US20130306273A1 - Apparatus for the compact cooling of an array of components - Google Patents
Apparatus for the compact cooling of an array of components Download PDFInfo
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- US20130306273A1 US20130306273A1 US13/475,224 US201213475224A US2013306273A1 US 20130306273 A1 US20130306273 A1 US 20130306273A1 US 201213475224 A US201213475224 A US 201213475224A US 2013306273 A1 US2013306273 A1 US 2013306273A1
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- fluid guide
- housing
- channels
- coolant
- heat sink
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- This invention relates to heat sinks, and more particularly to an apparatus for the compact cooling of an array of components.
- a power control unit typically consists of pairs of insulated gate bipolar transistors and diodes used for power conversion and manipulation, such as DC to DC, DC to AC, or AC to DC conversion.
- DC to DC DC to AC
- AC to DC conversion AC to DC conversion
- one example of the present invention is an apparatus for the compact cooling of an array of components.
- the apparatus may include a housing with two cover plates on opposing sides of the housing, and a frame between the cover plates.
- the frame can be thermally coupled to each of the cover plates.
- the frame may further include a plurality of channels for passing coolant through the housing.
- the heat sink can include a housing, a first cover plate on a side of the housing, a second cover plate on an opposite side of the housing, and a separating plate. Additionally, a first fluid guide may be thermally coupled to the first cover plate, and a second fluid guide may be thermally coupled to the second cover plate. The first fluid guide and the second fluid guide can define a plurality of channels for passing coolant through the housing. Furthermore, to isolate coolant of the first fluid guide from the second fluid guide, the separating plate may be between the first fluid guide and the second fluid guide.
- the heat sink may include a housing, a first cover plate on a first side of the housing, a first fluid guide thermally coupled to the first cover plate, a second cover plate on a second side of the housing opposite the first side, a second fluid guide thermally coupled to the second cover plate, a plurality of channels defined by the first fluid guide and second fluid guide for passing coolant through the housing, and an inlet port for receiving coolant into the housing and an outlet port for passing the coolant out of the housing.
- FIG. 1 shows a heat sink in accordance with one embodiment of the present invention.
- FIG. 2 shows an apparatus for the compact cooling of an array of components in accordance with another embodiment of the present invention.
- FIG. 3 shows contents of a heat sink according to embodiment of the present invention.
- FIGS. 1-3 When referring to the figures, like structures and elements shown throughout are indicated with like reference numerals.
- FIG. 1 shows an apparatus for the compact cooling of an array of components 102 in accordance with one embodiment of the present invention.
- the apparatus of FIG. 1 may comprise a housing 114 that includes cover plates 104 and 112 on opposing sides of the housing 114 .
- the apparatus can also include a frame 118 between the cover plates 104 and 112 .
- the frame 118 may be thermally coupled to the cover plates 104 and 112 .
- the frame 118 may be thermally coupled to the cover plates 104 and 112 by brazing, soldering, direct bonding, or any other applicable process.
- the frame 118 may also include a plurality of channels for passing coolant through the housing 114 .
- the housing 114 can further include a cover plate 112 that has a U-shaped cross section.
- the housing 114 may include an inlet port 116 for receiving the coolant into the housing 114 , and an outlet port 120 for passing the coolant out of the housing 114 .
- the housing 114 can have at least on inlet port 116 and one outlet 120 port to help attain even coolant distribution through each of the plurality of channels.
- a coolant supply line may be connected to the inlet port 116 , and the outlet port 120 may be connected to a coolant return line of an applicable cooling system.
- the coolant is gaseous in nature, such as air, inlet and outlet plenums may not be included, and this apparatus may be oriented so that the coolant flows through each of the plurality of channels.
- FIG. 1 also shows a heat sink in accordance with another embodiment of the present invention.
- the heat sink of FIG. 1 may comprise a housing 114 .
- the heat sink may also include a first cover plate 104 on a first side of the housing, and a first fluid guide 108 that is thermally coupled to the first cover plate 104 .
- the heat sink can include a second cover plate 112 on a second side of the housing 114 that opposes the first side, and a second fluid guide 106 that is thermally coupled to the second cover plate 112 .
- the fluid guides 108 and 106 may be thermally coupled to the cover plates 104 and 112 by brazing, soldering, direct bonding, or any other applicable process.
- the heat sink can include a separating plate 110 between the first fluid guide 108 and the second fluid guide 106 for isolating coolant of the first fluid guide 108 from the second fluid guide 106 .
- the heat sink can include a plurality of channels defined by the first fluid guide 108 and the second fluid guide 106 for passing fluid through the housing 114 .
- the heat sink may further comprise an inlet port 116 for receiving coolant into the housing, and an outlet port 120 for passing the coolant out of the housing 114 .
- the housing 114 can have at least one inlet port 116 and one outlet port 120 to help attain even coolant distribution through each of the plurality of channels.
- a coolant supply line may be connected to the inlet port 116 , and the outlet port 120 may be connected to a coolant return line of an applicable cooling system. If the coolant is gaseous in nature, such as air, the inlet port 116 and the outlet port 120 may not be included, and this heat sink may be oriented so that the coolant flows through each of the plurality of channels.
- the first fluid guide 108 can be a first unitary sheet of folded metal and the second fluid guide 106 can be a second unitary sheet of folded metal. Additionally, the plurality of channels can be triangular channels, as shown.
- FIG. 1 also shows another embodiment of the heat sink contemplated by the present invention.
- the heat sink can be utilized for the compact cooling of an array of components 102 .
- the heat sink of FIG. 1 can include a housing 114 .
- the heat sink can include a first cover plate 104 that is on a first side of the housing 114 , and a first fluid guide 108 that is thermally coupled to the first cover plate 104 .
- the heat sink can include a second cover plate 112 that is on a second side of the housing 114 opposite the first side of the housing, and a second fluid guide 106 that is thermally coupled to the second cover plate 112 .
- the fluid guides 108 and 106 may be thermally coupled to the cover plates 104 and 112 by brazing, soldering, direct bonding, or any other applicable process.
- the heat sink can include a plurality of channels that is defined by the first fluid guide 108 and the second fluid guide 106 for passing coolant through the housing.
- the heat sink may further comprise an inlet port 116 for receiving coolant into the housing, and an outlet port 120 for passing the coolant out of the housing 114 .
- the housing 114 can have at least one inlet port 116 and one outlet port 120 to help attain even coolant distribution through each of the plurality of channels.
- a coolant supply line may be connected to the inlet port 116 , and the outlet port 120 may be connected to a coolant return line of an applicable cooling system. If the coolant is gaseous in nature, such as air, the inlet port 116 and the outlet port 120 may not be included, and this heat sink may be oriented so that the coolant flows through each of the plurality of channels.
- the first fluid guide 108 can be a first unitary sheet of folded metal
- the second fluid guide 106 can be a second unitary sheet of folded metal.
- the plurality of channels may be triangular channels.
- the heat sink can also comprise a separating plate 110 between the first fluid guide 108 and the second fluid guide 106 for isolating coolant of the first fluid guide 108 from the second fluid guide 106 .
- FIG. 2 shows another embodiment of the apparatus contemplated by the present invention.
- the apparatus can be utilized for the compact cooling of an array of components 202 , such as a memory module.
- the apparatus can include a housing 210 that includes cover plates 204 on opposing sides of the housing 210 .
- the apparatus of FIG. 2 can include a frame 216 between the cover plates 204 .
- the frame 216 may be thermally coupled to the cover plates 204 .
- the frame 216 may be thermally coupled to the cover plates 204 by brazing, soldering, direct bonding, or any other applicable process.
- the frame 216 can include a plurality of channels for passing coolant through the housing 210 .
- the housing 210 may further include an inlet port 212 that receives coolant into the housing 210 , and an outlet port 214 that passes the coolant out of the housing 210 .
- the frame 216 can be thermally coupled to the cover plates 204 , and may also include a plurality of channels for passing the coolant through the housing 210 . If the coolant is fluidic in nature, such as water or glycol, the housing 210 can have at least one inlet port 212 and one outlet port 214 to help attain even coolant distribution through each of the plurality of channels.
- a coolant supply line may be connected to the inlet port 212 , and the outlet port 214 may be connected to a coolant return line of an applicable cooling system.
- the frame 216 may further include a fluid guide 206 that defines the plurality of channels.
- the fluid guide 206 may be thermally coupled to the cover plates 204 .
- the fluid guide 206 may be thermally coupled to the cover plates 204 by brazing, soldering, direct bonding, or any other applicable process.
- the fluid guide 206 can also be a unitary sheet of folded metal.
- the frame 216 may also include a separating plate 208 for isolating coolant of the fluid guide 206 .
- FIG. 3 shows contents of an apparatus for the compact cooling of an array of components in accordance with one embodiment of the present invention.
- the apparatus may include a first cover plate 302 and a second cover plate 310 .
- a frame of the apparatus may include a first fluid guide 308 that is thermally coupled to the first cover plate 302 , and a second fluid guide 304 that is thermally coupled to the second cover plate 310 .
- the fluid guides 308 and 304 may be thermally coupled to the cover plates 302 and 310 by brazing, soldering, direct bonding, or any other applicable process.
- the first fluid guide 308 and the second fluid guide 304 may define the plurality of channels. Additionally, the plurality of channels may be rectangular channels, as shown.
- first fluid guide 308 may be a first unitary sheet of folded metal
- second fluid guide 304 may be a second unitary sheet of folded metal
- the frame 316 may include a separating plate 306 between the first fluid guide 308 and the second fluid guide 304 .
- the separating plate 306 is intended to isolate the coolant of the first fluid guide 308 from the second fluid guide 304 .
- components may be attached to a cover plate by soldering, direct bonding, applying thermal grease, or any other applicable process.
- the number of layers in the heat sink may be one or more depending on the amount of heat that needs to be dissipated.
- the heat sink can be fabricated in a few steps. If starting from a unitary sheet of metal, the sheet can be folded to form a folded-fin structure having a height equal to the height of triangular or rectangular channels for passing coolant through the heat sink. Also, the folded-fin structure can have a width equal to the width of the base of the triangular or rectangular channels.
- the folded-fin structure may then be compressed horizontally from the sides to form a structure of alternating triangular channels.
- these channels can be placed and be attached to a rectangular cup-shaped cover plate using soldering, brazing, direct bonding, or any other applicable process.
- the rectangular cup-shaped cover plate may have an inlet port and an outlet port.
- a separating plate can then be attached to the top surface of the alternating triangular channels structure by soldering, brazing, direct bonding, or any other applicable process.
- An additional layer of the same structure of triangular or rectangular channels can then be attached to the top of this separating plate by soldering, brazing, direct bonded, or any other applicable process.
- a cover plate can be attached to the top-most layer by soldering, brazing, direct bonding, or any other applicable process.
- the cover plate can also be attached to the periphery of a base metal structure to form a leak-proof joint by soldering, brazing, direct bonding, or any other applicable process.
- the larger surface area provided by the proposed heat sink will allow for enhanced cooling.
- the proposed heat sink can have one or more than one layer of triangular channels on each side.
- the proposed heat sink can also include a rectangular cup-shaped bottom cover plate, an inlet port, an outlet port, triangular channels made from a single sheet, separating plates (for 2 or more channels on each side) and a top cover plate.
- the different components may be assembled together by soldering, brazing, direct-bonding, or any other applicable process.
- the heat sink can be fabricated from a metal sheet of specified thickness or from a sheet of folded-fin having a specified fin thickness, channel height and width. If starting from a unitary sheet of metal, the metal sheet can be folded to form a folded-fin structure that has a fin height equal to the height of triangular or rectangular channels for passing coolant through the heat sink. Also, the folded-fin structure can be folded to form a folded-fin structure that has a width equal to the width of the base of the triangular or rectangular channels. In the case of triangular channels, the folded-fin structure may then be compressed horizontally from the sides to form a structure of alternating triangular channels.
- the folded-fin structure may then be placed in a base rectangular cup-shaped metal structure.
- the base rectangular cup-shaped metal structure can have an inlet port for receiving coolant into the heat sink and an outlet port for passing coolant out of the heat sink.
- the folded-fin structure may be attached to the top of a separating plate by soldering, brazing, direct bonding, or any other applicable process.
- An additional layer of the same structure of alternating channels may then be attached to the top of the separating plate by soldering, brazing, direct bonding, or any other applicable process.
- the entire process for this embodiment of the present invention can be repeated N number of times to form N+1 layers of channels.
- a cover plate can be attached to the top of the top-most layer by soldering, brazing, direct bonding, or any other applicable method.
- the cover plate may also be attached to the periphery of the base rectangular cup-shaped metal structure by soldering, brazing, direct bonding, or any other applicable process to form a leak-proof joint.
- this heat sink can have one or more layers of alternating channels.
- due to the structure of the layers of alternating channels a larger surface area for contact between adjacent layers is inherent.
- the use of a soldering, braze joint, or direct bonding method can provide proper thermal contact between adjacent layers of alternating channels.
- the use of a soldering, braze joint, or direct bonding method can also enhance the thermal performance of the heat sink by enabling proper heat flow until the (N+1) th layer.
- the apparatus may include a heat sink assembly structure with two-layer triangular channels where heat sinks may be attached to opposing sides of a component.
- the heat sink can attach to manifolds on either end of the component to provide inlet and outlet paths for coolant.
- This attachment to the manifolds may also provide structural rigidity to the heat sinks with respect to the components.
- This structural rigidity can be used to provide a compressive force that ensures a sufficient contact between the components and the heat sinks.
- Any appropriate thermal interface material such as thermal grease, thermal pads, thermal oil, etc., can be placed between the component and the heat sinks to ensure proper thermal contact.
Abstract
Description
- This invention was made with Government support under Contract No. DE-EE0002894 (Department of Energy). The Government has certain rights in this invention.
- This invention relates to heat sinks, and more particularly to an apparatus for the compact cooling of an array of components.
- Over the years, electronic equipment, especially semiconductor based devices, have found their applications in almost all fields of research. The demand for more power and performance from such electronic equipment has constantly been growing, resulting in an increased amount of heat dissipation from these devices. While conventional cooling solutions have performed the task of heat removal, no straightforward extension has been possible for the significantly high heat fluxes dissipated by smaller and more efficient electronic devices.
- Thermal management of high-density power control units for hybrid electric vehicles is one such challenging application. A power control unit typically consists of pairs of insulated gate bipolar transistors and diodes used for power conversion and manipulation, such as DC to DC, DC to AC, or AC to DC conversion. Over the last few years, the performance of such power control units has been improved. Furthermore, their size has been reduced to attain higher efficiency (approximately 95%) and performance, causing the heat dissipation as well as heat density to increase significantly to approximately 400%. However, the overall cooling system has remained unchanged.
- Accordingly, one example of the present invention is an apparatus for the compact cooling of an array of components. The apparatus may include a housing with two cover plates on opposing sides of the housing, and a frame between the cover plates. The frame can be thermally coupled to each of the cover plates. Additionally, the frame may further include a plurality of channels for passing coolant through the housing.
- Another example of the present invention is a heat sink for the compact cooling of an array of components. The heat sink can include a housing, a first cover plate on a side of the housing, a second cover plate on an opposite side of the housing, and a separating plate. Additionally, a first fluid guide may be thermally coupled to the first cover plate, and a second fluid guide may be thermally coupled to the second cover plate. The first fluid guide and the second fluid guide can define a plurality of channels for passing coolant through the housing. Furthermore, to isolate coolant of the first fluid guide from the second fluid guide, the separating plate may be between the first fluid guide and the second fluid guide.
- Yet another embodiment of the present invention is heat sink for the compact cooling of an array of components. The heat sink may include a housing, a first cover plate on a first side of the housing, a first fluid guide thermally coupled to the first cover plate, a second cover plate on a second side of the housing opposite the first side, a second fluid guide thermally coupled to the second cover plate, a plurality of channels defined by the first fluid guide and second fluid guide for passing coolant through the housing, and an inlet port for receiving coolant into the housing and an outlet port for passing the coolant out of the housing.
- The subject matter which is regarded as the invention is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification. The foregoing and other objects, features, and advantages of the invention are apparent from the following detailed description taken in conjunction with the accompanying drawings in which:
-
FIG. 1 shows a heat sink in accordance with one embodiment of the present invention. -
FIG. 2 shows an apparatus for the compact cooling of an array of components in accordance with another embodiment of the present invention. -
FIG. 3 shows contents of a heat sink according to embodiment of the present invention. - The present invention is described with reference to embodiments of the invention. Throughout the description of the invention reference is made to
FIGS. 1-3 . When referring to the figures, like structures and elements shown throughout are indicated with like reference numerals. -
FIG. 1 shows an apparatus for the compact cooling of an array ofcomponents 102 in accordance with one embodiment of the present invention. The apparatus ofFIG. 1 may comprise ahousing 114 that includescover plates housing 114. The apparatus can also include aframe 118 between thecover plates frame 118 may be thermally coupled to thecover plates frame 118 may be thermally coupled to thecover plates frame 118 may also include a plurality of channels for passing coolant through thehousing 114. Thehousing 114 can further include acover plate 112 that has a U-shaped cross section. Moreover, thehousing 114 may include aninlet port 116 for receiving the coolant into thehousing 114, and anoutlet port 120 for passing the coolant out of thehousing 114. If the coolant is fluidic in nature, such as water or glycol, thehousing 114 can have at least oninlet port 116 and oneoutlet 120 port to help attain even coolant distribution through each of the plurality of channels. A coolant supply line may be connected to theinlet port 116, and theoutlet port 120 may be connected to a coolant return line of an applicable cooling system. If the coolant is gaseous in nature, such as air, inlet and outlet plenums may not be included, and this apparatus may be oriented so that the coolant flows through each of the plurality of channels. -
FIG. 1 also shows a heat sink in accordance with another embodiment of the present invention. The heat sink ofFIG. 1 may comprise ahousing 114. The heat sink may also include afirst cover plate 104 on a first side of the housing, and afirst fluid guide 108 that is thermally coupled to thefirst cover plate 104. Additionally, the heat sink can include asecond cover plate 112 on a second side of thehousing 114 that opposes the first side, and asecond fluid guide 106 that is thermally coupled to thesecond cover plate 112. Thefluid guides cover plates separating plate 110 between thefirst fluid guide 108 and thesecond fluid guide 106 for isolating coolant of thefirst fluid guide 108 from thesecond fluid guide 106. Moreover, the heat sink can include a plurality of channels defined by thefirst fluid guide 108 and thesecond fluid guide 106 for passing fluid through thehousing 114. The heat sink may further comprise aninlet port 116 for receiving coolant into the housing, and anoutlet port 120 for passing the coolant out of thehousing 114. If the coolant is fluidic in nature, such as water or glycol, thehousing 114 can have at least oneinlet port 116 and oneoutlet port 120 to help attain even coolant distribution through each of the plurality of channels. A coolant supply line may be connected to theinlet port 116, and theoutlet port 120 may be connected to a coolant return line of an applicable cooling system. If the coolant is gaseous in nature, such as air, theinlet port 116 and theoutlet port 120 may not be included, and this heat sink may be oriented so that the coolant flows through each of the plurality of channels. Thefirst fluid guide 108 can be a first unitary sheet of folded metal and thesecond fluid guide 106 can be a second unitary sheet of folded metal. Additionally, the plurality of channels can be triangular channels, as shown. -
FIG. 1 also shows another embodiment of the heat sink contemplated by the present invention. According to this embodiment of the invention the heat sink can be utilized for the compact cooling of an array ofcomponents 102. The heat sink ofFIG. 1 can include ahousing 114. Additionally, the heat sink can include afirst cover plate 104 that is on a first side of thehousing 114, and afirst fluid guide 108 that is thermally coupled to thefirst cover plate 104. Furthermore, the heat sink can include asecond cover plate 112 that is on a second side of thehousing 114 opposite the first side of the housing, and asecond fluid guide 106 that is thermally coupled to thesecond cover plate 112. The fluid guides 108 and 106 may be thermally coupled to thecover plates first fluid guide 108 and thesecond fluid guide 106 for passing coolant through the housing. The heat sink may further comprise aninlet port 116 for receiving coolant into the housing, and anoutlet port 120 for passing the coolant out of thehousing 114. If the coolant is fluidic in nature, such as water or glycol, thehousing 114 can have at least oneinlet port 116 and oneoutlet port 120 to help attain even coolant distribution through each of the plurality of channels. A coolant supply line may be connected to theinlet port 116, and theoutlet port 120 may be connected to a coolant return line of an applicable cooling system. If the coolant is gaseous in nature, such as air, theinlet port 116 and theoutlet port 120 may not be included, and this heat sink may be oriented so that the coolant flows through each of the plurality of channels. Thefirst fluid guide 108 can be a first unitary sheet of folded metal, and thesecond fluid guide 106 can be a second unitary sheet of folded metal. The plurality of channels may be triangular channels. The heat sink can also comprise aseparating plate 110 between thefirst fluid guide 108 and thesecond fluid guide 106 for isolating coolant of thefirst fluid guide 108 from thesecond fluid guide 106. -
FIG. 2 shows another embodiment of the apparatus contemplated by the present invention. According to this embodiment of the invention, the apparatus can be utilized for the compact cooling of an array ofcomponents 202, such as a memory module. The apparatus can include ahousing 210 that includescover plates 204 on opposing sides of thehousing 210. Additionally, the apparatus ofFIG. 2 can include aframe 216 between thecover plates 204. Theframe 216 may be thermally coupled to thecover plates 204. For example, theframe 216 may be thermally coupled to thecover plates 204 by brazing, soldering, direct bonding, or any other applicable process. Moreover, theframe 216 can include a plurality of channels for passing coolant through thehousing 210. Thehousing 210 may further include aninlet port 212 that receives coolant into thehousing 210, and anoutlet port 214 that passes the coolant out of thehousing 210. Theframe 216 can be thermally coupled to thecover plates 204, and may also include a plurality of channels for passing the coolant through thehousing 210. If the coolant is fluidic in nature, such as water or glycol, thehousing 210 can have at least oneinlet port 212 and oneoutlet port 214 to help attain even coolant distribution through each of the plurality of channels. A coolant supply line may be connected to theinlet port 212, and theoutlet port 214 may be connected to a coolant return line of an applicable cooling system. If the coolant is gaseous in nature, such as air, theinlet port 212 and theoutlet port 214 may not be included, and this heat sink may be oriented so that the coolant flows through each of the plurality of channels. The plurality of channels can be triangular channels, as shown. Theframe 216 may further include afluid guide 206 that defines the plurality of channels. Thefluid guide 206 may be thermally coupled to thecover plates 204. Thefluid guide 206 may be thermally coupled to thecover plates 204 by brazing, soldering, direct bonding, or any other applicable process. Additionally, thefluid guide 206 can also be a unitary sheet of folded metal. Moreover, theframe 216 may also include a separatingplate 208 for isolating coolant of thefluid guide 206. -
FIG. 3 shows contents of an apparatus for the compact cooling of an array of components in accordance with one embodiment of the present invention. According to this embodiment of the invention, the apparatus may include afirst cover plate 302 and asecond cover plate 310. A frame of the apparatus may include afirst fluid guide 308 that is thermally coupled to thefirst cover plate 302, and asecond fluid guide 304 that is thermally coupled to thesecond cover plate 310. The fluid guides 308 and 304 may be thermally coupled to thecover plates first fluid guide 308 and thesecond fluid guide 304 may define the plurality of channels. Additionally, the plurality of channels may be rectangular channels, as shown. Moreover, thefirst fluid guide 308 may be a first unitary sheet of folded metal, and thesecond fluid guide 304 may be a second unitary sheet of folded metal. The frame 316 may include a separatingplate 306 between thefirst fluid guide 308 and thesecond fluid guide 304. The separatingplate 306 is intended to isolate the coolant of thefirst fluid guide 308 from thesecond fluid guide 304. - In one embodiment of the heat sink contemplated by the present invention, components may be attached to a cover plate by soldering, direct bonding, applying thermal grease, or any other applicable process. The number of layers in the heat sink may be one or more depending on the amount of heat that needs to be dissipated. The heat sink can be fabricated in a few steps. If starting from a unitary sheet of metal, the sheet can be folded to form a folded-fin structure having a height equal to the height of triangular or rectangular channels for passing coolant through the heat sink. Also, the folded-fin structure can have a width equal to the width of the base of the triangular or rectangular channels. In the case of triangular channels, the folded-fin structure may then be compressed horizontally from the sides to form a structure of alternating triangular channels. Next, these channels can be placed and be attached to a rectangular cup-shaped cover plate using soldering, brazing, direct bonding, or any other applicable process. The rectangular cup-shaped cover plate may have an inlet port and an outlet port. A separating plate can then be attached to the top surface of the alternating triangular channels structure by soldering, brazing, direct bonding, or any other applicable process. An additional layer of the same structure of triangular or rectangular channels can then be attached to the top of this separating plate by soldering, brazing, direct bonded, or any other applicable process. This process can be repeated N number of times to form N+1 layers of triangular channels. Once N+1 numbers of channels are stacked, a cover plate can be attached to the top-most layer by soldering, brazing, direct bonding, or any other applicable process. The cover plate can also be attached to the periphery of a base metal structure to form a leak-proof joint by soldering, brazing, direct bonding, or any other applicable process. The larger surface area provided by the proposed heat sink will allow for enhanced cooling. In general, the proposed heat sink can have one or more than one layer of triangular channels on each side. The proposed heat sink can also include a rectangular cup-shaped bottom cover plate, an inlet port, an outlet port, triangular channels made from a single sheet, separating plates (for 2 or more channels on each side) and a top cover plate. The different components may be assembled together by soldering, brazing, direct-bonding, or any other applicable process.
- In another embodiment of the heat sink contemplated by the present invention the heat sink can be fabricated from a metal sheet of specified thickness or from a sheet of folded-fin having a specified fin thickness, channel height and width. If starting from a unitary sheet of metal, the metal sheet can be folded to form a folded-fin structure that has a fin height equal to the height of triangular or rectangular channels for passing coolant through the heat sink. Also, the folded-fin structure can be folded to form a folded-fin structure that has a width equal to the width of the base of the triangular or rectangular channels. In the case of triangular channels, the folded-fin structure may then be compressed horizontally from the sides to form a structure of alternating triangular channels. The folded-fin structure may then be placed in a base rectangular cup-shaped metal structure. The base rectangular cup-shaped metal structure can have an inlet port for receiving coolant into the heat sink and an outlet port for passing coolant out of the heat sink. Also, the folded-fin structure may be attached to the top of a separating plate by soldering, brazing, direct bonding, or any other applicable process. An additional layer of the same structure of alternating channels may then be attached to the top of the separating plate by soldering, brazing, direct bonding, or any other applicable process. The entire process for this embodiment of the present invention can be repeated N number of times to form N+1 layers of channels. Once N+1 number of layers of alternating channels are stacked, a cover plate can be attached to the top of the top-most layer by soldering, brazing, direct bonding, or any other applicable method. The cover plate may also be attached to the periphery of the base rectangular cup-shaped metal structure by soldering, brazing, direct bonding, or any other applicable process to form a leak-proof joint. In general, this heat sink can have one or more layers of alternating channels. Moreover, due to the structure of the layers of alternating channels, a larger surface area for contact between adjacent layers is inherent. The use of a soldering, braze joint, or direct bonding method can provide proper thermal contact between adjacent layers of alternating channels. The use of a soldering, braze joint, or direct bonding method can also enhance the thermal performance of the heat sink by enabling proper heat flow until the (N+1)th layer.
- In another embodiment of the apparatus contemplated by the present invention, the apparatus may include a heat sink assembly structure with two-layer triangular channels where heat sinks may be attached to opposing sides of a component. The heat sink can attach to manifolds on either end of the component to provide inlet and outlet paths for coolant. This attachment to the manifolds may also provide structural rigidity to the heat sinks with respect to the components. This structural rigidity can be used to provide a compressive force that ensures a sufficient contact between the components and the heat sinks. Any appropriate thermal interface material such as thermal grease, thermal pads, thermal oil, etc., can be placed between the component and the heat sinks to ensure proper thermal contact.
- The descriptions of the various embodiments of the present invention have been presented for purposes of illustration, but are not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein was chosen to best explain the principles of the embodiments, the practical application or technical improvement over technologies found in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
Claims (20)
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US13/475,224 US20130306273A1 (en) | 2012-05-18 | 2012-05-18 | Apparatus for the compact cooling of an array of components |
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US13/475,224 US20130306273A1 (en) | 2012-05-18 | 2012-05-18 | Apparatus for the compact cooling of an array of components |
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US13/475,224 Abandoned US20130306273A1 (en) | 2012-05-18 | 2012-05-18 | Apparatus for the compact cooling of an array of components |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105283038A (en) * | 2014-07-22 | 2016-01-27 | 西门子公司 | Cooling device for cooling electronic and/or electric element in targeted manner |
USD810034S1 (en) * | 2016-02-22 | 2018-02-13 | Heatscape.Com, Inc. | Flexible folded fin heatsink with straight and radial fin patterns |
US20190208669A1 (en) * | 2017-12-28 | 2019-07-04 | Hughes Network Systems Llc | Cooling apparatus for an electrical component |
US11416045B2 (en) * | 2020-04-13 | 2022-08-16 | International Business Machines Corporation | Thermal interface material structures for directing heat in a three-dimensional space |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5005640A (en) * | 1989-06-05 | 1991-04-09 | Mcdonnell Douglas Corporation | Isothermal multi-passage cooler |
US5526231A (en) * | 1994-01-20 | 1996-06-11 | Siemens Aktiengesellschaft | Cooling unit for power semiconductors |
US5666269A (en) * | 1994-01-03 | 1997-09-09 | Motorola, Inc. | Metal matrix composite power dissipation apparatus |
US5841634A (en) * | 1997-03-12 | 1998-11-24 | Delco Electronics Corporation | Liquid-cooled baffle series/parallel heat sink |
US5978220A (en) * | 1996-10-23 | 1999-11-02 | Asea Brown Boveri Ag | Liquid cooling device for a high-power semiconductor module |
US6563709B2 (en) * | 2000-07-21 | 2003-05-13 | Mitsubishi Materials Corporation | Liquid-cooled heat sink and manufacturing method thereof |
US6578625B1 (en) * | 2002-03-08 | 2003-06-17 | Raytheon Company | Method and apparatus for removing heat from a plate |
US6799628B1 (en) * | 2000-07-20 | 2004-10-05 | Honeywell International Inc. | Heat exchanger having silicon nitride substrate for mounting high power electronic components |
US7017655B2 (en) * | 2003-12-18 | 2006-03-28 | Modine Manufacturing Co. | Forced fluid heat sink |
US20090107655A1 (en) * | 2007-10-25 | 2009-04-30 | Katsuyuki Kajiura | Semiconductor cooling apparatus |
US20090114372A1 (en) * | 2005-09-13 | 2009-05-07 | Mitsubishi Electric Corporation | Heat sink |
US7839641B2 (en) * | 2007-05-21 | 2010-11-23 | Toyota Jidosha Kabushiki Kaisha | Condenser for power module and power module |
US20110122583A1 (en) * | 2009-11-23 | 2011-05-26 | Delphi Technologies, Inc. | Immersion cooling apparatus for a power semiconductor device |
-
2012
- 2012-05-18 US US13/475,224 patent/US20130306273A1/en not_active Abandoned
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5005640A (en) * | 1989-06-05 | 1991-04-09 | Mcdonnell Douglas Corporation | Isothermal multi-passage cooler |
US5666269A (en) * | 1994-01-03 | 1997-09-09 | Motorola, Inc. | Metal matrix composite power dissipation apparatus |
US5526231A (en) * | 1994-01-20 | 1996-06-11 | Siemens Aktiengesellschaft | Cooling unit for power semiconductors |
US5978220A (en) * | 1996-10-23 | 1999-11-02 | Asea Brown Boveri Ag | Liquid cooling device for a high-power semiconductor module |
US5841634A (en) * | 1997-03-12 | 1998-11-24 | Delco Electronics Corporation | Liquid-cooled baffle series/parallel heat sink |
US6799628B1 (en) * | 2000-07-20 | 2004-10-05 | Honeywell International Inc. | Heat exchanger having silicon nitride substrate for mounting high power electronic components |
US6563709B2 (en) * | 2000-07-21 | 2003-05-13 | Mitsubishi Materials Corporation | Liquid-cooled heat sink and manufacturing method thereof |
US6578625B1 (en) * | 2002-03-08 | 2003-06-17 | Raytheon Company | Method and apparatus for removing heat from a plate |
US7017655B2 (en) * | 2003-12-18 | 2006-03-28 | Modine Manufacturing Co. | Forced fluid heat sink |
US20090114372A1 (en) * | 2005-09-13 | 2009-05-07 | Mitsubishi Electric Corporation | Heat sink |
US7839641B2 (en) * | 2007-05-21 | 2010-11-23 | Toyota Jidosha Kabushiki Kaisha | Condenser for power module and power module |
US20090107655A1 (en) * | 2007-10-25 | 2009-04-30 | Katsuyuki Kajiura | Semiconductor cooling apparatus |
US20110122583A1 (en) * | 2009-11-23 | 2011-05-26 | Delphi Technologies, Inc. | Immersion cooling apparatus for a power semiconductor device |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105283038A (en) * | 2014-07-22 | 2016-01-27 | 西门子公司 | Cooling device for cooling electronic and/or electric element in targeted manner |
DE102014214209A1 (en) * | 2014-07-22 | 2016-01-28 | Siemens Aktiengesellschaft | Cooling device for targeted cooling of electronic and / or electrical components |
DE102014214209B4 (en) * | 2014-07-22 | 2016-05-04 | Siemens Aktiengesellschaft | Cooling device for targeted cooling of electronic and / or electrical components, converters with such a cooling device and electric or hybrid vehicle with such a converter |
USD810034S1 (en) * | 2016-02-22 | 2018-02-13 | Heatscape.Com, Inc. | Flexible folded fin heatsink with straight and radial fin patterns |
USD842822S1 (en) * | 2016-02-22 | 2019-03-12 | Heatscape.Com, Inc. | Flexible folded fin heatsink with straight and radial fin patterns |
US20190208669A1 (en) * | 2017-12-28 | 2019-07-04 | Hughes Network Systems Llc | Cooling apparatus for an electrical component |
US10986756B2 (en) * | 2017-12-28 | 2021-04-20 | Hughes Network Systems Llc | Cooling apparatus for an electrical component |
US11416045B2 (en) * | 2020-04-13 | 2022-08-16 | International Business Machines Corporation | Thermal interface material structures for directing heat in a three-dimensional space |
US11703922B2 (en) | 2020-04-13 | 2023-07-18 | International Business Machines Corporation | Thermal interface material structures for directing heat in a three-dimensional space |
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