US20190174630A1 - Burned-in Component Assembly - Google Patents
Burned-in Component Assembly Download PDFInfo
- Publication number
- US20190174630A1 US20190174630A1 US15/889,003 US201815889003A US2019174630A1 US 20190174630 A1 US20190174630 A1 US 20190174630A1 US 201815889003 A US201815889003 A US 201815889003A US 2019174630 A1 US2019174630 A1 US 2019174630A1
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- US
- United States
- Prior art keywords
- components
- adhesive
- burned
- compartments
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- B32—LAYERED PRODUCTS
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- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
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- B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
- B32B37/153—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is extruded and immediately laminated while in semi-molten state
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Definitions
- the present invention relates to the field of solderless assembly of packaged components, sometimes known as an Occam process.
- the present invention is an improvement on an Occam process generally described in U.S. Pat. No. 7,926,173, a grandparent of the present application, which is expressly incorporated by reference. That patent describes the process of placing components on a flexible substrate, adhering the components to the substrate with an insulating material, placing a component support fixture over the components to support them while processing the flexible substrate to provide electrical connections to the components.
- the components support may be temporary or it may be removed.
- component support fixture described in the aforementioned patent contains “compartments” of various sizes for different size components, there is no consideration of how to accommodate particular components that have ranges of sizes. If a component is too large in the vertical direction, for example, the component support fixture will not entirely fit over the component such that the support itself will not contact the flexible substrate it is intended to support during subsequent processing of the flexible substrate.
- the invention comprises providing component-receiving compartments in the component support fixture of slightly larger dimensions than the largest dimension of the particular type of component.
- Invention further provides adhesively bonding the component support fixture to the components using an applied adhesive.
- the invention further provides a vent hole or aperture into the compartment whereby excess adhesive may be extruded through the vent hole or aperture in the case of oversized components.
- the invention further provides that components be placed on an adhesive substrate, rather than being adhered to an otherwise non-adhesive substrate via a post-placement adhesive (insulating material). Suitable tooling holes may be employed in the adhesive substrate to better locate the placement of the components.
- the component support fixture comprises a machined or molded lid for both housing in compartments the components and for adhesively supporting the adhesive layer on a machined surface for subsequent processing of the adhesive layer in an Occam process.
- the substrate adhesive itself may be anisotropically conductive, such that a foil, adhered to the adhesive, may be patterned into conductive traces as provided by co-pending parent U.S. patent application Ser. No. 12/170,426 filed Jul. 9, 2008, which is hereby incorporated by reference.
- FIG. 1 illustrates a first step in the process showing to components of two different vertical dimensions before their placement on an adhesive substrate.
- FIG. 2 illustrates a further step in the process wherein adhesive is placed on top of the components after they have been placed on the adhesive substrate.
- FIG. 3 illustrates a further step in the process wherein a component fixture having aligned compartments is arranged above the components with adhesive already placed on their top surfaces.
- FIG. 4 illustrates a further step in the process where the component fixture has been pressed against the adhesive substrate and wherein excess adhesive has been extruded through a vent hole or aperture from the compartments.
- FIG. 5 illustrates a further step of the process showing the removal of the adhesive substrate.
- FIG. 6 illustrates a completed part after the removal of the adhesive substrate.
- the adhesive substrate may be supported on a flat surface as is conventional, and may itself be a laminate of one or more layers of, for example metal foil 12 , see FIG. 2 , and an adhesive layer 10 .
- the adhesive itself is preferably selected from a group consisting of low tack, pressure sensitive acrylic and thermal release films or tapes for hard substrate such as Nitto Denko material NWS-Y5V/NWS-TS322F
- Each of the components which may have different vertical heights (and lengths and widths), are package integrated circuits having formed thereon electrical contacts 22 and 32 that will physically contact the adhesive substrate 10 . While illustrated in the figure as contacts spaced about the bottom surfaces of the components 20 and 30 , the contacts could be of the gullwing, J-leaded or other lead shape variety as illustrated in the aforementioned U.S. Pat. No. 7,926,173. See e.g. FIGS. 8 and 9 of US '173, and the gullwing components 802 .
- the adhesive may be provided with tooling holes 14 that may be used to provide apertures for tools to better align the adhesive substrate and the tooling, not shown, that physically places the components 20 and 30 on the adhesive substrate 10 .
- FIG. 2 the figure illustrates the components 20 and 30 after they are accurately placed on the adhesive substrate 10 .
- a metal layer 12 may be applied to the adhesive substrate 10 .
- this metal layer 12 may be patterned the form electrical traces to the contacts 22 and 32 of the components 20 and 30 as illustrated either in US '173, which shows connections through vias through the adhesive substrate or in co-pending application Ser. No.
- the adhesive substrate 10 may itself comprise a laminate structure consisting of the adhesive substrate 10 and the metal foil 12 .
- an adhesive is applied to the top surfaces of components 20 and 30 , resulting in a piled layer of adhesive 42 and 40 respectively. While the amount of the adhesive in a pile might be within defined ranges, as known in the art, the amount can vary from sample to sample. For this reason, both the vertical height of the components 20 and 30 and the amount of adhesive in piles 42 and 40 may vary within tolerance ranges.
- a component support fixture 70 having compartments 50 and 52 is shown arranged above components 30 and 20 prior to the fixture being lowered into place.
- each of the compartments 50 and 52 additionally has a vent hole or aperture 60 and 62 .
- the purpose of a vent hole or aperture is to allow venting both of air and of excess adhesive from the respective compartments 50 and 52 as the component support fixture 70 is lowered into place about components 30 and 20 and is pressed into abutment (not shown) with the adhesive substrate 10 as illustrated in FIG. 4 .
- the size of the compartments 50 and 52 is chosen such that they can accommodate components of all sizes in the both the vertical and horizontal ranges and allow space both above and to the sides of the components 30 and 20 within the compartment 50 and 52 .
- the size is further chosen such that the pile of adhesive 40 or 42 is squeezed about the components 30 and 20 within the compartments 50 and 52 .
- the vent hole or aperture provides for the extrusion of adhesive 40 and 42 through vent holes or apertures 60 and 62 , as the component support fixture 70 is pressed down until its bottom surface 72 is pressed into contact with the adhesive substrate 10 .
- the figure shows the component support fixture 70 in place, contacting the adhesive layer 10 via its lower surface 72 .
- the piles of adhesive 40 and 42 have been squeezed into the spaces 54 and 56 between the components 30 and 20 and the compartments 50 and 52 .
- the adhesive could be allowed to be cured, at which time electrical contacts could be made according to the aforementioned co-pending applications to provide via connections to the contacts 32 , 22 , or traces by etching the metal foil 12 as provided in Ser. No. 12/170,426.
- the adhesive 10 could be removed by for example chemical stripping or peeling it from the completed component support fixture/component, as shown in the figure.
- the material could be a heat releasable material as mentioned earlier.
- a layer 12 which could be the metal foil layer 12 as described above, but it also could be any other suitable layer that would support the adhesive layer during the previous processing steps.
- a suitable layer could be any of various stable polymer films which could serve as a carrier for the adhesive including polyester, polyethelyne napthalate or polyimide.
- the completed part is shown after the adhesive layer 10 has been removed.
- This part may be used in subsequent manufacturing steps where the components 30 and 20 could be further processed using an Occam process or otherwise to provide electrical connections to other elements on a circuit board.
- the adhesive 40 or 42 be chosen such that the component support fixture 70 might be removed entirely after such subsequent processing.
- component support fixture 70 can be made of any material for the purpose sense if invites only temporary manufacturing support for the components 30 and 20 . If however component support fixture 70 is intended to be permanent, it could be made of a material that is insulating or conductive depending on the purpose for the support, and it further could be made out of a material having a high thermal conductivity, such as aluminum. Examples of materials in the latter category include epoxy glass laminates or molded thermoplastic materials such as PEEK.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A component support fixture having a plurality of oversized compartments of the same size mounted on a top surface of an anisotropic adhesive film such that each of a plurality of burned-in components of different heights and widths are accommodated within a compartment. Patterned traces are formed on the bottom surface of the anisotropic film. The leads of the burned-in components are in electrically communication with those traces through the anisotropic film.
Description
- This application is a non provisional of and claims the benefit of provisional application No. 61/381,399 filed Sep. 9, 2010; and is a continuation-in-part of U.S. application Ser. No. 13/081,384, filed Apr. 6, 2011, which is a divisional application of application Ser. No. 12/163,870, filed Jun. 27, 2008, now U.S. Pat. No. 7,926,173, which is a continuation-in-part and claims the benefit of PCT Application No. PCT/US08/63123 filed on May 8, 2008 which claimed priority to: “ELECTRONIC ASSEMBLY WITHOUT SOLDER,” U.S. Application No. 60/928,467, filed on May 8, 2007; “ELECTRONIC ASSEMBLY WITHOUT SOLDER AND METHODS FOR THEIR MANUFACTURE,” U.S. Application No. 60/932,200, filed on May 29, 2007; “SOLDERLESS FLEXIBLE ELECTRONIC ASSEMBLIES AND METHODS FOR THEIR MANUFACTURE,” U.S. Application No. 60/958,385, filed on Jul. 5, 2007; “ELECTRONIC ASSEMBLIES WITHOUT SOLDER AND METHODS FOR THEIR MANUFACTURE,” U.S. Application No. 60/959,148, filed on Jul. 10, 2007; “MASS ASSEMBLY OF ENCAPSULATED ELECTRONIC COMPONENTS TO A PRINTED CIRCUIT BOARD BY MEANS OF AN ADHESIVE LAYER HAVING EMBEDDED CONDUCTIVE JOINING MATERIALS,” U.S. Application No. 60/962,626, filed on Jul. 31, 2007; “SYSTEM FOR THE MANUFACTURE OF ELECTRONIC ASSEMBLIES WITHOUT SOLDER,” U.S. Application No. 60/963,822, filed on Aug. 6, 2007; “ELECTRONIC ASSEMBLIES WITHOUT SOLDER AND METHODS FOR THEIR MANUFACTURE,” U.S. Application No. 60/966,643, filed on Aug. 28, 2007; “MONOLITHIC MOLDED SOLDERLESS FLEXIBLE ELECTRONIC ASSEMBLIES AND METHODS FOR THEIR MANUFACTURE,” U.S. Application No. 61/038,564, filed on Mar. 21, 2008; and “THE OCCAM PROCESS SOLDERLESS ASSEMBLY AND INTERCONNECTION OF ELECTRONIC PACKAGES,” U.S. Application No. 61/039,059, filed on Mar. 24, 2008; all of which are hereby incorporated by reference.
- This application further is a continuation-in-part of co-pending U.S. application Ser. No. 12/170,426 filed Jul. 9, 2008; which application claims the benefit of U.S. provisional application No. 60/959,148 filed Jul. 10, 2007 and U.S. provisional application No. 60/962,627, filed Jul. 31, 2007; all of which are hereby incorporated by reference in their entirety.
- The present invention relates to the field of solderless assembly of packaged components, sometimes known as an Occam process.
- The present invention is an improvement on an Occam process generally described in U.S. Pat. No. 7,926,173, a grandparent of the present application, which is expressly incorporated by reference. That patent describes the process of placing components on a flexible substrate, adhering the components to the substrate with an insulating material, placing a component support fixture over the components to support them while processing the flexible substrate to provide electrical connections to the components. The components support may be temporary or it may be removed.
- While the component support fixture described in the aforementioned patent contains “compartments” of various sizes for different size components, there is no consideration of how to accommodate particular components that have ranges of sizes. If a component is too large in the vertical direction, for example, the component support fixture will not entirely fit over the component such that the support itself will not contact the flexible substrate it is intended to support during subsequent processing of the flexible substrate.
- The invention comprises providing component-receiving compartments in the component support fixture of slightly larger dimensions than the largest dimension of the particular type of component. Invention further provides adhesively bonding the component support fixture to the components using an applied adhesive. The invention further provides a vent hole or aperture into the compartment whereby excess adhesive may be extruded through the vent hole or aperture in the case of oversized components. The invention further provides that components be placed on an adhesive substrate, rather than being adhered to an otherwise non-adhesive substrate via a post-placement adhesive (insulating material). Suitable tooling holes may be employed in the adhesive substrate to better locate the placement of the components.
- Another feature of the present invention is that the component support fixture comprises a machined or molded lid for both housing in compartments the components and for adhesively supporting the adhesive layer on a machined surface for subsequent processing of the adhesive layer in an Occam process.
- Additionally, the substrate adhesive itself may be anisotropically conductive, such that a foil, adhered to the adhesive, may be patterned into conductive traces as provided by co-pending parent U.S. patent application Ser. No. 12/170,426 filed Jul. 9, 2008, which is hereby incorporated by reference.
-
FIG. 1 illustrates a first step in the process showing to components of two different vertical dimensions before their placement on an adhesive substrate. -
FIG. 2 illustrates a further step in the process wherein adhesive is placed on top of the components after they have been placed on the adhesive substrate. -
FIG. 3 illustrates a further step in the process wherein a component fixture having aligned compartments is arranged above the components with adhesive already placed on their top surfaces. -
FIG. 4 illustrates a further step in the process where the component fixture has been pressed against the adhesive substrate and wherein excess adhesive has been extruded through a vent hole or aperture from the compartments. -
FIG. 5 illustrates a further step of the process showing the removal of the adhesive substrate. -
FIG. 6 illustrates a completed part after the removal of the adhesive substrate. - Referring to
FIG. 1 , a pair ofcomponents adhesive substrate 10 prior to being placed upon theadhesive substrate 10. The adhesive substrate may be supported on a flat surface as is conventional, and may itself be a laminate of one or more layers of, forexample metal foil 12, seeFIG. 2 , and anadhesive layer 10. The adhesive itself is preferably selected from a group consisting of low tack, pressure sensitive acrylic and thermal release films or tapes for hard substrate such as Nitto Denko material NWS-Y5V/NWS-TS322F - Each of the components, which may have different vertical heights (and lengths and widths), are package integrated circuits having formed thereon
electrical contacts adhesive substrate 10. While illustrated in the figure as contacts spaced about the bottom surfaces of thecomponents - The adhesive may be provided with
tooling holes 14 that may be used to provide apertures for tools to better align the adhesive substrate and the tooling, not shown, that physically places thecomponents adhesive substrate 10. - Referring to
FIG. 2 , the figure illustrates thecomponents adhesive substrate 10. In this step, ametal layer 12 may be applied to theadhesive substrate 10. In subsequent processing, provided the surfaces of thecarrier 70 are non conductive thismetal layer 12 may be patterned the form electrical traces to thecontacts components - Alternatively to applying the
metal foil layer 12 in step two (FIG. 2 ), theadhesive substrate 10 may itself comprise a laminate structure consisting of theadhesive substrate 10 and themetal foil 12. - Again referring to
FIG. 2 , an adhesive is applied to the top surfaces ofcomponents adhesive components piles - Referring to
FIG. 3 , acomponent support fixture 70 havingcompartments components compartments aperture respective compartments component support fixture 70 is lowered into place aboutcomponents adhesive substrate 10 as illustrated inFIG. 4 . - As illustrated in
FIG. 4 , the size of thecompartments components compartment adhesive components compartments apertures component support fixture 70 is pressed down until itsbottom surface 72 is pressed into contact with theadhesive substrate 10. - Referring to
FIG. 4 , the figure shows thecomponent support fixture 70 in place, contacting theadhesive layer 10 via itslower surface 72. As well, the piles ofadhesive spaces components compartments contacts metal foil 12 as provided in Ser. No. 12/170,426. - Referring to
FIG. 5 , in an alternative embodiment, theadhesive 10 could be removed by for example chemical stripping or peeling it from the completed component support fixture/component, as shown in the figure. To facilitate removal the material could be a heat releasable material as mentioned earlier. This is preferentially accomplished by providing the adhesive with alayer 12, which could be themetal foil layer 12 as described above, but it also could be any other suitable layer that would support the adhesive layer during the previous processing steps. Such a suitable layer could be any of various stable polymer films which could serve as a carrier for the adhesive including polyester, polyethelyne napthalate or polyimide. - Referring to
FIG. 6 , the completed part is shown after theadhesive layer 10 has been removed. This part may be used in subsequent manufacturing steps where thecomponents component support fixture 70 might be removed entirely after such subsequent processing. - For this purpose, it is understood that the
component support fixture 70 can be made of any material for the purpose sense if invites only temporary manufacturing support for thecomponents component support fixture 70 is intended to be permanent, it could be made of a material that is insulating or conductive depending on the purpose for the support, and it further could be made out of a material having a high thermal conductivity, such as aluminum. Examples of materials in the latter category include epoxy glass laminates or molded thermoplastic materials such as PEEK. - The description of the various embodiments above are not to be taken as a limitation on the scope of the invention. Variations of materials and structures and sequence of steps to achieve the overall objective of providing a component support fixture with vent holes or apertures either as a partial step in an Occam process, or as a completed structure in an Occam process, or other process, is within the scope of the present invention.
Claims (3)
1. An apparatus comprising;
an anisotropic adhesive film having a top surface and a bottom surface;
at least one patterned trace formed on said bottom surface;
a plurality of burned-in components of different heights and widths within a size range, each of said plurality of burned-in components further having a bottom side and at least one lead formed on said bottom side;
wherein each of said plurality of burned-in components is mounted on the top surface of said adhesive film; and
further wherein said at least one lead each of said plurality of burned-in components is in contact with said top surface; and
a component support fixture having a plurality of oversized compartments of the same size mounted on said top side of said adhesive film such that each of said plurality of burned-in components is accommodated within a compartment of said plurality of oversized compartments.
2. The apparatus of claim 1 , wherein said burned-in components are covered on all sides but said bottom side with an insulating material.
3. The apparatus of claim 2 , wherein each compartment has a vent hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US15/889,003 US20190174630A1 (en) | 2007-05-08 | 2018-02-05 | Burned-in Component Assembly |
Applications Claiming Priority (16)
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US92846707P | 2007-05-08 | 2007-05-08 | |
US93220007P | 2007-05-29 | 2007-05-29 | |
US95838507P | 2007-07-05 | 2007-07-05 | |
US95914807P | 2007-07-10 | 2007-07-10 | |
US96262607P | 2007-07-31 | 2007-07-31 | |
US96262707P | 2007-07-31 | 2007-07-31 | |
US96382207P | 2007-08-06 | 2007-08-06 | |
US96664307P | 2007-08-28 | 2007-08-28 | |
US3856408P | 2008-03-21 | 2008-03-21 | |
US3905908P | 2008-03-24 | 2008-03-24 | |
PCT/US2008/063123 WO2008138011A1 (en) | 2007-05-08 | 2008-05-08 | Electronic assemblies without solder and methods for their manufacture |
US12/170,426 US8510935B2 (en) | 2007-07-10 | 2008-07-09 | Electronic assemblies without solder and methods for their manufacture |
US38139910P | 2010-09-09 | 2010-09-09 | |
US13/081,384 US20110182042A1 (en) | 2007-07-05 | 2011-04-06 | Electronic Assemblies without Solder and Methods for their Manufacture |
US13/228,826 US9894771B2 (en) | 2007-05-08 | 2011-09-09 | Occam process for components having variations in part dimensions |
US15/889,003 US20190174630A1 (en) | 2007-05-08 | 2018-02-05 | Burned-in Component Assembly |
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US13/228,826 Continuation US9894771B2 (en) | 2007-05-08 | 2011-09-09 | Occam process for components having variations in part dimensions |
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US20190174630A1 true US20190174630A1 (en) | 2019-06-06 |
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US13/228,826 Active 2029-10-11 US9894771B2 (en) | 2007-05-08 | 2011-09-09 | Occam process for components having variations in part dimensions |
US15/889,003 Abandoned US20190174630A1 (en) | 2007-05-08 | 2018-02-05 | Burned-in Component Assembly |
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KR102595896B1 (en) * | 2016-08-08 | 2023-10-30 | 삼성전자 주식회사 | Printed Circuit Board, and semiconductor package having the same |
EP3340752B1 (en) * | 2016-12-22 | 2023-01-25 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method using an air permeable temporary carrier tape for embedding component in component carrier |
US20230129597A1 (en) * | 2021-10-27 | 2023-04-27 | Sch Power Tech Co., Ltd. | Retaining Ring for Wafer Polishing |
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US20090008140A1 (en) * | 2007-07-05 | 2009-01-08 | Occam Portfolio Llc | Electronic Assemblies Without Solder and Methods for their Manufacture |
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JP3280394B2 (en) * | 1990-04-05 | 2002-05-13 | ロックヒード マーティン コーポレーション | Electronic equipment |
US5222305A (en) * | 1992-03-26 | 1993-06-29 | Hughes Aircraft Company | Method for specifying and verifying positive graphics pattern positions relative to non-plated tooling holes patterns on the same substrate |
US5734555A (en) | 1994-03-30 | 1998-03-31 | Intel Corporation | Shared socket multi-chip module and/or piggyback pin grid array package |
US6359335B1 (en) * | 1994-05-19 | 2002-03-19 | Tessera, Inc. | Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures |
KR100274333B1 (en) * | 1996-01-19 | 2001-01-15 | 모기 쥰이찌 | conductive layer adhesive anisotropic concuctive sheet and wiring board using such a sheet |
TWI224722B (en) * | 2000-05-19 | 2004-12-01 | Asulab Sa | Electronic device for generating and displaying an item of information |
US20030221313A1 (en) | 2001-01-26 | 2003-12-04 | Gann Keith D. | Method for making stacked integrated circuits (ICs) using prepackaged parts |
US20030057544A1 (en) | 2001-09-13 | 2003-03-27 | Nathan Richard J. | Integrated assembly protocol |
US7510108B2 (en) * | 2005-07-26 | 2009-03-31 | Delphi Technologies, Inc. | Method of making an electronic assembly |
TWI263313B (en) | 2005-08-15 | 2006-10-01 | Phoenix Prec Technology Corp | Stack structure of semiconductor component embedded in supporting board |
US8510935B2 (en) * | 2007-07-10 | 2013-08-20 | Joseph C Fjelstad | Electronic assemblies without solder and methods for their manufacture |
US20090026656A1 (en) * | 2007-07-23 | 2009-01-29 | Bautista Jr Jesus Bajo | Vented mold for encapsulating semiconductor components |
-
2011
- 2011-09-09 US US13/228,826 patent/US9894771B2/en active Active
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2018
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US5648136A (en) * | 1995-07-11 | 1997-07-15 | Minnesota Mining And Manufacturing Co. | Component carrier tape |
US20090008140A1 (en) * | 2007-07-05 | 2009-01-08 | Occam Portfolio Llc | Electronic Assemblies Without Solder and Methods for their Manufacture |
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US9894771B2 (en) | 2018-02-13 |
US20110315302A1 (en) | 2011-12-29 |
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