US20130228915A1 - Semiconductor package and fabrication method thereof - Google Patents
Semiconductor package and fabrication method thereof Download PDFInfo
- Publication number
- US20130228915A1 US20130228915A1 US13/534,664 US201213534664A US2013228915A1 US 20130228915 A1 US20130228915 A1 US 20130228915A1 US 201213534664 A US201213534664 A US 201213534664A US 2013228915 A1 US2013228915 A1 US 2013228915A1
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- layer
- encapsulant
- chips
- support plate
- circuit structure
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000008393 encapsulating agent Substances 0.000 claims abstract description 53
- 238000002955 isolation Methods 0.000 claims description 37
- 239000004642 Polyimide Substances 0.000 claims description 15
- 229920001721 polyimide Polymers 0.000 claims description 15
- 238000005520 cutting process Methods 0.000 claims description 12
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
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- 230000002209 hydrophobic effect Effects 0.000 claims description 3
- 229910010272 inorganic material Inorganic materials 0.000 claims description 3
- 239000011147 inorganic material Substances 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 13
- 239000000853 adhesive Substances 0.000 abstract description 12
- 239000010410 layer Substances 0.000 description 125
- 239000012790 adhesive layer Substances 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
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- 238000000465 moulding Methods 0.000 description 2
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- 229910052581 Si3N4 Inorganic materials 0.000 description 1
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Definitions
- the present invention relates to semiconductor packages and fabrication methods thereof, and more particularly, to a high-reliability semiconductor package and a fabrication method thereof.
- WLP wafer level packaging
- FIGS. 1A to 1E are schematic cross-sectional views showing a fabrication method of a conventional semiconductor package 1 .
- a thermal release adhesive layer 11 is applied on a carrier 10 .
- the thermal release tape 11 loses its adhesive property when heated.
- a plurality of chips 12 are disposed on the thermal release adhesive layer 11 .
- Each of the chips 12 has an active surface 12 a with a plurality of electrode pads 120 and an inactive surface 12 b opposite to the active surface 12 a , and is disposed on the thermal release adhesive layer 11 via the active surface 12 a thereof.
- an encapsulant 13 is formed on the chips 12 and the thermal release tape 11 through molding.
- the thermal release adhesive layer 11 and the carrier 10 are removed by heating, thereby exposing the active surfaces 12 a of the chips 12 .
- a circuit structure 14 is formed on the encapsulant 13 and the active surfaces 12 a of the chips 12 and electrically connected to the electrode pads 120 of the chips 12 .
- thermal release adhesive layer 11 is adhesive and the difference of CTEs (Coefficient of Thermal Expansion) between the thermal release adhesive layer 11 and the carrier 10 is substantial, after the encapsulant 13 is formed, warpage can easily occur to the overall structure during a thermal cycle, thus reducing the product reliability.
- the thermal release adhesive layer 11 is preferably coated on a small-sized carrier 10 .
- the conveying equipment not shown
- the present invention provides a semiconductor package, which comprises: an encapsulant having a first surface formed with a protruding portion and a second surface opposite to the first surface; a chip embedded in the protruding portion of the encapsulant, wherein the chip has an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface, the active surface and the electrode pads being exposed from the protruding portion of the encapsulant; a circuit structure formed on the first surface of the encapsulant and the active surface of the chip and electrically connected to the electrode pads of the chip; and a bonding layer formed on the second surface of the encapsulant.
- the present invention further provides a fabrication method of a semiconductor package, which comprises the steps of: providing a carrier having a plurality of concave portions on a surface thereof and a release layer formed on the surface having the concave portions; disposing a plurality of chips on the release layer in the concave portions, respectively, wherein each of the chips has an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface, the chip being disposed on the release layer via the active surface thereof; forming an encapsulant on the chips and the release layer; forming a bonding layer on the encapsulant; removing the release layer and the carrier so as to expose the active surfaces of the chips; and forming a circuit structure on the encapsulant and the active surfaces of the chips so as to electrically connect the circuit structure and the electrode pads of the chips.
- the carrier can be made of glass or metal
- the release layer can be made of a hydrophobic material, an inorganic material or a high polymer.
- the release layer can be formed through plasma-enhanced chemical vapor deposition (PECVD), and the bonding layer can be formed through lamination.
- PECVD plasma-enhanced chemical vapor deposition
- the above-described method can further comprise performing a singulation process so as to obtain a plurality of semiconductor packages.
- the method can further comprise forming an isolation layer on the bonding layer, wherein the isolation layer is formed on a support plate so as to be sandwiched between the support plate and the bonding layer. Further, before forming the bonding layer on the encapsulant, the method can first sandwich the isolation layer between the support plate and the bonding layer. Therein, the isolation layer is not adhesive to the support plate and the bonding layer.
- the isolation layer can be patterned to form gaps therein and then the isolation layer can be embedded in the bonding layer such that a portion of the bonding layer is formed in the gaps for bonding with the support plate.
- the method can further comprise cutting the overall structure along cutting paths through the gaps so as to remove the isolation layer and the support plate, thereby obtaining a plurality of semiconductor packages.
- the area of the isolation layer can be less than the area of the bonding layer and the area of the support plate such that a portion of the bonding layer encapsulates the edges of the isolation layer for the bonding layer to be bonded with the edges of the support plate.
- the method can further comprise singulating the chips and cutting along the edges of the isolation layer so as to remove the support plate and the isolation layer, thereby obtaining a plurality of semiconductor packages.
- the bonding layer can be made of polyimide (PI), a dry film or a semi-dry material.
- the circuit structure can have at least a dielectric layer formed on the encapsulant and the active surface of the chip, a circuit layer formed on the dielectric layer and a plurality of conductive vias formed in the dielectric layer for electrically connecting the circuit layer and the electrode pads of the chip.
- an insulating protection layer can be formed on the outermost dielectric layer of the circuit structure and have a plurality of openings therein such that a portion of the circuit layer is exposed through the openings so as for conductive elements to be disposed thereon through the openings.
- the circuit structure can have at least a dielectric layer formed on the encapsulant, and a circuit layer formed on the dielectric layer and the active surface of the chip so as to electrically connect the electrode pads of the chip.
- the present invention avoids warpage of the overall structure during a thermal cycle caused by incompatible CTEs. Further, the release layer can be easily formed on a carrier of large size through PECVD, thereby facilitating transport and improving the production efficiency.
- FIGS. 1A to 1E are schematic cross-sectional views showing a fabrication method of a conventional semiconductor package.
- FIGS. 2A to 2H are schematic cross-sectional views showing a fabrication method of a semiconductor package according to the present invention, wherein FIG. 2 E′ shows another embodiment of FIG. 2E , and FIGS. 2 G′, 2 G′′ and 2 H′ show other embodiments of FIGS. 2G and 2H , respectively.
- FIGS. 2A to 2H are schematic cross-sectional views showing a fabrication method of a semiconductor package 2 according to the present invention.
- a carrier 20 having a plurality of concave portions 200 on a surface thereof is provided.
- the carrier 20 is made of glass or metal, and the concave portions 200 are array arranged on the carrier 20 .
- a release layer 21 is formed on the surface of the carrier 20 having the concave portions 200 .
- the release layer 21 is made of a hydrophobic material, an inorganic material or a high polymer such as poly-para-xylylene (parylene), and formed through plasma-enhanced chemical vapor deposition (PECVD).
- a hydrophobic material such as poly-para-xylylene (parylene)
- a high polymer such as poly-para-xylylene (parylene)
- PECVD plasma-enhanced chemical vapor deposition
- the release layer 21 can be easily formed on the carrier 20 of large size through PECVD, thereby facilitating transport of the carrier 20 and improving the production efficiency.
- a plurality of chips 22 are disposed on the release layer 21 in the concave portions 200 , respectively.
- Each of the chips 22 has an active surface 22 a with a plurality of electrode pads 220 and an inactive surface 22 b opposite to the active surface 22 a , and the chip 22 is disposed on the release layer 21 via the active surface 22 a thereof.
- the concave portions 200 facilitate alignment of the chips 22 so as to avoid position deviation. Further, since the release layer 21 is only slightly adhesive to the chips 22 in comparison to the conventional thermal release adhesive layer, the present invention avoids significant position deviations of the chips 22 caused by the CTE of the release layer 21 , thereby securing the chips 22 in position and improving the reliability of subsequent processes.
- an encapsulant 23 is formed on the chips 22 and the release layer 21 by laminating or coating so as to encapsulate the chips 22 .
- the encapsulant 23 can be made of, but not limited to, polyimide (PI).
- the release layer 21 is slightly adhesive to the encapsulant 23 .
- a bonding layer 27 is laminated on the encapsulant 23 through a support plate 29 , and an isolation layer 28 is laminated in the bonding layer 27 .
- the bonding layer 27 has a thickness of 10 to 100 um.
- the bonding layer 27 can be made of polyimide (PI), a dry film or a semi-dry material.
- the support plate 29 can be made of glass.
- the isolation layer 28 is neither adhesive to the bonding layer 27 (such as PI) nor adhesive to the support plate 29 (such as glass), and the bonding layer 27 (such as PI) is adhesive to the support plate 29 (such as glass). Therefore, in the fabrication process, the isolation layer 28 is first patterned to form gaps 280 therein and then laminated such that the bonding layer 27 is pressed into the gaps 280 for bonding with the support plate 29 .
- the bonding layer 27 , the isolation layer 28 and the support plate 29 are laminated simultaneously.
- the bonding layer 27 can be formed on the encapsulant 23 first and then the isolation layer 28 is pressed into the bonding layer 27 through the support plate 29 .
- the isolation layer 28 ′ can have an area less than the area of the bonding layer 27 and the area of the support plate 29 . As such, during the lamination process, a portion of the bonding layer 27 is pressed to encapsulate the edges of the isolation layer 28 ′ so as to bond the bonding layer 27 with the edges of the support plate 29 .
- the release layer 21 and the carrier 20 are removed to expose the active surfaces 22 a of the chips 22 and a plurality of protruding portions 230 of the encapsulant 23 .
- the carrier 20 is first removed from the release layer 21 and then the release layer 21 is removed through plasma. Since the release layer 21 is removed without the need to apply heat, the present invention avoids warpage of the overall structure during a thermal cycle.
- the support plate 29 is provided to serve as a carrier during the removal process since the overall structure needs to be moved to another machine and turned upside down for the removal process.
- a circuit structure 24 is formed on the encapsulant 23 and the active surfaces 22 a of the chips 22 and electrically connected to the electrode pads 220 of the chips 22 .
- the circuit structure 24 has at least a dielectric layer 240 formed on the encapsulant 23 and the active surfaces 22 a of the chips 22 , a circuit layer 241 formed on the dielectric layer 240 and a plurality of conductive vias 242 formed in the dielectric layer 230 for electrically connecting the circuit layer 241 and the electrode pads 220 of the chips 22 .
- an insulating protection layer 25 is formed on the outermost dielectric layer 240 and a plurality of openings 250 are formed in the insulating protection layer 25 such that a portion of the circuit layer 241 is exposed through the openings 250 so as for conductive elements 26 to be disposed thereon.
- the number of the dielectric layers 240 can be multiple so as to increase the number of the circuit layers 241 .
- the insulating protection layer 25 has a thickness of 30 to 500 um.
- the insulating protection layer 25 can be made of SiO 2 or silicon nitride so as to serve as a passivation layer.
- the insulating protection layer 25 can also be made of a reinforcing material such as polyimide (PI) and polybenzoxazole (PBO).
- the conductive elements 26 can be, but not limited to, solder balls, solder bumps or solder pins.
- the circuit structure 24 can have at least a dielectric layer 240 formed on the encapsulant 23 , and a circuit layer 241 formed on the dielectric layer 240 and the active surfaces 22 a of the chips 22 for electrically connecting the electrode pads 220 of the chips 22 .
- the present invention forms the encapsulant 23 to encapsulate the chips 22 through laminating or coating instead of molding and then forms the circuit structure 24 of large size through patterning, thus effectively reducing the fabrication cost.
- a laser cutting tool or saw blade is used to perform a singulation process along cutting lines L (as shown in FIG. 2G ) through the gaps 280 so as to obtain a plurality of semiconductor packages 2 , 2 ′.
- the bonding between the bonding layer 27 and the support plate 29 is eliminated.
- the support plate 29 together with the isolation layer 28 can be removed. Therefore, the sandwich structure consisting of the support plate 29 , the isolation layer 28 and the bonding layer 27 facilitates to obtain the semiconductor packages 2 after the cutting process.
- a singulation process is performed along cutting lines L′ (as shown in FIG. 2 G′′) around the chips 22 and further along cutting lines L′′ (as shown in FIG. 2 G′′) at the edges of the isolation layer 28 ′ so as to remove the support plate 29 and the isolation layer 28 .
- the present invention further provides a semiconductor package 2 , 2 ′, which has: an encapsulant 23 having a first surface 23 a and a second surface 23 b opposite to the first surface 23 a ; a chip 22 embedded in the encapsulant 23 ; a circuit structure 24 formed on the encapsulant 23 ; and a bonding layer 27 formed on the second surface 23 b of the encapsulant 23 .
- the first surface 23 a of the encapsulant 23 has a protruding portion 230 .
- the chip 22 is embedded in the protruding portion 230 and has an active surface 22 a with a plurality of electrode pads 220 and an inactive surface 22 b opposite to the active surface 22 a , and the active surface 22 a and the electrode pads 220 are exposed from the protruding portion 230 of the encapsulant 23 .
- the bonding layer 27 is made of PI, a dry film or a semi-dry film.
- the circuit structure 24 is formed on the first surface 23 a of the encapsulant 23 and the active surface 22 a of the chip 22 and electrically connected to the electrode pads 220 of the chip 22 .
- the circuit structure 24 has at least a dielectric layer 240 formed on the encapsulant 23 and the active surface 22 a , a circuit layer 241 formed on the dielectric layer 240 and a plurality of conductive vias 242 formed in the dielectric layer 240 for electrically connecting the circuit layer 241 and the electrode pads 220 of the chip 22 .
- the circuit structure 24 has at least a dielectric layer 240 formed on the encapsulant 23 and a circuit layer 241 formed on the dielectric layer 240 and the active surface 22 a of the chip 22 for electrically connecting the electrode pads 220 of the chip 22 .
- an insulating protection layer 25 is formed on the outermost dielectric layer 240 of the circuit structure 24 and has a plurality of openings 250 therein such that portions of the circuit layer 241 are exposed through the openings 250 so as for conductive elements 26 to be disposed thereon.
- the circuit structure 24 can have multiple circuit layers.
- the present invention avoids warpage of the overall structure, thereby effectively improving the product reliability.
- the release layer can be easily formed on a carrier of large size so as to facilitate transport and improve the production efficiency.
- the present invention reduces the fabrication cost.
- the isolation layer is neither adhesive to the bonding layer nor adhesive to the support plate, by cutting through the gaps in the isolation layer to eliminate the bonding between the bonding layer and the support plate, the present invention can conveniently remove the support plate and the isolation layer so as to obtain a plurality of semiconductor packages.
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Abstract
A fabrication method of a semiconductor package includes the steps of: forming a release layer on a carrier having concave portions; disposing chips on the release layer in the concave portions of the carrier; forming an encapsulant on the chips and the release layer; forming a bonding layer on the encapsulant; removing the release layer and the carrier so as to expose the active surfaces of the chips; and forming a circuit structure on the encapsulant and the chips. Since the release layer is only slightly adhesive to the chips and the encapsulant, the present invention avoids warpage of the overall structure during a thermal cycle caused by incompatible CTEs.
Description
- 1. Field of the Invention
- The present invention relates to semiconductor packages and fabrication methods thereof, and more particularly, to a high-reliability semiconductor package and a fabrication method thereof.
- 2. Description of Related Art
- Along with the rapid development of electronic industries, electronic products are developed towards multi-function and high performance. To meet the miniaturization requirement of semiconductor packages, wafer level packaging (WLP) technologies have been developed.
- U.S. Pat. No. 6,452,265 and U.S. Pat. No. 7,202,107 provide fabrication methods of wafer-level packages.
FIGS. 1A to 1E are schematic cross-sectional views showing a fabrication method of aconventional semiconductor package 1. - Referring to
FIG. 1A , a thermal releaseadhesive layer 11 is applied on acarrier 10. Thethermal release tape 11 loses its adhesive property when heated. - Referring to
FIG. 1B , a plurality ofchips 12 are disposed on the thermal releaseadhesive layer 11. Each of thechips 12 has anactive surface 12 a with a plurality ofelectrode pads 120 and aninactive surface 12 b opposite to theactive surface 12 a, and is disposed on the thermal releaseadhesive layer 11 via theactive surface 12 a thereof. - Referring to
FIG. 1C , anencapsulant 13 is formed on thechips 12 and thethermal release tape 11 through molding. - Referring to
FIG. 1D , the thermal releaseadhesive layer 11 and thecarrier 10 are removed by heating, thereby exposing theactive surfaces 12 a of thechips 12. - Referring to
FIG. 1E , acircuit structure 14 is formed on theencapsulant 13 and theactive surfaces 12 a of thechips 12 and electrically connected to theelectrode pads 120 of thechips 12. - However, since the thermal release
adhesive layer 11 is adhesive and the difference of CTEs (Coefficient of Thermal Expansion) between the thermal releaseadhesive layer 11 and thecarrier 10 is substantial, after theencapsulant 13 is formed, warpage can easily occur to the overall structure during a thermal cycle, thus reducing the product reliability. - Further, it is difficult to uniformly coat the thermal release
adhesive layer 11 on a large-sized carrier 10. Therefore, the thermal release adhesive layer is preferably coated on a small-sized carrier 10. However, in comparison to a large-sized carrier, it is more difficult for the conveying equipment (not shown) to transport such a small-sized carrier, thereby adversely affecting the production efficiency. - Therefore, how to overcome the above-described drawbacks has become critical.
- In view of the above-described drawbacks, the present invention provides a semiconductor package, which comprises: an encapsulant having a first surface formed with a protruding portion and a second surface opposite to the first surface; a chip embedded in the protruding portion of the encapsulant, wherein the chip has an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface, the active surface and the electrode pads being exposed from the protruding portion of the encapsulant; a circuit structure formed on the first surface of the encapsulant and the active surface of the chip and electrically connected to the electrode pads of the chip; and a bonding layer formed on the second surface of the encapsulant.
- The present invention further provides a fabrication method of a semiconductor package, which comprises the steps of: providing a carrier having a plurality of concave portions on a surface thereof and a release layer formed on the surface having the concave portions; disposing a plurality of chips on the release layer in the concave portions, respectively, wherein each of the chips has an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface, the chip being disposed on the release layer via the active surface thereof; forming an encapsulant on the chips and the release layer; forming a bonding layer on the encapsulant; removing the release layer and the carrier so as to expose the active surfaces of the chips; and forming a circuit structure on the encapsulant and the active surfaces of the chips so as to electrically connect the circuit structure and the electrode pads of the chips.
- In the above-described method, the carrier can be made of glass or metal, and the release layer can be made of a hydrophobic material, an inorganic material or a high polymer.
- In the above-described method, the release layer can be formed through plasma-enhanced chemical vapor deposition (PECVD), and the bonding layer can be formed through lamination.
- The above-described method can further comprise performing a singulation process so as to obtain a plurality of semiconductor packages.
- Before removing the release layer and the carrier, the method can further comprise forming an isolation layer on the bonding layer, wherein the isolation layer is formed on a support plate so as to be sandwiched between the support plate and the bonding layer. Further, before forming the bonding layer on the encapsulant, the method can first sandwich the isolation layer between the support plate and the bonding layer. Therein, the isolation layer is not adhesive to the support plate and the bonding layer.
- The isolation layer can be patterned to form gaps therein and then the isolation layer can be embedded in the bonding layer such that a portion of the bonding layer is formed in the gaps for bonding with the support plate. After forming the circuit structure, the method can further comprise cutting the overall structure along cutting paths through the gaps so as to remove the isolation layer and the support plate, thereby obtaining a plurality of semiconductor packages. Alternatively, the area of the isolation layer can be less than the area of the bonding layer and the area of the support plate such that a portion of the bonding layer encapsulates the edges of the isolation layer for the bonding layer to be bonded with the edges of the support plate. As such, after forming the circuit structure, the method can further comprise singulating the chips and cutting along the edges of the isolation layer so as to remove the support plate and the isolation layer, thereby obtaining a plurality of semiconductor packages.
- In the above-described semiconductor package and method, the bonding layer can be made of polyimide (PI), a dry film or a semi-dry material.
- In the above-described semiconductor package and method, the circuit structure can have at least a dielectric layer formed on the encapsulant and the active surface of the chip, a circuit layer formed on the dielectric layer and a plurality of conductive vias formed in the dielectric layer for electrically connecting the circuit layer and the electrode pads of the chip.
- Further, an insulating protection layer can be formed on the outermost dielectric layer of the circuit structure and have a plurality of openings therein such that a portion of the circuit layer is exposed through the openings so as for conductive elements to be disposed thereon through the openings.
- In other embodiments, the circuit structure can have at least a dielectric layer formed on the encapsulant, and a circuit layer formed on the dielectric layer and the active surface of the chip so as to electrically connect the electrode pads of the chip.
- Therefore, by providing the release layer that is only slightly adhesive to the chips and the encapsulant, the present invention avoids warpage of the overall structure during a thermal cycle caused by incompatible CTEs. Further, the release layer can be easily formed on a carrier of large size through PECVD, thereby facilitating transport and improving the production efficiency.
-
FIGS. 1A to 1E are schematic cross-sectional views showing a fabrication method of a conventional semiconductor package; and -
FIGS. 2A to 2H are schematic cross-sectional views showing a fabrication method of a semiconductor package according to the present invention, wherein FIG. 2E′ shows another embodiment ofFIG. 2E , and FIGS. 2G′, 2G″ and 2H′ show other embodiments ofFIGS. 2G and 2H , respectively. - The following illustrative embodiments are provided to illustrate the disclosure of the present invention, these and other advantages and effects can be apparent to those in the art after reading this specification.
- It should be noted that the drawings are only for illustrative purposes and not intended to limit the present invention. Meanwhile, terms such as ‘on’, ‘a’ etc. are only used as a matter of descriptive convenience and not intended to have any other significance or provide limitations for the present invention.
-
FIGS. 2A to 2H are schematic cross-sectional views showing a fabrication method of asemiconductor package 2 according to the present invention. - Referring to
FIG. 2A , acarrier 20 having a plurality ofconcave portions 200 on a surface thereof is provided. In the present embodiment, thecarrier 20 is made of glass or metal, and theconcave portions 200 are array arranged on thecarrier 20. - Referring to
FIG. 2B , arelease layer 21 is formed on the surface of thecarrier 20 having theconcave portions 200. - In the present embodiment, the
release layer 21 is made of a hydrophobic material, an inorganic material or a high polymer such as poly-para-xylylene (parylene), and formed through plasma-enhanced chemical vapor deposition (PECVD). - Further, the
release layer 21 can be easily formed on thecarrier 20 of large size through PECVD, thereby facilitating transport of thecarrier 20 and improving the production efficiency. - Referring to
FIG. 2C , a plurality ofchips 22 are disposed on therelease layer 21 in theconcave portions 200, respectively. Each of thechips 22 has anactive surface 22 a with a plurality ofelectrode pads 220 and aninactive surface 22 b opposite to theactive surface 22 a, and thechip 22 is disposed on therelease layer 21 via theactive surface 22 a thereof. - The
concave portions 200 facilitate alignment of thechips 22 so as to avoid position deviation. Further, since therelease layer 21 is only slightly adhesive to thechips 22 in comparison to the conventional thermal release adhesive layer, the present invention avoids significant position deviations of thechips 22 caused by the CTE of therelease layer 21, thereby securing thechips 22 in position and improving the reliability of subsequent processes. - Referring to
FIG. 2D , anencapsulant 23 is formed on thechips 22 and therelease layer 21 by laminating or coating so as to encapsulate thechips 22. - In the present embodiment, the
encapsulant 23 can be made of, but not limited to, polyimide (PI). Therelease layer 21 is slightly adhesive to theencapsulant 23. - Referring to
FIGS. 2D and 2E , abonding layer 27 is laminated on theencapsulant 23 through asupport plate 29, and anisolation layer 28 is laminated in thebonding layer 27. - In the present embodiment, the
bonding layer 27 has a thickness of 10 to 100 um. Thebonding layer 27 can be made of polyimide (PI), a dry film or a semi-dry material. Thesupport plate 29 can be made of glass. - Further, the
isolation layer 28 is neither adhesive to the bonding layer 27 (such as PI) nor adhesive to the support plate 29 (such as glass), and the bonding layer 27 (such as PI) is adhesive to the support plate 29 (such as glass). Therefore, in the fabrication process, theisolation layer 28 is first patterned to formgaps 280 therein and then laminated such that thebonding layer 27 is pressed into thegaps 280 for bonding with thesupport plate 29. - Referring to
FIG. 2D , in the present embodiment, thebonding layer 27, theisolation layer 28 and thesupport plate 29 are laminated simultaneously. In other embodiment, thebonding layer 27 can be formed on theencapsulant 23 first and then theisolation layer 28 is pressed into thebonding layer 27 through thesupport plate 29. - In another embodiment, referring to FIG. 2E′, the
isolation layer 28′ can have an area less than the area of thebonding layer 27 and the area of thesupport plate 29. As such, during the lamination process, a portion of thebonding layer 27 is pressed to encapsulate the edges of theisolation layer 28′ so as to bond thebonding layer 27 with the edges of thesupport plate 29. - Referring to
FIG. 2F , therelease layer 21 and thecarrier 20 are removed to expose theactive surfaces 22 a of thechips 22 and a plurality of protrudingportions 230 of theencapsulant 23. - In the present embodiment, the
carrier 20 is first removed from therelease layer 21 and then therelease layer 21 is removed through plasma. Since therelease layer 21 is removed without the need to apply heat, the present invention avoids warpage of the overall structure during a thermal cycle. - Furthermore, the
support plate 29 is provided to serve as a carrier during the removal process since the overall structure needs to be moved to another machine and turned upside down for the removal process. - Referring to
FIG. 2G acircuit structure 24 is formed on theencapsulant 23 and theactive surfaces 22 a of thechips 22 and electrically connected to theelectrode pads 220 of thechips 22. - In the present embodiment, the
circuit structure 24 has at least adielectric layer 240 formed on theencapsulant 23 and theactive surfaces 22 a of thechips 22, acircuit layer 241 formed on thedielectric layer 240 and a plurality ofconductive vias 242 formed in thedielectric layer 230 for electrically connecting thecircuit layer 241 and theelectrode pads 220 of thechips 22. Subsequently, an insulatingprotection layer 25 is formed on the outermostdielectric layer 240 and a plurality ofopenings 250 are formed in the insulatingprotection layer 25 such that a portion of thecircuit layer 241 is exposed through theopenings 250 so as forconductive elements 26 to be disposed thereon. - Therein, the number of the
dielectric layers 240 can be multiple so as to increase the number of the circuit layers 241. The insulatingprotection layer 25 has a thickness of 30 to 500 um. The insulatingprotection layer 25 can be made of SiO2 or silicon nitride so as to serve as a passivation layer. The insulatingprotection layer 25 can also be made of a reinforcing material such as polyimide (PI) and polybenzoxazole (PBO). - The
conductive elements 26 can be, but not limited to, solder balls, solder bumps or solder pins. - In another embodiment, referring to FIG. 2G′, the
circuit structure 24 can have at least adielectric layer 240 formed on theencapsulant 23, and acircuit layer 241 formed on thedielectric layer 240 and theactive surfaces 22 a of thechips 22 for electrically connecting theelectrode pads 220 of thechips 22. - The present invention forms the
encapsulant 23 to encapsulate thechips 22 through laminating or coating instead of molding and then forms thecircuit structure 24 of large size through patterning, thus effectively reducing the fabrication cost. - Referring to FIGS. 2H and 2H′, a laser cutting tool or saw blade is used to perform a singulation process along cutting lines L (as shown in
FIG. 2G ) through thegaps 280 so as to obtain a plurality ofsemiconductor packages - In the present embodiment, by cutting through the
gaps 280 in theisolation layer 28, the bonding between thebonding layer 27 and thesupport plate 29 is eliminated. As such, thesupport plate 29 together with theisolation layer 28 can be removed. Therefore, the sandwich structure consisting of thesupport plate 29, theisolation layer 28 and thebonding layer 27 facilitates to obtain thesemiconductor packages 2 after the cutting process. - In another embodiment, continued from FIG. 2E′, a singulation process is performed along cutting lines L′ (as shown in FIG. 2G″) around the
chips 22 and further along cutting lines L″ (as shown in FIG. 2G″) at the edges of theisolation layer 28′ so as to remove thesupport plate 29 and theisolation layer 28. - The present invention further provides a
semiconductor package encapsulant 23 having a first surface 23 a and a second surface 23 b opposite to the first surface 23 a; achip 22 embedded in theencapsulant 23; acircuit structure 24 formed on theencapsulant 23; and abonding layer 27 formed on the second surface 23 b of theencapsulant 23. - The first surface 23 a of the
encapsulant 23 has a protrudingportion 230. - The
chip 22 is embedded in the protrudingportion 230 and has anactive surface 22 a with a plurality ofelectrode pads 220 and aninactive surface 22 b opposite to theactive surface 22 a, and theactive surface 22 a and theelectrode pads 220 are exposed from the protrudingportion 230 of theencapsulant 23. - The
bonding layer 27 is made of PI, a dry film or a semi-dry film. - The
circuit structure 24 is formed on the first surface 23 a of theencapsulant 23 and theactive surface 22 a of thechip 22 and electrically connected to theelectrode pads 220 of thechip 22. Thecircuit structure 24 has at least adielectric layer 240 formed on theencapsulant 23 and theactive surface 22 a, acircuit layer 241 formed on thedielectric layer 240 and a plurality ofconductive vias 242 formed in thedielectric layer 240 for electrically connecting thecircuit layer 241 and theelectrode pads 220 of thechip 22. - Alternatively, the
circuit structure 24 has at least adielectric layer 240 formed on theencapsulant 23 and acircuit layer 241 formed on thedielectric layer 240 and theactive surface 22 a of thechip 22 for electrically connecting theelectrode pads 220 of thechip 22. - Furthermore, an insulating
protection layer 25 is formed on the outermostdielectric layer 240 of thecircuit structure 24 and has a plurality ofopenings 250 therein such that portions of thecircuit layer 241 are exposed through theopenings 250 so as forconductive elements 26 to be disposed thereon. Moreover, in other embodiments, thecircuit structure 24 can have multiple circuit layers. - Therefore, by providing the release layer that is only slightly adhesive to the chips and the encapsulant, the present invention avoids warpage of the overall structure, thereby effectively improving the product reliability.
- Further, the release layer can be easily formed on a carrier of large size so as to facilitate transport and improve the production efficiency.
- Furthermore, by forming the encapsulant through laminating or coating and then forming the circuit structure of large size through patterning, the present invention reduces the fabrication cost.
- Moreover, since the isolation layer is neither adhesive to the bonding layer nor adhesive to the support plate, by cutting through the gaps in the isolation layer to eliminate the bonding between the bonding layer and the support plate, the present invention can conveniently remove the support plate and the isolation layer so as to obtain a plurality of semiconductor packages.
- The above-described descriptions of the detailed embodiments are only to illustrate the preferred implementation according to the present invention, and it is not to limit the scope of the present invention. Accordingly, all modifications and variations completed by those with ordinary skill in the art should fall within the scope of present invention defined by the appended claims.
Claims (22)
1. A semiconductor package, comprising:
an encapsulant having a first surface formed with a protruding portion and a second surface opposite to the first surface;
a chip embedded in the protruding portion of the encapsulant, wherein the chip has an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface, the active surface and the electrode pads being exposed from the protruding portion of the encapsulant;
a circuit structure formed on the first surface of the encapsulant and the active surface of the chip and electrically connected to the electrode pads of the chip; and
a bonding layer formed on the second surface of the encapsulant.
2. The package of claim 1 , wherein the circuit structure has at least a dielectric layer formed on the encapsulant and the active surface of the chip, a circuit layer formed on the dielectric layer, and a plurality of conductive vias formed in the dielectric layer for electrically connecting the circuit layer and the electrode pads of the chip.
3. The package of claim 2 , further comprising an insulating protection layer formed on the outermost one of the at least a dielectric layer of the circuit structure and having a plurality of openings formed therein such that a portion of the circuit layer is exposed through the openings so as for conductive elements to be disposed thereon.
4. The package of claim 1 , wherein the circuit structure has at least a dielectric layer formed on the encapsulant, and a circuit layer formed on the dielectric layer and the active surface of the chip so as to electrically connect the electrode pads of the chip.
5. The package of claim 1 , wherein the bonding layer is made of polyimide (PI), a dry film or a semi-dry material.
6. A fabrication method of a semiconductor package, comprising the steps of:
providing a carrier having a plurality of concave portions on a surface thereof and a release layer formed on the surface having the concave portions;
disposing a plurality of chips on the release layer in the concave portions, respectively, wherein each of the chips has an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface, the chips being disposed on the release layer via the active surfaces thereof;
forming an encapsulant on the chips and the release layer;
forming a bonding layer on the encapsulant;
removing the release layer and the carrier so as to expose the active surfaces of the chips; and
forming a circuit structure on the encapsulant and the active surfaces of the chips so as to electrically connect the circuit structure and the electrode pads of the chips.
7. The method of claim 6 , wherein the carrier is made of glass or metal.
8. The method of claim 6 , wherein the release layer is made of a hydrophobic material, an inorganic material or a high polymer.
9. The method of claim 6 , wherein the release layer is formed through plasma-enhanced chemical vapor deposition (PECVD).
10. The method of claim 6 , wherein the bonding layer is formed through lamination.
11. The method of claim 6 , wherein the bonding layer is made of polyimide (PI), a dry film or a semi-dry material.
12. The method of claim 6 , wherein the circuit structure has at least a dielectric layer formed on the encapsulant and the active surfaces of the chips, a circuit layer formed on the dielectric layer and a plurality of conductive vias formed in the dielectric layer for electrically connecting the circuit layer and the electrode pads of the chips.
13. The method of claim 12 , further comprising forming an insulating protection layer on the outermost one of the at least a dielectric layer of the circuit structure and forming a plurality of openings in the insulating protection layer such that a portion of the circuit layer is exposed through the openings so as for conductive elements to be disposed thereon.
14. The method of claim 6 , wherein the circuit structure has at least a dielectric layer formed on the encapsulant and a circuit layer formed on the dielectric layer and the active surfaces of the chips for electrically connecting the electrode pads of the chips.
15. The method of claim 6 , before removing the release layer and the carrier, further comprising forming an isolation layer on the bonding layer, wherein the isolation layer is disposed on a support plate so as to be sandwiched between the support plate and the bonding layer.
16. The method of claim 15 , before forming the bonding layer on the encapsulant, further comprising sandwiching the isolation layer between the support plate and the bonding layer.
17. The method of claim 15 , wherein the isolation layer is free from being adhered to the support plate and the bonding layer.
18. The method of claim 15 , wherein the isolation layer is patterned to form gaps therein and then the isolation layer is embedded in the bonding layer such that portions of the bonding layer are positioned in the gaps for bonding with the support plate.
19. The method of claim 18 , after forming the circuit structure, further comprising cutting the overall structure along cutting paths through the gaps so as to remove the isolation layer and the support plate, thereby obtaining a plurality of semiconductor packages.
20. The method of claim 15 , wherein the isolation layer is less in area than the bonding layer and the support plate such a portion of the bonding layer encapsulates edges of the isolation layer for the bonding layer to be bonded with edges of the support plate.
21. The method of claim 20 , after forming the circuit structure, further comprising singulating the chips and cutting along the edges of the isolation layer so as to remove the support plate and the isolation layer, thereby obtaining a plurality of semiconductor packages.
22. The method of claim 6 , further comprising performing a singulation process so as to obtain a plurality of semiconductor packages.
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Cited By (8)
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TWI524437B (en) * | 2013-11-06 | 2016-03-01 | 矽品精密工業股份有限公司 | Method of fabricating semiconductor package |
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Also Published As
Publication number | Publication date |
---|---|
CN103295978A (en) | 2013-09-11 |
US10049955B2 (en) | 2018-08-14 |
TWI476841B (en) | 2015-03-11 |
US20170229364A1 (en) | 2017-08-10 |
TW201338059A (en) | 2013-09-16 |
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