US20170370557A1 - Modular heat management apparatus for outdoor lighting system - Google Patents
Modular heat management apparatus for outdoor lighting system Download PDFInfo
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- US20170370557A1 US20170370557A1 US15/538,878 US201515538878A US2017370557A1 US 20170370557 A1 US20170370557 A1 US 20170370557A1 US 201515538878 A US201515538878 A US 201515538878A US 2017370557 A1 US2017370557 A1 US 2017370557A1
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- Prior art keywords
- management apparatus
- housing
- heat management
- interface portion
- modular heat
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
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- SXZSFWHOSHAKMN-UHFFFAOYSA-N 2,3,4,4',5-Pentachlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC(Cl)=C(Cl)C(Cl)=C1Cl SXZSFWHOSHAKMN-UHFFFAOYSA-N 0.000 description 3
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- 230000017525 heat dissipation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/002—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages with provision for interchangeability, i.e. component parts being especially adapted to be replaced by another part with the same or a different function
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/10—Outdoor lighting
- F21W2131/103—Outdoor lighting of streets or roads
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the technical field relates generally to an outdoor lighting system (e.g., an outdoor luminaire).
- a modular heat management apparatus of the outdoor lighting system which has thermal scaleability capabilities for managing heat dissipation of the outdoor lighting system regardless of amount of power to be supplied to the lighting system.
- Heat management plays an important role in an outdoor lighting system.
- the outdoor lighting system may employ high-flux lighting elements (e.g., LEDs) and the temperature of the lighting elements can affect the luminaire efficacy and performance, and therefore maintaining a low temperature at a junction of the lighting elements and the housing of the outdoor lighting system is critical.
- high-flux lighting elements e.g., LEDs
- LED-based roadway outdoor lighting systems have a same housing for a total range of system power, and the thermal condition varies based on the actual system power.
- these types of lighting systems are designed thermally for high system power. Therefore, in low system power cases, the housing provides unnecessary cooling and increased costs compared to use of a smaller housing.
- the various embodiments of the present disclosure are configured to provide a modular extendable heat management apparatus of an outdoor lighting system, having thermal scaleability capabilities.
- a modular heat management apparatus for an outdoor lighting system which comprises a housing comprising an interface portion disposed at a top surface of the housing, an attachable heat sink to be disposed and mounted onto the interface portion and configured to dissipate heat generated by the outdoor lighting system, and a fixing element configured to attach the heat sink to the interface portion and to apply contact pressure thereto.
- a modular heat management apparatus which comprises a housing, the housing comprising an interface portion disposed at a top surface of the housing, an attachable heat sink to be disposed on the interface portion and configured to dissipate heat generated by the outdoor lighting system, the attachable heat sink having a receiving portion for receiving a fixing element, and at least one fixing element configured to be disposed within the receiving portion, to attach the attachable heat sink to the interface portion, and to apply contact pressure thereto.
- FIG. 1 is a schematic of an outdoor lighting system according to one or more exemplary embodiments.
- FIG. 2 is an expanded view of the lighting elements shown in FIG. 1 according to one or more exemplary embodiments.
- FIG. 3 is schematic illustration of a modular heat management apparatus for the outdoor lighting system according to one or more exemplary embodiments.
- FIG. 4 is a schematic illustration of the modular heat management apparatus shown in FIG. 2 , including an attachable heat sink mounted thereon according to one or more exemplary embodiments.
- FIG. 5 is a schematic illustration of a modular heat management apparatus of an outdoor lighting system according to one or more alternative exemplary embodiments.
- FIG. 6 is a schematic illustration of the modular heat management apparatus of FIG. 5 including the heat sink to be mounted thereon, according to one or more exemplary embodiments.
- FIG. 7 is a schematic illustration of the modular heat management apparatus of FIG. 6 including a fixing element for fixing the heat sink, according to one or more exemplary embodiments.
- FIG. 8 is a schematic illustration of an attachable heat sink according to one or more alternative exemplary embodiments.
- FIGS. 9A and 9B are schematic illustrations of the fixing element of FIG. 7 according to one or more exemplary embodiments.
- FIG. 10 is a graphical illustration of contact pressure applied by the fixing element against the contact thermal resistance of the interface portion, according to one or more exemplary embodiments.
- Exemplary embodiments of the present invention provide a modular heat management apparatus for an outdoor lighting system, the apparatus comprising a housing comprising an interface portion disposed at a top region of the housing, an attachable heat sink to be disposed on the interface portion, and a fixing element configured to attach the heat sink to the interface portion.
- FIG. 1 is a schematic illustration of an outdoor lighting system 50 , according to one or more exemplary embodiments.
- the outdoor lighting system 50 includes a modular heat management apparatus 100 which includes a housing 110 having a top surface 110 a , an inner region 110 b and a bottom surface 110 c , the housing 110 comprising a light engine 113 having a printed circuit board (PCB) 114 including a plurality of lighting elements 115 (e.g., lighting emitting diodes (LEDs) and other electrical circuitry mounted thereon, an power supply (not shown) for supplying power to the outdoor lighting system 50 and a lighting driver 125 connected with the PCB 114 and configured to receive power from the power supply and supply power to the light engine 113 for operation of the plurality of lighting elements 115 .
- PCB printed circuit board
- the housing 110 may comprise cooling ribs (not shown) formed at an inner top surface of the housing 110 to allow for cooling within the housing 110 based on the heat generated from the components (e.g., the lighting driver 125 ) therein.
- a reflector (not shown) may also be provided for reflecting the light emitted from the lighting elements 115 in a desired direction away from the lighting system 50 .
- a gear tray (not shown) may also be provided for housing control switches (e.g., on/off or dimming switches) for controlling an operation state of the indoor lighting system 50 .
- a coupler 130 is also provided for connecting the lighting system 50 to a support surface.
- An attachable heat sink 140 is also provided and configured to dissipate heat generated from lighting elements 115 of the outdoor lighting system 50 . Details of the heat dissipation of the modular heat management apparatus 100 will be discussed below with reference to FIGS. 2 through 10 .
- FIG. 2 is an expanded view of the lighting elements shown in FIG. 1 according to one or more exemplary embodiments.
- the PCB 114 having the lighting elements 115 mounted thereon are disposed at a top inner surface of the inner region 110 b adjacent to the top surface 110 a of the modular heat management apparatus 100 and the lighting elements 115 are spaced apart from each other a predetermined distance “d”.
- the present invention is not limited to any particular number of lighting elements 115 or a particular arrangement thereof, and therefore may vary as desired.
- the lighting elements 115 may be positioned such that light emitted therefrom is emitted in a downward direction. Further, the lighting elements 115 are positioned at an end opposite an end coupled via the coupler 130 with the surface having the modular heat management apparatus 100 mounted thereon.
- FIG. 3 is a schematic illustration of the modular heat management apparatus 100 according to one or more exemplary embodiments.
- the modular heat management apparatus 100 includes the top surface 110 a of the housing 110 comprising an interface portion 160 for receiving the attachable heat sink 140 , (as depicted in FIG. 1 ) thereon, and a fixing element 170 for fixing the attachable heat sink 140 .
- the housing 110 is configured to other components in the inner region 110 b thereof, as shown in FIG. 1 , for operation of the outdoor lighting system 50 .
- the housing 110 may be formed of any shape or size as suitable for the purposes set forth herein.
- the housing 110 may be formed of a low thermal conductive material including for example, plastic, titanium, or iron.
- the thermal conductivity of the material may be approximately 0.5 W/m-K.
- the housing 110 is configured for mechanically fixing the components of the outdoor lighting system 50 .
- the housing 110 may be formed of a high thermal conductive material including for example, aluminum.
- the interface portion 160 is disposed at a top surface 110 a of the housing 110 opposite the bottom surface 110 c .
- the interface portion 160 is formed of a thermally conductive material higher in thermal conductivity than that of the housing 110 .
- the housing 110 may be formed of a low thermal conductive material while the interface portion 160 may be formed of aluminum and may have a thermally conductivity of approximately 160 W/m-K. Higher or lower values may be possible depending on the material.
- the housing 110 and the interface portion 160 may be formed of the same material, e.g., a high thermal conductive material such as aluminum.
- the interface portion 160 may be formed of a rectangular shape and is attached to the housing 110 via an attaching means, e.g., screws or any other type of attaching means suitable for the purpose set forth herein.
- the present invention is not limited to using a single interface portion and may vary as necessary.
- FIG. 4 is a schematic illustration of the modular heat management apparatus shown in FIG. 3 , including the attachable heat sink 140 mounted thereon according to one or more exemplary embodiments.
- the attachable heat sink 140 is disposed on a top surface of the interface portion 160 such that it covers the entire top surface of the interface portion 160 .
- the heat sink 140 is formed of a plurality of aligned fin portions (on the picture it is marked with 142 ) at one side surface thereof opposite the side surface which is mounted to the interface portion 160 .
- the heat sink 140 is mounted and attached to the interface portion 160 using the fixing element 170 , to firmly and securely keep the attachable heat sink 140 in place.
- the fixing element 170 may be a single element or comprise a plurality of fixing elements.
- the fixing element(s) 170 are configured to apply contact pressure to the heat sink 140 for securing the heat sink 140 to the interface portion 160 .
- the thermal connection between the interface portion 160 and the heat sink 140 is realized by applying sufficient contact pressure using the fixing elements 170 .
- the amount of the contact pressure P contact may be high enough e.g., approximately 0.35 Mpa, such that the thermal contact resistance R contact is negligible (e.g., approximately 0.0003 K-m 2 /W, where K is degrees Kelvin).
- the heat sink 140 may be formed of the same material as that of the interface portion 160 .
- the heat sink 140 may also be made of aluminum.
- the fin portions 142 of the heat sink 140 assist with the dissipation of heat generated inside the housing 110 including but not limited to heat generated from the above-mentioned components.
- a single heat sink 140 is illustrated herein, the present invention is not limited to a particular number of heat sinks, and may vary as necessary. Further, the present invention is not limited to a particular type of heat sink 140 or fixing element 170 , and therefore may vary accordingly.
- a modular heat management apparatus 100 will now be described with reference to FIGS. 6 through 9B .
- FIG. 5 is a schematic illustration of a modular heat management apparatus 300 of an outdoor lighting system 50 according to one or more alternative exemplary embodiments.
- the modular heat management apparatus 300 includes components similar to those of the modular heat management apparatus 100 as shown and described in FIG. 3 , therefore a detailed description of these elements is omitted.
- the modular heat management apparatus 300 includes a housing 310 including an interface portion 320 , a fixing element 330 and a heat sink 340 (as depicted in FIG. 6 ).
- the interface portion 320 may vary in size.
- the interface portion 320 is formed at a top surface 310 a of the housing 310 .
- FIG. 6 is a schematic illustration of the modular heat management apparatus 300 of FIG. 5 including the heat sink 340 to be mounted thereon, according to one or more exemplary embodiments.
- the heat sink 340 is mounted on the interface portion 320 and substantially completely covers the interface portion 320 .
- the heat sink 340 comprises a receiving portion 346 for receiving the fixing element 330 therein.
- the heat sink 340 comprises a plurality of aligned fin portions 342 , each fin 342 comprises a depression part 344 at a center region thereof, and the fins 342 are in parallel with each other, and in close proximity to thereby form the receiving portion 346 along the center region of the heat sink 340 , for receiving the fixing element 330 therein.
- the heat sink 440 includes the fin portions 442 which do not include a depression part 344 and instead are shorter in length and aligned in at least two column sections 444 such that an opening 446 exists between the two column sections 444 for receiving the fixing element 330 .
- FIG. 7 is a schematic illustration of the modular heat management apparatus 300 of FIG. 6 showing the fixing element 330 for fixing the heat sink 340 , according to one or more exemplary embodiments.
- the fixing element 330 is formed of a flexible material in a strap form, and is attached to the top surface 310 a of the housing 310 via first and second attaching means 334 and 336 at opposite ends of the top surface 310 a . Additional details regarding the fixing element 330 will be discussed below with reference to FIGS. 9A and 9 B.
- FIGS. 9A and 9B are schematic illustrations of the fixing element of FIG. 7 according to one or more exemplary embodiments.
- the fixing element 330 rests within a hook portion of the first attaching means 334 and is rotated about the first attaching means 334 at a first end of the top surface 310 a of the housing 310 , to bend within the receiving portion 346 and be housed therein, and to be connected to the second attaching means 336 at a second end opposite the first end as shown in FIG. 9B .
- the end of the fixing element 330 connecting with the second attaching means 336 includes a hook portion to hook and surround the second attaching means 336 .
- the fixing element 330 applies contact pressure to the heat sink 340 for securely mounting the heat sink 340 to the interface portion 320 .
- Exemplary embodiments of the present invention provide the advantage of heat management within an outdoor lighting system by employing an attachable heat sink, an interface portion and a fixing element for fixing the heat sink to the interface portion.
Abstract
Description
- The technical field relates generally to an outdoor lighting system (e.g., an outdoor luminaire). In particularly, a modular heat management apparatus of the outdoor lighting system which has thermal scaleability capabilities for managing heat dissipation of the outdoor lighting system regardless of amount of power to be supplied to the lighting system.
- Heat management plays an important role in an outdoor lighting system. The outdoor lighting system may employ high-flux lighting elements (e.g., LEDs) and the temperature of the lighting elements can affect the luminaire efficacy and performance, and therefore maintaining a low temperature at a junction of the lighting elements and the housing of the outdoor lighting system is critical.
- In a current example, LED-based roadway outdoor lighting systems have a same housing for a total range of system power, and the thermal condition varies based on the actual system power. Thus, these types of lighting systems are designed thermally for high system power. Therefore, in low system power cases, the housing provides unnecessary cooling and increased costs compared to use of a smaller housing.
- The various embodiments of the present disclosure are configured to provide a modular extendable heat management apparatus of an outdoor lighting system, having thermal scaleability capabilities.
- In one exemplary embodiment, a modular heat management apparatus for an outdoor lighting system is provided which comprises a housing comprising an interface portion disposed at a top surface of the housing, an attachable heat sink to be disposed and mounted onto the interface portion and configured to dissipate heat generated by the outdoor lighting system, and a fixing element configured to attach the heat sink to the interface portion and to apply contact pressure thereto.
- In another exemplary embodiment, a modular heat management apparatus is provided which comprises a housing, the housing comprising an interface portion disposed at a top surface of the housing, an attachable heat sink to be disposed on the interface portion and configured to dissipate heat generated by the outdoor lighting system, the attachable heat sink having a receiving portion for receiving a fixing element, and at least one fixing element configured to be disposed within the receiving portion, to attach the attachable heat sink to the interface portion, and to apply contact pressure thereto.
- The foregoing has broadly outlined some of the aspects and features of various embodiments, which should be construed to be merely illustrative of various potential applications of the disclosure. Other beneficial results can be obtained by applying the disclosed information in a different manner or by combining various aspects of the disclosed embodiments. Accordingly, other aspects and a more comprehensive understanding may be obtained by referring to the detailed description of the exemplary embodiments taken in conjunction with the accompanying drawings, in addition to the scope defined by the claims.
-
FIG. 1 is a schematic of an outdoor lighting system according to one or more exemplary embodiments. -
FIG. 2 is an expanded view of the lighting elements shown inFIG. 1 according to one or more exemplary embodiments. -
FIG. 3 is schematic illustration of a modular heat management apparatus for the outdoor lighting system according to one or more exemplary embodiments. -
FIG. 4 is a schematic illustration of the modular heat management apparatus shown inFIG. 2 , including an attachable heat sink mounted thereon according to one or more exemplary embodiments. -
FIG. 5 is a schematic illustration of a modular heat management apparatus of an outdoor lighting system according to one or more alternative exemplary embodiments. -
FIG. 6 is a schematic illustration of the modular heat management apparatus ofFIG. 5 including the heat sink to be mounted thereon, according to one or more exemplary embodiments. -
FIG. 7 is a schematic illustration of the modular heat management apparatus ofFIG. 6 including a fixing element for fixing the heat sink, according to one or more exemplary embodiments. -
FIG. 8 is a schematic illustration of an attachable heat sink according to one or more alternative exemplary embodiments. -
FIGS. 9A and 9B are schematic illustrations of the fixing element ofFIG. 7 according to one or more exemplary embodiments. -
FIG. 10 is a graphical illustration of contact pressure applied by the fixing element against the contact thermal resistance of the interface portion, according to one or more exemplary embodiments. - The drawings are only for purposes of illustrating preferred embodiments and are not to be construed as limiting the disclosure. Given the following enabling description of the drawings, the novel aspects of the present disclosure should become evident to a person of ordinary skill in the art. This detailed description uses numerical and letter designations to refer to features in the drawings. Like or similar designations in the drawings and description have been used to refer to like or similar parts of embodiments of the invention.
- As required, detailed embodiments are disclosed herein. It must be understood that the disclosed embodiments are merely exemplary of various and alternative forms. As used herein, the word “exemplary” is used expansively to refer to embodiments that serve as illustrations, specimens, models, or patterns. The figures are not necessarily to scale and some features may be exaggerated or minimized to show details of particular components. In other instances, well-known components, systems, materials, or methods that are known to those having ordinary skill in the art have not been described in detail in order to avoid obscuring the present disclosure. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art.
- Exemplary embodiments of the present invention provide a modular heat management apparatus for an outdoor lighting system, the apparatus comprising a housing comprising an interface portion disposed at a top region of the housing, an attachable heat sink to be disposed on the interface portion, and a fixing element configured to attach the heat sink to the interface portion.
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FIG. 1 is a schematic illustration of anoutdoor lighting system 50, according to one or more exemplary embodiments. Theoutdoor lighting system 50 includes a modularheat management apparatus 100 which includes ahousing 110 having a top surface 110 a, an inner region 110 b and abottom surface 110 c, thehousing 110 comprising alight engine 113 having a printed circuit board (PCB) 114 including a plurality of lighting elements 115 (e.g., lighting emitting diodes (LEDs) and other electrical circuitry mounted thereon, an power supply (not shown) for supplying power to theoutdoor lighting system 50 and alighting driver 125 connected with the PCB 114 and configured to receive power from the power supply and supply power to thelight engine 113 for operation of the plurality oflighting elements 115. Thehousing 110 may comprise cooling ribs (not shown) formed at an inner top surface of thehousing 110 to allow for cooling within thehousing 110 based on the heat generated from the components (e.g., the lighting driver 125) therein. A reflector (not shown) may also be provided for reflecting the light emitted from thelighting elements 115 in a desired direction away from thelighting system 50. A gear tray (not shown) may also be provided for housing control switches (e.g., on/off or dimming switches) for controlling an operation state of theindoor lighting system 50. Acoupler 130 is also provided for connecting thelighting system 50 to a support surface. Anattachable heat sink 140 is also provided and configured to dissipate heat generated fromlighting elements 115 of theoutdoor lighting system 50. Details of the heat dissipation of the modularheat management apparatus 100 will be discussed below with reference toFIGS. 2 through 10 . -
FIG. 2 is an expanded view of the lighting elements shown inFIG. 1 according to one or more exemplary embodiments. As shown inFIG. 2 , the PCB 114 having thelighting elements 115 mounted thereon, are disposed at a top inner surface of the inner region 110 b adjacent to the top surface 110 a of the modularheat management apparatus 100 and thelighting elements 115 are spaced apart from each other a predetermined distance “d”. The present invention is not limited to any particular number oflighting elements 115 or a particular arrangement thereof, and therefore may vary as desired. Thelighting elements 115 may be positioned such that light emitted therefrom is emitted in a downward direction. Further, thelighting elements 115 are positioned at an end opposite an end coupled via thecoupler 130 with the surface having the modularheat management apparatus 100 mounted thereon. -
FIG. 3 is a schematic illustration of the modularheat management apparatus 100 according to one or more exemplary embodiments. As shown inFIG. 3 , the modularheat management apparatus 100 includes the top surface 110 a of thehousing 110 comprising aninterface portion 160 for receiving theattachable heat sink 140, (as depicted inFIG. 1 ) thereon, and afixing element 170 for fixing theattachable heat sink 140. - The
housing 110 is configured to other components in the inner region 110 b thereof, as shown inFIG. 1 , for operation of theoutdoor lighting system 50. Thehousing 110 may be formed of any shape or size as suitable for the purposes set forth herein. - According to one or more exemplary embodiments, the
housing 110 may be formed of a low thermal conductive material including for example, plastic, titanium, or iron. The thermal conductivity of the material may be approximately 0.5 W/m-K. Thehousing 110 is configured for mechanically fixing the components of theoutdoor lighting system 50. According to alternative embodiments, thehousing 110 may be formed of a high thermal conductive material including for example, aluminum. - The
interface portion 160 is disposed at a top surface 110 a of thehousing 110 opposite thebottom surface 110 c. Theinterface portion 160 is formed of a thermally conductive material higher in thermal conductivity than that of thehousing 110. According to one or more exemplary embodiments, thehousing 110 may be formed of a low thermal conductive material while theinterface portion 160 may be formed of aluminum and may have a thermally conductivity of approximately 160 W/m-K. Higher or lower values may be possible depending on the material. Alternatively, in other embodiments, thehousing 110 and theinterface portion 160 may be formed of the same material, e.g., a high thermal conductive material such as aluminum. - As shown in
FIG. 3 , theinterface portion 160 may be formed of a rectangular shape and is attached to thehousing 110 via an attaching means, e.g., screws or any other type of attaching means suitable for the purpose set forth herein. The present invention is not limited to using a single interface portion and may vary as necessary. -
FIG. 4 is a schematic illustration of the modular heat management apparatus shown inFIG. 3 , including theattachable heat sink 140 mounted thereon according to one or more exemplary embodiments. - As shown in
FIG. 4 , theattachable heat sink 140 is disposed on a top surface of theinterface portion 160 such that it covers the entire top surface of theinterface portion 160. Theheat sink 140 is formed of a plurality of aligned fin portions (on the picture it is marked with 142) at one side surface thereof opposite the side surface which is mounted to theinterface portion 160. Theheat sink 140 is mounted and attached to theinterface portion 160 using the fixingelement 170, to firmly and securely keep theattachable heat sink 140 in place. The fixingelement 170 may be a single element or comprise a plurality of fixing elements. The fixing element(s) 170 are configured to apply contact pressure to theheat sink 140 for securing theheat sink 140 to theinterface portion 160. The thermal connection between theinterface portion 160 and theheat sink 140 is realized by applying sufficient contact pressure using the fixingelements 170. As shown ingraph 1000 inFIG. 10 , the amount of the contact pressure Pcontact may be high enough e.g., approximately 0.35 Mpa, such that the thermal contact resistance Rcontact is negligible (e.g., approximately 0.0003 K-m2/W, where K is degrees Kelvin). - Referring back to
FIG. 4 , theheat sink 140 may be formed of the same material as that of theinterface portion 160. For example, theheat sink 140 may also be made of aluminum. - The
lighting engine 113 and thePCB 114 including thelighting elements 115 and other electrical circuitry mounted thereon along with thelighting driver 125 in electrical communication with thelighting engine 113 which are mounted at an inner region 110 b of the housing 110 (as depicted inFIG. 1 ), are opposite and adjacent to a position of theinterface portion 160 disposed at the top surface 110 a of thehousing 110 and theheat sink 140 disposed thereon as shown inFIGS. 3 and 4 . Thefin portions 142 of theheat sink 140 assist with the dissipation of heat generated inside thehousing 110 including but not limited to heat generated from the above-mentioned components. Although asingle heat sink 140 is illustrated herein, the present invention is not limited to a particular number of heat sinks, and may vary as necessary. Further, the present invention is not limited to a particular type ofheat sink 140 or fixingelement 170, and therefore may vary accordingly. A modularheat management apparatus 100 according to other exemplary embodiments will now be described with reference toFIGS. 6 through 9B . -
FIG. 5 is a schematic illustration of a modularheat management apparatus 300 of anoutdoor lighting system 50 according to one or more alternative exemplary embodiments. As shown inFIG. 5 , the modularheat management apparatus 300 includes components similar to those of the modularheat management apparatus 100 as shown and described inFIG. 3 , therefore a detailed description of these elements is omitted. The modularheat management apparatus 300 includes ahousing 310 including aninterface portion 320, a fixingelement 330 and a heat sink 340 (as depicted inFIG. 6 ). - According to one or more exemplary embodiments, the
interface portion 320 may vary in size. Theinterface portion 320 is formed at atop surface 310 a of thehousing 310. -
FIG. 6 is a schematic illustration of the modularheat management apparatus 300 ofFIG. 5 including theheat sink 340 to be mounted thereon, according to one or more exemplary embodiments. As shown inFIG. 6 , theheat sink 340 is mounted on theinterface portion 320 and substantially completely covers theinterface portion 320. Theheat sink 340 comprises a receivingportion 346 for receiving the fixingelement 330 therein. As shown, theheat sink 340 comprises a plurality of alignedfin portions 342, eachfin 342 comprises adepression part 344 at a center region thereof, and thefins 342 are in parallel with each other, and in close proximity to thereby form the receivingportion 346 along the center region of theheat sink 340, for receiving the fixingelement 330 therein. - According to another exemplary embodiment as shown in
FIG. 8 , theheat sink 440 includes thefin portions 442 which do not include adepression part 344 and instead are shorter in length and aligned in at least twocolumn sections 444 such that anopening 446 exists between the twocolumn sections 444 for receiving the fixingelement 330. - Now referring back to
FIG. 7 ,FIG. 7 is a schematic illustration of the modularheat management apparatus 300 ofFIG. 6 showing the fixingelement 330 for fixing theheat sink 340, according to one or more exemplary embodiments. As shown inFIG. 7 , the fixingelement 330 is formed of a flexible material in a strap form, and is attached to thetop surface 310 a of thehousing 310 via first and second attaching means 334 and 336 at opposite ends of thetop surface 310 a. Additional details regarding the fixingelement 330 will be discussed below with reference toFIGS. 9A and 9 B. -
FIGS. 9A and 9B are schematic illustrations of the fixing element ofFIG. 7 according to one or more exemplary embodiments. - As shown in
FIG. 9A , the fixingelement 330 rests within a hook portion of the first attachingmeans 334 and is rotated about the first attaching means 334 at a first end of thetop surface 310 a of thehousing 310, to bend within the receivingportion 346 and be housed therein, and to be connected to the second attaching means 336 at a second end opposite the first end as shown inFIG. 9B . The end of the fixingelement 330 connecting with the second attaching means 336 includes a hook portion to hook and surround the second attachingmeans 336. When secured, the fixingelement 330 applies contact pressure to theheat sink 340 for securely mounting theheat sink 340 to theinterface portion 320. - Exemplary embodiments of the present invention, provide the advantage of heat management within an outdoor lighting system by employing an attachable heat sink, an interface portion and a fixing element for fixing the heat sink to the interface portion.
- This written description uses examples to disclose the invention, including the best mode, and also to enable any person skilled in the art to practice the invention, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the invention is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal languages of the claims.
Claims (22)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US15/538,878 US10488021B2 (en) | 2014-12-22 | 2015-12-22 | Lighting system with modular heat management apparatus |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201414578633A | 2014-12-22 | 2014-12-22 | |
PCT/US2015/067388 WO2016106322A1 (en) | 2014-12-22 | 2015-12-22 | Modular heat management apparatus for outdoor lighting system |
US15/538,878 US10488021B2 (en) | 2014-12-22 | 2015-12-22 | Lighting system with modular heat management apparatus |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US201414578633A Continuation | 2014-12-22 | 2014-12-22 |
Publications (2)
Publication Number | Publication Date |
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US20170370557A1 true US20170370557A1 (en) | 2017-12-28 |
US10488021B2 US10488021B2 (en) | 2019-11-26 |
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Family Applications (1)
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US15/538,878 Active US10488021B2 (en) | 2014-12-22 | 2015-12-22 | Lighting system with modular heat management apparatus |
Country Status (8)
Country | Link |
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US (1) | US10488021B2 (en) |
EP (1) | EP3237799A1 (en) |
JP (1) | JP2017538272A (en) |
KR (1) | KR20170097758A (en) |
CN (1) | CN107002982A (en) |
BR (1) | BR112017011466A2 (en) |
MX (1) | MX2017008323A (en) |
WO (1) | WO2016106322A1 (en) |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA3132654C (en) * | 2020-11-13 | 2023-03-07 | Hgci, Inc. | Heat sink for light fixture for indoor grow application |
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Also Published As
Publication number | Publication date |
---|---|
CN107002982A (en) | 2017-08-01 |
KR20170097758A (en) | 2017-08-28 |
BR112017011466A2 (en) | 2018-02-27 |
MX2017008323A (en) | 2017-10-24 |
WO2016106322A1 (en) | 2016-06-30 |
EP3237799A1 (en) | 2017-11-01 |
US10488021B2 (en) | 2019-11-26 |
JP2017538272A (en) | 2017-12-21 |
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