US9360318B1 - Gyro MEMS sensor package - Google Patents

Gyro MEMS sensor package Download PDF

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Publication number
US9360318B1
US9360318B1 US14/580,297 US201414580297A US9360318B1 US 9360318 B1 US9360318 B1 US 9360318B1 US 201414580297 A US201414580297 A US 201414580297A US 9360318 B1 US9360318 B1 US 9360318B1
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flexible substrate
die
mems
conductive
mems die
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US20160178372A1 (en
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Kelvin Po Leung Pun
Chee Wah Cheung
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Compass Tech Co Ltd
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Compass Tech Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0242—Gyroscopes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/097—Interconnects arranged on the substrate or the lid, and covered by the package seal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0136—Growing or depositing of a covering layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the invention relates to processes for packaging integrated circuit dies, and more particularly, to a method of packaging gyroscope sensor modules.
  • MEMS Micro Electrical Mechanical Systems
  • MEMS gyros are available commercially in the form of a package within which the MEMS die 24 is mounted by wire bonding 28 , as shown in FIG. 1 .
  • MEMS gyros are available commercially in the form of a package within which the MEMS die 24 is mounted by wire bonding 28 , as shown in FIG. 1 .
  • the die is contained in an enclosure 20 with a lid 22 which is normally ceramic and/or metallic.
  • BGA solder ball grid array
  • Such package design provides a rigid structure to hold the MEMS die, as well as the overall shape of the package allowing it to be handled easily by standard surface mount technology (SMT) processes.
  • SMT surface mount technology
  • the design of gyro sensor modules has been optimized for applications in small, portable devices.
  • the size and thus the weight of the MEMS gyro could be reduced.
  • the main circuit board can also reduce in size through the use of a multi-layer flexible substrate and increasing the circuit density.
  • Such smaller, lighter assemblies can be incorporated into a greater variety of portable and mobile devices which opens up opportunities for new applications.
  • a principal object of the present invention is to provide a cost-effective and very manufacturable method of packaging a MEMS die.
  • Another object of the invention is to provide method of mounting a MEMS die (s) directly on a multi-layer flexible substrate.
  • Yet another object of the invention is to provide a package wherein a MEMS die (s) is mounted directly on a multi-layer flexible substrate.
  • a method of packaging a MEMS die is achieved. At least one MEMS die is mounted directly on a multi-layer flexible substrate having at least one metal layer. Electrical connections are made between the MEMS die and the flexible substrate. The MEMS die and electrical connections are protected with a lid or die coating.
  • a MEMS die (s) mounted directly on a multi-layer flexible substrate having at least one metal layer is achieved.
  • An integrated circuit packaging structure comprises a MEMS die mounted directly on a flexible substrate and wire-bonded to the flexible substrate and a lid or die coating protecting the MEMS die and wire bonds.
  • FIG. 1 schematically illustrates in cross-sectional representation a MEMS package of the prior art.
  • FIGS. 2-9 schematically illustrate in cross-sectional representation MEMS packages of the present disclosure.
  • the present disclosure details a method for and a device comprising a gyro MEMS sensor package in integrated circuit packages and modules.
  • the method and device of the present disclosure hold a number of advantages over the traditional gyro sensor ceramic package sensing technologies as the MEMS die(s) is mounted directly on the flex surface of a multi-layer flexible substrate which offers a significant area reduction on the package size, lower profile, and lighter weight, as compared to traditional ceramic packages.
  • the MEMS gyro package is redesigned to achieve a smaller sensor footprint.
  • the commercially available MEMS gyro package is approximately 7 ⁇ 7 ⁇ 3.3 mm which contains the MEMS die of only approximately 140 ⁇ 140 ⁇ 110 ⁇ m within a fully enclosed environment, as shown, for example, in FIG. 1 .
  • the design of the enclosure is modified to eliminate the thickness contributed by the bottom side of the ceramic enclosure 20 .
  • the MEMS dies are bonded to an interposer flex circuit or multi-layer flexible substrate 18 by standard die attach, such as conductive or non-conductive epoxy 32 .
  • the flexible substrate technology can include finer line width than the conventional package and spacing of less than 10 ⁇ m.
  • the flexible substrate technology can offer small vias of less than 10 ⁇ m to connect the different conductive metal layers.
  • the flexible substrate has at least one metal layer and can be one conductive metal layer or more than one conductive metal layer. Additionally, the flexible substrate can have double sided conductive metal layers or more than two stack-up conductive metal layers.
  • the dielectric material in the flexible substrate may be polyimide (PI), liquid crystal polymer (LCP), Polyester (PET), polyethylene-naphthalate (PEN), poly tetra fluoro ethylene, or a laminate substrate such as epoxies and BT, or Teflon or modified Teflon.
  • Wire bonding 28 , 30 through, for example, gold fingers 29 completes the electrical connections.
  • Wire bonds may be copper, gold, paladium, aluminum, or any other conductive metals or alloys.
  • This gyro MEMS die assembly could then be handled as a component for mounting onto the main circuit (PCB or flex printed circuit board (FPCB)) 12 by methods such as soldering 15 .
  • the soldering material comprises eutectic PbSn or any lead-free Sn Ag or Sn Ag Cu, or by a combination of a conductive adhesive or solder with a non-conductive adhesive. It is estimated that using this design, the MEMS package size could be reduced to 6 ⁇ 6 ⁇ 2 mm, which is equivalent to a volumetric reduction of approximately 55%.
  • the enclosure is eliminated with wire connections 28 , 30 and MEMS die fully protected by die coating 34 , as shown in FIG. 3 .
  • This design could result in a volumetric reduction of approximately 80% for each set of the MEMS gyro.
  • the MEMS die is placed directly onto the sensor multi-layer flexible circuit 18 , in FIGS. 4 and 5 , which eliminates the need for the flex interposer.
  • conductive/non-conductive paste or film epoxy 32 a solder reflow process is not needed which further reduces the die profile upon the main circuitry, in addition to the possible benefits gained from a simplified manufacturing procedure.
  • metal or LCP lid 19 is attached to the flex substrate 12 using epoxy 32 .
  • die coating 34 protects the MEMS die.
  • the main circuit is also modified to enhance the size and weight reduction.
  • the main PCB circuit is based on a 4 metal layer (ML) rigid flex stackup which comprises a 2ML PCB board and a 2ML flex joined by soldering.
  • ML metal layer
  • a piece of multi metal layer (e.g. 4 metal layer) flex 18 is used as the main circuit substrate.
  • the multi metal layer flex could be based on a multi core or single core design. Such design eliminates the soldering process as required by the established rigid flex design.
  • the use of a multi-layer flexible substrate also allows fine pitch circuitry with via sizes of less than 10 ⁇ m diameter and trace width and spacing of less than 10 ⁇ m.
  • the MEMS die (s) mounted directly on a multi-layer flexible substrate allows for a smaller, thinner, and lighter gyro MEMS sensor package in integrated circuit packages and modules.
  • the MEMS die 24 with MEMS cap 26 can be directly mounted onto the flexible substrate 18 using non-conductive or conductive epoxy 32 . This results in an ultra small package size, eliminating the BGA pads as seen on the ceramic package. Because of the thinner overall package thickness, the wire bond 28 from the MEMS die to flex can be done with lower loop height.
  • FIGS. 6-9 stainless steel stiffeners 14 could be used as in the existing design whilst the flexibility of the flex 16 is maintained for folding after the MEMS gyro attachment.
  • FIGS. 6 and 7 show the at least one MEMS die attached to the flexible substrate 16 using conductive or non-conductive epoxy paste or film 32 .
  • the at least one MEMS die is die attached directly onto the stiffener 14 .
  • the multi-layer flexible substrate 16 is wrapped around the stiffener 14 .
  • the stiffener material can be copper, aluminum, stainless steel, ceramic, zinc, or tungsten, for example, or any other metal.
  • the flexible substrate 16 can be folded around the stiffener either before or after placement of the dies.
  • the flexible substrate 16 has at least one metal layer and can be one conductive metal layer or more than one conductive metal layer. Additionally, the flexible substrate can have double sided conductive metal layers or more than two stack-up conductive metal layers.
  • the dielectric material in the flexible substrate may be polyimide (PI), liquid crystal polymer (LCP), Polyester (PET), polyethylene-naphthalate (PEN), poly tetra fluoro ethylene, or a laminate substrate such as epoxies and BT, or Teflon or modified Teflon.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Gyroscopes (AREA)
  • Micromachines (AREA)

Abstract

An integrated circuit packaging structure comprises at least one Micro Electrical Mechanical Systems (MEMS) gyroscope die mounted directly on a multi-layer flexible substrate having at least one metal layer and wire-bonded to the flexible substrate and a lid or die coating protecting the MEMS die and wire bonds.

Description

BACKGROUND OF THE INVENTION
(1) Field of the Invention
The invention relates to processes for packaging integrated circuit dies, and more particularly, to a method of packaging gyroscope sensor modules.
(2) Description of the Related Art
The miniaturization of electronics drives the expansion of product functionality and application. However, the application of the gyroscope (‘gyro’) sensor module has been limited due to the size and weight of the MEMS (Micro Electrical Mechanical Systems) gyro package. Currently, MEMS gyros are available commercially in the form of a package within which the MEMS die 24 is mounted by wire bonding 28, as shown in FIG. 1. For protection the die is contained in an enclosure 20 with a lid 22 which is normally ceramic and/or metallic. On one side of the package, solder ball grid array (BGA) 15 is present to allow the package to be mounted on the main circuit board 10 by solder reflow. Such package design provides a rigid structure to hold the MEMS die, as well as the overall shape of the package allowing it to be handled easily by standard surface mount technology (SMT) processes.
To reduce the spatial requirement of the main circuit board, high density circuitry on multilayer printed circuit boards (PCBs) are available. However, the size of the gyro packages has become a key factor which limits its application in small portable devices, especially when up to three MEMS gyroscopes are required to sense and respond to X-, Y- and Z-axis movements. As demonstrated by J. Barton et al, “Design, Fabrication and Testing of Miniaturized Wireless Inertial Measurement Units (IMU),” IEEE, 2007, a 10 mm SMD IMU sensor could be produced but with little room left for further size reduction due to the large footprint of the gyro packages.
Therefore, the design of gyro sensor modules has been optimized for applications in small, portable devices. By redesigning the MEMS enclosure, the size and thus the weight of the MEMS gyro could be reduced. Consequently, the main circuit board can also reduce in size through the use of a multi-layer flexible substrate and increasing the circuit density. Such smaller, lighter assemblies can be incorporated into a greater variety of portable and mobile devices which opens up opportunities for new applications.
U.S. Pat. No. 6,784,020 (Lee et al), U.S. Pat. No. 8,804,993 (Shulka), U.S. Pat. No. 8,653,642 (Sutanto et al), and U.S. Pat. No. 8,368,154 (Trusov et al) and U.S. Patent Application 2012/0318059 (Otsuki) disclose MEMS devices mounted on flexible substrates.
SUMMARY OF THE INVENTION
A principal object of the present invention is to provide a cost-effective and very manufacturable method of packaging a MEMS die.
Another object of the invention is to provide method of mounting a MEMS die (s) directly on a multi-layer flexible substrate.
Yet another object of the invention is to provide a package wherein a MEMS die (s) is mounted directly on a multi-layer flexible substrate.
According to the objects of the invention, a method of packaging a MEMS die is achieved. At least one MEMS die is mounted directly on a multi-layer flexible substrate having at least one metal layer. Electrical connections are made between the MEMS die and the flexible substrate. The MEMS die and electrical connections are protected with a lid or die coating.
Also according to the objects of the invention, a MEMS die (s) mounted directly on a multi-layer flexible substrate having at least one metal layer is achieved. An integrated circuit packaging structure comprises a MEMS die mounted directly on a flexible substrate and wire-bonded to the flexible substrate and a lid or die coating protecting the MEMS die and wire bonds.
BRIEF DESCRIPTION OF THE DRAWINGS
In the accompanying drawings forming a material part of this description, there is shown:
FIG. 1 schematically illustrates in cross-sectional representation a MEMS package of the prior art.
FIGS. 2-9 schematically illustrate in cross-sectional representation MEMS packages of the present disclosure.
 DESCRIPTION OF THE PREFERRED EMBODIMENTS
The present disclosure details a method for and a device comprising a gyro MEMS sensor package in integrated circuit packages and modules. The method and device of the present disclosure hold a number of advantages over the traditional gyro sensor ceramic package sensing technologies as the MEMS die(s) is mounted directly on the flex surface of a multi-layer flexible substrate which offers a significant area reduction on the package size, lower profile, and lighter weight, as compared to traditional ceramic packages.
The MEMS gyro package is redesigned to achieve a smaller sensor footprint. Currently, the commercially available MEMS gyro package is approximately 7×7×3.3 mm which contains the MEMS die of only approximately 140×140×110 μm within a fully enclosed environment, as shown, for example, in FIG. 1.
In this disclosure, to reduce the size of the gyro assembly, the design of the enclosure is modified to eliminate the thickness contributed by the bottom side of the ceramic enclosure 20. As shown in FIG. 2, the MEMS dies are bonded to an interposer flex circuit or multi-layer flexible substrate 18 by standard die attach, such as conductive or non-conductive epoxy 32.
The flexible substrate technology can include finer line width than the conventional package and spacing of less than 10 μm. The flexible substrate technology can offer small vias of less than 10 μm to connect the different conductive metal layers.
The flexible substrate has at least one metal layer and can be one conductive metal layer or more than one conductive metal layer. Additionally, the flexible substrate can have double sided conductive metal layers or more than two stack-up conductive metal layers. The dielectric material in the flexible substrate may be polyimide (PI), liquid crystal polymer (LCP), Polyester (PET), polyethylene-naphthalate (PEN), poly tetra fluoro ethylene, or a laminate substrate such as epoxies and BT, or Teflon or modified Teflon.
Wire bonding 28, 30 through, for example, gold fingers 29 completes the electrical connections. Wire bonds may be copper, gold, paladium, aluminum, or any other conductive metals or alloys.
A single piece of metallic or liquid crystal polymer (LCP) lid 19, attached by epoxy 32, is used to protect the MEMS die from foreign particles. This gyro MEMS die assembly could then be handled as a component for mounting onto the main circuit (PCB or flex printed circuit board (FPCB)) 12 by methods such as soldering 15. The soldering material comprises eutectic PbSn or any lead-free Sn Ag or Sn Ag Cu, or by a combination of a conductive adhesive or solder with a non-conductive adhesive. It is estimated that using this design, the MEMS package size could be reduced to 6×6×2 mm, which is equivalent to a volumetric reduction of approximately 55%.
To further reduce the spatial requirement of the MEMS gyro package, the enclosure is eliminated with wire connections 28, 30 and MEMS die fully protected by die coating 34, as shown in FIG. 3. This design could result in a volumetric reduction of approximately 80% for each set of the MEMS gyro.
To even further minimize the gyro footprint, the MEMS die is placed directly onto the sensor multi-layer flexible circuit 18, in FIGS. 4 and 5, which eliminates the need for the flex interposer. Using conductive/non-conductive paste or film epoxy 32, a solder reflow process is not needed which further reduces the die profile upon the main circuitry, in addition to the possible benefits gained from a simplified manufacturing procedure. In FIG. 4, metal or LCP lid 19 is attached to the flex substrate 12 using epoxy 32. In FIG. 5, die coating 34 protects the MEMS die.
In parallel to the modification to the gyro package design, the main circuit is also modified to enhance the size and weight reduction. In the existing sensor design, the main PCB circuit is based on a 4 metal layer (ML) rigid flex stackup which comprises a 2ML PCB board and a 2ML flex joined by soldering.
To reduce the overall substrate thickness and weight, a piece of multi metal layer (e.g. 4 metal layer) flex 18 is used as the main circuit substrate. The multi metal layer flex could be based on a multi core or single core design. Such design eliminates the soldering process as required by the established rigid flex design. The use of a multi-layer flexible substrate also allows fine pitch circuitry with via sizes of less than 10 μm diameter and trace width and spacing of less than 10 μm.
The MEMS die (s) mounted directly on a multi-layer flexible substrate allows for a smaller, thinner, and lighter gyro MEMS sensor package in integrated circuit packages and modules. The MEMS die 24 with MEMS cap 26 can be directly mounted onto the flexible substrate 18 using non-conductive or conductive epoxy 32. This results in an ultra small package size, eliminating the BGA pads as seen on the ceramic package. Because of the thinner overall package thickness, the wire bond 28 from the MEMS die to flex can be done with lower loop height.
For structural rigidity, as shown in FIGS. 6-9, stainless steel stiffeners 14 could be used as in the existing design whilst the flexibility of the flex 16 is maintained for folding after the MEMS gyro attachment. FIGS. 6 and 7 show the at least one MEMS die attached to the flexible substrate 16 using conductive or non-conductive epoxy paste or film 32. In FIGS. 8 and 9, the at least one MEMS die is die attached directly onto the stiffener 14. In all of these figures, the multi-layer flexible substrate 16 is wrapped around the stiffener 14. The stiffener material can be copper, aluminum, stainless steel, ceramic, zinc, or tungsten, for example, or any other metal. The flexible substrate 16 can be folded around the stiffener either before or after placement of the dies.
As in the previous embodiments, the flexible substrate 16 has at least one metal layer and can be one conductive metal layer or more than one conductive metal layer. Additionally, the flexible substrate can have double sided conductive metal layers or more than two stack-up conductive metal layers. The dielectric material in the flexible substrate may be polyimide (PI), liquid crystal polymer (LCP), Polyester (PET), polyethylene-naphthalate (PEN), poly tetra fluoro ethylene, or a laminate substrate such as epoxies and BT, or Teflon or modified Teflon.
While the invention has been particularly shown and described with reference to the preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made without departing from the spirit and scope of the invention.

Claims (18)

What is claimed is:
1. An integrated circuit packaging structure comprising:
at least one Micro Electrical Mechanical Systems (MEMS) die mounted directly on a multi-layer flexible substrate or on a stiffener and wherein said flexible substrate is folded or wrapped around an underside of said stiffener and wire-bonded to said flexible substrate wherein said flexible substrate has at least one metal layer and wherein said flexible substrate remains underlying said MEMS die; and
a lid or die coating protecting sides and top surfaces of said MEMS die and wire bonds.
2. The structure according to claim 1 wherein said at least one MEMS die comprises a gyroscope.
3. The structure according to claim 1 wherein said at least one MEMS die is mounted on said flexible substrate by conductive or non-conductive epoxy paste or film.
4. The structure according to claim 1 wherein said stiffener comprises one of the group containing: copper, aluminum, stainless steel, ceramic, zinc, or tungsten, or any other metal.
5. The structure according to claim 1 wherein said MEMS die is wire-bonded to gold fingers on said flexible substrate.
6. The structure according to claim 1 wherein said die coating encapsulates said MEMS die and wire bonds.
7. The structure according to claim 1 wherein said lid comprises metal or liquid crystal polymer and wherein said lid is attached to said flexible substrate by conductive or non-conductive epoxy.
8. The structure according to claim 1 wherein said flexible substrate is attached to a multi-layer flexible substrate on a side opposite to said MEMS die wherein said multi-layer flexible substrate comprises one or more conductive metal layers and one or more dielectric layers wherein said attaching is by solder or conductive adhesive or a combination of solder and conductive adhesive.
9. The structure according to claim 1 wherein said flexible substrate is a multi-layer flexible substrate comprising one or more conductive metal layers and one or more dielectric layers.
10. A method of assembling an integrated circuit packaging structure comprising:
mounting at least one Micro Electrical Mechanical Systems (MEMS) die directly on a multi-layer flexible substrate having at least one metal layer or on a stiffener and wherein said flexible substrate is folded or wrapped around an underside of said stiffener wherein said flexible substrate remains underlying said MEMS die;
making electrical connections between said MEMS die and said flexible substrate; and
protecting top and side surfaces of said MEMS die and electrical connections with a lid or die coating.
11. The method according to claim 10 wherein said at least one MEMS die comprises a gyroscope.
12. The method according to claim 10 wherein said at least one MEMS die is mounted on said flexible substrate by conductive or non-conductive epoxy paste or film.
13. The method according to claim 10 wherein said stiffener comprises one of the group containing: copper, aluminum, stainless steel, ceramic, zinc, or tungsten, or any other metal.
14. The method according to claim 10 wherein said making electrical connections comprises wire-bonding said MEMS die to gold fingers on said flexible substrate and wherein wire bonds comprise Cu, Au, Pd, or Al.
15. The method according to claim 10 wherein said die coating encapsulates said MEMS die and wire bonds.
16. The method according to claim 10 wherein said lid comprises metal or liquid crystal polymer and wherein said lid is attached to said flexible substrate by conductive or non-conductive epoxy.
17. The method according to claim 10 further comprising:
attaching said flexible substrate to a multi-layer flexible substrate on a side opposite to said MEMS die wherein said multi-layer flexible substrate comprises one or more conductive metal layers and one or more dielectric layers wherein said attaching comprises solder or conductive adhesive or a combination of solder and conductive adhesive.
18. An integrated circuit packaging structure comprising:
at least one Micro Electrical Mechanical Systems (MEMS) gyroscope die mounted directly on a multi-layer flexible substrate and wire-bonded to said flexible substrate or on a stiffener and wherein said flexible substrate is folded or wrapped around an underside of said stiffener wherein said flexible substrate has at least one metal layer and wherein said flexible substrate remains underlying said MEMS die; and
a lid or die coating protecting top and side surfaces of said MEMS die and wire bonds.
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