USD842259S1 - Plasma chamber liner - Google Patents

Plasma chamber liner Download PDF

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Publication number
USD842259S1
USD842259S1 US29/602,207 US201729602207F USD842259S US D842259 S1 USD842259 S1 US D842259S1 US 201729602207 F US201729602207 F US 201729602207F US D842259 S USD842259 S US D842259S
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United States
Prior art keywords
plasma chamber
chamber liner
liner
view
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/602,207
Inventor
Eric Kihara Shono
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Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to US29/602,207 priority Critical patent/USD842259S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHONO, ERIC KIHARA
Priority to TW106306241F priority patent/TWD192021S/en
Priority to JPD2017-24106F priority patent/JP1615030S/ja
Application granted granted Critical
Publication of USD842259S1 publication Critical patent/USD842259S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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FIG. 1 is a top isometric view of a plasma chamber liner showing my new design;
FIG. 2 is a bottom isometric view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a side elevational view thereof;
FIG. 6 is an opposite side elevational view thereof; and,
FIG. 7 is a front elevational view thereof, a rear elevational view being identical.

Claims (1)

    CLAIM
  1. The ornamental design for a plasma chamber liner, as shown and described.
US29/602,207 2017-04-28 2017-04-28 Plasma chamber liner Active USD842259S1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US29/602,207 USD842259S1 (en) 2017-04-28 2017-04-28 Plasma chamber liner
TW106306241F TWD192021S (en) 2017-04-28 2017-10-25 Plasma chamber liner
JPD2017-24106F JP1615030S (en) 2017-04-28 2017-10-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/602,207 USD842259S1 (en) 2017-04-28 2017-04-28 Plasma chamber liner

Publications (1)

Publication Number Publication Date
USD842259S1 true USD842259S1 (en) 2019-03-05

Family

ID=63682182

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/602,207 Active USD842259S1 (en) 2017-04-28 2017-04-28 Plasma chamber liner

Country Status (3)

Country Link
US (1) USD842259S1 (en)
JP (1) JP1615030S (en)
TW (1) TWD192021S (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD882536S1 (en) * 2017-04-28 2020-04-28 Applied Materials, Inc. Plasma source liner
USD901405S1 (en) * 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device
USD925481S1 (en) * 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus
USD941787S1 (en) * 2020-03-03 2022-01-25 Applied Materials, Inc. Substrate transfer blade

Citations (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5964947A (en) * 1996-07-12 1999-10-12 Applied Materials, Inc. Removable pumping channel liners within a chemical vapor deposition chamber
US6277237B1 (en) * 1998-09-30 2001-08-21 Lam Research Corporation Chamber liner for semiconductor process chambers
US20010054381A1 (en) * 1998-12-14 2001-12-27 Salvador P Umotoy High temperature chemical vapor deposition chamber
US6374871B2 (en) * 1999-05-25 2002-04-23 Micron Technology, Inc. Liner for use in processing chamber
US20020069970A1 (en) * 2000-03-07 2002-06-13 Applied Materials, Inc. Temperature controlled semiconductor processing chamber liner
US20040033385A1 (en) * 2001-06-25 2004-02-19 Kaushal Tony S. Erosion-resistant components for plasma process chambers
US20040206309A1 (en) * 2003-04-17 2004-10-21 Applied Materials, Inc. Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor
US20050224180A1 (en) * 2004-04-08 2005-10-13 Applied Materials, Inc. Apparatus for controlling gas flow in a semiconductor substrate processing chamber
US20050229849A1 (en) * 2004-02-13 2005-10-20 Applied Materials, Inc. High productivity plasma processing chamber
US7011039B1 (en) * 2000-07-07 2006-03-14 Applied Materials, Inc. Multi-purpose processing chamber with removable chamber liner
USD583838S1 (en) 2007-09-19 2008-12-30 Riley Power, Inc. Grinding chamber side liner
US20090188625A1 (en) * 2008-01-28 2009-07-30 Carducci James D Etching chamber having flow equalizer and lower liner
USD658693S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658692S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD678228S1 (en) * 2011-03-30 2013-03-19 Tokyo Electron Limited Chamber block
USD699692S1 (en) * 2012-01-19 2014-02-18 Applied Materials, Inc. Upper liner
US20140116366A1 (en) 2011-04-21 2014-05-01 Eaton Corporation Pivot foot for deactivating rocker arm
US8858754B2 (en) * 2010-05-25 2014-10-14 Tokyo Electron Limited Plasma processing apparatus
USD716240S1 (en) * 2013-11-07 2014-10-28 Applied Materials, Inc. Lower chamber liner
USD716239S1 (en) * 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
US20140322897A1 (en) 2013-04-30 2014-10-30 Applied Materials, Inc. Flow controlled liner having spatially distributed gas passages
USD717746S1 (en) * 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
US8980005B2 (en) 2011-03-22 2015-03-17 Applied Materials, Inc. Liner assembly for chemical vapor deposition chamber
USD802545S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Lower chamber for a plasma processing apparatus
USD804436S1 (en) * 2015-06-12 2017-12-05 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus
USD812578S1 (en) * 2016-02-26 2018-03-13 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus

Patent Citations (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5964947A (en) * 1996-07-12 1999-10-12 Applied Materials, Inc. Removable pumping channel liners within a chemical vapor deposition chamber
US6277237B1 (en) * 1998-09-30 2001-08-21 Lam Research Corporation Chamber liner for semiconductor process chambers
US20010054381A1 (en) * 1998-12-14 2001-12-27 Salvador P Umotoy High temperature chemical vapor deposition chamber
US6374871B2 (en) * 1999-05-25 2002-04-23 Micron Technology, Inc. Liner for use in processing chamber
US20020069970A1 (en) * 2000-03-07 2002-06-13 Applied Materials, Inc. Temperature controlled semiconductor processing chamber liner
US7011039B1 (en) * 2000-07-07 2006-03-14 Applied Materials, Inc. Multi-purpose processing chamber with removable chamber liner
US20040033385A1 (en) * 2001-06-25 2004-02-19 Kaushal Tony S. Erosion-resistant components for plasma process chambers
US20040206309A1 (en) * 2003-04-17 2004-10-21 Applied Materials, Inc. Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor
US20050229849A1 (en) * 2004-02-13 2005-10-20 Applied Materials, Inc. High productivity plasma processing chamber
US20050224180A1 (en) * 2004-04-08 2005-10-13 Applied Materials, Inc. Apparatus for controlling gas flow in a semiconductor substrate processing chamber
USD583838S1 (en) 2007-09-19 2008-12-30 Riley Power, Inc. Grinding chamber side liner
US20090188625A1 (en) * 2008-01-28 2009-07-30 Carducci James D Etching chamber having flow equalizer and lower liner
US8858754B2 (en) * 2010-05-25 2014-10-14 Tokyo Electron Limited Plasma processing apparatus
US8980005B2 (en) 2011-03-22 2015-03-17 Applied Materials, Inc. Liner assembly for chemical vapor deposition chamber
USD658692S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD678228S1 (en) * 2011-03-30 2013-03-19 Tokyo Electron Limited Chamber block
USD658693S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
US20140116366A1 (en) 2011-04-21 2014-05-01 Eaton Corporation Pivot foot for deactivating rocker arm
USD699692S1 (en) * 2012-01-19 2014-02-18 Applied Materials, Inc. Upper liner
US20140322897A1 (en) 2013-04-30 2014-10-30 Applied Materials, Inc. Flow controlled liner having spatially distributed gas passages
USD717746S1 (en) * 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
USD716239S1 (en) * 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
USD716240S1 (en) * 2013-11-07 2014-10-28 Applied Materials, Inc. Lower chamber liner
USD802545S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Lower chamber for a plasma processing apparatus
USD804436S1 (en) * 2015-06-12 2017-12-05 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus
USD812578S1 (en) * 2016-02-26 2018-03-13 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Japanese Office Action for Application No. JP 2017-024106 dated Apr. 10, 2018.
Japanese Office Action for Application No. JP 2017-024107 dated Apr. 10, 2018.
Search Report for Taiwan Design Application No. 106306241 dated Jun. 6, 2018.

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD901405S1 (en) * 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD882536S1 (en) * 2017-04-28 2020-04-28 Applied Materials, Inc. Plasma source liner
USD925481S1 (en) * 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus
USD941787S1 (en) * 2020-03-03 2022-01-25 Applied Materials, Inc. Substrate transfer blade

Also Published As

Publication number Publication date
TWD192021S (en) 2018-08-01
JP1615030S (en) 2018-10-01

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