US20190021185A1 - Connector assembly - Google Patents
Connector assembly Download PDFInfo
- Publication number
- US20190021185A1 US20190021185A1 US16/032,410 US201816032410A US2019021185A1 US 20190021185 A1 US20190021185 A1 US 20190021185A1 US 201816032410 A US201816032410 A US 201816032410A US 2019021185 A1 US2019021185 A1 US 2019021185A1
- Authority
- US
- United States
- Prior art keywords
- mating
- terminals
- contact
- thermal conduction
- contact portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2107/00—Four or more poles
Definitions
- the present invention relates to a connector assembly, and more particularly to a connector assembly having a thermal conduction member.
- a commonly used plug connector in the industry includes a circuit board, a mating joint electrically connected to one end of the circuit board, a cable electrically connected to the other end of the circuit board, and a metal shell covering a rear end of the mating joint and outside of the circuit board.
- a chip is generally installed on the circuit board to enhance the decoding capability of the plug connector.
- the chip speed becomes faster and the required power is also increased, the chip will generate a lot of heat during operation. If the heat is not dissipated in time, the chip will become too hot and fail, and the plug connector will be damaged, resulting in failure of the entire electronic device.
- the metal shell is provided with an abutting portion, which elastically abuts the chip, such that the heat generated by the chip is transferred to the metal shell, and then heat exchange is performed with the outside air through the metal shell to achieve the purpose of heat dissipation.
- the heat transfer rate is slow, such that the heat generated by the chip cannot be quickly dissipated, resulting in poor heat dissipation effect, and affecting the reliability of the signal transmission of the plug connector.
- the invention is directed to a connector assembly having a thermal conduction member, which can quickly dissipate heat generated by the chip inside the plug connector.
- the present invention adopts the following technical solutions:
- a connector assembly includes: a socket connector, including: a main body, having a tongue, wherein the tongue has two first surfaces provided opposite to each other; a plurality of mating terminals, provided on the main body, wherein each of the mating terminals has a first contact portion, and the first contact portions of the mating terminals are exposed from at least one of the first surfaces; and at least one first thermal conduction member, provided on the main body, wherein the first thermal conduction member has a first mating portion, and the first mating portion is exposed to the at least one of the first surfaces provided with the first contact portions of the mating terminals; and a plug connector, including: a circuit board; at least one chip, provided on the circuit board; a mating joint, electrically connected to one end of the circuit board, wherein the mating joint has an insulating body and a plurality of conductive terminals provided on the insulating body; and at least one second thermal conduction member, provided on the insulating body, wherein the second thermal conduction member has a second mat
- the first contact portions of the mating terminals and the first mating portion are provided side by side on the at least one of the first surfaces, and two opposite sides of the first mating portion are respectively provided with the first contact portions.
- the first contact portions of the mating terminals and the first mating portion are provided side by side on the at least one of the first surface, and only one side of the first mating portion is provided with the first contact portions.
- a width of the first mating portion is twice or more than twice a width of each of the first contact portions of the mating terminals.
- the tongue is formed by a printed circuit board (PCB)
- each of the first contact portions is an electrical conduction trace on the PCB
- the first mating portion is a thermal conduction trace on the PCB.
- each of the first surfaces is provided with multiple ones of the first contact portions, the first mating portion is exposed from each of the first surfaces, the conductive terminals have a plurality of second contact portions arranged in two rows, and the plug connector is provided with two second mating portions correspondingly in contact with the first mating portion.
- each of the first surfaces is provided with multiple ones of the first contact portions and a first mating portion
- the conductive terminals have a plurality of second contact portions arranged in two rows
- the plug connector is provided with two second mating portions correspondingly in contact with the two first mating portions of the first surfaces.
- the socket connector further comprises a metal shell, the metal shell surrounds the tongue todefine an accommodating cavity therebetween, each of the first surfaces is provided with multiple ones of the first contact portions and at least two first mating portions, and the first contact portions and the first mating portions exposed from the two first surfaces are respectively symmetrical about a center point of the accommodating cavity at 180 degrees.
- the conducting portion protrudes out of the insulating body and is in contact with the chip to form thermal conduction.
- the mating joint further has a shielding shell provided outside the insulating body, and the second mating portion is accommodated in the shielding shell.
- the plug connector further comprises a masking shell provided at a rear end of the shielding shell, the circuit board is located in the masking shell, and the masking shell has an abutting portion in contact with the chip or the conducting portion.
- At least one of the first thermal conduction member and the second thermal conduction member is a thermal transistor or a capillary.
- the mating terminals on each of the first surfaces are provided side by side in a left-right direction, and comprise, sequentially from left to right, a grounding terminal, a pair of differential signal terminals for transmitting universal serial bus (USB) 3.0 signals, a power terminal, a reserved terminal, a pair of USB 2.0 terminals, a reserved terminal, a power terminal, a pair of differential signal terminals for transmitting USB 3.0 signals and a grounding terminal.
- USB universal serial bus
- the socket connector is mounted on a main board and exposed from one side of a casing, the main board is located in the casing, a heat dissipating device is provided in the casing, the at least one first thermal conduction member has a heat dissipating portion protruding out of the socket connector, and the heat dissipating device is configured for dissipating heat from the heat dissipating portion.
- a front end of the insulating body has a mating slot configured to accommodate the tongue
- each of the conductive terminals has a second contact portion, the second contact portion and the second mating portion respectively protrude into the mating slot
- the plug connector further comprises two latch arms located at a left side and a right side of the mating slot, each of the latch arms has a latch portion protruding into the mating slot
- the socket connector further comprises a middle shielding plate located between the two first surfaces, the middle shielding plate has two latch notches respectively exposed from a left side and a right side of the tongue, and the latch portions of the two latch arms are configured to be buckled to the latch notches.
- the socket connector is provided with the first thermal conduction member, the first thermal conduction member has the first mating portion, and the first mating portion is exposed from at least one of the first surfaces of the tongue provided with the first contact portions.
- the plug connector is provided with the second thermal conduction member, and the second thermal conduction member is provided with the second mating portion and the conducting portion thermally conducted with the chip inside the plug connector.
- the first contact portions are in contact with the second contact portions to form an electrical connection
- the second mating portion is in contact with the first mating portion to form a thermal conduction
- heat generated by the chip is transferred to the first thermal conduction member through the second thermal conduction member, thereby quickly dissipating the heat generated by the chip out of the inside of the plug connector.
- FIG. 1 is a perspective view of a connector assembly according to a first embodiment of the present invention.
- FIG. 2 is a local perspective sectional view of the plug connector in FIG. 1 .
- FIG. 3 is a local perspective sectional view of FIG. 1 before the plug connector is inserted into a socket connector.
- FIG. 4 is a perspective view of FIG. 3 when the plug connector is completely mated with the socket connector.
- FIG. 5 is a sectional view of FIG. 1 before the plug connector is mated with the socket connector.
- FIG. 6 is another sectional view of FIG. 1 before the plug connector is mated with the socket connector.
- FIG. 7 is a sectional view of FIG. 1 when the plug connector is completely mated with the socket connector.
- FIG. 8 is a schematic view of a plug connector according to another embodiment of the present invention.
- FIG. 9 is a schematic view of a connector assembly according to a second embodiment of the present invention.
- relative terms such as “lower” or “bottom” and “upper” or “top,” may be used herein to describe one element's relationship to another element as illustrated in the Figures. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures. For example, if the device in one of the figures is turned over, elements described as being on the “lower” side of other elements would then be oriented on “upper” sides of the other elements. The exemplary term “lower”, can therefore, encompasses both an orientation of “lower” and “upper,” depending of the particular orientation of the figure.
- “around”, “about” or “approximately” shall generally mean within 20 percent, preferably within 10 percent, and more preferably within 5 percent of a given value or range. Numerical quantities given herein are approximate, meaning that the term “around”, “about” or “approximately” can be inferred if not expressly stated.
- this invention in one aspect, relates to a connector assembly.
- the connector assembly includes a socket connector 4 and a plug connector 5 .
- the socket connector 4 is mated with the plug connector 5 in a front-rear direction.
- the socket connector 4 is mounted on a main board 2 provided in the casing 1 , and the socket connector 4 is electrically connected with the main board 2 .
- a heat dissipating device 3 is further provided in the casing 1 , and the heat dissipating device 3 is adjacent to the socket connector 4 .
- the casing 1 may be a shell of a portable computer, or may be desktop computer mainframe box. Of course, the casing 1 may also be a shell of other types of electronic devices or the like.
- the casing 1 may be made of a plastic material or metal material. In this embodiment, the casing 1 is made of a plastic material.
- the casing 1 has a bottom wall 11 and multiple side walls 12 extending upward from the bottom wall 11 .
- the main board 2 is mounted on the bottom wall 11 , and one of the side walls 12 is provided with an opening 13 communicating with outside.
- the socket connector 4 is partially exposed from the opening 13 .
- the heat dissipating device 3 is mounted on the main board 2 .
- the heat dissipating device 3 is a fan.
- the heat dissipating device 3 has a fan body 31 and an air outlet 32 connected to the fan body 31 , and the air outlet 32 directly faces the socket connector 4 .
- the heat dissipating device 3 may also be mounted on another component or device in the casing 1 , or the heat dissipating device 3 may also be mounted on the casing 1 .
- the socket connector 4 includes a main body 41 , multiple mating terminals 42 , a middle shielding plate 43 , two grounding members 44 , a metal shell 45 and two first thermal conduction members 47 .
- the main body 41 is made of an insulating material.
- the main body 41 has a base 411 , a tongue 412 located at one end of the base 411 and a step portion 413 provided between the base 411 and the tongue 412 .
- the base 411 , the step portion 413 and the tongue 412 are sequentially provided in the front-rear direction.
- the tongue 412 has two first surfaces 4121 provided vertically opposite to each other.
- the mating terminals 42 are provided in upper and lower rows on the main body 41 , and each of the mating terminals 42 has a first contact portion 421 .
- the first contact portions 421 of the mating terminals 42 are exposed from the two first surfaces 4121 of the tongue 412 .
- the middle shielding plate 43 is located between the two first surfaces 4121 . That is, the middle shielding plate 43 is located between the two rows of the first contact portions 421 .
- the left and right sides of the middle shielding plate 43 correspondingly protrude out of the left and right sides of the tongue 412 .
- the middle shielding plate 43 further has two latch notches 431 respectively exposed from the left and right sides of the tongue 412 .
- the two grounding members 44 are provided on the opposite upper and lower surfaces of the step portion 413 , and the two grounding members 44 are buckled with each other on the left and right sides of the step portion 413 .
- the grounding members 44 are in contact with the metal shell 45 .
- the metal shell 45 is sleeved over the main body 41 , and the metal shell 45 forms an accommodating cavity 46 around the tongue 412 .
- the first thermal conduction members 47 have favorable thermal conductivity.
- the thermal conductivity of the first thermal conduction members 47 is higher than the thermal conductivity of the metal shell 45 .
- the first thermal conduction members 47 are provided on the main body 41 , and the first thermal conduction members 47 extend in the front-rear direction.
- Each of the first thermal conduction members 47 has a first mating portion 471 and a heat dissipating portion 472 , and the first mating portion 471 and the heat dissipating portion 472 are located on two opposite ends of each first thermal conduction member 47 .
- the two first mating portions 471 of the two first thermal conduction members 47 are correspondingly exposed from the two first surfaces 4121 .
- each of the first surfaces 4121 is provided with one of the first mating portions 471 .
- the first contact portions 421 of the mating terminals 42 and the first mating portion 471 on each of the first surfaces 4121 are provided side by side in the left-right direction, and the left and right sides of the first mating portion 471 are respectively provided with multiple ones of the first contact portions 421 .
- each of the first contact portions 421 and the first mating portions 471 is a flat plate structure, but a width of each first mating portion 471 in the left-right direction is twice or more than twice the width of each first contact portion 421 in the left-right direction.
- the first mating portion 471 in the left-right direction is located in a middle position of the tongue 412 .
- the two heat dissipating portions 472 of the two first thermal conduction members 47 are in contact with each other above the main board 2 .
- One of the heat dissipating portions 472 protrudes out of the main body 41 and is exposed from the socket connector 4 , and is in contact with a heat dissipation pattern (not illustrated) on the main board 2 to form a thermal conduction.
- the first contact portions 421 and the first mating portions 471 exposed from the two first surfaces 4121 are symmetrical about a center of the accommodating cavity 46 at 180 degrees.
- the socket connector 4 may be provided with one first thermal conduction member 47 , but the first thermal conduction member 47 is only provided with one heat dissipating portion 472 and two first mating portions 471 integrally extending from the heat dissipating portion 472 , and the two first mating portions 471 are aligned vertically.
- the socket connector 4 can be only provided with one first thermal conduction member 47 , and a thickness of the first mating portion 471 in a vertical direction is greater than a thickness of the tongue 412 in the vertical direction.
- the first mating portion 471 may be simultaneously exposed from the upper and lower first surfaces 4121 .
- the middle shielding plate 43 is provided with a slot (not illustrated) in a position corresponding to the first thermal conduction member 47 in the vertical direction to give way to the first thermal conduction member 47 , and the middle shielding plate 43 is not in contact with the first thermal conduction member 47 .
- the heat dissipating portion 472 may also be in contact with the metal shell 45 so as to implement heat dissipation through the metal shell 45 , or the heat dissipating portion 472 is connected with a heat sink (not illustrated) with heat dissipation fins.
- the first thermal conduction members 47 may selectively be capillaries or thermal transistors. Since a capillary has a smaller diameter, a capillary bundle formed by multiple capillaries may be used, and both the capillaries and the thermal transistors have favorable thermal conductivity.
- the mating terminals of the conventional socket connector are provided in upper and lower rows on the tongue.
- the mating terminals in each row include, sequentially from left to right, a grounding terminal, a pair of differential signal terminals (high-speed terminals) for transmitting USB 3.0 signals, a power terminal, a reserved terminal, a pair of USB 2.0 terminals, a reserved terminal, a power terminal, a pair of differential signal terminals (high-speed terminals) for transmitting USB 3.0 signals and a grounding terminal.
- each of the first mating portions 471 occupies a position of the pair of USB 2.0 terminals on the first surface 4121 , and the other mating terminals 42 are unchanged.
- the first mating portions 471 in this embodiment replace the pair of USB 2.0 terminals on the first surface 4121 .
- the socket connector 4 is a non-standard USB Type-C socket connector.
- the plug connector 5 includes a circuit board 51 , at least one chip 52 provided on the circuit board 51 , a mating joint 53 electrically connected to one end of the circuit board 51 , a cable 54 electrically connected to the other end of the circuit board 51 , a masking shell 55 , an insulating shell 56 , and two second thermal conduction members 57 .
- the mating joint 53 has an insulating body 531 , multiple conductive terminals 532 provided on the insulating body 531 , a latch member 533 , a shielding shell 534 sleeved over the insulating body 1 , and two grounding elastic sheets 535 provided on the upper and lower surfaces of the insulating body 1 .
- a front end of the insulating body 531 has a mating slot 5311 .
- the conductive terminals 532 are provided in two rows, and each of the conductive terminals 532 has a second contact portion 5321 protruding forward into the mating slot 5311 .
- the second contact portions 5321 of the conductive terminals 532 are provided in two rows on the upper and lower sides of the mating slot 5311 .
- the latch member 533 is formed by blanking a metal sheet.
- the latch member 533 has a body portion (not illustrated) and two latch arms 5331 formed by extending forward from two opposite sides of the body portion.
- the body portion is located between the two rows of the conductive terminals 532 and configured to shield signal interference between the two rows of the conductive terminals 532 .
- the two latch arms 5331 are located on the left and right sides of the insulating body 531 , and each of the latch arms 5331 has a latch portion 5332 protruding into the mating slot 5311 .
- the latch portions 5332 are configured to be buckled to the latch notches 431 .
- the shielding shell 534 is a tubular structure seamlessly connected and formed by an drawing process.
- Each of the grounding elastic sheets 535 is sandwiched between the insulating body 1 and the shielding shell 534 .
- Each of the grounding elastic sheets 535 has multiple grounding contacts 5351 protruding into the mating slot 5311 , and the grounding contacts 5351 are located in front of the second contact portions 5321 .
- the masking shell 55 is sleeved over a rear end of the shielding shell 534 .
- the circuit board 51 is located in the masking shell 55 .
- the overlapped portions of the masking shell 55 and the shielding shell 534 are fixed together by spot soldering, or may also be fixed to each other through a buckle structure.
- the insulating shell 56 covers the masking shell 55 and the shielding shell 534 .
- the mating joint 73 projects forward out of a front end surface of the insulating shell 56
- the shielding shell 534 also projects forward out of the front end surface of the insulating shell 56 .
- the insulating shell 56 is injection-molded outside of the masking shell 55 , the shielding shell 534 and the cable 54 .
- the plug connector 5 is provided with the second thermal conduction members 57 having favorable thermal conductivity.
- the material of the second thermal conduction members 57 is different from the materials of the masking shell 55 and the shielding shell 534 , and the thermal conductivity of the second thermal conduction members 57 is higher than the thermal conductivity of the masking shell 55 and the shielding shell 534 .
- the second thermal conduction members 57 are provided on the insulating body 531 and accommodated in the shielding shell 534 .
- the second thermal conduction members 57 extend in the front-rear direction.
- Each of the second thermal conduction members 57 is provided with a second mating portion 571 , a conducting portion 572 and a connecting portion 573 connected between the second mating portion 571 and the conducting portion 572 .
- the connecting portion 573 is fixedly provided on the insulating body 531 .
- the second mating portion 571 protrudes forward into the mating slot 5311 .
- the two second mating portions 571 of the two second thermal conduction members 57 are located on the upper and lower sides of the mating slot 5311 , and each second mating portion 571 is located in a middle position of the second contact portions 5321 in the corresponding row in the left-right direction.
- Each of the second contact portions 5321 and the second mating portions 571 is an elastic contact arm structure, but a width of each second mating portion 571 in the left-right direction is twice or more than twice the width of each second contact portion 5321 in the left-right direction.
- the two rows of the second contact portions 5321 and the two second mating portions 571 are symmetrical about a center of the mating slot 5311 at 180 degrees.
- the two conducting portions 572 are in contact with the rear end of the insulating body 531 , and one of the conducting portions 572 extends backward out of the insulating body 531 to be in contact with the chip 52 . Further, thermal conduction paste or another high-thermal-conductivity component may also be provided between the conducting portions 572 and the chip 52 .
- the plug connector 5 may change its local structure or add one or more structures, so the heat generated by the chip 52 may also be abundantly dissipated from the inside of the plug connector 5 .
- the two conducting portions 572 respectively protrude out of the rear end of the insulating body 531 to be respectively in contact with the chip 52 to form a thermal conduction.
- the plug connector 5 may be provided with one second thermal conduction member 57 , and the second thermal conduction member 57 has one conducting portion 572 and the two second mating portions 571 integrally extending forward from the conducting portion 572 .
- the two second mating portions 571 are aligned vertically, and the conducting portion 572 also protrudes out of the rear end of the insulating body 531 to be in contact with the chip 52 to form a thermal conduction.
- the conducting portion 572 is in contact with the shielding shell 534 or the masking shell 55 , and the shielding shell 534 or the masking shell 55 is additionally provided with an abutting portion 551 .
- the abutting portion 551 is in contact with the chip 52 to form a thermal conduction.
- thermal conduction paste or another high-thermal-conductivity component may be also provided between the abutting portion 551 and the chip 52 .
- the masking shell 55 is additionally provided with at least one abutting portion 551 , and the abutting portion 551 abuts the chip 52 or abuts the conducting portion 572 . Meanwhile, at least one of the conducting portions 572 is in contact with the chip 52 to form a thermal conduction.
- multiple chips 52 may be provided, and the chips 52 may be provided on one surface of the circuit board 51 or provided on the opposite upper and lower surfaces of the circuit board 51 .
- the two conducting portions 572 of the two second thermal conduction members 57 may be respectively in contact with different chips 52 , or may also be in contact with the same chip 52 .
- the second thermal conduction members 57 may selectively be capillaries or thermal transistors. Since a capillary has a small diameter, a capillary bundle formed by multiple capillaries may be used, and both the capillaries and the thermal transistors have favorable thermal conductivity.
- the plug connector 5 and the socket connector 4 need to match with each other, so the arrangement of the conductive terminals 532 in the plug connector 5 should be the same as that of the socket connector 4 .
- the conductive terminals of the conventional plug connector are arranged in the upper and lower rows on the insulating body.
- the conductive terminals in each row include, sequentially from left to right, a grounding terminal, a pair of differential signal terminals (high-speed terminals) for transmitting USB 3.0 signals, a power supply terminal, a reserved terminal, a pair of USB 2.0 terminals, a reserved terminal, a power supply terminal, a pair of differential signal terminals (high-speed terminals) for transmitting USB 3.0 signals and a grounding terminal.
- each of the second mating portions 571 occupies a position of the pair of USB 2.0 terminals, and the other conductive terminals 532 are unchanged.
- the second mating portions 571 in this embodiment replace the pair of USB 2.0 terminals.
- the plug connector 5 is a non-standard USB Type-C plug connector.
- the front end of the mating joint 53 is inserted into the accommodating cavity 46 .
- the first contact portions 421 are in contact with the second contact portions 5321 to form an electrical connection
- the latch portions 5332 are buckled to the latch notches 431
- the grounding contact 5351 abuts the grounding member 44 to form a grounding path
- the shielding shell 534 is in contact with the metal shell 45 to form a grounding path.
- the second mating portion 571 is elastically in contact with the first mating portion 471 so as to form a thermal conduction, such that the heat generated by the chip 52 is quickly transferred to the first thermal conduction member 47 through the second thermal conduction member 57 .
- the fan body 31 operates to drive air to flow quickly. Since the air outlet 32 directly faces the heat dissipating portion 472 and the metal shell 45 , air flow around the heat dissipating portion 472 and the metal shell 45 may be accelerated to perform heat dissipation on the first thermal conduction members 47 . In addition, the air outlet 32 also accelerates air flow around the heat dissipation pattern on the main board 2 which is thermally conductive with the first thermal conduction members 47 , so as to increase the heat dissipation area and accelerate the heat dissipation. The heat dissipated into the casing 1 is then transferred to the outside air through the heat dissipation structure in the casing 1 .
- FIG. 9 shows a connector assembly according to a second embodiment of the present invention.
- the general structures of the connector assembly in this embodiment are the same as those of the first embodiment, and the same structures will not be elaborated again.
- the different structures in this embodiment are described as follows.
- Each of the first surfaces 4121 is similarly provided with the first contact portions 421 , which are flat plate shaped and are provided side by side in the left-right direction.
- Two first mating portions 471 are exposed from each of the first surfaces 4121 , and the first mating portions 471 exposed from the two first surfaces 4121 are aligned vertically. On each of the first surfaces 4121 , only one side of the first mating portion 471 is provided with the first contact portions 421 .
- the mating terminals 42 provided on each of the first surfaces 4121 include, sequentially from left to right, a grounding terminal, a pair of differential signal terminals (high-speed terminals) for transmitting USB 3.0 signals, a power terminal, a reserved terminal, a pair of USB 2.0 terminals, a reserved terminal, a power terminal, a pair of differential signal terminals (high-speed terminals) for transmitting USB 3.0 signals and a grounding terminal.
- the first contact portions 421 and the first mating portions 471 on the two first surfaces 4121 are symmetrical about the center of the accommodating cavity 46 at 180 degrees, and each of the upper and lower rows of the second contact portions 5321 in the plug connector 5 is also provided with the two second mating portions 571 . Since the plug connector 5 is mated with the socket connector 4 , the two second mating portions 571 in each row are also located on the relatively outermost sides of each row in the left-right direction. The two rows of the second contact portions 5321 and the second mating portions 571 are symmetrical about the center of the mating slot 5311 at 180 degrees.
- the conductive terminals in each row on the upper and lower sides of the mating slot 5311 include, sequentially from left to right, a grounding terminal, a pair of differential signal terminals (high-speed terminals) for transmitting USB 3.0 signals, a power supply terminal, a reserved terminal, a pair of USB 2.0 terminals, a reserved terminal, a power supply terminal, a pair of differential signal terminals (high-speed terminals) for transmitting USB 3.0 signals and a grounding terminal.
- the plug connector 5 may be inserted into the socket connector 5 forwardly or reversely.
- the socket connector 4 is provided with at least one first thermal conduction member 47 .
- the first mating portion 471 is only exposed from one of the first surfaces 4121 provided with the first contact portions 421 , and the first mating portion 471 may be provided on one side of the first contact portions 421 or provided among the first contact portions 421 .
- the plug connector 5 may be only provided with one second thermal conduction member 57
- the second thermal conduction member 57 is only provided with one second mating portion 571 which is in contact with the first mating portion 471 to form a thermal conduction.
- the tongue 412 may be formed by a PCB.
- the first contact portions 421 are conductive traces on the PCB
- the first mating portions 471 are thermally conductive patterns on the PCB.
- a corresponding connection may be formed respectively with the conductive traces and the thermally conductive patterns on the PCB through multiple conversion terminals and at least one conversion thermal conduction member.
- the connector assembly according to certain embodiments of the present invention has the following beneficial effects:
- the socket connector 4 is provided with the first thermal conduction member 47 .
- the first thermal conduction member 47 has the first mating portion 471 , and the first mating portion 471 is exposed from the at least one first surface 4121 of the tongue 412 provided with the first contact portions 421 .
- the plug connector 5 is provided with the second thermal conduction member 57 , and the second thermal conduction member 57 is provided with the second mating portion 571 and the conducting portion 572 which is thermally conducted with the chip 52 inside the plug connector 5 .
- the first contact portions 421 are in contact with the second contact portions 5321 to form an electrical connection
- the second mating portion 571 is in contact with the first mating portion 471 to form a thermal conduction
- heat generated by the chip 52 is transferred to the first thermal conduction member 47 through the second thermal conduction member 57 , thereby quickly dissipating the heat generated by the chip 52 out of the inside of the plug connector 4 .
- each first mating portion 471 in the left-right direction is twice or more than twice the width of each first contact portion 421 in the left-right direction
- the width of each second mating portion 571 in the left-right direction is twice or more than twice the width of each second contact portion 5321 in the left-right direction.
- the masking shell 55 is provided with the abutting portion 551 which is in contact with the chip 52 , and the conducting portion 572 is in contact with the masking shell 55 or the shielding shell 534 , such that the heat generated by the chip 52 may be transferred out through the second thermal conduction member 57 . Further, a part of the heat generated by the chip 52 can be transferred to the metal shell 45 through the contact between the shielding shell 534 and the metal shell 45 when the plug connector 5 is mated with the socket connector 4 . Moreover, the heat dissipating device 3 may also accelerate air flow around the metal shell 45 to perform heat dissipation on the metal shell 45 .
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
- This non-provisional application claims priority to and the benefit of, pursuant to 35 U.S.C. § 119(a), patent application Serial No. CN201720851266.6, filed in China on Jul. 14, 2017. The disclosure of the above application is incorporated herein in its entirety by reference.
- Some references, which may include patents, patent applications and various publications, are cited and discussed in the description of this disclosure. The citation and/or discussion of such references is provided merely to clarify the description of the present disclosure and is not an admission that any such reference is “prior art” to the disclosure described herein. All references cited and discussed in this specification are incorporated herein by reference in their entireties and to the same extent as if each reference were individually incorporated by reference.
- The present invention relates to a connector assembly, and more particularly to a connector assembly having a thermal conduction member.
- The background description provided herein is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.
- A commonly used plug connector in the industry includes a circuit board, a mating joint electrically connected to one end of the circuit board, a cable electrically connected to the other end of the circuit board, and a metal shell covering a rear end of the mating joint and outside of the circuit board. Currently, due to the increasingly powerful functions of electronic devices, the signal transmission requirements on plug connectors are also increasing. In order to enable the plug connector to have greater data transmission bandwidth and the ability to transmit uncompressed audio signals and high resolution video signals, a chip is generally installed on the circuit board to enhance the decoding capability of the plug connector. However, it is well-known that, as the chip speed becomes faster and the required power is also increased, the chip will generate a lot of heat during operation. If the heat is not dissipated in time, the chip will become too hot and fail, and the plug connector will be damaged, resulting in failure of the entire electronic device.
- In order to solve this problem, the metal shell is provided with an abutting portion, which elastically abuts the chip, such that the heat generated by the chip is transferred to the metal shell, and then heat exchange is performed with the outside air through the metal shell to achieve the purpose of heat dissipation. However, due to the low thermal conductivity of the metal shell, the heat transfer rate is slow, such that the heat generated by the chip cannot be quickly dissipated, resulting in poor heat dissipation effect, and affecting the reliability of the signal transmission of the plug connector.
- Therefore, a heretofore unaddressed need to design a new connector assembly exists in the art to address the aforementioned deficiencies and inadequacies.
- The invention is directed to a connector assembly having a thermal conduction member, which can quickly dissipate heat generated by the chip inside the plug connector.
- To achieve the foregoing objective, the present invention adopts the following technical solutions:
- A connector assembly includes: a socket connector, including: a main body, having a tongue, wherein the tongue has two first surfaces provided opposite to each other; a plurality of mating terminals, provided on the main body, wherein each of the mating terminals has a first contact portion, and the first contact portions of the mating terminals are exposed from at least one of the first surfaces; and at least one first thermal conduction member, provided on the main body, wherein the first thermal conduction member has a first mating portion, and the first mating portion is exposed to the at least one of the first surfaces provided with the first contact portions of the mating terminals; and a plug connector, including: a circuit board; at least one chip, provided on the circuit board; a mating joint, electrically connected to one end of the circuit board, wherein the mating joint has an insulating body and a plurality of conductive terminals provided on the insulating body; and at least one second thermal conduction member, provided on the insulating body, wherein the second thermal conduction member has a second mating portion and a conducting portion, and the conducting portion is thermally conducted with the chip, wherein when the plug connector is mated with the socket connector, the first contact portions of the mating terminals are in contact with the conductive terminals to form an electrical connection, and the first mating portion is in contact with the second mating portion to form thermal conduction.
- In certain embodiments, the first contact portions of the mating terminals and the first mating portion are provided side by side on the at least one of the first surfaces, and two opposite sides of the first mating portion are respectively provided with the first contact portions.
- In certain embodiments, the first contact portions of the mating terminals and the first mating portion are provided side by side on the at least one of the first surface, and only one side of the first mating portion is provided with the first contact portions.
- In certain embodiments, a width of the first mating portion is twice or more than twice a width of each of the first contact portions of the mating terminals.
- In certain embodiments, the tongue is formed by a printed circuit board (PCB), each of the first contact portions is an electrical conduction trace on the PCB, and the first mating portion is a thermal conduction trace on the PCB.
- In certain embodiments, each of the first surfaces is provided with multiple ones of the first contact portions, the first mating portion is exposed from each of the first surfaces, the conductive terminals have a plurality of second contact portions arranged in two rows, and the plug connector is provided with two second mating portions correspondingly in contact with the first mating portion.
- In certain embodiments, each of the first surfaces is provided with multiple ones of the first contact portions and a first mating portion, the conductive terminals have a plurality of second contact portions arranged in two rows, and the plug connector is provided with two second mating portions correspondingly in contact with the two first mating portions of the first surfaces.
- In certain embodiments, the socket connector further comprises a metal shell, the metal shell surrounds the tongue todefine an accommodating cavity therebetween, each of the first surfaces is provided with multiple ones of the first contact portions and at least two first mating portions, and the first contact portions and the first mating portions exposed from the two first surfaces are respectively symmetrical about a center point of the accommodating cavity at 180 degrees.
- In certain embodiments, the conducting portion protrudes out of the insulating body and is in contact with the chip to form thermal conduction.
- In certain embodiments, the mating joint further has a shielding shell provided outside the insulating body, and the second mating portion is accommodated in the shielding shell.
- In certain embodiments, the plug connector further comprises a masking shell provided at a rear end of the shielding shell, the circuit board is located in the masking shell, and the masking shell has an abutting portion in contact with the chip or the conducting portion.
- In certain embodiments, at least one of the first thermal conduction member and the second thermal conduction member is a thermal transistor or a capillary.
- In certain embodiments, the mating terminals on each of the first surfaces are provided side by side in a left-right direction, and comprise, sequentially from left to right, a grounding terminal, a pair of differential signal terminals for transmitting universal serial bus (USB) 3.0 signals, a power terminal, a reserved terminal, a pair of USB 2.0 terminals, a reserved terminal, a power terminal, a pair of differential signal terminals for transmitting USB 3.0 signals and a grounding terminal.
- In certain embodiments, the socket connector is mounted on a main board and exposed from one side of a casing, the main board is located in the casing, a heat dissipating device is provided in the casing, the at least one first thermal conduction member has a heat dissipating portion protruding out of the socket connector, and the heat dissipating device is configured for dissipating heat from the heat dissipating portion.
- In certain embodiments, a front end of the insulating body has a mating slot configured to accommodate the tongue, each of the conductive terminals has a second contact portion, the second contact portion and the second mating portion respectively protrude into the mating slot, the plug connector further comprises two latch arms located at a left side and a right side of the mating slot, each of the latch arms has a latch portion protruding into the mating slot, the socket connector further comprises a middle shielding plate located between the two first surfaces, the middle shielding plate has two latch notches respectively exposed from a left side and a right side of the tongue, and the latch portions of the two latch arms are configured to be buckled to the latch notches.
- Compared with the related art, certain embodiments of the present invention has the following advantages: the socket connector is provided with the first thermal conduction member, the first thermal conduction member has the first mating portion, and the first mating portion is exposed from at least one of the first surfaces of the tongue provided with the first contact portions. The plug connector is provided with the second thermal conduction member, and the second thermal conduction member is provided with the second mating portion and the conducting portion thermally conducted with the chip inside the plug connector. When the plug connector is completely mated with the socket connector, the first contact portions are in contact with the second contact portions to form an electrical connection, the second mating portion is in contact with the first mating portion to form a thermal conduction, and heat generated by the chip is transferred to the first thermal conduction member through the second thermal conduction member, thereby quickly dissipating the heat generated by the chip out of the inside of the plug connector.
- These and other aspects of the present invention will become apparent from the following description of the preferred embodiment taken in conjunction with the following drawings, although variations and modifications therein may be effected without departing from the spirit and scope of the novel concepts of the disclosure.
- The accompanying drawings illustrate one or more embodiments of the disclosure and together with the written description, serve to explain the principles of the disclosure. Wherever possible, the same reference numbers are used throughout the drawings to refer to the same or like elements of an embodiment, and wherein:
-
FIG. 1 is a perspective view of a connector assembly according to a first embodiment of the present invention. -
FIG. 2 is a local perspective sectional view of the plug connector inFIG. 1 . -
FIG. 3 is a local perspective sectional view ofFIG. 1 before the plug connector is inserted into a socket connector. -
FIG. 4 is a perspective view ofFIG. 3 when the plug connector is completely mated with the socket connector. -
FIG. 5 is a sectional view ofFIG. 1 before the plug connector is mated with the socket connector. -
FIG. 6 is another sectional view ofFIG. 1 before the plug connector is mated with the socket connector. -
FIG. 7 is a sectional view ofFIG. 1 when the plug connector is completely mated with the socket connector. -
FIG. 8 is a schematic view of a plug connector according to another embodiment of the present invention. -
FIG. 9 is a schematic view of a connector assembly according to a second embodiment of the present invention. - The present invention is more particularly described in the following examples that are intended as illustrative only since numerous modifications and variations therein will be apparent to those skilled in the art. Various embodiments of the invention are now described in detail. Referring to the drawings, like numbers indicate like components throughout the views. As used in the description herein and throughout the claims that follow, the meaning of “a”, “an”, and “the” includes plural reference unless the context clearly dictates otherwise. Also, as used in the description herein and throughout the claims that follow, the meaning of “in” includes “in” and “on” unless the context clearly dictates otherwise. Moreover, titles or subtitles may be used in the specification for the convenience of a reader, which shall have no influence on the scope of the present invention.
- It will be understood that when an element is referred to as being “on” another element, it can be directly on the other element or intervening elements may be present therebetween. In contrast, when an element is referred to as being “directly on” another element, there are no intervening elements present. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
- Furthermore, relative terms, such as “lower” or “bottom” and “upper” or “top,” may be used herein to describe one element's relationship to another element as illustrated in the Figures. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures. For example, if the device in one of the figures is turned over, elements described as being on the “lower” side of other elements would then be oriented on “upper” sides of the other elements. The exemplary term “lower”, can therefore, encompasses both an orientation of “lower” and “upper,” depending of the particular orientation of the figure. Similarly, if the device in one of the figures is turned over, elements described as “below” or “beneath” other elements would then be oriented “above” the other elements. The exemplary terms “below” or “beneath” can, therefore, encompass both an orientation of above and below.
- As used herein, “around”, “about” or “approximately” shall generally mean within 20 percent, preferably within 10 percent, and more preferably within 5 percent of a given value or range. Numerical quantities given herein are approximate, meaning that the term “around”, “about” or “approximately” can be inferred if not expressly stated.
- As used herein, the terms “comprising”, “including”, “carrying”, “having”, “containing”, “involving”, and the like are to be understood to be open-ended, i.e., to mean including but not limited to.
- The description will be made as to the embodiments of the present invention in conjunction with the accompanying drawings in
FIGS. 1-9 . In accordance with the purposes of this invention, as embodied and broadly described herein, this invention, in one aspect, relates to a connector assembly. - Referring to
FIG. 1 toFIG. 7 , a connector assembly according to a first embodiment of the present invention is provided. The connector assembly includes asocket connector 4 and aplug connector 5. Thesocket connector 4 is mated with theplug connector 5 in a front-rear direction. Thesocket connector 4 is mounted on amain board 2 provided in thecasing 1, and thesocket connector 4 is electrically connected with themain board 2. Aheat dissipating device 3 is further provided in thecasing 1, and theheat dissipating device 3 is adjacent to thesocket connector 4. - Referring to
FIG. 1 andFIG. 5 , thecasing 1 may be a shell of a portable computer, or may be desktop computer mainframe box. Of course, thecasing 1 may also be a shell of other types of electronic devices or the like. Thecasing 1 may be made of a plastic material or metal material. In this embodiment, thecasing 1 is made of a plastic material. Thecasing 1 has abottom wall 11 andmultiple side walls 12 extending upward from thebottom wall 11. Themain board 2 is mounted on thebottom wall 11, and one of theside walls 12 is provided with anopening 13 communicating with outside. Thesocket connector 4 is partially exposed from theopening 13. - Referring to
FIG. 1 , in this embodiment, theheat dissipating device 3 is mounted on themain board 2. Theheat dissipating device 3 is a fan. Theheat dissipating device 3 has afan body 31 and anair outlet 32 connected to thefan body 31, and theair outlet 32 directly faces thesocket connector 4. In other embodiments, theheat dissipating device 3 may also be mounted on another component or device in thecasing 1, or theheat dissipating device 3 may also be mounted on thecasing 1. - Referring to
FIG. 3 ,FIG. 5 andFIG. 6 , thesocket connector 4 includes amain body 41,multiple mating terminals 42, amiddle shielding plate 43, two groundingmembers 44, ametal shell 45 and two firstthermal conduction members 47. In this embodiment, themain body 41 is made of an insulating material. Themain body 41 has abase 411, atongue 412 located at one end of thebase 411 and astep portion 413 provided between the base 411 and thetongue 412. Thebase 411, thestep portion 413 and thetongue 412 are sequentially provided in the front-rear direction. Thetongue 412 has twofirst surfaces 4121 provided vertically opposite to each other. Themating terminals 42 are provided in upper and lower rows on themain body 41, and each of themating terminals 42 has afirst contact portion 421. Thefirst contact portions 421 of themating terminals 42 are exposed from the twofirst surfaces 4121 of thetongue 412. Themiddle shielding plate 43 is located between the twofirst surfaces 4121. That is, themiddle shielding plate 43 is located between the two rows of thefirst contact portions 421. The left and right sides of themiddle shielding plate 43 correspondingly protrude out of the left and right sides of thetongue 412. Themiddle shielding plate 43 further has twolatch notches 431 respectively exposed from the left and right sides of thetongue 412. The twogrounding members 44 are provided on the opposite upper and lower surfaces of thestep portion 413, and the two groundingmembers 44 are buckled with each other on the left and right sides of thestep portion 413. The groundingmembers 44 are in contact with themetal shell 45. Themetal shell 45 is sleeved over themain body 41, and themetal shell 45 forms anaccommodating cavity 46 around thetongue 412. - Referring to
FIG. 3 ,FIG. 5 andFIG. 6 , the firstthermal conduction members 47 have favorable thermal conductivity. The thermal conductivity of the firstthermal conduction members 47 is higher than the thermal conductivity of themetal shell 45. The firstthermal conduction members 47 are provided on themain body 41, and the firstthermal conduction members 47 extend in the front-rear direction. Each of the firstthermal conduction members 47 has afirst mating portion 471 and aheat dissipating portion 472, and thefirst mating portion 471 and theheat dissipating portion 472 are located on two opposite ends of each firstthermal conduction member 47. The twofirst mating portions 471 of the two firstthermal conduction members 47 are correspondingly exposed from the twofirst surfaces 4121. That is, each of thefirst surfaces 4121 is provided with one of thefirst mating portions 471. Thefirst contact portions 421 of themating terminals 42 and thefirst mating portion 471 on each of thefirst surfaces 4121 are provided side by side in the left-right direction, and the left and right sides of thefirst mating portion 471 are respectively provided with multiple ones of thefirst contact portions 421. Further, each of thefirst contact portions 421 and thefirst mating portions 471 is a flat plate structure, but a width of eachfirst mating portion 471 in the left-right direction is twice or more than twice the width of eachfirst contact portion 421 in the left-right direction. In this embodiment, thefirst mating portion 471 in the left-right direction is located in a middle position of thetongue 412. The twoheat dissipating portions 472 of the two firstthermal conduction members 47 are in contact with each other above themain board 2. One of theheat dissipating portions 472 protrudes out of themain body 41 and is exposed from thesocket connector 4, and is in contact with a heat dissipation pattern (not illustrated) on themain board 2 to form a thermal conduction. In this embodiment, thefirst contact portions 421 and thefirst mating portions 471 exposed from the twofirst surfaces 4121 are symmetrical about a center of theaccommodating cavity 46 at 180 degrees. In another embodiment, thesocket connector 4 may be provided with one firstthermal conduction member 47, but the firstthermal conduction member 47 is only provided with oneheat dissipating portion 472 and twofirst mating portions 471 integrally extending from theheat dissipating portion 472, and the twofirst mating portions 471 are aligned vertically. In yet another embodiment, thesocket connector 4 can be only provided with one firstthermal conduction member 47, and a thickness of thefirst mating portion 471 in a vertical direction is greater than a thickness of thetongue 412 in the vertical direction. Thus, thefirst mating portion 471 may be simultaneously exposed from the upper and lowerfirst surfaces 4121. Themiddle shielding plate 43 is provided with a slot (not illustrated) in a position corresponding to the firstthermal conduction member 47 in the vertical direction to give way to the firstthermal conduction member 47, and themiddle shielding plate 43 is not in contact with the firstthermal conduction member 47. Theheat dissipating portion 472 may also be in contact with themetal shell 45 so as to implement heat dissipation through themetal shell 45, or theheat dissipating portion 472 is connected with a heat sink (not illustrated) with heat dissipation fins. In still another embodiment, the firstthermal conduction members 47 may selectively be capillaries or thermal transistors. Since a capillary has a smaller diameter, a capillary bundle formed by multiple capillaries may be used, and both the capillaries and the thermal transistors have favorable thermal conductivity. - In a conventional socket connector satisfying USB Type-C terminal arrangement, the mating terminals of the conventional socket connector are provided in upper and lower rows on the tongue. The mating terminals in each row include, sequentially from left to right, a grounding terminal, a pair of differential signal terminals (high-speed terminals) for transmitting USB 3.0 signals, a power terminal, a reserved terminal, a pair of USB 2.0 terminals, a reserved terminal, a power terminal, a pair of differential signal terminals (high-speed terminals) for transmitting USB 3.0 signals and a grounding terminal. Referring to
FIG. 3 andFIG. 5 , in this embodiment, each of thefirst mating portions 471 occupies a position of the pair of USB 2.0 terminals on thefirst surface 4121, and theother mating terminals 42 are unchanged. In other words, thefirst mating portions 471 in this embodiment replace the pair of USB 2.0 terminals on thefirst surface 4121. Thus, thesocket connector 4 is a non-standard USB Type-C socket connector. - Referring to
FIG. 3 ,FIG. 5 andFIG. 6 , theplug connector 5 includes acircuit board 51, at least onechip 52 provided on thecircuit board 51, a mating joint 53 electrically connected to one end of thecircuit board 51, acable 54 electrically connected to the other end of thecircuit board 51, a maskingshell 55, an insulatingshell 56, and two secondthermal conduction members 57. The mating joint 53 has an insulatingbody 531, multipleconductive terminals 532 provided on the insulatingbody 531, alatch member 533, a shieldingshell 534 sleeved over the insulatingbody 1, and two groundingelastic sheets 535 provided on the upper and lower surfaces of the insulatingbody 1. A front end of the insulatingbody 531 has amating slot 5311. Theconductive terminals 532 are provided in two rows, and each of theconductive terminals 532 has asecond contact portion 5321 protruding forward into themating slot 5311. Thesecond contact portions 5321 of theconductive terminals 532 are provided in two rows on the upper and lower sides of themating slot 5311. Thelatch member 533 is formed by blanking a metal sheet. Thelatch member 533 has a body portion (not illustrated) and twolatch arms 5331 formed by extending forward from two opposite sides of the body portion. The body portion is located between the two rows of theconductive terminals 532 and configured to shield signal interference between the two rows of theconductive terminals 532. The twolatch arms 5331 are located on the left and right sides of the insulatingbody 531, and each of thelatch arms 5331 has alatch portion 5332 protruding into themating slot 5311. Thelatch portions 5332 are configured to be buckled to thelatch notches 431. The shieldingshell 534 is a tubular structure seamlessly connected and formed by an drawing process. Each of the groundingelastic sheets 535 is sandwiched between the insulatingbody 1 and the shieldingshell 534. Each of the groundingelastic sheets 535 hasmultiple grounding contacts 5351 protruding into themating slot 5311, and thegrounding contacts 5351 are located in front of thesecond contact portions 5321. The maskingshell 55 is sleeved over a rear end of the shieldingshell 534. Thecircuit board 51 is located in the maskingshell 55. The overlapped portions of the maskingshell 55 and the shieldingshell 534 are fixed together by spot soldering, or may also be fixed to each other through a buckle structure. The insulatingshell 56 covers the maskingshell 55 and the shieldingshell 534. The mating joint 73 projects forward out of a front end surface of the insulatingshell 56, and the shieldingshell 534 also projects forward out of the front end surface of the insulatingshell 56. In this embodiment, the insulatingshell 56 is injection-molded outside of the maskingshell 55, the shieldingshell 534 and thecable 54. - Referring to
FIG. 3 ,FIG. 5 andFIG. 6 , as the increasingly higher signal transmission requirements on theplug connector 5 and the enhancement of the signal processing capacity, thechip 52 will generate abundant heat during operation. In order to enable the heat generated by thechip 52 inside theplug connector 5 to be well dissipated, theplug connector 5 is provided with the secondthermal conduction members 57 having favorable thermal conductivity. The material of the secondthermal conduction members 57 is different from the materials of the maskingshell 55 and the shieldingshell 534, and the thermal conductivity of the secondthermal conduction members 57 is higher than the thermal conductivity of the maskingshell 55 and the shieldingshell 534. The secondthermal conduction members 57 are provided on the insulatingbody 531 and accommodated in the shieldingshell 534. The secondthermal conduction members 57 extend in the front-rear direction. Each of the secondthermal conduction members 57 is provided with asecond mating portion 571, a conductingportion 572 and a connectingportion 573 connected between thesecond mating portion 571 and the conductingportion 572. The connectingportion 573 is fixedly provided on the insulatingbody 531. Thesecond mating portion 571 protrudes forward into themating slot 5311. The twosecond mating portions 571 of the two secondthermal conduction members 57 are located on the upper and lower sides of themating slot 5311, and eachsecond mating portion 571 is located in a middle position of thesecond contact portions 5321 in the corresponding row in the left-right direction. Each of thesecond contact portions 5321 and thesecond mating portions 571 is an elastic contact arm structure, but a width of eachsecond mating portion 571 in the left-right direction is twice or more than twice the width of eachsecond contact portion 5321 in the left-right direction. The two rows of thesecond contact portions 5321 and the twosecond mating portions 571 are symmetrical about a center of themating slot 5311 at 180 degrees. The two conductingportions 572 are in contact with the rear end of the insulatingbody 531, and one of the conductingportions 572 extends backward out of the insulatingbody 531 to be in contact with thechip 52. Further, thermal conduction paste or another high-thermal-conductivity component may also be provided between the conductingportions 572 and thechip 52. - Referring to
FIG. 2 ,FIG. 5 andFIG. 8 , theplug connector 5 may change its local structure or add one or more structures, so the heat generated by thechip 52 may also be abundantly dissipated from the inside of theplug connector 5. For example, the two conductingportions 572 respectively protrude out of the rear end of the insulatingbody 531 to be respectively in contact with thechip 52 to form a thermal conduction. In another example, theplug connector 5 may be provided with one secondthermal conduction member 57, and the secondthermal conduction member 57 has one conductingportion 572 and the twosecond mating portions 571 integrally extending forward from the conductingportion 572. The twosecond mating portions 571 are aligned vertically, and the conductingportion 572 also protrudes out of the rear end of the insulatingbody 531 to be in contact with thechip 52 to form a thermal conduction. In a further example, the conductingportion 572 is in contact with the shieldingshell 534 or the maskingshell 55, and the shieldingshell 534 or the maskingshell 55 is additionally provided with an abuttingportion 551. The abuttingportion 551 is in contact with thechip 52 to form a thermal conduction. Further, thermal conduction paste or another high-thermal-conductivity component may be also provided between the abuttingportion 551 and thechip 52. In yet another example, the maskingshell 55 is additionally provided with at least one abuttingportion 551, and the abuttingportion 551 abuts thechip 52 or abuts the conductingportion 572. Meanwhile, at least one of the conductingportions 572 is in contact with thechip 52 to form a thermal conduction. In still another example,multiple chips 52 may be provided, and thechips 52 may be provided on one surface of thecircuit board 51 or provided on the opposite upper and lower surfaces of thecircuit board 51. The two conductingportions 572 of the two secondthermal conduction members 57 may be respectively in contact withdifferent chips 52, or may also be in contact with thesame chip 52. In yet a further example, the secondthermal conduction members 57 may selectively be capillaries or thermal transistors. Since a capillary has a small diameter, a capillary bundle formed by multiple capillaries may be used, and both the capillaries and the thermal transistors have favorable thermal conductivity. - Referring to
FIG. 3 andFIG. 5 , theplug connector 5 and thesocket connector 4 need to match with each other, so the arrangement of theconductive terminals 532 in theplug connector 5 should be the same as that of thesocket connector 4. Similarly, in a conventional plug connector satisfying the USB Type-C terminal arrangement, the conductive terminals of the conventional plug connector are arranged in the upper and lower rows on the insulating body. The conductive terminals in each row include, sequentially from left to right, a grounding terminal, a pair of differential signal terminals (high-speed terminals) for transmitting USB 3.0 signals, a power supply terminal, a reserved terminal, a pair of USB 2.0 terminals, a reserved terminal, a power supply terminal, a pair of differential signal terminals (high-speed terminals) for transmitting USB 3.0 signals and a grounding terminal. Referring toFIG. 3 andFIG. 5 , in this embodiment, each of thesecond mating portions 571 occupies a position of the pair of USB 2.0 terminals, and the otherconductive terminals 532 are unchanged. In other words, thesecond mating portions 571 in this embodiment replace the pair of USB 2.0 terminals. Thus, theplug connector 5 is a non-standard USB Type-C plug connector. - Referring to
FIG. 3 toFIG. 7 , when theplug connector 5 moves toward thesocket connector 4, and theplug connector 5 is completely mated with thesocket connector 4 forwardly or reversely, the front end of the mating joint 53 is inserted into theaccommodating cavity 46. At this time, thefirst contact portions 421 are in contact with thesecond contact portions 5321 to form an electrical connection, thelatch portions 5332 are buckled to thelatch notches 431, thegrounding contact 5351 abuts the groundingmember 44 to form a grounding path, and the shieldingshell 534 is in contact with themetal shell 45 to form a grounding path. Meanwhile, thesecond mating portion 571 is elastically in contact with thefirst mating portion 471 so as to form a thermal conduction, such that the heat generated by thechip 52 is quickly transferred to the firstthermal conduction member 47 through the secondthermal conduction member 57. - The
fan body 31 operates to drive air to flow quickly. Since theair outlet 32 directly faces theheat dissipating portion 472 and themetal shell 45, air flow around theheat dissipating portion 472 and themetal shell 45 may be accelerated to perform heat dissipation on the firstthermal conduction members 47. In addition, theair outlet 32 also accelerates air flow around the heat dissipation pattern on themain board 2 which is thermally conductive with the firstthermal conduction members 47, so as to increase the heat dissipation area and accelerate the heat dissipation. The heat dissipated into thecasing 1 is then transferred to the outside air through the heat dissipation structure in thecasing 1. - Referring to
FIG. 5 ,FIG. 6 andFIG. 9 ,FIG. 9 shows a connector assembly according to a second embodiment of the present invention. The general structures of the connector assembly in this embodiment are the same as those of the first embodiment, and the same structures will not be elaborated again. The different structures in this embodiment are described as follows. Each of thefirst surfaces 4121 is similarly provided with thefirst contact portions 421, which are flat plate shaped and are provided side by side in the left-right direction. Twofirst mating portions 471 are exposed from each of thefirst surfaces 4121, and thefirst mating portions 471 exposed from the twofirst surfaces 4121 are aligned vertically. On each of thefirst surfaces 4121, only one side of thefirst mating portion 471 is provided with thefirst contact portions 421. That is, on each of thefirst surfaces 4121, thefirst contact portions 421 are located between the twofirst mating portions 471 on the same plane. Themating terminals 42 provided on each of thefirst surfaces 4121 include, sequentially from left to right, a grounding terminal, a pair of differential signal terminals (high-speed terminals) for transmitting USB 3.0 signals, a power terminal, a reserved terminal, a pair of USB 2.0 terminals, a reserved terminal, a power terminal, a pair of differential signal terminals (high-speed terminals) for transmitting USB 3.0 signals and a grounding terminal. Similar to the first embodiment, thefirst contact portions 421 and thefirst mating portions 471 on the twofirst surfaces 4121 are symmetrical about the center of theaccommodating cavity 46 at 180 degrees, and each of the upper and lower rows of thesecond contact portions 5321 in theplug connector 5 is also provided with the twosecond mating portions 571. Since theplug connector 5 is mated with thesocket connector 4, the twosecond mating portions 571 in each row are also located on the relatively outermost sides of each row in the left-right direction. The two rows of thesecond contact portions 5321 and thesecond mating portions 571 are symmetrical about the center of themating slot 5311 at 180 degrees. The conductive terminals in each row on the upper and lower sides of themating slot 5311 include, sequentially from left to right, a grounding terminal, a pair of differential signal terminals (high-speed terminals) for transmitting USB 3.0 signals, a power supply terminal, a reserved terminal, a pair of USB 2.0 terminals, a reserved terminal, a power supply terminal, a pair of differential signal terminals (high-speed terminals) for transmitting USB 3.0 signals and a grounding terminal. Thus, theplug connector 5 may be inserted into thesocket connector 5 forwardly or reversely. In other embodiments, thesocket connector 4 is provided with at least one firstthermal conduction member 47. Thefirst mating portion 471 is only exposed from one of thefirst surfaces 4121 provided with thefirst contact portions 421, and thefirst mating portion 471 may be provided on one side of thefirst contact portions 421 or provided among thefirst contact portions 421. Correspondingly, theplug connector 5 may be only provided with one secondthermal conduction member 57, and the secondthermal conduction member 57 is only provided with onesecond mating portion 571 which is in contact with thefirst mating portion 471 to form a thermal conduction. In still another embodiment, thetongue 412 may be formed by a PCB. Thefirst contact portions 421 are conductive traces on the PCB, and thefirst mating portions 471 are thermally conductive patterns on the PCB. Thus, a corresponding connection may be formed respectively with the conductive traces and the thermally conductive patterns on the PCB through multiple conversion terminals and at least one conversion thermal conduction member. - To sum up, the connector assembly according to certain embodiments of the present invention has the following beneficial effects:
- 1. The
socket connector 4 is provided with the firstthermal conduction member 47. The firstthermal conduction member 47 has thefirst mating portion 471, and thefirst mating portion 471 is exposed from the at least onefirst surface 4121 of thetongue 412 provided with thefirst contact portions 421. Theplug connector 5 is provided with the secondthermal conduction member 57, and the secondthermal conduction member 57 is provided with thesecond mating portion 571 and the conductingportion 572 which is thermally conducted with thechip 52 inside theplug connector 5. When theplug connector 5 is completely mated with thesocket connector 4, thefirst contact portions 421 are in contact with thesecond contact portions 5321 to form an electrical connection, and thesecond mating portion 571 is in contact with thefirst mating portion 471 to form a thermal conduction, and heat generated by thechip 52 is transferred to the firstthermal conduction member 47 through the secondthermal conduction member 57, thereby quickly dissipating the heat generated by thechip 52 out of the inside of theplug connector 4. - 2. The width of each
first mating portion 471 in the left-right direction is twice or more than twice the width of eachfirst contact portion 421 in the left-right direction, and the width of eachsecond mating portion 571 in the left-right direction is twice or more than twice the width of eachsecond contact portion 5321 in the left-right direction. Thus, when thefirst mating portion 471 is mated with thesecond mating portion 571, a large contact area can be implemented, and the secondthermal conduction member 57 can quickly transfer the heat obtained from thechip 52 to the firstthermal conduction member 47, thereby accelerating the dissipation of the heat inside theplug connector 5. - 3. The masking
shell 55 is provided with the abuttingportion 551 which is in contact with thechip 52, and the conductingportion 572 is in contact with the maskingshell 55 or the shieldingshell 534, such that the heat generated by thechip 52 may be transferred out through the secondthermal conduction member 57. Further, a part of the heat generated by thechip 52 can be transferred to themetal shell 45 through the contact between the shieldingshell 534 and themetal shell 45 when theplug connector 5 is mated with thesocket connector 4. Moreover, theheat dissipating device 3 may also accelerate air flow around themetal shell 45 to perform heat dissipation on themetal shell 45. - The foregoing description of the exemplary embodiments of the invention has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the invention to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching.
- The embodiments are chosen and described in order to explain the principles of the invention and their practical application so as to activate others skilled in the art to utilize the invention and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those skilled in the art to which the present invention pertains without departing from its spirit and scope. Accordingly, the scope of the present invention is defined by the appended claims rather than the foregoing description and the exemplary embodiments described therein.
Claims (15)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720851266.6 | 2017-07-14 | ||
CN201720851266U | 2017-07-14 | ||
CN201720851266.6U CN207082649U (en) | 2017-07-14 | 2017-07-14 | Connector combination |
Publications (2)
Publication Number | Publication Date |
---|---|
US20190021185A1 true US20190021185A1 (en) | 2019-01-17 |
US10201112B1 US10201112B1 (en) | 2019-02-05 |
Family
ID=61427210
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/032,410 Active US10201112B1 (en) | 2017-07-14 | 2018-07-11 | Connector assembly |
Country Status (2)
Country | Link |
---|---|
US (1) | US10201112B1 (en) |
CN (1) | CN207082649U (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10381771B2 (en) * | 2017-07-14 | 2019-08-13 | Lotes Co., Ltd. | Connector assembly |
US10686276B2 (en) * | 2018-05-17 | 2020-06-16 | Yong Tai Electronic (Dongguan) Ltd. | Cable connector assembly and manufacturing method thereof |
EP3914055A1 (en) * | 2020-05-18 | 2021-11-24 | Yazaki Corporation | Circuit connection module |
US20230188001A1 (en) * | 2021-12-10 | 2023-06-15 | Corsair Memory, Inc. | Smart-fan components, controls and systems |
US11942729B2 (en) * | 2019-06-06 | 2024-03-26 | Autonetworks Technologies, Ltd. | Shield connector |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM573523U (en) * | 2018-05-14 | 2019-01-21 | 陳曉萍 | Connector with heat protection function |
US10749304B1 (en) * | 2019-08-06 | 2020-08-18 | International Business Machines Corporation | Port for heat sink ono active cable end |
US10923841B1 (en) * | 2019-08-06 | 2021-02-16 | International Business Machines Corporation | Port for heat sink on active cable end |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130272649A1 (en) * | 2011-11-16 | 2013-10-17 | Henning Braunisch | Optical connection techniques and configurations |
US20160249919A1 (en) * | 2015-02-27 | 2016-09-01 | Ethicon Endo-Surgery, Llc | Surgical instrument system comprising an inspection station |
US20160346609A1 (en) * | 2015-05-28 | 2016-12-01 | Nike, Inc. | Wearable usb device assembly |
US20160375733A1 (en) * | 2014-03-10 | 2016-12-29 | Itire, Llc | Smart tag assembly for mounting on an object to be tracked |
US20180056871A1 (en) * | 2002-08-21 | 2018-03-01 | Magna Electronics Inc. | Multi-camera vision system for a vehicle |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8113863B2 (en) | 2009-08-25 | 2012-02-14 | Tyco Electronics Corporation | Socket connector having a thermally conductive insert |
CN105610015A (en) | 2016-02-24 | 2016-05-25 | 苏州携旅网络技术有限公司 | Thermal dissipation type USB interface set with automatic filtering detection function |
-
2017
- 2017-07-14 CN CN201720851266.6U patent/CN207082649U/en active Active
-
2018
- 2018-07-11 US US16/032,410 patent/US10201112B1/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180056871A1 (en) * | 2002-08-21 | 2018-03-01 | Magna Electronics Inc. | Multi-camera vision system for a vehicle |
US20130272649A1 (en) * | 2011-11-16 | 2013-10-17 | Henning Braunisch | Optical connection techniques and configurations |
US20160375733A1 (en) * | 2014-03-10 | 2016-12-29 | Itire, Llc | Smart tag assembly for mounting on an object to be tracked |
US20160249919A1 (en) * | 2015-02-27 | 2016-09-01 | Ethicon Endo-Surgery, Llc | Surgical instrument system comprising an inspection station |
US20160346609A1 (en) * | 2015-05-28 | 2016-12-01 | Nike, Inc. | Wearable usb device assembly |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10381771B2 (en) * | 2017-07-14 | 2019-08-13 | Lotes Co., Ltd. | Connector assembly |
US10686276B2 (en) * | 2018-05-17 | 2020-06-16 | Yong Tai Electronic (Dongguan) Ltd. | Cable connector assembly and manufacturing method thereof |
US11942729B2 (en) * | 2019-06-06 | 2024-03-26 | Autonetworks Technologies, Ltd. | Shield connector |
EP3914055A1 (en) * | 2020-05-18 | 2021-11-24 | Yazaki Corporation | Circuit connection module |
US11515656B2 (en) | 2020-05-18 | 2022-11-29 | Yazaki Corporation | Circuit connection module |
US20230188001A1 (en) * | 2021-12-10 | 2023-06-15 | Corsair Memory, Inc. | Smart-fan components, controls and systems |
US11962220B2 (en) * | 2021-12-10 | 2024-04-16 | Corsair Memory, Inc. | Smart-fan components, controls and systems |
Also Published As
Publication number | Publication date |
---|---|
CN207082649U (en) | 2018-03-09 |
US10201112B1 (en) | 2019-02-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10201112B1 (en) | Connector assembly | |
US10381771B2 (en) | Connector assembly | |
US10879638B2 (en) | Socket connector for an electronic package | |
US10085360B2 (en) | Heat sink assembly | |
US9728916B1 (en) | Electrical receptacle connector | |
US10468839B2 (en) | Assembly having thermal conduction members | |
US20170077651A1 (en) | Electrical connector | |
US7442051B2 (en) | Electrical connector with printed circuit board | |
US10164362B2 (en) | Plug connecetor with a metallic enclosure having heat sink member thereon | |
US20180145462A1 (en) | Electrical connector | |
US7857656B2 (en) | Electrical connector and electrical connector assembly having heat-radiating structure | |
US10855033B2 (en) | Electrical connector with stability assurance for internal shielding plate and the attachment of an external electrical component | |
US10910766B2 (en) | Connector system | |
US10879649B2 (en) | Electrical connector | |
US10135198B2 (en) | Electrical connector assembly | |
TW201834324A (en) | Electrical connector and assembly | |
US10170845B2 (en) | Plug connector | |
US10177511B2 (en) | Electrical connector | |
US20210210885A1 (en) | Electrical connector | |
US10777939B2 (en) | Connector system | |
US6752654B1 (en) | Serial advanced technology attachment connector | |
US9893445B1 (en) | Connector assembly | |
US8632361B2 (en) | Electrical connector | |
TWI406462B (en) | Power receptacle and assembly thereof | |
US10651583B1 (en) | Power supply for socket assembly |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: LOTES CO., LTD, TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:JU, TED;LIN, CHIN CHI;REEL/FRAME:046319/0451 Effective date: 20180709 |
|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 4 |