US20130168055A1

US20130168055A1 - Thermal module

Info

Publication number: US20130168055A1
Application number: US13/409,108
Authority: US
Inventors: Chun-Ming Wu
Original assignee: Asia Vital Components Co Ltd
Current assignee: Asia Vital Components Co Ltd
Priority date: 2011-12-30
Filing date: 2012-03-01
Publication date: 2013-07-04
Also published as: TW201326721A; TWI460388B

Abstract

A thermal module includes a heat sink and a heat pipe. The heat sink has a heat absorption section and a heat dissipation section. The heat dissipation section has multiple radiating fins. The heat absorption section is formed with at least one receiving groove. The heat pipe is received in the receiving groove. The heat pipe has a first end, a second end, a middle section and at least one conduction section. The first and second ends and the middle section are arranged in adjacency to each other to together define a first section. The conduction section winds around the first section.

Description

This application claims the priority benefit of Taiwan patent application number 100149731 filed on Dec. 30, 2011.

BACKGROUND OF THE INVENTION

1. Field of the Invention
The present invention relates generally to a thermal module, and more particularly to a thermal module, which has better heat transfer efficiency and overcomes the shortcoming of the conventional thermal module that the ends of the heat pipe fail to conduct heat as invalid ends.
2. Description of the Related Art
Following the advance of semiconductor technique, the volume of integrated circuit has been more and more minified. With respect to an internal processor or the like integrated circuit electronic component, the faster the operation speed is, the more the heat generated per unit time is. The heat must be dissipated in time. Otherwise, the temperature will rise to cause unstable operation. In general, a heat sink is arranged on the internal processor to help in dissipating the heat so as to lower the temperature of the internal processor and the south and north bridge chips.
Please refer to FIG. 1, which is a perspective exploded view of a conventional thermal module. The conventional heat sink 3 has a heat absorption section 31 and a heat dissipation section 32. The heat absorption section 31 is attached to a heat source 4 to conduct the heat to the heat dissipation section 32. Then multiple radiating fins 321 of the heat dissipation section 32 dissipate the heat by way of radiation to enhance heat dissipation efficiency. In order to further increase heat conduction efficiency, the heat sink 3 is often connected with a heat pipe 5 to speed heat conduction. Two ends of the heat pipe 5 are respectively connected to the heat absorption section 31 and heat dissipation section 32 of the heat sink 3 to increase the heat transfer efficiency. Such structure has some shortcomings. For example, the two ends of the heat pipe 5 are the sections that have lowest heat transfer efficiency. The working fluid contained in the heat pipe 5 is likely to stagnate in the two ends as invalid ends to make the heat pipe 5 lose its heat transfer function. This will greatly deteriorate the heat dissipation performance of the heat sink 3.
Please refer to FIG. 2, which is a perspective exploded view of another conventional thermal module. In the conventional thermal module, the heat absorption section 31 of the heat sink 3 is formed with grooves 311. Multiple heat pipes 5 are positioned in the grooves 311 to increase the heat conduction efficiency. A central section 312 of the heat sink 3 is attached to the heat source 4. Therefore, the heat pipes 5 are arranged at the central section 312 of the heat absorption section 31. Two ends of each heat pipe 5 extend from the central section 312 to the surrounding thereof to speed the heat conduction. Such structure also has the above problem that the two ends of the heat pipe 5 often fail to conduct the heat as invalid ends to make the heat pipe 5 lose its heat transfer function. Therefore, the heat sink 3 with the heat pipes 5 still can hardly achieve an expected effect and the heat transfer performance of the heat sink 3 with the heat pipes 5 is still limited.

SUMMARY OF THE INVENTION

A primary object of the present invention is to provide a thermal module, which has better heat transfer efficiency.
To achieve the above and other objects, the thermal module of the present invention includes a heat sink and a heat pipe.
The heat sink has a heat absorption section and a heat dissipation section. The heat dissipation section has multiple radiating fins. The heat absorption section is formed with at least one receiving groove.
The heat pipe is received in the receiving groove. The heat pipe has a first end, a second end, a middle section and at least one conduction section. The first and second ends and the middle section are arranged in adjacency to each other to together define a first section. The conduction section winds around the first section.
In the thermal module of the present invention, the heat pipe is fully utilized to conduct heat so that the heat dissipation efficiency is greatly enhanced. Also, the thermal module of the present invention overcomes the shortcoming of the conventional thermal module that the ends of the heat pipe fail to conduct heat as invalid ends, which cause decrease of heat transfer efficiency.

BRIEF DESCRIPTION OF THE DRAWINGS

The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:

FIG. 1 is a perspective exploded view of a conventional thermal module;

FIG. 2 is a perspective exploded view of another conventional thermal module;

FIG. 3 is a perspective exploded view of a first embodiment of the thermal module of the present invention;

FIG. 4 is a perspective assembled view of the first embodiment of the thermal module of the present invention;

FIG. 5 is a sectional assembled view of the first embodiment of the thermal module of the present invention;

FIG. 6 is a perspective exploded view of a second embodiment of the thermal module of the present invention;

FIG. 7 is a perspective exploded view of a third embodiment of the thermal module of the present invention;

FIG. 8 is a perspective assembled view of the third embodiment of the thermal module of the present invention;

FIG. 9 is a perspective exploded view of the third embodiment of the thermal module of the present invention in another aspect;

FIG. 10 is a perspective assembled view of the third embodiment of the thermal module of the present invention in the other aspect;

FIG. 11 is a perspective exploded view of a fourth embodiment of the thermal module of the present invention;

FIG. 12 is a perspective view of the heat pipe of a fifth embodiment of the thermal module of the present invention;

FIG. 12A is a perspective sectional view taken along line A-A of FIG. 12;

FIG. 13 is a perspective view showing the application of the thermal module of the present invention; and

FIG. 14 is also a perspective view showing the application of the thermal module of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Please refer to FIGS. 3, 4 and 5. FIG. 3 is a perspective exploded view of a first embodiment of the thermal module of the present invention. FIG. 4 is a perspective assembled view of the first embodiment of the thermal module of the present invention. FIG. 5 is a sectional assembled view of the first embodiment of the thermal module of the present invention. According to the first embodiment, the thermal module 1 includes a heat sink 11 and a heat pipe 12.
The heat sink 11 has a heat absorption section 111 and a heat dissipation section 112. The heat dissipation section 112 has multiple radiating fins 1121. The heat absorption section 111 is formed with at least one receiving groove 113.
The heat pipe 12 is received in the receiving groove 113. The heat pipe 12 has a first end 121, a second end 122, a middle section 123 and at least one conduction section 124. The first and second ends 121, 122 and the middle section 123 are arranged in adjacency to each other to together define a first section 13. The conduction section 124 winds around the first section 13.
The receiving groove 113 has a heat absorption section 1131 and a spreading section 1132. The heat absorption section 1131 is disposed on inner side of the spreading section 1132. The spreading section 1132 is disposed around the heat absorption section 1131. The first section 13 of the heat pipe 12 is disposed in the heat absorption section 1131, while the conduction section 124 is disposed in the spreading section 1132.
The heat pipe 12 has a first side 125 and a second side 126. Both the first and second sides 125, 126 have a flat form.
The first and second ends 121, 122 and the middle section 123 of the heat pipe 12 are arranged in adjacency to each other on inner side of the conduction section 124. The conduction section 124 winds around the first and second ends 121, 122 and the middle section 123 in connection with the first and second ends 121, 122 and the middle section 123.
The receiving groove 113 has an open side 1133 and a closed side 1134. The first side 125 of the heat pipe 12 is correspondingly attached to the closed side 1134 by means of brazing, adhesion, insertion or press fit. The second side 126 of the heat pipe 12 is correspondingly positioned in the open side 1133.
Please now refer to FIG. 6, which is a perspective exploded view of a second embodiment of the thermal module of the present invention. The second embodiment is substantially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter. The second embodiment is different from the first embodiment in that the first section 13 of the heat pipe 12 is adjacent to the conduction section 124. As a whole, the heat pipe 12 has an asymmetrical form. The first section 13 is positioned in a position offset from the position of the heat source 2.
Please now refer to FIGS. 7, 8, 9 and 10. FIG. 7 is a perspective exploded view of a third embodiment of the thermal module of the present invention. FIG. 8 is a perspective assembled view of the third embodiment of the thermal module of the present invention. FIG. 9 is a perspective exploded view of the third embodiment of the thermal module of the present invention in another aspect. FIG. 10 is a perspective assembled view of the third embodiment of the thermal module of the present invention in the other aspect. The third embodiment is substantially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter. The third embodiment is different from the first embodiment in that the thermal module 1 further includes a substrate 6 correspondingly attached to the first section 13 of the heat pipe 12. The substrate 6 is connected with the heat pipe 12 and the heat sink 11 by means of brazing, adhesion, insertion or press fit.
FIGS. 9 and 10 show the third embodiment in the other aspect. In this aspect, the substrate 6 is correspondingly attached to the entire heat pipe 12. The substrate 6 is connected with the heat pipe 12 and the heat sink 11 by means of brazing, adhesion, insertion or press fit.
Please now refer to FIG. 11, which is a perspective exploded view of a fourth embodiment of the thermal module of the present invention. The fourth embodiment is substantially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter. The fourth embodiment is different from the first embodiment in that the heat dissipation section 112 is composed of multiple stacked radiating fins 1121. The radiating fins 1121 are attached to one side of the heat absorption section 111 opposite to the heat pipe 12 by means of brazing, adhesion, press fit or insertion.
Please now refer to FIGS. 12 and 12A. FIG. 12 is a perspective view of the heat pipe of a fifth embodiment of the thermal module of the present invention. FIG. 12A is a perspective sectional view taken along line A-A of FIG. 12. The fifth embodiment is substantially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter. The fifth embodiment is different from the first embodiment in that the heat pipe 12 has a flat second side 126 and a D-shaped cross section.
Please refer to FIGS. 13 and 14, which show the application of the thermal module of the present invention. The thermal module 1 is in contact with at least one heat source 2 for conducting the heat generated by the heat source 2. The heat absorption section 111 of the heat sink 11 of the thermal module 1 serves to contact the heat source 2. The heat pipe 12 received in the receiving groove 113 of the heat absorption section 111 is also attached to the heat source 2. The first part 13, (that is, the first and second ends 121, 122 and the middle section 123) of the heat pipe 12 is substantially positioned at the center of the heat absorption section 111 in direct contact with the heat source 2. Alternatively, the first part 13 can be positioned on another part of the heat absorption section 111 (as shown in FIG. 6). The first part 13 serves to absorb the heat generated by the heat source 2 and spread the heat to the conduction section 124 of the heat pipe 12. The conduction section 124 then further directly conducts and spreads the heat over the heat absorption section 111 of the heat sink 11 to uniformly transfer the heat.
The heat generated by the heat source 2 not only is spread over the heat absorption section 111 of the heat sink 11 by the heat pipe 12 in a horizontal direction, but also is directly conducted by the heat absorption section 111 from the heat source 2 to the heat dissipation section 112 of the heat sink 11 in a vertical direction. Therefore, the heat dissipation performance of the heat sink 11 is greatly enhanced.
The above embodiments are only used to illustrate the present invention, not intended to limit the scope thereof. It is understood that many changes and modifications of the above embodiments can be made without departing from the spirit of the present invention. The scope of the present invention is limited only by the appended claims.

Claims

What is claimed is:

1. A thermal module comprising:

a heat sink having a heat absorption section and a heat dissipation section, the heat dissipation section having multiple radiating fins, the heat absorption section being formed with at least one receiving groove; and

a heat pipe received in the receiving groove, the heat pipe having a first end, a second end, a middle section and at least one conduction section, the first and second ends and the middle section being arranged in adjacency to each other to together define a first section, the conduction section winding around the first section.

2. The thermal module as claimed in claim 1, wherein the receiving groove has a heat absorption section and a spreading section, the heat absorption section being disposed on inner side of the spreading section, the first section of the heat pipe being disposed in the heat absorption section, while the conduction section of the heat pipe being disposed in the spreading section.

3. The thermal module as claimed in claim 1, wherein the first section of the heat pipe is adjacent to the conduction section and as a whole, the heat pipe has an asymmetrical form.

4. The thermal module as claimed in claim 1, wherein the receiving groove has an open side and a closed side, the heat pipe having a first side and a second side, the first side of the heat pipe being correspondingly attached to the closed side, the second side of the heat pipe being correspondingly positioned in the open side.

5. The thermal module as claimed in claim 4, wherein one of the first and second sides of the heat pipe has a flat form.

6. The thermal module as claimed in claim 4, wherein both the first and second sides of the heat pipe have a flat form.

7. The thermal module as claimed in claim 1, further comprising a substrate attached to the first section of the heat pipe.

8. The thermal module as claimed in claim 1, further comprising a substrate attached to the heat pipe.