US20200084892A1 - Micro Devices Formed by Flex Circuit Substrates - Google Patents
Micro Devices Formed by Flex Circuit Substrates Download PDFInfo
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- US20200084892A1 US20200084892A1 US16/682,082 US201916682082A US2020084892A1 US 20200084892 A1 US20200084892 A1 US 20200084892A1 US 201916682082 A US201916682082 A US 201916682082A US 2020084892 A1 US2020084892 A1 US 2020084892A1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
- B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/0015—Cantilevers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/00166—Electrodes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0075—Manufacture of substrate-free structures
- B81C99/0095—Aspects relating to the manufacture of substrate-free structures, not covered by groups B81C99/008 - B81C99/009
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0264—Pressure sensors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0292—Sensors not provided for in B81B2201/0207 - B81B2201/0285
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
- B81C2201/019—Bonding or gluing multiple substrate layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/03—Bonding two components
- B81C2203/038—Bonding techniques not provided for in B81C2203/031 - B81C2203/037
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/05—Aligning components to be assembled
- B81C2203/051—Active alignment, e.g. using internal or external actuators, magnets, sensors, marks or marks detectors
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
Abstract
Description
- This application claims priority under 35 U.S.C. § 119 to U.S. Provisional Patent Application Ser. No. 62/566,591, filed Oct. 2, 2017, and entitled “Micro Devices Formed by Flex Circuit Substrates”, the entire contents of which is hereby incorporated by reference.
- This specification relates to flexible circuitry and micro devices, such as accelerometers.
- Flex (or flexible) circuit technology is an approach for manufacturing electronic circuits by mounting electronic components on flexible plastic substrates. Various types of plastic materials can be uses such as polyimide. Other materials such as Polyether ether ketone (PEEK), PET Polyethylene terephthalate, and transparent conductive polyester may be used. Flex circuit assemblies may be manufactured using identical components used for rigid printed circuit boards. However, unlike rigid printed circuit boards, flex circuit technology allows the flex circuit board to flex or conform to a shape during use.
- Accelerometers are devices that measure “proper acceleration,” i.e., the rate of change of velocity of a body in its own instantaneous rest frame in contrast to coordinate acceleration, being the acceleration in a fixed coordinate system. Accelerometers have multiple applications in industry and science. For instance, accelerometers are used in tablet computers, hand held smart phones, digital cameras and so forth so that images on screens are always displayed upright. Single axis as well as multi-axis accelerometers are available. Micro-machined accelerometer devices are present in many portable electronic devices such as hand-held controllers, e.g. remote controls and video game controllers and are used to provide a coarse indication of changes in device position, e.g., movement.
- Generally, micro-accelerometers used in applications are discrete device components that are typically mounted on or affixed on or to a circuit board or the like to provide a finished assembly. As a discrete device component, such accelerometers add fabrication cost in producing devices that use an accelerometer. While the incremental cost of adding a discrete device components accelerometers may be a fraction of the total cost of the finished assembly, in some applications such as the consumer applications mentioned above minimizing such costs is desirable. This problem can be extended to other types of micro electro-mechanical components that are fabricated as discrete components adding incremental costs, which costs for some applications of such devices can be significant.
- According to an aspect, a circuit substrate includes a plurality of layers of one or more materials, with the plurality of layers adhered together, and with at least a first set of the plurality of layers having patterned electrical conductors thereon; and a micro electro mechanical device formed by a second set of the plurality of layers.
- Some embodiments include at least some of the plurality of layers of the material are layers comprising one or more of a rigid or a semi-rigid or a flexible material, at least some of the plurality of layers of the material are layers comprising a flexible material, wherein at least some of the layers of the second set of the plurality of layers have metal conductors over portions thereof. Some embodiments include at least some of the second set of layers of the plurality of layers have a compartment and at least some other layers of the second set of layers of the plurality of layers each have a metal conductor supported on portions of the some other layers, at least some of the second set of layers of the plurality of layers of the flexible material have a compartment and at least one of the layers of the second set of the plurality of layers has a member integrally formed from the one layer, with the member being movable within the compartment.
- Some embodiments include the second set of layers of the plurality of layers including a flexible material and the device is a micro-accelerometer sensor element. The micro-accelerometer sensor element further comprises a first electrode supported on a first layer of the second set of layers of the plurality of layers, a first spacer layer having a first compartment, the first spacer layer provided from a second layer of the second set of layers of the plurality of layers, a cantilever beam provided from a third layer of the second set of layers of the plurality of layers, the cantilever beam carrying a cantilever beam electrode, a second spacer layer having a second compartment, the second spacer layer provided from a fourth layer of the second set of layers of the plurality of layers, and a second electrode supported on a fifth layer of the second set of layers of the plurality of layers, with the cantilever beam electrode being disposed in a vertical alignment between the first and second compartments, and between portions of the first and second electrodes.
- The flexible circuit further includes a capacitance measurement circuit having a first pair of inputs coupled to the first electrode and the beam electrode and a second pair of inputs coupled to the second electrode and the beam electrode, and a controller that converts measured capacitance from the capacitance measurement circuit into a measure of acceleration. The second set of the plurality of layers of the material are layers comprising a flexible material, and the device is a micro flow sensor, with a subset of the second set of the plurality of layers of the flexible material having one or more compartments formed in portions of the subset of the second set of the plurality of layers of the flexible material and with a rotatable wheel provided from a first layer of the subset of the second set of the plurality of layers of the flexible material and supported within the compartment between second and third layers of the subset of the second set of the plurality of layers of the flexible material.
- Some embodiments include the flexible circuit wherein the second set of the plurality of layers comprise a flexible material that support a membrane layer, the device is a micro pressure sensor, and with a subset of the second set layers having compartments in portions thereof, with portions of the membrane layers supported over the compartments, and with each compartment having either an input or an output port.
- According to an aspect, a method includes forming of a flexible circuit substrate from a plurality of layers of one or more materials; and while forming the flexible circuit substrate, forming an operative, micro electro mechanical device within the flexible circuit substrate from a set of the layers of the plurality of layers of the one or more materials.
- Some embodiments include patterning a metal layer on a first layer from the set of layers to provide an electrode, forming a compartment in a first layer from the set of layers patterning a metal layer on a first layer from the set of layers to provide a first electrode, forming from a second layer from the set of layers, a moveable member that is moveable within the compartment, and patterning a metal layer on a third layer from the set of layers to provide a second electrode. The first electrode is in vertical alignment with the second electrode and functionally associated with the member that moves within the compartment. The operative device is a micro-accelerometer sensor element and the member that moves is a beam. The operative device is a micro-flow sensor and the member that moves is a rotatable wheel. The operative, micro electro mechanical device is a micro pressure sensor, and the method further includes forming a plurality of repeatable layers, by patterning first layers to provide corresponding compartments, and patterning metal layers on a like number of membrane layers to provide patterned electrodes, with the electrodes on the membrane layers disposed over respective compartments in the first layers; and stacking the plurality of repeatable layers.
- According to an aspect, a micro-accelerometer sensor element device formed within a flexible circuit substrate comprised of a plurality of layers of a flexible material, is formed by a process including patterning a metal layer that is on a first one of the plurality of layers of flexible material to provide a first electrode, patterning at least one metal layer that is on a second one of the plurality of layers of flexible material to provide a cantilever beam electrode, forming from the second one of the plurality of layers of flexible material, a compartment and a cantilever beam that supports the cantilever beam electrode, with the cantilever beam electrode having a portion thereof in a vertical alignment with a portion of the first electrode; and patterning a metal layer that is on a third one of the plurality of layers of flexible material to provide a second electrode, with the second electrode in vertical alignment with the first electrode and the cantilever beam electrode.
- According to an aspect, a method of providing an operative device embedded within a flexible circuit substrate comprised of a plurality of layers of a flexible material, includes patterning a metal layer that is on a first one of the plurality of layers of flexible material to provide a first electrode, patterning at least one metal layer that is on a second one of the plurality of layers of flexible material to provide a cantilever beam electrode, forming from the second one of the plurality of layers of flexible material, a compartment and a cantilever beam that supports the cantilever beam electrode, with the cantilever beam electrode having a portion thereof in a vertical alignment with a portion of the first electrode, and patterning a metal layer that is on a third one of the plurality of layers of flexible material to provide a second electrode, with the second electrode in vertical alignment with the first electrode and the cantilever beam electrode.
- Some embodiments include the operative device is a micro-accelerometer sensor element. The method further includes forming a first spacer layer between the first and second layers, and forming a second spacer layer between the second and third layers, and with the first and second spacer layers each having a compartment over which the respective first and second electrodes are supported.
- The accelerometers described herein are fabricated using micro fabrication methods that allow the accelerometers to be produced within micro fabrication flexible circuit substrates, as part of the construction of the flexible circuits themselves, at a nominal (e.g., potentially insignificant) incremental cost that avoids much of the incremental costs associated with discrete accelerometer devices, e.g., the cost of the device, costs in mounting the device, and costs incurred by the discrete device occupying physical space on the flexible circuit.
- The described accelerometers can sense changes in orientation for a variety of applications especially consumer applications. The accelerometers described below are fabricated using reasonably inexpensive techniques and thus provide inexpensive accelerometers built into such flexible circuit substrates. In particular embodiments, the accelerometers described below are fabricated using roll to roll manufacturing techniques.
- The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the invention are apparent from the description and drawings, and from the claims.
-
FIG. 1 is an isometric view of an accelerometer sensor element device that is shown in isolation, but which is built within a flexible circuit substrate from layers of the flexible circuit. -
FIG. 2 is an isometric view of a flexible circuit substrate having the accelerometer sensor element device ofFIG. 1 . -
FIG. 2A is an isometric magnified view of a portion of the accelerometer sensor element device ofFIG. 2 . -
FIGS. 3A-3D are isometric views of the flexible circuit substrate in various stages of construction of the accelerometer sensor element device ofFIG. 1 fabricated from layers of the flexible circuit substrate. -
FIGS. 4A-4D are plan views of an alternative configurations of beams with corresponding electrode patterns. -
FIG. 5 is an isometric view of a micro-accelerometer system including the accelerometer sensor element device showing capacitance measurement circuitry. -
FIG. 5A is a cross-sectional view of the accelerometer sensor element device ofFIG. 5 , but not showing the capacitance measurement circuitry. -
FIG. 6A is a cross-sectional view of a micro pressure sensor device fabricated as part of a flexible circuit substrate. -
FIG. 6B is a perspective view ofFIG. 6A . -
FIG. 7 is a plan view of a micro flow sensor device fabricated as part of a flexible circuit substrate. -
FIGS. 8A and 8B are plan and cross-sectional views showing inlets and outlets or fluid couplings that are surface mounted on a flexible circuit substrate. -
FIG. 9 depicts a flow diagram. - Micro-accelerometer sensor elements (micro-accelerometer sensor elements) are built into flexible layers of a flexible circuit (flex-circuit) are described herein and are made using micro fabrication methods. The micro-accelerometer sensor elements can be used for sensing changes in orientation or motion in various applications including consumer device applications. The micro-accelerometer sensor elements are fabricated on a micron/millimeter scale. Several fabrication techniques are disclosed. Also disclosed are other micro devices that are built into and fabricated from layers of flexible circuits. As used herein “layer” is generally used to refer to a portion of a flexible circuit, whereas “sheet” is used to refer to a bolt of material that is used in forming flexible circuit assemblies. However, use of layers or sheets would be acceptable and understood from context of the description.
- Referring to
FIGS. 1 and 2 , amicro-accelerometer sensor element 10 is fabricated as part of and during fabrication of a flex-circuit substrate 20 (FIG. 2 ). The micro-accelerometer sensor element 10 (shown inFIG. 1 in isolation but inFIG. 2 as integrally formed from the flex circuit substrate 20) includes aframe 12 that houses acantilever beam 13 that acts as a reference or proofing mass. Theframe 12 surrounds acompartment 14 within which thecantilever beam 13 extends. The cantileveredbeam 13 is integrally formed as part of theframe 12. Thecantilever beam 13 carries one or two electrodes, e.g.,electrode 15 a, as shown on a topside of thecantilever beam 13, and could carry an electrode on the bottom side (not shown). Thecantilever beam 13 is suspended in thecompartment 14 and between twoelectrodes frame 12. - Referring to
FIG. 2 , themicro-accelerometer sensor element 10 is fabricated within theflexible circuit substrate 20 comprisingflexible layers 20 a-20 g (provided from sheets of material(s) seeFIG. 9 ), which provide aflexible circuit 11. In one implementation, theflexible circuit 11 is defined as the combination of plural flexible layers, including thelayers 20 a-20 g, optionally other devices (not shown), and themicro-accelerometer sensor element 10. In another implementation, theflexible circuit 11 consists essentially of the combination of plural flexible layers, including thelayers 20 a-20 g, other devices (not shown), and themicro-accelerometer sensor element 10. In still another implementation, theflexible circuit 11 consists of the combination of plural flexible layers, including thelayers 20 a-20 g and themicro-accelerometer sensor element 10. - Typically, the
layer 20 a and thelayer 20 g serve as lower and upper boundary layers (e.g., caps) for themicro-accelerometer sensor element 10. Themicro-accelerometer sensor element 10 is formed from asecond layer 20 b of theflexible circuit substrate 20, athird layer 20 c, afourth layer 20 d, afifth layer 20 e, andsixth layer 20 f, as illustrated inFIG. 2 . Thus, thefirst layer 20 a and theupper layer 20 g of theflexible circuit substrate 20 contain or provide boundaries to themicro-accelerometer sensor element 10 within theflexible circuit substrate 20. More layers (not shown) can be provided above or below layers 20 a and 20 f, as the needs of theflexible circuit substrate 20 require. Theupper layer 20 g is shown partially broken away. - Although not explicitly illustrated in
FIG. 2 , some of thelayers 20 a-20 g are actually two layers, a body layer from which a frame or body is defined and a metalized film layer. In some implementations, some of theselayers 20 a-20 g can include a body layer and a membrane layer having a metalized film layer from which an electrode is defined. Also not explicitly illustrated inFIG. 2 , in some implementations of thelayer 20 d thelayer 20 d is actually a composite layer of a body layer from which thecantilever beam 13 is defined, and which has two metalized surface film layers (not shown) from which theelectrode 15 a is defined. - The
micro-accelerometer sensor element 10 is of a capacitive type that converts mechanical energy into an electrical signal(s). The details of techniques to construct themicro-accelerometer sensor element 10 and details of various configurations of micro-accelerometer sensor elements will be discussed below. Prior to that discussion, some principals of operation will be discussed first. - During application of an external acceleration, the proof mass which in
FIG. 1 is thecantilever beam 13, deflects from a neutral position (e.g., a center position betweenelectrodes electrodes electrode 15 a on the cantilevered beam 13 (proof mass). The cantileveredbeam 13 as the proof mass has a known quantity of mass. During the application of an external acceleration, thecantilever beam 13 deflects. This deflection is measured by changes in capacitance between two capacitors C1 and C2. One of the capacitors C1 is formed between theelectrode 15 a carried by the cantileveredbeam 13 and fixedelectrode 17 a and the other capacitor C2 is formed between theelectrode 15 a carried by the cantileveredbeam 13 and fixedelectrode 17 b (or if thecantilever beam 13 has anelectrode 15 b as shown inFIG. 2A , then betweenelectrode 15 b andelectrode 17 b). These changes in capacitance are used to detect changes in position, e.g., movements of thecantilever beam 13 and concomitant therewith detect an application of an external acceleration. - In some implementations, the
compartment 14 is a sealed compartment that include a gas (e.g., air) that acts as a damping agent. In other embodiments, thecompartment 14 is a sealed compartment at a near vacuum pressure or at least a reduced pressure. - Referring now to
FIGS. 3A to 3D , themicro-accelerometer sensor element 10 is shown in various stages of construction. -
FIG. 3A shows themicro-accelerometer sensor element 10 ofFIG. 1 (at a stage of construction). Themicro-accelerometer sensor element 10 is formed from thesecond layer 20 b and thethird layer 20 c of theflexible circuit substrate 20 at this stage of construction. Thesecond layer 20 b carries theelectrode 17 a and thethird layer 20 c is a spacer layer having acompartment 23 a. - The
second layer 20 b is a layer of a flexible material having a metalizedsurface layer 20 b′ on a surface thereof from which theelectrode 17 b is patterned. In some implementations this electrode can be interconnected to other interconnects of theflexible circuit substrate 20. In some embodiments, thelayer 20 b can have a membrane layer (not shown) that has a metal layer over a first major surface thereof. Themetal layer 20 b′ on thesecond layer 20 b is patterned to provide theelectrode 17 b (and electrical interconnects (not shown) to thatelectrode 17 b). (Themetal layer 20 b′ is generally completely removed except on theelectrode 17 b and electrical interconnects). - The
compartment 23 a is formed in thethird layer 20 c also of the flexible material of theflexible circuit substrate 20, (here illustrated as immediately above thelayer 20 b). Not shown inFIG. 3A is thebottom layer 20 a (FIG. 1 ). Thethird layer 20 c defines aportion 12 a of the frame 12 (FIG. 1 ) that has four walls (not referenced). Theframe portion 12 a defines aportion 23 a of the compartment 14 (FIG. 1 ). -
FIG. 3B shows the micro-accelerometer sensor element 10 (at a subsequent stage of construction) having aportion 12 b of the frame 12 (FIG. 1 ) having four walls (not referenced). Theframe portion 12 b defines acompartment 23 b. Thefourth layer 20 d of the flexible material is patterned to form theframe portion 12 b, thecompartment 23 b, and thecantilever beam 13 having theelectrode 15 a. Thefourth layer 20 d of the flexible material carries at least one, but could carry twometal layers 20 d′, 20 d″ (to provide one or bothelectrodes cantilever beam 13 and conductors. Theframe portion 12 b, thecompartment 23 b, and thecantilever beam 13 features are formed by selective removal of portions of thefourth layer 20 d and portions of the metal layers 20 d′ and/or 20 d″. InFIG. 3B , all of the metal layers 20 d′ 20 d″ are shown as removed, except on thecantilever beam 13 and part of theframe portion 12 b. Electrical conductors (not shown) can be patterned from portions of themetal layer 20 d′. -
FIG. 3C shows the micro-accelerometer sensor element 10 (at the stage of construction ofFIG. 3B ) from an underside of thecantilever beam 13, formed as discussed above fromlayer 20 d andmetal layer 20 d″ patterned to provide theoptional electrode 15 b. -
FIG. 3D shows thefifth layer 20 e and thesixth layer 20 f of theflexible circuit substrate 20. Thefifth layer 20 e is a spacer layer having acompartment 23 c and the sixth layer carries theelectrode 17 a. Thefifth layer 20 e defines aportion 12 c of the frame 12 (FIG. 1 ). Thesixth layer 20 f is a layer of a flexible material having a metalizedsurface layer 20 f ′ on a surface thereof from which theelectrode 17 a is patterned. Thecompartment 23 c is formed in thefifth layer 20 e also of the flexible material of theflexible circuit substrate 20. (InFIG. 3D all of themetal layer 20 f′ is shown as removed, except on theelectrode 17 a, but conductors not shown could be patterned from thelayer 20 f.) Compartments 23 a-23 c andframe portions 12 a-12 c provide respectivelycompartment 14 andframe 12 of the micro-accelerometer sensor element 10 (FIG. 1 ). - Referring to
FIGS. 4A-4D , alternative configurations of beams 13 (FIG. 1 ) for themicro-accelerometer sensor element 10 are shown. Each of these configurations would include pairs or set of electrodes above and below the beams, similar in pattern to thebeam -
FIG. 4A shows atorsional beam 13 a that has an electrode (not referenced), and which beam is susceptible to bending and thus could detect bending accelerations (e.g., rocking type movements). -
FIG. 4B shows corresponding electrodes (generally 17′) that would be in alignment with the electrodes on thebeam 13 a and on layers (not shown) that were above and below thebeam 13 a ofFIG. 4A . Capacitances are measured between each end region of thebeam 13 a and pairs of corresponding electrodes that are above and below thebeam 13 a. -
FIG. 4C shows abeam 13 b with four physically spaced electrodes (not referenced) that are electrically isolated from each other and that are suspended from four corners of a body that could detect accelerations in three dimensions, i.e., movement and orientation. -
FIG. 4D shows corresponding electrodes (generally 17″) and conductors (not referenced) that would be on layers (not shown) above and below the four physically spaced electrodes of thebeam 13 b ofFIG. 13C . Capacitances would be measured between each of the four physically spaced electrodes and pairs of corresponding electrodes above and below the four physically spaced electrodes of thebeam 13 b. - Referring now to
FIG. 5 , a completed micro-accelerometer sensor element 10 (shown isolated, but understood to be fabricated as part of the describe flexible circuit) is coupled to capacitance measurement circuitry to provide amicro-accelerometer system 19. Thecantilever beam 13 havingelectrodes electrodes electrodes capacitance measurement circuit 30 that delivers voltages to the electrodes 15 a-15 b and 17 a-17 b according to the type of capacitance measurement circuit employed. In some examples of themicro-accelerometer system 19, thecapacitance measurement circuit 30 uses an AC waveform and the capacitances are measured using frequency domain techniques. In other examples of themicro-accelerometer system 19, thecapacitance measurement circuit 30 uses a DC waveform to measure capacitances using time domain techniques. - In some examples, the
capacitance measurement circuits 30 are provided within theflexible circuit substrate 20. In other examples, thecapacitance measurement circuits 30 can be very simple circuits and are provided on theflexible circuit substrate 20 after fabrication. In many instances, thecapacitance measurement circuits 30 could be provided as part of the fabrication of the circuitry that theflexible circuit 11 carries and such capacitance measurement circuits would make the appropriate electrical contact to the device, e.g., the accelerometer. - Referring to
FIG. 5A , a cross-sectional view of a typical arrangement of a completed micro component, such as theaccelerometer 10, is shown built between flexible circuit layers (20 a and 20 g) of theflexible circuit substrate 20. Theaccelerometer 10 is shown built fromlayers 20 b-20 f. Also shown onlayers respective electrodes electrodes electrode 17 b. Therespective electrodes FIGS. 3A-3D ). Thus, as also shown inFIG. 5A , thecantilever beam 13 is free to flex within thecomposite compartment 14 that is formed from the compartments 23 a-23 c defined by frame 12 (provided fromframe portions 12 a-12 c shown inFIGS. 3A, 3B and 3D ). - When the
micro-accelerometer sensor element 10 is at rest thecantilever beam 13 is in a nominal position (generally centered between theelectrodes device 10. Nominal capacitances are measured betweenelectrodes electrodes optional electrode 15 b, nominal capacitances are measured betweenelectrodes electrodes - The
electrodes layers cantilever beam 13 formed inlayer 20 c can flex due to an acceleration applied to thedevice 10. As thecantilever beam 13 flexes one of itselectrodes electrodes electrodes electrodes electrodes electrodes cantilever beam 13 cause changes in capacitance betweenelectrode electrode - A capacitance characteristic is provided by a pair of adjacent electrodes that are separated by a dielectric, e.g., dielectric property of the membrane (if provided) the dielectric of the beam, and air, and distances between the
cantilever beam 13 and each of theelectrodes electrodes -
C=ε rε0 A/d, where - C is the capacitance, in farads;
- A is the area of overlap of the two electrodes, in square meters;
- εr is the dielectric constant of the material between the electrodes (sum of dielectric constants of a membrane and fluid);
- ε0 is the electric constant (ε0≈8.854×10−12 F·m−1); and
- d is the separation between the plates, in meters. where d is sufficiently small with respect to A.
- A controller (not shown) that is either part of the capacitance measurement circuit or a separate circuit references a table/algorithm to convert measured capacitance units into units of rates of change in velocity based on a characterization of the
structure 10. Many techniques can be used to measure and detect changes in such capacitance over a nominal bulk capacitance provided by themicro-accelerometer sensor element 10 while in a rest condition and characterize these changes. - In some embodiments, the thicknesses of each of the
layers 20 b-20 f is about 50 microns. Thus, the distances between theelectrodes cantilever beam 13 in its nominal positions is about 50 microns (thickness ofspacer layer 20 e). As an example, themicro-accelerometer sensor element 10 can have a length of about 1.5 mm, a width of about 1.5 mm, a total height (the cumulative height ofdifferent layers 20 b-20 f of 250 microns (0.25 mm). Other configurations are possible. Other thickness ranges are also possible. Generally, the thicknesses of each of the layers, as well as other layers that provide theflex circuit 20 can be of conventional thicknesses used for such circuit substrates, and more particularly between 25 microns and 250 microns per layer, and any sub-range within that range. In general, actual thickness would be application specific. - Compared to a conventional accelerometer used for similar purposes, the
micro-accelerometer sensor element 10 may use less material, and thus is subject to less stress. Themicro-accelerometer sensor element 10 has a size in the micron to millimeter scale and is built within theflex circuit substrate 20 as part of the fabrication of theflex circuit substrate 20, and can be fabricated during the fabrication of other elements, such patterned conductors that are used to form electrical interconnects. Other types of discrete devices may be inserted into theflex circuit substrate 20. - Characteristics
- Body layers (layers)—The material used for the
layers 20 a-20 g may be defined by the requirements of the flexible circuit and the device formed from those layers. In general, the material needs to be strong or stiff enough to hold its shape to produce the compartment. In some implementations, the material is etchable or photo sensitive so that its features can be defined and machined/developed. Sometimes it is also desirable that the material interact well, e.g., adheres, with the other materials in the sensor. Various thicknesses can be used for the layers, according to the application of the flexible circuit. Discussed herein is an exemplary thickness of 50 microns. However, the thicknesses of the layers can vary from microns to microns to millimeters to millimeters in thickness depending on the specific requirements of theflexible circuit 19. - Membrane (optional)—The membrane material is impermeable to the fluids of interest, including gas and liquids, is electrically non-conductive, and can have either a low or a high breakdown voltage characteristic. Examples of suitable materials include silicon nitride, PET, and Teflon. Others are possible.
- Electrodes—The material of the electrodes is electrically conductive. Because the electrodes do not conduct significant amounts of current, the material can have a high electrical sheet resistance, although the high resistance feature is not necessarily desirable. The electrodes are subject to bending, and therefore, it is desirable that the material is supple to handle the bending without fatigue and failure. In addition, the electrode material and the membrane material adhere well, e.g., do not delaminate from each other, under the conditions of operation. Examples of suitable materials include very thin layers of gold and platinum. Others are possible.
- Electrical interconnects—The voltages from the capacitance measurement circuits are conducted to the electrode on each membrane of each compartment. Electrically conducting paths to these electrodes can be built using conductive materials, e.g., gold and platinum and can be patterned from the metalized films.
- Other materials—when MEMS processing is used in manufacturing the micro pressure sensor, a sacrificial filling material, e.g., polyvinyl alcohol (PVA), can be used. The sacrificial filling material may also be used in R2R processing. In some implementations, solvents are used in the manufacturing process, which may place additional requirements on the various materials of the micro accelerometer. It may be possible to print some of the electrical circuit components onto the membranes. In general, while certain materials have been specified above, other materials having similar properties to those mentioned could be used.
- Other examples are possible. For example, the
device 10 could be apressure sensor 40. - Referring to
FIGS. 6A and 6B , amicro pressure sensor 40 includes a single compartmentalizedpressure sensor chamber 50. Themicro pressure sensor 40 also includes asensor body 41 having twowalls FIGS. 1-4 ) that are orthogonal to two fixed end walls (i.e., end caps) 46 a, 46 b that are opposite to each other along a direction perpendicular to the fluid flow direction. Thewalls single chamber 50. Thesingle chamber 50 is compartmentalized by membrane layers (membranes) 48 a-48 f. Membranes 48 a-48 f are anchored between the twoend walls chamber 50 into plural compartments 51 a-51 g. A first set of ports 42 a-42 c are disposed throughwall 43 a for fluid access into each of compartments 51 b, 51 d and 51 f, respectively. A second set ofports 14 a-14 d, are disposed throughwall 43 b for fluid access into each ofcompartments compartment 41 a-41 b includes a port either from the first set of ports 42 a-42 c or from the second set of ports 44 a-44 d, but not both, defined in the respective walls. For example, thecompartment 51 a includes theport 44 a in thewall 43 b, whereaswall 43 a in the region ofcompartment 51 a is solid, without any opening. - The
device 40 would present a single input port and output port to the first set of ports 42 a-42 c and the second set of ports 44 a-44 d, from/to different exterior environments. Details of a micro pressure sensor fabricated as an individual component is set out in U.S. patent application Ser. No. 15/668,837, filed Aug. 8, 2017 the entire contents of which are incorporated herein by reference. - In fabricating the
micro pressure sensor 40 as part of the fabrication of a flex circuit substrate 60, thesensor body 41 is fabricated from module layers (as disclosed in the incorporated by reference patentFIGS. 4-7 ). The module layers would be comprised of layers of the flexible material 62 a-62 g that is patterned to provide the compartments 51 a-51 g and membrane layers 64 a-64 f having metalized surfaces 66 a-66 g on the membrane layers 64 a-64 f, which surfaces are patterned to provide the electrodes (not referenced) on the membranes 48 a-48 f. Ports 44 a-44 d are shown staggered. - Referring to
FIG. 7 , another example of a device fabricated from a flex circuit substrate is amicro flow sensor 70, shown in a final stage of construction (but with membranes (not referenced) andelectrodes micro flow sensor 70 has a single circularflow sensor chamber 72 defined by walls 74 a-74 d,ports wheel 76 that is rotatable about a fixedaxle 78. Bridge members (not shown) were used to tether thewheel 76 to a flow sensor body 74 during fabrication, and another set of bridge members (not shown) were used to tether theaxle 78 to thewheel 76 during fabrication. With the bridges removed, thewheel 76 is free to rotate about the fixedaxle 78. Thewheel 76 haspaddles 76 b and an interrupter feature 82 (asymmetric metal layer on the wheel (other types of interrupters could be used). Details of a micro pressure sensor fabricated as a component are set out in U.S. Patent App. 62/541,128, filed Aug. 4, 2017 the entire contents of which are incorporated herein by reference. - A capacitance measurement circuit (not shown, but similar in concept to that used for the micro accelerometer 10) is attached to electrodes of the
micro flow sensor 70. The capacitance measurement circuit delivers voltages to the electrodes according to the type of capacitance measurement circuit employed. In some examples of a capacitance measurement circuit an AC waveform can be used and the capacitance is measured using frequency domain techniques. In other examples of a capacitance measurement circuit a DC waveform is used to measure capacitance using time domain techniques. The capacitance measurement circuit delivers an output train of pulses that is proportional to the capacitance measured. A controller (not shown) converts these pulses to a capacitance value that is translated to a flow rate and flow direction. The output will be a value that represents the bulk capacitance between theelectrodes wheel 76 and themetal layer 82 cutting into and out of a region of overlap with theelectrodes - Referring now to
FIGS. 8A and 8B , various ones of the layers used in construction of the respective devices ofFIGS. 6A, 6B and 7 are also layers used for fabrication of theflexible circuit 11 from theflexible circuit substrate 20. For fluid ingress and egress devices (e.g., thedevice 40 or thedevice 70 ofFIGS. 6A and 7 ), these devices could presentports single input port 85 a and asingle output port 85 b from/to different exterior environments for fluid flows into and out of the devices (40, 70) viaslots inlets 85 a andoutlets 85 b would be provided on other layers of theflexible circuit 11 to connect thedevice 40 or thedevice 70 from/to the different exterior environments. - Processing for Producing Micro-Accelerometer Sensor Elements
- Referring to
FIG. 9 , aspects of processing 90 aflexible circuit substrate 20 to produce an embedded device from the layers of theflexible circuit substrate 20, as suchflexible circuit 11 is being constructed are shown. InFIG. 9 , discussed are details of fabrication of themicro-accelerometer sensor element 10 as illustrative example. - Initially, the
layer 20 a is provided 91 from a sheet (not shown) of material. In someembodiments 20 a can be part of an initial layer of the embedded device. - A
layer 20 b of aflexible material 50 micron thick sheet (not shown) of material having a metalized 100 Angstrom thick surface layer is provided overlayer 20 a. The sheet of material forlayer 20 b will be patterned to carry theelectrode 17 b. For the particular implementation the material oflayer 20 b is polyethylene terephthalate (PET). Other materials could be used. The metalized 100 Angstrom thick surface layer of Al is patterned 92 to provide theelectrode 17 b and conductors or conductive contacts to theelectrode 17 b, as needed. A direct write or a mask is used to configure a laser ablation station to remove the metal from areas of thelayer 20 b. - The
layer 20 c such as a non-metalized 50 micron thick sheet (not shown) of flexible material is patterned 94 to formcompartment 23 a in themicro-accelerometer sensor element 10 by micro-machining using a mask (not shown) or direct write to configure a laser ablation station to define or form thecompartment 23 a, as discussed inFIG. 5A . Vias are also provided for electrical connections (not shown). The micro-machining ablates away the flexible plastic material to form thecompartment 23 a. - The
layer 20 d of flexible material such as a single sided or dual sided metalized 50 micron thick sheet (not shown) is patterned 96 to form one or twoelectrodes micro-accelerometer sensor element 10, which regions will correspond to conductors, e.g., theelectrodes FIG. 3B ) on thecantilever beam 13 and a portion of the body layer (and other conductors if the layer is an active involved with other features/devices of the flex circuit substrate 20). Also, while not shown, themetal layer 42 a may also be patterned to provide conductors or conductive contacts to theelectrodes 15 a (and 15 b). - The
layer 20 d is provided by micro-machining 98 the sheet, using a mask (not shown) or direct write to configure a laser ablation station to define or form thecompartment 23 b and thecantilever beam 13. Vias are also provided for electrical connections. The micro-machining ablates away the material of the sheet that provideslayer 20 d to form thecompartment 23 b that is part of thecompartment 14 in thelayer 20 d, and provide the cantilever beam 13 (FIG. 3B ). - The
layer 20 e such as a non-metalized 50 micron thick sheet (not shown) of flexible material is patterned 100 to formcompartment 23 c in themicro-accelerometer sensor element 10 by micro-machining using a mask (not shown) or direct write to configure a laser ablation station to define or form thecompartment 23 c as discussed inFIG. 5A . Vias are also provided for electrical connections (not shown). The micro-machining ablates away the flexible plastic material to form thecompartment 23 c. - The
layer 20 f of material is provided from a 50 micron thick sheet (not shown) that has a metalized 100 Angstrom thick surface layer that will carry theelectrode 17 a. For the particular implementation the material oflayer 20 f is polyethylene terephthalate (PET). Other materials could be used. The metalized 100 Angstrom thick surface layer of Al is patterned 102 to provide theelectrode 17 a and conductors or conductive contacts to theelectrode 17 a, as needed. A mask (not shown) or direct write is used to configure a laser ablation station to remove the metal from areas of thelayer 20 f. - Cap layers or other layers, e.g., the
layer 20 a and thelayer 20 g are provided from sheets (not shown) of a flexible material are provided 104 over the now completeddevice 10. -
Layers 20 a-20 g can be metalized (or non-metalized as needed) 50 micron thick layers having (as needed) a 100 Angstrom thick surface layer of a metal e.g., Al. For the particular implementation above, the material is polyethylene terephthalate (PET). Other materials could be used. - All layers of the flex-
circuit substrate 20 including thelayers 20 a-20 g are laminated 104 together using conventional flex circuit substrate fabrication techniques. Each of thelayers 20 a-20 g are machined to provide alignment holes (not shown). Thelayers 20 a-20 g are laminated together to form the embedded device, such as themicro-accelerometer sensor element 10, fabricated as part of fabrication of theflexible circuit 11. For other devices, such as thepressure sensor 40, the fabrication steps will vary, depending on the nature of the device. - In general, such devices will have some fabrication features in common. These devices are micro-electro-mechanical (MEMS) devices formed within the flex circuit substrate, by being formed from the layers that provide the flex circuit substrate. At least some of the layers are patterned to form one or more apertures or compartments in the respective layers. At least some of the layers are patterned to form electrodes on the respective layers. In some examples of these devices, membrane layers are used to support electrodes (e.g., some examples of the
accelerometer 10, thepressure sensor 40 and the flow sensor 70). In some examples, the membrane layers themselves are expected to flex (e.g., the pressure sensor 40) or elements are expected to move or rotate (e.g., the wheel in the flow sensor 70). In general, pairs of such electrodes are disposed in a functional relationship with a dielectric to provide capacitors, whose capacitances are measured to provide an indication of the performance of the device. The micro-electro-mechanical (MEMS) devices fabricated as part of the flex circuit substrate perform specific functions, such measuring of physical properties or performing a mechanical action, etc. - The
layers 20 a-20 g can also be laminated between a pair of prefabricated sealing layers disposed on both sides of the layers. The sealing layers can be 50 micron layers. The prefabricated sealing layers are patterned to cut electrode access notches for electrical connections or vias. In other techniques, each of thelayers 20 a-20 g are processed to cut alignment pin holes (not shown) that are used to position thelayers 20 a-20 g in a fixture and cut stitches that are used to singulatemicro-accelerometer sensor element 10 from layer arrays. - The above technique can also use a machine vision system to produce a data file that is used by the laser ablation system in aligning a laser ablation station with a mask (or direct write) such that a laser beam from the laser ablation system provides features according to the mask used in registration with the corresponding portions of the bodies, as discussed. The electrodes are formed by ablating away the metal in regions that are not part of the electrodes and conductors, leaving isolated electrodes and conductors on the layer.
- The
layers 20 a-20 g of flexible material can be polyethylene terephthalate (PET). Other materials could be used. In some implementations, some thinning of features to accommodate variations in thicknesses among the various layers or to accommodate features of particular devices may be performed. The processing line can comprises several stations, (not shown) and in general can use otherwise conventional flexible circuitry fabrication techniques, as otherwise modified as discussed herein. - Processing viewed at a high level thus can be additive (adding material exactly where wanted) or subtractive (removing material in places where not wanted). Deposition processing includes evaporation, sputtering, and/or chemical vapor deposition (CVD), as needed, as well as printing. The patterning processing can include depending on requirements techniques such as scanning laser and electron beam pattern generation, machining, optical lithography, mask and flexographic (offset) printing depending on resolution of features being patterned. Ink jet printing and screen printing can be used to put down functional materials such as conductors. Other techniques such as punching, imprinting and embossing can be used.
- In some embodiments, roll to roll processing can be used to fabricate the micro-electro-mechanical (MEMS) devices, such as the
micro-accelerometer sensor element 10. These techniques can use a web of flexible material can be any such material and is typically glass or a plastic or a stainless steel. While any of these materials (or others) could be used, types of plastics have advantages of lower cost considerations over glass and stainless steel. Specific materials will be determined according to the application of the micro-accelerometer sensor element 10 (or the other devices). In high temperature applications materials such as stainless steel or other materials that can withstand encountered temperatures would be used, such as Teflon and other plastics that can withstand the encountered temperatures. - For the structures shown in
FIGS. 1-8B , stations within a roll to roll processing line are set up according to the processing required. Thus, while the end cap and top caps could be formed on the web or plastic sheet in one implementation the end and top caps are provided after formation of themicro-accelerometer sensor element 10. - In some implementations, the plastic web is used to support the body by a deposition of material on the web at a deposition station followed by patterning station. The body is formed at a forming station. The web having the body has a membrane deposited over the body at a station. An alternative roll to roll processing approach to provide the
micro-accelerometer sensor element 10 has the raw sheet (or multiple raw sheets) of material passed through plural stations to have features applied to the sheet (or sheets) and the sheet (or sheets) are subsequently taken up to form parts of the repeatable composite layers to ultimately produce a composite sheet of fabricatedmicro-accelerometer sensor element 10. - Via conductors are used to interconnect the patterned electrodes on
micro-accelerometer sensor element 10. The via conductors are castellated structures, i.e., with relatively wide areas contacting electrode tabs and relatively narrow areas through holes in the electrode. This arrangement is provided by having the holes in the body portions larger than the holes through the electrode portions. This can be accomplished during the patterning stages of the body and the electrodes respectively. The via conductors are formed by introduction of the conductive inks mentioned above into the holes. - Elements of different implementations described herein may be combined to form other embodiments not specifically set forth above. Elements may be left out of the structures described herein without adversely affecting their operation. Furthermore, various separate elements may be combined into one or more individual elements to perform the functions described herein.
- Other embodiments are within the scope of the following claims. For example, in some implementations, three layers could be used to provide the micro accelerometer. A first layer would have a compartment on the bottom of which would be the first electrode, a second layer would have a compartment that supports within the compartment the cantilever beam carrying the beam electrode, and a third layer would have a compartment on the bottom of which would be the second electrode. This could avoid the need for the spacer layers, as shown in
FIG. 5A . - Other modifications include using the principles described herein to provide hybrid constructed circuit substrates on rigid (so called rigid-flex circuits) and semi-rigid circuit substrates, in addition to flexible circuit substrates. Excluded are single crystalline semiconductor substrates. Thus, suitable materials include polyester (PET), polyimide (PI), polyethylene naphthalate (PEN), polyetherimide (PEI), various types of fluropolymers (FEP) and copolymers, in addition to other materials commonly used for rigid, semi-rigid circuit and flexible circuit substrates. In some embodiments adhesives are used as a bonding medium to laminate layers together. Adhesive can be of various polymer materials such as thermoplastic polyimide adhesives. Both base layers and adhesive layers can be of many different thickness that is typically governed by the specific use of the flex or semi-flex or rigid circuit substrate.
Claims (27)
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US10512164B2 (en) * | 2017-10-02 | 2019-12-17 | Encite Llc | Micro devices formed by flex circuit substrates |
US11711892B2 (en) * | 2019-07-15 | 2023-07-25 | Velvetwire Llc | Method of manufacture and use of a flexible computerized sensing device |
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US10512164B2 (en) | 2019-12-17 |
CN111989545A (en) | 2020-11-24 |
AU2018345552A1 (en) | 2020-04-23 |
US20190104616A1 (en) | 2019-04-04 |
EP3692335A4 (en) | 2020-12-30 |
CA3078361A1 (en) | 2019-04-11 |
EP3692335A1 (en) | 2020-08-12 |
WO2019070557A1 (en) | 2019-04-11 |
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