US20130168061A1

US20130168061A1 - Heat dissipation assembly

Info

Publication number: US20130168061A1
Application number: US13/370,327
Authority: US
Inventors: Jing-Ya He
Original assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2011-12-28
Filing date: 2012-02-10
Publication date: 2013-07-04
Also published as: TW201328138A; CN103186206A

Abstract

A heat dissipation assembly includes a base, two heat pipes, a first heat sink, and a fan. The first heat sink includes a first fin assembly installed to one of the heat pipe, and a second fin assembly installed to the other heat pipe. The fan is installed to the first fin assembly opposite to the second fin assembly. The first fin assembly includes a plurality of first fins spaced from and parallel to one another. The second fin assembly includes a plurality of second fins spaced from and parallel to one another. The first fins are misaligned with the second fins. Each heat pipe is mounted to the base, and extends through the first or second fins.

Description

BACKGROUND

1. Technical Field
The present disclosure relates to a heat dissipation assembly.
2. Description of Related Art
Central processing units (CPUs) of computers or servers generate a large amount of heat during operation. The heat needs to be dissipated immediately to ensure the continued proper functioning of the computers or servers. Presently, a heat sink is mounted on a CPU for dissipating the heat, and a cooling fan is installed to the heat sink for generating airflow. However, the heat sink includes a plurality of parallel and spaced fins for the air to quickly flow through, the air cannot fully contact with the fins, thus reducing heat dissipating efficiency of the heat sink.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the embodiments can be better understood with reference to the drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is an exploded, isometric view of an exemplary embodiment of a heat dissipation assembly, together with a motherboard, wherein the heat dissipation assembly includes a first heat sink.

FIG. 2 is a side plan view of the first heat sink of FIG. 1.

FIG. 3 is a partially assembled, isometric view of the heat dissipation assembly of FIG. 1.

FIG. 4 is an assembled, isometric view of the heat dissipation assembly of FIG. 1.

DETAILED DESCRIPTION

The present disclosure, including the accompanying drawings, is illustrated by way of examples and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to FIG. 1, an embodiment of a heat dissipation assembly 100 for dissipating heat of an electronic component 302 mounted on a motherboard 300 includes a base 20, a first heat sink 40, a second heat sink 60, a bracket 80, and a fan 90. The motherboard 300 defines four fastening holes 304 adjacent to four corners of the electronic component 302. In the embodiment, the electronic component 302 is a central processing unit.
The base 20 includes a bottom wall 22 and two substantially U-shaped fixing plates 26 fixed to two opposite ends of the bottom wall 22. The bottom wall 22 defines four receiving slots 222 parallel to the ends of the bottom wall 22, between the fixing plates 26. Each fixing plate 26 includes a fixing portion 262 mounted on the corresponding end of the bottom wall 22, and two extending portions 264 slantingly extending out from two opposite ends of the fixing portion 262. A distal end of each extending portion 264 defines a through hole 266.
The first heat sink 40 includes four U-shaped heat pipes 42, a first fin assembly 44 installed to two of the heat pipes 42, and a second fin assembly 46 installed to the other two heat pipes 42. Each heat pipe 42 includes a positioning portion 422 and two heat-conductive portions 424 extending up from two opposite ends of the positioning portion 422.
The first fin assembly 44 includes a plurality of rectangular first fins 442. Each of the two opposite ends of each first fin 442 defines two inserting holes 446 and a cutout 444. The cutout 444 extends through the corresponding end of the first fin 442.
The second fin assembly 46 includes a plurality of rectangular second fin 462. Each of the two opposite ends of each second fin 462 defines two inserting holes 464.
The second heat sink 60 includes a bottom plate 62 and a plurality of fins 64 perpendicularly extending up from the bottom plate 62. The bottom of the bottom plate 62 defines four parallel receiving slots 622, opposite to the fins 64.
The bracket 80 is rectangular, and defines an opening 85 in a center. Four connecting bars 82 are formed on four sides of the bracket 80, around the opening 85. A junction of every two connecting bars 82 defines a screw hole 86. Two latching plates 84 perpendicularly extend out from two opposite connecting bars 82. A resilient hook 87 protrudes from each latching plate 84, toward the other latching plate 84.
The fan 90 is substantially rectangular, and defines four through holes 92 in four corners of the fan 90.
Referring to FIGS. 2-4, in assembly, the heat-conductive portions 424 of two heat pipes 42 are inserted into the corresponding inserting holes 446 of each first fin 442. The first fins 442 are fixed to the heat-conductive portions 424 through jointing. The first fins 442 are parallel to and spaced from one another. Every two neighboring first fins 442 cooperatively bound a first airflow channel 447. The cutouts 444 of the first fins 442 at the same end cooperatively bound a latching slot 448. The heat-conductive portions 424 of the other two heat pipes 42 are inserted into the corresponding inserting holes 464 of each second fin 462. The second fins 442 are fixed to the heat-conductive portions 424 through jointing. The second fins 462 are parallel to and spaced from one another. Every two neighboring second fins 462 cooperatively bound a second airflow channel 467.
Two bottoms of the positioning portions 422 of the heat pipes 42 fixed with the first fins 442 are received in the corresponding receiving slots 222 adjacent to one fixing plate 26, and fixed to the bottom wall 22 through jointing. Two bottoms of the positioning portions 422 of the heat pipes 42 fixed with the second fins 462 are received in the corresponding receiving slots 222 adjacent to other fixing plate 26, and fixed to the bottom wall 22 through jointing. The first fin assembly 44 is juxtaposed to the second fin assembly 46. The first and second fins 442 and 462 are misaligned. In the embodiment, every two neighboring first fins 442 cooperatively bound a first airflow channel 447, and each first airflow channel 447 aligns with one of the second fins 462. Every two neighboring second fins 462 cooperatively bound a second airflow channel 467, and each second airflow channel 467 aligns with one of the first fins 442. The second heat sink 60 is mounted on the bottom wall 22. Tops of the positioning portions 422 are received in the corresponding receiving slots 622. The latching plates 84 are attached to two opposite ends of the first fin assembly 44. The hooks 87 are inserted into the corresponding latching slots 448. Four screws extend through the through holes 92, to be screwed into the corresponding screw holes 86, thereby fixing the fan 90 to the bracket 80. The fan 90 aligns with the opening 85. The base 20 is supported on the electronic component 302. Four screws extend through the through holes 266 of the fixing plates 26, to be screwed into the corresponding fastening holes 304. Therefore, the heat dissipation assembly 100 is fixed to the motherboard 300, to dissipate heat for the electronic component 302.
In use, a first part of heat generated by the electronic component 302 is transferred to the second heat sink 60 through the base 20 and the positioning portions 422 of the heat pipe 42. A second part of the heat is transferred to the first and second fin assemblies 40 and 60 through the base and the heat pipes 42. Airflow generated by the fan 90 flows through each of the first airflow channels 447, to be separated into two corresponding second airflow channels 467. The airflow can fully contact with the first and second fins 442 and 462, to increase heat-dissipation effective.
While the disclosure describes examples and embodiments, it is to be understood that the disclosure is not limited thereto. On the contrary, the disclosure is intended to cover various modifications and similar arrangements as would be apparent to those skilled in the art. Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.

Claims

What is claimed is:

1. A heat dissipation assembly, comprising:

a base;

a first heat sink comprising two heat pipes mounted on the base, a first fin assembly installed to one of the heat pipes, and a second fin assembly installed to the other heat pipe and juxtapositional with the first fin assembly; and

a fan installed to the first fin assembly opposite to the second fin assembly;

wherein the first fin assembly comprises a plurality of first fins spaced from and parallel to one another, the second fin assembly comprises a plurality of second fins spaced from and parallel to one another, the first fins are misaligned with the second fins.

2. The heat dissipation assembly of claim 1, wherein every two neighboring first fins cooperatively bound a first airflow channel, and each first airflow channel aligns with one of the second fins.

3. The heat dissipation assembly of claim 2, wherein every two neighboring second fins cooperatively bound a second airflow channel, and each second airflow channel aligns with one of the first fins.

4. The heat dissipation assembly of claim 1, further comprising a second heat sink mounted on the base, and engaging with the heat pipes.

5. The heat dissipation assembly of claim 4, wherein each heat pipe comprises a positioning portion sandwiched between the second heat sink and the base, and two heat-conductive portions extending up from two opposite ends of the positioning portion, the heat-conductive portions extend through the first or second fins.

6. The heat dissipation assembly of claim 5, wherein the second heat sink comprises a bottom plate mounted on the base, and a plurality of fins extending up from the bottom plate.

7. The heat dissipation assembly of claim 6, wherein the base defines two parallel first receiving slots, the bottom plate defines two parallel second receiving slots communicating with the first receiving slots, the positioning portions of the heat pipes are accommodated in the first and second receiving slots.

8. The heat dissipation assembly of claim 1, further comprising a bracket mounted to the first fin assembly, wherein two opposite ends of each first fin defines a cutout, the cutouts of the first fins at a same end cooperatively form a latching slot, the bracket comprises four connecting bars for fixing the fan, two latching plates extend out from two opposite connecting bars, a resilient hook protrudes from each latching plate to engage in one of the corresponding latching slots.