US20140340864A1 - Electronic device and electromagnetic interference shielding structure - Google Patents
Electronic device and electromagnetic interference shielding structure Download PDFInfo
- Publication number
- US20140340864A1 US20140340864A1 US13/927,126 US201313927126A US2014340864A1 US 20140340864 A1 US20140340864 A1 US 20140340864A1 US 201313927126 A US201313927126 A US 201313927126A US 2014340864 A1 US2014340864 A1 US 2014340864A1
- Authority
- US
- United States
- Prior art keywords
- spring clip
- main chassis
- conductive
- cage
- shielding structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0018—Casings with provisions to reduce aperture leakages in walls, e.g. terminals, connectors, cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6582—Shield structure with resilient means for engaging mating connector
- H01R13/6583—Shield structure with resilient means for engaging mating connector with separate conductive resilient members between mating shield members
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
Abstract
An electronic device of the invention includes a main chassis, an electronic module, a cage and an EMI shielding structure. The main chassis has an opening. The cage is assembled to the main chassis and covers the opening. The electronic module is disposed in the cage. The EMI shielding structure includes a conductive frame and at least one first conductive spring clip. The conductive frame is assembled to the cage and electrically connected to the electronic module. The first conductive spring clip is connected to the conductive frame and contacts the main chassis, in which an electromagnetic wave emitted by the electronic module sequentially passes through the conductive frame and the first conductive spring clip to be transmitted to the main chassis.
Description
- This application claims the priority benefit of China application serial no. 201310184990.4, filed on May 17, 2013. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
- 1. Field of the Invention
- The invention generally relates to an electronic device and an electromagnetic interference (EMI) shielding structure thereof, and more particularly, to an electronic device and an electromagnetic interference shielding structure with conductive spring clips.
- 2. Description of Related Art
- With the advances in technology, the PC has been widely used in the working and living. The common PC currently includes desktop computer and notebook computer. Most of the PCs have connectors to connect an external expansion device or a data storage device.
- In more details, a chassis of an electronic device such as a PC has an hole for exposing the connector and for the external device to plug in. At the time, the electromagnetic wave emitted from the connector of the electronic device or other electronic components may go outside through the hole on the chassis to cause EMI. Thus, how to use a simple conduction path to guide the electromagnetic wave emitted from the connector or other electronic components to the main chassis of the electronic device to achieve good EMI-shielding effect has become an important issue for designing an electronic device today.
- Accordingly, the invention is directed to an electronic device, wherein the EMI shielding structure has good EMI-shielding effect.
- The invention is also directed to an EMI shielding structure with good EMI-shielding effect.
- An electronic device of the invention includes a main chassis, an electronic module, a cage and an EMI shielding structure. The main chassis has an opening. The cage is assembled to the main chassis and covers the opening. The electronic module is disposed in the cage. The EMI shielding structure includes a conductive frame and at least one first conductive spring clip. The conductive frame is assembled to the cage and electrically connected to the electronic module. The first conductive spring clip is connected to the conductive frame and contacts the main chassis, in which an electromagnetic wave emitted by the electronic module sequentially passes through the conductive frame and the first conductive spring clip to be transmitted to the main chassis.
- An EMI shielding structure of the invention is suitable for an electronic device, wherein the electronic device includes a main chassis, an electronic module and a cage, the cage is assembled to the main chassis and covers an opening of the main chassis, and the electronic module is disposed in the cage. The EMI shielding structure includes a conductive frame and at least one first conductive spring clip. The conductive frame is assembled to the cage and electrically connected to the electronic module. The first conductive spring clip is connected to the conductive frame and contacts the main chassis. An electromagnetic wave emitted by the electronic module sequentially passes through the conductive frame and the first conductive spring clip to be transmitted to the main chassis.
- In an embodiment of the invention, the electronic module includes a circuit board and at least one connector, and the connector is disposed on the circuit board and electrically connected to the conductive frame.
- In an embodiment of the invention, the cage has at least one hole and the hole exposes the connector.
- In an embodiment of the invention, the EMI shielding structure further includes at least one second conductive spring clip, the second conductive spring clip is connected to the conductive frame and contacts the electronic module, the electromagnetic wave emitted by the electronic module sequentially passes through the second conductive spring clip, the conductive frame and the first conductive spring clip to be transmitted to the main chassis.
- In an embodiment of the invention, the conductive frame, the first conductive spring clip and the second conductive spring clip are integrally formed.
- In an embodiment of the invention, the main chassis has a bottom wall, the cage has a top wall, the top wall is located between the bottom wall and the EMI shielding structure and has at least one slot, and the first conductive spring clip goes through the slot to contact the bottom wall of the main chassis.
- Based on the depiction above, the EMI shielding structure of the invention contacts the main chassis of the electronic device through the first conductive spring clip thereof, so that the conductive frame can be electrically connected to the main chassis without relying on the cage. Thus, after the electromagnetic wave emitted by the electronic module reaches the conductive frame, the electromagnetic wave can be directly transmitted to the main chassis through the first conductive spring clip, not via the cage for conducting. In this way, even the cage is made of a material with lower conductivity, a good conductive efficiency still can be kept between the EMI shielding structure and the main chassis, which ensures the electronic device to achieve the EMI-shielding effect.
- Other objectives, features and advantages of the present invention will be further understood from the further technological features disclosed by the embodiments of the present invention wherein there are shown and described preferred embodiments of this invention, simply by way of illustration of modes best suited to carry out the invention.
-
FIG. 1 is a three-dimensional diagram of an electronic device according to an embodiment of the invention. -
FIG. 2 is an exploded diagram of the electronic device ofFIG. 1 . -
FIG. 3 is a partial cross-sectional diagram of the electronic device ofFIG. 1 . -
FIG. 4 is a three-dimensional diagram of the cage and the EMI shielding structure inFIG. 2 . -
FIG. 5 is a diagram in another view of angle of the cage and the EMI shielding structure ofFIG. 4 . -
FIG. 1 is a three-dimensional diagram of an electronic device according to an embodiment of the invention andFIG. 2 is an exploded diagram of the electronic device ofFIG. 1 . Referring toFIGS. 1 and 2 , anelectronic device 100 of the embodiment includes amain chassis 110, anelectronic module 120, acage 130 and anEMI shielding structure 140. Themain chassis 110 has anopening 110 a, thecage 130 is assembled to themain chassis 110 and covers theopening 110 a of themain chassis 110, and thecage 130 has at least one hole 132 (multiple ones are shown inFIG. 2 ). Theelectronic module 120 is disposed in thecage 130 and corresponding to thehole 132. -
FIG. 3 is a partial cross-sectional diagram of the electronic device ofFIG. 1 . Referring toFIGS. 2 and 3 , theEMI shielding structure 140 of the embodiment includes aconductive frame 142 and at least one connector 124 (multiple ones are shown inFIG. 2 ). Theconnector 124 is disposed on thecircuit board 122 and electrically connected to theconductive frame 142. Thehole 132 of thecage 130 is configured to expose theconnector 124. Theconductive frame 142 is assembled to thecage 130 and electrically connected to themain chassis 110, so that the electromagnetic wave emitted from theconnector 124 is transmitted to themain chassis 110 via theconductive frame 142. - In more details, the
EMI shielding structure 140 includes at least one first conductive spring clip 144 (multiple ones are shown inFIG. 2 ) and at least one second conductive spring clip 146 (multiple ones are shown inFIG. 2 ). The firstconductive spring clip 144 is connected to theconductive frame 142 and contacts themain chassis 110 so that theconductive frame 142 is electrically connected to themain chassis 110. The secondconductive spring clip 146 is connected to theconductive frame 142 and contacts theconnector 124 of theelectronic module 120 so that theconductive frame 142 is electrically connected to theconnector 124. The electromagnetic wave emitted from theconnector 124 of theelectronic module 120 sequentially passes through the secondconductive spring clip 146, theconductive frame 142 and the firstconductive spring clip 144 to be transmitted to themain chassis 110. - Under the above-mentioned layout, since the
EMI shielding structure 140 contacts themain chassis 110 of theelectronic device 100 through the firstconductive spring clip 144 thereof, theconductive frame 142 is able to electrically connect themain chassis 110 without relying on thecage 130. Thus, after the electromagnetic wave emitted from theconnector 124 of theelectronic module 120 reaches theconductive frame 142 via the secondconductive spring clip 146, the electromagnetic wave can be directly transmitted to themain chassis 110 through the firstconductive spring clip 144, not via thecage 130 for conducting. In this way, even the material of thecage 130 is one with lower conductivity (for example, galvanized steel plate), a good conductive efficiency between theEMI shielding structure 140 and themain chassis 110 is still kept, so that theelectronic device 100 can reliably have EMI-shielding effect, and the electromagnetic wave emitted from theelectronic module 120 can be avoided from reaching the outside via thehole 132 of thecage 130 or other gaps to cause the EMI. - In the embodiment, the material of the
EMI shielding structure 140 is, for example, stainless steel with good conductivity so as to effectively transmit the electromagnetic wave come from theelectronic module 120 to themain chassis 110. In other embodiments, the material of theEMI shielding structure 140 can be other appropriate materials, which the invention is not limited to. - The
electronic device 100 in the embodiment is, for example, a host of a desktop computer, while in other embodiments, it can be an electronic device of other types, which the invention is not limited to. In addition to shield the electromagnetic wave come from theconnector 124, theEMI shielding structure 140 in other embodiments can be used to shield the electromagnetic wave come from the electronic components of other types, which the invention is not limited to. -
FIG. 4 is a three-dimensional diagram of the cage and the EMI shielding structure inFIG. 2 . Referring toFIGS. 2-4 , themain chassis 110 of the embodiment has abottom wall 110 b, thecage 130 has atop wall 130 a, and thetop wall 130 a is located between thebottom wall 110 b and theEMI shielding structure 140 and has at least one slot 134 (multiple ones are shown inFIGS. 2 and 4 ). The firstconductive spring clip 144 of theEMI shielding structure 140 goes through theslot 134 of thetop wall 130 a of thecage 130 to contact thebottom wall 110 b of themain chassis 110, which makes theEMI shielding structure 140 able to be electrically connected to themain chassis 110. -
FIG. 5 is a diagram in another view of angle of the cage and the EMI shielding structure ofFIG. 4 . Referring toFIGS. 2 and 5 , in the embodiment, theconductive frame 142 of theEMI shielding structure 140 has a plurality ofriveting holes 142 a and is riveted to thecage 130 through theriveting holes 142 a. Theconductive frame 142, the firstconductive spring clip 144 and the secondconductive spring clip 146 are, for example, integrally formed to simplify the fabrication and the assembling of theEMI shielding structure 140. - In summary, the EMI shielding structure of the invention contacts the main chassis of the electronic device through the first conductive spring clip thereof, so that the conductive frame can be electrically connected to the main chassis without relying on the cage. Thus, after the electromagnetic wave emitted by the connector of the electronic module reaches the conductive frame via the second conductive spring clip, the electromagnetic wave can be directly transmitted to the main chassis through the first conductive spring clip, not via the cage for conducting. In this way, even the cage is made of a material with lower conductivity, a good conductive efficiency still can be kept between the EMI shielding structure and the main chassis, so that the electronic device can reliably have EMI-shielding effect, and the electromagnetic wave emitted from the electronic module can be avoided from reaching the outside via the hole of the cage or other gaps cause the EMI.
- It will be apparent to those skilled in the art that the descriptions above are several preferred embodiments of the invention only, which does not limit the implementing range of the invention. Various modifications and variations can be made to the structure of the invention without departing from the scope or spirit of the invention. The claim scope of the invention is defined by the claims hereinafter.
Claims (12)
1. An electronic device, comprising:
a main chassis, having an opening;
a cage, assembled to the main chassis and covering the opening;
an electronic module, disposed in the cage; and
an electromagnetic interference shielding structure, comprising:
a conductive frame, assembled to the cage and electrically connected to the electronic module; and
at least one first conductive spring clip, connected to the conductive frame and contacting the main chassis, wherein an electromagnetic wave emitted by the electronic module sequentially passes through the conductive frame and the first conductive spring clip to be transmitted to the main chassis.
2. The electronic device as claimed in claim 1 , wherein the electronic module comprises a circuit board and at least one connector, and the connector is disposed on the circuit board and electrically connected to the conductive frame.
3. The electronic device as claimed in claim 2 , wherein the cage has at least one hole and the hole exposes the connector.
4. The electronic device as claimed in claim 1 , wherein the electromagnetic interference shielding structure further comprises at least one second conductive spring clip, the second conductive spring clip is connected to the conductive frame and contacts the electronic module, the electromagnetic wave emitted by the electronic module sequentially passes through the second conductive spring clip, the conductive frame and the first conductive spring clip to be transmitted to the main chassis.
5. The electronic device as claimed in claim 4 , wherein the conductive frame, the first conductive spring clip and the second conductive spring clip are integrally formed.
6. The electronic device as claimed in claim 1 , wherein the main chassis has a bottom wall, the cage has a top wall, the top wall is located between the bottom wall and the electromagnetic interference shielding structure and has at least one slot, and the first conductive spring clip goes through the slot to contact the bottom wall of the main chassis.
7. An electromagnetic interference shielding structure, suitable for an electronic device, wherein the electronic device comprises a main chassis, an electronic module and a cage, the cage is assembled to the main chassis and covers an opening of the main chassis, the electronic module is disposed in the cage, and the electromagnetic interference shielding structure comprises:
a conductive frame, assembled to the cage and electrically connected to the electronic module; and
at least one first conductive spring clip, connected to the conductive frame and contacting the main chassis, wherein an electromagnetic wave emitted by the electronic module sequentially passes through the conductive frame and the first conductive spring clip to be transmitted to the main chassis.
8. The electromagnetic interference shielding structure as claimed in claim 7 , wherein the electronic module comprises a circuit board and at least one connector, and the connector is disposed on the circuit board and electrically connected to the conductive frame.
9. The electromagnetic interference shielding structure as claimed in claim 8 , wherein the cage has at least one hole and the hole exposes the connector.
10. The electromagnetic interference shielding structure as claimed in claim 7 , further comprising at least one second conductive spring clip, wherein the second conductive spring clip is connected to the conductive frame and contacts the electronic module, the electromagnetic wave emitted by the electronic module sequentially passes through the second conductive spring clip, the conductive frame and the first conductive spring clip to be transmitted to the main chassis.
11. The electromagnetic interference shielding structure as claimed in claim 10 , wherein the conductive frame, the first conductive spring clip and the second conductive spring clip are integrally formed.
12. The electromagnetic interference shielding structure as claimed in claim 7 , wherein the main chassis has a bottom wall, the cage has a top wall, the top wall is located between the bottom wall and the electromagnetic interference shielding structure and has at least one slot, and the first conductive spring clip goes through the slot to contact the bottom wall of the main chassis.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310184990.4A CN104168749B (en) | 2013-05-17 | 2013-05-17 | Electronic device and electromagnetic interference shield structure |
CN201310184990.4 | 2013-05-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20140340864A1 true US20140340864A1 (en) | 2014-11-20 |
Family
ID=51895626
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/927,126 Abandoned US20140340864A1 (en) | 2013-05-17 | 2013-06-26 | Electronic device and electromagnetic interference shielding structure |
Country Status (3)
Country | Link |
---|---|
US (1) | US20140340864A1 (en) |
CN (1) | CN104168749B (en) |
TW (1) | TWI520677B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150062857A1 (en) * | 2013-09-05 | 2015-03-05 | Wistron Corporation | Electronic device and covering structure |
WO2017123194A1 (en) * | 2016-01-11 | 2017-07-20 | Hewlett Packard Enterprise Development Lp | Containing electro-magnetic inteference (emi) using a number of low-profile spring devices |
JP2017228746A (en) * | 2016-06-24 | 2017-12-28 | 京セラドキュメントソリューションズ株式会社 | Ground plate fitting structure, ground plate, and image forming apparatus |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105472873A (en) * | 2015-12-28 | 2016-04-06 | 联想(北京)有限公司 | Resonant component and electronic equipment |
TW201929636A (en) * | 2017-12-12 | 2019-07-16 | 台揚科技股份有限公司 | Electronic apparatus with integral housing |
CN113133293B (en) * | 2020-01-15 | 2023-10-13 | 技嘉科技股份有限公司 | Floating type shielding mechanism and circuit board module |
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2013
- 2013-05-17 CN CN201310184990.4A patent/CN104168749B/en active Active
- 2013-06-17 TW TW102121412A patent/TWI520677B/en active
- 2013-06-26 US US13/927,126 patent/US20140340864A1/en not_active Abandoned
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US6278617B1 (en) * | 1998-10-06 | 2001-08-21 | Hon Hai Precision Ind. Co., Ltd. | Shield for electronic device |
US6940731B2 (en) * | 2002-12-19 | 2005-09-06 | Gateway Inc. | Integrated drive panel for a computer case |
US20070284141A1 (en) * | 2003-09-18 | 2007-12-13 | Sosnowski Anthony M | Lance-tab mounting method |
US7111994B2 (en) * | 2004-03-24 | 2006-09-26 | Avago Technologies Fiber Ip (Singapore) Ptd. Ltd. | Integral insert molded fiber optic transceiver electromagnetic interference shield |
US20050225958A1 (en) * | 2004-04-08 | 2005-10-13 | Lewis Jeffrey M | Spring fingers with end extensions |
US20070212942A1 (en) * | 2005-12-28 | 2007-09-13 | Molex Incorporated | EMI shroud with bidirectional contact members |
US7692932B2 (en) * | 2006-03-17 | 2010-04-06 | Flextronics Ap, Llc | Resilient grounding clip in electronics chassis |
US20080011510A1 (en) * | 2006-07-12 | 2008-01-17 | General Electric Company | Hybrid faceplate having reduced EMI emissions |
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US8854835B2 (en) * | 2011-06-27 | 2014-10-07 | Crestron Electronics Inc. | Hi-definition multimedia interface shield with fingers |
US8803005B2 (en) * | 2012-04-20 | 2014-08-12 | General Electric Company | Electromagnetic interference blocking cabinet with integrated input/output panel |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150062857A1 (en) * | 2013-09-05 | 2015-03-05 | Wistron Corporation | Electronic device and covering structure |
US9552847B2 (en) * | 2013-09-05 | 2017-01-24 | Wistron Corporation | Electronic device and covering structure |
WO2017123194A1 (en) * | 2016-01-11 | 2017-07-20 | Hewlett Packard Enterprise Development Lp | Containing electro-magnetic inteference (emi) using a number of low-profile spring devices |
US11026357B2 (en) | 2016-01-11 | 2021-06-01 | Hewlett Packard Enterprise Development Lp | Containing electro-magnetic interference (EMI) using a number of low-profile spring devices |
JP2017228746A (en) * | 2016-06-24 | 2017-12-28 | 京セラドキュメントソリューションズ株式会社 | Ground plate fitting structure, ground plate, and image forming apparatus |
Also Published As
Publication number | Publication date |
---|---|
CN104168749B (en) | 2017-03-22 |
TW201446125A (en) | 2014-12-01 |
TWI520677B (en) | 2016-02-01 |
CN104168749A (en) | 2014-11-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: WISTRON CORPORATION, TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WU, LONG-HUA;HSIEH, TE-HSIUNG;REEL/FRAME:030716/0798 Effective date: 20130625 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |