US20170264273A1 - Apparatuses and methods for voltage buffering - Google Patents

Apparatuses and methods for voltage buffering Download PDF

Info

Publication number
US20170264273A1
US20170264273A1 US15/607,020 US201715607020A US2017264273A1 US 20170264273 A1 US20170264273 A1 US 20170264273A1 US 201715607020 A US201715607020 A US 201715607020A US 2017264273 A1 US2017264273 A1 US 2017264273A1
Authority
US
United States
Prior art keywords
transistor
node
voltage
coupled
channel type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US15/607,020
Other versions
US9762215B1 (en
Inventor
Wei Lu CHU
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micron Technology Inc
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US15/607,020 priority Critical patent/US9762215B1/en
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Assigned to MORGAN STANLEY SENIOR FUNDING, INC. reassignment MORGAN STANLEY SENIOR FUNDING, INC. SUPPLEMENT NO. 5 TO PATENT SECURITY AGREEMENT Assignors: MICRON TECHNOLOGY, INC.
Assigned to U.S. BANK NATIONAL ASSOCIATION reassignment U.S. BANK NATIONAL ASSOCIATION SUPPLEMENT NO. 5 TO PATENT SECURITY AGREEMENT Assignors: MICRON TECHNOLOGY, INC.
Publication of US9762215B1 publication Critical patent/US9762215B1/en
Application granted granted Critical
Publication of US20170264273A1 publication Critical patent/US20170264273A1/en
Assigned to JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT reassignment JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MICRON SEMICONDUCTOR PRODUCTS, INC., MICRON TECHNOLOGY, INC.
Assigned to MICRON TECHNOLOGY, INC. reassignment MICRON TECHNOLOGY, INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: U.S. BANK NATIONAL ASSOCIATION, AS AGENT
Assigned to MICRON TECHNOLOGY, INC. reassignment MICRON TECHNOLOGY, INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Assigned to MICRON SEMICONDUCTOR PRODUCTS, INC., MICRON TECHNOLOGY, INC. reassignment MICRON SEMICONDUCTOR PRODUCTS, INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K3/00Circuits for generating electric pulses; Monostable, bistable or multistable circuits
    • H03K3/02Generators characterised by the type of circuit or by the means used for producing pulses
    • H03K3/353Generators characterised by the type of circuit or by the means used for producing pulses by the use, as active elements, of field-effect transistors with internal or external positive feedback
    • H03K3/356Bistable circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/50Marginal testing, e.g. race, voltage or current testing
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1078Data input circuits, e.g. write amplifiers, data input buffers, data input registers, data input level conversion circuits
    • G11C7/1084Data input buffers, e.g. comprising level conversion circuits, circuits for adapting load
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/34DC amplifiers in which all stages are DC-coupled
    • H03F3/343DC amplifiers in which all stages are DC-coupled with semiconductor devices only
    • H03F3/347DC amplifiers in which all stages are DC-coupled with semiconductor devices only in integrated circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/50Marginal testing, e.g. race, voltage or current testing
    • G11C2029/5004Voltage

Definitions

  • Memories and memory devices may include circuits that do not have current drive ability. Voltages from these circuits may be provided to other circuits in the memories or memory devices. In some applications, the voltages may be used as reference voltages. For example, a band gap circuit may provide a reference voltage to another circuit or a voltage monitoring device. The reference voltage may vary if it is provided to a circuit that draws a current from the band gap circuit. The performance of the circuit may degrade if the reference voltage varies. A voltage monitoring device may receive an inaccurate measurement if the reference voltage varies. It may be advantageous to prevent voltages provided by circuits without current drive ability from varying when the voltages are provided to other circuits or devices.
  • An example apparatus may include a current source that may be configured to provide a current, and a voltage buffer coupled to the current source to receive the current, wherein the voltage buffer may include a first stage that may be configured to receive an input voltage and provide an intermediate voltage, the first stage may be configured to receive the current from the current source; and a second stage may be configured to receive the intermediate voltage and provide an output voltage, the second stage may be configured to receive the current from the current source.
  • the voltage buffer may include a first stage that may be configured to receive an input voltage and provide an intermediate voltage, the first stage may be configured to receive the current from the current source; and a second stage may be configured to receive the intermediate voltage and provide an output voltage, the second stage may be configured to receive the current from the current source.
  • An example apparatus may include a first load circuit, a second load circuit, a first transistor, wherein a drain of the first transistor is coupled to the first load circuit, a source of the first transistor is coupled to ground, and a gate of the first transistor may be configured to receive an input voltage, a second transistor, wherein a drain of the second transistor is coupled to the second load circuit, a source of the second transistor is coupled to ground, and a gate of the second transistor is coupled to the source of the first load circuit and the drain of the first transistor, and wherein the drain of the second transistor may be configured to provide an output voltage.
  • An example memory may include a pad, a test circuit coupled to the pad and may be configured to provide an output voltage at the pad to be monitored, the test circuit and may include a voltage buffer that may be configured to receive an input voltage and provide the output voltage, the voltage buffer may include: a first active load circuit, a second active load circuit, a first transistor, wherein a drain of the first transistor is coupled to the first load circuit, a source of the first transistor is coupled to ground, and a gate of the first transistor may be configured to receive an input voltage, and a second transistor, wherein a drain of the second transistor is coupled to the second load circuit, a source of the second transistor is coupled to ground, and a gate of the second transistor is coupled to the source of the first load circuit and the drain of the first transistor, wherein the first transistor, second transistor, and transistors of the first and second active load circuits may be matched, and a current source coupled to the voltage buffer and may be configured to provide a current to the voltage buffer.
  • FIG. 1 is a block diagram of an apparatus according to an embodiment of the invention.
  • FIG. 2 is a circuit diagram of a voltage buffer according to an embodiment of the invention.
  • FIG. 3 is a block diagram of a test system according to an embodiment of the invention.
  • FIG. 4 is a block diagram of a portion of a memory according to an embodiment of the invention.
  • apparatus may refer to, for example, an integrated circuit, a memory device, a memory system, an electronic device or system, a smart phone, a tablet, a computer, a server, etc.
  • FIG. 1 is a block diagram of an apparatus 100 according to an embodiment of the invention.
  • apparatus may refer to, for example, an integrated circuit, a memory device, a memory system, an electronic device or system, a smart phone, a tablet, a computer, a server, etc.
  • the apparatus includes a current source 105 coupled to a voltage buffer 110 .
  • the current source may prevent excessive current consumption by the voltage buffer circuit.
  • the voltage buffer 110 may be configured to receive an input voltage Vin.
  • the input voltage Vin may be provided by a circuit with relatively weak current drive ability (not shown in FIG. 1 ).
  • the voltage buffer 110 may further be configured to receive a current Isrc from the current source 105 .
  • the voltage buffer 110 may provide an output voltage Vout, which may be equal to the input voltage Vin.
  • the output voltage Vout may be provided for use by another circuit, for example, the output voltage Vout may be monitored by a testing circuit.
  • the voltage buffer 110 may allow the input voltage Vin to be provided to other circuits in the form of output voltage Vout without current being drawn from the circuit from which the voltage buffer 110 received the input voltage Yin. As a result, there may be less variability in the observed value of Vout.
  • FIG. 2 is a diagram of a circuit 200 according to an embodiment of the invention.
  • the circuit 200 includes a current source 205 and a voltage buffer 210 .
  • the current source 205 and the voltage buffer 210 may be used for the current source 105 and the voltage buffer 110 previously described with and shown in FIG. 1 .
  • the current source 205 may be a current mirror, although other current sources may be used.
  • the current source may include transistors 212 , 215 .
  • the gates of the transistors 212 , 215 may be coupled to one another.
  • the sources of transistors 212 , 215 may be coupled to a voltage source Vpp.
  • Transistor 212 may have both its drain and gate coupled to a resistance 213 , which is in turn coupled to a voltage reference, for example, ground.
  • the resistance 213 may limit the current of the current source 205 .
  • Transistors 212 , 215 may be p-channel transistors, but other transistor types may be used.
  • the resistance 213 may have a resistance value between 100 k ⁇ -1 M ⁇ . Other values of resistance may also be used without departing from the scope of the disclosed invention.
  • the drain of transistor 215 may be coupled to the voltage buffer 210 to provide a current Isrc.
  • the voltage buffer 210 may include two stages 240 , 245 .
  • Transistors 220 , 230 may have their gates and drains coupled to the current source 205 .
  • the transistors 220 and 230 may be configured as load circuits that provide respective electrical loads to the stage 240 and the stage 245 .
  • the transistors 220 and 230 may be configured as active load circuits.
  • the source of transistor 220 may be coupled to the drain of transistor 225 and the gate of transistor 235 .
  • Transistor 225 may receive input voltage Vin at its gate.
  • the source of transistor 225 may be coupled to a reference voltage, for example, ground.
  • Transistor 230 may have its source coupled to the drain of transistor 235 .
  • the gate of transistor 235 may be coupled to the source of transistor 220 and the drain of transistor 225 .
  • the source of transistor 235 may be coupled to a reference voltage.
  • An output voltage Vout may be provided from the source of transistor 230 and the drain of transistor 235 .
  • Transistors 220 , 225 , 230 , 235 may be n-channel transistors, but other transistor types may he used. In some embodiments, the transistors 220 , 225 , 230 , 235 may be matched. For example, transistors 220 , 225 , 230 , 235 may all have similar transistor dimensions and/or transistor characteristics.
  • the matched transistors 220 , 225 , 230 , 235 may be identical, for example, the transistors 220 , 225 , 230 , 235 may have identical transistor dimensions and/or identical transistor characteristics. Other transistor designs may also be used.
  • a voltage Vsupply may develop at the drains of transistors 220 and 230 as a result of the current Isrc provided by the current source 205 .
  • An intermediate voltage Vm may develop between stage 240 and stage 245 of the voltage buffer 210 .
  • the intermediate voltage Vm may be equal to the voltage Vsupply minus the input voltage Vin.
  • the output voltage Vout may be equal to the voltage Vsupply minus the intermediate voltage Vm.
  • the output voltage Vout may also equal the input voltage Vin.
  • the stage 245 may have current drive ability and provide Vout, but the voltage buffer 210 prevents current being drawn from the source providing Vin at stage 240 . This may allow for low mismatch and variation in the output voltage Vout. Circuits to which voltage Vout is provided may experience less variable performance because of the voltage buffer 210 .
  • FIG. 3 A block diagram of an apparatus including a test system 300 that may include an embodiment of the invention is illustrated in FIG. 3 .
  • the test system 300 may monitor multiple voltages V 1 -V 4 from one or more circuits (not shown).
  • a multiplexer (MUX) 305 may be used to select a voltage from the multiple voltages V 1 -V 4 to be provided as an input voltage Yin to the voltage buffer circuit 110 .
  • the MUX 305 may allow multiple voltages to be monitored sequentially through a single voltage buffer 110 .
  • the voltage buffer circuit 110 may provide an output voltage Vout to a PAD 310 for monitoring by a monitoring device (not shown).
  • the output voltage Vout may be equal to the input voltage Vin. Accordingly, the monitoring device may monitor the value of the input voltage Vin by monitoring the output voltage Vout.
  • the monitoring device may measure less variation in Vout compared to existing monitoring circuits because no current is being drawn by the voltage probe or other monitoring device from the source providing Vin.
  • FIG. 4 illustrates a portion of a memory 400 according to an embodiment of the present invention.
  • the memory 400 includes an array 402 of memory cells, which may be, for example, volatile memory cells (e.g., DRAM memory cells, SRAM memory cells, etc.), non-volatile memory cells (e.g., flash memory cells, PCM cells, etc.), or some other types of memory cells.
  • volatile memory cells e.g., DRAM memory cells, SRAM memory cells, etc.
  • non-volatile memory cells e.g., flash memory cells, PCM cells, etc.
  • PCM cells PCM cells
  • the memory 400 includes a command decoder 406 that receives memory commands through a command bus 408 and generates corresponding control signals within the memory 400 to carry out various memory operations.
  • the command decoder 406 responds to memory commands applied to the command bus 408 to perform various operations on the memory array 402 .
  • the command decoder 406 is used to generate internal control signals to read data from and write data to the memory array 402 .
  • Row and column address signals are applied to the memory 400 through an address bus 420 and provided to an address latch 410 . The address latch then outputs a separate column address and a separate row address.
  • the row and column addresses are provided by the address latch 410 to a row address decoder 422 and a column address decoder 428 , respectively.
  • the column address decoder 428 selects bit lines extending through the array 402 corresponding to respective column addresses.
  • the row address decoder 422 is connected to word line driver 424 that activates respective rows of memory cells in the array 402 corresponding to received row addresses.
  • the selected data line e.g., a bit line or bit lines
  • a received column address are coupled to a read/write circuitry 430 to provide read data to a data output buffer 434 via an input-output data bus 440 .
  • Write data are applied to the memory array 402 through a data input buffer 444 and the memory array read/write circuitry 430 .
  • Circuits according to an embodiment of the invention may be included in the memory 400 .
  • the circuit 200 ( FIG. 2 ) may be included in the data input buffer 444 , which may include a bias voltage generator.
  • the circuit 200 may be configured to operate as a voltage monitor circuit used during testing of the memory device to confirm proper generation of the bias voltage by the bias voltage generator within the data input buffer 444 .
  • test circuit 300 may be included in the memory 400 , which may include multiple input buffers similar to input buffer 444 .
  • the MUX. 305305 may allow for the bias voltage of multiple input buffers to be monitored with the test circuit 300 . Testing may be performed during manufacture of the memory or at a later time.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Logic Circuits (AREA)

Abstract

An apparatuses and methods for buffering a voltage from a circuit without current drive ability are described. An example apparatus includes a voltage buffer that includes two identical stages. The first stage is configured to receive an input voltage and produce an intermediate voltage as an output. The second stage is configured to receive the intermediate voltage and provide an output voltage that is equal to the input voltage. The voltage buffer may be coupled to a current source. The second stage of the voltage buffer may have current drive ability.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • This application is a continuation of U.S. application Ser. No. 14/417,105, filed Jan. 23, 2015, which is a 371 National Stage application claiming the filing benefit of International Application No. PCT/CN2014/085093, filed Aug. 25, 2014. These applications are incorporated herein by reference in their entirety and for any purpose.
  • BACKGROUND
  • Memories and memory devices may include circuits that do not have current drive ability. Voltages from these circuits may be provided to other circuits in the memories or memory devices. In some applications, the voltages may be used as reference voltages. For example, a band gap circuit may provide a reference voltage to another circuit or a voltage monitoring device. The reference voltage may vary if it is provided to a circuit that draws a current from the band gap circuit. The performance of the circuit may degrade if the reference voltage varies. A voltage monitoring device may receive an inaccurate measurement if the reference voltage varies. It may be advantageous to prevent voltages provided by circuits without current drive ability from varying when the voltages are provided to other circuits or devices.
  • SUMMARY
  • An example apparatus according to the disclosure may include a current source that may be configured to provide a current, and a voltage buffer coupled to the current source to receive the current, wherein the voltage buffer may include a first stage that may be configured to receive an input voltage and provide an intermediate voltage, the first stage may be configured to receive the current from the current source; and a second stage may be configured to receive the intermediate voltage and provide an output voltage, the second stage may be configured to receive the current from the current source.
  • An example apparatus according to the disclosure may include a first load circuit, a second load circuit, a first transistor, wherein a drain of the first transistor is coupled to the first load circuit, a source of the first transistor is coupled to ground, and a gate of the first transistor may be configured to receive an input voltage, a second transistor, wherein a drain of the second transistor is coupled to the second load circuit, a source of the second transistor is coupled to ground, and a gate of the second transistor is coupled to the source of the first load circuit and the drain of the first transistor, and wherein the drain of the second transistor may be configured to provide an output voltage.
  • An example memory according the disclosure may include a pad, a test circuit coupled to the pad and may be configured to provide an output voltage at the pad to be monitored, the test circuit and may include a voltage buffer that may be configured to receive an input voltage and provide the output voltage, the voltage buffer may include: a first active load circuit, a second active load circuit, a first transistor, wherein a drain of the first transistor is coupled to the first load circuit, a source of the first transistor is coupled to ground, and a gate of the first transistor may be configured to receive an input voltage, and a second transistor, wherein a drain of the second transistor is coupled to the second load circuit, a source of the second transistor is coupled to ground, and a gate of the second transistor is coupled to the source of the first load circuit and the drain of the first transistor, wherein the first transistor, second transistor, and transistors of the first and second active load circuits may be matched, and a current source coupled to the voltage buffer and may be configured to provide a current to the voltage buffer.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a block diagram of an apparatus according to an embodiment of the invention.
  • FIG. 2 is a circuit diagram of a voltage buffer according to an embodiment of the invention.
  • FIG. 3 is a block diagram of a test system according to an embodiment of the invention.
  • FIG. 4 is a block diagram of a portion of a memory according to an embodiment of the invention.
  • DETAILED DESCRIPTION
  • Certain details are set forth below to provide a sufficient understanding of embodiments of the disclosure. However, it will be clear to one having skill in the art that embodiments of the disclosure may be practiced without these particular details. Moreover, the particular embodiments of the present disclosure described herein are provided by way of example and should not be used to limit the scope of the disclosure to these particular embodiments. In other instances, well-known circuits, control signals, timing protocols, and software operations have not been shown in detail in order to avoid unnecessarily obscuring the disclosure. As used herein, apparatus may refer to, for example, an integrated circuit, a memory device, a memory system, an electronic device or system, a smart phone, a tablet, a computer, a server, etc.
  • FIG. 1 is a block diagram of an apparatus 100 according to an embodiment of the invention. As used herein, apparatus may refer to, for example, an integrated circuit, a memory device, a memory system, an electronic device or system, a smart phone, a tablet, a computer, a server, etc. The apparatus includes a current source 105 coupled to a voltage buffer 110. The current source may prevent excessive current consumption by the voltage buffer circuit. The voltage buffer 110 may be configured to receive an input voltage Vin. The input voltage Vin may be provided by a circuit with relatively weak current drive ability (not shown in FIG. 1). The voltage buffer 110 may further be configured to receive a current Isrc from the current source 105. The voltage buffer 110 may provide an output voltage Vout, which may be equal to the input voltage Vin. The output voltage Vout may be provided for use by another circuit, for example, the output voltage Vout may be monitored by a testing circuit. The voltage buffer 110 may allow the input voltage Vin to be provided to other circuits in the form of output voltage Vout without current being drawn from the circuit from which the voltage buffer 110 received the input voltage Yin. As a result, there may be less variability in the observed value of Vout.
  • FIG. 2 is a diagram of a circuit 200 according to an embodiment of the invention. The circuit 200 includes a current source 205 and a voltage buffer 210. The current source 205 and the voltage buffer 210 may be used for the current source 105 and the voltage buffer 110 previously described with and shown in FIG. 1. The current source 205 may be a current mirror, although other current sources may be used. The current source may include transistors 212, 215. The gates of the transistors 212, 215 may be coupled to one another. The sources of transistors 212, 215 may be coupled to a voltage source Vpp. Transistor 212 may have both its drain and gate coupled to a resistance 213, which is in turn coupled to a voltage reference, for example, ground. The resistance 213 may limit the current of the current source 205. Transistors 212, 215 may be p-channel transistors, but other transistor types may be used. The resistance 213 may have a resistance value between 100 kΩ-1 MΩ. Other values of resistance may also be used without departing from the scope of the disclosed invention. The drain of transistor 215 may be coupled to the voltage buffer 210 to provide a current Isrc.
  • The voltage buffer 210 may include two stages 240, 245. Transistors 220, 230 may have their gates and drains coupled to the current source 205. The transistors 220 and 230 may be configured as load circuits that provide respective electrical loads to the stage 240 and the stage 245. In some embodiments, the transistors 220 and 230 may be configured as active load circuits. The source of transistor 220 may be coupled to the drain of transistor 225 and the gate of transistor 235. Transistor 225 may receive input voltage Vin at its gate. The source of transistor 225 may be coupled to a reference voltage, for example, ground. Transistor 230 may have its source coupled to the drain of transistor 235. The gate of transistor 235 may be coupled to the source of transistor 220 and the drain of transistor 225. The source of transistor 235 may be coupled to a reference voltage. An output voltage Vout may be provided from the source of transistor 230 and the drain of transistor 235. Transistors 220, 225, 230, 235 may be n-channel transistors, but other transistor types may he used. In some embodiments, the transistors 220, 225, 230, 235 may be matched. For example, transistors 220, 225, 230, 235 may all have similar transistor dimensions and/or transistor characteristics. In some embodiments, the matched transistors 220, 225, 230, 235 may be identical, for example, the transistors 220, 225, 230, 235 may have identical transistor dimensions and/or identical transistor characteristics. Other transistor designs may also be used.
  • A voltage Vsupply may develop at the drains of transistors 220 and 230 as a result of the current Isrc provided by the current source 205. An intermediate voltage Vm may develop between stage 240 and stage 245 of the voltage buffer 210. The intermediate voltage Vm may be equal to the voltage Vsupply minus the input voltage Vin. The output voltage Vout may be equal to the voltage Vsupply minus the intermediate voltage Vm. Thus, the output voltage Vout may also equal the input voltage Vin. The stage 245 may have current drive ability and provide Vout, but the voltage buffer 210 prevents current being drawn from the source providing Vin at stage 240. This may allow for low mismatch and variation in the output voltage Vout. Circuits to which voltage Vout is provided may experience less variable performance because of the voltage buffer 210.
  • A block diagram of an apparatus including a test system 300 that may include an embodiment of the invention is illustrated in FIG. 3. The test system 300 may monitor multiple voltages V1-V4 from one or more circuits (not shown). A multiplexer (MUX) 305 may be used to select a voltage from the multiple voltages V1-V4 to be provided as an input voltage Yin to the voltage buffer circuit 110. The MUX 305 may allow multiple voltages to be monitored sequentially through a single voltage buffer 110. The voltage buffer circuit 110 may provide an output voltage Vout to a PAD 310 for monitoring by a monitoring device (not shown). The output voltage Vout may be equal to the input voltage Vin. Accordingly, the monitoring device may monitor the value of the input voltage Vin by monitoring the output voltage Vout. The monitoring device may measure less variation in Vout compared to existing monitoring circuits because no current is being drawn by the voltage probe or other monitoring device from the source providing Vin.
  • FIG. 4 illustrates a portion of a memory 400 according to an embodiment of the present invention. The memory 400 includes an array 402 of memory cells, which may be, for example, volatile memory cells (e.g., DRAM memory cells, SRAM memory cells, etc.), non-volatile memory cells (e.g., flash memory cells, PCM cells, etc.), or some other types of memory cells.
  • The memory 400 includes a command decoder 406 that receives memory commands through a command bus 408 and generates corresponding control signals within the memory 400 to carry out various memory operations. The command decoder 406 responds to memory commands applied to the command bus 408 to perform various operations on the memory array 402. For example, the command decoder 406 is used to generate internal control signals to read data from and write data to the memory array 402. Row and column address signals are applied to the memory 400 through an address bus 420 and provided to an address latch 410. The address latch then outputs a separate column address and a separate row address.
  • The row and column addresses are provided by the address latch 410 to a row address decoder 422 and a column address decoder 428, respectively. The column address decoder 428 selects bit lines extending through the array 402 corresponding to respective column addresses. The row address decoder 422 is connected to word line driver 424 that activates respective rows of memory cells in the array 402 corresponding to received row addresses. The selected data line (e.g., a bit line or bit lines) corresponding to a received column address are coupled to a read/write circuitry 430 to provide read data to a data output buffer 434 via an input-output data bus 440. Write data are applied to the memory array 402 through a data input buffer 444 and the memory array read/write circuitry 430.
  • Circuits according to an embodiment of the invention may be included in the memory 400. For example, the circuit 200 (FIG. 2) may be included in the data input buffer 444, which may include a bias voltage generator. The circuit 200 may be configured to operate as a voltage monitor circuit used during testing of the memory device to confirm proper generation of the bias voltage by the bias voltage generator within the data input buffer 444. In some embodiments, test circuit 300 may be included in the memory 400, which may include multiple input buffers similar to input buffer 444. The MUX. 305305 may allow for the bias voltage of multiple input buffers to be monitored with the test circuit 300. Testing may be performed during manufacture of the memory or at a later time.
  • Those of ordinary skill would further appreciate that the various illustrative logical blocks, configurations, modules, circuits, and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software executed by a processor, or combinations of both. Various illustrative components, blocks, configurations, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or processor executable instructions depends on the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.
  • The previous description of the disclosed embodiments is provided to enable a person skilled in the art to make or use the disclosed embodiments. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the principles defined herein may be applied to other embodiments without departing from the scope of the disclosure. Thus, the present disclosure is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope possible consistent with the principles and novel features as defined by the following claims.

Claims (20)

What is claimed is:
1. An apparatus comprising:
an input terminal configured to receive an input voltage;
an output terminal configured to provide an output voltage;
first and second voltage lines;
first and second nodes;
a current source coupled between the first voltage line and the first node;
a first transistor coupled between the first node and the second node, the first transistor including a gate coupled to the first node;
a second transistor coupled between the second node and the second voltage line, the second transistor including a gate coupled to the input terminal;
a third transistor coupled between the first node and the output terminal, the third transistor including a gate coupled to the first node; and
a fourth transistor coupled between the output terminal and the second voltage line, the fourth transistor including a gate coupled to the second node.
2. The apparatus of claim 1, wherein each of the first, second, third and fourth transistors is of a first channel type.
3. The apparatus of claim 2, wherein the first channel type is an n-channel type.
4. The apparatus of claim 2, wherein the first, second, third and fourth transistors have identical transistor dimensions.
5. The apparatus of claim 2, wherein the first, second, third and fourth transistors have identical transistor characteristics.
6. The apparatus of claim 2, wherein the current source comprises a fifth transistor coupled between the first voltage line and the first node.
7. The apparatus of claim 6, wherein the fifth transistor is of a second channel type.
8. The apparatus of claim 7, wherein the first channel type is an n-channel type and the second channel type is a p-channel type.
9. The apparatus of claim 1, wherein the current source comprises a fifth transistor and a sixth transistor, wherein the fifth transistor and the sixth transistor are coupled to configure a current mirror.
10. The apparatus of claim 9, wherein each of the first, second, third and fourth transistors is of a first channel type and each of the fifth and sixth transistors is of a second channel type.
11. The apparatus of claim 10, wherein the first channel type is an n-channel type and the second channel type is a p-channel type.
12. An apparatus comprising:
a current source; and
a voltage buffer coupled to the current source;
wherein the voltage buffer is configured to receive an input voltage and provide an output voltage that is substantially equal to the input voltage;
wherein the voltage buffer comprises a first stage and a second stage coupled to the first stage, the first stage being configured to receive the input voltage and the second stage being configured to provide the output voltage;
wherein the first stage comprises a first node, a second node, a third node, a first transistor coupled between the first node and the second node, and a second transistor coupled between the second node and the third node; and
wherein the second stage comprises a fourth node, a fifth node, a sixth node, a third transistor coupled between the fourth node and the fifth node, and a fourth transistor coupled between the fifth node and the sixth node.
13. The apparatus of claim 12, wherein the second transistor is configured to receive the input voltage, and the fourth transistor is configured to receive an intermediate voltage from the second node and provide the output voltage to the fifth node.
14. The apparatus of claim 13, wherein each of the first transistor and the third transistor is coupled to configure a load.
15. The apparatus of claim 14, wherein each of the first transistor and the third transistor includes a gate and a drain coupled to each other.
16. The apparatus of claim 12, wherein the first node and the fourth node are coupled to the current source, and the third node and the sixth node are coupled to a reference voltage line.
17. The apparatus of claim 16, wherein each of the first, second, third and fourth transistors is of a first channel type.
18. The apparatus of claim 17, wherein the first channel type is an n-channel type.
19. The apparatus of claim 16, wherein the current source comprises a fifth transistor coupled to the first node and the fourth node.
20. The apparatus of claim 19, wherein each of the first, second, third and fourth transistors is of an n-channel type and the fifth transistor is of a p-channel type.
US15/607,020 2014-08-25 2017-05-26 Apparatuses and methods for voltage buffering Active US9762215B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/607,020 US9762215B1 (en) 2014-08-25 2017-05-26 Apparatuses and methods for voltage buffering

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/417,105 US9692398B2 (en) 2014-08-25 2014-08-25 Apparatuses and methods for voltage buffering
PCT/CN2014/085093 WO2016029341A1 (en) 2014-08-25 2014-08-25 Apparatuses and methods for voltage buffering
US15/607,020 US9762215B1 (en) 2014-08-25 2017-05-26 Apparatuses and methods for voltage buffering

Related Parent Applications (2)

Application Number Title Priority Date Filing Date
US14/417,105 Continuation US9692398B2 (en) 2014-08-25 2014-08-25 Apparatuses and methods for voltage buffering
PCT/CN2014/085093 Continuation WO2016029341A1 (en) 2014-08-25 2014-08-25 Apparatuses and methods for voltage buffering

Publications (2)

Publication Number Publication Date
US9762215B1 US9762215B1 (en) 2017-09-12
US20170264273A1 true US20170264273A1 (en) 2017-09-14

Family

ID=55398560

Family Applications (2)

Application Number Title Priority Date Filing Date
US14/417,105 Active 2034-11-05 US9692398B2 (en) 2014-08-25 2014-08-25 Apparatuses and methods for voltage buffering
US15/607,020 Active US9762215B1 (en) 2014-08-25 2017-05-26 Apparatuses and methods for voltage buffering

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US14/417,105 Active 2034-11-05 US9692398B2 (en) 2014-08-25 2014-08-25 Apparatuses and methods for voltage buffering

Country Status (2)

Country Link
US (2) US9692398B2 (en)
WO (1) WO2016029341A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9692398B2 (en) 2014-08-25 2017-06-27 Micron Technology, Inc. Apparatuses and methods for voltage buffering

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0653758A (en) 1992-07-31 1994-02-25 Hitachi Ltd Semiconductor integrated circuit
US5952848A (en) 1997-03-14 1999-09-14 Lucent Technologies Inc. High-voltage tolerant input buffer in low-voltage technology
US6366124B1 (en) * 2001-05-16 2002-04-02 Pericom Semiconductor Corp. BiDirectional active voltage translator with bootstrap switches for mixed-supply VLSI
KR100465759B1 (en) * 2002-06-14 2005-01-13 삼성전자주식회사 Semiconductor device
US7002401B2 (en) * 2003-01-30 2006-02-21 Sandisk Corporation Voltage buffer for capacitive loads
US20070096821A1 (en) 2005-11-03 2007-05-03 Samsung Electronics Co., Ltd. Wide-band amplifier
TWI446817B (en) 2006-02-23 2014-07-21 Koninkl Philips Electronics Nv Methods and systems for extending range and adjusting bandwidth for wireless networks
JP4237219B2 (en) * 2006-11-10 2009-03-11 Necエレクトロニクス株式会社 Data receiving circuit, data driver and display device
KR100920840B1 (en) * 2008-03-12 2009-10-08 주식회사 하이닉스반도체 Buffering Circuit of Semiconductor Memory Apparatus
CN102067234B (en) * 2009-04-27 2013-10-09 松下电器产业株式会社 Method for writing to resistance-change non-volatile memory elements, and resistance-change non-volatile memory device
JP2011228849A (en) 2010-04-16 2011-11-10 Rohm Co Ltd Buffer circuit, semiconductor device using same, output circuit, and electronic equipment
CN202548685U (en) 2011-12-21 2012-11-21 比亚迪股份有限公司 Reference voltage buffer circuit
CN103066991A (en) 2012-12-07 2013-04-24 湖南城市学院 Buffering device used for improving voltage drive capability
US9692398B2 (en) 2014-08-25 2017-06-27 Micron Technology, Inc. Apparatuses and methods for voltage buffering

Also Published As

Publication number Publication date
US20160218699A1 (en) 2016-07-28
US9762215B1 (en) 2017-09-12
WO2016029341A1 (en) 2016-03-03
US9692398B2 (en) 2017-06-27

Similar Documents

Publication Publication Date Title
US9305611B2 (en) Sense amplifier for a memory cell with a fast sensing speed
US8780650B2 (en) Memory with redundant sense amplifier
JP2018506131A (en) System and method for detecting the data state of a data cell comprising an STT-MRAM
US9666287B2 (en) Voltage detector, method for setting reference voltage and computer readable medium
US10073477B2 (en) Apparatuses and methods for temperature independent current generations
JP2009211733A (en) Magnetic storage device
KR101748055B1 (en) Low voltage current reference generator for a sensing amplifier
US20130155780A1 (en) Apparatuses and methods for comparing a current representative of a number of failing memory cells
US20170110187A1 (en) Clamp circuit
US9257995B2 (en) Apparatuses and methods for mitigating uneven circuit degradation of delay circuits
DE112015005947T5 (en) Data transmission system, data transmission device and sensor device
US20070263465A1 (en) Precharge circuit of semiconductor memory apparatus
US20130229877A1 (en) Memory with bit line current injection
US9959915B2 (en) Voltage generator to compensate for process corner and temperature variations
US9762215B1 (en) Apparatuses and methods for voltage buffering
US20130148432A1 (en) Sense amplifier with offset current injection
US20150078102A1 (en) Nonvolatile semiconductor memory device and data transmission method
US8988957B2 (en) Sense amplifier soft-fail detection circuit
US20150003168A1 (en) Non-volatile memory device with improved reading circuit
US20150016205A1 (en) Semiconductor circuit
CN106898382B (en) Reading circuit of memory and reading method thereof
JP2011159332A (en) Semiconductor memory device
US8873295B2 (en) Memory and operation method thereof
US9406384B2 (en) Matching semiconductor circuits
US10200017B2 (en) Self-setting/resetting latch

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN)

AS Assignment

Owner name: MORGAN STANLEY SENIOR FUNDING, INC., MARYLAND

Free format text: SUPPLEMENT NO. 5 TO PATENT SECURITY AGREEMENT;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:043482/0776

Effective date: 20170721

Owner name: U.S. BANK NATIONAL ASSOCIATION, MINNESOTA

Free format text: SUPPLEMENT NO. 5 TO PATENT SECURITY AGREEMENT;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:043483/0686

Effective date: 20170721

STCF Information on status: patent grant

Free format text: PATENTED CASE

AS Assignment

Owner name: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT, ILLINOIS

Free format text: SECURITY INTEREST;ASSIGNORS:MICRON TECHNOLOGY, INC.;MICRON SEMICONDUCTOR PRODUCTS, INC.;REEL/FRAME:047540/0001

Effective date: 20180703

Owner name: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT, IL

Free format text: SECURITY INTEREST;ASSIGNORS:MICRON TECHNOLOGY, INC.;MICRON SEMICONDUCTOR PRODUCTS, INC.;REEL/FRAME:047540/0001

Effective date: 20180703

AS Assignment

Owner name: MICRON TECHNOLOGY, INC., IDAHO

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:U.S. BANK NATIONAL ASSOCIATION, AS AGENT;REEL/FRAME:046597/0393

Effective date: 20180629

AS Assignment

Owner name: MICRON TECHNOLOGY, INC., IDAHO

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT;REEL/FRAME:050700/0535

Effective date: 20190731

AS Assignment

Owner name: MICRON TECHNOLOGY, INC., IDAHO

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT;REEL/FRAME:051028/0001

Effective date: 20190731

Owner name: MICRON SEMICONDUCTOR PRODUCTS, INC., IDAHO

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT;REEL/FRAME:051028/0001

Effective date: 20190731

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 4