US20220384376A1 - Package structure of semiconductor device with improved bonding between the substrates - Google Patents
Package structure of semiconductor device with improved bonding between the substrates Download PDFInfo
- Publication number
- US20220384376A1 US20220384376A1 US17/880,691 US202217880691A US2022384376A1 US 20220384376 A1 US20220384376 A1 US 20220384376A1 US 202217880691 A US202217880691 A US 202217880691A US 2022384376 A1 US2022384376 A1 US 2022384376A1
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- Prior art keywords
- bonding
- bonding pad
- pad pattern
- pads
- bonding pads
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- 239000000758 substrate Substances 0.000 title claims abstract description 59
- 239000004065 semiconductor Substances 0.000 title claims abstract description 26
- 238000009826 distribution Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 description 9
- 239000003989 dielectric material Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000926 separation method Methods 0.000 description 4
- 238000000137 annealing Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/07—Structure, shape, material or disposition of the bonding areas after the connecting process
- H01L24/08—Structure, shape, material or disposition of the bonding areas after the connecting process of an individual bonding area
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3512—Cracking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3512—Cracking
- H01L2924/35121—Peeling or delaminating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/38—Effects and problems related to the device integration
- H01L2924/381—Pitch distance
Definitions
- the disclosure relates to a semiconductor manufacturing technique, and more particularly, to a package structure of a semiconductor device.
- an integrated circuit can be manufactured on one substrate.
- the functions of the integrated circuit have been developed towards more complex designs in response to the overall development demands for electronic products.
- the number of components and interconnect structures included in an integrated circuit has thus increased significantly.
- the integrated circuit may be divided into two parts which are respectively manufactured on the corresponding substrates.
- a bonding layer is formed at the upper layer of the substrate.
- the bonding layer includes a dielectric layer, and a plurality of bonding pads are disposed in the dielectric layer.
- the bonding pad is connected to a circuit formed on the substrate to bond to a circuit on another substrate.
- the positions of a plurality of bonding pads of the bonding layers of the two substrates are the same.
- the two substrates face each other, and through bonding of the bonding layers, the whole integrated circuit can be formed.
- the bonding strength between the two substrates is insufficient, when the circuit is subsequently cut into a single die, the bonding pads may have poor contact or even separate due to the insufficient bonding strength, which may cause manufacturing failure of the integrated circuit and lower the yield. Therefore, the bonding strength between the two substrates needs to be enhanced to at least reduce damage to the circuit in the subsequent die cutting process.
- the invention provides a layout of a bonding pad pattern on a substrate, which can improve the bonding of bonding layers and reduce the phenomenon of separation of the bonding layers between two substrates.
- the invention provides a package structure of a semiconductor device, including a first substrate, a second substrate, and a bonding layer.
- the bonding layer bonds the first substrate and the second substrate.
- the bonding layer includes an inner bonding pad pattern and an outer bonding pad pattern formed in a dielectric layer, and the outer bonding pad pattern surrounds the inner bonding pad pattern.
- the outer bonding pad pattern includes first bonding pads
- the inner bonding pad pattern includes second bonding pads
- a density of the first bonding pads of the outer bonding pad pattern is greater than a density of the second bonding pads of the inner bonding pad pattern.
- the first bonding pads of the outer bonding pad pattern is distributed to form a plurality of pad rings surrounding the inner bonding pad pattern, and the first bonding pads of the plurality of pad rings are aligned in a horizontal direction or a vertical direction.
- the package structure of a semiconductor device there is a first distance between two adjacent first bonding pads in the outer bonding pad pattern at the first bonding pad density, there is a second distance between two adjacent second bonding pads in the inner bonding pad pattern at the second bonding pad density, and the first distance is smaller than the second distance.
- the first substrate includes a first bonding layer
- the second substrate includes a second bonding layer
- the first bonding layer and the second bonding layer are bonded together to form the bonding layer
- the outer bonding pad pattern is a dummy pattern
- the inner bonding pad pattern is connected between a circuit in the first substrate and a circuit in the second substrate.
- the second bonding pads of the inner bonding pad pattern are uniformly distributed in a square region, a rectangular region, or a circular region.
- the outer bonding pad pattern is a right-angle quadrilateral, and each side of the right-angle quadrilateral includes a plurality of bonding pad rows along the side.
- a distribution of the first bonding pads in each of the bonding pad rows is the same.
- the first bonding pads of the outer bonding pad pattern are distributed to form at least two pad rings.
- a pad distribution of an inner ring of the at least two pad rings includes discontinuous regions at corners of the right-angle quadrilateral.
- the first bonding pads of the at least two pad rings are distributed to form at least two bonding pad rows on each side of the right-angle quadrilateral, and a length of each of the at least two bonding pad rows is equal to a length of the corresponding side.
- a geometric shape of the first bonding pads comprises circle, square, rectangle, hexagon, or polygon
- a geometric shape of the second bonding pads comprises circle, square, rectangle, hexagon, or polygon
- FIG. 1 A to FIG. 1 C are schematic views showing a mechanism of bonding two substrates.
- FIG. 2 is a schematic view showing a bonding pad pattern on a substrate.
- FIG. 3 to FIG. 6 are schematic views showing bonding pad patterns on a substrate according to multiple embodiments of the invention.
- FIG. 7 is a schematic view showing inspection of a bonding quality of bonding layers according to multiple embodiments of the invention.
- the invention relates to a semiconductor packaging technique.
- the invention can improve the bonding degree of a bonding layer between two substrates.
- the invention can reduce, for example, the phenomenon of separation of the bonding layer between two substrates when cutting a die.
- dielectric-to-dielectric bonding technique There are various bonding techniques available for bonding between substrates, e.g., a dielectric-to-dielectric bonding technique.
- the mechanism of dielectric-to-dielectric bonding involves performing bonding at a relatively low temperature or causing chemical reaction, between one dielectric layer and another dielectric layer to bond the dielectric materials.
- the bonding pads between the dielectric layers are in contact to achieve electrical connection.
- an annealing process at a higher temperature is performed to enhance the bonding strength, and the bonding degree between the bonding pads will further achieve excellent bonding.
- FIG. 1 A to FIG. 1 C are schematic views showing a mechanism of bonding two substrates.
- predetermined circuit structures are completed respectively in two substrates 50 and 50 A.
- interconnect layers 52 and 52 A may be formed respectively at the upper ends of the substrates 50 and 50 A and may also be, for example, redistribution layers (RDL) which can more uniformly redistribute the connection endpoints.
- RDL redistribution layers
- the endpoints to be electrically connected between the two interconnect layers 52 and 52 A are disposed at the same position, so that the two circuits on the two substrates 50 and 50 A are connected into a whole circuit.
- a plurality of bonding pads 56 and 56 A corresponding to the endpoints to be connected are formed through bonding layers 54 and 54 A.
- the material of the bonding layers 54 and 54 A includes a dielectric layer, and the plurality of bonding pads 56 and 56 A are respectively formed in the same pattern in the bonding layers 54 and 54 A of the two substrates 50 and 50 A.
- the bonding pads 56 and 56 A are, for example, copper, a selected metal, or a conductive material.
- the bonding pads 56 and 56 A of the invention are not limited to specific materials.
- the circuit structures on the two substrates 50 and 50 A are manufactured separately.
- the bonding layers 54 and 54 A of the two substrate 50 and 50 A are aligned with each other, and then the first-stage dielectric material bonding is performed, for example, by causing a chemical reaction between the dielectric materials at a relatively low temperature to bond the dielectric materials.
- the corresponding bonding pads 56 and 56 A which belong to the two substrates 50 and 50 A will be in contact and connected.
- the dielectric material is generally, for example, silicon oxide but is not limited thereto.
- the dielectric material may also be, for example, silicon oxynitride, silicon nitride, or a similar material.
- annealing at a higher temperature is performed to obtain a bonding layer 54 B.
- the effect of annealing further enhances the bonding strength between the dielectric materials and also promotes better bonding of the bonding pads 56 and 56 A.
- FIG. 2 is a schematic view showing a bonding pad pattern on a substrate.
- the density of the plurality of bonding pads 56 in the bonding layer 54 is still relatively low (sparse distribution) even after the re-layout through the interconnect layer 52 . This is because the number of endpoints to be actually connected between the two circuits is not large.
- one endpoint may be configured with a plurality of bonding pads 56 , but the density is still relatively low, which may cause the bonding strength between the two substrates to be insufficient and result in separation of the two substrates when cutting the die.
- the invention at least looks into the issue of the bonding pads 56 in the bonding layer 54 and proposes a layout for the bonding pads in the bonding layer 54 .
- FIG. 3 to FIG. 6 are schematic views showing bonding pad patterns on a substrate according to multiple embodiments of the invention.
- the bonding layer 54 of the substrate 50 will be taken as an example to describe the layout of the bonding pad pattern.
- the bonding pad pattern of the bonding layer 54 A on the substrate 50 A is the same as the bonding pad pattern of the bonding layer 54 on the substrate 50 , and they are bonded, for example, through the bonding process of FIG. 1 A to FIG. 1 C to achieve the overall connection of the two circuits.
- the bonding layer 54 includes an inner region 60 and an outer region 62 .
- the outer region 62 surrounds the inner region 60 .
- the geometry of the inner region 60 is, for example, a rectangle or a square but is not limited thereto.
- the geometry of the inner region 60 may also be a circle or other shapes. A rectangle or a square will be taken as an example in the description below.
- a plurality of bonding pads 56 are disposed in the inner region 60 , and they are uniformly distributed to form an inner bonding pad pattern 57 .
- a plurality of bonding pads 58 a and 58 b are disposed in the outer region 62 to form an outer bonding pad pattern 58 .
- the bonding layer 54 includes a dielectric layer which surrounds the inner bonding pads 56 and the outer bonding pads 58 a and 58 b .
- the inner bonding pad pattern 57 is configured for actual bonding of circuits.
- the outer bonding pad pattern 58 is formed of dummy bonding pads 58 a and 58 b located in the outer region 62 of the bonding layer 54 and may enhance the bonding strength after bonding.
- the external force of cutting will be applied along a scribe line, and the edge of the bonding layer 54 will be subjected to the cutting force and is likely to be damaged.
- the dummy outer bonding pad pattern 58 may withstand the cutting force. Accordingly, the bonding pad density of the outer bonding pad pattern 58 should be greater than the bonding pad density of the inner bonding pad pattern 57 .
- the bonding pad pattern 58 there is a distance d 2 between two adjacent bonding pads in the outer bonding pad pattern 58 at a predetermined first bonding pad density. There is a distance d 1 between two adjacent bonding pads in the inner bonding pad pattern 57 at a predetermined second bonding pad density. The high-density distance d 2 is smaller than the low-density distance d 1 . Because the bonding pads 58 a and 58 b of the outer bonding pad pattern 58 have a large bonding pad density, their mechanical strength and bonding strength are larger, and they can withstand the external cutting force, so that the two bonding layers 54 and 54 A are less likely to be separated.
- the distribution of the plurality of bonding pads 56 of the inner bonding pad pattern 57 may be laid out according to the actual requirements of circuit bonding.
- the plurality of bonding pads 58 a and 58 b of the outer bonding pad pattern 58 are laid out at a greater density.
- the plurality of bonding pads 58 a and 58 b of the outer bonding pad pattern 58 are, for example, two pad rings.
- the bonding pads 58 a form an inner pad ring
- the bonding pads 58 b form an outer pad ring.
- the inner pad ring or outer pad ring formed of the bonding pads may be continuous or may also include discontinuous local regions.
- the inner pad ring may have discontinuous local regions at the corners.
- the bonding pads 58 a of the inner pad ring and the bonding pads 58 b of the outer pad ring may be laid out to be alternately shifted.
- a vertical direction e.g., a direction of the wide side of the rectangle
- the bonding pads 58 a and the bonding pads 58 b are left-right staggered.
- a horizontal direction e.g., a direction of the long side of the rectangle
- the bonding pads 58 a and the bonding pads 58 b are up-down staggered.
- the bonding pads 58 a of the inner pad ring can block the stress passed between the bonding pads 58 b of the outer pad ring.
- the plurality of bonding pads 58 a and 58 b of the outer bonding pad pattern 58 do not need to be aligned with the extending direction of the plurality of bonding pads 56 of the inner bonding pad pattern 57 .
- the invention is not limited to the layout of the plurality of bonding pads 58 a and 58 b of the outer bonding pad pattern 58 in FIG. 3 .
- the bonding pads 58 a of the inner pad ring and the bonding pads 58 b of the outer pad ring formed of the plurality of bonding pads 58 a and 58 b of the outer bonding pad pattern 58 may also be aligned with each other.
- a plurality of rows of bonding pads 58 a and 58 b may be stacked.
- two rows of bonding pads 58 a and 58 b may be stacked.
- the layout of the bonding pads 58 a and 58 b of FIG. 4 is only an example provided for illustration.
- the bonding pads 58 a and 58 b at the corners may not be provided.
- the geometry of the bonding pads 58 a and 58 b may be, for example, a rectangle, a polygon, or a circle and is not limited to a square.
- the geometry of the bonding pads 58 a and 58 b is a circle.
- the geometry of the bonding pads 58 a and 58 b is a hexagon.
- the plurality of bonding pads of the outer bonding pad pattern 58 may also be laid out to be, for example, a single pad ring, which can similarly enhance the bonding strength at the periphery, and the invention is not limited to the layout of two pad rings in FIG. 3 and FIG. 4 .
- the plurality of bonding pads of the outer bonding pad pattern 58 may also be laid out to be, for example, multiple pad rings such as three rings, and the invention is not limited to the layout of two rings of FIG. 3 and FIG. 4 .
- the bonding pads 58 a , 58 b , and 58 c of the three pad rings further include a pad ring of the bonding pad 58 c based on the layout of the two pad rings shown in FIG. 3 or FIG. 4 .
- the layout of the bonding pads of the outer bonding pad pattern 58 may be changed according to the actual requirements, and a greater bonding pad density can enhance the mechanical strength and bonding strength in the peripheral region and reduce the separation of the two substrates during cutting.
- FIG. 7 is a schematic view showing inspection of a bonding quality of bonding layers according to multiple embodiments of the invention.
- the bonding strength between the two bonding layers 54 and 54 A of the bonding layer 54 B is tested.
- a knife tool 64 is used to change the applied external force, and the magnitude of the applied force for peeling the two bonding layers 54 and 54 A is observed to determine the magnitude of the bonding strength.
- the stress for causing peeling also increases, at an increase rate greater than the linear one-order increase rate.
- the arrangement of the outer bonding pad pattern 58 of the invention can effectively prevent peeling of the two bonding layers 54 and 54 A.
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
A package structure of a semiconductor device includes a first substrate, a second substrate, and a bonding layer. The bonding layer bonds the first substrate and the second substrate. The bonding layer includes an inner bonding pad pattern and an outer bonding pad pattern formed in a dielectric layer. The outer bonding pad pattern surrounds the inner bonding pad pattern. The outer bonding pad pattern includes first bonding pads, the inner bonding pad pattern includes second bonding pads, a density of the first bonding pads is greater than that of the second bonding pads. The first bonding pads of the outer bonding pad pattern is distributed to form a plurality of pad rings surrounding the inner bonding pad pattern, and the first bonding pads of the plurality of pad rings are aligned in a horizontal direction or a vertical direction.
Description
- This application is a continuation application of and claims the priority benefit of U.S. patent application Ser. No. 16/781,937, filed on Feb. 4, 2020, now allowed, which claims the priority benefit of Taiwan patent application serial no. 108148392, filed on Dec. 30, 2019. The entirety of each of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of this specification.
- The disclosure relates to a semiconductor manufacturing technique, and more particularly, to a package structure of a semiconductor device.
- Through semiconductor manufacturing technology, an integrated circuit can be manufactured on one substrate. The functions of the integrated circuit have been developed towards more complex designs in response to the overall development demands for electronic products. The number of components and interconnect structures included in an integrated circuit has thus increased significantly. There is a limit to the area of a substrate on which components can be formed and manufactured. Due to the large number of components involved for enhancing the function of the integrated circuit, the manufacturing of the integrated circuit, for example, has been developed towards stacking in the vertical direction of the substrate to form more components and circuits.
- In further manufacturing and development, the integrated circuit may be divided into two parts which are respectively manufactured on the corresponding substrates. A bonding layer is formed at the upper layer of the substrate. The bonding layer includes a dielectric layer, and a plurality of bonding pads are disposed in the dielectric layer. The bonding pad is connected to a circuit formed on the substrate to bond to a circuit on another substrate. The positions of a plurality of bonding pads of the bonding layers of the two substrates are the same. In the subsequent packaging process, the two substrates face each other, and through bonding of the bonding layers, the whole integrated circuit can be formed.
- In the above packaging process, if the bonding strength between the two substrates is insufficient, when the circuit is subsequently cut into a single die, the bonding pads may have poor contact or even separate due to the insufficient bonding strength, which may cause manufacturing failure of the integrated circuit and lower the yield. Therefore, the bonding strength between the two substrates needs to be enhanced to at least reduce damage to the circuit in the subsequent die cutting process.
- The invention provides a layout of a bonding pad pattern on a substrate, which can improve the bonding of bonding layers and reduce the phenomenon of separation of the bonding layers between two substrates.
- In an embodiment, the invention provides a package structure of a semiconductor device, including a first substrate, a second substrate, and a bonding layer. The bonding layer bonds the first substrate and the second substrate. The bonding layer includes an inner bonding pad pattern and an outer bonding pad pattern formed in a dielectric layer, and the outer bonding pad pattern surrounds the inner bonding pad pattern. The outer bonding pad pattern includes first bonding pads, the inner bonding pad pattern includes second bonding pads, a density of the first bonding pads of the outer bonding pad pattern is greater than a density of the second bonding pads of the inner bonding pad pattern. The first bonding pads of the outer bonding pad pattern is distributed to form a plurality of pad rings surrounding the inner bonding pad pattern, and the first bonding pads of the plurality of pad rings are aligned in a horizontal direction or a vertical direction.
- In an embodiment, in the package structure of a semiconductor device, there is a first distance between two adjacent first bonding pads in the outer bonding pad pattern at the first bonding pad density, there is a second distance between two adjacent second bonding pads in the inner bonding pad pattern at the second bonding pad density, and the first distance is smaller than the second distance.
- In an embodiment, in the package structure of a semiconductor device, the first substrate includes a first bonding layer, the second substrate includes a second bonding layer, and the first bonding layer and the second bonding layer are bonded together to form the bonding layer.
- In an embodiment, in the package structure of a semiconductor device, the outer bonding pad pattern is a dummy pattern, and the inner bonding pad pattern is connected between a circuit in the first substrate and a circuit in the second substrate.
- In an embodiment, in the package structure of a semiconductor device, the second bonding pads of the inner bonding pad pattern are uniformly distributed in a square region, a rectangular region, or a circular region.
- In an embodiment, in the package structure of a semiconductor device, the outer bonding pad pattern is a right-angle quadrilateral, and each side of the right-angle quadrilateral includes a plurality of bonding pad rows along the side.
- In an embodiment, in the package structure of a semiconductor device, a distribution of the first bonding pads in each of the bonding pad rows is the same.
- In an embodiment, in the package structure of a semiconductor device, the first bonding pads of the outer bonding pad pattern are distributed to form at least two pad rings. A pad distribution of an inner ring of the at least two pad rings includes discontinuous regions at corners of the right-angle quadrilateral.
- In an embodiment, in the package structure of a semiconductor device, the first bonding pads of the at least two pad rings are distributed to form at least two bonding pad rows on each side of the right-angle quadrilateral, and a length of each of the at least two bonding pad rows is equal to a length of the corresponding side.
- In an embodiment, in the package structure of a semiconductor device, a geometric shape of the first bonding pads comprises circle, square, rectangle, hexagon, or polygon, and a geometric shape of the second bonding pads comprises circle, square, rectangle, hexagon, or polygon.
- The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and together with the description serve to explain the principles of the invention.
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FIG. 1A toFIG. 1C are schematic views showing a mechanism of bonding two substrates. -
FIG. 2 is a schematic view showing a bonding pad pattern on a substrate. -
FIG. 3 toFIG. 6 are schematic views showing bonding pad patterns on a substrate according to multiple embodiments of the invention. -
FIG. 7 is a schematic view showing inspection of a bonding quality of bonding layers according to multiple embodiments of the invention. - The invention relates to a semiconductor packaging technique. By planning the bonding pad pattern on the substrate, the invention can improve the bonding degree of a bonding layer between two substrates. The invention can reduce, for example, the phenomenon of separation of the bonding layer between two substrates when cutting a die.
- Some embodiments will be described below to illustrate the invention, but the invention is not limited to the multiple embodiments provided. It is also possible that the multiple embodiments provided can be combined with each other.
- There are various bonding techniques available for bonding between substrates, e.g., a dielectric-to-dielectric bonding technique. The mechanism of dielectric-to-dielectric bonding involves performing bonding at a relatively low temperature or causing chemical reaction, between one dielectric layer and another dielectric layer to bond the dielectric materials. The bonding pads between the dielectric layers are in contact to achieve electrical connection. Afterwards, an annealing process at a higher temperature is performed to enhance the bonding strength, and the bonding degree between the bonding pads will further achieve excellent bonding.
-
FIG. 1A toFIG. 1C are schematic views showing a mechanism of bonding two substrates. Referring toFIG. 1A , predetermined circuit structures are completed respectively in twosubstrates interconnect layers substrates interconnect layers substrates bonding pads bonding layers bonding pads substrates bonding pads bonding pads substrates - Referring to
FIG. 1B , the bonding layers 54 and 54A of the twosubstrate corresponding bonding pads substrates - Referring to
FIG. 1C , after the bonding layers 54 and 54A of the twosubstrates bonding layer 54B. The effect of annealing further enhances the bonding strength between the dielectric materials and also promotes better bonding of thebonding pads -
FIG. 2 is a schematic view showing a bonding pad pattern on a substrate. Taking the bonding layer on thesubstrate 50 as an example, it is observed herein that the density of the plurality ofbonding pads 56 in thebonding layer 54 is still relatively low (sparse distribution) even after the re-layout through theinterconnect layer 52. This is because the number of endpoints to be actually connected between the two circuits is not large. Here, one endpoint may be configured with a plurality ofbonding pads 56, but the density is still relatively low, which may cause the bonding strength between the two substrates to be insufficient and result in separation of the two substrates when cutting the die. The invention at least looks into the issue of thebonding pads 56 in thebonding layer 54 and proposes a layout for the bonding pads in thebonding layer 54. -
FIG. 3 toFIG. 6 are schematic views showing bonding pad patterns on a substrate according to multiple embodiments of the invention. - Referring to
FIG. 3 , thebonding layer 54 of thesubstrate 50 will be taken as an example to describe the layout of the bonding pad pattern. The bonding pad pattern of thebonding layer 54A on thesubstrate 50A is the same as the bonding pad pattern of thebonding layer 54 on thesubstrate 50, and they are bonded, for example, through the bonding process ofFIG. 1A toFIG. 1C to achieve the overall connection of the two circuits. - In an embodiment, the
bonding layer 54 includes aninner region 60 and anouter region 62. Theouter region 62 surrounds theinner region 60. The geometry of theinner region 60 is, for example, a rectangle or a square but is not limited thereto. The geometry of theinner region 60 may also be a circle or other shapes. A rectangle or a square will be taken as an example in the description below. - A plurality of
bonding pads 56 are disposed in theinner region 60, and they are uniformly distributed to form an innerbonding pad pattern 57. A plurality ofbonding pads outer region 62 to form an outerbonding pad pattern 58. Thebonding layer 54 includes a dielectric layer which surrounds theinner bonding pads 56 and theouter bonding pads bonding pad pattern 57 is configured for actual bonding of circuits. The outerbonding pad pattern 58 is formed ofdummy bonding pads outer region 62 of thebonding layer 54 and may enhance the bonding strength after bonding. - When cutting a die, the external force of cutting will be applied along a scribe line, and the edge of the
bonding layer 54 will be subjected to the cutting force and is likely to be damaged. The dummy outerbonding pad pattern 58 may withstand the cutting force. Accordingly, the bonding pad density of the outerbonding pad pattern 58 should be greater than the bonding pad density of the innerbonding pad pattern 57. - Regarding the magnitude of the bonding pad density, in an embodiment, there is a distance d2 between two adjacent bonding pads in the outer
bonding pad pattern 58 at a predetermined first bonding pad density. There is a distance d1 between two adjacent bonding pads in the innerbonding pad pattern 57 at a predetermined second bonding pad density. The high-density distance d2 is smaller than the low-density distance d1. Because thebonding pads bonding pad pattern 58 have a large bonding pad density, their mechanical strength and bonding strength are larger, and they can withstand the external cutting force, so that the twobonding layers - The distribution of the plurality of
bonding pads 56 of the innerbonding pad pattern 57 may be laid out according to the actual requirements of circuit bonding. The plurality ofbonding pads bonding pad pattern 58 are laid out at a greater density. In an embodiment, the plurality ofbonding pads bonding pad pattern 58 are, for example, two pad rings. Thebonding pads 58 a form an inner pad ring, and thebonding pads 58 b form an outer pad ring. Based on the geometry of theinner region 60, the inner pad ring or outer pad ring formed of the bonding pads may be continuous or may also include discontinuous local regions. For example, the inner pad ring may have discontinuous local regions at the corners. In addition, thebonding pads 58 a of the inner pad ring and thebonding pads 58 b of the outer pad ring may be laid out to be alternately shifted. In a vertical direction, e.g., a direction of the wide side of the rectangle, thebonding pads 58 a and thebonding pads 58 b are left-right staggered. Similarly, in a horizontal direction, e.g., a direction of the long side of the rectangle, thebonding pads 58 a and thebonding pads 58 b are up-down staggered. Accordingly, thebonding pads 58 a of the inner pad ring can block the stress passed between thebonding pads 58 b of the outer pad ring. In an embodiment, the plurality ofbonding pads bonding pad pattern 58 do not need to be aligned with the extending direction of the plurality ofbonding pads 56 of the innerbonding pad pattern 57. However, the invention is not limited to the layout of the plurality ofbonding pads bonding pad pattern 58 inFIG. 3 . - Referring to
FIG. 4 , in an embodiment, thebonding pads 58 a of the inner pad ring and thebonding pads 58 b of the outer pad ring formed of the plurality ofbonding pads bonding pad pattern 58 may also be aligned with each other. - In an embodiment, on the wide side and the long side of the rectangle, a plurality of rows of
bonding pads bonding pads bonding pads FIG. 4 is only an example provided for illustration. In an embodiment, thebonding pads bonding pads FIG. 4A , the geometry of thebonding pads FIG. 4B , the geometry of thebonding pads - In an embodiment, referring to
FIG. 5 , the plurality of bonding pads of the outerbonding pad pattern 58 may also be laid out to be, for example, a single pad ring, which can similarly enhance the bonding strength at the periphery, and the invention is not limited to the layout of two pad rings inFIG. 3 andFIG. 4 . - In an embodiment, referring to
FIG. 6 , the plurality of bonding pads of the outerbonding pad pattern 58 may also be laid out to be, for example, multiple pad rings such as three rings, and the invention is not limited to the layout of two rings ofFIG. 3 andFIG. 4 . Thebonding pads bonding pad 58 c based on the layout of the two pad rings shown inFIG. 3 orFIG. 4 . - In other words, the layout of the bonding pads of the outer
bonding pad pattern 58 may be changed according to the actual requirements, and a greater bonding pad density can enhance the mechanical strength and bonding strength in the peripheral region and reduce the separation of the two substrates during cutting. -
FIG. 7 is a schematic view showing inspection of a bonding quality of bonding layers according to multiple embodiments of the invention. Referring toFIG. 7 , herein, the bonding strength between the twobonding layers bonding layer 54B is tested. For example, aknife tool 64 is used to change the applied external force, and the magnitude of the applied force for peeling the twobonding layers bonding pad pattern 58 of the invention can effectively prevent peeling of the twobonding layers - Lastly, it is noted that the above embodiments are only provided to describe, rather than limit, the technical solutions of the invention. Although the invention has been described in detail with reference to the foregoing embodiments, one of ordinary skill in the art will understand that he or she can still modify the technical solutions described in the foregoing embodiments, or make equivalent replacements to some or all of the technical features. These modifications or replacements do not cause the nature of the corresponding technical solutions to depart from the scope of the technical solutions of the embodiments of the invention.
Claims (10)
1. A package structure of a semiconductor device, comprising:
a first substrate;
a second substrate; and
a bonding layer bonding the first substrate and the second substrate, wherein the bonding layer comprises an inner bonding pad pattern and an outer bonding pad pattern formed in a dielectric layer, and the outer bonding pad pattern surrounds the inner bonding pad pattern,
wherein the outer bonding pad pattern comprises first bonding pads, the inner bonding pad pattern comprises second bonding pads, a density of the first bonding pads of the outer bonding pad pattern is greater than a density of the second bonding pads of the inner bonding pad pattern,
the first bonding pads of the outer bonding pad pattern is distributed to form a plurality of pad rings surrounding the inner bonding pad pattern, and
the first bonding pads of the plurality of pad rings are aligned in a horizontal direction or a vertical direction.
2. The package structure of a semiconductor device according to claim 1 , wherein there is a first distance between two adjacent first bonding pads in the outer bonding pad pattern at the first bonding pad density, there is a second distance between two adjacent second bonding pads in the inner bonding pad pattern at the second bonding pad density, and the first distance is smaller than the second distance.
3. The package structure of a semiconductor device according to claim 1 , wherein the first substrate comprises a first bonding layer, the second substrate comprises a second bonding layer, and the first bonding layer and the second bonding layer are bonded together to form the bonding layer.
4. The package structure of a semiconductor device according to claim 1 , wherein the outer bonding pad pattern is a dummy pattern, and the inner bonding pad pattern is connected between a circuit in the first substrate and a circuit in the second substrate.
5. The package structure of a semiconductor device according to claim 1 , wherein the second bonding pads of the inner bonding pad pattern are uniformly distributed in a square region, a rectangular region, or a circular region.
6. The package structure of a semiconductor device according to claim 1 , wherein the outer bonding pad pattern is a right-angle quadrilateral, and each side of the right-angle quadrilateral comprises a plurality of bonding pad rows along the side.
7. The package structure of a semiconductor device according to claim 6 , wherein a distribution of the first bonding pads in each of the bonding pad rows is the same.
8. The package structure of a semiconductor device according to claim 6 , wherein the first bonding pads of the outer bonding pad pattern are distributed to form at least two pad rings, wherein a pad distribution of an inner ring of the at least two pad rings comprises discontinuous regions at corners of the right-angle quadrilateral.
9. The package structure of a semiconductor device according to claim 6 , wherein the first bonding pads of the at least two pad rings are distributed to form at least two bonding pad rows on each side of the right-angle quadrilateral, and a length of each of the at least two bonding pad rows is equal to a length of the corresponding side.
10. The package structure of a semiconductor device according to claim 1 , wherein a geometric shape of the first bonding pads comprises circle, square, rectangle, hexagon, or polygon, and a geometric shape of the second bonding pads comprises circle, square, rectangle, hexagon, or polygon.
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US17/880,691 US20220384376A1 (en) | 2019-12-30 | 2022-08-04 | Package structure of semiconductor device with improved bonding between the substrates |
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TW108148392 | 2019-12-30 | ||
TW108148392A TWI808292B (en) | 2019-12-30 | 2019-12-30 | Package structure of semiconductor device |
US16/781,937 US11450633B2 (en) | 2019-12-30 | 2020-02-04 | Package structure of semiconductor device with improved bonding between the substrates |
US17/880,691 US20220384376A1 (en) | 2019-12-30 | 2022-08-04 | Package structure of semiconductor device with improved bonding between the substrates |
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US16/781,937 Continuation US11450633B2 (en) | 2019-12-30 | 2020-02-04 | Package structure of semiconductor device with improved bonding between the substrates |
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KR20220033619A (en) * | 2020-09-08 | 2022-03-17 | 삼성전자주식회사 | Semiconductor package |
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US20190164914A1 (en) * | 2017-11-30 | 2019-05-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Seal Ring for Hybrid-Bond |
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US7915744B2 (en) * | 2005-04-18 | 2011-03-29 | Mediatek Inc. | Bond pad structures and semiconductor devices using the same |
US7446398B2 (en) * | 2006-08-01 | 2008-11-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Bump pattern design for flip chip semiconductor package |
US9099318B2 (en) * | 2010-10-15 | 2015-08-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor chip having different pad width to UBM width ratios and method of manufacturing the same |
US8293578B2 (en) | 2010-10-26 | 2012-10-23 | International Business Machines Corporation | Hybrid bonding techniques for multi-layer semiconductor stacks |
US9412725B2 (en) | 2012-04-27 | 2016-08-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for image sensor packaging |
US9171759B2 (en) * | 2012-12-18 | 2015-10-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for die to die stress improvement |
US9299736B2 (en) | 2014-03-28 | 2016-03-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Hybrid bonding with uniform pattern density |
JP6215755B2 (en) * | 2014-04-14 | 2017-10-18 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
KR102287754B1 (en) | 2014-08-22 | 2021-08-09 | 삼성전자주식회사 | Chip stacked semiconductor package |
KR102388711B1 (en) * | 2015-04-27 | 2022-04-20 | 삼성디스플레이 주식회사 | Display device |
US10050018B2 (en) | 2016-02-26 | 2018-08-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | 3DIC structure and methods of forming |
-
2019
- 2019-12-30 TW TW108148392A patent/TWI808292B/en active
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2020
- 2020-02-04 US US16/781,937 patent/US11450633B2/en active Active
- 2020-02-20 CN CN202010104189.4A patent/CN113130428A/en active Pending
- 2020-03-19 EP EP20164116.4A patent/EP3846201A1/en active Pending
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2022
- 2022-08-04 US US17/880,691 patent/US20220384376A1/en not_active Abandoned
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US20010004135A1 (en) * | 1999-12-20 | 2001-06-21 | Ryuichi Okamura | Flip-chip bonded semiconductor device |
US20130001274A1 (en) * | 2011-06-30 | 2013-01-03 | Renesas Electronics Corporation | Method of manufacturing semiconductor device |
US20180247915A1 (en) * | 2017-02-24 | 2018-08-30 | Micron Technology, Inc. | Semiconductor device assemblies with electrically functional heat transfer structures |
US20190123006A1 (en) * | 2017-10-24 | 2019-04-25 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and method for manufacturing the same |
US20190164914A1 (en) * | 2017-11-30 | 2019-05-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Seal Ring for Hybrid-Bond |
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EP3846201A1 (en) | 2021-07-07 |
TW202125728A (en) | 2021-07-01 |
TWI808292B (en) | 2023-07-11 |
CN113130428A (en) | 2021-07-16 |
US20210202418A1 (en) | 2021-07-01 |
US11450633B2 (en) | 2022-09-20 |
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