US20210264180A1 - Biometric device and method thereof and wearable carrier - Google Patents
Biometric device and method thereof and wearable carrier Download PDFInfo
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- US20210264180A1 US20210264180A1 US17/317,899 US202117317899A US2021264180A1 US 20210264180 A1 US20210264180 A1 US 20210264180A1 US 202117317899 A US202117317899 A US 202117317899A US 2021264180 A1 US2021264180 A1 US 2021264180A1
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- 238000000034 method Methods 0.000 title claims description 26
- 230000003287 optical effect Effects 0.000 claims abstract description 72
- 239000000758 substrate Substances 0.000 claims abstract description 39
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 14
- 210000003462 vein Anatomy 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 70
- 238000010586 diagram Methods 0.000 description 8
- 230000008901 benefit Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 230000003247 decreasing effect Effects 0.000 description 5
- 238000005286 illumination Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 210000004204 blood vessel Anatomy 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010191 image analysis Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 210000000707 wrist Anatomy 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
Images
Classifications
-
- G06K9/00885—
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/33—Transforming infrared radiation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/12—Details of acquisition arrangements; Constructional details thereof
- G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
- G06V10/143—Sensing or illuminating at different wavelengths
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/12—Details of acquisition arrangements; Constructional details thereof
- G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
- G06V10/147—Details of sensors, e.g. sensor lenses
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/17—Image acquisition using hand-held instruments
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
-
- G06K2009/00932—
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/14—Vascular patterns
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
-
- H04N5/2256—
Definitions
- the disclosure relates to a recognition device and a method thereof, and particularly relates to a biometric device and a method thereof and a wearable carrier using the biometric device.
- Biometrics plays a more and more important role in today's society, where types of the biometrics mainly include face recognition, iris recognition, vein recognition, fingerprint recognition, etc.
- the disclosure is directed to a biometric device, which adopts an optical layer to achieve a thinning effect.
- the disclosure is directed to a biometric method, which is adapted to sequentially light infrared light emitting diodes to decrease a data amount and increase a processing speed.
- the disclosure is directed to a wearable carrier, which has the aforementioned biometric device.
- the disclosure provides a biometric device, which is adapted to recognize a biological characteristic of a region of a biological body.
- the biometric device includes a substrate, an image sensor, an optical layer and at least one infrared light emitting diode (IR LED).
- the image sensor is disposed on the substrate.
- the optical layer is disposed on the image sensor and includes a diffraction pattern.
- the IR LED is disposed on the diffraction pattern of the optical layer, where and the optical layer is located between the IR LED and the image sensor.
- the disclosure provides a biometric device, which is adapted to recognize a biological characteristic of a region of a biological body.
- the biometric device includes a substrate, an image sensor, a plurality of infrared light emitting diodes (IR LEDs) and an optical layer.
- the image sensor is disposed on the substrate and includes a plurality of photosensing units.
- the IR LEDs are disposed on the substrate, where the IR LEDs and the photosensing units are arranged in interleaving.
- the optical layer includes a plurality of lens portions, where the lens portions are aligned to a part of the photosensing units, an orthogonal projection of each of the lens portions on the substrate is overlapped with an orthogonal projection of the corresponding photosensing unit on the substrate.
- the disclosure provides a wearable carrier, which is adapted to be worn on a user.
- the wearable carrier includes a display unit, a strip unit and a biometric device.
- the strip unit is connected to the display unit at a first edge and a second edge opposite to each other.
- the biometric device is disposed on the display unit or the strip unit for recognizing a biological characteristic of a region of a biological body.
- the biometric device includes a substrate, an image sensor, an optical layer and at least one infrared light emitting diode (IR LED).
- the image sensor is disposed on the substrate.
- the optical layer is disposed on the image sensor and includes a diffraction pattern.
- the IR LED is disposed on the diffraction pattern of the optical layer, where the IR LED is located between the region of the biological body and the image sensor, and the optical layer is located between the IR LED and the image sensor.
- the disclosure provides a wearable carrier, which is adapted to be worn on a user.
- the wearable carrier includes a display unit, a strip unit and a biometric device.
- the strip unit is connected to the display unit at a first edge and a second edge opposite to each other.
- the biometric device is disposed on the display unit or the strip unit for recognizing a biological characteristic of a region of a biological body.
- the biometric device includes a substrate, an image sensor, a plurality of infrared light emitting diodes (IR LEDs) and an optical layer.
- the image sensor is disposed on the substrate and includes a plurality of photosensing units.
- the IR LEDs are disposed on the substrate, where the IR LEDs and the photosensing units are arranged in interleaving.
- the optical layer includes a plurality of lens portions, where the lens portions are aligned to a part of the photosensing units, an orthogonal projection of each of the lens portions on the substrate is overlapped with an orthogonal projection of the corresponding photosensing unit on the substrate, and the lens portion is located between the region of the biological body and the corresponding photosensing unit.
- the disclosure provides a biometric method including following steps.
- a characteristic image data is received.
- a region of a biological body is coupled to a biometric device, where the biometric device includes a plurality of photosensing units and a plurality of infrared light emitting diodes (IR LEDs), and the photosensing units are disposed corresponding to the IR LEDs, and each of the IR LEDs is adapted to emit a light to the region of the biological body.
- At least a part of the IR LEDs is sequentially lighted and the corresponding photosensing units are sequentially turned on, and the corresponding photosensing units receive the lights scattered by the region to respectively generate a recognition sensing image.
- the recognition sensing image is compared with the characteristic image data, and a recognition result is output according to a comparison result.
- the biometric device of an embodiment of the disclosure adopts the design of the optical layer to replace the conventional optical module with a large volume
- the biometric device of the disclosure has an advantage of thinning tendency.
- the optical layer thereof has the lens portion, such that the biometric device may provide a planar light source to decrease intensity and power consumption of the IR LEDs may in subsequent recognition illumination.
- the biometric method of the disclosure adopts a method of sequentially lighting the IR LEDs, the amount of data processed by the image sensor is decreased, such that an image processing speed is accelerated to quickly obtain a recognition result.
- FIG. 1A is a cross-sectional view of a biometric device according to an embodiment of the disclosure.
- FIG. 1B is a partial top view of an exploded schematic diagram of the biometric device of FIG. 1A .
- FIGS. 2A-2E are schematic diagrams of diffraction figures of a plurality of different embodiments in the optical layer.
- FIG. 3A is a cross-sectional view of a biometric device according to another embodiment of the disclosure.
- FIG. 3B is a partial enlarged cross-sectional view of the biometric device of FIG. 3A .
- FIG. 4A is a cross-sectional view of a biometric device according to an embodiment of the disclosure.
- FIG. 4B is a partial top view of the biometric device of FIG. 4A .
- FIG. 4C is a cross-sectional view of a biometric device according to another embodiment of the disclosure.
- FIG. 4D is a cross-sectional view of a biometric device according to another embodiment of the disclosure.
- FIG. 5 is a cross-sectional view of a biometric device according to another embodiment of the disclosure.
- FIG. 6 is a cross-sectional view of a biometric device according to another embodiment of the disclosure.
- FIG. 7 is a schematic diagram of a wearable carrier according to an embodiment of the disclosure.
- FIG. 8 is a flowchart illustrating a biometric method according to an embodiment of the disclosure.
- FIG. 9 is a schematic diagram of a biological characteristic of a region of a biological body.
- FIGS. 10A-10H are enlarged views of a region A to a region H in FIG. 9 .
- FIG. 11 is a partial top view of a biometric device according to another embodiment of the disclosure.
- FIG. 1A is a cross-sectional view of a biometric device according to an embodiment of the disclosure.
- FIG. 1B is a partial top view of an exploded schematic diagram of the biometric device of FIG. 1A .
- the biometric device 100 a is adapted to recognize a biological characteristic of a region 12 of a biological body 10 , where the region 12 of the biological body 10 is, for example, a wrist of a human body, and the biological characteristic is, for example, a vein network image characteristic.
- the biometric device 100 a includes a substrate 110 , an image sensor 120 a , an optical layer 130 a and at least one infrared light emitting diode (IR LED) 140 a (in FIG. 1A and FIG. 1B , a plurality of IR LEDs is schematically illustrated).
- the image sensor 120 a is disposed on the substrate 110 .
- the optical layer 130 a is disposed on the image sensor 120 a and includes a diffraction pattern 132 a .
- the IR LEDs 140 a are disposed on the diffraction pattern 132 a of the optical layer 130 a , where the IR LEDs 140 a are located between the region 12 of the biological body 10 and the image sensor 120 a , and the optical layer 130 a is located between the IR LEDs 140 a and the image sensor 120 a.
- the image sensor 120 a includes a plurality of photosensing units 122 a , where the photosensing units 122 a are arranged in an array.
- the optical layer 130 a further includes a transparent substrate 134 a , and the diffraction pattern 132 a is disposed on the transparent substrate 134 a to define a plurality of slits S. As shown in FIG.
- the transparent substrate 134 a of the optical layer 130 a of the present embodiment can be divided into a plurality of blocks, for example, blocks D 1 , D 2 , D 3 , and each block D 1 (or the block D 2 , the block D 3 ) is configured with a diffraction figure DF1 (or a diffraction figure DF2 , a diffraction figure DF3 ), and the diffraction figures DF1 , DF 2 , DF 3 define the diffraction pattern 132 a .
- the diffraction figure DF1 in the block D 1 for example, comprises a plurality of line images of the same size
- the diffraction figure DF2 in the block D 2 for example, comprises a plurality of line images with different widths
- the diffraction figure DF3 in the block D 3 for example, comprises a plurality of line images of the same size, and the line images are intersected with each other to form a grid, though the disclosure is not limited thereto.
- the shape of the diffraction figure can be any shape of diffraction figures DF4 -DF 8 shown in FIG. 2A - FIG. 2E or other shapes, which is not limited by the disclosure.
- the transparent substrate 134 a of the optical layer 130 a can be divided into the required number of blocks according to an actual requirement, and these blocks can be respectively configured with the required diffraction figure to define the diffraction pattern 132 a of different types.
- the slits S are defined on the transparent substrate 134 a (i.e. the region without the diffraction pattern 132 a ).
- the IR LEDs 140 a are disposed on the diffraction pattern 132 a , i.e. a light L emitted by the IR LED 140 a does not enter the optical layer 130 a from the position where the IR LED 140 a is located, but is incident to the region 12 of the biological body 10 , and is scattered by the region 12 of the biological body 10 to form a scattered light LS, and the scattered light LS enters the optical layer 130 a . Then, the scattered light LS passes through the slits S to produce a diffraction effect for imaging, and the image sensor 120 a receives the scattered light LS, and obtains a recognition result after image processing and image analysis and comparison.
- the optical layer 130 a of the present embodiment is embodied as a single layer type optical layer, compared to the conventional optical module consisting of multilayer of lenses, the optical layer 130 a of the present embodiment may have a thinner volume. Therefore, the biometric device 100 a of the present embodiment adopts the optical layer 130 a to replace the conventional large-volume optical modules, by which the whole volume and thickness can be greatly decreased to cope with a thinning tendency.
- FIG. 3A is a cross-sectional view of a biometric device according to another embodiment of the disclosure.
- FIG. 3B is a partial enlarged cross-sectional view of the biometric device of FIG. 3A .
- the biometric device 100 b of the present embodiment is similar to the biometric device 100 a of FIG. 1A and FIG. 1B , and a main difference there between is that the structure of the optical layer 130 b of the present embodiment is different to the structure of the optical layer 130 a of the aforementioned embodiment.
- the optical layer 130 b of the present embodiment further includes a first silicon oxide layer 131 b , a silicon nitride layer 133 b and a second silicon oxide layer 135 b .
- the silicon nitride layer 133 b is located between the first silicon oxide layer 131 b and the second silicon oxide layer 135 b
- the diffraction pattern 132 b is located in partial region of an upper surface 130 b 1 of the first silicon oxide layer 131 b
- the second silicon oxide layer 135 b is located between the silicon nitride layer 133 b and the image sensor 120 a .
- the optical layer 130 b of the present embodiment further includes a metal layer 137 b and at least one conductive through hole 139 b .
- the metal layer 137 b is disposed on the upper surface 130 b 1 of the first silicon oxide layer 131 b and covers a part of the diffraction pattern 132 b .
- the conductive through hole 139 b is electrically connected between the metal layer 137 b and the image sensor 120 a
- the IR LED 140 a is electrically connected to image sensor 120 a through the metal layer 137 b and the conductive through hole 139 b , where the metal layer 137 b can also be replaced by a conductive light-shielding material.
- the IR LED 140 a can be electrically connected to the metal layer 137 b through a conductive bump 145 .
- the light L emitted by the IR LED 140 a is incident to the region 12 of the biological body 10 , and is scattered by the region 12 of the biological body 10 to form the scattered light LS, and the scattered light LS enters the optical layer 130 b .
- the scattered light LS passes through the diffraction pattern 132 b to generate diffracted lights L 1 , L 2 , L 3 of different orders, and the diffracted lights L 1 , L 2 , L 3 of different orders are diffracted towards different directions and are received by the photosensing units 122 a of the image sensor 120 a , and then a recognition result is obtained after image processing and image analysis and comparison.
- FIG. 4A is a cross-sectional view of a biometric device according to an embodiment of the disclosure.
- FIG. 4B is a partial top view of the biometric device of FIG. 4A .
- a part of the components is omitted in FIG. 4B .
- the biometric device 100 c of the present embodiment is similar to the biometric device 100 a of FIG. 1A and FIG. 1B , and a main difference there between is that the IR LEDs 140 c and the photosensing units 122 c are arranged in interleaving.
- the optical layer 130 c includes a plurality of lens portions 132 c and a transparent panel portion 134 c , where the transparent panel portion 134 c covers the IR LEDs 140 c and the photosensing units 122 c , and the lens portions 132 c are disposed on a top surface 135 c of the transparent panel portion 134 c and are aligned to a part of the photosensing units 122 c .
- each of the lens portions 132 c on the substrate 110 is overlapped with an orthogonal projection of the corresponding photosensing unit 122 c on the substrate 110 , and the lens portion 132 c is located between the region 12 of the biological body 10 and the corresponding photosensing unit 122 c .
- the number of the lens portions 132 c is less than the number of the photosensing units 122 c , and the lens portions 132 c may cover a part of the photosensing units 122 c.
- the photosensing units 122 c of the present embodiment and the IR LEDs 140 c are, for example, (but not limited to be) located on a same horizontal plane.
- a height of the photosensing unit 122 c is, for example, greater than a height of the IR LED 140 c , though the disclosure is not limited thereto.
- a light LS' emitted by the IR LED 140 c is incident to the region 12 of the biological body 10 , and is scattered by the region 12 of the biological body 10 to form the scattered light LS′, and the scattered light LS' enters the optical layer 130 c . Then, a part of the scattered light LS' passes through the lens portions 132 c and is received by the photosensing units 122 c under the lens portions 132 c , and the other part of the scattered light LS' is directly received by the photosensing units 122 c uncovered by the lens portions 132 c .
- vein image processing is performed to process the lights passing through the lens portions 132 c and the lights without passing through the lens portion 132 c that are sensed by the photosensing units 122 c , and after comparison and analysis, a vein image is obtained.
- the vein image is a biological characteristic of a user
- a vein image database comprises a plurality of vein images.
- the optical layer 130 c of the present embodiment is embodied as a single layer type optical layer, compared to the conventional optical module consisting of multilayer of lenses, the optical layer 130 a of the present embodiment may have a thinner volume. Therefore, the whole volume and thickness can be greatly decreased to cope with the thinning tendency.
- the IR LEDs are arranged in an array to provide a planar light source. In this way, the intensity and power consumption of the IR LEDs 140 can be effectively decreased in subsequent recognition illumination.
- FIG. 4C is a cross-sectional view of a biometric device according to another embodiment of the disclosure.
- the biometric device 100 d of the present embodiment is similar to the biometric device 100 c of FIG. 4A , and a main difference there between is that a height of a first upper surface 142 d of the IR LED 140 d is higher than a height of a second upper surface 123 d of the photosensing unit 122 d .
- the height of the IR LED 140 d of the present embodiment is higher than the height of the photosensing unit 122 d .
- a surrounding surface 143 d of the IR LED 140 d of the present embodiment has a reflective material layer 144 d , where reflectivity of the reflective material layer 144 d is, for example, greater than 70%, and a material of the reflective material layer 144 d is, for example, gold, silver, aluminium, though the disclosure is not limited thereto.
- the reflective material layer 144 d is configured to reflect the lateral light of the IR LED 140 d for emitting in a normal direction.
- the biometric device 100 e of the present embodiment is similar to the biometric device 100 d of FIG. 4C , and a main difference there between is that the biometric device 100 e of the present embodiment further includes a plurality of wall structures 150 .
- the wall structures 150 are disposed on the substrate 110 and surround each of the IR LEDs 140 e , where each of the wall structures 150 has a third upper surface 152 , and the third upper surface 152 is higher than the first upper surface 142 e .
- the wall structures 150 may change the lateral light of the IR LED 140 e from a lateral transmission direction into an upward transmission direction, such that the light transmitted in the lateral manner can be effectively used.
- FIG. 5 is a cross-sectional view of a biometric device according to another embodiment of the disclosure.
- the biometric device 100 f of the present embodiment is similar to the biometric device 100 c of FIG. 4A , and a main difference there between is that the IR LEDs 140 f and the photosensing units are not arranged in interleaving.
- the IR LEDs 140 f and the photosensing units are not arranged in interleaving.
- the image sensor 120 a is disposed on the substrate 110 , and the optical layer 130 a and the IR LEDs 140 a are disposed on the image sensor 120 a
- the image sensor 120 f is disposed on the substrate 110
- the IR LEDs 140 f , the optical layer 130 f and the lens portions 132 f thereof are disposed on the image sensor 120 f.
- FIG. 6 is a cross-sectional view of a biometric device according to another embodiment of the disclosure.
- the biometric device 100 g of the present embodiment is similar to the biometric device 100 f of FIG. 5 , and a main difference there between is that the optical layer 130 g of the present embodiment further includes a transparent panel portion 134 g , where the transparent panel portion 134 g is disposed on the IR LEDs 140 g , and the transparent panel portion 134 g , the IR LEDs 140 g and the image sensor 120 g define a plurality of air gaps AG.
- the air gaps AG are located between the IR LEDs 140 g
- the lens portions 132 g are located on a top surface 135 g of the transparent panel portion 134 g.
- FIG. 7 is a schematic diagram of a wearable carrier according to an embodiment of the disclosure.
- the wearable carrier 200 of the present embodiment is adapted to be worn on a user.
- the wearable carrier 200 includes a display unit 210 , a strip unit 220 and one of the aforementioned biometric devices 100 a - 100 h .
- the wearable carrier 200 is embodied by a watch, though the disclosure is not limited thereto. In other embodiments that are not shown, a sport bracelet or other types of wearable carrier is also applicable.
- the display unit 210 of the present embodiment may, for example, display time information, where the display unit 210 has a first edge 210 a and a second edge 210 b opposite to each other and a display surface 212 and a back surface 214 opposite to each other.
- the strip unit 220 is connected to the first edge 210 a and the second edge 210 b of the display unit 210 , and is adapted to be fixed on a wrist of the user, though the disclosure is not limited thereto.
- the biometric device 100 a (or the biometric devices 100 b - 100 h ) can be configured on the display surface 212 of the display unit 210 .
- the biometric device 100 a (or the biometric devices 100 b - 100 h ) can also be disposed on the back surface 214 of the display unit 210 , or on an outer surface 222 of the strip unit 220 , or on an inner surface 224 of the strip unit 220 .
- the biometric device 100 a (or the biometric devices 100 b - 100 h ) adopts the optical layer 130 a (or 130 b , 130 c , 130 f , 130 g ) to replace the conventional optical module consisting of multilayer of lenses
- the surface of the optical layer is similar to a planar optical layer, such that the biometric device 100 a (or the biometric devices 100 b - 100 h ) of the present embodiment have an advantage of thinning tendency.
- the biometric device 100 a (or the biometric devices 100 b - 100 h ) is integrated with the wearable device to form a wearable carrier 200 , besides that the wearable carrier 200 has the original functions (for example, a time display function), it also has a biometric function, which satisfies user's appeal for multi-function on products.
- FIG. 8 is a flowchart illustrating a biometric method according to an embodiment of the disclosure.
- FIG. 9 is a schematic diagram of a biological characteristic of a region of a biological body.
- FIGS. 10A-10H are enlarged views of a region A to a region H in FIG. 9 .
- the biometric method of the present embodiment includes following steps. First, in step S 1 , a biological characteristic of a user is registered, and a characteristic image data is received in a first use and is stored in the device to serve as a comparison reference. Establishment of the characteristic image data is, for example, to capture an image of the region 12 of the biological body 10 , for example, capture an image of the vein, and then referring to FIG.
- regions corresponding to the characteristic image are extracted to store a structure characteristic of the characteristic image and related position data to form the characteristic image data.
- Selection of the characteristic image data is, for example, bifurcations of blood vessels, and referring to FIG. 10A to FIG. 10H for schematic diagrams of bifurcations of blood vessels in the region A to the region H.
- step S 2 the region 12 of the biological body 10 is coupled to the biometric device 100 a , where the biometric device 100 a includes a plurality of photosensing units 122 a and a plurality of IR LEDs 140 a , the photosensing units 122 a are disposed corresponding to the IR LEDs 140 a , and each of the IR LEDs 140 a is adapted to emit a light L to the region 12 of the biological body 10 .
- step S 3 a relative position between the region 12 of the biological body 10 and the biometric device 100 a is confirmed, and a method for confirming the relative position is described as follow.
- one or a plurality of IR LEDs 140 a is lighted and the corresponding photosensing unit 122 a are turned on, such that the photosensing units 122 a receive the light LS scattered by the region 12 to generate a positioning sensing image.
- the corresponding photosensing unit 122 a is turned on at the same time while, before or after one of the IR LEDs 140 a is lighted, which is not limited by the disclosure.
- the positioning sensing image is compared with the characteristic image data to confirm the relative position between the region 12 of the biological body 10 and the biometric device 100 a . If the positioning sensing image is not complied with the characteristic image data, the flow returns to the step S 2 to re-couple the region 12 of the biological body 10 and the biometric device 100 a to adjust the relative position between the region 12 of the biological body 10 and the biometric device 100 a . In other embodiments, other proper methods can be adopted to confirm the relative position, which is not limited by the disclosure.
- step S 4 after the relative position is confirmed, at least a part of the IR LEDs 140 a are sequentially lighted and the corresponding photosensing units 122 are sequentially turned on, such that the corresponding photosensing units 122 receive the light LS to respectively generate a recognition sensing image.
- the corresponding photosensing units 122 a are turned on at the same time while, before or after the unlighted IR LEDs 140 a are sequentially lighted, which is not limited by the disclosure.
- a method for sequentially lighting the IR LEDs 140 a is, for example, to only light a single IR LED 140 a at each time point, i.e. when one of the IR LEDs 140 a is lighted, the other IR LEDs 140 a are all turned off, though the disclosure is not limited thereto.
- step S 5 the recognition sensing image is compared with the characteristic image data to output a recognition result according to a comparison result.
- a method of sequentially lighting the IR LEDs 140 a is adopted to decrease an amount of data processed by the image sensor 120 a , an image processing speed is accelerated to quickly obtain a recognition result.
- the biometric device 100 a adopted in the aforementioned biometric method is only an example, and those skilled in the art may select to use the biometric devices 100 b - 100 h of the aforementioned embodiments according to an actual requirement. If the biometric device 100 c of FIG. 4A is used, since the optical layer 130 c of the biometric device 100 c has the lens portions 132 c , the biometric device 100 c may provide a planar light source to decrease intensity and power consumption of the IR LEDs 140 c required in recognition illumination.
- FIG. 11 is a partial top view of a biometric device according to another embodiment of the disclosure.
- the biometric device 100 h of the present embodiment is similar to the biometric device 100 c of FIG. 4B , and a main difference there between is that the substrate 110 of the biometric device 100 h is configured with more number of the IR LEDs 140 h , where each of the photosensing unit 122 h is surrounded by a plurality of the IR LEDs 140 h , and the light emitted by each of the IR LEDs 140 h is scattered by the region of the biological body to form the scattered light, and the scattered light is sensed by one or a plurality of the photosensing units 122 h.
- technicians of the field may add other types of sensing elements in the biometric devices 100 b - 100 h of the aforementioned embodiments, such that the functions of the biometric devices can be more comprehensive and diversified.
- the added sensing elements are, for example, used for sensing the biological body, sensing an environment in which the biological body is located or providing other sensing functions, which is not limited by the disclosure.
- the biometric device of the embodiment of the disclosure adopts the design of the optical layer to replace the conventional optical module with a large volume, and the surface of the optical layer is similar to a planar optical layer, the biometric device of the disclosure has an advantage of thinning tendency.
- the optical layer thereof has the lens portion, such that the biometric device may provide a planar light source to decrease intensity and power consumption of the IR LEDs required in subsequent recognition illumination.
- the biometric method of the disclosure adopts a method of sequentially lighting the IR LEDs, the amount of data processed by the image sensor is decreased, such that an image processing speed is accelerated to quickly obtain a recognition result.
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Abstract
Description
- This application is a divisional application of and claims the priority benefit of a prior application Ser. No. 16/596,770, filed on Oct. 9, 2019, now allowed. The prior U.S. application Ser. No. 16/596,770 is continuation application of and claims the priority benefit of a prior application Ser. No. 15/221,615, filed on Jul. 28, 2016, now abandoned. The prior U.S. application Ser. No. 15/221,615 claims the priority benefits of U.S. provisional application Ser. No. 62/198,645, filed on Jul. 29, 2015, and Taiwan application serial no. 105120683, filed on Jun. 30, 2016. The entirety of each of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of this specification.
- The disclosure relates to a recognition device and a method thereof, and particularly relates to a biometric device and a method thereof and a wearable carrier using the biometric device.
- Biometrics plays a more and more important role in today's society, where types of the biometrics mainly include face recognition, iris recognition, vein recognition, fingerprint recognition, etc.
- In terms of a current technique, solution for identity (ID) recognition on a smart wearable device is still not developed, and a reason thereof is that the wearable device generally requires a light and thin ID recognition system. Moreover, taking finger, palm vein recognition as an example, a vein image is generally captured first, and regarding the current technique, a data amount of the image is relatively large, a processing speed thereof is very slow, and power consumption of the whole image capturing operation is relatively large, which is not suitable for ID recognition of the smart wearable device. Therefore, how to design a biometric device with low power consumption, thinned modules and a fast processing speed has become an important technical challenge in design of the biometric device.
- The disclosure is directed to a biometric device, which adopts an optical layer to achieve a thinning effect.
- The disclosure is directed to a biometric method, which is adapted to sequentially light infrared light emitting diodes to decrease a data amount and increase a processing speed.
- The disclosure is directed to a wearable carrier, which has the aforementioned biometric device.
- The disclosure provides a biometric device, which is adapted to recognize a biological characteristic of a region of a biological body. The biometric device includes a substrate, an image sensor, an optical layer and at least one infrared light emitting diode (IR LED). The image sensor is disposed on the substrate. The optical layer is disposed on the image sensor and includes a diffraction pattern. The IR LED is disposed on the diffraction pattern of the optical layer, where and the optical layer is located between the IR LED and the image sensor.
- The disclosure provides a biometric device, which is adapted to recognize a biological characteristic of a region of a biological body. The biometric device includes a substrate, an image sensor, a plurality of infrared light emitting diodes (IR LEDs) and an optical layer. The image sensor is disposed on the substrate and includes a plurality of photosensing units. The IR LEDs are disposed on the substrate, where the IR LEDs and the photosensing units are arranged in interleaving. The optical layer includes a plurality of lens portions, where the lens portions are aligned to a part of the photosensing units, an orthogonal projection of each of the lens portions on the substrate is overlapped with an orthogonal projection of the corresponding photosensing unit on the substrate.
- The disclosure provides a wearable carrier, which is adapted to be worn on a user. The wearable carrier includes a display unit, a strip unit and a biometric device. The strip unit is connected to the display unit at a first edge and a second edge opposite to each other. The biometric device is disposed on the display unit or the strip unit for recognizing a biological characteristic of a region of a biological body. The biometric device includes a substrate, an image sensor, an optical layer and at least one infrared light emitting diode (IR LED). The image sensor is disposed on the substrate. The optical layer is disposed on the image sensor and includes a diffraction pattern. The IR LED is disposed on the diffraction pattern of the optical layer, where the IR LED is located between the region of the biological body and the image sensor, and the optical layer is located between the IR LED and the image sensor.
- The disclosure provides a wearable carrier, which is adapted to be worn on a user. The wearable carrier includes a display unit, a strip unit and a biometric device. The strip unit is connected to the display unit at a first edge and a second edge opposite to each other. The biometric device is disposed on the display unit or the strip unit for recognizing a biological characteristic of a region of a biological body. The biometric device includes a substrate, an image sensor, a plurality of infrared light emitting diodes (IR LEDs) and an optical layer. The image sensor is disposed on the substrate and includes a plurality of photosensing units. The IR LEDs are disposed on the substrate, where the IR LEDs and the photosensing units are arranged in interleaving. The optical layer includes a plurality of lens portions, where the lens portions are aligned to a part of the photosensing units, an orthogonal projection of each of the lens portions on the substrate is overlapped with an orthogonal projection of the corresponding photosensing unit on the substrate, and the lens portion is located between the region of the biological body and the corresponding photosensing unit.
- The disclosure provides a biometric method including following steps. A characteristic image data is received. A region of a biological body is coupled to a biometric device, where the biometric device includes a plurality of photosensing units and a plurality of infrared light emitting diodes (IR LEDs), and the photosensing units are disposed corresponding to the IR LEDs, and each of the IR LEDs is adapted to emit a light to the region of the biological body. At least a part of the IR LEDs is sequentially lighted and the corresponding photosensing units are sequentially turned on, and the corresponding photosensing units receive the lights scattered by the region to respectively generate a recognition sensing image. The recognition sensing image is compared with the characteristic image data, and a recognition result is output according to a comparison result.
- According to the above description, since the biometric device of an embodiment of the disclosure adopts the design of the optical layer to replace the conventional optical module with a large volume, the biometric device of the disclosure has an advantage of thinning tendency. Moreover, in the biometric device of another embodiment of the disclosure, the optical layer thereof has the lens portion, such that the biometric device may provide a planar light source to decrease intensity and power consumption of the IR LEDs may in subsequent recognition illumination. In addition, since the biometric method of the disclosure adopts a method of sequentially lighting the IR LEDs, the amount of data processed by the image sensor is decreased, such that an image processing speed is accelerated to quickly obtain a recognition result.
- In order to make the aforementioned and other features and advantages of the disclosure comprehensible, several exemplary embodiments accompanied with figures are described in detail below.
- The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the disclosure and, together with the description, serve to explain the principles of the disclosure.
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FIG. 1A is a cross-sectional view of a biometric device according to an embodiment of the disclosure. -
FIG. 1B is a partial top view of an exploded schematic diagram of the biometric device ofFIG. 1A . -
FIGS. 2A-2E are schematic diagrams of diffraction figures of a plurality of different embodiments in the optical layer. -
FIG. 3A is a cross-sectional view of a biometric device according to another embodiment of the disclosure. -
FIG. 3B is a partial enlarged cross-sectional view of the biometric device ofFIG. 3A . -
FIG. 4A is a cross-sectional view of a biometric device according to an embodiment of the disclosure. -
FIG. 4B is a partial top view of the biometric device ofFIG. 4A . -
FIG. 4C is a cross-sectional view of a biometric device according to another embodiment of the disclosure. -
FIG. 4D is a cross-sectional view of a biometric device according to another embodiment of the disclosure. -
FIG. 5 is a cross-sectional view of a biometric device according to another embodiment of the disclosure. -
FIG. 6 is a cross-sectional view of a biometric device according to another embodiment of the disclosure. -
FIG. 7 is a schematic diagram of a wearable carrier according to an embodiment of the disclosure. -
FIG. 8 is a flowchart illustrating a biometric method according to an embodiment of the disclosure. -
FIG. 9 is a schematic diagram of a biological characteristic of a region of a biological body. -
FIGS. 10A-10H are enlarged views of a region A to a region H inFIG. 9 . -
FIG. 11 is a partial top view of a biometric device according to another embodiment of the disclosure. -
FIG. 1A is a cross-sectional view of a biometric device according to an embodiment of the disclosure.FIG. 1B is a partial top view of an exploded schematic diagram of the biometric device ofFIG. 1A . Referring toFIG. 1A andFIG. 1B , in the present embodiment, thebiometric device 100 a is adapted to recognize a biological characteristic of aregion 12 of abiological body 10, where theregion 12 of thebiological body 10 is, for example, a wrist of a human body, and the biological characteristic is, for example, a vein network image characteristic. Thebiometric device 100 a includes asubstrate 110, animage sensor 120 a, anoptical layer 130 a and at least one infrared light emitting diode (IR LED) 140 a (inFIG. 1A andFIG. 1B , a plurality of IR LEDs is schematically illustrated). Theimage sensor 120 a is disposed on thesubstrate 110. Theoptical layer 130 a is disposed on theimage sensor 120 a and includes adiffraction pattern 132 a. TheIR LEDs 140 a are disposed on thediffraction pattern 132 a of theoptical layer 130 a, where theIR LEDs 140 a are located between theregion 12 of thebiological body 10 and theimage sensor 120 a, and theoptical layer 130 a is located between theIR LEDs 140 a and theimage sensor 120 a. - In detail, the
image sensor 120 a includes a plurality ofphotosensing units 122 a, where thephotosensing units 122 a are arranged in an array. Theoptical layer 130 a further includes atransparent substrate 134 a, and thediffraction pattern 132 a is disposed on thetransparent substrate 134 a to define a plurality of slits S. As shown inFIG. 1B , thetransparent substrate 134 a of theoptical layer 130 a of the present embodiment can be divided into a plurality of blocks, for example, blocks D1, D2, D3, and each block D1 (or the block D2, the block D3) is configured with a diffractionfigure DF1 (or a diffractionfigure DF2 , a diffractionfigure DF3 ), and the diffractionfigures DF1 , DF2, DF3 define thediffraction pattern 132 a. The diffractionfigure DF1 in the block D1, for example, comprises a plurality of line images of the same size, and the diffractionfigure DF2 in the block D2, for example, comprises a plurality of line images with different widths, and the diffractionfigure DF3 in the block D3, for example, comprises a plurality of line images of the same size, and the line images are intersected with each other to form a grid, though the disclosure is not limited thereto. For example, the shape of the diffraction figure can be any shape of diffractionfigures DF4 -DF8 shown inFIG. 2A -FIG. 2E or other shapes, which is not limited by the disclosure. It should be noted that thetransparent substrate 134 a of theoptical layer 130 a can be divided into the required number of blocks according to an actual requirement, and these blocks can be respectively configured with the required diffraction figure to define thediffraction pattern 132 a of different types. - Since the
diffraction pattern 132 a is an opaque pattern and is disposed on thetransparent substrate 134 a, the slits S are defined on thetransparent substrate 134 a (i.e. the region without thediffraction pattern 132 a). TheIR LEDs 140 a are disposed on thediffraction pattern 132 a, i.e. a light L emitted by theIR LED 140 a does not enter theoptical layer 130 a from the position where theIR LED 140 a is located, but is incident to theregion 12 of thebiological body 10, and is scattered by theregion 12 of thebiological body 10 to form a scattered light LS, and the scattered light LS enters theoptical layer 130 a. Then, the scattered light LS passes through the slits S to produce a diffraction effect for imaging, and theimage sensor 120 a receives the scattered light LS, and obtains a recognition result after image processing and image analysis and comparison. - Since the
optical layer 130 a of the present embodiment is embodied as a single layer type optical layer, compared to the conventional optical module consisting of multilayer of lenses, theoptical layer 130 a of the present embodiment may have a thinner volume. Therefore, thebiometric device 100 a of the present embodiment adopts theoptical layer 130 a to replace the conventional large-volume optical modules, by which the whole volume and thickness can be greatly decreased to cope with a thinning tendency. - It should be noticed that reference numbers of the components and a part of contents of the aforementioned embodiment are also used in the following embodiment, wherein the same reference numbers denote the same or like components, and descriptions of the same technical contents are omitted. The aforementioned embodiment can be referred for descriptions of the omitted parts, and detailed descriptions thereof are not repeated in the following embodiment.
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FIG. 3A is a cross-sectional view of a biometric device according to another embodiment of the disclosure.FIG. 3B is a partial enlarged cross-sectional view of the biometric device ofFIG. 3A . Referring toFIG. 3A andFIG. 3B , thebiometric device 100 b of the present embodiment is similar to thebiometric device 100 a ofFIG. 1A andFIG. 1B , and a main difference there between is that the structure of theoptical layer 130 b of the present embodiment is different to the structure of theoptical layer 130 a of the aforementioned embodiment. In detail, theoptical layer 130 b of the present embodiment further includes a firstsilicon oxide layer 131 b, asilicon nitride layer 133 b and a secondsilicon oxide layer 135 b. Thesilicon nitride layer 133 b is located between the firstsilicon oxide layer 131 b and the secondsilicon oxide layer 135 b, and thediffraction pattern 132 b is located in partial region of anupper surface 130b 1 of the firstsilicon oxide layer 131 b, and the secondsilicon oxide layer 135 b is located between thesilicon nitride layer 133 b and theimage sensor 120 a. Moreover, theoptical layer 130 b of the present embodiment further includes ametal layer 137 b and at least one conductive throughhole 139 b. Themetal layer 137 b is disposed on theupper surface 130b 1 of the firstsilicon oxide layer 131 b and covers a part of thediffraction pattern 132 b. The conductive throughhole 139 b is electrically connected between themetal layer 137 b and theimage sensor 120 a, and theIR LED 140 a is electrically connected to imagesensor 120 a through themetal layer 137 b and the conductive throughhole 139 b, where themetal layer 137 b can also be replaced by a conductive light-shielding material. - As shown in
FIG. 3B , theIR LED 140 a can be electrically connected to themetal layer 137 b through aconductive bump 145. The light L emitted by theIR LED 140 a is incident to theregion 12 of thebiological body 10, and is scattered by theregion 12 of thebiological body 10 to form the scattered light LS, and the scattered light LS enters theoptical layer 130 b. Then, the scattered light LS passes through thediffraction pattern 132 b to generate diffracted lights L1, L2, L3 of different orders, and the diffracted lights L1, L2, L3 of different orders are diffracted towards different directions and are received by thephotosensing units 122 a of theimage sensor 120 a, and then a recognition result is obtained after image processing and image analysis and comparison. -
FIG. 4A is a cross-sectional view of a biometric device according to an embodiment of the disclosure.FIG. 4B is a partial top view of the biometric device ofFIG. 4A . For simplicity's sake, a part of the components is omitted inFIG. 4B . Referring toFIG. 4A andFIG. 4B , thebiometric device 100 c of the present embodiment is similar to thebiometric device 100 a ofFIG. 1A andFIG. 1B , and a main difference there between is that theIR LEDs 140 c and thephotosensing units 122 c are arranged in interleaving. Theoptical layer 130 c includes a plurality oflens portions 132 c and atransparent panel portion 134 c, where thetransparent panel portion 134 c covers theIR LEDs 140 c and thephotosensing units 122 c, and thelens portions 132 c are disposed on atop surface 135 c of thetransparent panel portion 134 c and are aligned to a part of thephotosensing units 122 c. An orthogonal projection of each of thelens portions 132 c on thesubstrate 110 is overlapped with an orthogonal projection of thecorresponding photosensing unit 122 c on thesubstrate 110, and thelens portion 132 c is located between theregion 12 of thebiological body 10 and thecorresponding photosensing unit 122 c. Namely, the number of thelens portions 132 c is less than the number of thephotosensing units 122 c, and thelens portions 132 c may cover a part of thephotosensing units 122 c. - To be specific, the
photosensing units 122 c of the present embodiment and theIR LEDs 140 c are, for example, (but not limited to be) located on a same horizontal plane. Moreover, in the present embodiment, a height of thephotosensing unit 122 c is, for example, greater than a height of theIR LED 140 c, though the disclosure is not limited thereto. - As shown in
FIG. 4A , a light LS' emitted by theIR LED 140 c is incident to theregion 12 of thebiological body 10, and is scattered by theregion 12 of thebiological body 10 to form the scattered light LS′, and the scattered light LS' enters theoptical layer 130 c. Then, a part of the scattered light LS' passes through thelens portions 132 c and is received by thephotosensing units 122 c under thelens portions 132 c, and the other part of the scattered light LS' is directly received by thephotosensing units 122 c uncovered by thelens portions 132 c. Then, image processing is performed to process the lights passing through thelens portions 132 c and the lights without passing through thelens portion 132 c that are sensed by thephotosensing units 122 c, and after comparison and analysis, a vein image is obtained. Herein, the vein image is a biological characteristic of a user, and a vein image database comprises a plurality of vein images. - Since the
optical layer 130 c of the present embodiment is embodied as a single layer type optical layer, compared to the conventional optical module consisting of multilayer of lenses, theoptical layer 130 a of the present embodiment may have a thinner volume. Therefore, the whole volume and thickness can be greatly decreased to cope with the thinning tendency. Moreover, in the present embodiment, the IR LEDs are arranged in an array to provide a planar light source. In this way, the intensity and power consumption of the IR LEDs 140 can be effectively decreased in subsequent recognition illumination. -
FIG. 4C is a cross-sectional view of a biometric device according to another embodiment of the disclosure. Referring toFIG. 4C , thebiometric device 100 d of the present embodiment is similar to thebiometric device 100 c ofFIG. 4A , and a main difference there between is that a height of a firstupper surface 142 d of theIR LED 140 d is higher than a height of a secondupper surface 123 d of thephotosensing unit 122 d. Namely, the height of theIR LED 140 d of the present embodiment is higher than the height of thephotosensing unit 122 d. Since the height of theIR LED 140 d of the present embodiment is higher than the height of thephotosensing unit 122 d, in order to avoid a situation that thephotosensing unit 122 d receives a lateral light of theIR LED 140 d, a surroundingsurface 143 d of theIR LED 140 d of the present embodiment has areflective material layer 144 d, where reflectivity of thereflective material layer 144 d is, for example, greater than 70%, and a material of thereflective material layer 144 d is, for example, gold, silver, aluminium, though the disclosure is not limited thereto. Thereflective material layer 144 d is configured to reflect the lateral light of theIR LED 140 d for emitting in a normal direction. - Certainly, in other embodiments, different structure designs can be adopted to prevent the lateral light of the
IR LED 140 d from entering thephotosensing unit 122 d. Referring toFIG. 4D , thebiometric device 100 e of the present embodiment is similar to thebiometric device 100 d ofFIG. 4C , and a main difference there between is that thebiometric device 100 e of the present embodiment further includes a plurality ofwall structures 150. Thewall structures 150 are disposed on thesubstrate 110 and surround each of theIR LEDs 140 e, where each of thewall structures 150 has a thirdupper surface 152, and the thirdupper surface 152 is higher than the firstupper surface 142 e. Thewall structures 150 may change the lateral light of theIR LED 140 e from a lateral transmission direction into an upward transmission direction, such that the light transmitted in the lateral manner can be effectively used. -
FIG. 5 is a cross-sectional view of a biometric device according to another embodiment of the disclosure. Referring toFIG. 5 , thebiometric device 100 f of the present embodiment is similar to thebiometric device 100 c ofFIG. 4A , and a main difference there between is that theIR LEDs 140 f and the photosensing units are not arranged in interleaving. To be specific, similar to the embodiment ofFIG. 1A where theimage sensor 120 a is disposed on thesubstrate 110, and theoptical layer 130 a and theIR LEDs 140 a are disposed on theimage sensor 120 a, in the present embodiment, theimage sensor 120 f is disposed on thesubstrate 110, and theIR LEDs 140 f, theoptical layer 130 f and thelens portions 132 f thereof are disposed on theimage sensor 120 f. -
FIG. 6 is a cross-sectional view of a biometric device according to another embodiment of the disclosure. Referring toFIG. 6 , thebiometric device 100 g of the present embodiment is similar to thebiometric device 100 f ofFIG. 5 , and a main difference there between is that the optical layer 130 g of the present embodiment further includes atransparent panel portion 134 g, where thetransparent panel portion 134 g is disposed on theIR LEDs 140 g, and thetransparent panel portion 134 g, theIR LEDs 140 g and theimage sensor 120 g define a plurality of air gaps AG. The air gaps AG are located between theIR LEDs 140 g, and thelens portions 132 g are located on atop surface 135 g of thetransparent panel portion 134 g. -
FIG. 7 is a schematic diagram of a wearable carrier according to an embodiment of the disclosure. Referring toFIG. 7 , thewearable carrier 200 of the present embodiment is adapted to be worn on a user. Thewearable carrier 200 includes adisplay unit 210, astrip unit 220 and one of the aforementioned biometric devices 100 a-100 h. As shown inFIG. 7 , thewearable carrier 200 is embodied by a watch, though the disclosure is not limited thereto. In other embodiments that are not shown, a sport bracelet or other types of wearable carrier is also applicable. - In detail, the
display unit 210 of the present embodiment may, for example, display time information, where thedisplay unit 210 has afirst edge 210 a and asecond edge 210 b opposite to each other and adisplay surface 212 and aback surface 214 opposite to each other. Thestrip unit 220 is connected to thefirst edge 210 a and thesecond edge 210 b of thedisplay unit 210, and is adapted to be fixed on a wrist of the user, though the disclosure is not limited thereto. Thebiometric device 100 a (or thebiometric devices 100 b-100 h) can be configured on thedisplay surface 212 of thedisplay unit 210. Certainly, in other embodiments that are not shown, thebiometric device 100 a (or thebiometric devices 100 b-100 h) can also be disposed on theback surface 214 of thedisplay unit 210, or on anouter surface 222 of thestrip unit 220, or on aninner surface 224 of thestrip unit 220. - Since the
biometric device 100 a (or thebiometric devices 100 b-100 h) adopts theoptical layer 130 a (or 130 b, 130 c, 130 f, 130 g) to replace the conventional optical module consisting of multilayer of lenses, the surface of the optical layer is similar to a planar optical layer, such that thebiometric device 100 a (or thebiometric devices 100 b-100 h) of the present embodiment have an advantage of thinning tendency. When thebiometric device 100 a (or thebiometric devices 100 b-100 h) is integrated with the wearable device to form awearable carrier 200, besides that thewearable carrier 200 has the original functions (for example, a time display function), it also has a biometric function, which satisfies user's appeal for multi-function on products. -
FIG. 8 is a flowchart illustrating a biometric method according to an embodiment of the disclosure.FIG. 9 is a schematic diagram of a biological characteristic of a region of a biological body.FIGS. 10A-10H are enlarged views of a region A to a region H inFIG. 9 . Referring toFIG. 8 , the biometric method of the present embodiment includes following steps. First, in step S1, a biological characteristic of a user is registered, and a characteristic image data is received in a first use and is stored in the device to serve as a comparison reference. Establishment of the characteristic image data is, for example, to capture an image of theregion 12 of thebiological body 10, for example, capture an image of the vein, and then referring toFIG. 9 , regions corresponding to the characteristic image (for example, the region A to the region H inFIG. 9 ) are extracted to store a structure characteristic of the characteristic image and related position data to form the characteristic image data. Selection of the characteristic image data is, for example, bifurcations of blood vessels, and referring toFIG. 10A toFIG. 10H for schematic diagrams of bifurcations of blood vessels in the region A to the region H. - Then, referring to
FIG. 8 andFIG. 1A , in step S2, theregion 12 of thebiological body 10 is coupled to thebiometric device 100 a, where thebiometric device 100 a includes a plurality ofphotosensing units 122 a and a plurality ofIR LEDs 140 a, thephotosensing units 122 a are disposed corresponding to theIR LEDs 140 a, and each of theIR LEDs 140 a is adapted to emit a light L to theregion 12 of thebiological body 10. - Then, referring to
FIG. 8 andFIG. 1A , in step S3, a relative position between theregion 12 of thebiological body 10 and thebiometric device 100 a is confirmed, and a method for confirming the relative position is described as follow. First, one or a plurality ofIR LEDs 140 a is lighted and thecorresponding photosensing unit 122 a are turned on, such that thephotosensing units 122 a receive the light LS scattered by theregion 12 to generate a positioning sensing image. Thecorresponding photosensing unit 122 a is turned on at the same time while, before or after one of theIR LEDs 140 a is lighted, which is not limited by the disclosure. Then, the positioning sensing image is compared with the characteristic image data to confirm the relative position between theregion 12 of thebiological body 10 and thebiometric device 100 a. If the positioning sensing image is not complied with the characteristic image data, the flow returns to the step S2 to re-couple theregion 12 of thebiological body 10 and thebiometric device 100 a to adjust the relative position between theregion 12 of thebiological body 10 and thebiometric device 100 a. In other embodiments, other proper methods can be adopted to confirm the relative position, which is not limited by the disclosure. - Then referring to
FIG. 8 andFIG. 1A , in step S4, after the relative position is confirmed, at least a part of theIR LEDs 140 a are sequentially lighted and the corresponding photosensing units 122 are sequentially turned on, such that the corresponding photosensing units 122 receive the light LS to respectively generate a recognition sensing image. Thecorresponding photosensing units 122 a are turned on at the same time while, before or after theunlighted IR LEDs 140 a are sequentially lighted, which is not limited by the disclosure. - In detail, a method for sequentially lighting the
IR LEDs 140 a is, for example, to only light asingle IR LED 140 a at each time point, i.e. when one of theIR LEDs 140 a is lighted, theother IR LEDs 140 a are all turned off, though the disclosure is not limited thereto. - Finally, referring to
FIG. 8 , in step S5, the recognition sensing image is compared with the characteristic image data to output a recognition result according to a comparison result. In the present embodiment, since a method of sequentially lighting theIR LEDs 140 a is adopted to decrease an amount of data processed by theimage sensor 120 a, an image processing speed is accelerated to quickly obtain a recognition result. - Certainly, the
biometric device 100 a adopted in the aforementioned biometric method is only an example, and those skilled in the art may select to use thebiometric devices 100 b-100 h of the aforementioned embodiments according to an actual requirement. If thebiometric device 100 c ofFIG. 4A is used, since theoptical layer 130 c of thebiometric device 100 c has thelens portions 132 c, thebiometric device 100 c may provide a planar light source to decrease intensity and power consumption of theIR LEDs 140 c required in recognition illumination. -
FIG. 11 is a partial top view of a biometric device according to another embodiment of the disclosure. Referring toFIG. 11 , thebiometric device 100 h of the present embodiment is similar to thebiometric device 100 c ofFIG. 4B , and a main difference there between is that thesubstrate 110 of thebiometric device 100 h is configured with more number of theIR LEDs 140 h, where each of thephotosensing unit 122 h is surrounded by a plurality of theIR LEDs 140 h, and the light emitted by each of theIR LEDs 140 h is scattered by the region of the biological body to form the scattered light, and the scattered light is sensed by one or a plurality of thephotosensing units 122 h. - According to actual requirements, technicians of the field may add other types of sensing elements in the
biometric devices 100 b-100 h of the aforementioned embodiments, such that the functions of the biometric devices can be more comprehensive and diversified. The added sensing elements are, for example, used for sensing the biological body, sensing an environment in which the biological body is located or providing other sensing functions, which is not limited by the disclosure. - In summary, since the biometric device of the embodiment of the disclosure adopts the design of the optical layer to replace the conventional optical module with a large volume, and the surface of the optical layer is similar to a planar optical layer, the biometric device of the disclosure has an advantage of thinning tendency. Moreover, in the biometric device of another embodiment of the disclosure, the optical layer thereof has the lens portion, such that the biometric device may provide a planar light source to decrease intensity and power consumption of the IR LEDs required in subsequent recognition illumination. In addition, since the biometric method of the disclosure adopts a method of sequentially lighting the IR LEDs, the amount of data processed by the image sensor is decreased, such that an image processing speed is accelerated to quickly obtain a recognition result.
- It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the disclosure without departing from the scope or spirit of the disclosure. In view of the foregoing, it is intended that the disclosure cover modifications and variations of this disclosure provided they fall within the scope of the following claims and their equivalents.
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17/317,899 US20210264180A1 (en) | 2015-07-29 | 2021-05-12 | Biometric device and method thereof and wearable carrier |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562198645P | 2015-07-29 | 2015-07-29 | |
TW105120683 | 2016-06-30 | ||
TW105120683A TWI623766B (en) | 2015-07-29 | 2016-06-30 | Biometric device and method and wearable carrier |
US15/221,615 US20170032203A1 (en) | 2015-07-29 | 2016-07-28 | Biometric device and method thereof and wearable carrier |
US16/596,770 US11037007B2 (en) | 2015-07-29 | 2019-10-09 | Biometric device and method thereof and wearable carrier |
US17/317,899 US20210264180A1 (en) | 2015-07-29 | 2021-05-12 | Biometric device and method thereof and wearable carrier |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US16/596,770 Division US11037007B2 (en) | 2015-07-29 | 2019-10-09 | Biometric device and method thereof and wearable carrier |
Publications (1)
Publication Number | Publication Date |
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US20210264180A1 true US20210264180A1 (en) | 2021-08-26 |
Family
ID=57882667
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
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US15/221,615 Abandoned US20170032203A1 (en) | 2015-07-29 | 2016-07-28 | Biometric device and method thereof and wearable carrier |
US16/596,770 Active US11037007B2 (en) | 2015-07-29 | 2019-10-09 | Biometric device and method thereof and wearable carrier |
US17/317,899 Pending US20210264180A1 (en) | 2015-07-29 | 2021-05-12 | Biometric device and method thereof and wearable carrier |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
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US15/221,615 Abandoned US20170032203A1 (en) | 2015-07-29 | 2016-07-28 | Biometric device and method thereof and wearable carrier |
US16/596,770 Active US11037007B2 (en) | 2015-07-29 | 2019-10-09 | Biometric device and method thereof and wearable carrier |
Country Status (2)
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CN108629242B (en) * | 2017-03-24 | 2022-11-18 | 敦泰电子有限公司 | Display with biological characteristic identification function |
TWI605536B (en) * | 2017-04-12 | 2017-11-11 | 財團法人工業技術研究院 | Magnetic transfer module and method for transferring electronic element |
CN108734064A (en) * | 2017-04-20 | 2018-11-02 | 上海耕岩智能科技有限公司 | A kind of method and apparatus of iris recognition |
CN107958194B (en) * | 2017-08-17 | 2021-11-19 | 柳州梓博科技有限公司 | Photoelectric sensing device and electronic equipment |
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CN111242092A (en) | 2020-06-05 |
US11037007B2 (en) | 2021-06-15 |
US20170032203A1 (en) | 2017-02-02 |
CN106407881A (en) | 2017-02-15 |
CN106407881B (en) | 2020-07-31 |
US20200042810A1 (en) | 2020-02-06 |
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