US20190045655A1 - Phase change material heat sink using additive manufacturing and method - Google Patents
Phase change material heat sink using additive manufacturing and method Download PDFInfo
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- US20190045655A1 US20190045655A1 US16/153,452 US201816153452A US2019045655A1 US 20190045655 A1 US20190045655 A1 US 20190045655A1 US 201816153452 A US201816153452 A US 201816153452A US 2019045655 A1 US2019045655 A1 US 2019045655A1
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- heat sink
- internal matrix
- phase change
- change material
- upper shell
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
- B23P2700/10—Heat sinks
Definitions
- the present disclosure is directed, in general, to thermal technology and, more specifically, to a phase change material heat sink using additive manufacturing and method.
- Phase change material heat sinks are capable of increasing thermal capacitance per volume/mass as compared to typical metallic heat sinks. Containing the phase change material within a heat sink generally requires sealing that is accomplished by vacuum brazing two metal shells, in addition to brazing an internal metal matrix, such as aluminum foam. However, brazing operations are expensive and provide potential leak paths and fatigue failure points.
- This disclosure provides a phase change material (PCM) heat sink using additive manufacturing and method.
- PCM phase change material
- a heat sink in a first embodiment, includes a lower shell, an upper shell, and an internal matrix having a space.
- the space is configured to receive a phase change material.
- the lower shell, the upper shell and the internal matrix are formed as a single component using additive manufacturing techniques.
- a PCM heat sink in second embodiment, includes a phase change material, a lower shell, an upper shell, and an internal matrix having a space.
- the space is configured to receive the phase change material.
- the lower shell, the upper shell and the internal matrix are formed as a single component using additive manufacturing techniques.
- an apparatus in a third embodiment, includes a structural component and a heat sink.
- the heat sink includes a lower shell, an internal matrix configured to receive a phase change material, and an upper shell.
- the internal matrix includes a plurality of parallel pins or plates.
- the lower shell, the internal matrix, and the upper shell of the heat sink comprise a single-structure component that is incorporated into the structural component such that the heat sink and the structural component are integral.
- FIG. 1 illustrates an expanded view of a heat sink in accordance with the present disclosure
- FIGS. 2A-C illustrate cross-sectional views of an example of the formation of a phase change material (PCM) heat sink in accordance with the present disclosure
- FIGS. 3A-D illustrate examples of the internal matrix of FIGS. 2A-C in accordance with the present disclosure.
- FIG. 4 is a flowchart illustrating a method for forming the PCM heat sink of FIGS. 2A-C in accordance with the present disclosure.
- FIGS. 1 through 4 discussed below, and the various embodiments used to describe the principles of the present disclosure in this patent document are by way of illustration only and should not be construed in any way to limit the scope of the disclosure. Those skilled in the art will understand that the principles of the present disclosure may be implemented using any number of techniques, whether currently known or not. Additionally, the drawings are not necessarily drawn to scale.
- containing a phase change material (PCM) within a heat sink generally requires sealing that is most effectively accomplished by creating a pressure vessel to contain the PCM.
- PCM phase change material
- paraffin wax is sealed in an aluminum container to form one type of PCM heat sink that typically uses vacuum brazing to prevent the paraffin wax from escaping the heat sink when it expands as a liquid. Vacuum brazing is performed at a limited number of facilities and typically has a multi-month lead time.
- FIG. 1 illustrates an expanded view of a heat sink 100 in accordance with the present disclosure.
- the embodiment of the heat sink 100 shown in FIG. 1 is for illustration only. Other embodiments of the heat sink 100 could be used without departing from the scope of this disclosure.
- the heat sink 100 comprises a lower shell 102 , an upper shell 104 and an internal matrix 106 .
- a phase change material (not shown in FIG. 1 ) is incorporated into the heat sink 100 to generate a phase change material (PCM) heat sink.
- the heat sink 100 may comprise aluminum or any other suitable thermally-conductive material. Although illustrated as circular, it will be understood that the heat sink 100 may comprise any suitable shape, such as oval, rectangular, triangular, configured to be adjacent to a printed circuit board or the like.
- the heat sink 100 may be designed into the structure of any suitable component, eliminating the need to physically attach the heat sink 100 to a component requiring thermal regulation.
- the internal matrix 106 comprises open space that is configured to accommodate the phase change material.
- the internal matrix 106 may comprise any suitable form, such as straight, slanted, spiral, zigzag, foam or the like, that includes open space for receiving the phase change material.
- the internal matrix 106 is configured to conduct thermal energy into the phase change material within the space of the internal matrix 106 .
- the lower shell and the upper shell are distinct components that are sealed together using vacuum brazing.
- the heat sink 100 of the present disclosure includes the lower shell 102 , the upper shell 104 and the internal matrix 106 integrated together as a single component that is generated using additive manufacturing.
- the heat sink 100 is less expensive to produce and more robust than conventional heat sinks.
- Additive manufacturing also allows for the possibility to generate the lower and upper shells 102 and 104 , as well as the internal matrix 106 , with more complex designs to address specific issues such as dissipating heat from high power density components.
- the design of the internal matrix 106 is not limited to a metal foam or other design that can be formed using traditional machining techniques.
- a complex internal matrix 106 may be designed to optimize heat transport, maximize volume allocated for phase change material, and provide suitable PCM filling paths. This design may be customized to provide the most efficient removal of heat from a particular application and to optimize heat transfer into the phase change material.
- the heat sink 100 may be incorporated into the design of any suitable structural component, thereby increasing heat capacity for the structural component.
- the structural component may include an airframe, bulkhead or any other suitable component that may be formed using additive manufacturing techniques.
- FIG. 1 illustrates one example of a heat sink 100
- various changes may be made to the embodiment shown in FIG. 1 .
- the makeup and arrangement of the heat sink 100 are for illustration only. Components could be added, omitted, combined, subdivided, or placed in any other suitable configuration according to particular needs.
- FIGS. 2A-C illustrate cross-sectional views of an example of the formation of a PCM heat sink 120 in accordance with the present disclosure.
- the lower shell 102 , the upper shell 104 and the internal matrix 106 are formed together as a single-structure heat sink 100 using additive manufacturing techniques.
- the heat sink 100 also includes a fill port 108 and a vent port 110 to enable the insertion of a phase change material into open space 112 formed in the structure of the internal matrix 106 .
- the shapes of the shells 102 and 104 and the internal matrix 106 may include any suitable shapes and that the embodiment of the heat sink 100 shown in FIGS. 2A-C is for illustration only. Other embodiments of the heat sink 100 could be used without departing from the scope of this disclosure.
- a phase change material 114 is introduced through the fill port 108 so as to substantially fill the space 112 within the internal matrix 106 .
- the phase change material 114 may comprise a paraffin wax or other suitable material that absorbs thermal energy when changing from a solid state to a liquid state and releases thermal energy when changing from a liquid state to a solid state.
- the phase change material 114 is configured to store and release heat or thermal energy via the phase changes of the phase change material 114 .
- the structure of the internal matrix 106 is configured to conduct heat or thermal energy between the phase change material 114 and one or both of the shells 102 and 104 .
- the size, spacing and geometry of the internal matrix 106 structure may be selected based on any suitable criteria, such as the thermal requirements of the application in which the PCM heat sink 120 is to be implemented.
- the internal matrix 106 may have any type of three-dimensional, non-symmetric and/or non-matrix design because of the additive manufacturing techniques used to form the heat sink 100 .
- seal plugs 116 a and 116 b are used to seal the ports 108 and 110 , thus completing the formation of the PCM heat sink 120 .
- the seal plugs 116 a - b may include any suitable structure and may be inserted by any suitable process so as to seal the ports 108 and 110 , thereby preventing the phase change material 114 from leaking out of the PCM heat sink 120 .
- the seal plugs 116 a - b may include expansion plugs.
- the seal plugs 116 a - b may include solder.
- the PCM heat sink 120 By forming the PCM heat sink 120 from a single-structure heat sink 100 generated using additive manufacturing techniques, the need for vacuum brazing is eliminated. As a result, the process to form the heat sink 100 and, thus, the PCM heat sink 120 , is significantly less expensive and faster to fabricate. In addition, the robustness of the PCM heat sink 120 is increased as compared to conventionally manufactured PCM heat sinks, and complex designs may be easily implemented. Furthermore, the lower shell 102 , the upper shell 104 and/or the internal matrix 106 may each include customizable, complex designs that are not possible with traditional machining techniques. This PCM heat sink 120 may be included in test hardware, commercial electronics or any other suitable application in which thermal energy needs to be managed.
- FIGS. 2A-C illustrate one example of the formation of a PCM heat sink 120
- various changes may be made to the embodiment shown in FIGS. 2A-C .
- the makeup and arrangement of the PCM heat sink 120 are for illustration only. Components could be added, omitted, combined, subdivided, or placed in any other suitable configuration according to particular needs.
- FIGS. 3A-D illustrate examples of the internal matrix 106 in accordance with the present disclosure.
- the examples of the internal matrix 106 shown in FIGS. 3A-D are for illustration only. Other embodiments of the internal matrix 106 could be used without departing from the scope of this disclosure.
- the internal matrix 106 comprises a thermally-conductive material 302 , represented by dark areas, and a space 304 , represented by white areas.
- the internal matrix 106 is illustrated in a top view.
- the thermally-conductive material 302 includes the same material as the lower and upper shells 102 and 104 of the heat sink 100 due to the additive manufacturing techniques used to form the heat sink 100 as a single structure, as described above. Because the internal matrix 106 is manufactured using additive manufacturing techniques, the thermally-conductive material 302 may be formed in any suitable configuration and is not limited to geometries that can be formed with traditional machining techniques.
- the thermally-conductive material 302 is configured as a plurality of pins.
- the space 304 comprises an open area formed by the pins. Although illustrated as square, it will be understood that the pins may alternatively be circular or any other suitable shape.
- the thermally-conductive material 302 is configured as a plurality of plates.
- the space 304 comprises an open area formed between the plates. Although illustrated as straight, it will be understood that the plates may alternatively be slanted, zigzag, or any other suitable shape.
- the thermally-conductive material 302 is configured as a grid.
- the space 304 comprises an open area formed by the grid.
- the thermally-conductive material 302 is configured in a non-standard shape to illustrate that the internal matrix 106 may have a complex, customized design that is tailored to meet the needs of a particular application.
- the space 304 in this example comprises an open area formed by the thermally-conductive material 302 .
- the geometry of the thermally-conductive material 302 may be as complex as desired and is not limited to the relatively simple shapes illustrated in FIGS. 3A-D .
- the cross-section of any portion of the thermally-conductive material 302 such as pins or plates, may be constant or varying due to the additive manufacturing techniques.
- an hour-glass shaped pin or plate could be implemented.
- each pin or plate could be designed independently, with each having any desired shape.
- the thermally-conductive material 302 may include any suitable simple or complex three-dimensional shape, including curvatures that are not possible with traditional machining techniques.
- localized holes (not shown in FIGS.
- 3A-D may be included in the thermally-conductive material 302 to allow the phase change material to be introduced into substantially the entire open space 304 when the thermally-conductive material 302 would otherwise block its path, which may be difficult or impossible to achieve with traditional machining techniques.
- FIG. 4 is a flowchart illustrating a method 400 for forming the PCM heat sink 120 in accordance with the present disclosure.
- the method 400 shown in FIG. 4 is for illustration only.
- the PCM heat sink 120 may be formed in any other suitable manner without departing from the scope of this disclosure.
- a single-structure heat sink 100 is formed using additive manufacturing techniques (step 402 ).
- a lower shell 102 , an upper shell 104 and an internal matrix 106 are formed as a single component.
- the heat sink 100 may comprise aluminum or other suitable material.
- phase change material 114 is inserted via a fill port 108 of the heat sink 100 (step 404 ).
- the phase change material 114 is inserted such that open space 304 within the internal matrix 106 is substantially filled with the phase change material 114 .
- the phase change material 114 may comprise a paraffin wax or other suitable material.
- the fill port 108 and a vent port 110 of the heat sink 100 are sealed to complete formation of the PCM heat sink 120 (step 406 ).
- the fill port 108 and the vent port 110 may be sealed using expansion plugs or other suitable method, such as soldering.
- the PCM heat sink 120 may be formed using a process that is significantly less expensive and faster as compared to conventional PCM heat sinks while providing the benefit of increased robustness.
- the heat sink 100 itself may be designed to optimize heat transport, maximize volume allocated for phase change material 114 , and provide suitable PCM filling paths due to the use of additive manufacturing techniques in the formation of the heat sink 100 .
- FIG. 4 illustrates one example of a method 400 for forming the PCM heat sink 120
- various changes may be made to the embodiment shown in FIG. 4 .
- steps in FIG. 4 could overlap, occur in parallel, occur in a different order, or occur multiple times.
- Couple and its derivatives refer to any direct or indirect communication between two or more elements, whether or not those elements are in physical contact with one another.
- the term “or” is inclusive, meaning and/or.
- Each refers to each member of a set or each member of a subset of a set. Terms such as “over” and “under” may refer to relative positions in the figures and do not denote required orientations during manufacturing or use. Terms such as “higher” and “lower” denote relative values and are not meant to imply specific values or ranges of values.
- phrases “associated with” and “associated therewith,” as well as derivatives thereof, may mean to include, be included within, interconnect with, contain, be contained within, connect to or with, couple to or with, be communicable with, cooperate with, interleave, juxtapose, be proximate to, be bound to or with, have, have a property of, or the like.
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Abstract
Description
- This application claims priority under 35 U.S.C. § 120 as a divisional of U.S. patent application Ser. No. 14/925,737 filed on Oct. 28, 2015, which is hereby incorporated by reference in its entirety.
- The present disclosure is directed, in general, to thermal technology and, more specifically, to a phase change material heat sink using additive manufacturing and method.
- Phase change material heat sinks are capable of increasing thermal capacitance per volume/mass as compared to typical metallic heat sinks. Containing the phase change material within a heat sink generally requires sealing that is accomplished by vacuum brazing two metal shells, in addition to brazing an internal metal matrix, such as aluminum foam. However, brazing operations are expensive and provide potential leak paths and fatigue failure points.
- This disclosure provides a phase change material (PCM) heat sink using additive manufacturing and method.
- In a first embodiment, a heat sink includes a lower shell, an upper shell, and an internal matrix having a space. The space is configured to receive a phase change material. The lower shell, the upper shell and the internal matrix are formed as a single component using additive manufacturing techniques.
- In second embodiment, a PCM heat sink includes a phase change material, a lower shell, an upper shell, and an internal matrix having a space. The space is configured to receive the phase change material. The lower shell, the upper shell and the internal matrix are formed as a single component using additive manufacturing techniques.
- In a third embodiment, an apparatus includes a structural component and a heat sink. The heat sink includes a lower shell, an internal matrix configured to receive a phase change material, and an upper shell. The internal matrix includes a plurality of parallel pins or plates. The lower shell, the internal matrix, and the upper shell of the heat sink comprise a single-structure component that is incorporated into the structural component such that the heat sink and the structural component are integral.
- Other technical features may be readily apparent to one skilled in the art from the following figures, descriptions, and claims.
- For a more complete understanding of the present disclosure, reference is now made to the following description taken in conjunction with the accompanying drawings, in which:
-
FIG. 1 illustrates an expanded view of a heat sink in accordance with the present disclosure; -
FIGS. 2A-C illustrate cross-sectional views of an example of the formation of a phase change material (PCM) heat sink in accordance with the present disclosure; -
FIGS. 3A-D illustrate examples of the internal matrix ofFIGS. 2A-C in accordance with the present disclosure; and -
FIG. 4 is a flowchart illustrating a method for forming the PCM heat sink ofFIGS. 2A-C in accordance with the present disclosure. -
FIGS. 1 through 4 , discussed below, and the various embodiments used to describe the principles of the present disclosure in this patent document are by way of illustration only and should not be construed in any way to limit the scope of the disclosure. Those skilled in the art will understand that the principles of the present disclosure may be implemented using any number of techniques, whether currently known or not. Additionally, the drawings are not necessarily drawn to scale. - As described above, containing a phase change material (PCM) within a heat sink generally requires sealing that is most effectively accomplished by creating a pressure vessel to contain the PCM. For example, paraffin wax is sealed in an aluminum container to form one type of PCM heat sink that typically uses vacuum brazing to prevent the paraffin wax from escaping the heat sink when it expands as a liquid. Vacuum brazing is performed at a limited number of facilities and typically has a multi-month lead time.
-
FIG. 1 illustrates an expanded view of aheat sink 100 in accordance with the present disclosure. The embodiment of theheat sink 100 shown inFIG. 1 is for illustration only. Other embodiments of theheat sink 100 could be used without departing from the scope of this disclosure. - The
heat sink 100 comprises alower shell 102, anupper shell 104 and aninternal matrix 106. As described in more detail below, a phase change material (not shown inFIG. 1 ) is incorporated into theheat sink 100 to generate a phase change material (PCM) heat sink. Theheat sink 100 may comprise aluminum or any other suitable thermally-conductive material. Although illustrated as circular, it will be understood that theheat sink 100 may comprise any suitable shape, such as oval, rectangular, triangular, configured to be adjacent to a printed circuit board or the like. In addition, theheat sink 100 may be designed into the structure of any suitable component, eliminating the need to physically attach theheat sink 100 to a component requiring thermal regulation. - As described in more detail below, the
internal matrix 106 comprises open space that is configured to accommodate the phase change material. Theinternal matrix 106 may comprise any suitable form, such as straight, slanted, spiral, zigzag, foam or the like, that includes open space for receiving the phase change material. Theinternal matrix 106 is configured to conduct thermal energy into the phase change material within the space of theinternal matrix 106. - In conventional PCM heat sinks, the lower shell and the upper shell (and often the internal matrix also) are distinct components that are sealed together using vacuum brazing. However, the
heat sink 100 of the present disclosure includes thelower shell 102, theupper shell 104 and theinternal matrix 106 integrated together as a single component that is generated using additive manufacturing. - As a result, the
heat sink 100 is less expensive to produce and more robust than conventional heat sinks. Additive manufacturing also allows for the possibility to generate the lower andupper shells internal matrix 106, with more complex designs to address specific issues such as dissipating heat from high power density components. Thus, the design of theinternal matrix 106 is not limited to a metal foam or other design that can be formed using traditional machining techniques. For example, a complexinternal matrix 106 may be designed to optimize heat transport, maximize volume allocated for phase change material, and provide suitable PCM filling paths. This design may be customized to provide the most efficient removal of heat from a particular application and to optimize heat transfer into the phase change material. - In addition, because the
internal matrix 106 is formed together with theshells shells heat sink 100. Finally, instead of being formed separately and later attached to a component, theheat sink 100 may be incorporated into the design of any suitable structural component, thereby increasing heat capacity for the structural component. For example, the structural component may include an airframe, bulkhead or any other suitable component that may be formed using additive manufacturing techniques. - Although
FIG. 1 illustrates one example of aheat sink 100, various changes may be made to the embodiment shown inFIG. 1 . For example, the makeup and arrangement of theheat sink 100 are for illustration only. Components could be added, omitted, combined, subdivided, or placed in any other suitable configuration according to particular needs. -
FIGS. 2A-C illustrate cross-sectional views of an example of the formation of aPCM heat sink 120 in accordance with the present disclosure. As shown inFIG. 2A , thelower shell 102, theupper shell 104 and theinternal matrix 106 are formed together as a single-structure heat sink 100 using additive manufacturing techniques. Theheat sink 100 also includes afill port 108 and avent port 110 to enable the insertion of a phase change material intoopen space 112 formed in the structure of theinternal matrix 106. - It will be understood that the shapes of the
shells internal matrix 106 may include any suitable shapes and that the embodiment of theheat sink 100 shown inFIGS. 2A-C is for illustration only. Other embodiments of theheat sink 100 could be used without departing from the scope of this disclosure. - As shown in
FIG. 2B , aphase change material 114 is introduced through thefill port 108 so as to substantially fill thespace 112 within theinternal matrix 106. Thephase change material 114 may comprise a paraffin wax or other suitable material that absorbs thermal energy when changing from a solid state to a liquid state and releases thermal energy when changing from a liquid state to a solid state. Thus, thephase change material 114 is configured to store and release heat or thermal energy via the phase changes of thephase change material 114. - The structure of the
internal matrix 106 is configured to conduct heat or thermal energy between thephase change material 114 and one or both of theshells internal matrix 106 structure may be selected based on any suitable criteria, such as the thermal requirements of the application in which thePCM heat sink 120 is to be implemented. In addition, theinternal matrix 106 may have any type of three-dimensional, non-symmetric and/or non-matrix design because of the additive manufacturing techniques used to form theheat sink 100. - As shown in
FIG. 2C , seal plugs 116 a and 116 b are used to seal theports PCM heat sink 120. The seal plugs 116 a-b may include any suitable structure and may be inserted by any suitable process so as to seal theports phase change material 114 from leaking out of thePCM heat sink 120. For example, for a particular embodiment, the seal plugs 116 a-b may include expansion plugs. For another embodiment, the seal plugs 116 a-b may include solder. - By forming the
PCM heat sink 120 from a single-structure heat sink 100 generated using additive manufacturing techniques, the need for vacuum brazing is eliminated. As a result, the process to form theheat sink 100 and, thus, thePCM heat sink 120, is significantly less expensive and faster to fabricate. In addition, the robustness of thePCM heat sink 120 is increased as compared to conventionally manufactured PCM heat sinks, and complex designs may be easily implemented. Furthermore, thelower shell 102, theupper shell 104 and/or theinternal matrix 106 may each include customizable, complex designs that are not possible with traditional machining techniques. ThisPCM heat sink 120 may be included in test hardware, commercial electronics or any other suitable application in which thermal energy needs to be managed. - Although
FIGS. 2A-C illustrate one example of the formation of aPCM heat sink 120, various changes may be made to the embodiment shown inFIGS. 2A-C . For example, the makeup and arrangement of thePCM heat sink 120 are for illustration only. Components could be added, omitted, combined, subdivided, or placed in any other suitable configuration according to particular needs. -
FIGS. 3A-D illustrate examples of theinternal matrix 106 in accordance with the present disclosure. The examples of theinternal matrix 106 shown inFIGS. 3A-D are for illustration only. Other embodiments of theinternal matrix 106 could be used without departing from the scope of this disclosure. For these examples, theinternal matrix 106 comprises a thermally-conductive material 302, represented by dark areas, and aspace 304, represented by white areas. In addition, theinternal matrix 106 is illustrated in a top view. - The thermally-
conductive material 302 includes the same material as the lower andupper shells heat sink 100 due to the additive manufacturing techniques used to form theheat sink 100 as a single structure, as described above. Because theinternal matrix 106 is manufactured using additive manufacturing techniques, the thermally-conductive material 302 may be formed in any suitable configuration and is not limited to geometries that can be formed with traditional machining techniques. - For the example shown in
FIG. 3A , the thermally-conductive material 302 is configured as a plurality of pins. Thespace 304 comprises an open area formed by the pins. Although illustrated as square, it will be understood that the pins may alternatively be circular or any other suitable shape. For the example shown inFIG. 3B , the thermally-conductive material 302 is configured as a plurality of plates. Thespace 304 comprises an open area formed between the plates. Although illustrated as straight, it will be understood that the plates may alternatively be slanted, zigzag, or any other suitable shape. For the example shown inFIG. 3C , the thermally-conductive material 302 is configured as a grid. Thespace 304 comprises an open area formed by the grid. Although illustrated as a square grid, it will be understood that the grid may alternatively be formed in any other suitable shape. For the example shown inFIG. 3D , the thermally-conductive material 302 is configured in a non-standard shape to illustrate that theinternal matrix 106 may have a complex, customized design that is tailored to meet the needs of a particular application. Thespace 304 in this example comprises an open area formed by the thermally-conductive material 302. - The geometry of the thermally-
conductive material 302 may be as complex as desired and is not limited to the relatively simple shapes illustrated inFIGS. 3A-D . For example, the cross-section of any portion of the thermally-conductive material 302, such as pins or plates, may be constant or varying due to the additive manufacturing techniques. As a particular example, an hour-glass shaped pin or plate could be implemented. Alternatively, each pin or plate could be designed independently, with each having any desired shape. Thus, the thermally-conductive material 302 may include any suitable simple or complex three-dimensional shape, including curvatures that are not possible with traditional machining techniques. In addition, for some embodiments, localized holes (not shown inFIGS. 3A-D ) may be included in the thermally-conductive material 302 to allow the phase change material to be introduced into substantially the entireopen space 304 when the thermally-conductive material 302 would otherwise block its path, which may be difficult or impossible to achieve with traditional machining techniques. -
FIG. 4 is a flowchart illustrating amethod 400 for forming thePCM heat sink 120 in accordance with the present disclosure. Themethod 400 shown inFIG. 4 is for illustration only. ThePCM heat sink 120 may be formed in any other suitable manner without departing from the scope of this disclosure. - Initially, a single-
structure heat sink 100 is formed using additive manufacturing techniques (step 402). For a particular example, for some embodiments, alower shell 102, anupper shell 104 and aninternal matrix 106 are formed as a single component. Theheat sink 100 may comprise aluminum or other suitable material. - A
phase change material 114 is inserted via afill port 108 of the heat sink 100 (step 404). For a particular example, for some embodiments, thephase change material 114 is inserted such thatopen space 304 within theinternal matrix 106 is substantially filled with thephase change material 114. Thephase change material 114 may comprise a paraffin wax or other suitable material. - The
fill port 108 and avent port 110 of theheat sink 100 are sealed to complete formation of the PCM heat sink 120 (step 406). Thefill port 108 and thevent port 110 may be sealed using expansion plugs or other suitable method, such as soldering. - As a result, the
PCM heat sink 120 may be formed using a process that is significantly less expensive and faster as compared to conventional PCM heat sinks while providing the benefit of increased robustness. In addition, theheat sink 100 itself may be designed to optimize heat transport, maximize volume allocated forphase change material 114, and provide suitable PCM filling paths due to the use of additive manufacturing techniques in the formation of theheat sink 100. - Although
FIG. 4 illustrates one example of amethod 400 for forming thePCM heat sink 120, various changes may be made to the embodiment shown inFIG. 4 . For example, while shown as a series of steps, various steps inFIG. 4 could overlap, occur in parallel, occur in a different order, or occur multiple times. - Modifications, additions, or omissions may be made to the apparatuses, and methods described herein without departing from the scope of the disclosure. For example, the components of the apparatuses may be integrated or separated. The methods may include more, fewer, or other steps. Additionally, as described above, steps may be performed in any suitable order.
- It may be advantageous to set forth definitions of certain words and phrases used throughout this patent document. The term “couple” and its derivatives refer to any direct or indirect communication between two or more elements, whether or not those elements are in physical contact with one another. The terms “include” and “comprise,” as well as derivatives thereof, mean inclusion without limitation. The term “or” is inclusive, meaning and/or. The term “each” refers to each member of a set or each member of a subset of a set. Terms such as “over” and “under” may refer to relative positions in the figures and do not denote required orientations during manufacturing or use. Terms such as “higher” and “lower” denote relative values and are not meant to imply specific values or ranges of values. The phrases “associated with” and “associated therewith,” as well as derivatives thereof, may mean to include, be included within, interconnect with, contain, be contained within, connect to or with, couple to or with, be communicable with, cooperate with, interleave, juxtapose, be proximate to, be bound to or with, have, have a property of, or the like.
- While this disclosure has described certain embodiments and generally associated methods, alterations and permutations of these embodiments and methods will be apparent to those skilled in the art. Accordingly, the above description of example embodiments does not define or constrain this disclosure. Other changes, substitutions, and alterations are also possible without departing from the spirit and scope of this disclosure, as defined by the following claims.
Claims (20)
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US16/153,452 US20190045655A1 (en) | 2015-10-28 | 2018-10-05 | Phase change material heat sink using additive manufacturing and method |
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US14/925,737 US10123456B2 (en) | 2015-10-28 | 2015-10-28 | Phase change material heat sink using additive manufacturing and method |
US16/153,452 US20190045655A1 (en) | 2015-10-28 | 2018-10-05 | Phase change material heat sink using additive manufacturing and method |
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US20160209128A1 (en) * | 2015-01-15 | 2016-07-21 | Hamilton Sundstrand Space Systems International, Inc. | Composite passive heat sink system and method |
US20160209126A1 (en) * | 2015-01-15 | 2016-07-21 | Hamilton Sundstrand Space Systems International, Inc. | Composite flow-through heat sink system and method |
CN112352134A (en) | 2018-07-11 | 2021-02-09 | 林德有限责任公司 | Temperature compensation element, pipe and method for producing a pipe |
EP3821190A1 (en) | 2018-07-11 | 2021-05-19 | Linde GmbH | Heat exchanger and method for producing a heat exchanger |
WO2020011397A1 (en) | 2018-07-11 | 2020-01-16 | Linde Aktiengesellschaft | Tube sheet arrangement for a heat exchanger, heat exchanger, and method for producing a tube sheet arrangement |
CN112702889B (en) * | 2020-12-15 | 2021-10-08 | 西安交通大学 | Negative pressure phase change heat dissipation device and high heat flow density electronic chip simulation heat dissipation system |
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US20170234389A1 (en) * | 2016-02-11 | 2017-08-17 | Abb Technology Ltd. | Pressure plate with phase change material |
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US20170127557A1 (en) | 2017-05-04 |
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