US7256998B2 - Heat-dissipating structure with air-guiding device - Google Patents

Heat-dissipating structure with air-guiding device Download PDF

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Publication number
US7256998B2
US7256998B2 US11/113,189 US11318905A US7256998B2 US 7256998 B2 US7256998 B2 US 7256998B2 US 11318905 A US11318905 A US 11318905A US 7256998 B2 US7256998 B2 US 7256998B2
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Prior art keywords
heat
fan
water
air
cooling device
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Expired - Fee Related, expires
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US11/113,189
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US20060238978A1 (en
Inventor
Chia-Min Chou
Hsiang-Chieh Tseng
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Giga Byte Technology Co Ltd
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Giga Byte Technology Co Ltd
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Assigned to GIGA-BYTE TECHNOLOGY CO., LTD. reassignment GIGA-BYTE TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHOU, CHIA-MIN, TSENG, HSIANG-CHIEH
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat-dissipating structure, and particularly relates to a heat-dissipating structure assembled on a Central Processing Unit (CPU).
  • the heat-dissipating structure has a fan separated a distance from a water-cooling device by a support device. Additionally, the air from the fan is directed by an air-guiding device to the CPU and another element that disposed in the vicinity of the CPU for dissipating the heat.
  • the processing velocity of the CPU is faster, and then the heat from the CPU is higher.
  • a heat-dissipating device and a fan usually be used to help to dissipate the heat.
  • the water-cooling device (water block) of the prior art is assembled on the CPU for dissipating the heat from the heat source of the CPU in order to obtain a perfect heat-dissipating effect.
  • the water-cooling device 90 of prior art includes a main body 91 disposed on a heat surface of a CPU 92 , and a flow channel 93 formed in the main body 91 for guiding the cooling fluid to circulate in the main body 91 .
  • the flow channel 93 connects to an external pipe and a pump to drive the cooling fluid to circulate in the main body 91 for dissipating the heat from the CPU 92 .
  • the water-cooling device only can dissipate the heat from the CPU. Moreover, another electronic element disposes around the CPU, and will result more heat by the CPU. However the prior art cannot provide a heat-dissipating effect on another electronic element.
  • the present invention provides a heat-dissipating device.
  • a fan provides wind through the accommodating space to dissipate the heat from the water-cooling device by an air-cooling method. Therefore, both the water-cooling method and the air-cooling method dissipates the heat of the CPU. Furthermore, after the wind from the fan blows to the water-cooling device, the wind changes the flow direction for blowing to another electronic element that disposes around the CPU. In other words, the present invention can dissipate efficiently the heat from the CPU and another electronic element that disposes around the CPU. Furthermore, the wind-guiding device can guide the wind from the fan to correct place for cooling the CPU or another electronic element. Hence the present invention can provide a comprehensive heat-dissipating effect on the CPU.
  • the heat-dissipating structure is assembled on a CUP, and has a water-cooling device, a fan and a support device.
  • the support device is assembled between the water-cooling device and the fan to form an accommodating space.
  • FIG. 1 is a perspective view of a water-cooling device of the prior art
  • FIG. 2 is a perspective view of a water-cooling device of the present art
  • FIG. 3 is a side view of a water-cooling device of the present art
  • FIG. 4 is a schematic view of a water-cooling device in use according to the present art
  • FIG. 5 is a perspective view of a water-cooling device of another embodiment according to the present art.
  • FIG. 6 is a side view of a water-cooling device of another embodiment according to the present art.
  • FIG. 7 is a schematic view of a water-cooling device of another embodiment in use according to the present art.
  • the present invention provides a heat-dissipating structure assembled on a CPU 5 .
  • the heat-dissipating structure includes a water-cooling device 1 , a fan 3 and a support device 4 .
  • the water-cooling device 1 has a main body 11 .
  • the main body 11 is made of metal materials with a good heat-conducting function.
  • the main body 11 has a contact face 111 and a connection face 112 opposite to each other.
  • the contact face 111 of the main body 11 is disposed on a heat surface 51 of the CPU 5 .
  • the main body 11 has a suitable flow channel (not shown) formed therein for guiding cooling fluid to circulate in the main body 11 .
  • the water-cooling device 1 has a connection 12 connecting to the flow channel, an external pipe and a pump for driving the cooling fluid to circulate in the main body 11 .
  • the fan 3 is an axial-flow fan or another type of fan.
  • the support device 4 is assembled between the water-cooling device 1 and the fan 3 for supporting the fan 3 to assemble over the water-cooling device 1 .
  • the support device 4 has four fixed posts 41 with same height. Each of the four fixed posts 41 has an upper side screwing to one corner of the fan 3 and a bottom seat 42 connecting to a lower side thereof. The bottom seat 42 is fixed on the main body 11 of the water-cooling device 1 .
  • the support device 4 is assembled between the water-cooling device 1 and the fan 3 to form an accommodating space 43 .
  • the accommodating space 43 is enclosed by the four fixed posts 41 to provide a wind flow space for when the fan 3 working.
  • the water-cooling device 1 is assembled on the heat surface of the CPU 5 by the contact face 111 of the water-cooling device 1 for dissipating the heat from the CUP 5 by a water-cooling method.
  • the fan 3 provides wind through the accommodating space to dissipate the heat from the water-cooling device 1 and the CPU 5 by an air-cooling method. Therefore, both the water-cooling method and the air-cooling method dissipates the heat of the CPU 5 . Furthermore, after the wind from the fan 3 blows to the water-cooling device 1 , the wind changes the flow direction for blowing to another electronic element that disposes around the CPU 5 .
  • the wind from the fan 3 can blow to the water-cooling device 1 for dissipating the heat from the CPU 5 , and blow to another electronic element that disposes around the CPU 5 for increasing the life of the electronic element.
  • the heat-dissipating structure further includes a wind-guiding device 2 disposed on the main body 11 of the water-cooling device 1 .
  • the wind-guiding device 2 has a cone shaped in the present embodiment.
  • the wind-guiding device 2 has a wind-guiding face 21 formed on a surface thereof.
  • the wind-guiding face 21 has an oblique face extended outwardly from up to down for guiding the wind from vertical flow to horizontal flow, so as to change a flow direction of the wind.
  • the wind-guiding device 2 has a bottom portion connecting to the bottom seat 42 of the support device 4 .
  • the wind-guiding device 2 is disposed between the main body 11 of the water-cooling device 1 and the fan 3 .
  • the wind-guiding device 2 can be any shaped for changing the flow direction of the wind, or being omitted.
  • the present invention can dissipate efficiently the heat from the CPU and another electronic element that disposes around the CPU. Furthermore, the wind-guiding device can guide the wind from the fan to correct place for cooling the CPU or another electronic element. Hence the present invention can provide a comprehensive heat-dissipating effect on the CPU.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat-dissipating structure is assembled on a Central Processing Unit, and has a water-cooling device, a fan and a support device. The support device is assembled between the water-cooling device and the fan to form an accommodating space. Hence, the heat-dissipating device can efficiently dissipate the heat from the Central Processing Unit and another electronic element that is disposed in the vicinity of the Central Processing Unit. Furthermore, the air-guiding device can guide the air from the fan to the correct place for cooling the Central Processing Unit or another electronic element.

Description

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a heat-dissipating structure, and particularly relates to a heat-dissipating structure assembled on a Central Processing Unit (CPU). The heat-dissipating structure has a fan separated a distance from a water-cooling device by a support device. Additionally, the air from the fan is directed by an air-guiding device to the CPU and another element that disposed in the vicinity of the CPU for dissipating the heat.
2. Description of the Related Art
According to the development of the computer industry, the processing velocity of the CPU is faster, and then the heat from the CPU is higher. In order to dissipate the heat from the heat source to the external world, a heat-dissipating device and a fan usually be used to help to dissipate the heat.
The water-cooling device (water block) of the prior art is assembled on the CPU for dissipating the heat from the heat source of the CPU in order to obtain a perfect heat-dissipating effect.
Referring to FIG. 1, the water-cooling device 90 of prior art includes a main body 91 disposed on a heat surface of a CPU 92, and a flow channel 93 formed in the main body 91 for guiding the cooling fluid to circulate in the main body 91. The flow channel 93 connects to an external pipe and a pump to drive the cooling fluid to circulate in the main body 91 for dissipating the heat from the CPU 92.
However, the water-cooling device only can dissipate the heat from the CPU. Moreover, another electronic element disposes around the CPU, and will result more heat by the CPU. However the prior art cannot provide a heat-dissipating effect on another electronic element.
SUMMARY OF THE INVENTION
The present invention provides a heat-dissipating device. A fan provides wind through the accommodating space to dissipate the heat from the water-cooling device by an air-cooling method. Therefore, both the water-cooling method and the air-cooling method dissipates the heat of the CPU. Furthermore, after the wind from the fan blows to the water-cooling device, the wind changes the flow direction for blowing to another electronic element that disposes around the CPU. In other words, the present invention can dissipate efficiently the heat from the CPU and another electronic element that disposes around the CPU. Furthermore, the wind-guiding device can guide the wind from the fan to correct place for cooling the CPU or another electronic element. Hence the present invention can provide a comprehensive heat-dissipating effect on the CPU.
One aspect of the invention is a heat-dissipating structure. The heat-dissipating structure is assembled on a CUP, and has a water-cooling device, a fan and a support device. The support device is assembled between the water-cooling device and the fan to form an accommodating space.
It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed. Other advantages and features of the invention will be apparent from the following description, drawings and claims.
BRIEF DESCRIPTION OF THE DRAWINGS
The various objectives and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawing, in which:
FIG. 1 is a perspective view of a water-cooling device of the prior art;
FIG. 2 is a perspective view of a water-cooling device of the present art;
FIG. 3 is a side view of a water-cooling device of the present art;
FIG. 4 is a schematic view of a water-cooling device in use according to the present art;
FIG. 5 is a perspective view of a water-cooling device of another embodiment according to the present art;
FIG. 6 is a side view of a water-cooling device of another embodiment according to the present art; and
FIG. 7 is a schematic view of a water-cooling device of another embodiment in use according to the present art.
 DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
Referring to FIGS. 2 and 3, the present invention provides a heat-dissipating structure assembled on a CPU 5. The heat-dissipating structure includes a water-cooling device 1, a fan 3 and a support device 4. Wherein the water-cooling device 1 has a main body 11. The main body 11 is made of metal materials with a good heat-conducting function. The main body 11 has a contact face 111 and a connection face 112 opposite to each other. The contact face 111 of the main body 11 is disposed on a heat surface 51 of the CPU 5. The main body 11 has a suitable flow channel (not shown) formed therein for guiding cooling fluid to circulate in the main body 11. The water-cooling device 1 has a connection 12 connecting to the flow channel, an external pipe and a pump for driving the cooling fluid to circulate in the main body 11.
The fan 3 is an axial-flow fan or another type of fan. The support device 4 is assembled between the water-cooling device 1 and the fan 3 for supporting the fan 3 to assemble over the water-cooling device 1. The support device 4 has four fixed posts 41 with same height. Each of the four fixed posts 41 has an upper side screwing to one corner of the fan 3 and a bottom seat 42 connecting to a lower side thereof. The bottom seat 42 is fixed on the main body 11 of the water-cooling device 1. The support device 4 is assembled between the water-cooling device 1 and the fan 3 to form an accommodating space 43. The accommodating space 43 is enclosed by the four fixed posts 41 to provide a wind flow space for when the fan 3 working.
Referring to FIG. 4, the water-cooling device 1 is assembled on the heat surface of the CPU 5 by the contact face 111 of the water-cooling device 1 for dissipating the heat from the CUP 5 by a water-cooling method. The fan 3 provides wind through the accommodating space to dissipate the heat from the water-cooling device 1 and the CPU 5 by an air-cooling method. Therefore, both the water-cooling method and the air-cooling method dissipates the heat of the CPU 5. Furthermore, after the wind from the fan 3 blows to the water-cooling device 1, the wind changes the flow direction for blowing to another electronic element that disposes around the CPU 5.
Hence the wind from the fan 3 can blow to the water-cooling device 1 for dissipating the heat from the CPU 5, and blow to another electronic element that disposes around the CPU 5 for increasing the life of the electronic element.
Referring to FIGS. 5 to 7, the heat-dissipating structure further includes a wind-guiding device 2 disposed on the main body 11 of the water-cooling device 1. The wind-guiding device 2 has a cone shaped in the present embodiment. The wind-guiding device 2 has a wind-guiding face 21 formed on a surface thereof. The wind-guiding face 21 has an oblique face extended outwardly from up to down for guiding the wind from vertical flow to horizontal flow, so as to change a flow direction of the wind. The wind-guiding device 2 has a bottom portion connecting to the bottom seat 42 of the support device 4. Hence the wind-guiding device 2 is disposed between the main body 11 of the water-cooling device 1 and the fan 3. The wind-guiding device 2 can be any shaped for changing the flow direction of the wind, or being omitted.
In other words, the present invention can dissipate efficiently the heat from the CPU and another electronic element that disposes around the CPU. Furthermore, the wind-guiding device can guide the wind from the fan to correct place for cooling the CPU or another electronic element. Hence the present invention can provide a comprehensive heat-dissipating effect on the CPU.
Although the present invention has been described with reference to the preferred embodiment thereof, it will be understood that the invention is not limited to the details thereof. Various substitutions and modifications have been suggested in the foregoing description, and others will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are intended to be embraced within the scope of the invention as defined in the appended claims.

Claims (2)

1. A heat-dissipating structure, comprising:
a water-cooling device having a main body with a contact face in contact with a surface of a central processing unit and an opposing connection face;
a fan for providing airflow to dissipate heat from the water-cooling device;
a support device assembled between the main body of the water-cooling device and the fan to form an accommodating space therebetween, the support device having a bottom seat affixed to the connection face of the water-cooling device and four fixed posts enclosing the accommodating space, each of the fixed posts having an upper side connecting with one corner of the fan and a lower side fixed to the bottom seat; and
an air-guiding device disposed in the accommodating space and secured to the bottom seat, the air-guiding device having an air-guiding face on a surface thereof, the air-guiding face being an oblique face extending outwardly from an upper end thereof adjacent the fan to an opposing end adjacent the bottom seat;
wherein the fan provides air flow through the accommodating space and over the air-guiding face of the air-guiding device for guiding air flow from the fan to change direction and dissipate heat from the water-cooling device.
2. The heat-dissipating structure as claimed in claim 1, wherein the air-guiding device has a conical shaped.
US11/113,189 2005-04-25 2005-04-25 Heat-dissipating structure with air-guiding device Expired - Fee Related US7256998B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050261981A1 (en) * 2004-05-24 2005-11-24 Geoffrey Girdler Point of sale systems and methods

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104185405B (en) * 2013-05-27 2017-08-04 英业达科技有限公司 Electronic installation

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6019165A (en) * 1998-05-18 2000-02-01 Batchelder; John Samuel Heat exchange apparatus
US6477045B1 (en) * 2001-12-28 2002-11-05 Tien-Lai Wang Heat dissipater for a central processing unit
US6809928B2 (en) * 2002-12-27 2004-10-26 Intel Corporation Sealed and pressurized liquid cooling system for microprocessor
US6909608B2 (en) * 2003-02-25 2005-06-21 Datech Technology Co., Ltd. Heat sink assembly with heat pipe
US20060219387A1 (en) * 2005-04-01 2006-10-05 Takayuki Atarashi Cooling jacket
US20060268513A1 (en) * 2005-05-29 2006-11-30 Jian-Qing Sheng Grease cover for heat dissipating apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6019165A (en) * 1998-05-18 2000-02-01 Batchelder; John Samuel Heat exchange apparatus
US6477045B1 (en) * 2001-12-28 2002-11-05 Tien-Lai Wang Heat dissipater for a central processing unit
US6809928B2 (en) * 2002-12-27 2004-10-26 Intel Corporation Sealed and pressurized liquid cooling system for microprocessor
US6909608B2 (en) * 2003-02-25 2005-06-21 Datech Technology Co., Ltd. Heat sink assembly with heat pipe
US20060219387A1 (en) * 2005-04-01 2006-10-05 Takayuki Atarashi Cooling jacket
US20060268513A1 (en) * 2005-05-29 2006-11-30 Jian-Qing Sheng Grease cover for heat dissipating apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050261981A1 (en) * 2004-05-24 2005-11-24 Geoffrey Girdler Point of sale systems and methods
US7827063B2 (en) * 2004-05-24 2010-11-02 Digipos Store Solutions Group Limited Point of sale systems and methods

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