US20140345831A1 - Plate-type heat pipe and method of manufacturing the same - Google Patents
Plate-type heat pipe and method of manufacturing the same Download PDFInfo
- Publication number
- US20140345831A1 US20140345831A1 US13/900,837 US201313900837A US2014345831A1 US 20140345831 A1 US20140345831 A1 US 20140345831A1 US 201313900837 A US201313900837 A US 201313900837A US 2014345831 A1 US2014345831 A1 US 2014345831A1
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- US
- United States
- Prior art keywords
- plate
- heat pipe
- type heat
- capillary structure
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D53/00—Making other particular articles
- B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
- B23P2700/09—Heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/08—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes pressed; stamped; deep-drawn
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/04—Fastening; Joining by brazing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49353—Heat pipe device making
Definitions
- the instant disclosure relates to a plate-type heat pipe; in particular, to a plate-type heat pipe using two-phase flow recirculation for heat transferring and a method of manufacturing the same.
- the trend of technology development is ever complicating, for example, the integrated circuits or laptop.
- the shrinking volume of electronic products is accompanied by the issue of heat dissipation.
- the heat generated by an electronic device is considerably high.
- the electronic components are therefore equipped with suitable heat sink or device to increase the rate of heat dissipation.
- the air-cooled system is replaced by liquid-cooled system for efficiently maintaining optimal operation temperature.
- heat pipe is implemented in heat dissipation design.
- the plate-type heat pipe is a variation of tubular heat pipe.
- the two structures employ the same heat dissipation mechanism, which transfers heat by two-phase flow recirculation.
- the conventional plate-type heat pipe includes a plate, capillaries and a support structure. After disposing the capillaries and the support structure onto the plate, further brazing or diffusion bonding is required to secure the capillaries and support structure on the plate. The fabrication process consumes considerable time and labor and the manufacturing cost remains high. Thus, the conventional heat pipe is not competitive in the current market.
- the instant disclosure provides a plate-type heat pipe and a method of manufacturing the same.
- the manufacturing process is simplified to save time and labor and therefore reduces cost for better product competiveness.
- the plate-type heat pipe includes a first plate, a capillary structure and a support structure.
- the first plate, capillary structure and support structure are arranged in sequence and tightly connected by pressing.
- the instant disclosure also provides a method of manufacturing the plate-type heat pipe.
- the method includes firstly providing a first plate, a capillary structure and a support structure.
- the first plate, capillary structure and support structure are arranged in sequence and pressed to allow tight connection.
- the plate-type heat pipe is formed by pressing the first plate, capillary structure and support structure and therefore brazing or diffusion bonding can be omitted in the manufacturing process.
- This fabrication method simplifies the overall process, reduces time and labor and decreases cost to enhance product competiveness.
- FIG. 1 is a flow chart showing a method of manufacturing a plate-type heat pipe of the instant disclosure.
- FIG. 2 is a schematic diagram (I) showing a method of manufacturing a plate-type heat pipe of the instant disclosure.
- FIG. 3 is a schematic diagram (II) showing a method of manufacturing a plate-type heat pipe of the instant disclosure.
- FIG. 4 is a schematic diagram (III) showing a method of manufacturing a plate-type heat pipe of the instant disclosure.
- FIG. 5 is a schematic diagram (IV) showing a method of manufacturing a plate-type heat pipe of the instant disclosure.
- FIG. 6 is a cross-sectional view of a plate-type heat pipe of the instant disclosure.
- the instant disclosure provides a method of manufacturing a plate-type heat pipe. The details are further elaborated herein.
- Step S 110 firstly, a first plate 1 , a capillary structure 2 and a support structure 3 are provided.
- the first plate 1 , capillary structure 2 and support structure 3 superimpose on one another.
- the first plate 1 , capillary structure 2 and support structure 3 are disposed successively in that order.
- the first plate 1 may be made of copper, aluminum or other metallic materials exhibiting desired heat conductivity.
- the shape of the first plate 1 is not restricted by the instant embodiment. It is worth noting that the first plate 1 can be the bottom or the top of the plate-type heat pipe.
- the face that immediately contacts the capillary structure 2 of the first plate 1 may be formed with a capillary tissue 11 .
- the capillary tissue 11 can be grooves or formed by powder sintering or both.
- the capillary structure 2 may be grid, fiber, or formed by powder sintering or the combination thereof.
- the capillary structure 2 is a grid (for example, copper grid).
- the support structure 3 can be made of copper, aluminum or other metallic materials exhibiting desired heat conductivity.
- the configuration of the support structure 3 is not limited by the instant embodiment.
- the support structure 3 has a plurality of support bodies 31 .
- the support bodies 31 may be cylindrical, polygonal, rectangular, or the like and the instant disclosure is not limited thereto.
- the support bodies 31 are cylindrical pillars having the same diameter overall, i.e., each column has the same dimension.
- the support bodies may vary in size in another embodiment whereas uniform dimension simplifies the manufacturing process.
- Step S 120 subsequently, the first plate 1 , capillary structure 2 and support structure 3 are pressed.
- the pressing allows the first plate 1 , capillary structure 2 and support structure 3 for tight connection to build the main scaffold of the plate-type heat pipe.
- a mold 5 is fixed on the press machine (not shown) for conducting the pressing process.
- a plurality of grooves 12 can be formed on the first plate 1 cooperatively positioned to the support bodies 31 .
- the end of the support bodies 31 that immediately contacts the first plate 1 has a diameter D larger than the diameter d of the groove 12 .
- Step S 130 additionally, a second plate 4 is provided.
- the second plate 4 may be made of copper, aluminum or other metallic materials exhibiting desired heat conductivity.
- the second plate 4 is configured to coincide with the first plate 1 . It is worth noting the second plate 4 can be the bottom or the top of the plate-type heat pipe.
- the connection of the first plate 1 and second plate 4 results in a completed plate-type heat pipe.
- the first plate 1 and second plate 4 can be connected by brazing, diffusion bonding or the like to define a chamber 41 between the first and second plates 1 , 4 .
- the chamber 41 is vacuumed and fluid fills therein (not shown). Different phase conversion of the fluid can rapidly and evenly transfer the heat generated by electronic components.
- the instant disclosure provides a plate-type heat pipe.
- the plate-type heat pipe includes a first plate 1 , a capillary structure 2 and a support structure 3 .
- the capillary structure 2 can be grid, fiber, or formed by powder sintering or the combination thereof.
- the first plate 1 , capillary structure 2 and support structure 3 are stacked in sequence.
- One face of the first plate 1 that immediately contacts the capillary structure 2 may be formed with a capillary tissue 11 .
- the support structure 3 includes a plurality of support bodies 31 being cylindrical, polygonal, rectangular, or any other geometric configuration.
- the first plate 1 , capillary structure 2 and support structure 3 are tightly connected by pressing.
- a plurality of grooves 12 can be formed on the first plate 1 cooperatively positioned to the support bodies 31 .
- the ends of the support bodies 31 that immediately contact the first plate 1 have a diameter D larger than the diameter d of the groove 12 .
- the support bodies 31 are tightly connected with the first plate 1 by mating with the grooves 12 . That is to say, the support bodies 31 are fittingly plugged into the grooves 12 of the first plate 1 .
- the capillary structure 2 is fixed between the first plate 1 and the support bodies 31 by clamping and the first plate 1 , capillary structure 2 and support bodies 31 are closely stacked on one another.
- a plurality of protrusions (not shown) is formed on the first plate 1 .
- the end of each support body 31 is formed with a depression (not shown) configured to mate with the protrusions.
- the depression portion of the support bodies 31 engages with the protrusions of the first plate 1 .
- the mating configuration among the first plate 1 , capillary structure 2 and support structure 3 may vary according to preferable design.
- the plate-type heat pipe may include a second plate 4 .
- a chamber 41 is defined between the first and second plates 1 , 4 .
- the chamber 41 is vacuumed and fluid fills therein (not shown).
- the first plate, capillary structure and support structure are tightly connected by pressing. Hence, brazing or diffusion bonding among the first plate, capillary structure and support structure is not required in the manufacturing process.
- the method of manufacturing the plate-type heat pipe reduces time and labor and brings down the cost, thus increasing product competiveness.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A plate-type heat pipe includes a first plate, a capillary structure and a support structure. The first plate, the capillary structure and the support structure are arranged in sequence, and the first plate, the capillary structure and the support structure are tightly connected by pressing. A method of manufacturing a plate-type heat pipe is also discussed.
Description
- 1. Field of the Invention
- The instant disclosure relates to a plate-type heat pipe; in particular, to a plate-type heat pipe using two-phase flow recirculation for heat transferring and a method of manufacturing the same.
- 2. Description of Related Art
- The trend of technology development is ever complicating, for example, the integrated circuits or laptop. The shrinking volume of electronic products is accompanied by the issue of heat dissipation. During operation, the heat generated by an electronic device is considerably high. The electronic components are therefore equipped with suitable heat sink or device to increase the rate of heat dissipation. Especially to the central processing unit, the air-cooled system is replaced by liquid-cooled system for efficiently maintaining optimal operation temperature.
- Additionally, heat pipe is implemented in heat dissipation design. The plate-type heat pipe is a variation of tubular heat pipe. The two structures employ the same heat dissipation mechanism, which transfers heat by two-phase flow recirculation.
- However, the conventional plate-type heat pipe includes a plate, capillaries and a support structure. After disposing the capillaries and the support structure onto the plate, further brazing or diffusion bonding is required to secure the capillaries and support structure on the plate. The fabrication process consumes considerable time and labor and the manufacturing cost remains high. Thus, the conventional heat pipe is not competitive in the current market.
- To address the above issues, the inventor strives via associated experience and research to present the instant disclosure, which can effectively improve the limitation described above.
- The instant disclosure provides a plate-type heat pipe and a method of manufacturing the same. The manufacturing process is simplified to save time and labor and therefore reduces cost for better product competiveness.
- According to one embodiment of the instant disclosure, the plate-type heat pipe includes a first plate, a capillary structure and a support structure. The first plate, capillary structure and support structure are arranged in sequence and tightly connected by pressing.
- The instant disclosure also provides a method of manufacturing the plate-type heat pipe. The method includes firstly providing a first plate, a capillary structure and a support structure. The first plate, capillary structure and support structure are arranged in sequence and pressed to allow tight connection.
- The plate-type heat pipe is formed by pressing the first plate, capillary structure and support structure and therefore brazing or diffusion bonding can be omitted in the manufacturing process. This fabrication method simplifies the overall process, reduces time and labor and decreases cost to enhance product competiveness.
- In order to further understand the instant disclosure, the following embodiments are provided along with illustrations to facilitate the appreciation of the instant disclosure; however, the appended drawings are merely provided for reference and illustration, without any intention to be used for limiting the scope of the instant disclosure.
-
FIG. 1 is a flow chart showing a method of manufacturing a plate-type heat pipe of the instant disclosure. -
FIG. 2 is a schematic diagram (I) showing a method of manufacturing a plate-type heat pipe of the instant disclosure. -
FIG. 3 is a schematic diagram (II) showing a method of manufacturing a plate-type heat pipe of the instant disclosure. -
FIG. 4 is a schematic diagram (III) showing a method of manufacturing a plate-type heat pipe of the instant disclosure. -
FIG. 5 is a schematic diagram (IV) showing a method of manufacturing a plate-type heat pipe of the instant disclosure. -
FIG. 6 is a cross-sectional view of a plate-type heat pipe of the instant disclosure. - The aforementioned illustrations and following detailed descriptions are exemplary for the purpose of further explaining the scope of the instant disclosure. Other objectives and advantages related to the instant disclosure will be illustrated in the subsequent descriptions and appended drawings.
- Referring to
FIGS. 1 and 2 , the instant disclosure provides a method of manufacturing a plate-type heat pipe. The details are further elaborated herein. - Step S110, firstly, a
first plate 1, acapillary structure 2 and asupport structure 3 are provided. Thefirst plate 1,capillary structure 2 andsupport structure 3 superimpose on one another. Specifically, thefirst plate 1,capillary structure 2 andsupport structure 3 are disposed successively in that order. - The
first plate 1 may be made of copper, aluminum or other metallic materials exhibiting desired heat conductivity. The shape of thefirst plate 1 is not restricted by the instant embodiment. It is worth noting that thefirst plate 1 can be the bottom or the top of the plate-type heat pipe. The face that immediately contacts thecapillary structure 2 of thefirst plate 1 may be formed with acapillary tissue 11. Thecapillary tissue 11 can be grooves or formed by powder sintering or both. - The
capillary structure 2 may be grid, fiber, or formed by powder sintering or the combination thereof. In the instant embodiment, thecapillary structure 2 is a grid (for example, copper grid). - The
support structure 3 can be made of copper, aluminum or other metallic materials exhibiting desired heat conductivity. The configuration of thesupport structure 3 is not limited by the instant embodiment. In the instant embodiment, thesupport structure 3 has a plurality ofsupport bodies 31. Thesupport bodies 31 may be cylindrical, polygonal, rectangular, or the like and the instant disclosure is not limited thereto. In the instant embodiment, thesupport bodies 31 are cylindrical pillars having the same diameter overall, i.e., each column has the same dimension. The support bodies may vary in size in another embodiment whereas uniform dimension simplifies the manufacturing process. - Step S120, subsequently, the
first plate 1,capillary structure 2 andsupport structure 3 are pressed. The pressing allows thefirst plate 1,capillary structure 2 andsupport structure 3 for tight connection to build the main scaffold of the plate-type heat pipe. - As shown in
FIGS. 3 and 4 , a mold 5 is fixed on the press machine (not shown) for conducting the pressing process. - Additionally, before the pressing process, a plurality of
grooves 12 can be formed on thefirst plate 1 cooperatively positioned to thesupport bodies 31. The end of thesupport bodies 31 that immediately contacts thefirst plate 1 has a diameter D larger than the diameter d of thegroove 12. When pressing thefirst plate 1,capillary structure 2 andsupport structure 3, thesupport bodies 31 are tightly connected with thefirst plate 1 by mating with thegrooves 12. Thecapillary structure 2 is fixed between thefirst plate 1 and thesupport bodies 31 by clamping and each layer is closely stacked on one another (as shown inFIGS. 5 and 6 ). - Step S130, additionally, a second plate 4 is provided. The second plate 4 may be made of copper, aluminum or other metallic materials exhibiting desired heat conductivity. The second plate 4 is configured to coincide with the
first plate 1. It is worth noting the second plate 4 can be the bottom or the top of the plate-type heat pipe. The connection of thefirst plate 1 and second plate 4 results in a completed plate-type heat pipe. Thefirst plate 1 and second plate 4 can be connected by brazing, diffusion bonding or the like to define achamber 41 between the first andsecond plates 1, 4. Thechamber 41 is vacuumed and fluid fills therein (not shown). Different phase conversion of the fluid can rapidly and evenly transfer the heat generated by electronic components. - Referring to
FIGS. 2 , 5 and 6, the instant disclosure provides a plate-type heat pipe. The plate-type heat pipe includes afirst plate 1, acapillary structure 2 and asupport structure 3. Thecapillary structure 2 can be grid, fiber, or formed by powder sintering or the combination thereof. Thefirst plate 1,capillary structure 2 andsupport structure 3 are stacked in sequence. One face of thefirst plate 1 that immediately contacts thecapillary structure 2 may be formed with acapillary tissue 11. Thesupport structure 3 includes a plurality ofsupport bodies 31 being cylindrical, polygonal, rectangular, or any other geometric configuration. Thefirst plate 1,capillary structure 2 andsupport structure 3 are tightly connected by pressing. - A plurality of
grooves 12 can be formed on thefirst plate 1 cooperatively positioned to thesupport bodies 31. The ends of thesupport bodies 31 that immediately contact thefirst plate 1, have a diameter D larger than the diameter d of thegroove 12. When thefirst plate 1,capillary structure 2 andsupport structure 3 are pressed, thesupport bodies 31 are tightly connected with thefirst plate 1 by mating with thegrooves 12. That is to say, thesupport bodies 31 are fittingly plugged into thegrooves 12 of thefirst plate 1. Thecapillary structure 2 is fixed between thefirst plate 1 and thesupport bodies 31 by clamping and thefirst plate 1,capillary structure 2 andsupport bodies 31 are closely stacked on one another. - In another embodiment of the instant disclosure, a plurality of protrusions (not shown) is formed on the
first plate 1. The end of eachsupport body 31 is formed with a depression (not shown) configured to mate with the protrusions. By pressing thefirst plate 1,capillary structure 2 and thesupport structure 3, the depression portion of thesupport bodies 31 engages with the protrusions of thefirst plate 1. In other words, the mating configuration among thefirst plate 1,capillary structure 2 andsupport structure 3 may vary according to preferable design. - In addition, the plate-type heat pipe may include a second plate 4. Upon connection of the
first plate 1 and second plate 4, achamber 41 is defined between the first andsecond plates 1, 4. Thechamber 41 is vacuumed and fluid fills therein (not shown). - In summary, the first plate, capillary structure and support structure are tightly connected by pressing. Hence, brazing or diffusion bonding among the first plate, capillary structure and support structure is not required in the manufacturing process. The method of manufacturing the plate-type heat pipe reduces time and labor and brings down the cost, thus increasing product competiveness.
- The descriptions illustrated supra set forth simply the preferred embodiments of the instant disclosure; however, the characteristics of the instant disclosure are by no means restricted thereto. All changes, alternations, or modifications conveniently considered by those skilled in the art are deemed to be encompassed within the scope of the instant disclosure delineated by the following claims.
Claims (14)
1. A plate-type heat pipe, comprising:
a first plate;
a capillary structure; and
a support structure;
wherein the first plate, the capillary structure and the support structure are arranged in sequence, and the first plate, the capillary structure and the support structure are tightly connected by pressing.
2. The plate-type heat pipe according to claim 1 , wherein the support structure includes a plurality of support bodies, and the ends of the support bodies are tightly connected to the first plate.
3. The plate-type heat pipe according to claim 2 , wherein the first plate has a plurality of grooves corresponding to the support bodies, and one end of each of the support bodies fittingly mates with the corresponding groove of the first plate.
4. The plate-type heat pipe according to claim 2 , wherein the capillary structure is fixed between the first plate and the support structure by clamping.
5. The plate-type heat pipe according to claim 1 , wherein the first plate has a capillary tissue formed on one face thereof to immediately contact the capillary structure.
6. The plate-type heat pipe according to claim 1 , wherein the capillary structure is formed by grid, fiber, powder sintering or a combination thereof.
7. The plate-type heat pipe according to claim 1 , further comprising: a second plate correspondingly connected to the first plate to define a chamber, wherein the chamber is vacuumed and filled with fluid.
8. A method of manufacturing a plate-type heat pipe, comprising:
providing a first plate, a capillary structure and a support structure, wherein the first plate, the capillary structure and the support structure are arranged in sequence; and
pressing the first plate, the capillary structure and the support structure for tightly connecting the first plate, the capillary structure and the support structure.
9. The method according to claim 8 , wherein the support structure includes a plurality of support bodies, and the ends of the support bodies are tightly connected to the first plate.
10. The method according to claim 9 , wherein the first plate has a plurality of grooves corresponding to the support bodies, and one end of each of the support bodies fittingly mates with the corresponding groove of the first plate.
11. The method according to claim 9 , wherein the capillary structure is fixed between the first plate and the support structure by clamping.
12. The method according to claim 8 , wherein the first plate has a capillary tissue formed on one face thereof to immediately contact the capillary structure.
13. The method according to claim 8 , wherein the capillary structure is formed by grid, fiber, powder sintering or a combination thereof.
14. The method according to claim 8 , further comprising: a second plate correspondingly connected to the first plate to define a chamber, wherein the chamber is vacuumed and filled with fluid.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US13/900,837 US20140345831A1 (en) | 2013-05-23 | 2013-05-23 | Plate-type heat pipe and method of manufacturing the same |
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Application Number | Priority Date | Filing Date | Title |
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US13/900,837 US20140345831A1 (en) | 2013-05-23 | 2013-05-23 | Plate-type heat pipe and method of manufacturing the same |
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US20140345831A1 true US20140345831A1 (en) | 2014-11-27 |
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US13/900,837 Abandoned US20140345831A1 (en) | 2013-05-23 | 2013-05-23 | Plate-type heat pipe and method of manufacturing the same |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105513972A (en) * | 2015-12-07 | 2016-04-20 | 苏州明和行新材料科技有限公司 | Method and system for preparing capillary wick through diffusion welding |
JP2017106672A (en) * | 2015-12-10 | 2017-06-15 | Leading Edge Associates株式会社 | Heat radiator and manufacturing method of heat radiator |
US10371458B2 (en) * | 2016-04-07 | 2019-08-06 | Cooler Master Co., Ltd. | Thermal conducting structure |
EP3671095A1 (en) * | 2018-12-21 | 2020-06-24 | Cooler Master Co., Ltd. | Heat dissipation device having irregular shape |
US11112186B2 (en) * | 2019-04-18 | 2021-09-07 | Furukawa Electric Co., Ltd. | Heat pipe heatsink with internal structural support plate |
US11340022B2 (en) * | 2017-04-28 | 2022-05-24 | Murata Manufacturing Co., Ltd. | Vapor chamber having pillars with decreasing cross-sectional area |
US20230152043A1 (en) * | 2021-01-06 | 2023-05-18 | Asia Vital Components Co., Ltd. | Vapor chamber structure |
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US3338600A (en) * | 1966-07-29 | 1967-08-29 | Wahl Clipper Corp | Bushing for a pressed fit connection |
US4461343A (en) * | 1982-01-28 | 1984-07-24 | Mcdonnell Douglas Corporation | Plated heat pipe |
US6082443A (en) * | 1997-02-13 | 2000-07-04 | The Furukawa Electric Co., Ltd. | Cooling device with heat pipe |
US8074706B2 (en) * | 2006-04-21 | 2011-12-13 | Taiwan Microloops Corp. | Heat spreader with composite micro-structure |
-
2013
- 2013-05-23 US US13/900,837 patent/US20140345831A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3338600A (en) * | 1966-07-29 | 1967-08-29 | Wahl Clipper Corp | Bushing for a pressed fit connection |
US4461343A (en) * | 1982-01-28 | 1984-07-24 | Mcdonnell Douglas Corporation | Plated heat pipe |
US6082443A (en) * | 1997-02-13 | 2000-07-04 | The Furukawa Electric Co., Ltd. | Cooling device with heat pipe |
US8074706B2 (en) * | 2006-04-21 | 2011-12-13 | Taiwan Microloops Corp. | Heat spreader with composite micro-structure |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105513972A (en) * | 2015-12-07 | 2016-04-20 | 苏州明和行新材料科技有限公司 | Method and system for preparing capillary wick through diffusion welding |
JP2017106672A (en) * | 2015-12-10 | 2017-06-15 | Leading Edge Associates株式会社 | Heat radiator and manufacturing method of heat radiator |
US10371458B2 (en) * | 2016-04-07 | 2019-08-06 | Cooler Master Co., Ltd. | Thermal conducting structure |
US10935326B2 (en) * | 2016-04-07 | 2021-03-02 | Cooler Master Co., Ltd. | Thermal conducting structure |
US11313628B2 (en) * | 2016-04-07 | 2022-04-26 | Cooler Master Co., Ltd. | Thermal conducting structure |
US11340022B2 (en) * | 2017-04-28 | 2022-05-24 | Murata Manufacturing Co., Ltd. | Vapor chamber having pillars with decreasing cross-sectional area |
EP3671095A1 (en) * | 2018-12-21 | 2020-06-24 | Cooler Master Co., Ltd. | Heat dissipation device having irregular shape |
US11112186B2 (en) * | 2019-04-18 | 2021-09-07 | Furukawa Electric Co., Ltd. | Heat pipe heatsink with internal structural support plate |
US20230152043A1 (en) * | 2021-01-06 | 2023-05-18 | Asia Vital Components Co., Ltd. | Vapor chamber structure |
US11761710B2 (en) * | 2021-01-06 | 2023-09-19 | Asia Vital Components Co., Ltd. | Vapor chamber structure |
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