US20150047806A1

US20150047806A1 - Chamber system and heat-insulating panel

Info

Publication number: US20150047806A1
Application number: US14/323,500
Authority: US
Inventors: Takaharu Miura; Hideki TSUKADA; Atsushi Endo; Ryosuke INOUE
Original assignee: Nikon Corp
Current assignee: Nikon Corp
Priority date: 2012-01-13
Filing date: 2014-07-03
Publication date: 2015-02-19
Also published as: WO2013105635A1; TW201346205A; JPWO2013105635A1

Abstract

A chamber system includes: a housing section that is surrounded by a bottom part, a side wall part, and a ceiling part and houses a processing apparatus; and a heat-insulating section that is provided in each of the bottom part, the side wall part, and the ceiling part, and regulates transfer of heat between the housing section and the outside of the housing section.

Description

This application is a Continuation application of International Application No. PCT/JP2013/050398 filed on Jan. 11, 2013, which claims priority on Japanese Patent Application No. 2012-005145 filed on Jan. 13, 2012, and Japanese Patent Application No. 2012-006180 filed on Jan. 16, 2012. The contents of the above applications are incorporated herein by reference.

BACKGROUND

1. Field of the Invention
The present invention relates to a chamber system and a heat-insulating panel.
2. Background
In processing apparatuses, such as measuring apparatuses, manufacturing apparatuses, and machining apparatuses, processing precision may vary depending on, for example, changes in a surrounding environment, such as temperature. For this reason, a processing apparatus may be housed and used in a chamber system where its surrounding environment is easily and uniformly adjusted or the like (for example, refer to PCT International Publication No. WO 2008/090975).

SUMMARY

However, in the above chamber system, when heat-insulating properties are insufficient, transfer of heat occurs to the inside and to the outside of a chamber system, and the precision of the processing apparatus may be influenced.
In addition, in the above chamber system, when sound-insulating properties are insufficient, transmission of vibration due to sound occurs to the inside and to the outside of the chamber system, and the precision of the processing apparatus may be influenced.
An object of an aspect of the invention is to provide a chamber system and a heat-insulating panel having excellent heat-insulating properties.
Another object is to provide a chamber system having excellent sound-insulating properties.
According to an aspect of the invention, a chamber system is provided, including a housing section that is surrounded by a bottom part, a side wall part, and a ceiling part and houses a processing apparatus; and a heat-insulating section that is provided in each of the bottom part, the side wall part, and the ceiling part, and regulates transfer of heat between the housing section and the outside of the housing section.
According to another aspect of the invention, a heat-insulating panel is provided, including a pair of substrates; a heat transfer-suppressing layer sandwiched between the pair of substrates; and a substrate-supporting portion that is provided in the heat transfer-suppressing layer and supports a portion between the pair of substrates.
According to still another aspect of the invention, a chamber system is provided, including a housing section that is surrounded by a bottom part, a side wall part, and a ceiling part and houses a processing apparatus; an atmosphere-adjusting section that adjusts the atmosphere inside the housing section; and an aerial vibration-attenuating section that is provided in each of the bottom part, the side wall part, the ceiling part, and the atmosphere-adjusting section and attenuates aerial vibration outside the housing section.
According to an aspect of the invention, a chamber system and a heat-insulating panel having excellent heat-insulating properties can be provided.
Additionally, according to an aspect of the invention, a chamber system having excellent sound-insulating properties can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a view illustrating an overall configuration of a chamber system related to a first embodiment of the invention.

FIG. 2 is a cross-sectional view illustrating the configuration of a heat-insulating panel of the chamber system related to the present embodiment.

FIG. 3 is a cross-sectional view illustrating the configuration of the heat-insulating panel of the chamber system related to the present embodiment.

FIG. 4 is a cross-sectional view illustrating the configuration of the heat-insulating panel of the chamber system related to the present embodiment.

FIG. 5 is a view illustrating another configuration of the heat-insulating panel of the chamber system related to the present embodiment.

FIG. 6 is a view illustrating still another configuration of the heat-insulating panel of the chamber system related to the present embodiment.

FIG. 7 is a view illustrating a still further configuration of the heat-insulating panel of the chamber system related to the present embodiment.

FIG. 8 is a view illustrating a still further configuration of the heat-insulating panel of the chamber system related to the present embodiment.

FIG. 9 is a view illustrating a still further configuration of the heat-insulating panel of the chamber system related to the present embodiment.

FIG. 10 is a view illustrating another configuration of the chamber system related to the present embodiment.

FIG. 11 is a view illustrating still another configuration of the chamber system related to the present embodiment.

FIG. 12 is a view illustrating the configuration of a chamber system related to a second embodiment of the invention.

FIG. 13 is a view illustrating the configuration of a portion of a sound-insulating panel related to the present embodiment.

FIG. 14 is a view illustrating the principle of Helmholtz resonance.

FIG. 15 is a view illustrating the configuration of a portion of a Helmholtz sound absorber related to the present embodiment.

FIG. 16 is a view illustrating the principle of Helmholtz resonance.

FIG. 17 is a view illustrating the configuration of a silencing hose related to the present embodiment.

FIG. 18 is a view illustrating the configuration of a chamber system related to a third embodiment of the invention.

FIG. 19 is a view illustrating the configuration of a chamber system related to a fourth embodiment of the invention.

FIG. 20 is a view illustrating the configuration of a chamber system related to a fifth embodiment of the invention.

FIG. 21 is a view illustrating the configuration of a chamber system related to a sixth embodiment of the invention.

FIG. 22 is a view illustrating the configuration of a chamber system related to a seventh embodiment of the invention.

FIG. 23 is a view illustrating another configuration of the sound-insulating panel related to the present embodiment.

FIG. 24 is a view illustrating still another configuration of the sound-insulating panel related to the present embodiment.

FIG. 25 is a view illustrating a still further configuration of the chamber system related to the present embodiment.

FIG. 26 is a view illustrating a still further configuration of the chamber system related to the present embodiment.

FIG. 27 is a view illustrating a still further configuration of the chamber system related to the present embodiment.

FIG. 28 is a graph illustrating results obtained by performing acoustic analysis of the chamber system related to the present embodiment.

FIG. 29 is a graph illustrating results obtained by performing acoustic analysis of the chamber system related to the present embodiment.

FIG. 30 is a view illustrating a still further configuration of the chamber system related to the present embodiment.

FIG. 31 is a view illustrating a still further configuration of the chamber system related to the present embodiment.

FIG. 32 is a view illustrating a still further configuration of the chamber system related to the present embodiment.

DESCRIPTION OF THE EMBODIMENTS

Hereinafter, embodiments of the invention will be described with reference to the drawings. In addition, in the following drawings, scales of respective members are appropriately changed in order to make respective members have recognizable sizes. Additionally, in the following description, an XYZ rectangular coordinate system is set, and the positional relationship of the respective members may be described referring to this XYZ rectangular coordinate system.
In the present embodiments, a predetermined direction within a horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction within the horizontal plane is defined as a Y-axis direction, and a direction (that is, a vertical direction) orthogonal to the X-axis direction and the Y-axis direction is defined as a Z-axis direction.

First Embodiment

Hereinafter, a first embodiment of the invention will be described.
FIG. 1 is a view illustrating the configuration of a chamber system 100 related to the present embodiment.
As illustrated in FIG. 1, the chamber system 100 has a housing section 40 surrounded by a bottom part 10, side wall parts 20, and a ceiling part 30, heat-insulating sections 50 provided at the bottom part 10, the side wall parts 20, and the ceiling part 30, and a temperature-adjusting section 60 that adjusts the temperature of the housing section 40. The chamber system 100 is used after being placed, for example, on a floor surface FL of a factory or the like.
The housing section 40 is a space that houses a processing apparatus PA. The housing section 40 is connected to an atmosphere-adjusting section (not illustrated) so that, for example, the atmosphere around the processing apparatus PA can be adjusted. The processing apparatus PA housed in the housing section 40 includes, for example, at least one of a measuring apparatus, a manufacturing apparatus, and a machining apparatus. The number of processing apparatuses PA to be housed in the housing section 40 may be one or may be two or more.
The processing apparatus PA has an apparatus body MB that performs processing (for example, measurement processing, manufacturing processing, machining processing, or the like) corresponding to the respective apparatuses, and a supporting base BS that supports the apparatus body MB. A heat generator HE that generates heat due to the above respective processings is included in, for example, the apparatus body MB of the processing apparatus PA.
The supporting base BS is placed on the bottom part 10 to support the apparatus body MB. Accordingly, the apparatus body MB is supported by a portion of the bottom part 10 via the supporting base BS. A plurality of the supporting bases BS are provided so as to support a plurality of places in the apparatus body MB. In addition, there may be one supporting base BS.
Each heat-insulating section 50 regulates transfer of heat between the housing section 40 and the outside of the housing section 40. The heat-insulating sections 50 have a plurality of heat-insulating panels 101 and a plurality of heat-insulating panels 102.
The heat-insulating panels 101 are used as constituent members that constitute the side wall parts 20 and the ceiling part 30. In this way, the heat-insulating panels 101 are used as the heat-insulating sections 50 and are used as portions of the side wall parts 20 and the ceiling part 30.
Each side wall part 20 is formed in a state where the side wall part stands vertically with respect to the floor surface FL. The side wall part 20 has wall portions 20 a surrounding four sides (+X-side, −X-side, +Y-side, and −Y-side) of the housing section 40. Each wall portion 20 a has a configuration in which a plurality of heat-insulating panels 101 are arranged without gaps therebetween. A connecting portion between the heat-insulating panels 101 is sealed with, for example, an adhesive (not illustrated), and is fixed by a fixture (not illustrated) or the like.
The side wall part 20 is provided so that two wall portions 20 a among the four wall portions 20 a formed by the plurality of such heat-insulating panels 101 face each other.
The ceiling part 30 is provided on the +Z-side of the side wall part 20, and is arranged parallel to the floor surface FL. The ceiling part 30 has a ceiling plate 30 a that seals the +Z-side of the housing section 40. The ceiling plate 30 a has a configuration in which a plurality of heat-insulating panels 101 are arranged without gaps therebetween in an X direction and in a Y direction.
The connecting portion between the heat-insulating panels 101 is sealed with, for example, an adhesive (not illustrated), and is fixed by a fixture (not illustrated) or the like.
The heat-insulating panels 102 are constituent members that constitute the bottom part 10. In this way, the heat-insulating panels 102 are used as the heat-insulating sections 50 and are used as portions of the bottom part 10. For this reason, the transfer of heat between the housing section and the outside (for example, the floor surface FL) thereof is also regulated in the bottom part 10 on which the processing apparatus PA that is a heavy load is placed.
The bottom part 10 is placed on the floor surface FL. The bottom part 10 has a bottom plate 10 a placed on the floor surface FL. The bottom plate 10 a has a configuration in which a plurality of heat-insulating panels 102 are arranged without gaps therebetween in the X direction and in the Y direction.
The connecting portion between the heat-insulating panels 102 is sealed with, for example, an adhesive (not illustrated), and is fixed by a fixture (not illustrated) or the like. The bottom plate 10 a is formed so as to protrude in one direction (for example, in the −X direction) from the housing section 40. A portion of the temperature-adjusting section 60 is placed on the portion of the bottom part 10 that protrudes from the housing section 40.
The temperature-adjusting section 60 allows a temperature-adjusting medium to flow between the temperature-adjusting section and the housing section 40, thereby adjusting the temperature inside the housing section 40. The temperature-adjusting section 60 has a gas supply system 61, an exhaust system 62, a temperature-adjusting system 63, a second supply system 64, and a heat-insulating section 65.
The gas supply system 61 supplies, for example, a temperature-adjusting gas, such as air or nitrogen, as a temperature-adjusting medium to the housing section 40. The gas supply system 61 has a gas flow pipe 61 a and a duct 61 b.
The gas flow pipe 61 a has one end connected to the temperature-adjusting system 63 and the other end connected to the duct 61 b. The gas flow pipe 61 a allows the temperature-adjusting gas supplied from the temperature-adjusting system 63 to flow into the duct 61 b. The duct 61 b is provided in a portion of the side wall part 20, and is connected to the housing section 40. The duct 61 b jets the temperature-adjusting gas from the gas flow pipe 61 a into the housing section 40.
The exhaust system 62 exhausts the gas in the housing section 40 to the outside of the housing section 40. The exhaust system 62 has a gas flow pipe 62 a and a duct 62 b. The gas flow pipe 62 a has one end connected to the temperature-adjusting system 63 and the other end connected to the duct 62 b. The gas flow pipe 62 a allows the gas from the duct 62 b to flow to the temperature-adjusting system 63.
The duct 62 b is provided in a portion of the side wall part 20, and is connected to the housing section 40. The −Z-side of the duct 62 b is placed on, for example, the bottom part 10. The duct 62 b jets off the gas of the housing section 40 to the gas flow pipe 62 a.
The temperature-adjusting system 63 adjusts the temperature of the gas exhausted by the exhaust system 62, and returns the gas to the gas supply system 61 as the temperature-adjusting gas. The temperature-adjusting system 63 has a cooling unit 63 a that cools the exhausted gas, and a heating unit 63 b that heats the gas cooled by the cooling unit 63 a. The cooling unit 63 a is connected to the gas flow pipe 62 a of the exhaust system 62. The cooling unit 63 a has a cooling mechanism (not illustrated) that cools gas, using, for example, a refrigerant.
The heating unit 63 b is connected to the cooling unit 63 a. As the heating unit 63 b, for example, a heating mechanism (not illustrated), such as a heater, is used. A temperature-adjusting gas adjusted to a predetermined temperature is generated by heating the gas cooled by the cooling unit 63 a, using the heating unit 63 b. Although most of the generated temperature-adjusting gas is returned to the gas supply system 61, a portion thereof is supplied to the second supply system 64.
The second supply system 64 locally supplies the temperature-adjusting gas to the processing apparatus PA. The second supply system 64 is provided with a control unit (not illustrated) that controls the supply amount, temperature, direction, or the like of the temperature-adjusting gas. The second supply system 64 has a second supply pipe 64 a having one end portion connected to the heating unit 63 b and the other end portion connected to the inside of the apparatus body MB.
The second supply pipe 64 a is provided through the side wall part 20. The above other end portion of the second supply pipe 64 a is directed to the heat generator HE.
In this configuration, the second supply system 64 is able to locally supply the temperature-adjusting gas to the heat generator HE included in the apparatus body MB. In addition, it is possible to adjust the position of the other end portion of the second supply pipe 64 a, thereby locally supplying the temperature-adjusting gas to a portion different from the heat generator HE.
For example, a configuration may be adopted in which the other end portion of the second supply pipe 64 a is arranged at a portion between a plurality of the supporting bases BS, outside the apparatus body MB, or the like to thereby supply the temperature-adjusting gas to these portions.
Since the portion between the supporting bases BS or the portion of the apparatus body MB on the +X-side is located on the downstream side of a flow of the temperature-adjusting gas supplied from the gas supply system 61, drift may occur or particles or the like of the housing section 40 may be deposited. The occurrence of drift or the deposition of particles is reduced by locally supplying the temperature-adjusting gas to such a portion.
Additionally, a configuration may be adopted in which a plurality of the second supply pipes 64 a are provided. In this case, the temperature-adjusting gas can be locally supplied to a plurality of places.
The temperature-adjusting gas supplied to the heat generator HE adjusts the temperature of a space around the heat generator HE. In addition, the temperature-adjusting gas used for the temperature adjustment is released to the outside (that is, the housing section 40) of the processing apparatus PA from an exhaust part (not illustrated), and is exhausted to the outside of the housing section 40 by the exhaust system 62.
By providing the second supply system 64 that locally supplies the temperature-adjusting gas to the heat generator HE of the processing apparatus PA, unevenness, drift, or the like of a flow of the temperature-adjusting gas that is supplied by, for example, the gas supply system 61 is reduced, and deposition of particles in the vicinity of the processing apparatus PA (for example, between the supporting bases BS or the like) is reduced.
The heat-insulating section 65 suppresses the transfer of heat between the inside and outside of the temperature-adjusting section 60. The heat-insulating section 65 has a plurality of heat insulation members 103. As the heat insulation members 103, for example, a configuration in which an insulating material, such as foamed urethane, is formed in a layered fashion, heat-insulating panels having the same configuration as the above heat-insulating panels 101 and the heat-insulating panels 102, or the like can be used.
The heat insulation members 103 are provided in the gas supply system 61, the exhaust system 62, the temperature-adjusting system 63, and the second supply system 64.
Specifically, the heat insulation members 103 are arranged so as to cover an outer peripheral surface of the gas flow pipe 61 a and an outer peripheral surface of the duct 61 b in the gas supply system 61, an outer peripheral surface of the gas flow pipe 62 a and an outer peripheral surface of the duct 62 b in the exhaust system 62, an outer surface of the temperature-adjusting system 63, and an outer peripheral surface of the second supply pipe 64 a of the second supply system 64 without gaps therebetween.
In this way, since the temperature-adjusting section 60 and the outside are partitioned off from each other by the heat-insulating section 65 without gaps therebetween, the transfer of heat between the temperature-adjusting section 60 and the outside (including the inside of the housing section 40) is regulated.
FIG. 2 is a cross-sectional view illustrating the configuration of a heat-insulating panel 101.
As illustrated in FIG. 2, the heat-insulating panel 101 has a pair of substrates (a first substrate 51 and a second substrate 52), a heat transfer-suppressing layer 53 sandwiched by the first substrate 51 and the second substrate 52.
As the first substrate 51 and the second substrate 52, for example, a substrate formed of a resin material, such as plastics, a substrate formed of a metallic material, such as stainless steel, or the like can be used. A configuration may be adopted in which heat is reflected by providing copper foil, aluminum foil, or the like on the front surfaces or inner surfaces of the first substrate 51 and the second substrate 52.
The heat transfer-suppressing layer 53 includes a heat-insulating material layer or a vacuum layer that suppresses the transfer of heat. As the heat-insulating material layer, for example, a configuration obtained using foamed urethane or the like may be adopted. As the vacuum layer, for example, a configuration may be adopted in which a space between the first substrate 51 and the second substrate 52 is sealed so as to have a pressure of about 10⁻³Pa.
Additionally, as a heat transfer-suppressing layer 53, a configuration may be adopted in which a heat-insulating material layer formed of a fiber-based core material, such as a glass fiber, and a vacuum layer sealed so that the pressure thereof becomes about 1 Pa to 10 Pa are included.
FIG. 3 is a cross-sectional view illustrating the configuration of a heat-insulating panel 102. FIG. 4 is a view illustrating a configuration along an A-A cross-section in FIG. 3.
As illustrated in FIG. 3, the heat-insulating panel 102 has the pair of substrates (the first substrate 51 and the second substrate 52), the heat transfer-suppressing layer 53 sandwiched by the first substrate 51 and the second substrate 52, and a reinforcing member 54 that reinforces the first substrate 51 and the second substrate 52. The configuration of the first substrate 51 and the second substrate 52 is the same as that of the heat-insulating panel 101.
The reinforcing member 54 has a first reinforcing substrate 55 that reinforces the first substrate 51, a second reinforcing substrate 56 that reinforces the second substrate 52, and a substrate-supporting portion 57 that supports the first reinforcing substrate 55 and the second reinforcing substrate 56. The first reinforcing substrate 55, the second reinforcing substrate 56, and the substrate-supporting portion 57 are formed of for example, a metallic material.
The substrate-supporting portion 57 is provided through the first substrate 51, the heat transfer-suppressing layer 53, and the second substrate 52. Accordingly, a portion of the substrate-supporting portion 57 is arranged in the heat transfer-suppressing layer 53.
Additionally, a plurality of substrate-supporting portions 57 are provided. The plurality of substrate-supporting portions 57 are arranged in a matrix in a plan view, for example, as illustrated in FIG. 4. In FIG. 4, the substrate-supporting portions 57 are arranged so as to become three rows×three columns, but are not limited to this arrangement.
Additionally, as illustrated in FIG. 1, for example, the processing apparatus PA is placed on the heat-insulating panels 102 provided on the bottom part 10 via the supporting bases BS. Additionally, an object different from the processing apparatus PA or the supporting bases may be placed on the heat-insulating panels 102, or a worker may ride on the heat-insulating panels.
For this reason, there is a great necessity for a configuration in which the first substrate 51, the second substrate 52, and the heat transfer-suppressing layer 53 that constitute each heat-insulating panel 102 are not easily deformed against the load of the heat-insulating panel 102 in a thickness direction (a direction directed from the first substrate 51 to the second substrate 52).
In contrast, in the present embodiment, the heat-insulating panel 102 provided on the bottom part 10 has the first reinforcing substrate 55, the second reinforcing substrate 56, and the substrate-supporting portions 57. Therefore, the first substrate 51, the second substrate 52, and the heat transfer-suppressing layer 53 are configured so as not to be easily deformed against the load of the heat-insulating panel 102 in the thickness direction.
In the above configuration, the heat-insulating sections 50 (the heat-insulating panels 101 or the heat-insulating panels 102) are arranged on the entire surface of an outer wall portion including the bottom part 10, the side wall parts 20, and the ceiling part 30, which surrounds the housing section 40. Therefore, the housing section 40 is isolated from the outside in the state of being surrounded by the heat-insulating sections 50. For this reason, the state between the inside and outside of the housing section 40, also including the bottom part 10, is brought into a state where the transfer of heat is regulated.
Additionally, since the chamber system 100 is in the state of being sealed by the heat-insulating sections 50 and the heat-insulating section 65, the inside and outside of the chamber system 100 are isolated from each other via the heat-insulating sections 50 and the heat-insulating section 65. For this reason, the state between the inside and outside of the chamber system 100 is brought into a state where the transfer of heat is regulated.
As described above, the chamber system 100 related to the present embodiment includes the housing section 40 that is surrounded by the bottom part 10, the side wall parts 20, and the ceiling part 30 and houses the processing apparatus PA, and the heat-insulating sections 50 that are provided at the bottom part 10, the side wall parts 20, and the ceiling part 30, and regulate the transfer of heat between the housing section 40 and the outside of the housing section 40. Thus, the transfer of heat between the inside and outside of the housing section 40 can be regulated not only in the side wall parts 20 and the ceiling part 30 but also in the bottom part 10.
This can maintain a temperature environment around the processing apparatus PA. In this way, a chamber system 100 having excellent heat-insulating properties can be provided.
Additionally, the heat-insulating panel 102 related to the present embodiment includes the pair of substrates (the first reinforcing substrate 55 and the second reinforcing substrate 56), the heat transfer-suppressing layer 53 sandwiched by the first reinforcing substrate 55 and the second reinforcing substrate 56, and the substrate-supporting portions 57 that are provided in the heat transfer-suppressing layer 53 and support a portion between the pair of substrates. Thus, even if a load such that a heavy load is placed is added, a heat-insulating panel 102 that is not easily deformed in the thickness direction can be provided.
The technical range of the invention is not limited to the above embodiment, and changes can be appropriately added without departing from the scope of the invention.
For example, in the above embodiment, in each of the individual heat-insulating panels 102 that constitute the bottom part 10, a configuration in which the substrate-supporting portions 57 are formed so as to be uniformly arranged has been described as an example. However, the configuration of the heat-insulating panel is not limited to this configuration.
For example, as illustrated in FIG. 5, a configuration may be adopted in which the density of the substrate-supporting portions 57 provided in the heat-insulating panel 102 on which the supporting bases BS are placed among the plurality of heat-insulating panels 102 is made greater than the density of the substrate-supporting portions 57 provided in the other heat-insulating panels 102.
Additionally, for example, when a supporting base BS is arranged over a plurality of heat-insulating panels 102, not only a configuration in which the density of the substrate-supporting portions 57 is adjusted for each heat-insulating panel 102, but also, for example, a configuration in which the density of the substrate-supporting portions 57 becomes higher in the portions of the plurality of heat-insulating panels 102 that overlap the supporting base BS may be adopted.
In this configuration, the density of the substrate-supporting portions 57 may vary depending on portions if attention is paid to the individual heat-insulating panels 102. In this case, for example, the region of the bottom part 10 on which the supporting base BS is placed may be set in advance, and the heat-insulating panels 102 of which the density of the substrate-supporting portions 57 is adjusted so as to correspond to the region on which the supporting base BS is placed may be used.
Additionally, in the above embodiment, a configuration in which the inside of each substrate-supporting portion 57 is solid has been described as an example. However, the configuration of the substrate-supporting portion is not limited to this configuration. For example, as illustrated in FIG. 6, a configuration may be adopted in which a hollow portion 58 a is provided inside each substrate-supporting portion 57. By providing the hollow portion 58 a inside the substrate-supporting portion 57, the transfer of heat in a path from the first reinforcing substrate 55 through the substrate-supporting portion 57 to the second reinforcing substrate 56 can be suppressed.
In addition, this configuration is more effective when the first reinforcing substrate 55, the substrate-supporting portion 57, and the second reinforcing substrate 56 are formed of a material, such as metal, having a high thermal conductivity. Additionally, in this case, as illustrated in FIG. 6, a configuration may be adopted in which a refrigerant 58 p is held by the hollow portion 58 a. This can further suppress the transfer of heat in the above path.
Additionally, in the configuration of the above embodiment, the configuration of the connecting portion between the heat-insulating panels 102 can be deformed. For example, as illustrated in FIGS. 7 and 8, a configuration can be adopted in which the connecting portion between the heat-insulating panels 102 is provided with a connection frame 59. In addition, FIG. 7 is a plan view illustrating a state where two heat-insulating panels 102 are connected to each other using the connection frame 59, and FIG. 8 is a view illustrating a configuration along a B-B cross-section in FIG. 7.
As illustrated in FIGS. 7 and 8, the connection frame 59 is formed using, for example, a high-rigidity material, such as a metallic material. The connection frame 59 has an outer frame portion 59 a and a coupling portion 59 b. The outer frame portion 59 a holds sides other than sides, adjacent to each other, of the two heat-insulating panels 102. The coupling portion 59 b holds the sides, adjacent to each other, of the two heat-insulating panels 102.
Additionally, as illustrated in FIG. 8, the outer frame portion 59 a and the coupling portion 59 b are formed with the same thickness as the heat-insulating panels 102.
In addition, when a plurality of, specifically, three or more heat-insulating panels 102 are connected, similarly, a configuration can be adopted in which the outer frame portion 59 a holds sides, other than sides adjacent to each other, of the plurality of heat-insulating panels 102, and the coupling portion 59 b holds the sides, adjacent to each other, of the plurality of heat-insulating panels 102.
According to this configuration, since the plurality of heat-insulating panels 102 can be firmly connected to each other, even if a heavy load is placed on the heat-insulating panels 102, the strength of the heat-insulating panels 102 can be secured.
Additionally, when the plurality of heat-insulating panels 102 are connected to each other using the connection frame 59, for example, as illustrated in FIG. 9, a configuration may be adopted in which a connecting portion 59 c is provided between the coupling portion 59 b of the connection frame 59 and the substrate-supporting portions 57 of each heat-insulating panel 102 and the coupling portion 59 b and the substrate-supporting portions 57 are integrally connected to each other by the connecting portion 59 c.
In this case, a configuration may be adopted in which a hollow portion 58 a is provided inside each substrate-supporting portion 57 and a hollow portion 58 c is provided inside the coupling portion 59 b. The heat-insulating properties of the bottom part 10 having the connection frame 59 and the heat-insulating panels 102 are enhanced by this configuration.
Additionally, as illustrated in FIG. 9, a configuration may be adopted in which the hollow portions 58 b are provided inside the connecting portion 59 c to allow the hollow portions 58 a to communicate with each other and allow the hollow portions 58 a and the hollow portion 58 c to communicate with each other. Additionally, a configuration may be adopted in which the refrigerant 58 p is enclosed in the hollow portions 58 a, the hollow portions 58 b, and the hollow portion 58 c that communicate with each other and the refrigerant 58 p is enabled to flow through the hollow portions 58 a, the hollow portions 58 b, and the hollow portion 58 c.
The heat-insulating properties of the bottom part 10 having the connection frame 59 and the heat-insulating panels 102 are further enhanced by this configuration.
In addition, in this case, a configuration can be adopted in which the refrigerant 58 p can be controlled so as to flow to a desired place among the hollow portions 58 a, the hollow portions 58 b, and the hollow portion 58 c.
For example, there is a configuration or the like in which supply units and recovery units for the refrigerant 58 p are provided in a plurality of places of the hollow portions 58 a, the hollow portions 58 b, and the hollow portion 58 c, and whether to use any among the supply units and recovery units that are provided in the plurality of places according to regions that allow the refrigerant 58 p to flow thereto is made selectable.
Accordingly, the refrigerant 58 p can be individually supplied to a plurality of regions without being limited to one region among the hollow portions 58 a, the hollow portions 58 b, and the hollow portion 58 c.
Additionally, in the above embodiment, a configuration is provided in which the heat generated in the heat generator HE included in the apparatus body MB of the processing apparatus PA is released from the exhaust system 62 to the outside via the temperature-adjusting gas supplied using the second supply system 64. However, the invention is not limited to this. For example, a configuration may be adopted in which the heat generated in the heat generator HE is used in the heating unit 63 b.
Specifically, as illustrated in FIG. 10, a configuration can be adopted in which a heat transfer system 63 c is provided between the heat generator HE and the heating unit 63 b. The heat transfer system 63 c transfers the heat generated in the heat generator HE to the heating unit 63 b. As the heat transfer system 63 c, for example, a configuration can be adopted in which a heat pipe and a heat exchanger are combined.
Accordingly, energy saving can be achieved in a temperature adjustment operation of the housing section 40 of the chamber system 100.
In the above embodiment, a configuration in which the temperature-adjusting section 60 is installed at a side wall part 20 has been described as an example. However, the invention is not limited to this. A configuration may be adopted in which the temperature-adjusting section is installed at other portions, such as the bottom part 10 and the ceiling part 30.
Additionally, in the above embodiment, a configuration in which the heat-insulating panels 101 are used as the heat-insulating sections 50 of the side wall parts 20 and the ceiling part 30 and the heat-insulating panels 102 are used as the heat-insulating section 50 of the bottom part 10 has been described as an example. However, the invention is not limited to this. A configuration may be adopted in which the same heat-insulating panels are used for all of the bottom part 10, the side wall parts 20, and the ceiling part 30.
In this case, for example, the heat-insulating panels 102 may be used as the heat-insulating sections 50 of each side wall part 20 and the ceiling part 30, or the heat-insulating panels 101 may be used as the heat-insulating sections 50 of the bottom part 10.
Additionally, in the above embodiment, a configuration in which one heat-insulating panel 101 or one heat-insulating panel 102 is provided in the thickness direction in the bottom part 10, the side wall part 20, and the ceiling part 30 has been described as an example. However, the invention is not limited to this. A configuration may be adopted in which a plurality of heat-insulating panels 101 or heat-insulating panels 102 are stacked.
This can enhance the heat-insulating properties of the bottom part 10, the side wall parts 20, and the ceiling part 30 and the strength thereof against an external force.
Additionally, in the above embodiment, for example, as illustrated in FIG. 1, a configuration in which the gas supply system 61 and the second supply system 64 supply gas from the same side (left side in FIG. 1) with respect to the processing apparatus PA has been described as an example. The invention is not limited to this. A configuration may be adopted in which the second supply system 64 supplies gas from a side different from the gas supply system 61.
For example, in the configuration illustrated in FIG. 11, the second supply pipe 64 a is arranged so as to go around the processing apparatus PA, and the end portion 64 b of the second supply pipe 64 a is arranged, for example, on the right side of the processing apparatus PA.
This configuration enables gas to be sufficiently supplied also to a portion that the gas supplied from the gas supply system 61 does not reach easily. In this case, variations in temperature distribution around the processing apparatus PA can be reduced by adjusting the position and orientation of the end portion 64 b.
Additionally, since the temperatures of the respective sections of the chamber system 100 can be locally adjusted using the second supply system 64 by adjusting the position and orientation of the end portion 64 b of the second supply pipe 64 a, the influence of temperature distribution outside the chamber system 100 is reduced.
Additionally, in the above embodiment, a configuration in which the gas supply system 61 and the second supply system 64 are provided in order to reduce the variations in temperature distribution around the processing apparatus PA has been described as an example. However, the invention is not limited to this. For example, as illustrated in FIG. 11, a configuration may be adopted in which a second exhaust system 164 is provided around the processing apparatus PA.
The second exhaust system 164 exhausts the gas around the processing apparatus PA to the outside of the chamber system 100. The second exhaust system 164 has an exhaust port 164 a. The gas in the vicinity of the processing apparatus PA can be exhausted by arranging the exhaust port 164 a in the vicinity of the processing apparatus PA.
By virtue of such a configuration, an air current can be adjusted by exhausting the periphery of the processing apparatus PA.

Second Embodiment

Next, a second embodiment of the invention will be described.
FIG. 12 is a view illustrating the configuration of a chamber system 2100 related to the present embodiment.
As illustrated in FIG. 12, the chamber system 2100 has a housing section 2040 surrounded by a bottom part 2010, side wall parts 2020, and a ceiling part 2030, an atmosphere-adjusting section 2050 that adjusts the temperature of the housing section 2040, and aerial vibration-attenuating sections 2060 provided in the bottom part 2010, the side wall parts 2020, and the ceiling part 2030.
The chamber system 2100 is used after being placed, for example, on the floor surface FL of a factory or the like.
The bottom part 2010 is placed on the floor surface FL. The bottom part 2010 has a bottom plate 2010 a placed on the floor surface FL. The bottom plate 2010 a has a configuration in which a plurality of sound-insulating panels 2101 are arranged without gaps therebetween in the X direction and in the Y direction. A connecting portion between the sound-insulating panels 2101 is sealed with, for example, an adhesive (not illustrated), and is fixed by a fixture (not illustrated) or the like.
Each side wall part 2020 is formed in a state where the side wall part stands vertically with respect to the floor surface FL. The side wall part 2020 has wall portions 2020 a surrounding four sides (+X-side, −X-side, +Y-side, and −Y-side) of the housing section 2040. The respective wall portions 2020 a have a configuration in which the plurality of sound-insulating panels 2101 are arranged without gaps therebetween.
A connecting portion between the sound-insulating panels 2101 is sealed with, for example, an adhesive (not illustrated), and is fixed by a fixture (not illustrated) or the like. The side wall part 2020 is provided so that two wall portions 2020 a among the four wall portions 2020 a formed by the plurality of such sound-insulating panels 2101 face each other.
The ceiling part 2030 is provided on the +Z-side of the side wall part 2020, and is arranged parallel to the floor surface FL. The ceiling part 2030 has a ceiling plate 2030 a that seals the +Z-side of the housing section 2040. The ceiling plate 2030 a has a configuration in which a plurality of sound-insulating panels 2101 are arranged without gaps therebetween in the X direction and in the Y direction.
A connecting portion between the sound-insulating panels 2101 is sealed with, for example, an adhesive (not illustrated), and is fixed by a fixture (not illustrated) or the like.
The housing section 2040 is a space that houses the processing apparatus PA. The housing section 2040 is connected to an atmosphere-adjusting section 2050 so that, for example, the atmosphere around a processing apparatus PA can be adjusted.
The processing apparatus PA housed in the housing section 2040 includes, for example, at least one of a measuring apparatus, a manufacturing apparatus, and a machining apparatus. The number of processing apparatuses PA to be housed in the housing section 2040 may be one or may be two or more.
The processing apparatus PA has the apparatus body MB that performs processing (for example, measurement processing, manufacturing processing, machining processing, or the like) corresponding to the respective apparatuses, and the supporting base BS that supports the apparatus body MB.
The supporting base BS is placed on the bottom part 2010 to support the apparatus body MB. Accordingly, the apparatus body MB is supported by a portion of the bottom part 2010 via the supporting base BS. A plurality of the supporting bases BS are provided so as to support a plurality of places in the apparatus body MB. In addition, the supporting base BS may be single.
The atmosphere-adjusting section 2050 allows gas to flow between the atmosphere-adjusting section and the housing section 2040, thereby adjusting the atmosphere (for example, the temperature) inside the housing section 2040. The atmosphere-adjusting section 2050 has a first supply system 2051, a second supply system 2052, and an exhaust system 2053.
The first supply system 2051 supplies, for example, gas, such as air or nitrogen, to the housing section 2040. The first supply system 2051 has a gas delivery unit 2071, a gas flow pipe 2072, and a duct 2073. The gas delivery unit 2071 has a fan 2071 a, a fan-housing portion 2071 b, a connecting portion 2071 c, and a sound-absorbing layer 2071 d.
The fan 2071 a is provided so as to be rotatable by the driving of, for example, a motor device (not illustrated) and is rotated to thereby deliver the gas to the gas flow pipe 2072. The fan-housing portion 2071 b is formed in a rectangular box shape, and houses the fan 2071 a. The connecting portion 2071 c is provided in the fan-housing portion 2071 b, and is a portion connected to the gas flow pipe 2072.
The sound-absorbing layer 2071 d is formed over the substantially entire surface of an inner surface of the fan-housing portion 2071 b. The sound-absorbing layer 2071 d is formed using, for example, an absorption type sound absorbing material, such as glass wool. The sound-absorbing layer 2071 d absorbs sound waves inside the fan-housing portion 2071 b.
As the sound-absorbing layer 2071 d is formed, for example, motor sound, blowing sound, or the like during the rotation of the fan 2071 a is absorbed by the sound-absorbing layer 2071 d. Therefore, noise does not easily leak to the outside of the fan-housing portion 2071 b, and noise is not easily transmitted to the housing section 2040 through the gas flow pipe 2072.
The gas flow pipe 2072 allows the gas delivered from the gas delivery unit 2071 to flow to the duct 2073. The gas flow pipe 2072 has a piping portion 2072 a formed in the shape of a tube. A first end portion 2072 b of the piping portion 2072 a on the gas delivery unit 2071 side is connected to the connecting portion 2071 c of the gas delivery unit 2071.
Accordingly, the inside of the piping portion 2072 a communicates with the inside of the fan-housing portion 2071 b via the connecting portion 2071 c. Additionally, a second end portion 2072 c of the piping portion 2072 a on the duct 2073 side is connected to the duct 2073.
A sound-absorbing layer 2072 d is formed on an inner surface of the piping portion 2072 a over its substantially entire surface. The sound-absorbing layer 2072 d is formed using, for example, a sound absorbing material, such as glass wool. The sound-absorbing layer 2072 d absorbs sound waves inside the piping portion 2072 a.
As the sound-absorbing layer 2072 d is provided, for example, the flow sound or the like of the gas that flows through the piping portion 2072 a is absorbed by the sound-absorbing layer 2072 d. Therefore, noise does not easily leak to the outside of the piping portion 2072 a.
Additionally, the piping portion 2072 a is provided with a resonant sound absorber or an interference type sound absorber that absorbs sound waves inside the piping portion. Here, a Helmholtz sound absorber 2102 that is the resonant sound absorber will be described as an example.
The duct 2073 is detachably provided in a portion of the side wall part 2020. The duct 2073 delivers the gas from the gas flow pipe 2072 to the housing section 2040. The duct 2073 has a cover member 2073 a that covers one surface of the side wall part 2020. The cover member 2073 a is formed in the shape of a tray so as to have dimensions corresponding to the one surface of the side wall part 2020.
The cover member 2073 a is formed with a connecting portion 2073 b connected to the gas flow pipe 2072. The inside of the cover member 2073 a and the piping portion 2072 a communicate with each other via the connecting portion 2073 b.
The portion of the side wall part 2020 covered with the cover member 2073 a is formed with a filter 2073 c. The filter 2073 c removes foreign matter included in the gas. The inside of the cover member 2073 a communicates with the housing section 2040 via the filter 2073 c.
A sound-absorbing layer 2073 d is formed on the inner surface of the cover member 2073 a over its substantially entire surface. The sound-absorbing layer 2073 d is formed using, for example, a sound absorbing material, such as glass wool.
The sound-absorbing layer 2073 d absorbs sound waves inside the cover member 2073 a. As the sound-absorbing layer 2073 d is provided, for example, the flow sound of gas that flows in the cover member 2073 a or the like is absorbed by the sound-absorbing layer 2073 d. Therefore, noise does not easily leak to the outside of the cover member 2073 a.
The second supply system 2052 locally supplies the gas to the processing apparatus PA. The second supply system 2052 has a gas delivery unit 2081, a gas flow pipe 2082, and a silencing hose 2083. The gas delivery unit 2081 has a fan 2081 a, a fan-housing portion 2081 b, a connecting portion 2081 c, and a sound-absorbing layer 2081 d.
The fan 2081 a is provided so as to be rotatable by the driving of, for example, a motor device (not illustrated) and is rotated to thereby deliver the gas to the gas flow pipe 2082. The fan-housing portion 2081 b is formed in a rectangular box shape, and houses the fan 2081 a. The connecting portion 2081 c is provided in the fan-housing portion 2081 b, and is a portion connected to the gas flow pipe 2082.
The sound-absorbing layer 2081 d is formed over the substantially entire surface of an inner surface of the fan-housing portion 2081 b. The sound-absorbing layer 2081 d is formed using, for example, a sound absorbing material, such as glass wool. The sound-absorbing layer 2081 d absorbs sound waves inside the fan-housing portion 2081 b.
As the sound-absorbing layer 2081 d is formed, for example, motor sound, blowing sound, or the like during the rotation of the fan 2081 a is absorbed by the sound-absorbing layer 2081 d. Therefore, noise does not easily leak to the outside of the fan-housing portion 2081 b.
The gas flow pipe 2082 allows the gas delivered from the gas delivery unit 2081 to flow to the silencing hose 2083. The gas flow pipe 2082 has a piping portion 2082 a formed in the shape of a tube. A first end portion 2082 b of the piping portion 2082 a on the gas delivery unit 2081 side is connected to the connecting portion 2081 c of the gas delivery unit 2081.
Accordingly, the inside of the piping portion 2082 a communicates with the inside of the fan-housing portion 2081 b via the connecting portion 2081 c. Additionally, a second end portion 2082 c of the piping portion 2082 a on the silencing hose 2083 side is connected to the silencing hose 2083.
A sound-absorbing layer 2082 d is formed on an inner surface of the piping portion 2082 a over its substantially entire surface. The sound-absorbing layer 2082 d is formed using, for example, a sound absorbing material, such as glass wool. The sound-absorbing layer 2082 d absorbs sound waves inside the piping portion 2082 a.
As the sound-absorbing layer 2082 d is provided, for example, the flow sound or the like of the gas that flows through the piping portion 2082 a is absorbed by the sound-absorbing layer 2082 d. Therefore, noise does not easily leak to the outside of the piping portion 2082 a.
The silencing hose 2083 locally jets the gas from the gas flow pipe 2082 to the processing apparatus PA. The silencing hose 2083 has an adapter 2083 a provided in the side wall part 2020, a hose body 2083 b arranged inside the housing section 2040, and a nozzle 2083 c provided at the tip of the hose body 2083 b.
The adapter 2083 a has the piping portion 2082 a of the gas flow pipe 2082 detachably connected thereto from an outer surface side of the side wall part 2020 and has the hose body 2083 b detachably connected thereto from an inner surface side (housing section 2040 side) of the side wall part 2020.
The adapter 2083 a communicates with the inside of the hose body 2083 b and the inside of the piping portion 2082 a in a state where the hose body 2083 b and the piping portion 2082 a are connected to each other. In addition, a sound-absorbing layer (not illustrated) is formed on an inner surface of the adapter 2083 a over its substantially entire surface.
The hose body 2083 b is formed so as to extend from the adapter 2083 a toward the processing apparatus PA. The hose body 2083 b guides the gas from the adapter 2083 a to the processing apparatus PA. The nozzle 2083 c is directed to a heat generator HT of the processing apparatus PA, and is able to locally supply the gas to the heat generator HT included in the apparatus body MB.
In addition, it is possible to adjust the position or orientation of the nozzle 2083 c, thereby locally supplying the gas to a portion different from the heat generator HT. For example, a configuration may be adopted in which the nozzle 2083 c is arranged at a portion between a plurality of the supporting bases BS, outside the apparatus body MB, or the like to thereby supply the gas to these portions.
Since the portion between the supporting bases BS or the portion of the apparatus body MB on the +X-side is located on the downstream side of a flow of the gas supplied from the first supply system 2051, drift may occur or particles or the like of the housing section 2040 may be deposited. The occurrence of drift or the deposition of particles is reduced by locally supplying the gas to such a portion.
Additionally, a configuration may be adopted in which a plurality of the hose bodies 2083 b and the nozzles 2083 c are provided. In this case, the gas can be locally supplied to a plurality of places.
The gas supplied to the heat generator HT adjusts the temperature of a space around the heat generator HT. In addition, the gas used for the temperature adjustment is released to the outside (that is, the housing section 2040) of the processing apparatus PA from an exhaust part (not illustrated) provided in the processing apparatus PA, and is exhausted to the outside of the housing section 2040 by the exhaust system 2053.
In this way, by providing the second supply system 2052 that locally supplies the gas to the heat generator HT of the processing apparatus PA, unevenness, drift, or the like of a flow of the gas that is supplied by, for example, the first supply system 2051 is reduced, and deposition of particles in the vicinity of the processing apparatus PA (for example, between the supporting bases BS or the like) is reduced.
The aerial vibration-attenuating sections 2060 attenuate the aerial vibration from the outside of the housing section 2040. The aerial vibration-attenuating section 2060 is provided in each of the bottom part 2010, the side wall parts 2020, the ceiling part 2030, and the atmosphere-adjusting section 2050.
In the present embodiment, the sound-insulating panels 2101 that constitute the bottom part 2010, the side wall parts 2020, and the ceiling part 2030 are provided as one form of the aerial vibration-attenuating sections 2060.
Additionally, in the present embodiment, the Helmholtz sound absorber 2102, the sound-absorbing layer 2071 d, the sound-absorbing layer 2072 d, the sound-absorbing layer 2073 d, the sound-absorbing layer 2081 d, and the sound-absorbing layer 2082 d in the atmosphere-adjusting section 2050 are used as one form of the aerial vibration-attenuating sections 2060.
FIG. 13 is a cross-sectional view illustrating the configuration of a sound-insulating panel 2101.
As illustrated in FIG. 13, the sound-insulating panel 2101 has a base portion 2061, a lid portion 2062, and a communication portion 2063. The sound-insulating panel 2101 is formed so as to resonate with the aerial vibration by generating Helmholtz resonance. The base portion 2061 and the lid portion 2062 are formed using, for example, metal.
The base portion 2061 has a bottom portion 2061 a and a wall portion 2061 b. The bottom portion 2061 a is formed in a rectangular shape. The wall portion 2061 b is provided on four sides of the bottom portion 2061 a, and is formed so as to surround a central portion of the bottom portion 2061 a in a plan view.
The bottom portion 2061 a and the wall portion 2061 b are formed of, for example, one member. A recess 2061 c is formed in a portion surrounded by the bottom portion 2061 a and the wall portion 2061 b.
The lid portion 2062 is formed in a rectangular plate shape, similar to the bottom portion 2061 a of the base portion 2061, and is formed with substantially the same dimensions as the bottom portion 2061 a. The lid portion 2062 is placed on the wall portion 2061 b so as to block the recess 2061 c and cover the base portion 2061. The wall portion 2061 b and the lid portion 2062 are brought into close contact with each other by, for example, an adhesive (not illustrated).
A communication portion 2063 is formed in the lid portion 2062. The communication portion 2063 is formed through the lid portion 2062 in its thickness direction. The communication portion 2063 communicates with the inside of the recess 2061 c and the outside of the recess 2061 c.
In the present embodiment, the communication portion 2063 is provided on the side of the sound-insulating panel 2101 inside the housing section 2040. For this reason, the communication portion 2063 communicates with the inside of the recess 2061 c and the inside of the housing section 2040.
FIG. 14 is an explanatory view illustrating the Helmholtz resonance of the sound-insulating panel 2101, and is a schematic view illustrating a Helmholtz resonator.
The Helmholtz resonator in which a neck portion is connected to a space portion is illustrated in FIG. 14. In this Helmholtz resonator, a spring mass system in which the air in the space portion acts as a spring and the air in the neck portion acts as mass is conceivable. In this case, if sonic velocity is c, the volume of the space portion is V, the length of the neck portion is defined as L, and the cross-sectional area of the neck portion is defined as S, the resonant frequency f of the Helmholtz resonance is expressed by the following Expression 1.
$\begin{matrix} [Expression 1] \\ f = \frac{c}{2 π} \sqrt{\frac{S}{VL}} \end{matrix}$
That is, when the same periodic external force as the frequency f is applied to the Helmholtz resonator from the outside, that is, when aerial vibration with the frequency f is transmitted, the air within the Helmholtz resonator vibrates.
This is the principle of the Helmholtz resonance. The energy of the aerial vibration with the frequency f is consumed by a frictional force generated when the air inside the Helmholtz resonator vibrates or the like, and as a result, the amplitude of the aerial vibration decreases. That is, the aerial vibration with the same frequency as the resonant frequency f is attenuated by the Helmholtz resonator.
A space 2066 formed as the recess 2061 c is blocked by the lid portion 2062 functions as the space portion of the Helmholtz resonator, and the communication portion 2063 formed in the lid portion 2062 functions as the neck portion of the Helmholtz resonator, whereby the sound-insulating panel 2101 functions as the Helmholtz resonator.
In the above Expression 1, the volume V of the space portion of the Helmholtz resonator, the length L of the neck portion, and the cross-sectional area S of the neck portion become variables. For this reason, a Helmholtz resonator having an arbitrary resonant frequency f can be configured by adjusting these variables.
That is, in the present embodiment, at least one out of the space 2066 (volume V) and the communication portion 2063 (length L, cross-sectional area S) having a specification according to the frequency F of aerial vibration to be attenuated are obtained, whereby the sound-insulating panel 2101 has a resonant frequency corresponding to the frequency F of the above aerial vibration.
FIG. 15 is a view illustrating the configuration of the Helmholtz sound absorber 2102. In addition, FIG. 15 illustrates a state where the Helmholtz sound absorber 2102 is cut into halves in order to make illustration easily understood.
As illustrated in FIG. 15, the Helmholtz sound absorber 2102 has a box-shaped member 2102 a for forming a cavity portion 2102 b around the gas flow pipe 2072. The portion of the gas flow pipe 2072 surrounded by the box-shaped member 2102 a is formed with through-holes 2072 e. The through-holes 2072 e are formed so as to allow the inside and outside of the piping portion 2072 a to communicate with each other.
Accordingly, the inside of the piping portion 2072 a communicates with the cavity portion 2102 b via the through-holes 2072 e.
FIG. 16 is a view schematically illustrating the Helmholtz sound absorber 2102.
As illustrated in FIG. 16, in the Helmholtz sound absorber 2102, when the volume of the cavity portion 2102 b is defined as V, the cross-sectional area of the piping portion 2072 a is defined as S, the diameter of the piping portion 2072 a is defined as d, the thickness of the piping portion 2072 a, that is, the length of the through-holes 2072 e, is defined as Lc, and the radius of the through-holes 2072 e is defined as a (the diameter thereof is 2a), the acoustic loss TL (dB) in the Helmholtz sound absorber 2102 and the central frequency Fr (Hz) of the aerial vibration are shown by Equation (1) and Equation (2) of Expression 2.
However, it is premised that Equation (1) and Equation (2) satisfy Equation (3) and Equation (4).
$\begin{matrix} [Expression 2] \\ Acoustic Loss T L (dB) TL = 10 \times \log_{10} {1 + \frac{{(\frac{\sqrt{(Co \times V}}{2 \times S})}^{2}}{{(\frac{F}{Fr} - \frac{Fr}{F})}^{2}}} & Equation (1) \\ Central Frequency Fr (Hz) Fr = \frac{c}{2 \times π} \times \sqrt{\frac{Co}{V}} Here, & Equation (2) \\ Co = n π a^{2} / (Lc + β a) & Equation (3) \\ β = π / 2 & Equation (4) \end{matrix}$
FIG. 17 is a cross-sectional view illustrating the configuration of the silencing hose 2083.
As illustrated in FIG. 17, the silencing hose 2083 has a metal wire 2091 formed in a spiral shape, a nonwoven fabric member 2092 wound around the outside of the metal wire 2091, a glass wool layer 2093 that covers an outer periphery of the nonwoven fabric member 2092, and a tube member 2094 that covers the glass wool layer 2093.
The silencing hose 2083 is formed so that the gas flows through the inside of the metal wire 2091 surrounded by the nonwoven fabric member 2092. The silencing hose 2083 absorbs the flow of the gas and the noise propagated by the gas, and suppresses the movement of heat between the inside and outside thereof. For this reason, the movement of heat between the housing section 2040 and the silencing hose 2083 of the chamber system 2100 is suppressed.
In the above configuration, the aerial vibration-attenuating sections 2060 (sound-insulating panels 2101) are arranged on the entire surface of an outer wall portion including the bottom part 2010, the side wall parts 2020, and the ceiling part 2030, which surrounds the housing section 2040. Therefore, the housing section 2040 is isolated from the outside in the state of being surrounded by the aerial vibration-attenuating sections 2060.
For this reason, the state between the inside and outside of the housing section 2040, also including the bottom part 2010, is brought into a state where the transmission of vibration caused by noise is regulated.
Additionally, the sound-absorbing layer is formed as each aerial vibration-attenuating section 2060 over the substantially entire surface of the inner surface of each of the portions that constitute the atmosphere-adjusting section 2050, the Helmholtz sound absorber 2102 is provided as the aerial vibration-attenuating section 2060 in the gas flow pipe 2072, and the silencing hose 2083 is provided as the aerial vibration-attenuating section 2060 in the second supply system 2052. Therefore, the state between the atmosphere-adjusting section 2050 and the outside thereof is also brought into a state where the transmission of vibration caused by noise is regulated.
As described above, the chamber system 2100 related to the present embodiment includes the housing section 2040 that is surrounded by the bottom part 2010, the side wall parts 2020, and the ceiling part 2030 and houses the processing apparatus PA, the atmosphere-adjusting section 2050 that adjusts the atmosphere inside the housing section 2040, and the aerial vibration-attenuating sections 2060 that are provided at the bottom part 2010, the side wall parts 2020, the ceiling part 2030, and the atmosphere-adjusting section 2050, and attenuate the aerial vibration outside the housing section 2040. Thus, the transfer of heat between the inside and outside of the housing section can be regulated not only in the bottom part 2010, the side wall parts 2020 and the ceiling part 2030 but also the atmosphere-adjusting section 2050.
Accordingly, it is possible to reduce the transmission of vibration caused by sound occurring inside and outside the chamber system 2100. In this way, the chamber system 2100 having excellent sound-insulating properties can be provided.

Third Embodiment

Next, a third embodiment of the invention will be described.
FIG. 18 is a view illustrating the configuration of a chamber system 2200 related to the present embodiment.
The chamber system 2200 of the present embodiment is different from that of the second embodiment in terms of the configuration of a first supply system 2251 of an atmosphere-adjusting section 2250, and other configurations thereof are the same as that of the second embodiment. Hereinafter, differences from the second embodiment will mainly be described.
As illustrated in FIG. 18, the first supply system 2251 has a gas delivery unit 2271, a gas flow pipe 2272, and a duct 2273. Among these, the gas flow pipe 2272 is bent in an L-shape, and an elbow sound absorber 2103 is provided at the bent portion of the gas flow pipe 2272. The elbow sound absorber 2103 is arranged on the gas delivery unit 2271 side with respect to the Helmholtz sound absorber 2102.
In this way, according to the present embodiment, the elbow sound absorber 2103 is provided in addition to the Helmholtz sound absorber 2102. Thus, the sound generated in the first supply system 2251 is absorbed. Accordingly, transmission of vibration resulting from the outside of the first supply system 2251, that is, sound, to the housing section 2040 side can be reduced.

Fourth Embodiment

Next, a fourth embodiment of the invention will be described.
FIG. 19 is a view illustrating the configuration of a chamber system 2300 related to the present embodiment.
The chamber system 2300 of the present embodiment is different from that of the first embodiment in terms of the configuration of a first supply system 2351 of an atmosphere-adjusting section 2350, and other configurations thereof are the same as that of the second embodiment. Hereinafter, differences from the second embodiment will mainly be described.
As illustrated in FIG. 19, the first supply system 2351 has a duct 2373 and a duct 2374 that are arranged side by side in a Z direction. The duct 2373 and the duct 2374 are spatially shut off from each other. For this reason, the duct 2373 and the duct 2374 individually have internal spaces that are independent from each other.
The duct 2373 and the duct 2374 have cover members 2373 a and 2374 a, connecting portions 2373 b and 2374 b, filters 2373 c and 2374 c, and sound-absorbing layers 2373 d and 2374 d, respectively. The configurations are the same as those of the second embodiment.
A first branch pipe 2375 and a second branch pipe 2376 that are branch pipes are connected to a second end portion 2372 c of a gas flow pipe 2372. The first branch pipe 2375 has a piping portion 2375 a formed in the shape of a tube, and a sound-absorbing layer 2375 d formed over the substantially entire surface of an inner surface of the piping portion 2375 a. The first branch pipe 2375 is connected to the connecting portion 2373 b of the duct 2373.
Similarly, the second branch pipe 2376 has a piping portion 2376 a formed in the shape of a tube, and a sound-absorbing layer 2376 d formed over the substantially entire surface of an inner surface of the piping portion 2376 a. Additionally, the second branch pipe 2376 is connected to the connecting portion 2374 b of the duct 2374.
Since the duct 2373 and the duct 2374 are shut off from each other, the gas that has flowed through the first branch pipe 2375, and the gas that has flowed through the second branch pipe 2376 are individually supplied to the housing section 2040 without being mixed with each other.
In addition, in the first supply system 2351, the gas flow pipe 2372 is formed in an L-shape, similar to the third embodiment. Additionally, the elbow sound absorber 2103 is provided at a bent portion of the gas flow pipe 2372.
In the present embodiment, the elbow sound absorber 2103 is provided in addition to the Helmholtz sound absorber 2102, the sound-absorbing layer 2375 d and the sound-absorbing layer 2376 d are formed over the substantially entire surfaces of the inner surfaces of the first branch pipe 2375 and the second branch pipe 2376 that branch from each other, and the sound-absorbing layer 2373 d and the sound-absorbing layer 2374 d are formed over the substantially entire surfaces of the inner surfaces of the duct 2373 and the duct 2374 that are individually provided. Therefore, the sound generated in the first supply system 2351 is absorbed.
Accordingly, transmission of vibration resulting from the outside of the first supply system 2351, that is, sound, to the housing section 2040 side can be reduced.
In addition, in the present embodiment, a configuration in which the first branch pipe 2375 and the second branch pipe 2376 have the same path length has been described as an example. However, the invention is not limited to this. A configuration may be adopted in which the first branch pipe 2375 and the second branch pipe 2376 are formed so as to have different path lengths.
In this case, for example, if the wavelength of vibration generated in the gas delivery unit 2371 is defined as λ, the interference between waves of which the phases are shifted from each other by λ/2 is caused by shifting a path length by λ/2 between the first branch pipe 2375 and the second branch pipe 2376. This interference can attenuate the vibration generated in the atmosphere-adjusting section 2350.

Fifth Embodiment

Next, a fifth embodiment of the invention will be described.
FIG. 20 is a view illustrating the configuration of a chamber system 2400 related to the present embodiment.
The chamber system 2400 of the present embodiment is different from that of the second embodiment in terms of the configuration of a first supply system 2451 of an atmosphere-adjusting section 2450, and other configurations thereof are the same as that of the second embodiment. Hereinafter, differences from the second embodiment will mainly be described.
As illustrated in FIG. 20, the first supply system 2451, similar to the fourth embodiment, has a duct 2473 and a duct 2474 that are arranged side by side in the Z direction.
The duct 2473 and the duct 2474 have cover members 2473 a and 2474 a, connecting portions 2473 b and 2474 b, filters 2473 c and 2474 c, and sound-absorbing layers 2473 d and 2474 d, respectively. The respective configurations are the same as those of the fourth embodiment.
A manifold 2104 is connected to a second end portion 2472 c of the gas flow pipe 2472. The manifold 2104 has a container member 2104 a capable of containing gas, a connecting portion 2104 b, a branch connecting portion 2104 c, and a sound-absorbing layer 2104 d.
The connecting portion 2104 b is provided on a gas delivery unit 2471 side (an upstream side of the flow of the gas) of the container member 2104 a. A plurality of the branch connecting portions 2104 c are provided on the side (a downstream side of the flow of the gas) of the duct 2473 and the duct 2474 of the container member 2104 a. Additionally, the sound-absorbing layer 2104 d is formed over the substantially entire surface of an inner surface of the container member 2104 a.
Silencing hoses 2105 are connected to the plurality of branch connecting portions 2104 c. The configuration of the silencing hoses 2105 is the same as that of the silencing hose 2083 of the first embodiment. Some of the plurality of silencing hoses 2105 are connected to the connecting portion 2473 b of the duct 2473. Additionally, the rest of the plurality of silencing hoses 2105 are connected to the connecting portion 2474 b of the duct 2474.
In this way, the present embodiment provides a configuration in which the downstream side of the gas flow pipe 2472 is branched using the manifold 2104 and the silencing hoses 2105.
According to the present embodiment, the sound-absorbing layer 2104 d and the sound-absorbing layer 2474 d are formed as the aerial vibration-attenuating sections 2060 and are formed over the substantially entire surface of the inner surface of the manifold 2104, and the sound-absorbing layer 2473 d and the sound-absorbing layer 2474 d are formed as the aerial vibration-attenuating sections 2060 over the substantially entire surfaces of the inner surfaces of the duct 2473 and the duct 2474 that are individually provided. Therefore, the sound generated in the first supply system 2451 is easily absorbed.
Accordingly, transmission of vibration resulting from the outside of the first supply system 2451, that is, sound, to the housing section 2040 side can be reduced.

Sixth Embodiment

Next, a sixth embodiment of the invention will be described.
FIG. 21 is a view illustrating the configuration of a chamber system 2500 related to the present embodiment.
The chamber system 2500 of the present embodiment is different from that of the second embodiment in terms of the configuration of an atmosphere-adjusting section 2550, and other configurations thereof are the same as that of the second embodiment. Hereinafter, differences from the second embodiment will mainly be described.
As illustrated in FIG. 21, the atmosphere-adjusting section 2550 has a gas supply system 2551 and an exhaust system 2552. The gas supply system 2551 has a gas delivery unit 2571, a gas flow pipe 2572, and a duct 2573. The configuration of the present embodiment is different from the configuration of the above respective embodiments in that the gas flow pipe 2572 is configured using a plurality of silencing hoses.
Additionally, the exhaust system 2552 exhausts the gas of the housing section 2040 to the outside of the housing section 2040. The exhaust system 2552 has a piping portion 2552 a. The piping portion 2552 a has one end connected to a connecting portion 2020 b of each side wall part 2020 and the other end connected to a circulation connecting portion 2571 c of the gas delivery unit 2571.
For this reason, the piping portion 2552 a allows the gas exhausted from the connecting portion 2020 b to flow to the gas delivery unit 2571. A sound-absorbing layer 2552 b is formed on an inner surface of the piping portion 2552 a over its substantially entire surface.
In addition, sound-absorbing layers formed with the same configuration as the above embodiment are arranged as the aerial vibration-attenuating sections 2060 over the substantially entire surfaces of the inner surfaces of the circulation connecting portion 2571 c and the connecting portion 2020 b.
Additionally, the elbow sound absorber 2103, the Helmholtz sound absorber 2102, and a splitter sound absorber 2106 are provided as the aerial vibration-attenuating sections 2060 from the connecting portion 2020 b side toward the circulation connecting portion 2571 c side in the piping portion 2552 a. The Helmholtz sound absorber 2102 and the splitter sound absorber 2106 are provided at close positions.
When the gas exhausted from the housing section 2040 is circulated through the gas delivery unit 2571 as in the present embodiment, vibration caused by sound propagates in a direction opposite to a direction in which the gas flows, in a circulation path. Accordingly, the sound generated in the gas delivery unit 2571 propagates to the piping portion 2552 a via the circulation connecting portion 2571 c, and proceeds to the connecting portion 2020 b side within the piping portion 2552 a.
In this process, for example, the sound is absorbed in order by the sound-absorbing layer 2571 e provided on the inner surface of the gas delivery unit 2571, the sound-absorbing layer 2552 b provided on the inner surface of the piping portion 2552 a, the splitter sound absorber 2106, the Helmholtz sound absorber 2102, and the elbow sound absorber 2103. This can reduce transmission of the sound generated in the gas delivery unit 2571 to the housing section 2040.
In addition, in the present embodiment, the Helmholtz sound absorber 2102 and the splitter sound absorber 2106 are provided at positions close to each other. However, these sound absorbers are not necessarily provided close to each other.

Seventh Embodiment

Next, a seventh embodiment of the invention will be described.
FIG. 22 is a view illustrating the configuration of a chamber system 2600 related to the present embodiment.
The chamber system 2600 of the present embodiment is different from the sixth embodiment in terms of the configuration of an exhaust system 2652 of an atmosphere-adjusting section 2650 and the configuration of the aerial vibration-attenuating sections 2060, and other configurations thereof are the same as that of the sixth embodiment. Hereinafter, differences from the second embodiment will mainly be described.
As illustrated in FIG. 22, the exhaust system 2652 has a piping portion 2652 a that exhausts the gas of the housing section 2040 to the outside of the housing section 2040. Additionally, the exhaust system 2652 has a gas delivery unit 2682 that delivers the gas to the piping portion 2652 a. The gas delivery unit 2682 is connected to the connecting portion 2020 b of the side wall part 2020 by an exhaust pipe 2681.
Accordingly, the gas delivery unit 2682 communicates with the housing section 2040 via the exhaust pipe 2681 and the connecting portion 2020 b.
The gas delivery unit 2682 has a fan 2682 a that delivers gas by rotation, and a fan-housing portion 2682 b that houses the fan 2682 a. The fan-housing portion 2682 b is provided with a first connecting portion 2682 c connected to the exhaust pipe 2681 and a second connecting portion 2682 d connected to the piping portion 2652 a.
Additionally, a sound-absorbing layer 2682 e is provided as the aerial vibration-attenuating section 2060 on the inner surface of the fan-housing portion 2682 b over its substantially entire surface.
Additionally, the elbow sound absorber 2103 and an active sound absorber 2107 are provided from the connecting portion 2020 b side toward a circulation connecting portion 2671 c side in the piping portion 2652 a. The active sound absorber 2107 detects the acoustic frequency in the housing section 2040, and attenuates sound with a predetermined frequency that influences the processing apparatus PA in the piping portion 2652 a, using a superposition principle.
The active sound absorber 2107 has a housing 2107 a, a detecting microphone 2107 b provided in the housing section 2040, a microphone 2107 c for a housing and a loudspeaker 2107 d that are provided inside the housing 2107 a, and a controller 2107 e that generally controls the respective portions. The detecting microphone 2107 b is provided in the vicinity of, for example, the processing apparatus PA.
The active sound absorber 2107 detects the distribution of the acoustic frequency in the vicinity of the processing apparatus PA with the detecting microphone 2107 b, and transmits the distribution to the controller 2107 e.
In order to attenuate a waveform with a predetermined frequency that influences the processing apparatus PA among detection results obtained by the detecting microphone 2107 b, a waveform for this attenuation is generated in the controller 2107 e. The waveform generated in the controller 2107 e is output as a sound signal from the loudspeaker 2107 d.
At this time, a feedback control may be performed such that the acoustic frequency inside the housing 2107 a is detected using the microphone 2107 c for a housing inside the housing 2107 a, the detection result is transmitted to the controller 2107 e, and an output signal made to output from the loudspeaker 2107 d on the basis of the detection result of the microphone 2107 c for a housing is generated in the controller 2107 e.
As described above, according to the present embodiment, the acoustic frequency within the housing section 2040 can be attenuated in the piping portion 2652 a by using the active sound absorber 2107 for the piping portion 2652 a of the exhaust system 2652. This can prevent an influence on the processing apparatus PA.
The technical range of the invention is not limited to the above embodiment, and, changes can be appropriately added without departing from the scope of the invention.
For example, in the above embodiment, a configuration in which the space 2066 formed by the recess 2061 c and the lid portion 2062 as the sound-insulating panel 2101 is one layer has been described as an example. However, the invention is not limited to this. For example, a configuration in which the space is divided into a plurality of layers may be adopted.
For example, as illustrated in FIG. 23, a configuration may be adopted in which a portion between the recess 2061 c and the lid portion 2062 is divided into a three-layer space ( spaces 2066A, 2066B, and 2066C) by a metal membrane 2064 and a metal membrane 2065.
The metal membrane 2064 and the metal membrane 2065 are formed of, for example, aluminum or the like. The metal membrane 2064 and the metal membrane 2065 are respectively formed with a through-hole 2064 a and a through-hole 2065 a that pass through both surfaces thereof.
Additionally, in the configuration illustrated in FIG. 23, a plurality of the communication portions 2063 formed in the lid portion 2062 are provided. The band of the frequency at which sound can be absorbed can be broadened compared to a case where the space is one layer by virtue of the configuration having the plurality of layers of spaces in this way.
Additionally, as illustrated in FIG. 24, a configuration may be adopted in which a lid portion-supporting portion 2067 supporting the lid portion 2062 is provided inside the space 2066.
The lid portion-supporting portion 2067 is formed using, for example, a high-rigidity material, such as metal. The lid portion-supporting portion 2067 is formed, for example, in a columnar shape, and is housed in the space 2066. The lid portion-supporting portion 2067 has an upper end abutting against the lid portion 2062 and a lower end supported by the bottom portion 2061 a. This configuration can make it hard for the lid portion 2062 to be deflected to the space 2066 side.
Additionally, for example, in the above respective embodiments, an example in which the bottom part 2010, the side wall parts 2020, and the ceiling part 2030 are constituted by the sound-insulating panels 2101 has been illustrated and described. However, the invention is not limited to this. For example, as illustrated in FIG. 25, the bottom part 2010, the side wall parts 2020, and the ceiling part 2030 may be constituted using heat-insulating panels 2201 in addition to the sound-insulating panels 2101.
Although a configuration in which a sound-insulating panel 2101 is arranged on a heat-insulating panel 2201 has been described as an example in FIG. 25, the invention is not limited to this. A configuration may be adopted in which a heat-insulating panel 2201 is arranged on a sound-insulating panel 2101.
The heat-insulating panel 2201 has a pair of substrates (a first substrate 2191 and a second substrate 2192), a heat transfer-suppressing layer 2193 sandwiched by the first substrate 2191 and the second substrate 2192, and a reinforcing member 2194 that reinforces the first substrate 2191 and the second substrate 2192.
As the first substrate 2191 and the second substrate 2192, for example, a substrate formed of a resin material, such as plastics, a substrate formed of a metallic material, such as stainless steel, or the like can be used. A configuration may be adopted in which heat is reflected by providing copper foil, aluminum foil, or the like on the front surfaces or inner surfaces of the first substrate 2191 and the second substrate 2192.
The heat transfer-suppressing layer 2193 includes a heat-insulating material layer or a vacuum layer that suppresses the transfer of heat. As the heat-insulating material layer, for example, a configuration obtained using foamed urethane or the like may be adopted. As the vacuum layer, for example, a configuration may be adopted in which a space between the first substrate 2191 and the second substrate 2192 is sealed so as to have a pressure of about 10⁻³Pa.
Additionally, as the heat transfer-suppressing layer 2193, a configuration may be adopted in which a heat-insulating material layer formed of a fiber-based core material, such as a glass fiber, and a vacuum layer sealed so that the pressure thereof becomes about 1 Pa to 10 Pa are included.
The reinforcing member 2194 has a first reinforcing substrate 2195 that reinforces the first substrate 2191, a second reinforcing substrate 2196 that reinforces the second substrate 2192, and a substrate-supporting portion 2197 that supports the first reinforcing substrate 2195 and the second reinforcing substrate 2196. The first reinforcing substrate 2195, the second reinforcing substrate 2196, and the substrate-supporting portion 2197 are formed of, for example, a metallic material.
By using the heat-insulating panel 2201 in this way, the movement of heat between the inside and the outside of the housing section 2040 can be prevented, and the influence exerted on the processing apparatus PA can be reduced.
Additionally, there is a great necessity for a configuration in which the first substrate 2191, the second substrate 2192, and the heat transfer-suppressing layer 2193 that constitute each heat-insulating panel 2201 are not easily deformed against the load of the sound-insulating panel 2101 in a thickness direction (a direction directed from the first substrate 2191 to the second substrate 2192).
In contrast, in the present embodiment, the heat-insulating panel 2201 provided on the bottom part 2010 has the first reinforcing substrate 2195, the second reinforcing substrate 2196, and the substrate-supporting portions 2197. Therefore, the first substrate 2191, the second substrate 2192, and the heat transfer-suppressing layer 2193 are configured so as not to be easily deformed against the load of the heat-insulating panel 2201 in the thickness direction.
In addition, although the configuration in the bottom part 2010 has been described as an example in FIG. 25, the above configuration may be used for the side wall parts 2020 and the ceiling part 2030 in addition to the bottom part. Additionally, a configuration may be adopted in which the first substrate 2191, the second substrate 2192, and the heat transfer-suppressing layer 2193 are included without providing the heat-insulating panel 2201 with the reinforcing member 2194.
Additionally, in the above embodiment, a configuration in which the sound-insulating panels 2101 are used as the side wall parts 2020 and the ceiling part 2030 of the chamber system 2100 has been described as an example. However, the invention is not limited to this. As illustrated in FIG. 26, a configuration may be adopted in which a sound absorbing material 2108 is provided, for example, on the inner surface (surface on the housing section 2040 side) of the heat-insulating panel 2201 as the side wall parts 2020 and the ceiling part 2030.
As the sound absorbing material 2108, for example, an ULPA (Ultra Low Penetration Air) filter is used. In addition, a porous material may be used as the sound absorbing material 2108.
By using a chemically clean sound absorbing material, such as the ULPA filter, as a sound absorbing material 2108, the sound absorbing material 2108 can also be arranged in a chemically clean environment as an environment where the chamber system 2100 is provided, unlike, for example, the sound absorbing material, such as the glass wool.
Additionally, a configuration in which the sound absorbing material 2108 and the sound-insulating panel 2101 described in the above embodiment are combined together may be adopted for the side wall parts 2020 and the ceiling part 2030. As such a configuration, for example, there is a configuration in which the sound absorbing material is pasted on the surface of the sound-insulating panel 2101, for example, in the heat-insulating panel 2201 and the sound-insulating panel 2101 that are illustrated in FIG. 25.
Additionally, for example, as illustrated in FIG. 27, a configuration may be adopted in which the sound absorbing material 2108 is provided not only on the surface of the lid portion 2062 of the sound-insulating panel 2101 but inside the recess 2061 c.
By providing the sound absorbing material 2108 inside the recess 2061 c, it is possible to further enhance sound absorbing properties. Additionally, by integrating the heat-insulating panel 2201, the sound-insulating panel 2101, and the sound absorbing material 2108, the rigidity of the side wall parts 2020 and the ceiling part 2030 can be enhanced, and it is possible to suppress occurrence of noise caused by vibration.
FIGS. 28 and 29 are graphs illustrating results obtained by performing acoustic analysis using the finite element method when a sound pressure spectrum is input from a portion of a side wall part 2020, in a case where the chamber system 2100 is formed as a rectangular parallelepiped. In addition, the inner surface and outer surface of the side wall part 2020 of the chamber system 2100 are formed as rigid body surfaces.
FIG. 28 illustrates the state of vibration when the inner surfaces of the side wall parts 2020 and the ceiling part 2030 are not provided with the sound absorbing materials 2108. FIG. 29 illustrates the state of vibration when the inner surfaces of the side wall parts 2020 and the ceiling part 2030 are provided with the sound absorbing materials 2108. The horizontal axis of FIGS. 28 and 29 shows the frequency (relative value) of the vibration, and the vertical axis shows the amplitude (relative value) of the vibration.
FIG. 29 illustrates results when the sound absorbing materials 2108 with a reflectivity 0.5 are pasted on the ceiling part 2030, the four side surfaces of the side wall parts 2020, and the bottom part 2010. In addition, the places where the acoustic analysis was performed are five points in the housing section 2040.
As illustrated in FIGS. 28 and 29, when the sound absorbing materials 2108 including the ULPA filters are provided on the inner surfaces of the side wall parts 2020 and the ceiling part 2030, it can be seen that the amplitude of the vibration in the housing section 2040 is lower compared to a case where the sound absorbing material 2108 is not provided on the inner surface.
By providing the sound absorbing material 2108 on the inner surface of each of the side wall part 2020 and the ceiling part 2030 in this way, it is possible to enhance the sound absorbing properties of the housing section 2040.
In the above embodiment, for the chamber system 2100, a configuration in which the bottom part 2010 and the ceiling part 2030 are parallel to each other and opposing side wall parts 2020 are parallel to each other has been described as an example. However, the invention is not limited to this. It is also possible to adopt a configuration in which the bottom part 2010 and the ceiling part 2030 are not parallel to each other and the opposing side wall parts 2020 are not parallel to each other.
For example, as illustrated in FIG. 30, a configuration may be adopted in which a plurality of irregular portions (protrusions 2020 d and recesses 2020 e) are provided in the opposing side wall parts 2020. In this configuration, between the opposing side wall parts 2020, the protrusions 2020 d face each other and the recesses 2020 e face each other. Therefore, there is a configuration in which the opposing side wall parts 2020 do not become parallel to each other.
In addition, the shape of the protrusions 2020 d and the recesses 2020 e may be other shapes (for example, a quadrangular shape, a semicircular shape, a semi-spherical shape, and the like) without being limited to a triangular shape as illustrated in FIG. 30.
Additionally, although the protrusions 2020 d and the recesses 2020 e are provided in a range from the bottom part 2010 to the ceiling part 2030, the invention is not limited to that in FIG. 30. Additionally, a configuration may be adopted in which the same structure as the protrusions 2020 d and the recesses 2020 e is provided in the bottom part 2010 or the ceiling part 2030.
Additionally, for example, as illustrated in FIG. 31, a configuration may be adopted in which one set of opposing side wall parts 2020 are arranged so as to incline (have an inclination angle). Also in this case, a configuration is provided in which the side wall parts 2020 do not become parallel to each other. In addition, a configuration may be adopted in which two sets of opposing side wall parts 2020 are arranged so as to incline.
Additionally, for example, as illustrated in FIG. 32, a configuration may be adopted in which the ceiling part 2030 inclines with respect to the bottom part 2010. In this case, a configuration is provided in which the bottom part 2010 and the ceiling part 2030 do not become parallel to each other. In addition, the configuration illustrated in FIGS. 30 to 32 and the configurations of the above respective descriptions can be combined together and applied.
As described above, the sound interference to the housing section 2040 is reduced by providing a configuration in which the bottom part 2010 and the ceiling part 2030 do not become parallel to each other, and the opposing side wall parts 2020 do not become parallel to each other.
In this case, the inclination angle between the bottom part 2010 and the ceiling part 2030 and the inclination angle between the opposing side wall parts 2020 can be set to be suitable angles according to the distances between the wall surfaces, the wavelength of sound generated in the housing section 2040, the wavelength of the sound propagated in the housing section 2040, or the like.
Additionally, the same applies to the shapes, dimensions, and positions of the protrusions 2020 d and the recesses 2020 e, and the same applies to the protrusions or recesses provided in the bottom part 2010 or the ceiling part 2030.

Claims

1-26. (canceled)

27. A chamber system comprising:

a housing section that is surrounded by a bottom part, a side wall part, and a ceiling part and houses a processing apparatus;

an atmosphere-adjusting section that adjusts the atmosphere inside the housing section; and

an aerial vibration-attenuating section that is provided in each of the side wall part, the ceiling part, and the atmosphere-adjusting section and attenuates aerial vibration outside the housing section.

28-37. (canceled)

38. The chamber system according to claim 27,

wherein the atmosphere-adjusting section has a gas supply system that supplies gas to the housing section, and

wherein the aerial vibration-attenuating section is provided in the gas supply system.

39. The chamber system according to claim 38,

wherein the gas supply system has a first branch path and a second branch path that are branched, and the first branch path and the second branch path have different path lengths.

40. The chamber system according to claim 27,

wherein the atmosphere-adjusting section has an exhaust system that exhausts gas from the housing section, and

wherein the aerial vibration-attenuating section is provided in the exhaust system.

41. The chamber system according to claim 27,

wherein the atmosphere-adjusting section has a circulation system that exhausts a gas from the housing section and returns the exhausted gas to the housing section, and

wherein the aerial vibration-attenuating section is provided in the circulation system.

42. The chamber system according to claim 27,

wherein the atmosphere-adjusting section has a flow passage through which the gas flows, and

wherein the aerial vibration-attenuating section is provided at a position according to the shape of the flow passage in the flow passage.

43. The chamber system according to claim 27,

wherein the bottom part and the ceiling part are formed so that the surface of the bottom part on the housing section side and the surface of the ceiling part on the housing section side do not become parallel to each other.

44. The chamber system according to claim 27,

wherein the side wall part has a plurality of surfaces on the housing section side, and is formed so that at least two of the plurality of surfaces do not become parallel to each other.

45. The chamber system according to claim 43,

wherein at least one of the bottom part, the side wall part, and the ceiling part has a plurality of irregular portions.

46. The chamber system according to claim 27,

wherein the aerial vibration-attenuating section has:

a detecting unit that detects the frequency of aerial vibration in the housing section; and

a control unit that performs a control so that vibration corresponding to a frequency according to a detection result of the detecting unit is generated in at least some of the bottom part, the side wall part, the ceiling part, and the atmosphere-adjusting section.

47. The chamber system according to claim 27,

wherein the aerial vibration-attenuating section has an absorbing member that absorbs the aerial vibration.

48. (canceled)

49. The chamber system according to claim 27,

wherein the aerial vibration-attenuating section has a sound absorption portion that absorbs the aerial vibration.

50. The chamber system according to claim 27,

wherein the aerial vibration-attenuating section has a resonating portion that resonates with the aerial vibration.

51. The chamber system according to claim 50,

wherein the aerial vibration-attenuating section is formed so that Helmholtz resonance is generated in the resonating portion.

52. The chamber system according to claim 50,

wherein the resonating portion has:

a base portion having a recess formed therein;

a lid portion that covers the base portion so as to block the recess; and

a communication portion that is formed in the lid portion and allows the inside of the recess and the outside of the recess to communicate with each other.

53. The chamber system according to claim 52,

wherein at least one of the recess and the communication portion is formed with a specification according to the frequency of the aerial vibration.

54. The chamber system according to claim 52,

wherein the communication portion is formed on the housing section side so as to allow the inside of the recess and the inside of the housing section to communicate with each other.

55. The chamber system according to claim 52,

wherein the lid portion is formed using metal.

56. The chamber system according to claim 52,

wherein the resonating portion has a lid portion-supporting portion that is provided in the recess and supports the lid portion.

57. The chamber system according to claim 56,

wherein the resonating portion is provided in at least the bottom part, and

wherein the processing apparatus is placed on the resonating portion.

58. The chamber system according to claim 57,

wherein a plurality of the lid portion-supporting portions are provided, and

wherein the plurality of lid portion-supporting portions are arranged so that the density of the portions thereof corresponding to the processing apparatus becomes higher than that of the other portions.

59. The chamber system according to claim 27,

wherein the processing apparatus includes at least one of a measuring apparatus, a manufacturing apparatus, and a machining apparatus.