US20160116948A1 - Housing, electronic device using the same, and method for making the same - Google Patents
Housing, electronic device using the same, and method for making the same Download PDFInfo
- Publication number
- US20160116948A1 US20160116948A1 US14/607,500 US201514607500A US2016116948A1 US 20160116948 A1 US20160116948 A1 US 20160116948A1 US 201514607500 A US201514607500 A US 201514607500A US 2016116948 A1 US2016116948 A1 US 2016116948A1
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- US
- United States
- Prior art keywords
- metal base
- housing
- conductive member
- metal
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
- G06F1/1698—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being a sending/receiving arrangement to establish a cordless communication link, e.g. radio or infrared link, integrated cellular phone
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2258—Supports; Mounting means by structural association with other equipment or articles used with computer equipment
- H01Q1/2266—Supports; Mounting means by structural association with other equipment or articles used with computer equipment disposed inside the computer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/40—Radiating elements coated with or embedded in protective material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/10—Resonant slot antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0485—Dielectric resonator antennas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09909—Special local insulating pattern, e.g. as dam around component
Definitions
- the subject matter herein generally relates to a housing, an electronic device using the housing, and a method for making the housing.
- Metal housings are widely used for electronic devices such as mobile phones or personal digital assistants (PDAs). Antennas are also important components in electronic devices. But the signal of the antenna located in the metal housing is often shield by the metal housing.
- FIG. 1 is an isometric view of an electronic device, according to an exemplary embodiment.
- FIG. 2 is an isometric view of a housing of the electronic device shown in FIG. 1 according to a first exemplary embodiment.
- FIG. 3 is similar to FIG. 2 , but shown from another angle.
- FIG. 4 is an exploded, isometric view of the housing shown in FIG. 2 , according to the first exemplary embodiment.
- FIG. 5 is similar to FIG. 4 , but shown from another angle.
- FIG. 6 is a cross-sectional view of the housing along line VI-VI of FIG. 2 .
- FIG. 7 is an isometric view of a housing according to a second exemplary embodiment.
- FIG. 8 is an exploded, isometric view of the housing shown in FIG. 7 .
- FIG. 9 is a cross-sectional view of the housing along line X-X of FIG. 7 .
- FIG. 10 is an isometric view of a housing according to a third exemplary embodiment.
- FIG. 11 is a cross-sectional view of the housing along line XII-XII of FIG. 10 .
- FIG. 12 is an isometric view of a housing according to a fourth exemplary embodiment.
- FIG. 13 is a cross-sectional view of the housing along line XIII-XIII of FIG. 12 .
- FIG. 14 is a flow chart of a method for making a housing in accordance with a first exemplary embodiment.
- FIG. 15 is another flow chart of a method for making a housing in accordance with a second exemplary embodiment.
- FIG. 1 illustrates an electronic device 100 according to an exemplary embodiment.
- the electronic device 100 can be, but not limited to, a mobile phone, a personal digital assistant or a tablet computer.
- the electronic device 100 includes a body 10 , a housing 30 assembled to the body 10 , and an antenna 50 located inside the housing 30 .
- the body 10 can have a printed circuit board (PCB, not shown) and a battery (not shown) electronically connected with the PCB.
- the battery can charge the electronic device 100 .
- the housing 30 is a back cover of the electronic device 100 .
- the housing 30 can include a metal base 31 and a non-conductive member 33 , a dielectric member 35 received in the metal base 31 , and a protective layer (not shown) formed on the metal base 31 .
- the metal base 31 can be coupled with the antenna 50 , such that the metal base 31 is used as a part of an antenna assembly of the electronic device 100 . In alternative embodiments, the metal base 31 is not coupled with the antenna 50 , such that the metal base 31 is not used as a part of the antenna assembly of the electronic device 100 .
- the metal base 31 includes an internal surface 311 and an outer surface 313 opposite to the internal surface 311 .
- a thickness of the metal base 31 is less than 0.5 mm, preferably, the thickness of the metal base is about 0.3 mm to about 0.5 mm.
- the non-conductive member 33 can directly cover at least a portion of the internal surface 311 .
- the location, shape and dimension of the portion of the internal surface 311 covered with the non-conductive member 33 can be designed according to that of the housing 30 .
- the metal base 31 can be made of metal which can be selected from a group consisting of aluminium, aluminium alloy, magnesium, magnesium alloy, titanium, titanium alloy, copper and copper alloy.
- sections of a portion of the metal base 31 are cut off to form at least one gap 315 .
- the dielectric member 35 can be received in the gap 315 .
- the non-conductive member 33 can be located at a bottom of the at least one gap 315 .
- the antenna 50 corresponds to the at least one gap 315 , the dielectric member 35 and the non-conductive member 33 , such that signal of the antenna 50 can pass through the gap 315 to have a high radiation efficiency.
- the at least one gap 315 includes a plurality of gaps 315 , and the metal base 31 is spaced by the gaps 315 , forming a plurality of metal sheets 317 and at least one main body 319 .
- the location of the metal sheets 317 and the at least one main body 319 does not move, because the metal sheets 317 and the at least one main body 319 are bonded with the non-conductive member 33 , such that the housing 30 has high dimensional accuracy.
- Each metal sheet 317 has a width of about 0.15 mm to about 1.0 mm along a direction from an adjacent dielectric member 35 located at one side of the metal sheet 317 to another adjacent dielectric member 35 located at the opposite side of the metal sheet 317 .
- Each gap 315 and each dielectric member 35 have a width of about 0.02 mm to about 0.7 mm along a direction from an adjacent dielectric member 35 located at one side of the metal sheet 317 to another adjacent dielectric member 35 located at the opposite side of the metal sheet 317 .
- the metal base 31 is spaced by the gaps 315 , forming a plurality of metal sheets 317 and two main bodies 319 .
- Each gap 315 can run through the two opposite ends of the metal base 31 along a direction of the metal sheets 319 parallel to the main body 319 .
- the non-conductive member 33 can be made of a thermoplastic, a thermosetting plastic, a ceramic, or other non-conductive materials.
- the thermoplastic can be selected from a group consisting of polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), polyethylene terephthalate (PET), polyether ether ketone (PEEK), polycarbonate (PC) and polyvinyl chloride polymer (PVC).
- the thermosetting plastic can be selected from a group consisting of a polyurethane resin, an epoxy, and a polyurea resin.
- the dielectric member 35 can be bonded with the non-conductive member 33 , and received in the at least one gap 315 to bond the metal sheets 317 with the at least one main body 319 .
- the signal of the antenna 50 can pass through the dielectric member 35 , such that the antenna 50 has a high radiation efficiency.
- the dielectric member 35 can be made of dielectric material, such as resin, rubber, ceramic, and so on.
- the resin can be made of a thermoplastic or a thermosetting plastic.
- the thermoplastic can be selected from a group consisting of polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), polyethylene terephthalate (PET), polyether ether ketone (PEEK), polycarbonate (PC) and polyvinyl chloride polymer (PVC).
- the thermosetting plastic can be selected from a group consisting of an epoxy, and a polyurea resin, and a UV-curing adhesive.
- the UV-curing adhesive can be acrylic resin or polyurethane.
- the protective layer (not shown) can be formed by an anodic oxidation coloring process, a spraying process or an electrophoresis process.
- the protective layer can have a thickness of about 10 ⁇ m to about 15 ⁇ m and cover the internal surface 311 and the outer surface 311 of the metal base 31 .
- FIGS. 7-9 illustrate a housing 40 according to a second exemplary embodiment.
- the difference between the housing 40 of the second exemplary embodiment and the housing 30 of the first exemplary embodiment is that the metal base 41 is spaced by the gaps 415 , forming a plurality of metal sheets 417 and one main body 419 .
- the gaps 415 are positioned within the metal base 41 .
- the gaps 415 cannot run through at least one end of the metal base 41 along a direction of the metal sheets 419 parallel to the main body 419 .
- FIGS. 10-11 illustrate a housing 50 according to a third exemplary embodiment.
- the difference between the housing 50 of the third exemplary embodiment and the housing 30 of the first exemplary embodiment is that a thickness of the metal base 51 is more than 0.5 mm.
- the thickness of the metal base 51 is about 0.8 mm to about 1.0 mm.
- Sections of a portion of an internal surface 511 of the metal base 51 can be thinned to form a groove 5111 by a thinning process.
- a non-conductive member 53 can be received in the groove 5111 .
- the thickness of the metal base 51 corresponding to the groove 5111 can be about 0.3 mm to about 0.5 mm.
- the thinning process can be carried out by a computer number control technology (CNC). It is to be understood that the non-conductive member 53 can also cover a periphery of groove 5111 to enhance the bonding strength between the non-conductive member 53 and the metal base 51 .
- CNC computer number control technology
- FIGS. 12-13 illustrate a housing 60 according to a fourth exemplary embodiment.
- the difference between the housing 60 of the fourth exemplary embodiment and the housing 40 of the second exemplary embodiment is that a thickness of the metal base 61 is more than 0.5 mm.
- the thickness of the metal base 61 is about 0.8 mm to about 1.0 mm.
- Sections of a portion of an internal surface 611 can be thinned to form a groove 6111 by a thinning process.
- Non-conductive member 63 can be received in the groove 6111 .
- a thickness of the metal base 61 corresponding to the groove 6111 can be about 0.3 mm to about 0.5 mm.
- the thinning process can be carried out by a CNC technology. It is to be understood that the non-conductive member 63 can also cover a periphery of groove 6111 to enhance the bonding strength between the non-conductive member 63 and the metal base 61 .
- FIG. 14 a flowchart is presented in accordance with an example embodiment.
- the method 1400 is provided by way of example, as there are a variety of ways to carry out the method.
- the method 1400 described below can be carried out using the configurations illustrated in FIGS. 1-6 , for example, and various elements of these figures are referenced in explaining method 1400 .
- Each block shown in FIG. 14 represents one or more processes, methods or subroutines, carried out in the method 1400 .
- the order of blocks is illustrative only and the order of the blocks can change according to the present disclosure. Additional blocks may be added or fewer blocks may be utilized, without departing from this disclosure.
- the method 1400 for making the housing 30 can begin at block 1401 .
- a metal base 31 is provided.
- the metal base 31 has an internal surface 311 and an outer surface 313 opposite to the internal surface 311 .
- a thickness of the metal base is less than 0.5 mm.
- the thickness of the metal base is about 0.3 mm to about 0.5 mm.
- the metal base 31 can be made by casting, punching, or CNC.
- the metal base 31 having a desired three dimensional shape is provided.
- the metal base 31 can be made of metal which can be selected from a group consisting of aluminium, aluminium alloy, magnesium, magnesium alloy, titanium, titanium alloy, copper and copper alloy.
- the metal base 31 is degreased.
- the degreasing process may include ultrasonic cleaning the metal base 31 in absolute ethanol for about 25 minutes to about 35 minutes to remove oil stain coated on the metal base 31 .
- the metal base 31 is put into a mold (not shown) to form a non-conductive member 33 on an internal surface of the metal base 31 .
- the injection temperature is about 290° C. to about 320° C.
- the injection pressure is about 2 MPa to about 4 MPa.
- Liquid resin can be filled into the mold and cover at least a portion of the internal surface 311 of the metal base 31 , forming the non-conductive member 31 .
- non-conductive member 33 can be formed by a conventional injection process, and also can be formed by a nano mold technology (NMT).
- NMT nano mold technology
- NMT can be carried out by surface treating the metal base 31 to form a plurality of nano-pores (not shown) having a diameter of about 10 nm to about 300 nm on the internal surface 311 , such that the internal surface 311 can have a surface roughness of about 0.1 ⁇ m to about 1 ⁇ m.
- the surface treatment can be an electrochemical etching process, a dipping process, an anodic oxidation treatment or a chemical etching process.
- the metal base 31 having nano-pores is put into a mold (not shown), and liquid resin is filled into the mold and cover at least a portion of the internal surface 311 of the metal base 31 , forming the non-conductive member 31 .
- the resin for making the non-conductive member 33 can be a thermoplastic or a thermosetting plastic.
- the thermoplastic can be selected from a group consisting of polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), polyethylene terephthalate (PET), polyether ether ketone (PEEK), polycarbonate (PC) and polyvinyl chloride polymer (PVC).
- the thermosetting plastic can be selected from a group consisting of a polyurethane resin, an epoxy, and a polyurea resin.
- non-conductive member 33 can also be made of ceramic, or other non-conductive materials
- sections of a portion of the metal base 31 corresponding to the non-conductive member 33 are cut off from the outer surface 313 to form at least one gap 315 , and the metal base 31 can be spaced by at least one gap 315 , forming at least one metal sheet 317 and at least one main body 319 .
- the non-conductive member 33 is located at the bottom of the gap 315 .
- the metal base 31 can be cut off by a laser cutting process or a CNC process.
- the metal base 31 is spaced by the at least one gap 315 , forming a plurality of metal sheets 317 and two main bodies 319 .
- the gaps 315 can run through the two opposite ends of the metal base 31 .
- each gap 315 is filled with a dielectric member 35 .
- the dielectric member 35 can be made of a dielectric material, such as a resin, a rubber, a ceramic, and so on.
- the resin can be made of a thermoplastic or a thermosetting plastic.
- the thermoplastic can be selected from a group consisting of polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), polyethylene terephthalate (PET), polyether ether ketone (PEEK), polycarbonate (PC) and polyvinyl chloride polymer (PVC).
- the thermosetting plastic can be selected from a group consisting of an epoxy, and a polyurea resin, and a UV-curing adhesive.
- the dielectric member 35 can be formed by any of the following three methods:
- the UV-curing adhesive is cured by a UV irradiation process to form the dielectric members 35 located in the gaps 315 .
- the UV-curing adhesive can be an acrylic resin or a polyurethane resin.
- the metal base 31 is put into a mold (not shown).
- the injection temperature can be about 290° C. to about 320° C.
- the injection pressure can be about 2 MPa to about 4 MPa.
- Liquid resin can be filled into the gaps 315 , forming the dielectric members 35 .
- the dielectric members 35 are formed by NMT.
- the NMT is carried out by surface treating the metal base 31 , the metal sheets 317 and the main bodies 319 to form a plurality of nano-pores (not shown) having a diameter of about 10 nm to about 300 nm on the metal base 31 , metal sheets 317 and the main bodies 319 .
- the surface treating method can be an electrochemical etching process, a dipping process, an anodic oxidation treatment or a chemical etching process.
- the metal base 31 , the metal sheets 317 and the main bodies 319 having nano-pores are put into a mold (not shown), and liquid resin is filled into the gaps 315 between each two adjacent metal sheets 317 , the main bodies 319 and the metal sheets 317 adjacent the main bodies 319 , forming the dielectric member 35
- the gaps 315 and the dielectric member 35 both have a width of about 0.02 mm to about 0.7 mm along a direction from an adjacent dielectric member 35 located at one side of the metal sheet 317 to another adjacent dielectric member 35 located at the opposite side of the metal sheet 317 .
- Each metal sheet 317 has a width of about 0.15 mm to about 1.0 mm along a direction from an adjacent dielectric member 35 located at one side of the metal sheet 317 to another adjacent dielectric member 35 located at the opposite side of the metal sheet 317 .
- a protective layer (not shown) having a thickness of about 10 ⁇ m to about 15 ⁇ m is formed on the surface of the metal base 31 .
- the protective layer can be formed by any of the following three methods:
- the protective layer is formed by an anodic oxidation coloring process.
- the anodic oxidation coloring process is carried out in a sulphuric acid solution having a concentration of about 160 g/L to about 220 g/L, with the metal base 31 being an anode, and a stainless steel board or a lead plate being a cathode.
- the voltage between the anode and the cathode is about 10 V to about 15 V.
- the temperature of the sulphuric acid is about 16° C. to about 18° C.
- the anodic oxidation coloring process may last for about 30 minutes to about 45 minutes to form the protective layer having a thickness of about 10 ⁇ m to about 15 ⁇ m.
- the protective layer has a plurality of pores (not shown). Then, the metal base 31 is dipped into a dyeing solution containing coloring agent at a temperature of about 30° C. to about 50° C.
- the coloring agent has a concentration of about 3 g/L to about 10 g/L.
- the dipping time may be about 1 minute to about 2 minutes.
- the coloring agent is absorbed into the pores of the protective layer, such that the protective layer can have color.
- the coloring agent is a dark organic coloring agent or a dark inorganic coloring agent.
- the protective layer containing coloring agent should be sealed to fix the coloring agent in the pores.
- the sealing treatment can be a boiling water sealing process, a steam sealing process, a nickel acetate sealing process, a potassium dichromate sealing process, a nickel sulfate sealing process, stearic acid sealing process, or a cold sealing process.
- the protective layer is formed by an electrophoresis process.
- the electrophoresis process is carried out in an electrophoresis solution at a temperature of about 30° C. to about 35° C., with the metal base 31 being an anode, and a stainless steel board or a lead plate being a cathode.
- the voltage between the anode and the cathode is about 70 V to about 90 V.
- the electrophoresis process may last for about 20 seconds to about 44 seconds to form the protective layer having a thickness of about 10 ⁇ m to about 15 ⁇ m.
- the electrophoresis solution includes electrophoresis paint and water with a volume ratio of about 3-5:4-6.
- the electrophoresis paint can be an epoxy electrophoresis paint.
- the main chain of the epoxy electrophoresis paint can have polyether and dual alcohol, polyether and dual amine, or polyester and dual alcohol.
- the protective layer formed by the electrophoresis process or the anodic oxidation coloring process can cover an area of the metal base 31 .
- the width of the dielectric member 35 is very small, it is hard to find out the dielectric member 35 located in the metal base 31 , such that the housing 30 can have an entire metallic appearance.
- the protective layer is formed by spraying paint onto the surface of the metal base 31 by a spraying gun (not shown). Then, the metal base 31 is put in a dryer to be backed, such that the protective layer having a thickness of about 10 ⁇ m to about 15 ⁇ m is formed on the entail surface of the metal base 31 . As the paint can cover the entire surface of the metal base 31 and the dielectric member 35 , the metal base 31 can have an entire metallic appearance.
- FIGS. 7-9 illustrate a housing 40 according to a second exemplary embodiment.
- the difference between the method of the second exemplary embodiment and the method of the first exemplary embodiment is that the metal base 41 is spaced by gaps 415 , forming a plurality of metal sheets 417 and one main body 419 .
- the gaps 415 can be positioned within the metal base 41 .
- the gaps 415 cannot run through at least one end of the metal base 41 along a direction of the metal sheets 419 parallel to the main body 419 .
- the method 1500 is provided by way of example, as there are a variety of ways to carry out the method.
- the method 1500 described below can be carried out using the configurations illustrated in FIGS. 10-11 , for example, and various elements of these figures are referenced in explaining method 1500 .
- Each block shown in FIG. 15 represents one or more processes, methods or subroutines, carried out in the method 1500 .
- the order of blocks is illustrative only and the order of the blocks can change according to the present disclosure. Additional blocks may be added or fewer blocks may be utilized, without departing from this disclosure.
- the method 1500 for making the housing 50 can begin at block 1501 .
- a metal base 51 is provided.
- the metal base 51 has an internal surface 511 and an outer surface 513 opposite to the internal surface 511 .
- a thickness of the metal base 51 is less than 0.5 mm.
- the thickness of the metal base 51 is about 0.3 mm to about 0.5 mm.
- a thickness of the metal base 51 is more than 0.5 mm.
- the thickness of the metal base 51 is about 0.8 mm to about 1.0 mm.
- the metal base 51 can be made by casting, punching, or CNC.
- the metal base 51 having a desired three dimensional shape is provided.
- the metal base 51 can be made of a metal which can be selected from a group consisting of aluminium, aluminium alloy, magnesium, magnesium alloy, titanium, titanium alloy, copper and copper alloy.
- the metal base 51 is degreased.
- the degreasing process may include ultrasonic cleaning the metal base 51 in absolute ethanol for about 25 minutes to about 35 minutes to remove oil stain coated on the metal base 51 .
- a groove 5111 is formed on the metal base 51 by a thinning process.
- the thickness of the metal base 51 corresponding to the groove 5111 can be about 0.3 mm to about 0.5 mm.
- the thinning process can be carried out by a CNC technology.
- the metal base 51 is put into a mold (not shown) to form a non-conductive member 53 on an internal surface of the metal base 51 , the non-conductive member 53 can be received in the groove 5111 .
- the injection temperature is about 290° C. to about 320° C.
- the injection pressure is about 2 MPa to about 4 MPa.
- Liquid resin can be filled into the mold and cover at least a portion of the internal surface 511 of the metal base 51 , forming the non-conductive member 51 .
- the non-conductive member 53 can also cover a periphery of groove 5111 to enhance the bonding strength between the non-conductive member 53 and the metal base 51 .
- non-conductive member 53 can be formed by a conventional injection process, and also can be formed by a nano mold technology (NMT) as illustrated in block 1403 .
- NMT nano mold technology
- sections of a portion of the metal base 51 corresponding to the non-conductive member 53 are cut off from the outer surface 513 to form at least one gap 515 , and the metal base 51 can be spaced by at least one gap 515 , forming at least one metal sheet 517 and at least one main body 519 .
- the non-conductive member 53 is located at the bottom of the gap 515 .
- the metal base 51 can be cut off by a laser cutting process or a CNC process.
- the metal base 51 is spaced by the at least one gap 515 , forming a plurality of metal sheets 517 and two main bodies 519 .
- the gaps 515 can run through the two opposite ends of the metal base 51 .
- each gap 515 is filled with a dielectric member 55 .
- the dielectric member 55 can be made of a dielectric material, such as a resin, a rubber, a ceramic, and so on.
- the resin can be made of a thermoplastic or a thermosetting plastic.
- the thermoplastic can be selected from a group consisting of polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), polyethylene terephthalate (PET), polyether ether ketone (PEEK), polycarbonate (PC) and polyvinyl chloride polymer (PVC).
- the thermosetting plastic can be selected from a group consisting of an epoxy, and a polyurea resin, and a UV-curing adhesive.
- the dielectric member 55 can be formed by any of the following three methods:
- the UV-curing adhesive is cured by a UV irradiation process to form the dielectric members 55 located in the gaps 515 .
- the UV-curing adhesive can be an acrylic resin or a polyurethane resin.
- the metal base 51 is put into a mold (not shown).
- the injection temperature can be about 290° C. to about 320° C.
- the injection pressure can be about 2 MPa to about 4 MPa.
- Liquid resin can be filled into the gaps 515 , forming the dielectric members 55 .
- the dielectric members 55 are formed by NMT.
- the NMT is carried out by surface treating the metal base 51 , the metal sheets 517 and the main bodies 519 to form a plurality of nano-pores (not shown) having a diameter of about 10 nm to about 300 nm on the metal base 51 , metal sheets 517 and the main bodies 519 .
- the surface treating method can be an electrochemical etching process, a dipping process, an anodic oxidation treatment or a chemical etching process.
- the metal base 51 , the metal sheets 517 and the main bodies 519 having nano-pores are put into a mold (not shown), and liquid resin is filled into the gaps 515 between each two adjacent metal sheets 517 , the main bodies 519 and the metal sheets 517 adjacent the main bodies 519 , forming the dielectric member 55
- the gaps 515 and the dielectric member 55 both have a width of about 0.02 mm to about 0.7 mm along a direction from an adjacent dielectric member 55 located at one side of the metal sheet 517 to another adjacent dielectric member 55 located at the opposite side of the metal sheet 517 .
- Each metal sheet 517 has a width of about 0.15 mm to about 1.0 mm along a direction from an adjacent dielectric member 55 located at one side of the metal sheet 517 to another adjacent dielectric member 55 located at the opposite side of the metal sheet 517 .
- a protective layer (not shown) having a thickness of about 10 ⁇ m to about 15 ⁇ m is formed on the surface of the metal base 51 .
- the protective layer can be formed by any of the following three methods:
- the protective layer is formed by an anodic oxidation coloring process.
- the anodic oxidation coloring process is carried out in a sulphuric acid solution having a concentration of about 160 g/L to about 220 g/L, with the metal base 51 being an anode, and a stainless steel board or a lead plate being a cathode.
- the voltage between the anode and the cathode is about 10 V to about 15 V.
- the temperature of the sulphuric acid is about 16° C. to about 18° C.
- the anodic oxidation coloring process may last for about 30 minutes to about 45 minutes to form the protective layer having a thickness of about 10 ⁇ m to about 15 ⁇ m.
- the protective layer has a plurality of pores (not shown). Then, the metal base 51 is dipped into a dyeing solution containing coloring agent at a temperature of about 30° C. to about 50° C.
- the coloring agent has a concentration of about 3 g/L to about 10 g/L.
- the dipping time may be about 1 minute to about 2 minutes.
- the coloring agent is absorbed into the pores of the protective layer, such that the protective layer can have color.
- the coloring agent is a dark organic coloring agent or a dark inorganic coloring agent.
- the protective layer containing coloring agent should be sealed to fix the coloring agent in the pores.
- the sealing treatment can be a boiling water sealing process, a steam sealing process, a nickel acetate sealing process, a potassium dichromate sealing process, a nickel sulfate sealing process, stearic acid sealing process, or a cold sealing process.
- the protective layer is formed by an electrophoresis process.
- the electrophoresis process is carried out in an electrophoresis solution at a temperature of about 30° C. to about 35° C., with the metal base 51 being an anode, and a stainless steel board or a lead plate being a cathode.
- the voltage between the anode and the cathode is about 70 V to about 90 V.
- the electrophoresis process may last for about 20 seconds to about 44 seconds to form the protective layer having a thickness of about 10 ⁇ m to about 15 ⁇ m.
- the electrophoresis solution includes electrophoresis paint and water with a volume ratio of about 3-5:4-6.
- the electrophoresis paint can be an epoxy electrophoresis paint.
- the main chain of the epoxy electrophoresis paint can have polyether and dual alcohol, polyether and dual amine, or polyester and dual alcohol.
- the protective layer formed by the electrophoresis process or the anodic oxidation coloring process can cover an area of the metal base 51 .
- the width of the dielectric member 55 is very small, it is hard to find out the dielectric member 55 located in the metal base 51 , such that the housing 50 can have an entire metallic appearance.
- the protective layer is formed by spraying paint onto the surface of the metal base 51 by a spraying gun (not shown). Then, the metal base 51 is put in a dryer to be backed, such that the protective layer having a thickness of about 10 ⁇ m to about 15 ⁇ m is formed on the entail surface of the metal base 51 . As the paint can cover the entire surface of the metal base 51 and the dielectric member 55 , the metal base 51 can have an entire metallic appearance.
- FIGS. 12-13 illustrate a housing 60 according to a fourth exemplary embodiment.
- the difference between the method of the fourth exemplary embodiment and the method of the second exemplary embodiment can be that a thickness of the metal base 61 is more than 0.5 mm.
- the thickness of the metal base 31 is about 0.8 mm to about 1.0 mm, and sections of a portion of an internal surface 611 can be thinned to form a groove 6111 by a thinning process.
- a non-conductive member 63 can be received in the groove 3111 .
- the thickness of the metal base 61 corresponding to the groove 6111 is about 0.3 mm to about 0.5 mm.
- the thinning process can be carried out by a CNC technology. It is to be understood, the non-conductive member 63 can also cover a periphery of groove 6111 to enhance the bonding strength between the non-conductive member 63 and the metal base 61 .
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- Computer Networks & Wireless Communication (AREA)
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- Injection Moulding Of Plastics Or The Like (AREA)
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Abstract
Description
- The subject matter herein generally relates to a housing, an electronic device using the housing, and a method for making the housing.
- Metal housings are widely used for electronic devices such as mobile phones or personal digital assistants (PDAs). Antennas are also important components in electronic devices. But the signal of the antenna located in the metal housing is often shield by the metal housing.
- Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.
-
FIG. 1 is an isometric view of an electronic device, according to an exemplary embodiment. -
FIG. 2 is an isometric view of a housing of the electronic device shown inFIG. 1 according to a first exemplary embodiment. -
FIG. 3 is similar toFIG. 2 , but shown from another angle. -
FIG. 4 is an exploded, isometric view of the housing shown inFIG. 2 , according to the first exemplary embodiment. -
FIG. 5 is similar toFIG. 4 , but shown from another angle. -
FIG. 6 is a cross-sectional view of the housing along line VI-VI ofFIG. 2 . -
FIG. 7 is an isometric view of a housing according to a second exemplary embodiment. -
FIG. 8 is an exploded, isometric view of the housing shown inFIG. 7 . -
FIG. 9 is a cross-sectional view of the housing along line X-X ofFIG. 7 . -
FIG. 10 is an isometric view of a housing according to a third exemplary embodiment. -
FIG. 11 is a cross-sectional view of the housing along line XII-XII ofFIG. 10 . -
FIG. 12 is an isometric view of a housing according to a fourth exemplary embodiment. -
FIG. 13 is a cross-sectional view of the housing along line XIII-XIII ofFIG. 12 . -
FIG. 14 is a flow chart of a method for making a housing in accordance with a first exemplary embodiment. -
FIG. 15 is another flow chart of a method for making a housing in accordance with a second exemplary embodiment. - It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.
- The term “comprising” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series and the like. The term “coupled” when utilized, means “either a direct electrical connection between the things that are connected, or an indirect connection through one or more passive or active intermediary devices, but not necessarily limited to”.
-
FIG. 1 illustrates anelectronic device 100 according to an exemplary embodiment. Theelectronic device 100 can be, but not limited to, a mobile phone, a personal digital assistant or a tablet computer. Theelectronic device 100 includes abody 10, ahousing 30 assembled to thebody 10, and anantenna 50 located inside thehousing 30. - The
body 10 can have a printed circuit board (PCB, not shown) and a battery (not shown) electronically connected with the PCB. The battery can charge theelectronic device 100. - Referring to
FIGS. 2-5 , in one exemplary embodiment, thehousing 30 is a back cover of theelectronic device 100. Thehousing 30 can include ametal base 31 and anon-conductive member 33, adielectric member 35 received in themetal base 31, and a protective layer (not shown) formed on themetal base 31. - In at least one embodiment, the
metal base 31 can be coupled with theantenna 50, such that themetal base 31 is used as a part of an antenna assembly of theelectronic device 100. In alternative embodiments, themetal base 31 is not coupled with theantenna 50, such that themetal base 31 is not used as a part of the antenna assembly of theelectronic device 100. - The
metal base 31 includes aninternal surface 311 and anouter surface 313 opposite to theinternal surface 311. In at least one exemplary embodiment, a thickness of themetal base 31 is less than 0.5 mm, preferably, the thickness of the metal base is about 0.3 mm to about 0.5 mm. Thenon-conductive member 33 can directly cover at least a portion of theinternal surface 311. - It is to be understood, the location, shape and dimension of the portion of the
internal surface 311 covered with thenon-conductive member 33 can be designed according to that of thehousing 30. - The
metal base 31 can be made of metal which can be selected from a group consisting of aluminium, aluminium alloy, magnesium, magnesium alloy, titanium, titanium alloy, copper and copper alloy. - Referring to
FIG. 6 , sections of a portion of themetal base 31 are cut off to form at least onegap 315. Thedielectric member 35 can be received in thegap 315. Thenon-conductive member 33 can be located at a bottom of the at least onegap 315. Theantenna 50 corresponds to the at least onegap 315, thedielectric member 35 and thenon-conductive member 33, such that signal of theantenna 50 can pass through thegap 315 to have a high radiation efficiency. - In at least one exemplary embodiment, the at least one
gap 315 includes a plurality ofgaps 315, and themetal base 31 is spaced by thegaps 315, forming a plurality ofmetal sheets 317 and at least onemain body 319. The location of themetal sheets 317 and the at least onemain body 319 does not move, because themetal sheets 317 and the at least onemain body 319 are bonded with thenon-conductive member 33, such that thehousing 30 has high dimensional accuracy. Eachmetal sheet 317 has a width of about 0.15 mm to about 1.0 mm along a direction from an adjacentdielectric member 35 located at one side of themetal sheet 317 to another adjacentdielectric member 35 located at the opposite side of themetal sheet 317. Eachgap 315 and eachdielectric member 35 have a width of about 0.02 mm to about 0.7 mm along a direction from an adjacentdielectric member 35 located at one side of themetal sheet 317 to another adjacentdielectric member 35 located at the opposite side of themetal sheet 317. - Referring to
FIGS. 4-6 , in at least one exemplary embodiment, themetal base 31 is spaced by thegaps 315, forming a plurality ofmetal sheets 317 and twomain bodies 319. Eachgap 315 can run through the two opposite ends of themetal base 31 along a direction of themetal sheets 319 parallel to themain body 319. - The
non-conductive member 33 can be made of a thermoplastic, a thermosetting plastic, a ceramic, or other non-conductive materials. - The thermoplastic can be selected from a group consisting of polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), polyethylene terephthalate (PET), polyether ether ketone (PEEK), polycarbonate (PC) and polyvinyl chloride polymer (PVC). The thermosetting plastic can be selected from a group consisting of a polyurethane resin, an epoxy, and a polyurea resin.
- The
dielectric member 35 can be bonded with thenon-conductive member 33, and received in the at least onegap 315 to bond themetal sheets 317 with the at least onemain body 319. The signal of theantenna 50 can pass through thedielectric member 35, such that theantenna 50 has a high radiation efficiency. - The
dielectric member 35 can be made of dielectric material, such as resin, rubber, ceramic, and so on. - The resin can be made of a thermoplastic or a thermosetting plastic. The thermoplastic can be selected from a group consisting of polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), polyethylene terephthalate (PET), polyether ether ketone (PEEK), polycarbonate (PC) and polyvinyl chloride polymer (PVC). The thermosetting plastic can be selected from a group consisting of an epoxy, and a polyurea resin, and a UV-curing adhesive. The UV-curing adhesive can be acrylic resin or polyurethane.
- The protective layer (not shown) can be formed by an anodic oxidation coloring process, a spraying process or an electrophoresis process. The protective layer can have a thickness of about 10 μm to about 15 μm and cover the
internal surface 311 and theouter surface 311 of themetal base 31. -
FIGS. 7-9 illustrate ahousing 40 according to a second exemplary embodiment. The difference between thehousing 40 of the second exemplary embodiment and thehousing 30 of the first exemplary embodiment is that the metal base 41 is spaced by thegaps 415, forming a plurality ofmetal sheets 417 and onemain body 419. Thegaps 415 are positioned within the metal base 41. And thegaps 415 cannot run through at least one end of the metal base 41 along a direction of themetal sheets 419 parallel to themain body 419. -
FIGS. 10-11 illustrate ahousing 50 according to a third exemplary embodiment. The difference between thehousing 50 of the third exemplary embodiment and thehousing 30 of the first exemplary embodiment is that a thickness of themetal base 51 is more than 0.5 mm. Preferably, the thickness of themetal base 51 is about 0.8 mm to about 1.0 mm. Sections of a portion of aninternal surface 511 of themetal base 51 can be thinned to form agroove 5111 by a thinning process. Anon-conductive member 53 can be received in thegroove 5111. The thickness of themetal base 51 corresponding to thegroove 5111 can be about 0.3 mm to about 0.5 mm. The thinning process can be carried out by a computer number control technology (CNC). It is to be understood that thenon-conductive member 53 can also cover a periphery ofgroove 5111 to enhance the bonding strength between thenon-conductive member 53 and themetal base 51. -
FIGS. 12-13 illustrate ahousing 60 according to a fourth exemplary embodiment. The difference between thehousing 60 of the fourth exemplary embodiment and thehousing 40 of the second exemplary embodiment is that a thickness of themetal base 61 is more than 0.5 mm. Preferably, the thickness of themetal base 61 is about 0.8 mm to about 1.0 mm. Sections of a portion of aninternal surface 611 can be thinned to form agroove 6111 by a thinning process.Non-conductive member 63 can be received in thegroove 6111. A thickness of themetal base 61 corresponding to thegroove 6111 can be about 0.3 mm to about 0.5 mm. The thinning process can be carried out by a CNC technology. It is to be understood that thenon-conductive member 63 can also cover a periphery ofgroove 6111 to enhance the bonding strength between thenon-conductive member 63 and themetal base 61. - Referring to
FIG. 14 , a flowchart is presented in accordance with an example embodiment. Themethod 1400 is provided by way of example, as there are a variety of ways to carry out the method. Themethod 1400 described below can be carried out using the configurations illustrated inFIGS. 1-6 , for example, and various elements of these figures are referenced in explainingmethod 1400. Each block shown inFIG. 14 represents one or more processes, methods or subroutines, carried out in themethod 1400. Furthermore, the order of blocks is illustrative only and the order of the blocks can change according to the present disclosure. Additional blocks may be added or fewer blocks may be utilized, without departing from this disclosure. Themethod 1400 for making thehousing 30 can begin atblock 1401. - At
block 1401, ametal base 31 is provided. Themetal base 31 has aninternal surface 311 and anouter surface 313 opposite to theinternal surface 311. In at least one exemplary embodiment, a thickness of the metal base is less than 0.5 mm. Preferably, the thickness of the metal base is about 0.3 mm to about 0.5 mm. - The
metal base 31 can be made by casting, punching, or CNC. Themetal base 31 having a desired three dimensional shape is provided. Themetal base 31 can be made of metal which can be selected from a group consisting of aluminium, aluminium alloy, magnesium, magnesium alloy, titanium, titanium alloy, copper and copper alloy. - At
block 1402, themetal base 31 is degreased. The degreasing process may include ultrasonic cleaning themetal base 31 in absolute ethanol for about 25 minutes to about 35 minutes to remove oil stain coated on themetal base 31. - At
block 1403, themetal base 31 is put into a mold (not shown) to form anon-conductive member 33 on an internal surface of themetal base 31. The injection temperature is about 290° C. to about 320° C., and the injection pressure is about 2 MPa to about 4 MPa. Liquid resin can be filled into the mold and cover at least a portion of theinternal surface 311 of themetal base 31, forming thenon-conductive member 31. - It is to be understood that the
non-conductive member 33 can be formed by a conventional injection process, and also can be formed by a nano mold technology (NMT). - NMT can be carried out by surface treating the
metal base 31 to form a plurality of nano-pores (not shown) having a diameter of about 10 nm to about 300 nm on theinternal surface 311, such that theinternal surface 311 can have a surface roughness of about 0.1 μm to about 1 μm. The surface treatment can be an electrochemical etching process, a dipping process, an anodic oxidation treatment or a chemical etching process. Then, themetal base 31 having nano-pores is put into a mold (not shown), and liquid resin is filled into the mold and cover at least a portion of theinternal surface 311 of themetal base 31, forming thenon-conductive member 31. - The resin for making the
non-conductive member 33 can be a thermoplastic or a thermosetting plastic. The thermoplastic can be selected from a group consisting of polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), polyethylene terephthalate (PET), polyether ether ketone (PEEK), polycarbonate (PC) and polyvinyl chloride polymer (PVC). The thermosetting plastic can be selected from a group consisting of a polyurethane resin, an epoxy, and a polyurea resin. - It is to be understood that the
non-conductive member 33 can also be made of ceramic, or other non-conductive materials - At
block 1404, sections of a portion of themetal base 31 corresponding to thenon-conductive member 33 are cut off from theouter surface 313 to form at least onegap 315, and themetal base 31 can be spaced by at least onegap 315, forming at least onemetal sheet 317 and at least onemain body 319. Thenon-conductive member 33 is located at the bottom of thegap 315. Themetal base 31 can be cut off by a laser cutting process or a CNC process. - In at least one exemplary embodiment, the
metal base 31 is spaced by the at least onegap 315, forming a plurality ofmetal sheets 317 and twomain bodies 319. Thegaps 315 can run through the two opposite ends of themetal base 31. - At
block 1405, eachgap 315 is filled with adielectric member 35. Thedielectric member 35 can be made of a dielectric material, such as a resin, a rubber, a ceramic, and so on. The resin can be made of a thermoplastic or a thermosetting plastic. The thermoplastic can be selected from a group consisting of polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), polyethylene terephthalate (PET), polyether ether ketone (PEEK), polycarbonate (PC) and polyvinyl chloride polymer (PVC). The thermosetting plastic can be selected from a group consisting of an epoxy, and a polyurea resin, and a UV-curing adhesive. - The
dielectric member 35 can be formed by any of the following three methods: - In a first method, after filling a UV-curing adhesive into the
gaps 315, the UV-curing adhesive is cured by a UV irradiation process to form thedielectric members 35 located in thegaps 315. The UV-curing adhesive can be an acrylic resin or a polyurethane resin. - In a second method, the
metal base 31 is put into a mold (not shown). The injection temperature can be about 290° C. to about 320° C., and the injection pressure can be about 2 MPa to about 4 MPa. Liquid resin can be filled into thegaps 315, forming thedielectric members 35. - In a third method, the
dielectric members 35 are formed by NMT. - The NMT is carried out by surface treating the
metal base 31, themetal sheets 317 and themain bodies 319 to form a plurality of nano-pores (not shown) having a diameter of about 10 nm to about 300 nm on themetal base 31,metal sheets 317 and themain bodies 319. The surface treating method can be an electrochemical etching process, a dipping process, an anodic oxidation treatment or a chemical etching process. Then, themetal base 31, themetal sheets 317 and themain bodies 319 having nano-pores are put into a mold (not shown), and liquid resin is filled into thegaps 315 between each twoadjacent metal sheets 317, themain bodies 319 and themetal sheets 317 adjacent themain bodies 319, forming thedielectric member 35 - The
gaps 315 and thedielectric member 35 both have a width of about 0.02 mm to about 0.7 mm along a direction from anadjacent dielectric member 35 located at one side of themetal sheet 317 to anotheradjacent dielectric member 35 located at the opposite side of themetal sheet 317. Eachmetal sheet 317 has a width of about 0.15 mm to about 1.0 mm along a direction from anadjacent dielectric member 35 located at one side of themetal sheet 317 to anotheradjacent dielectric member 35 located at the opposite side of themetal sheet 317. - At
block 1406, a protective layer (not shown) having a thickness of about 10 μm to about 15 μm is formed on the surface of themetal base 31. The protective layer can be formed by any of the following three methods: - In a first method, the protective layer is formed by an anodic oxidation coloring process. The anodic oxidation coloring process is carried out in a sulphuric acid solution having a concentration of about 160 g/L to about 220 g/L, with the
metal base 31 being an anode, and a stainless steel board or a lead plate being a cathode. The voltage between the anode and the cathode is about 10 V to about 15 V. The temperature of the sulphuric acid is about 16° C. to about 18° C. The anodic oxidation coloring process may last for about 30 minutes to about 45 minutes to form the protective layer having a thickness of about 10 μm to about 15 μm. The protective layer has a plurality of pores (not shown). Then, themetal base 31 is dipped into a dyeing solution containing coloring agent at a temperature of about 30° C. to about 50° C. The coloring agent has a concentration of about 3 g/L to about 10 g/L. The dipping time may be about 1 minute to about 2 minutes. The coloring agent is absorbed into the pores of the protective layer, such that the protective layer can have color. The coloring agent is a dark organic coloring agent or a dark inorganic coloring agent. The protective layer containing coloring agent should be sealed to fix the coloring agent in the pores. The sealing treatment can be a boiling water sealing process, a steam sealing process, a nickel acetate sealing process, a potassium dichromate sealing process, a nickel sulfate sealing process, stearic acid sealing process, or a cold sealing process. - In a second method, the protective layer is formed by an electrophoresis process. The electrophoresis process is carried out in an electrophoresis solution at a temperature of about 30° C. to about 35° C., with the
metal base 31 being an anode, and a stainless steel board or a lead plate being a cathode. The voltage between the anode and the cathode is about 70 V to about 90 V. The electrophoresis process may last for about 20 seconds to about 44 seconds to form the protective layer having a thickness of about 10 μm to about 15 μm. The electrophoresis solution includes electrophoresis paint and water with a volume ratio of about 3-5:4-6. The electrophoresis paint can be an epoxy electrophoresis paint. The main chain of the epoxy electrophoresis paint can have polyether and dual alcohol, polyether and dual amine, or polyester and dual alcohol. - It is to be understood that the protective layer formed by the electrophoresis process or the anodic oxidation coloring process can cover an area of the
metal base 31. As the width of thedielectric member 35 is very small, it is hard to find out thedielectric member 35 located in themetal base 31, such that thehousing 30 can have an entire metallic appearance. - In a third method, the protective layer is formed by spraying paint onto the surface of the
metal base 31 by a spraying gun (not shown). Then, themetal base 31 is put in a dryer to be backed, such that the protective layer having a thickness of about 10 μm to about 15 μm is formed on the entail surface of themetal base 31. As the paint can cover the entire surface of themetal base 31 and thedielectric member 35, themetal base 31 can have an entire metallic appearance. -
FIGS. 7-9 illustrate ahousing 40 according to a second exemplary embodiment. The difference between the method of the second exemplary embodiment and the method of the first exemplary embodiment is that the metal base 41 is spaced bygaps 415, forming a plurality ofmetal sheets 417 and onemain body 419. Thegaps 415 can be positioned within the metal base 41. And thegaps 415 cannot run through at least one end of the metal base 41 along a direction of themetal sheets 419 parallel to themain body 419. - Referring to
FIG. 15 , a flowchart is presented according to another exemplary embodiment. Themethod 1500 is provided by way of example, as there are a variety of ways to carry out the method. Themethod 1500 described below can be carried out using the configurations illustrated inFIGS. 10-11 , for example, and various elements of these figures are referenced in explainingmethod 1500. Each block shown inFIG. 15 represents one or more processes, methods or subroutines, carried out in themethod 1500. Furthermore, the order of blocks is illustrative only and the order of the blocks can change according to the present disclosure. Additional blocks may be added or fewer blocks may be utilized, without departing from this disclosure. Themethod 1500 for making thehousing 50 can begin atblock 1501. - At
block 1501, ametal base 51 is provided. Themetal base 51 has aninternal surface 511 and anouter surface 513 opposite to theinternal surface 511. In at least one exemplary embodiment, a thickness of themetal base 51 is less than 0.5 mm. Preferably, the thickness of themetal base 51 is about 0.3 mm to about 0.5 mm. A thickness of themetal base 51 is more than 0.5 mm. Preferably, the thickness of themetal base 51 is about 0.8 mm to about 1.0 mm. - The
metal base 51 can be made by casting, punching, or CNC. Themetal base 51 having a desired three dimensional shape is provided. Themetal base 51 can be made of a metal which can be selected from a group consisting of aluminium, aluminium alloy, magnesium, magnesium alloy, titanium, titanium alloy, copper and copper alloy. - At
block 1502, themetal base 51 is degreased. The degreasing process may include ultrasonic cleaning themetal base 51 in absolute ethanol for about 25 minutes to about 35 minutes to remove oil stain coated on themetal base 51. - At
block 1503, agroove 5111 is formed on themetal base 51 by a thinning process. The thickness of themetal base 51 corresponding to thegroove 5111 can be about 0.3 mm to about 0.5 mm. The thinning process can be carried out by a CNC technology. - At
block 1504, themetal base 51 is put into a mold (not shown) to form anon-conductive member 53 on an internal surface of themetal base 51, thenon-conductive member 53 can be received in thegroove 5111. The injection temperature is about 290° C. to about 320° C., and the injection pressure is about 2 MPa to about 4 MPa. Liquid resin can be filled into the mold and cover at least a portion of theinternal surface 511 of themetal base 51, forming thenon-conductive member 51. - It is to be understood, the
non-conductive member 53 can also cover a periphery ofgroove 5111 to enhance the bonding strength between thenon-conductive member 53 and themetal base 51. - It is to be understood that the
non-conductive member 53 can be formed by a conventional injection process, and also can be formed by a nano mold technology (NMT) as illustrated inblock 1403. - At
block 1505, sections of a portion of themetal base 51 corresponding to thenon-conductive member 53 are cut off from theouter surface 513 to form at least onegap 515, and themetal base 51 can be spaced by at least onegap 515, forming at least onemetal sheet 517 and at least onemain body 519. Thenon-conductive member 53 is located at the bottom of thegap 515. Themetal base 51 can be cut off by a laser cutting process or a CNC process. - In at least one exemplary embodiment, the
metal base 51 is spaced by the at least onegap 515, forming a plurality ofmetal sheets 517 and twomain bodies 519. Thegaps 515 can run through the two opposite ends of themetal base 51. - At
block 1506, eachgap 515 is filled with adielectric member 55. Thedielectric member 55 can be made of a dielectric material, such as a resin, a rubber, a ceramic, and so on. The resin can be made of a thermoplastic or a thermosetting plastic. The thermoplastic can be selected from a group consisting of polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), polyethylene terephthalate (PET), polyether ether ketone (PEEK), polycarbonate (PC) and polyvinyl chloride polymer (PVC). The thermosetting plastic can be selected from a group consisting of an epoxy, and a polyurea resin, and a UV-curing adhesive. - The
dielectric member 55 can be formed by any of the following three methods: - In a first method, after filling a UV-curing adhesive into the
gaps 515, the UV-curing adhesive is cured by a UV irradiation process to form thedielectric members 55 located in thegaps 515. The UV-curing adhesive can be an acrylic resin or a polyurethane resin. - In a second method, the
metal base 51 is put into a mold (not shown). The injection temperature can be about 290° C. to about 320° C., and the injection pressure can be about 2 MPa to about 4 MPa. Liquid resin can be filled into thegaps 515, forming thedielectric members 55. - In a third method, the
dielectric members 55 are formed by NMT. - The NMT is carried out by surface treating the
metal base 51, themetal sheets 517 and themain bodies 519 to form a plurality of nano-pores (not shown) having a diameter of about 10 nm to about 300 nm on themetal base 51,metal sheets 517 and themain bodies 519. The surface treating method can be an electrochemical etching process, a dipping process, an anodic oxidation treatment or a chemical etching process. Then, themetal base 51, themetal sheets 517 and themain bodies 519 having nano-pores are put into a mold (not shown), and liquid resin is filled into thegaps 515 between each twoadjacent metal sheets 517, themain bodies 519 and themetal sheets 517 adjacent themain bodies 519, forming thedielectric member 55 - The
gaps 515 and thedielectric member 55 both have a width of about 0.02 mm to about 0.7 mm along a direction from anadjacent dielectric member 55 located at one side of themetal sheet 517 to anotheradjacent dielectric member 55 located at the opposite side of themetal sheet 517. Eachmetal sheet 517 has a width of about 0.15 mm to about 1.0 mm along a direction from anadjacent dielectric member 55 located at one side of themetal sheet 517 to anotheradjacent dielectric member 55 located at the opposite side of themetal sheet 517. - At
block 1507, a protective layer (not shown) having a thickness of about 10 μm to about 15 μm is formed on the surface of themetal base 51. The protective layer can be formed by any of the following three methods: - In a first method, the protective layer is formed by an anodic oxidation coloring process. The anodic oxidation coloring process is carried out in a sulphuric acid solution having a concentration of about 160 g/L to about 220 g/L, with the
metal base 51 being an anode, and a stainless steel board or a lead plate being a cathode. The voltage between the anode and the cathode is about 10 V to about 15 V. The temperature of the sulphuric acid is about 16° C. to about 18° C. The anodic oxidation coloring process may last for about 30 minutes to about 45 minutes to form the protective layer having a thickness of about 10 μm to about 15 μm. The protective layer has a plurality of pores (not shown). Then, themetal base 51 is dipped into a dyeing solution containing coloring agent at a temperature of about 30° C. to about 50° C. The coloring agent has a concentration of about 3 g/L to about 10 g/L. The dipping time may be about 1 minute to about 2 minutes. The coloring agent is absorbed into the pores of the protective layer, such that the protective layer can have color. The coloring agent is a dark organic coloring agent or a dark inorganic coloring agent. The protective layer containing coloring agent should be sealed to fix the coloring agent in the pores. The sealing treatment can be a boiling water sealing process, a steam sealing process, a nickel acetate sealing process, a potassium dichromate sealing process, a nickel sulfate sealing process, stearic acid sealing process, or a cold sealing process. - In a second method, the protective layer is formed by an electrophoresis process. The electrophoresis process is carried out in an electrophoresis solution at a temperature of about 30° C. to about 35° C., with the
metal base 51 being an anode, and a stainless steel board or a lead plate being a cathode. The voltage between the anode and the cathode is about 70 V to about 90 V. The electrophoresis process may last for about 20 seconds to about 44 seconds to form the protective layer having a thickness of about 10 μm to about 15 μm. The electrophoresis solution includes electrophoresis paint and water with a volume ratio of about 3-5:4-6. The electrophoresis paint can be an epoxy electrophoresis paint. The main chain of the epoxy electrophoresis paint can have polyether and dual alcohol, polyether and dual amine, or polyester and dual alcohol. - It is to be understood that the protective layer formed by the electrophoresis process or the anodic oxidation coloring process can cover an area of the
metal base 51. As the width of thedielectric member 55 is very small, it is hard to find out thedielectric member 55 located in themetal base 51, such that thehousing 50 can have an entire metallic appearance. - In a third method, the protective layer is formed by spraying paint onto the surface of the
metal base 51 by a spraying gun (not shown). Then, themetal base 51 is put in a dryer to be backed, such that the protective layer having a thickness of about 10 μm to about 15 μm is formed on the entail surface of themetal base 51. As the paint can cover the entire surface of themetal base 51 and thedielectric member 55, themetal base 51 can have an entire metallic appearance. -
FIGS. 12-13 illustrate ahousing 60 according to a fourth exemplary embodiment. The difference between the method of the fourth exemplary embodiment and the method of the second exemplary embodiment can be that a thickness of themetal base 61 is more than 0.5 mm. Preferably, the thickness of themetal base 31 is about 0.8 mm to about 1.0 mm, and sections of a portion of aninternal surface 611 can be thinned to form agroove 6111 by a thinning process. Anon-conductive member 63 can be received in the groove 3111. The thickness of themetal base 61 corresponding to thegroove 6111 is about 0.3 mm to about 0.5 mm. The thinning process can be carried out by a CNC technology. It is to be understood, thenon-conductive member 63 can also cover a periphery ofgroove 6111 to enhance the bonding strength between thenon-conductive member 63 and themetal base 61. - It is to be understood, however, that even through numerous characteristics and advantages of the present disclosure have been set forth in the foregoing description, together with details of assembly and function, the disclosure is illustrative only, and changes may be made in detail, including in the matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (16)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US15/481,480 US10353440B2 (en) | 2014-10-23 | 2017-04-07 | Housing and electronic device using the same |
US15/491,998 US20170220079A1 (en) | 2014-10-23 | 2017-04-20 | Method for making housing |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN201410570054.1 | 2014-10-23 | ||
CN201410570054.1A CN104540341A (en) | 2014-10-23 | 2014-10-23 | Shell, electronic device employing shell and manufacture method of shell |
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US15/481,480 Continuation US10353440B2 (en) | 2014-10-23 | 2017-04-07 | Housing and electronic device using the same |
US15/491,998 Division US20170220079A1 (en) | 2014-10-23 | 2017-04-20 | Method for making housing |
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US20160116948A1 true US20160116948A1 (en) | 2016-04-28 |
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US14/607,500 Abandoned US20160116948A1 (en) | 2014-10-23 | 2015-01-28 | Housing, electronic device using the same, and method for making the same |
US15/481,480 Expired - Fee Related US10353440B2 (en) | 2014-10-23 | 2017-04-07 | Housing and electronic device using the same |
US15/491,998 Abandoned US20170220079A1 (en) | 2014-10-23 | 2017-04-20 | Method for making housing |
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US15/481,480 Expired - Fee Related US10353440B2 (en) | 2014-10-23 | 2017-04-07 | Housing and electronic device using the same |
US15/491,998 Abandoned US20170220079A1 (en) | 2014-10-23 | 2017-04-20 | Method for making housing |
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JP (1) | JP6494292B2 (en) |
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Also Published As
Publication number | Publication date |
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US20170212553A1 (en) | 2017-07-27 |
JP2016083921A (en) | 2016-05-19 |
TW201618643A (en) | 2016-05-16 |
TWI662879B (en) | 2019-06-11 |
CN104540341A (en) | 2015-04-22 |
JP6494292B2 (en) | 2019-04-03 |
US10353440B2 (en) | 2019-07-16 |
US20170220079A1 (en) | 2017-08-03 |
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