US20140131013A1 - Low-profile heat pipe - Google Patents

Low-profile heat pipe Download PDF

Info

Publication number
US20140131013A1
US20140131013A1 US13/678,527 US201213678527A US2014131013A1 US 20140131013 A1 US20140131013 A1 US 20140131013A1 US 201213678527 A US201213678527 A US 201213678527A US 2014131013 A1 US2014131013 A1 US 2014131013A1
Authority
US
United States
Prior art keywords
pipe component
pipe
low
heat pipe
profile heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/678,527
Inventor
Chin-Hsing Horng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US13/678,527 priority Critical patent/US20140131013A1/en
Publication of US20140131013A1 publication Critical patent/US20140131013A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular

Definitions

  • the present invention relates to heat pipe technology and more particularly, to a low-profile heat pipe that is formed of two flat pipe components and has low profile and uniform heat transfer characteristics.
  • a conventional flat heat pipe may be made by flatting a round heat pipe into a flat condition, or directly processing a flat tube into a flat heat pipe. Further, in order to comply with the arrangement of electronic components in an electronic product, or in order to comply with the demand for space arrangement in an electronic product, a heat pipe may be bent into a particular shape.
  • a heat pipe has a wick structure located at the inner perimeter and made of sintered metal powder, bending a heat pipe into a particular shape can destruct the integrity of the wick structure, lowering the heat transfer performance of the heat pipe. If the pipe is bent into shape prior to the wick sintering process, the sintered wick structure can be uneven. Further, flatting a round heat pipe into a flat condition or bending a round heat pipe into a curved shape can damage the internal wick structure.
  • the present invention has been accomplished under the circumstances in view. It is one object of the present invention to provide a low-profile heat pipe, which has a low profile and can effectively keep the wick structure of each component part thereof intact during fabrication.
  • a heat pipe comprises a flat plate-like first pipe component shaped like a flat plat member and having a wick structure sintered to the inner surface thereof, a flat plate-like second pipe component having a wick structure sintered to the inner surface thereof, an enclosed cavity defined in between the first pipe component and the second pipe component and surrounded by the wick structures of the first and second pipe components, and a working fluid contained in the enclosed cavity.
  • first pipe component comprises at least one first curved potion disposed between two opposite ends thereof;
  • second pipe component comprises at least one second curved portion disposed between two opposite ends thereof corresponding to the at least one first curved portion of the first pipe component.
  • FIG. 1 is an elevational view of a low-profile heat pipe in accordance with a first embodiment of the present invention.
  • FIG. 2 is a sectional view taken along line A-A of FIG. 1 .
  • FIG. 3 is an exploded view of the low-profile heat pipe in accordance with the first embodiment of the present invention.
  • FIG. 4 is a sectional view of a low-profile heat pipe in accordance with a second embodiment of the present invention.
  • FIG. 5 is a sectional view of a low-profile heat pipe in accordance with a third embodiment of the present invention.
  • FIG. 6 is a sectional view of a low-profile heat pipe in accordance with a fourth embodiment of the present invention.
  • FIG. 7 is an elevational view of a low-profile heat pipe in accordance with a fifth embodiment of the present invention.
  • FIG. 8 is an elevational view of a low-profile heat pipe in accordance with a sixth embodiment of the present invention.
  • a low-profile heat pipe 10 in accordance with a first embodiment of the present invention is shown comprising a first pipe component 1 and a second pipe component 2 .
  • the first pipe component 1 is a narrow, elongated, curved, hollow flat member, defining a plurality of curved portions 11 . Further, the first pipe component 1 comprises a base wall 12 , and an endless upright wall 13 perpendicularly extended around the border of the base wall 12 .
  • the second pipe component 2 is a narrow, elongated, curved, hollow flat member configured subject to the configuration of the first pipe component 1 , defining a plurality of curved portions 21 corresponding to the curved portions 11 of the first pipe component 1 . Further, a wick structure 4 is formed on an inner surface of the base wall 12 and endless upright wall 13 of the first pipe component 1 and an inner surface of the second pipe component 2 by sintering.
  • the second pipe component 2 is covered on the first pipe component 1 and sealed thereto by welding or ultrasonic fusion bonding, and thus an enclosed cavity 3 is defined in between the first pipe component 1 and the second pipe component 2 .
  • the cavity 3 is kept in an airtight condition.
  • a working fluid 5 is filled in the space surrounded by the base wall 12 and endless upright wall 13 of the first pipe component 1 .
  • the second pipe component 2 is covered on the first pipe component 1 and sealed thereto air-tightly.
  • FIG. 4 illustrates a low-profile heat pipe in accordance with a second embodiment of the present invention.
  • This second embodiment is substantially similar to the aforesaid first embodiment with the exception that the endless upright wall 13 of the first pipe component 1 defines an inner locating groove 131 in an inner surface thereof at a top side, and the second pipe component 2 is press-fitted into the inner locating groove 131 in flush with the topmost edge of the endless upright wall 13 of the first pipe component 1 .
  • FIG. 5 illustrates a low-profile heat pipe in accordance with a third embodiment of the present invention.
  • This third embodiment is substantially similar to the aforesaid first embodiment with the exception that the endless upright wall 13 defines an outer locating groove 132 in an outer surface thereof at a top side; the second pipe component 2 comprises a base wall 22 , and an endless flange 23 perpendicularly downwardly extended around the border of the base wall 22 and press-fitted into the outer locating groove 132 in flush with the periphery of the endless upright wall 13 of the first pipe component 1 .
  • FIG. 6 illustrates a low-profile heat pipe in accordance with a fourth embodiment of the present invention.
  • This fourth embodiment is substantially similar to the aforesaid first embodiment with the exception that the endless upright wall 13 defines a top locating groove 133 at the topmost edge thereof; the second pipe component 2 comprises a base wall 22 , and a protruding portion flange 24 protruded from the bottom surface thereof and fitted into the top locating groove 133 of the endless upright wall 13 of the first pipe component 1 .
  • FIG. 7 illustrates a low-profile heat pipe in accordance with a fifth embodiment of the present invention. Unlike the curved portions 11 and 21 of the low-profile heat pipe 10 of the foresaid first embodiment that are disposed at the same plane, the curved portions 11 and 21 of the low-profile heat pipe 10 in accordance with this fifth embodiment are disposed at different elevations.
  • FIG. 8 illustrates a low-profile heat pipe in accordance with a sixth embodiment of the present invention.
  • the first pipe component 1 and second pipe component 2 of the low-profile heat pipe 10 in accordance with this sixth embodiment are flat straight members gradually reducing in width from one end to the other end.
  • the invention provides a low-profile heat pipe 10 that has the advantages and features as follows:
  • the low-profile heat pipe 10 is made by sealing a flat, elongated first pipe component 1 and a flat, elongated second pipe component 2 together, having a low profile characteristic.
  • the low-profile heat pipe 10 is made by sealing a flat, elongated first pipe component 1 and a flat, elongated second pipe component 2 together that are configured subject to the desired shape and having a sintered wick structure 4 at the inner surface thereof.
  • the sintered wick structure 4 is kept intact for quick heat transfer in a uniform manner.

Abstract

A low-profile heat pipe includes a flat plate-like first pipe component shaped like a flat plat member and having a wick structure sintered to the inner surface thereof, a flat plate-like second pipe component having a wick structure sintered to the inner surface thereof, an enclosed cavity defined in between the first pipe component and the second pipe component and surrounded by the wick structures of the first and second pipe components, and a working fluid contained in the enclosed cavity.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to heat pipe technology and more particularly, to a low-profile heat pipe that is formed of two flat pipe components and has low profile and uniform heat transfer characteristics.
  • 2. Description of the Related Art
  • Various heat pipe designs have been disclosed for use in electronic products for quick dissipation of waste heat. Following the market trend of the electronic industry toward a low profile design, the vertical installation space in an electronic device for heat pipe must be minimized. Thus, flat heat pipes are created. A conventional flat heat pipe may be made by flatting a round heat pipe into a flat condition, or directly processing a flat tube into a flat heat pipe. Further, in order to comply with the arrangement of electronic components in an electronic product, or in order to comply with the demand for space arrangement in an electronic product, a heat pipe may be bent into a particular shape. Because a heat pipe has a wick structure located at the inner perimeter and made of sintered metal powder, bending a heat pipe into a particular shape can destruct the integrity of the wick structure, lowering the heat transfer performance of the heat pipe. If the pipe is bent into shape prior to the wick sintering process, the sintered wick structure can be uneven. Further, flatting a round heat pipe into a flat condition or bending a round heat pipe into a curved shape can damage the internal wick structure.
    • SUMMARY OF THE INVENTION
  • The present invention has been accomplished under the circumstances in view. It is one object of the present invention to provide a low-profile heat pipe, which has a low profile and can effectively keep the wick structure of each component part thereof intact during fabrication.
  • To achieve this and other objects of the present invention, a heat pipe comprises a flat plate-like first pipe component shaped like a flat plat member and having a wick structure sintered to the inner surface thereof, a flat plate-like second pipe component having a wick structure sintered to the inner surface thereof, an enclosed cavity defined in between the first pipe component and the second pipe component and surrounded by the wick structures of the first and second pipe components, and a working fluid contained in the enclosed cavity.
  • Further, the first pipe component comprises at least one first curved potion disposed between two opposite ends thereof; the second pipe component comprises at least one second curved portion disposed between two opposite ends thereof corresponding to the at least one first curved portion of the first pipe component.
    • DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an elevational view of a low-profile heat pipe in accordance with a first embodiment of the present invention.
  • FIG. 2 is a sectional view taken along line A-A of FIG. 1.
  • FIG. 3 is an exploded view of the low-profile heat pipe in accordance with the first embodiment of the present invention.
  • FIG. 4 is a sectional view of a low-profile heat pipe in accordance with a second embodiment of the present invention.
  • FIG. 5 is a sectional view of a low-profile heat pipe in accordance with a third embodiment of the present invention.
  • FIG. 6 is a sectional view of a low-profile heat pipe in accordance with a fourth embodiment of the present invention.
  • FIG. 7 is an elevational view of a low-profile heat pipe in accordance with a fifth embodiment of the present invention.
  • FIG. 8 is an elevational view of a low-profile heat pipe in accordance with a sixth embodiment of the present invention.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • Referring to FIGS. 1-3, a low-profile heat pipe 10 in accordance with a first embodiment of the present invention is shown comprising a first pipe component 1 and a second pipe component 2.
  • The first pipe component 1 is a narrow, elongated, curved, hollow flat member, defining a plurality of curved portions 11. Further, the first pipe component 1 comprises a base wall 12, and an endless upright wall 13 perpendicularly extended around the border of the base wall 12. The second pipe component 2 is a narrow, elongated, curved, hollow flat member configured subject to the configuration of the first pipe component 1, defining a plurality of curved portions 21 corresponding to the curved portions 11 of the first pipe component 1. Further, a wick structure 4 is formed on an inner surface of the base wall 12 and endless upright wall 13 of the first pipe component 1 and an inner surface of the second pipe component 2 by sintering.
  • The second pipe component 2 is covered on the first pipe component 1 and sealed thereto by welding or ultrasonic fusion bonding, and thus an enclosed cavity 3 is defined in between the first pipe component 1 and the second pipe component 2. After formation of the heat pipe 10, the cavity 3 is kept in an airtight condition. Further, before closing the second pipe component 2 on the first pipe component 1, a working fluid 5 is filled in the space surrounded by the base wall 12 and endless upright wall 13 of the first pipe component 1. After filling of the working fluid 5 in the first pipe component 1, the second pipe component 2 is covered on the first pipe component 1 and sealed thereto air-tightly.
  • FIG. 4 illustrates a low-profile heat pipe in accordance with a second embodiment of the present invention. This second embodiment is substantially similar to the aforesaid first embodiment with the exception that the endless upright wall 13 of the first pipe component 1 defines an inner locating groove 131 in an inner surface thereof at a top side, and the second pipe component 2 is press-fitted into the inner locating groove 131 in flush with the topmost edge of the endless upright wall 13 of the first pipe component 1.
  • FIG. 5 illustrates a low-profile heat pipe in accordance with a third embodiment of the present invention. This third embodiment is substantially similar to the aforesaid first embodiment with the exception that the endless upright wall 13 defines an outer locating groove 132 in an outer surface thereof at a top side; the second pipe component 2 comprises a base wall 22, and an endless flange 23 perpendicularly downwardly extended around the border of the base wall 22 and press-fitted into the outer locating groove 132 in flush with the periphery of the endless upright wall 13 of the first pipe component 1.
  • FIG. 6 illustrates a low-profile heat pipe in accordance with a fourth embodiment of the present invention. This fourth embodiment is substantially similar to the aforesaid first embodiment with the exception that the endless upright wall 13 defines a top locating groove 133 at the topmost edge thereof; the second pipe component 2 comprises a base wall 22, and a protruding portion flange 24 protruded from the bottom surface thereof and fitted into the top locating groove 133 of the endless upright wall 13 of the first pipe component 1.
  • FIG. 7 illustrates a low-profile heat pipe in accordance with a fifth embodiment of the present invention. Unlike the curved portions 11 and 21 of the low-profile heat pipe 10 of the foresaid first embodiment that are disposed at the same plane, the curved portions 11 and 21 of the low-profile heat pipe 10 in accordance with this fifth embodiment are disposed at different elevations.
  • FIG. 8 illustrates a low-profile heat pipe in accordance with a sixth embodiment of the present invention. Unlike the low-profile heat pipe 10 of the foresaid first embodiment that has a uniform width, the first pipe component 1 and second pipe component 2 of the low-profile heat pipe 10 in accordance with this sixth embodiment are flat straight members gradually reducing in width from one end to the other end.
  • In conclusion, the invention provides a low-profile heat pipe 10 that has the advantages and features as follows:
  • 1. The low-profile heat pipe 10 is made by sealing a flat, elongated first pipe component 1 and a flat, elongated second pipe component 2 together, having a low profile characteristic.
  • 2. The low-profile heat pipe 10 is made by sealing a flat, elongated first pipe component 1 and a flat, elongated second pipe component 2 together that are configured subject to the desired shape and having a sintered wick structure 4 at the inner surface thereof.
  • When the flat, elongated first pipe component 1 and the flat, elongated second pipe component 2 are bonded together, the sintered wick structure 4 is kept intact for quick heat transfer in a uniform manner.

Claims (6)

What the invention claimed is:
1. A low-profile heat pipe, comprising:
a first pipe component shaped like a flat plat member;
a second pipe component shaped like a flat plate member and covered on and bonded to said first pipe component, said second pipe component comprising a wick structure formed on an inner surface thereof by sintering;
an enclosed cavity defined in between said first pipe component and said second pipe component and partially surrounded by the wick structure of said second pipe component; and
a working fluid contained in said enclosed cavity.
2. The low-profile heat pipe as claimed in claim 1, wherein said first pipe component comprises at least one first curved potion disposed between two opposite ends thereof; said second pipe component comprises at least one second curved portion disposed between two opposite ends thereof corresponding to said at least one first curved portion of said first pipe component.
3. The low-profile heat pipe as claimed in claim 1, wherein said first pipe component comprises a wick structure formed on an inner surface thereof by sintering and abutted against the wick structure of said second pipe component around said enclosed cavity.
4. The low-profile heat pipe as claimed in claim 1, wherein said first pipe component comprises a base wall, and an endless upright wall perpendicularly extended around the border of said base wall; said second pipe component is bonded to said endless upright wall of said first pipe component.
5. The low-profile heat pipe as claimed in claim 1, wherein said first pipe component comprises a base wall, an endless upright wall perpendicularly extended around the border of said base wall, and an inner locating groove located on an inner surface of said endless upright wall at a top side; said second pipe component is press-fitted into said inner locating groove of said endless upright all of said first pipe component in a flush manner.
6. The low-profile heat pipe as claimed in claim 1, wherein said first pipe component comprises a base wall, an endless upright wall perpendicularly extended around the border of the base wall thereof, and an outer locating groove located on an outer surface of said endless upright wall at a top side; said second pipe component comprises a base wall and an endless flange perpendicularly downwardly extended around the border of the base wall thereof and press-fitted into said outer locating groove of said endless upright wall of said first pipe component.
US13/678,527 2012-11-15 2012-11-15 Low-profile heat pipe Abandoned US20140131013A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/678,527 US20140131013A1 (en) 2012-11-15 2012-11-15 Low-profile heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/678,527 US20140131013A1 (en) 2012-11-15 2012-11-15 Low-profile heat pipe

Publications (1)

Publication Number Publication Date
US20140131013A1 true US20140131013A1 (en) 2014-05-15

Family

ID=50680548

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/678,527 Abandoned US20140131013A1 (en) 2012-11-15 2012-11-15 Low-profile heat pipe

Country Status (1)

Country Link
US (1) US20140131013A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170363366A1 (en) * 2016-06-15 2017-12-21 Delta Electronics, Inc. Temperature plate and heat dissipation device
US10999952B1 (en) * 2020-01-02 2021-05-04 Taiwan Microloops Corp. Vapor chamber and manufacturing method thereof
US11448470B2 (en) 2018-05-29 2022-09-20 Cooler Master Co., Ltd. Heat dissipation plate and method for manufacturing the same
US11543188B2 (en) 2016-06-15 2023-01-03 Delta Electronics, Inc. Temperature plate device
US11913725B2 (en) * 2018-12-21 2024-02-27 Cooler Master Co., Ltd. Heat dissipation device having irregular shape

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3050844A (en) * 1957-09-05 1962-08-28 R & B Wagner Inc Method of making end caps for pipe railings
US20020191374A1 (en) * 2001-06-13 2002-12-19 Fujikura Ltd. Cooling device for electronic unit
US20050205243A1 (en) * 2003-06-26 2005-09-22 Rosenfeld John H Brazed wick for a heat transfer device and method of making same
US7661463B2 (en) * 2004-12-03 2010-02-16 Foxconn Technology Co., Ltd. Cooling device incorporating boiling chamber
US20100059207A1 (en) * 2008-09-05 2010-03-11 Pegatron Corporation Fin, thermal module, and method for assembling the same
US20100126701A1 (en) * 2008-11-25 2010-05-27 Foxconn Technology Co., Ltd. Plate-type heat pipe and method for manufacturing the same
US20100258277A1 (en) * 2009-04-10 2010-10-14 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20110088877A1 (en) * 2009-10-15 2011-04-21 Sony Corporation Heat transport device, method of manufacturing a heat transport device, and electronic apparatus
US20110253345A1 (en) * 2008-12-24 2011-10-20 Sony Chemical & Information Device Corporation Heat transportation device production method and heat transportation device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3050844A (en) * 1957-09-05 1962-08-28 R & B Wagner Inc Method of making end caps for pipe railings
US20020191374A1 (en) * 2001-06-13 2002-12-19 Fujikura Ltd. Cooling device for electronic unit
US20050205243A1 (en) * 2003-06-26 2005-09-22 Rosenfeld John H Brazed wick for a heat transfer device and method of making same
US7661463B2 (en) * 2004-12-03 2010-02-16 Foxconn Technology Co., Ltd. Cooling device incorporating boiling chamber
US20100059207A1 (en) * 2008-09-05 2010-03-11 Pegatron Corporation Fin, thermal module, and method for assembling the same
US20100126701A1 (en) * 2008-11-25 2010-05-27 Foxconn Technology Co., Ltd. Plate-type heat pipe and method for manufacturing the same
US20110253345A1 (en) * 2008-12-24 2011-10-20 Sony Chemical & Information Device Corporation Heat transportation device production method and heat transportation device
US20100258277A1 (en) * 2009-04-10 2010-10-14 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20110088877A1 (en) * 2009-10-15 2011-04-21 Sony Corporation Heat transport device, method of manufacturing a heat transport device, and electronic apparatus

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170363366A1 (en) * 2016-06-15 2017-12-21 Delta Electronics, Inc. Temperature plate and heat dissipation device
US11306974B2 (en) * 2016-06-15 2022-04-19 Delta Electronics, Inc. Temperature plate and heat dissipation device
US11543188B2 (en) 2016-06-15 2023-01-03 Delta Electronics, Inc. Temperature plate device
US11971219B2 (en) 2016-06-15 2024-04-30 Delta Electronics, Inc. Heat dissipation device
US11448470B2 (en) 2018-05-29 2022-09-20 Cooler Master Co., Ltd. Heat dissipation plate and method for manufacturing the same
US11680752B2 (en) 2018-05-29 2023-06-20 Cooler Master Co., Ltd. Heat dissipation plate and method for manufacturing the same
US11913725B2 (en) * 2018-12-21 2024-02-27 Cooler Master Co., Ltd. Heat dissipation device having irregular shape
US10999952B1 (en) * 2020-01-02 2021-05-04 Taiwan Microloops Corp. Vapor chamber and manufacturing method thereof

Similar Documents

Publication Publication Date Title
US20140131013A1 (en) Low-profile heat pipe
US20140138056A1 (en) Low-profile composite heat pipe
US11320211B2 (en) Heat transfer device
US20170108286A1 (en) Heat transfer plate and heat pipe mounting structure and method
US10619941B2 (en) Heat pipe structure
USD912508S1 (en) Packaging blank
US20140138057A1 (en) Structure of low-profile heat pipe
US8746325B2 (en) Non-base block heat sink
US20150136363A1 (en) Combination heat sink assembly
US20120216991A1 (en) Method for assembling heat pipe and thermo-conductive body and structure thereof
US11543188B2 (en) Temperature plate device
WO2007007611A1 (en) Gasket
CN105909792B (en) Metal gasket
US20150144301A1 (en) Heat dissipating device
EP3330654A1 (en) Plate-like temperature uniforming device
US6986383B2 (en) End surface structure of a heat pipe for contact with a heat source
US20170010048A1 (en) Thin vapor chamber and manufacturing method thereof
JP2006029364A (en) Gasket
US8919423B2 (en) Heat dissipating device
KR20150122922A (en) Center-ring unit for connecting pipes
US20140166243A1 (en) Vapor chamber and method of manufacturing the same
JP2014046353A5 (en)
US20150113808A1 (en) Method for manufacturing heat pipe with ultra-thin capillary structure
JP2013016657A5 (en)
JP2020068367A5 (en)

Legal Events

Date Code Title Description
STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION