USD649126S1 - Vacuum contact pad - Google Patents

Vacuum contact pad Download PDF

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Publication number
USD649126S1
USD649126S1 US29/334,787 US33478709F USD649126S US D649126 S1 USD649126 S1 US D649126S1 US 33478709 F US33478709 F US 33478709F US D649126 S USD649126 S US D649126S
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US
United States
Prior art keywords
contact pad
vacuum contact
vacuum
view
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/334,787
Inventor
Tamami Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Assigned to EBARA CORPORATION reassignment EBARA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TAKAHASHI, TAMAMI
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Publication of USD649126S1 publication Critical patent/USD649126S1/en
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Description

FIG. 1 is a front elevational view of a vacuum contact pad showing our new design;
FIG. 2 is a back elevation view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is an enlarged sectional view taken along the line 5—5 in X part of FIG. 1 thereof;
FIG. 6 is a front elevational view in use thereof;
FIG. 7 is an enlarged sectional view taken along the line 7—7 in X part of FIG. 1 in use thereof; and,
FIG. 8 is a reference perspective view showing the usable state thereof.
The broken lines depict environmental subject matter only and form no part of the claimed design.

Claims (1)

  1. The ornamental design for a vacuum contact pad, as shown and described.
US29/334,787 2008-10-20 2009-04-01 Vacuum contact pad Active USD649126S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008-026901 2008-02-06
JP2008026901 2008-10-20

Publications (1)

Publication Number Publication Date
USD649126S1 true USD649126S1 (en) 2011-11-22

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Application Number Title Priority Date Filing Date
US29/334,787 Active USD649126S1 (en) 2008-10-20 2009-04-01 Vacuum contact pad

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US (1) USD649126S1 (en)

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD731448S1 (en) * 2013-10-29 2015-06-09 Ebara Corporation Polishing pad for substrate polishing apparatus
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770404S1 (en) * 2015-08-05 2016-11-01 Witricity Corporation Resonator coil
USD770990S1 (en) * 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD790489S1 (en) 2015-07-08 2017-06-27 Ebara Corporation Vacuum contact pad
USD792962S1 (en) * 2014-11-28 2017-07-25 Draingarde Inc. Catch basin cover
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793972S1 (en) * 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD806046S1 (en) 2015-04-16 2017-12-26 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD825504S1 (en) 2015-04-21 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD826185S1 (en) * 2016-10-14 2018-08-21 Hitachi Kokusai Electric Inc. Ceiling heater for substrate processing apparatus
USD837755S1 (en) * 2015-04-16 2019-01-08 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
US10208884B2 (en) 2014-01-30 2019-02-19 Draingarde, Inc. Watershed protection device and system
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD859331S1 (en) * 2017-03-31 2019-09-10 Ebara Corporation Vacuum contact pad
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD869409S1 (en) 2016-09-30 2019-12-10 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD881126S1 (en) * 2017-08-04 2020-04-14 Holygo Corporation Coil for wireless charger
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD918848S1 (en) * 2019-07-18 2021-05-11 Kokusai Electric Corporation Retainer of ceiling heater for semiconductor fabrication apparatus
USD929198S1 (en) * 2019-09-16 2021-08-31 David Gysland Tungsten grinder
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD947802S1 (en) * 2020-05-20 2022-04-05 Applied Materials, Inc. Replaceable substrate carrier interfacing film
USD962183S1 (en) * 2019-07-11 2022-08-30 Kokusai Electric Corporation Retainer plate of top heater for wafer processing furnace
USD962184S1 (en) * 2019-07-11 2022-08-30 Kokusai Electric Corporation Retainer plate of top heater for wafer processing furnace
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Cited By (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) * 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD813180S1 (en) 2013-05-15 2018-03-20 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD731448S1 (en) * 2013-10-29 2015-06-09 Ebara Corporation Polishing pad for substrate polishing apparatus
US10208884B2 (en) 2014-01-30 2019-02-19 Draingarde, Inc. Watershed protection device and system
USD792962S1 (en) * 2014-11-28 2017-07-25 Draingarde Inc. Catch basin cover
USD852762S1 (en) 2015-03-27 2019-07-02 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793972S1 (en) * 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD806046S1 (en) 2015-04-16 2017-12-26 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD837755S1 (en) * 2015-04-16 2019-01-08 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD825504S1 (en) 2015-04-21 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD790489S1 (en) 2015-07-08 2017-06-27 Ebara Corporation Vacuum contact pad
USD770404S1 (en) * 2015-08-05 2016-11-01 Witricity Corporation Resonator coil
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD869409S1 (en) 2016-09-30 2019-12-10 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD826185S1 (en) * 2016-10-14 2018-08-21 Hitachi Kokusai Electric Inc. Ceiling heater for substrate processing apparatus
USD913977S1 (en) 2016-12-12 2021-03-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD859331S1 (en) * 2017-03-31 2019-09-10 Ebara Corporation Vacuum contact pad
USD881126S1 (en) * 2017-08-04 2020-04-14 Holygo Corporation Coil for wireless charger
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD902165S1 (en) 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD962183S1 (en) * 2019-07-11 2022-08-30 Kokusai Electric Corporation Retainer plate of top heater for wafer processing furnace
USD962184S1 (en) * 2019-07-11 2022-08-30 Kokusai Electric Corporation Retainer plate of top heater for wafer processing furnace
USD918848S1 (en) * 2019-07-18 2021-05-11 Kokusai Electric Corporation Retainer of ceiling heater for semiconductor fabrication apparatus
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD929198S1 (en) * 2019-09-16 2021-08-31 David Gysland Tungsten grinder
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD970566S1 (en) 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD947802S1 (en) * 2020-05-20 2022-04-05 Applied Materials, Inc. Replaceable substrate carrier interfacing film
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD966357S1 (en) 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

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