US7129182B2 - Method for etching a thin metal layer - Google Patents
Method for etching a thin metal layer Download PDFInfo
- Publication number
- US7129182B2 US7129182B2 US10/704,498 US70449803A US7129182B2 US 7129182 B2 US7129182 B2 US 7129182B2 US 70449803 A US70449803 A US 70449803A US 7129182 B2 US7129182 B2 US 7129182B2
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- United States
- Prior art keywords
- metal layer
- layer
- oxide
- metal
- gate dielectric
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 184
- 239000002184 metal Substances 0.000 title claims abstract description 184
- 238000000034 method Methods 0.000 title claims abstract description 71
- 238000005530 etching Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 230000000873 masking effect Effects 0.000 claims description 37
- 239000002738 chelating agent Substances 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 14
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 14
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 13
- 229920005591 polysilicon Polymers 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910044991 metal oxide Inorganic materials 0.000 claims description 8
- 150000004706 metal oxides Chemical class 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 8
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 7
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 7
- 239000007864 aqueous solution Substances 0.000 claims description 7
- 229910017052 cobalt Inorganic materials 0.000 claims description 7
- 239000010941 cobalt Substances 0.000 claims description 7
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 7
- 229910052735 hafnium Inorganic materials 0.000 claims description 7
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 229910052763 palladium Inorganic materials 0.000 claims description 7
- 229910052697 platinum Inorganic materials 0.000 claims description 7
- 229910052707 ruthenium Inorganic materials 0.000 claims description 7
- 229910052715 tantalum Inorganic materials 0.000 claims description 7
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- 239000010936 titanium Substances 0.000 claims description 7
- 229910052726 zirconium Inorganic materials 0.000 claims description 7
- 229910000449 hafnium oxide Inorganic materials 0.000 claims description 6
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 claims description 6
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 claims description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 6
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 6
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 6
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims description 4
- XWCMFHPRATWWFO-UHFFFAOYSA-N [O-2].[Ta+5].[Sc+3].[O-2].[O-2].[O-2] Chemical compound [O-2].[Ta+5].[Sc+3].[O-2].[O-2].[O-2] XWCMFHPRATWWFO-UHFFFAOYSA-N 0.000 claims description 3
- ILCYGSITMBHYNK-UHFFFAOYSA-N [Si]=O.[Hf] Chemical compound [Si]=O.[Hf] ILCYGSITMBHYNK-UHFFFAOYSA-N 0.000 claims description 3
- VKJLWXGJGDEGSO-UHFFFAOYSA-N barium(2+);oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[O-2].[Ti+4].[Ba+2] VKJLWXGJGDEGSO-UHFFFAOYSA-N 0.000 claims description 3
- JQJCSZOEVBFDKO-UHFFFAOYSA-N lead zinc Chemical compound [Zn].[Pb] JQJCSZOEVBFDKO-UHFFFAOYSA-N 0.000 claims description 3
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 claims description 3
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 claims description 3
- 150000002989 phenols Chemical class 0.000 claims description 3
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 claims description 3
- CZXRMHUWVGPWRM-UHFFFAOYSA-N strontium;barium(2+);oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[O-2].[O-2].[Ti+4].[Sr+2].[Ba+2] CZXRMHUWVGPWRM-UHFFFAOYSA-N 0.000 claims description 3
- 229910001936 tantalum oxide Inorganic materials 0.000 claims description 3
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 claims description 3
- 239000004615 ingredient Substances 0.000 claims 12
- 150000001735 carboxylic acids Chemical class 0.000 claims 3
- 150000007965 phenolic acids Chemical class 0.000 claims 1
- 238000007704 wet chemistry method Methods 0.000 claims 1
- 239000004480 active ingredient Substances 0.000 abstract description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000002019 doping agent Substances 0.000 description 4
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
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- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- FCKYPQBAHLOOJQ-UHFFFAOYSA-N Cyclohexane-1,2-diaminetetraacetic acid Chemical compound OC(=O)CN(CC(O)=O)C1CCCCC1N(CC(O)=O)CC(O)=O FCKYPQBAHLOOJQ-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- 229910018503 SF6 Inorganic materials 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000000277 atomic layer chemical vapour deposition Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- DUYCTCQXNHFCSJ-UHFFFAOYSA-N dtpmp Chemical compound OP(=O)(O)CN(CP(O)(O)=O)CCN(CP(O)(=O)O)CCN(CP(O)(O)=O)CP(O)(O)=O DUYCTCQXNHFCSJ-UHFFFAOYSA-N 0.000 description 1
- -1 e.g. Inorganic materials 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229910000042 hydrogen bromide Inorganic materials 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 229910000043 hydrogen iodide Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823828—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes
- H01L21/823842—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes gate conductors with different gate conductor materials or different gate conductor implants, e.g. dual gate structures
Definitions
- the present invention relates to methods for etching metal layers, in particular, those formed when making semiconductor devices.
- a metal gate electrode when making a MOS field-effect transistor that includes a high-k gate dielectric.
- patterned masking layer 102 may define sections of metal layer 101 to be removed. If a wet etch process is applied to remove part of metal layer 101 , that process may etch metal layer 101 isotropically. As a consequence, part of metal layer 101 may be etched from beneath masking layer 102 , as FIG. 1 b illustrates. The resulting undercut may have adverse consequences.
- FIGS. 1 a – 1 b illustrate a process for etching a metal layer.
- FIGS. 2 a – 2 b represent cross-sections of structures that may be formed when carrying out an embodiment of the method of the present invention.
- FIGS. 3 a – 3 c identify hexa-dentate chelating agents that may be used in an embodiment of the method of the present invention.
- FIGS. 4 a – 4 c represent cross-sections of structures that may be formed when carrying out a second embodiment of the method of the present invention.
- FIGS. 5 a – 5 g represent cross-sections of structures that may be formed when carrying out a third embodiment of the method of the present invention.
- a method for etching a metal layer comprises forming a metal layer on a substrate, then exposing part of the metal layer to a wet etch chemistry that comprises an active ingredient with a diameter that exceeds the thickness of the metal layer.
- FIGS. 2 a – 2 b illustrate structures that may be formed, when carrying out an embodiment of the method of the present invention.
- metal layer 201 is formed on substrate 200 .
- Masking layer 202 is then deposited and patterned to generate the FIG. 2 a structure.
- Metal layer 201 preferably is less than about 100 angstroms thick, and more preferably is between about 25 angstroms and about 50 angstroms thick.
- Metal layer 201 may comprise any metal that may be etched. Examples of such metals include: hafnium, zirconium, titanium, tantalum, aluminum, ruthenium, palladium, platinum, cobalt, nickel, metal carbides and conductive metal oxides.
- Metal layer 201 may be formed on substrate 200 using a conventional PVD or CVD process, as will be apparent to those skilled in the art.
- Masking layer 202 preferably comprises a silicon nitride or silicon dioxide hard mask, which may be deposited and patterned in the conventional manner.
- exposed part 203 of metal layer 201 is removed, generating the FIG. 2 b structure.
- exposed part 203 of metal layer 201 is removed using a wet etch chemistry that comprises an active ingredient.
- That active ingredient preferably comprises an etchant that is associated with a sufficient number of water molecules to solubilize the etchant.
- the resulting complex which may have a quasi-spherical configuration and may be identified as a “hydrated etchant”—must have a diameter that exceeds the thickness of metal layer 201 .
- a wet etch chemistry comprising an aqueous solution that includes a chelating agent (e.g., an organic compound that may bind to a metal ion to form a chelate) is applied to exposed part 203 of metal layer 201 to remove that part of that layer.
- a chelating agent e.g., an organic compound that may bind to a metal ion to form a chelate
- examples of potentially useful chelating agents include those that have been employed to remove metallic contaminants from semiconductor substrates.
- Particularly preferred are hexa-dentate chelating agents (i.e., chelating agents with six bonding atoms).
- 3 a – 3 c identify some hexa-dentate chelating agents that may be used, including carboxylic acid based chelating agents 301 and 302 (EDTA and CDTA, respectively); catechol 303 (representative of phenol derivatives that may be used); and phosphonic acid based chelating agents 304 and 305 (c-TRAMP and DTPMP).
- carboxylic acid based chelating agents 301 and 302 EDTA and CDTA, respectively
- catechol 303 representsative of phenol derivatives that may be used
- phosphonic acid based chelating agents 304 and 305 c-TRAMP and DTPMP
- the method described above ensures that significant amounts of metal layer 201 will not be removed from beneath masking layer 202 , when exposed part 203 of metal layer 201 is removed. In a preferred embodiment, less than about 100 angstroms of metal layer 201 are removed from beneath masking layer 202 , when exposed part 203 of metal layer 201 is removed. In a more preferred embodiment, less than about 50 angstroms of metal layer 201 are removed from beneath masking layer 202 , when exposed part 203 of metal layer 201 is removed.
- FIGS. 4 a – 4 c illustrate a process for making a semiconductor device that employs the method of the present invention. Initially, high-k gate dielectric layer 401 is formed on substrate 400 , and metal layer 402 is formed on high-k gate dielectric layer 401 . Part of metal layer 402 is then masked by masking layer 403 —generating the FIG. 4 a structure.
- Substrate 400 may comprise any material upon which a semiconductor device may be built.
- High-k gate dielectric layer 401 may comprise, for example, hafnium oxide, hafnium silicon oxide, lanthanum oxide, zirconium oxide, zirconium silicon oxide, tantalum oxide, barium strontium titanium oxide, barium titanium oxide, strontium titanium oxide, yttrium oxide, aluminum oxide, lead scandium tantalum oxide, or lead zinc niobate. Particularly preferred are hafnium oxide, zirconium oxide, and aluminum oxide.
- Metal layer 402 may comprise any conductive material from which a metal gate electrode may be derived. In this regard, metal layer 402 may comprise one of the materials identified above in connection with metal layer 201 .
- High-k gate dielectric layer 401 and metal layer 402 may be formed on substrate 400 using conventional PVD and CVD deposition methods.
- a conventional atomic layer CVD process preferably is used to deposit high-k gate dielectric layer 401 .
- High-k gate dielectric layer 401 preferably is between about 5 angstroms and about 40 angstroms thick.
- Metal layer 402 preferably is less than about 100 angstroms thick, and more preferably is between about 25 angstroms and about 50 angstroms thick.
- Masking layer 403 may comprise a polysilicon layer, which may be deposited and patterned using conventional deposition, photolithography and etch techniques.
- a wet etch chemistry that comprises an aqueous solution that contains a chelating agent may be applied to exposed part 404 of metal layer 402 to remove that part of that layer, and to generate the FIG. 4 b structure.
- hexa-dentate chelating agents may be used to etch metal layer 402 .
- Removing exposed portion 404 of metal layer 402 using a wet etch chemistry that includes such a chelating agent may enable metal layer 402 to be etched selectively to high-k gate dielectric layer 401 , without significantly etching that metal layer from beneath masking layer 403 .
- the exposed portion of high-k gate dielectric layer 401 may be removed using any etch process suitable for removing such a layer, yielding the FIG. 4 c structure.
- FIGS. 5 a – 5 g illustrate a process for making a CMOS semiconductor device that employs the method of the present invention.
- FIG. 5 a represents a cross-section of a structure that includes: high-k gate dielectric layer 501 , which is formed on substrate 500 ; first metal layer 502 , which is formed on high-k gate dielectric layer 501 ; and masking layer 503 , which is formed on first metal layer 502 .
- High-k gate dielectric layer 501 may comprise one of the materials identified above.
- first metal layer 502 comprises an n-type metal, for example: hafnium, zirconium, titanium, tantalum, aluminum, and metal carbides that include these elements.
- First metal layer 502 may be formed on high-k gate dielectric layer 501 using a well known PVD or CVD process, and preferably is between about 25 angstroms and about 50 angstroms thick.
- first metal layer 502 comprises an n-type material, that layer preferably has a workfunction that is between about 3.9 eV and about 4.2 eV.
- Dopants may be added to first metal layer 502 , as it is formed or after it is formed, to shift layer 502 's workfunction to ensure that it falls within the desired range.
- the optimal concentration of any dopant that is added to first metal layer 502 to shift its workfunction to a targeted level may depend upon the composition and properties of layer 502 (including its initial workfunction), the type of dopant used, and the target workfunction.
- Metal layers that are doped as, or after, they are deposited fall within the definition of “metal layer,” as that term is used in this application.
- Masking layer 503 may be formed from conventional materials, e.g., silicon nitride or silicon dioxide, using conventional techniques. After masking layer 503 is deposited on layer 502 , conventional photolithography and etch processes may be applied to remove part of masking layer 503 , exposing a first portion of first metal layer 502 and yielding the FIG. 5 a structure.
- conventional photolithography and etch processes may be applied to remove part of masking layer 503 , exposing a first portion of first metal layer 502 and yielding the FIG. 5 a structure.
- first metal layer 502 is removed, leaving part of high-k gate dielectric layer 501 exposed.
- a plasma dry etch process e.g., one using a chlorine based plasma, may be applied to remove a first portion of layer 502 selective to high-k gate dielectric layer 501 .
- a wet etch process may be used instead as long as it does not remove a significant amount of layer 502 from beneath masking layer 503 .
- second metal layer 504 is then deposited on first metal layer 502 and on the exposed portion of high-k gate dielectric layer 501 —generating the structure illustrated by FIG. 5 c.
- first metal layer 502 comprises an n-type metal
- second metal layer 504 preferably comprises a p-type metal.
- Examples of potentially suitable p-type metals for forming second metal layer 504 include: ruthenium, palladium, platinum, cobalt, nickel, and conductive metal oxides, e.g., ruthenium oxide.
- Second metal layer 504 may be formed on high-k gate dielectric layer 501 and first metal layer 502 using a conventional PVD or CVD process, and preferably is between about 25 angstroms and about 50 angstroms thick.
- layer 504 preferably has a workfunction that is between about 4.9 eV and about 5.2 eV.
- first metal layer 502 and second metal layer 504 may each comprise the same mid-gap metal, e.g., titanium nitride or tantalum nitride.
- the workfunction of a layer that includes such a mid-gap metal may be shifted up or down by adding an element to that layer that has a relatively low electronegativity or a relatively high electronegativity.
- the workfunction of that layer may be shifted to about 4.2 eV or less by adding to a mid-gap metal an element with a relatively low electronegativity, e.g., aluminum.
- the workfunction of that layer may be shifted to about 4.9 eV or higher by adding to a mid-gap metal an element with a relatively high electronegativity, e.g., chlorine.
- first and second metal layers 502 and 504 are described here, those layers may be made from many other materials.
- FIG. 5 d represents a cross-section of the structure that results after masking layer 506 is deposited on masking layer 505 , and then patterned.
- masking layer 505 comprises a polysilicon containing layer, which may be deposited using conventional methods and which preferably is between about 500 angstroms and about 2,000 angstroms thick. Such a polysilicon layer may be undoped or doped with either n-type or p-type impurities.
- Layer 506 may comprise conventional materials, e.g., silicon nitride or silicon dioxide, and may be deposited and patterned using conventional techniques.
- a first portion of layer 505 is removed selective to second metal layer 504 to expose part of layer 504 and to create the FIG. 5 e structure.
- a dry etch process may be used to etch layer 505 .
- Such a dry etch process may employ a plasma that is derived from sulfur hexafluoride, hydrogen bromide, hydrogen iodide, chlorine, argon, oxygen and/or helium.
- the optimal process for etching layer 505 may depend upon the material used for second metal layer 504 , the degree to which layer 505 is doped, and the desired profile for the resulting etched layer.
- second metal layer 504 and the underlying portion of first metal layer 502 are then removed, to generate the FIG. 5 f structure.
- layers 504 and 502 are removed with a wet etch process that employs a chelating agent, like those identified above.
- chelating agents are added to an aqueous solution to etch metal layers 504 and 502 , they should be included at a concentration of between about 0.5 and about 5.0 moles/liter.
- a chelating agent that is tailored to bind with ions of a specific metal may selectively etch a layer that includes that metal without significantly etching an underlying film having a different composition.
- parts of a chelating agent e.g., aryl or alkyl groups, may be modified to enhance its ability to bind to a specific metal (or metals) to enable selective etching of that metal.
- a wet etch chemistry for etching those layers may include multiple chelating agents—with different agents having an affinity to bind to different components that are contained in those layers.
- the relative concentration of each chelating agent included in such a solution may be proportional to the relative amounts of each component included in the metal layers.
- the chelating agent or agents selected for the wet etch chemistry used to etch layers 504 and 502 should be combined with a suitable solvent to maximize etch selectively.
- the best solvent for etching layers 504 and 502 selectively to layer 501 may be de-ionized water.
- the optimum solvent may be acidic or basic, and may comprise many types of polar and/or nonpolar components, depending upon the composition of layers 504 , 502 , and 501 .
- the same wet etch chemistry is used to etch both layers 504 and 502 , different wet etch chemistries may be used to etch those layers.
- exposing those layers to a wet etch chemistry that includes a chelating agent or agents may etch those layers selectively to high-k gate dielectric layer 501 , without significantly etching those materials from beneath masking layer 505 .
- a wet etch chemistry to etch layers 504 and 502 ensures that less than about 100 angstroms of those layers will be removed from beneath masking layer 505 .
- such an etch process will undercut masking layer 505 by less than about 50 angstroms.
- the exposed portion of high-k gate dielectric layer 501 is removed, generating the FIG. 5 g structure.
- Process steps for completing the device that follow the dielectric layer etch e.g., forming source and drain regions and the device's contacts, are well known to those skilled in the art and will not be described in more detail here.
- using a dummy doped polysilicon layer for masking layer 505 may enable one to apply commonly used nitride spacer, source/drain, and silicide formation techniques, when completing the structure.
- first metal layer 502 may comprise an n-type metal
- second metal layer 504 may comprise a p-type metal
- first metal layer 502 may comprise a p-type metal
- second metal layer 504 may comprise an n-type metal.
- the method of the present invention enables an exposed portion of a very thin metal layer to be etched without removing significant portions of that layer where located beneath a masking layer.
- the embodiments described above provide examples of processes for carrying out this method, the present invention is not limited to these particular embodiments.
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Abstract
A method for etching a metal layer is described. That method comprises forming a metal layer on a substrate, then exposing part of the metal layer to a wet etch chemistry that comprises an active ingredient with a diameter that exceeds the thickness of the metal layer.
Description
The present invention relates to methods for etching metal layers, in particular, those formed when making semiconductor devices.
It may be desirable to use a metal gate electrode when making a MOS field-effect transistor that includes a high-k gate dielectric. When forming such a metal gate electrode, it may be necessary to remove portions of a previously deposited very thin metal layer. As shown in FIG. 1 a, patterned masking layer 102 may define sections of metal layer 101 to be removed. If a wet etch process is applied to remove part of metal layer 101, that process may etch metal layer 101 isotropically. As a consequence, part of metal layer 101 may be etched from beneath masking layer 102, as FIG. 1 b illustrates. The resulting undercut may have adverse consequences.
Accordingly, there is a need for an improved process for etching a very thin metal layer. There is a need for such a process that may enable part of such a layer to be removed, without removing significant portions of it from beneath an overlying masking layer. The method of the present invention provides such a process.
Features shown in these figures are not intended to be drawn to scale.
A method for etching a metal layer is described. That method comprises forming a metal layer on a substrate, then exposing part of the metal layer to a wet etch chemistry that comprises an active ingredient with a diameter that exceeds the thickness of the metal layer. In the following description, a number of details are set forth to provide a thorough understanding of the present invention. It will be apparent to those skilled in the art, however, that the invention may be practiced in many ways other than those expressly described here. The invention is thus not limited by the specific details disclosed below.
After masking layer 202 is patterned, exposed part 203 of metal layer 201 is removed, generating the FIG. 2 b structure. In the method of the present invention, exposed part 203 of metal layer 201 is removed using a wet etch chemistry that comprises an active ingredient. That active ingredient preferably comprises an etchant that is associated with a sufficient number of water molecules to solubilize the etchant. The resulting complex—which may have a quasi-spherical configuration and may be identified as a “hydrated etchant”—must have a diameter that exceeds the thickness of metal layer 201.
In a particularly preferred embodiment, a wet etch chemistry comprising an aqueous solution that includes a chelating agent (e.g., an organic compound that may bind to a metal ion to form a chelate) is applied to exposed part 203 of metal layer 201 to remove that part of that layer. Examples of potentially useful chelating agents include those that have been employed to remove metallic contaminants from semiconductor substrates. Particularly preferred are hexa-dentate chelating agents (i.e., chelating agents with six bonding atoms). FIGS. 3 a–3 c identify some hexa-dentate chelating agents that may be used, including carboxylic acid based chelating agents 301 and 302 (EDTA and CDTA, respectively); catechol 303 (representative of phenol derivatives that may be used); and phosphonic acid based chelating agents 304 and 305 (c-TRAMP and DTPMP). When such well known chelating agents are added to an aqueous solution to etch metal layer 201, they should be included at a concentration of between about 0.5 and about 5.0 moles/liter.
In contrast to the method that FIGS. 1 a–1 b illustrate, the method described above ensures that significant amounts of metal layer 201 will not be removed from beneath masking layer 202, when exposed part 203 of metal layer 201 is removed. In a preferred embodiment, less than about 100 angstroms of metal layer 201 are removed from beneath masking layer 202, when exposed part 203 of metal layer 201 is removed. In a more preferred embodiment, less than about 50 angstroms of metal layer 201 are removed from beneath masking layer 202, when exposed part 203 of metal layer 201 is removed.
High-k gate dielectric layer 401 and metal layer 402 may be formed on substrate 400 using conventional PVD and CVD deposition methods. A conventional atomic layer CVD process preferably is used to deposit high-k gate dielectric layer 401. High-k gate dielectric layer 401 preferably is between about 5 angstroms and about 40 angstroms thick. Metal layer 402 preferably is less than about 100 angstroms thick, and more preferably is between about 25 angstroms and about 50 angstroms thick. Masking layer 403 may comprise a polysilicon layer, which may be deposited and patterned using conventional deposition, photolithography and etch techniques.
A wet etch chemistry that comprises an aqueous solution that contains a chelating agent may be applied to exposed part 404 of metal layer 402 to remove that part of that layer, and to generate the FIG. 4 b structure. As in the embodiment described above, hexa-dentate chelating agents may be used to etch metal layer 402. Removing exposed portion 404 of metal layer 402 using a wet etch chemistry that includes such a chelating agent may enable metal layer 402 to be etched selectively to high-k gate dielectric layer 401, without significantly etching that metal layer from beneath masking layer 403. After metal layer 402 is etched, the exposed portion of high-k gate dielectric layer 401 may be removed using any etch process suitable for removing such a layer, yielding the FIG. 4 c structure.
High-k gate dielectric layer 501 may comprise one of the materials identified above. In one embodiment, first metal layer 502 comprises an n-type metal, for example: hafnium, zirconium, titanium, tantalum, aluminum, and metal carbides that include these elements. First metal layer 502 may be formed on high-k gate dielectric layer 501 using a well known PVD or CVD process, and preferably is between about 25 angstroms and about 50 angstroms thick. When first metal layer 502 comprises an n-type material, that layer preferably has a workfunction that is between about 3.9 eV and about 4.2 eV.
Dopants may be added to first metal layer 502, as it is formed or after it is formed, to shift layer 502's workfunction to ensure that it falls within the desired range. The optimal concentration of any dopant that is added to first metal layer 502 to shift its workfunction to a targeted level may depend upon the composition and properties of layer 502 (including its initial workfunction), the type of dopant used, and the target workfunction. Metal layers that are doped as, or after, they are deposited fall within the definition of “metal layer,” as that term is used in this application.
Masking layer 503 may be formed from conventional materials, e.g., silicon nitride or silicon dioxide, using conventional techniques. After masking layer 503 is deposited on layer 502, conventional photolithography and etch processes may be applied to remove part of masking layer 503, exposing a first portion of first metal layer 502 and yielding the FIG. 5 a structure.
After patterning masking layer 503, a first portion of first metal layer 502 is removed, leaving part of high-k gate dielectric layer 501 exposed. A plasma dry etch process, e.g., one using a chlorine based plasma, may be applied to remove a first portion of layer 502 selective to high-k gate dielectric layer 501. Although a dry etch process is preferred, a wet etch process may be used instead as long as it does not remove a significant amount of layer 502 from beneath masking layer 503. After first metal layer 502 is etched, the remainder of masking layer 503 is removed, generating the FIG. 5 b structure.
In this embodiment, second metal layer 504 is then deposited on first metal layer 502 and on the exposed portion of high-k gate dielectric layer 501—generating the structure illustrated by FIG. 5 c. When first metal layer 502 comprises an n-type metal, second metal layer 504 preferably comprises a p-type metal. Examples of potentially suitable p-type metals for forming second metal layer 504 include: ruthenium, palladium, platinum, cobalt, nickel, and conductive metal oxides, e.g., ruthenium oxide.
As with first metal layer 502, dopants may be added to second metal layer 504 to shift layer 504's workfunction to the desired level. In some embodiments, first metal layer 502 and second metal layer 504 may each comprise the same mid-gap metal, e.g., titanium nitride or tantalum nitride. The workfunction of a layer that includes such a mid-gap metal may be shifted up or down by adding an element to that layer that has a relatively low electronegativity or a relatively high electronegativity. When an n-type metal is desired for first metal layer 502, the workfunction of that layer may be shifted to about 4.2 eV or less by adding to a mid-gap metal an element with a relatively low electronegativity, e.g., aluminum. When a p-type metal is desired for second metal layer 504, the workfunction of that layer may be shifted to about 4.9 eV or higher by adding to a mid-gap metal an element with a relatively high electronegativity, e.g., chlorine.
Although a few examples of materials that may be used to form first and second metal layers 502 and 504 are described here, those layers may be made from many other materials. The term “metal layer,” as applied in this embodiment, thus encompasses any conductive material from which a metal gate electrode may be derived.
After depositing second metal layer 504 on first metal layer 502 and high-k gate dielectric layer 501, masking layer 505 is deposited on second metal layer 504. Masking layer 506 is then formed on masking layer 505 and patterned to define sections of masking layer 505 to be removed and sections to be retained. FIG. 5 d represents a cross-section of the structure that results after masking layer 506 is deposited on masking layer 505, and then patterned.
In a preferred embodiment, masking layer 505 comprises a polysilicon containing layer, which may be deposited using conventional methods and which preferably is between about 500 angstroms and about 2,000 angstroms thick. Such a polysilicon layer may be undoped or doped with either n-type or p-type impurities. Layer 506 may comprise conventional materials, e.g., silicon nitride or silicon dioxide, and may be deposited and patterned using conventional techniques.
After layer 506 is patterned, a first portion of layer 505 is removed selective to second metal layer 504 to expose part of layer 504 and to create the FIG. 5 e structure. A dry etch process may be used to etch layer 505. Such a dry etch process may employ a plasma that is derived from sulfur hexafluoride, hydrogen bromide, hydrogen iodide, chlorine, argon, oxygen and/or helium. The optimal process for etching layer 505 may depend upon the material used for second metal layer 504, the degree to which layer 505 is doped, and the desired profile for the resulting etched layer.
The exposed portion of second metal layer 504 and the underlying portion of first metal layer 502 are then removed, to generate the FIG. 5 f structure. To prevent that process step from removing significant portions of layers 504 and 502 from beneath masking layer 505, layers 504 and 502 are removed with a wet etch process that employs a chelating agent, like those identified above. When such well known chelating agents are added to an aqueous solution to etch metal layers 504 and 502, they should be included at a concentration of between about 0.5 and about 5.0 moles/liter.
Depending upon the materials used for metal layers 504 and 502 and for high-k gate dielectric layer 501, it may be desirable to modify the chelating agents described above (or to employ other types of chelating agents) to ensure that layers 504 and 502 are etched selectively to layer 501. A chelating agent that is tailored to bind with ions of a specific metal may selectively etch a layer that includes that metal without significantly etching an underlying film having a different composition. In this respect, parts of a chelating agent, e.g., aryl or alkyl groups, may be modified to enhance its ability to bind to a specific metal (or metals) to enable selective etching of that metal.
When second metal layer 504 and first metal layer 502 comprise multiple components, a wet etch chemistry for etching those layers may include multiple chelating agents—with different agents having an affinity to bind to different components that are contained in those layers. The relative concentration of each chelating agent included in such a solution may be proportional to the relative amounts of each component included in the metal layers.
The chelating agent or agents selected for the wet etch chemistry used to etch layers 504 and 502 should be combined with a suitable solvent to maximize etch selectively. The best solvent for etching layers 504 and 502 selectively to layer 501 may be de-ionized water. In other embodiments, the optimum solvent may be acidic or basic, and may comprise many types of polar and/or nonpolar components, depending upon the composition of layers 504, 502, and 501. Although in a preferred embodiment, the same wet etch chemistry is used to etch both layers 504 and 502, different wet etch chemistries may be used to etch those layers.
When the combination of layers 504 and 502 is less than about 100 angstroms thick, exposing those layers to a wet etch chemistry that includes a chelating agent or agents may etch those layers selectively to high-k gate dielectric layer 501, without significantly etching those materials from beneath masking layer 505. In a preferred embodiment, using such a wet etch chemistry to etch layers 504 and 502 ensures that less than about 100 angstroms of those layers will be removed from beneath masking layer 505. In an even more preferred embodiment, such an etch process will undercut masking layer 505 by less than about 50 angstroms.
After metal layers 504 and 502 are etched, the exposed portion of high-k gate dielectric layer 501 is removed, generating the FIG. 5 g structure. Process steps for completing the device that follow the dielectric layer etch, e.g., forming source and drain regions and the device's contacts, are well known to those skilled in the art and will not be described in more detail here. In this regard, using a dummy doped polysilicon layer for masking layer 505 may enable one to apply commonly used nitride spacer, source/drain, and silicide formation techniques, when completing the structure.
The order in which metal layers of different conductivity type are deposited is unimportant. As illustrated, first metal layer 502 may comprise an n-type metal, and second metal layer 504 may comprise a p-type metal. Alternatively, first metal layer 502 may comprise a p-type metal, and second metal layer 504 may comprise an n-type metal.
As illustrated above, the method of the present invention enables an exposed portion of a very thin metal layer to be etched without removing significant portions of that layer where located beneath a masking layer. Although the embodiments described above provide examples of processes for carrying out this method, the present invention is not limited to these particular embodiments.
Although the foregoing description has specified certain steps and materials that may be used in the present invention, those skilled in the art will appreciate that many modifications and substitutions may be made. Accordingly, it is intended that all such modifications, alterations, substitutions and additions be considered to fall within the spirit and scope of the invention as defined by the appended claims.
Claims (25)
1. A method for making a semiconductor device comprising:
forming a high-k gate dielectric layer on a substrate;
forming a metal layer on said high-k gate dielectric layer;
forming a masking layer on said metal layer, exposing part of said metal layer; and
applying a wet etch chemistry that comprises an aqueous solution that includes between about 0.5 and about 5.0 moles/liter of at least one active etching ingredient, wherein said exposed part of said metal layer is removed from said high-k gate dielectric layer by said at least one active etching ingredient, wherein all active etching ingredients have a diameter that exceeds the thickness of said metal layer, and wherein removal of said metal layer underneath said masking layer is blocked by said masking layer.
2. The method of claim 1 wherein said metal layer comprises a material selected from the group consisting of hafnium, zirconium, titanium, tantalum, aluminum, ruthenium, palladium, platinum, cobalt, nickel, a metal carbide, and a conductive metal oxide.
3. The method of claim 1 wherein said high-k gate dielectric layer comprises a material selected from the group consisting of hafnium oxide, hafnium silicon oxide, lanthanum oxide, zirconium oxide, zirconium silicon oxide, tantalum oxide, barium strontium titanium oxide, barium titanium oxide, strontium titanium oxide, yttrium oxide, aluminum oxide, lead scandium tantalum oxide, and lead zinc niobate.
4. The method of claim 1 wherein said masking layer comprises polysilicon.
5. The method of claim 1 wherein said metal layer is between about 25 angstroms and about 50 angstroms thick.
6. A method for making a semiconductor device comprising:
forming a high-k gate dielectric layer on a substrate;
forming a metal layer on said high-k gate dielectric layer, said metal layer being between about 25 angstroms and about 50 angstroms thick;
forming a polysilicon containing layer on said metal layer;
removing a first portion of said polysilicon layer to expose part of said metal layer; and
applying a wet etch chemistry that comprises an aqueous solution that includes between about 0.5 and about 5.0 moles/liter of at least one active etching ingredient to remove said exposed part of said metal layer from said high-k gate dielectric layer, wherein all active etching ingredients have a diameter that exceeds the thickness of said metal layer, and wherein removal of said metal layer underneath said polysilicon containing layer is blocked by said polysilicon containing layer.
7. The method of claim 6 wherein said high-k gate dielectric layer comprises a material selected from the group consisting of hafnium oxide, zirconium oxide, and aluminum oxide.
8. The method of claim 6 wherein said metal layer has a workfunction that is between about 3.9 eV and about 4.2 eV.
9. The method of claim 6 wherein said metal layer has a workfunction that is between about 4.9 eV and about 5.2 eV.
10. The method of claim 6 wherein at least one active etching ingredient is a hexa-dentate chelating agent that is selected from the group consisting of carboxylic acid based chelating agents, phosphonic acid based chelating agents, and phenol derivatives.
11. A method for making a semiconductor device comprising:
forming a high-k gate dielectric layer on a substrate, said high-k gate dielectric layer comprising a material selected from the group consisting of hafnium oxide, zirconium oxide, and aluminum oxide;
forming a first metal layer on said high-k gate dielectric layer, said first metal layer being between about 25 angstroms and about 50 angstroms thick;
removing a first portion of said first metal layer;
forming a second metal layer on said high-k gate dielectric layer, said second metal layer being between about 25 angstroms and about 50 angstroms thick, a first portion of said second metal layer covering the remaining portion of said first metal layer and a second portion of said second metal layer covering said high-k gate dielectric layer;
forming a polysilicon containing layer on said second metal layer;
removing a portion of said polysilicon layer selectively to said second metal layer to expose part of said second metal layer; and
removing the exposed part of said second metal layer and the underlying part of said first metal layer selectively to said high-k gate dielectric layer by exposing said second metal layer and said first metal layer to a wet chemistry that comprises an aqueous solution that includes between about 0.5 and about 5.0 moles/liter of a hexa-dentate chelating agent that is selected from the group consisting of carboxylic acid based chelating agents, phosphonic acid based chelating agents, and phenol derivatives; wherein, said hexa-dentate chelating agent has a diameter that exceeds the combined thickness of said first and said second metal layers.
12. The method of claim 11 wherein said first metal layer has a workfunction that is between about 3.9 eV and about 4.2 eV, comprises a material that is selected from the group consisting of hafnium, zirconium, titanium, tantalum, aluminum, and a metal carbide, and serves as a gate electrode for an NMOS transistor, and said second metal layer has a workfunction that is between about 4.9 eV and about 5.2 eV, comprises a material that is selected from the group consisting of ruthenium, palladium, platinum, cobalt, nickel, and a conductive metal oxide, and serves as a gate electrode for a PMOS transistor.
13. The method of claim 11 wherein said first metal layer has a workfunction that is between about 4.9 eV and about 5.2 eV, comprises a material that is selected from the group consisting of ruthenium, palladium, platinum, cobalt, nickel, and a conductive metal oxide, and serves as a gate electrode for a PMOS transistor, and said second metal layer has a workfunction that is between about 3.9 eV and about 4.2 eV, comprises a material that is selected from the group consisting of hafnium, zirconium, titanium, tantalum, aluminum, and a metal oxide, and serves as a gate electrode for an NMOS transistor.
14. The method of claim 11 wherein less than about 100 angstroms of said second metal layer and the underlying part of said first metal layer are removed from beneath said polysilicon containing layer, when the exposed part of said second metal layer and the underlying part of said first metal layer are removed selectively to said high-k gate dielectric layer.
15. The method of claim 14 wherein less than about 50 angstroms of said second metal layer and the underlying part of said first metal layer are removed from beneath said polysilicon containing layer.
16. A method comprising:
forming a metal layer on a substrate, said metal layer having a thickness;
forming a mask on said metal layer wherein said mask exposes a portion of said metal layer; and
applying a wet etchant that comprises at least one active etching ingredient to remove said exposed portion of said metal layer from said substrate, wherein all active etching ingredients have a diameter that exceeds said thickness of said metal layer, and wherein removal of said metal layer underneath said mask is blocked by said mask.
17. The method of claim 16 wherein said metal layer is between about 25 angstroms and about 50 angstroms thick.
18. The method of claim 17 wherein said metal layer comprises a material selected from the group consisting of hafnium, zirconium, titanium, tantalum, aluminum, ruthenium, palladium, platinum, cobalt, nickel, a metal carbide, and a conductive metal oxide.
19. The method of claim 18 wherein at least one active etching ingredient comprises a chelating agent selected from the group consisting of carboxylic acid based chelating agents, derivatives of phenol, and phosphonic acid based chelating agents.
20. A method comprising:
forming a metal layer on a substrate or a high-k gate dielectric layer, said metal layer having a thickness;
forming a mask on said metal layer wherein said mask exposes a portion of said metal layer; and
applying a wet etchant that comprises at least one active etching ingredient to remove said exposed portion of said metal layer from said substrate, wherein all active etching ingredients have a diameter that exceeds said thickness of said metal layer, thereby preventing all active etching ingredients from significantly undercutting said metal layer underneath said masking layer.
21. The method of claim 20 wherein said undercutting is less than 100 angstroms.
22. The method of claim 21 wherein said undercutting is less than 100 angstroms, regardless of the duration of application of said wet etch chemistry.
23. The method of claim 20 wherein said metal layer is between about 25 angstroms and about 50 angstroms thick.
24. The method of claim 23 wherein said metal layer comprises a material selected from the group consisting of hafnium, zirconium, titanium, tantalum, aluminum, ruthenium, palladium, platinum, cobalt, nickel, a metal carbide, and a conductive metal oxide.
25. The method of claim 20 wherein said high-k gate dielectric layer comprises a material selected from the group consisting of hafnium oxide, hafnium silicon oxide, lanthanum oxide, zirconium oxide, zirconium silicon oxide, tantalum oxide, barium strontium titanium oxide, barium titanium oxide, strontium titanium oxide, yttrium oxide, aluminum oxide, lead scandium tantalum oxide, and lead zinc niobate.
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US20100052066A1 (en) * | 2008-08-26 | 2010-03-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | structure and method for a cmos device with doped conducting metal oxide as the gate electrode |
US20100068884A1 (en) * | 2008-09-12 | 2010-03-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of etching a layer of a semiconductor device using an etchant layer |
US20100327364A1 (en) * | 2009-06-29 | 2010-12-30 | Toshiba America Electronic Components, Inc. | Semiconductor device with metal gate |
US8252675B2 (en) | 2009-12-08 | 2012-08-28 | Samsung Electronics Co., Ltd. | Methods of forming CMOS transistors with high conductivity gate electrodes |
Families Citing this family (12)
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US20050053869A1 (en) * | 2003-09-08 | 2005-03-10 | Brask Justin K. | Methods and compositions for selectively etching metal films and structures |
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US9041125B2 (en) | 2013-03-11 | 2015-05-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Fin shape for fin field-effect transistors and method of forming |
US10090247B1 (en) | 2017-05-03 | 2018-10-02 | International Business Machines Corporation | Semiconductor device formed by wet etch removal of Ru selective to other metals |
US10679934B2 (en) | 2017-12-01 | 2020-06-09 | International Business Machines Corporation | Capacitance reduction in sea of lines BEOL metallization |
Citations (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5466389A (en) * | 1994-04-20 | 1995-11-14 | J. T. Baker Inc. | PH adjusted nonionic surfactant-containing alkaline cleaner composition for cleaning microelectronics substrates |
US5625217A (en) | 1992-12-11 | 1997-04-29 | Intel Corporation | MOS transistor having a composite gate electrode and method of fabrication |
US5753560A (en) | 1996-10-31 | 1998-05-19 | Motorola, Inc. | Method for fabricating a semiconductor device using lateral gettering |
US5891798A (en) | 1996-12-20 | 1999-04-06 | Intel Corporation | Method for forming a High dielectric constant insulator in the fabrication of an integrated circuit |
US5972123A (en) * | 1997-06-13 | 1999-10-26 | Cfmt, Inc. | Methods for treating semiconductor wafers |
US6015505A (en) * | 1997-10-30 | 2000-01-18 | International Business Machines Corporation | Process improvements for titanium-tungsten etching in the presence of electroplated C4's |
US6063698A (en) | 1997-06-30 | 2000-05-16 | Motorola, Inc. | Method for manufacturing a high dielectric constant gate oxide for use in semiconductor integrated circuits |
US6087261A (en) | 1997-09-30 | 2000-07-11 | Fujitsu Limited | Method for production of semiconductor device |
US6121094A (en) | 1998-07-21 | 2000-09-19 | Advanced Micro Devices, Inc. | Method of making a semiconductor device with a multi-level gate structure |
US6184072B1 (en) | 2000-05-17 | 2001-02-06 | Motorola, Inc. | Process for forming a high-K gate dielectric |
US6358788B1 (en) * | 1999-08-30 | 2002-03-19 | Micron Technology, Inc. | Method of fabricating a wordline in a memory array of a semiconductor device |
US6391802B1 (en) | 1999-08-31 | 2002-05-21 | Stmicroelectronics, S.A. | Method of manufacturing an integrated capacitor onto a silicon substrate |
US6420279B1 (en) | 2001-06-28 | 2002-07-16 | Sharp Laboratories Of America, Inc. | Methods of using atomic layer deposition to deposit a high dielectric constant material on a substrate |
US6436777B1 (en) | 2000-10-19 | 2002-08-20 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and manufacturing method thereof |
US6475874B2 (en) | 2000-12-07 | 2002-11-05 | Advanced Micro Devices, Inc. | Damascene NiSi metal gate high-k transistor |
US20020197790A1 (en) | 1997-12-22 | 2002-12-26 | Kizilyalli Isik C. | Method of making a compound, high-K, gate and capacitor insulator layer |
US6514828B2 (en) | 2001-04-20 | 2003-02-04 | Micron Technology, Inc. | Method of fabricating a highly reliable gate oxide |
US20030032303A1 (en) | 2001-08-13 | 2003-02-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Ozone-enhanced oxidation for high-k dielectric semiconductor devices |
US20030045080A1 (en) | 2001-08-31 | 2003-03-06 | Visokay Mark R. | Gate structure and method |
US6544906B2 (en) | 2000-12-21 | 2003-04-08 | Texas Instruments Incorporated | Annealing of high-k dielectric materials |
US6565763B1 (en) * | 1999-06-07 | 2003-05-20 | Kabushiki Kaisha Toshiba | Method for manufacturing porous structure and method for forming pattern |
US6617210B1 (en) | 2002-05-31 | 2003-09-09 | Intel Corporation | Method for making a semiconductor device having a high-k gate dielectric |
US6617209B1 (en) | 2002-02-22 | 2003-09-09 | Intel Corporation | Method for making a semiconductor device having a high-k gate dielectric |
US6642131B2 (en) | 2001-06-21 | 2003-11-04 | Matsushita Electric Industrial Co., Ltd. | Method of forming a silicon-containing metal-oxide gate dielectric by depositing a high dielectric constant film on a silicon substrate and diffusing silicon from the substrate into the high dielectric constant film |
US6667246B2 (en) | 2001-12-04 | 2003-12-23 | Matsushita Electric Industrial Co., Ltd. | Wet-etching method and method for manufacturing semiconductor device |
US6727188B2 (en) * | 2000-11-01 | 2004-04-27 | Lg.Philips Lcd Co., Ltd. | Etchant and method for fabricating a substrate for an electronic device using the same wherein the substrate includes a copper or copper alloy film |
US6770564B1 (en) * | 1998-07-29 | 2004-08-03 | Denso Corporation | Method of etching metallic thin film on thin film resistor |
US6794234B2 (en) | 2002-01-30 | 2004-09-21 | The Regents Of The University Of California | Dual work function CMOS gate technology based on metal interdiffusion |
US20040191974A1 (en) * | 2003-03-27 | 2004-09-30 | Gilmer David C. | Method for fabricating dual-metal gate device |
US6902969B2 (en) * | 2003-07-31 | 2005-06-07 | Freescale Semiconductor, Inc. | Process for forming dual metal gate structures |
-
2003
- 2003-11-06 US US10/704,498 patent/US7129182B2/en not_active Expired - Fee Related
Patent Citations (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5625217A (en) | 1992-12-11 | 1997-04-29 | Intel Corporation | MOS transistor having a composite gate electrode and method of fabrication |
US5783478A (en) | 1992-12-11 | 1998-07-21 | Intel Corporation | Method of frabricating a MOS transistor having a composite gate electrode |
US5466389A (en) * | 1994-04-20 | 1995-11-14 | J. T. Baker Inc. | PH adjusted nonionic surfactant-containing alkaline cleaner composition for cleaning microelectronics substrates |
US5753560A (en) | 1996-10-31 | 1998-05-19 | Motorola, Inc. | Method for fabricating a semiconductor device using lateral gettering |
US6306742B1 (en) | 1996-12-20 | 2001-10-23 | Intel Corporation | Method for forming a high dielectric constant insulator in the fabrication of an integrated circuit |
US5891798A (en) | 1996-12-20 | 1999-04-06 | Intel Corporation | Method for forming a High dielectric constant insulator in the fabrication of an integrated circuit |
US5972123A (en) * | 1997-06-13 | 1999-10-26 | Cfmt, Inc. | Methods for treating semiconductor wafers |
US6063698A (en) | 1997-06-30 | 2000-05-16 | Motorola, Inc. | Method for manufacturing a high dielectric constant gate oxide for use in semiconductor integrated circuits |
US6087261A (en) | 1997-09-30 | 2000-07-11 | Fujitsu Limited | Method for production of semiconductor device |
US6015505A (en) * | 1997-10-30 | 2000-01-18 | International Business Machines Corporation | Process improvements for titanium-tungsten etching in the presence of electroplated C4's |
US20020197790A1 (en) | 1997-12-22 | 2002-12-26 | Kizilyalli Isik C. | Method of making a compound, high-K, gate and capacitor insulator layer |
US6121094A (en) | 1998-07-21 | 2000-09-19 | Advanced Micro Devices, Inc. | Method of making a semiconductor device with a multi-level gate structure |
US6809034B2 (en) * | 1998-07-29 | 2004-10-26 | Denso Corporation | Method of etching metallic thin film on thin film resistor |
US6770564B1 (en) * | 1998-07-29 | 2004-08-03 | Denso Corporation | Method of etching metallic thin film on thin film resistor |
US6565763B1 (en) * | 1999-06-07 | 2003-05-20 | Kabushiki Kaisha Toshiba | Method for manufacturing porous structure and method for forming pattern |
US6358788B1 (en) * | 1999-08-30 | 2002-03-19 | Micron Technology, Inc. | Method of fabricating a wordline in a memory array of a semiconductor device |
US6391802B1 (en) | 1999-08-31 | 2002-05-21 | Stmicroelectronics, S.A. | Method of manufacturing an integrated capacitor onto a silicon substrate |
US6184072B1 (en) | 2000-05-17 | 2001-02-06 | Motorola, Inc. | Process for forming a high-K gate dielectric |
US6436777B1 (en) | 2000-10-19 | 2002-08-20 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and manufacturing method thereof |
US6727188B2 (en) * | 2000-11-01 | 2004-04-27 | Lg.Philips Lcd Co., Ltd. | Etchant and method for fabricating a substrate for an electronic device using the same wherein the substrate includes a copper or copper alloy film |
US6475874B2 (en) | 2000-12-07 | 2002-11-05 | Advanced Micro Devices, Inc. | Damascene NiSi metal gate high-k transistor |
US6544906B2 (en) | 2000-12-21 | 2003-04-08 | Texas Instruments Incorporated | Annealing of high-k dielectric materials |
US6514828B2 (en) | 2001-04-20 | 2003-02-04 | Micron Technology, Inc. | Method of fabricating a highly reliable gate oxide |
US6642131B2 (en) | 2001-06-21 | 2003-11-04 | Matsushita Electric Industrial Co., Ltd. | Method of forming a silicon-containing metal-oxide gate dielectric by depositing a high dielectric constant film on a silicon substrate and diffusing silicon from the substrate into the high dielectric constant film |
US6420279B1 (en) | 2001-06-28 | 2002-07-16 | Sharp Laboratories Of America, Inc. | Methods of using atomic layer deposition to deposit a high dielectric constant material on a substrate |
US20030032303A1 (en) | 2001-08-13 | 2003-02-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Ozone-enhanced oxidation for high-k dielectric semiconductor devices |
US20030045080A1 (en) | 2001-08-31 | 2003-03-06 | Visokay Mark R. | Gate structure and method |
US6667246B2 (en) | 2001-12-04 | 2003-12-23 | Matsushita Electric Industrial Co., Ltd. | Wet-etching method and method for manufacturing semiconductor device |
US6794234B2 (en) | 2002-01-30 | 2004-09-21 | The Regents Of The University Of California | Dual work function CMOS gate technology based on metal interdiffusion |
US6617209B1 (en) | 2002-02-22 | 2003-09-09 | Intel Corporation | Method for making a semiconductor device having a high-k gate dielectric |
US6617210B1 (en) | 2002-05-31 | 2003-09-09 | Intel Corporation | Method for making a semiconductor device having a high-k gate dielectric |
US20040191974A1 (en) * | 2003-03-27 | 2004-09-30 | Gilmer David C. | Method for fabricating dual-metal gate device |
US6902969B2 (en) * | 2003-07-31 | 2005-06-07 | Freescale Semiconductor, Inc. | Process for forming dual metal gate structures |
Non-Patent Citations (16)
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7667278B2 (en) * | 2003-11-28 | 2010-02-23 | International Business Machines Corporation | Metal carbide gate structure and method of fabrication |
US20060186490A1 (en) * | 2003-11-28 | 2006-08-24 | International Business Machines Corporation | Metal carbide gate structure and method of fabrication |
US20080135952A1 (en) * | 2004-04-20 | 2008-06-12 | Brask Justin K | Method for making a semiconductor device having a high-k dielectric layer and a metal gate electrode |
US7671471B2 (en) | 2004-04-20 | 2010-03-02 | Intel Corporation | Method for making a semiconductor device having a high-k dielectric layer and a metal gate electrode |
US20070178637A1 (en) * | 2006-01-31 | 2007-08-02 | Samsung Electronics Co., Ltd. | Method of fabricating gate of semiconductor device using oxygen-free ashing process |
US20070218642A1 (en) * | 2006-03-17 | 2007-09-20 | United Monolithic Semiconductors Gmbh | Method for producing a semiconductor component having a metallic control electrode, and semiconductor component |
US7573122B2 (en) * | 2006-03-17 | 2009-08-11 | United Monolithic Semiconductors Gmbh | Method for producing a semiconductor component having a metallic control electrode, and semiconductor component |
US20080135944A1 (en) * | 2006-12-06 | 2008-06-12 | Reika Ichihara | Semiconductor device |
US7608896B2 (en) * | 2006-12-06 | 2009-10-27 | Kabushiki Kaisha Toshiba | Semiconductor device |
US8263452B2 (en) | 2006-12-06 | 2012-09-11 | Kabushiki Kaisha Toshiba | Semiconductor device |
US20090206406A1 (en) * | 2008-02-15 | 2009-08-20 | Willy Rachmady | Multi-gate device having a t-shaped gate structure |
US8264048B2 (en) | 2008-02-15 | 2012-09-11 | Intel Corporation | Multi-gate device having a T-shaped gate structure |
US20100052066A1 (en) * | 2008-08-26 | 2010-03-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | structure and method for a cmos device with doped conducting metal oxide as the gate electrode |
US7947588B2 (en) * | 2008-08-26 | 2011-05-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Structure and method for a CMOS device with doped conducting metal oxide as the gate electrode |
US20100068884A1 (en) * | 2008-09-12 | 2010-03-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of etching a layer of a semiconductor device using an etchant layer |
US8153523B2 (en) * | 2008-09-12 | 2012-04-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of etching a layer of a semiconductor device using an etchant layer |
TWI413175B (en) * | 2008-09-12 | 2013-10-21 | Taiwan Semiconductor Mfg | Method of etching a layer of a semiconductor device using an etchant layer |
US20100327364A1 (en) * | 2009-06-29 | 2010-12-30 | Toshiba America Electronic Components, Inc. | Semiconductor device with metal gate |
US8252675B2 (en) | 2009-12-08 | 2012-08-28 | Samsung Electronics Co., Ltd. | Methods of forming CMOS transistors with high conductivity gate electrodes |
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