USD785057S1 - Bake plate - Google Patents

Bake plate Download PDF

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Publication number
USD785057S1
USD785057S1 US29/491,482 US201429491482F USD785057S US D785057 S1 USD785057 S1 US D785057S1 US 201429491482 F US201429491482 F US 201429491482F US D785057 S USD785057 S US D785057S
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United States
Prior art keywords
bake plate
view
elevation view
bake
design
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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US29/491,482
Inventor
Jim Strothmann
Roger A. Ruesing
Brandon Wilson
Kirk Emory
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cost Effective Equipment LLC
Original Assignee
Brewer Science Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brewer Science Inc filed Critical Brewer Science Inc
Priority to US29/491,482 priority Critical patent/USD785057S1/en
Assigned to BREWER SCIENCE INC. reassignment BREWER SCIENCE INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: EMORY, KIRK, RUESING, ROGER A., STROTHMANN, JIM, WILSON, BRANDON
Application granted granted Critical
Publication of USD785057S1 publication Critical patent/USD785057S1/en
Assigned to COST EFFECTIVE EQUIPMENT LLC reassignment COST EFFECTIVE EQUIPMENT LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BREWER SCIENCE INC.
Assigned to PHELPS COUNTY BANK reassignment PHELPS COUNTY BANK SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: COST EFFECTIVE EQUIPMENT LLC
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Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front perspective view of a bake plate embodying our design;
FIG. 2 is a rear perspective view of the bake plate shown in FIG. 1;
FIG. 3 is a top view of the bake plate shown in FIGS. 1 and 2;
FIG. 4 is a front elevation view of the bake plate depicted in FIGS. 1-3;
FIG. 5 is a side elevation view of the bake plate depicted in FIGS. 1-4;
FIG. 6 is a rear elevation view of the bake plate depicted in FIGS. 1-5;
FIG. 7 is a side elevation view of the bake plate opposite that shown in FIG. 5;
FIG. 8 is a front perspective view of a bake plate embodying our design, with the lid, display, rearmost portion of the cabinet, and a number of other features of the cabinet being shown in broken lines for illustrative purposes only and forming no part of the claimed design;
FIG. 9 is a rear perspective view of the bake plate shown in FIG. 8;
FIG. 10 is a top view of the bake plate shown in FIGS. 8 and 9;
FIG. 11 is a front elevation view of the bake plate depicted in FIGS. 8-10;
FIG. 12 is a side elevation view of the bake plate depicted in FIGS. 8-1;
FIG. 13 is a side elevation view of the bake plate opposite that shown in FIG. 12;
FIG. 14 is a front perspective view of a bake plate embodying our design, with all but the front portion of the cabinet being shown in broken lines, such that the remaining portion of the cabinet and a number of other features of the cabinet are shown for illustrative purposes only and form no part of the claimed design;
FIG. 15 is a rear perspective view of the bake plate shown in FIG. 14;
FIG. 16 is a top view of the bake plate shown in FIGS. 14 and 15;
FIG. 17 is a front elevation view of the bake plate depicted in FIGS. 14-16;
FIG. 18 is a side elevation view of the bake plate depicted in FIGS. 14-17; and,
FIG. 19 is a side elevation view of the bake plate opposite that shown in FIG. 18.
The broken lines are directed to environment and/or are for illustrative purposes only. None of the broken lines form part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a bake plate, as shown and described.
US29/491,482 2014-05-21 2014-05-21 Bake plate Active USD785057S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/491,482 USD785057S1 (en) 2014-05-21 2014-05-21 Bake plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/491,482 USD785057S1 (en) 2014-05-21 2014-05-21 Bake plate

Publications (1)

Publication Number Publication Date
USD785057S1 true USD785057S1 (en) 2017-04-25

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Family Applications (1)

Application Number Title Priority Date Filing Date
US29/491,482 Active USD785057S1 (en) 2014-05-21 2014-05-21 Bake plate

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US (1) USD785057S1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD794095S1 (en) * 2015-04-20 2017-08-08 Anest Iwata Corporation Control panel for coating machine
USD794094S1 (en) * 2015-04-20 2017-08-08 Anest Iwata Corporation Control panel for coating machine
USD798355S1 (en) * 2015-06-12 2017-09-26 Comau S.P.A. Control or programming unit, in particular for industrial robot

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6204551B1 (en) * 1999-08-16 2001-03-20 Winbond Electronics Corp. Modified SOG coater's hot plate to improve SOG film quality
US6780571B1 (en) * 2002-01-11 2004-08-24 Taiwan Semiconductor Manufacturing Company, Limited Upside down bake plate to make vertical and negative photoresist profile
US6891134B2 (en) * 2003-02-10 2005-05-10 Asml Netherlands B.V. Integrally formed bake plate unit for use in wafer fabrication system
US7274005B2 (en) * 2004-12-22 2007-09-25 Sokudo Co., Ltd. Bake plate having engageable thermal mass
US7741583B2 (en) * 2007-03-22 2010-06-22 Tokyo Electron Limited Bake plate lid cleaner and cleaning method
USD621426S1 (en) * 2009-06-26 2010-08-10 Freund Corporation Fluidized bed granulation coater
USD654935S1 (en) * 2009-11-25 2012-02-28 Hitachi Plant Technologies, Ltd. Inkjet coater
USD655323S1 (en) * 2010-12-15 2012-03-06 Schebler Company Coater
US8211234B2 (en) * 2008-09-02 2012-07-03 United Technologies Corporation Coater platter homing tool
US8387674B2 (en) * 2007-11-30 2013-03-05 Taiwan Semiconductor Manufacturing Comany, Ltd. Chip on wafer bonder
USD685825S1 (en) * 2012-05-25 2013-07-09 Leica Mikrosysteme Gmbh Coater
US8578877B2 (en) * 2007-04-11 2013-11-12 Ricoh Company, Ltd. Spin coater, temperature controlling method of the same, optical disc production apparatus, and optical disc production method
US8640755B2 (en) * 2010-10-05 2014-02-04 Skyworks Solutions, Inc. Securing mechanism and method for wafer bonder
US8758553B2 (en) * 2010-10-05 2014-06-24 Skyworks Solutions, Inc. Fixtures and methods for unbonding wafers by shear force
US8888085B2 (en) * 2010-10-05 2014-11-18 Skyworks Solutions, Inc. Devices and methodologies for handling wafers
US9224631B2 (en) * 2010-08-06 2015-12-29 Brewer Science Inc. Multiple bonding layers for thin-wafer handling

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6204551B1 (en) * 1999-08-16 2001-03-20 Winbond Electronics Corp. Modified SOG coater's hot plate to improve SOG film quality
US6780571B1 (en) * 2002-01-11 2004-08-24 Taiwan Semiconductor Manufacturing Company, Limited Upside down bake plate to make vertical and negative photoresist profile
US6891134B2 (en) * 2003-02-10 2005-05-10 Asml Netherlands B.V. Integrally formed bake plate unit for use in wafer fabrication system
US7274005B2 (en) * 2004-12-22 2007-09-25 Sokudo Co., Ltd. Bake plate having engageable thermal mass
US7741583B2 (en) * 2007-03-22 2010-06-22 Tokyo Electron Limited Bake plate lid cleaner and cleaning method
US8578877B2 (en) * 2007-04-11 2013-11-12 Ricoh Company, Ltd. Spin coater, temperature controlling method of the same, optical disc production apparatus, and optical disc production method
US8387674B2 (en) * 2007-11-30 2013-03-05 Taiwan Semiconductor Manufacturing Comany, Ltd. Chip on wafer bonder
US8211234B2 (en) * 2008-09-02 2012-07-03 United Technologies Corporation Coater platter homing tool
USD621426S1 (en) * 2009-06-26 2010-08-10 Freund Corporation Fluidized bed granulation coater
USD654935S1 (en) * 2009-11-25 2012-02-28 Hitachi Plant Technologies, Ltd. Inkjet coater
US9224631B2 (en) * 2010-08-06 2015-12-29 Brewer Science Inc. Multiple bonding layers for thin-wafer handling
US8640755B2 (en) * 2010-10-05 2014-02-04 Skyworks Solutions, Inc. Securing mechanism and method for wafer bonder
US8758553B2 (en) * 2010-10-05 2014-06-24 Skyworks Solutions, Inc. Fixtures and methods for unbonding wafers by shear force
US8888085B2 (en) * 2010-10-05 2014-11-18 Skyworks Solutions, Inc. Devices and methodologies for handling wafers
USD655323S1 (en) * 2010-12-15 2012-03-06 Schebler Company Coater
USD685825S1 (en) * 2012-05-25 2013-07-09 Leica Mikrosysteme Gmbh Coater
USD694298S1 (en) * 2012-05-25 2013-11-26 Lieca Mikrosysteme GmbH Coater

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD794095S1 (en) * 2015-04-20 2017-08-08 Anest Iwata Corporation Control panel for coating machine
USD794094S1 (en) * 2015-04-20 2017-08-08 Anest Iwata Corporation Control panel for coating machine
USD798355S1 (en) * 2015-06-12 2017-09-26 Comau S.P.A. Control or programming unit, in particular for industrial robot

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