US20130105132A1 - Heat sink fin and heat sink device - Google Patents

Heat sink fin and heat sink device Download PDF

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Publication number
US20130105132A1
US20130105132A1 US13/281,515 US201113281515A US2013105132A1 US 20130105132 A1 US20130105132 A1 US 20130105132A1 US 201113281515 A US201113281515 A US 201113281515A US 2013105132 A1 US2013105132 A1 US 2013105132A1
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United States
Prior art keywords
heat sink
heat
compressed block
fin
sink fin
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/281,515
Inventor
Tsung-Hsien Huang
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Individual
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Individual
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Publication date
Application filed by Individual filed Critical Individual
Priority to US13/281,515 priority Critical patent/US20130105132A1/en
Publication of US20130105132A1 publication Critical patent/US20130105132A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the primary object of the present invention is to provide a heat sink fin and a heat sink device.
  • the heat sink device comprises a heat sink module which is composed by a plurality of heat sink fins and at least one heat conduction pipe.
  • the heat sink fin has an extension portion which is integrally formed with a lower end of the heat sink fin.
  • the extension portion is folded or curled to form a semi-finished compressed block.
  • the semi-finished compressed block has a bottom formed with at least one an engaging recess by stamping to constitute a compressed block.
  • the compressed blocks of the heat sink fins are connected with each other to form a block member as a base.
  • the engaging recesses of the heat sink fins are to form an engaging passage for engagement of the heat conduction pipe to constitute the heat sink device having the heat conduction pipe.
  • FIG. 5 is a perspective view showing the spaced heat conduction pipes of the heat sink device according to the preferred embodiment of the present invention.
  • the heat sink device having a heat conduction pipe of the present invention comprises the plurality of heat sink fins 1 which are connected to form the heat sink module 10 and at least one heat conduction pipe 2 .
  • the heat sink fins 1 each has at least hole 13 at an upper portion thereof to form a through hole for insertion of a heat dissipation end of the heat conduction pipe 2 .
  • a heat absorption end of the heat conduction pipe 2 is inserted and engaged in the engaging passage A 1 of the block member A.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geometry (AREA)
  • Sustainable Development (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat sink device includes a heat sink module which comprises a plurality of heat sink fins and at least one heat conduction pipe. The heat sink fin has an extension portion integrally formed with a lower end of the heat sink fin. The extension portion is folded to form a semi-finished compressed block. The semi-finished compressed block has a bottom formed with at least one engaging recess by stamping to constitute a compressed block. The heat sink fins are connected one by one and the compressed blocks of the heat sink fins are connected with each other to form a block member as a base. The engaging recesses of the heat sink fins form an engaging passage for engagement of the heat conduction pipe to constitute the heat sink device having the heat conduction pipe.

Description

    BACKGROUND OF THE INVENTION
  • (a) Field of the Invention
  • The present invention relates to a heat sink fin and a heat sink device, and more particularly to a heat sink fin having an extension portion which is integrally formed with a lower end of the heat sink fin. The extension portion is folded to form a compressed block. The bottom of the compressed block is formed with at least one an engaging recess by stamping. The compressed blocks of a plurality of heat sink fins are connected with each other to form a block member as a base to couple a heat conduction pipe so as to constitute the heat sink device having the heat conduction pipe.
  • (b) Description of the Prior Art
  • A conventional heat sink device having a heat conduction pipe comprises a heat sink module, a metallic base and at least one heat conduction pipe. The heat sink module is composed of a plurality of heat sink fins which are connected one by one and coupled to the metallic base. The metallic base is a solid block. The heat conduction pipe is inserted into or coupled to the bottom of the metallic base. The base or the heat conduction pipe is attached to a heat source, such as a CPU or a memory or other electronic components, so that the heat can be conducted to the heat sink module through the heat conduction pipe and the base to enhance the heat dissipation efficiency.
  • It is necessary to use solder paste for soldering the heat sink module, the base and the heat conduction pipe of the conventional heat sink device. Besides, the components are made by different metallic materials, so they must be electroplated before soldering. This complicates the processing and increases the cost. It is inconvenient to assemble the conventional heat sink device and it is not environment-friendly. The base of the heat sink device is solid, which is heavy and large in size and uses more metallic material to increase the manufacture cost. Accordingly, the inventor of the present invention has devoted himself based on his many years of practical experiences to solve these problems.
    • SUMMARY OF THE INVENTION
  • The primary object of the present invention is to provide a heat sink fin and a heat sink device. The heat sink device comprises a heat sink module which is composed by a plurality of heat sink fins and at least one heat conduction pipe. The heat sink fin has an extension portion which is integrally formed with a lower end of the heat sink fin. The extension portion is folded or curled to form a semi-finished compressed block. The semi-finished compressed block has a bottom formed with at least one an engaging recess by stamping to constitute a compressed block. The compressed blocks of the heat sink fins are connected with each other to form a block member as a base. The engaging recesses of the heat sink fins are to form an engaging passage for engagement of the heat conduction pipe to constitute the heat sink device having the heat conduction pipe. The block member formed by the compressed blocks of the extension portions of the heat sink fins is to replace the conventional solid metallic base so as to simplify the configuration of the heat sink device without welding. The present invention can save the material, lower the cost and ensure the connection of the heat sink module and the heat conduction pipe. The heat generated by the electronic component can be immediately dissipated through the heat conduction pipe and the heat sink fins. The present invention provides a better heat dissipation efficiency.
  • Another object of the present invention is to provide a heat sink fin and a heat sink device, wherein the heat sink fin can be in any shape and the length of the extension portion of the heat sink fin can be changed as desired.
  • A further object of the present invention is to provide a heat sink fin and a heat sink device, wherein the extension portion of the heat sink fin is folded up in sequence to form the compressed block, or the extension portion is folded face-to-face more than once to form the compressed block, or the extension portion is curled to form the compressed block.
  • A further object of the present invention is to provide a heat sink fin and a heat sink device, wherein the bottom of the compressed block of the heat sink fin has a support rib formed between two adjacent engaging recesses. The support rib has a height equal to the depth of the engaging recesses, so that there is an interval between two adjacent heat conduction pipes after assembled.
  • A further object of the present invention is to provide a heat sink fin and a heat sink device, wherein the bottom of the compressed block of the heat sink fin has a support rib formed between two adjacent engaging recesses. The support rib has a height smaller than the depth of the engaging recesses to form a height difference between the support rib and the engaging recess. There is no interval between two adjacent heat conduction pipes after assembled.
  • A further object of the present invention is to provide a heat sink fin and a heat sink device, wherein the compressed block of the heat sink fin is further formed with a connecting portion by stamping, so that the adjacent heat sink fins can be connected by the connecting portion to enhance the connection of the heat sink fins.
  • A further object of the present invention is to provide a heat sink fin and a heat sink device, wherein the compressed block of the heat sink fin is further formed with a rivet hole by stamping for insertion of a rivet to firm the configuration of the block member.
  • A further object of the present invention is to provide a heat sink fin and a heat sink device, wherein the heat sink module further comprises a pair of retaining blocks at two sides of the block member. Each retaining block is riveted with a threaded post to be coupled to a circuit board.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective view showing the heat sink fin according to a preferred embodiment of the present invention;
  • FIG. 2 is a perspective view showing the heat sink fin before finished according to the preferred embodiment of the present invention;
  • FIG. 3 is a perspective view showing the semi-finished compressed block of the heat sink fin according to the preferred embodiment of the present invention;
  • FIG. 4 is a schematic view showing the heat sink module composed by the plurality of heat sink fins according to the preferred embodiment of the present invention;
  • FIG. 5 is a perspective view showing the spaced heat conduction pipes of the heat sink device according to the preferred embodiment of the present invention;
  • FIG. 6 is a sectional view showing the extension portion which is folded in sequence to form the compressed block;
  • FIG. 7 is a sectional view showing the extension portion which is folded face-to-face more than once to form the compressed block;
  • FIG. 8 is a sectional view showing the extension portion which is curled to form the compressed block;
  • FIG. 9 is a front view showing the support rib formed between two adjacent engaging recesses, wherein the support rib has a height equal to the depth of the engaging recesses;
  • FIG. 10 is a front view showing the support rib formed between two adjacent engaging recesses, wherein the support rib has a height small than the depth of the engaging recesses;
  • FIG. 11 is a perspective view to show that there is no interval between the heat conduction pipes of the heat sink device;
  • FIG. 12 is a perspective view to show that the compressed block of the heat sink fin is further formed with the connecting portion;
  • FIG. 13 is a sectional view of FIG. 12;
  • FIG. 14 is a perspective view to show that the compressed block of the heat sink fin is further provided with the rivet hole and the rivet; and
  • FIG. 15 is a sectional view of FIG. 14.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Embodiments of the present invention will now be described, by way of example only, with reference to the accompanying drawings.
  • FIG. 1 is a perspective view showing the heat sink fin 1 according to a preferred embodiment of the present invention. The heat sink fin 1 can be in any shape. The heat sink fin 1 has an extension portion 11 which is integrally formed with a lower end of the heat sink fin 1, as shown in FIG. 2. The extension portion 11 is folded (or curled) to form a semi-finished compressed block 11 a, as shown in FIG. 3. The semi-finished compressed block 11 a has a bottom formed with at least one an engaging recess 111 a by stamping to constitute a compressed block 11 b, as shown in FIG. 1. A plurality of heat sink fins 1 are connected one by one to form a heat sink module 10, as shown in FIG. 4, and the compressed blocks 11 b of the plurality of heat sink fins 1 are neighbored with each other to form a block member A as a base. The engaging recesses 111 a of the plurality of heat sink fins 1 are to form an engaging passage Al as shown in FIG. 4 for engagement of a heat conduction pipe 2, such that a heat sink device 100 having a heat conduction pipe is assembled as shown in FIG. 5.
  • The length of the extension portion 11 of the heat sink fin 1 can be changed as desired. The extension portion 11 is folded up in sequence to form the compressed block 11 b, as shown in FIG. 6. Referring to FIG. 7, the extension portion 11 can be folded face-to-face more than once to form the same compressed block 11 b. Referring to FIG. 8, the extension portion 11 can be curled to form the same compressed block 11 b.
  • As shown in FIG. 9, the bottom of the compressed block 11 b of the heat sink fin 1 has a support rib 12 formed between two adjacent engaging recesses 111 a. The support rib 12 has a height equal to the depth of the engaging recesses 111 a, so that there is an interval between two adjacent heat conduction pipes 2 after assembled, as shown in FIG. 5.
  • As shown in FIG. 10, the bottom of the compressed block 11 b of the heat sink fin 1 has a support rib 12′ formed between two adjacent engaging recesses 111 a. The support rib 12′ has a height smaller than the depth of the engaging recesses 111 a to form a height difference H between the support rib 12′ and the engaging recesses 111 a. In this way, there is no interval between two adjacent heat conduction pipes 2 after assembled, as shown in FIG. 11.
  • As shown in FIG. 12 and FIG. 13, the compressed block 11 b of the heat sink fin 1 of the present invention is further formed with a connecting portion 112 b by stamping, so that the adjacent heat sink fins 1 can be connected by the connecting portion 112 b to enhance the connection of the heat sink fins 1 and the configuration of the block member A.
  • FIG. 14 and FIG. 15 show a different embodiment of the present invention. The compressed block 11 b of the heat sink fin 1 of the present invention is further formed with a rivet hole 113 a by stamping for insertion of a rivet 114 a to firm the configuration of the block member A.
  • The heat sink device having a heat conduction pipe of the present invention comprises the plurality of heat sink fins 1 which are connected to form the heat sink module 10 and at least one heat conduction pipe 2. The heat sink fins 1 each has at least hole 13 at an upper portion thereof to form a through hole for insertion of a heat dissipation end of the heat conduction pipe 2. A heat absorption end of the heat conduction pipe 2 is inserted and engaged in the engaging passage A1 of the block member A.
  • The shape and size of the heat sink fin 1 and the connected form of the plurality of heat sink fins 1 can be changed as desired. As shown in FIG. 4, the heat sink module 10 further comprises a pair of retaining blocks 14 at two sides of the block member A. Each retaining block 14 is riveted with a threaded post 141 to be coupled to a circuit board. Although particular embodiments of the present invention have been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the present invention. Accordingly, the present invention is not to be limited except as by the appended claims.

Claims (10)

What is claimed is:
1. A heat sink fin, the heat sink fin having an extension portion which is integrally formed with a lower end of the heat sink fin, the extension portion being folded to form a semi-finished compressed block, the semi-finished compressed block having a bottom formed with at least one an engaging recess by stamping to constitute a compressed block.
2. The heat sink fin as claimed in claim 1, wherein a plurality of heat sink fins are connected one by one to form a heat sink module, the compressed blocks of the plurality of heat sink fins being connected with each other to form a block member as a base, the engaging recesses of the plurality of heat sink fins being to form an engaging passage for engagement of a heat conduction pipe to constitute a heat sink device having the heat conduction pipe.
3. The heat sink fin as claimed in claim 1, wherein the extension portion is folded up in sequence to form the compressed block.
4. The heat sink fin as claimed in claim 1, wherein the extension portion is curled to form the compressed block.
5. The heat sink fin as claimed in claim 1, wherein the bottom of the compressed block of the heat sink fin has a support rib formed between two adjacent engaging recesses, the support rib having a height equal to a depth of the engaging recesses.
6. The heat sink fin as claimed in claim 1, wherein the bottom of the compressed block of the heat sink fin has a support rib formed between two adjacent engaging recesses, the support rib having a height smaller than a depth of the engaging recesses.
7. The heat sink fin as claimed in claim 1, wherein the compressed block of the heat sink fin is further formed with a connecting portion by stamping.
8. The heat sink fin as claimed in claim 1, wherein the compressed block of the heat sink fin is further formed with a rivet hole by stamping for insertion of a rivet.
9. A heat sink device, comprising a plurality of heat sink fins connected one by one to form a heat sink module and at least one heat conduction pipe, the plurality of heat sink fins each having an extension portion which is integrally formed with a lower end of the heat sink fin, the extension portion being folded to form a semi-finished compressed block, the semi-finished compressed block having a bottom formed with at least one an engaging recess by stamping to constitute a compressed block, the plurality of heat sink fins each having at least hole at an upper portion thereof to form a through hole for insertion of a heat dissipation end of the heat conduction pipe, the compressed blocks of the plurality of heat sink fins being connected with each other to form a block member as a base, a heat absorption end of the heat conduction pipe being inserted and engaged in an engaging passage of the block member.
10. The heat sink device as claimed in claim 9, wherein the heat sink module further comprises a pair of retaining blocks at two sides of the block member, the retaining blocks each being riveted with a threaded post.
US13/281,515 2011-10-26 2011-10-26 Heat sink fin and heat sink device Abandoned US20130105132A1 (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170303435A1 (en) * 2016-04-14 2017-10-19 Microsoft Technology Licensing, Llc Heat spreader
EP3403937A1 (en) * 2017-05-19 2018-11-21 Goodrich Lighting Systems GmbH Exterior aircraft light unit
US20210114082A1 (en) * 2019-10-21 2021-04-22 Huizhou Hanxu Hardware & Plastic Technology Co., Ltd. Double-sided expanded plate riveting structure and method
US20210270538A1 (en) * 2019-09-05 2021-09-02 Ldc Precision Engineering Co., Ltd. Fast heat-sinking device for evaporators
US11262140B2 (en) * 2018-09-30 2022-03-01 Tyco Electronics (Shanghai) Co. Ltd. Heat sink and housing assembly

Citations (11)

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Publication number Priority date Publication date Assignee Title
US3241610A (en) * 1961-10-16 1966-03-22 Peerless Of America Fin and tube stock assemblies for heat exchange units
US4669535A (en) * 1985-08-07 1987-06-02 North American Specialties Corp. Heat sink formed of stacked fin elements
US6076594A (en) * 1998-10-13 2000-06-20 Kuo; Ching-Sung Heat dissipating device
US6370774B1 (en) * 2000-07-21 2002-04-16 Ling-Po Sheu Radiator with thin fins and method for producing the same
US6749011B2 (en) * 2002-08-09 2004-06-15 Sunonwealth Electric Machine Industry Co., Ltd. Heat sink
US6776224B1 (en) * 2003-05-30 2004-08-17 Shin Ming Chen Heating dissipating device for electronic elements
US7441592B2 (en) * 2006-11-26 2008-10-28 Tsung-Hsien Huang Cooler module
US20090178787A1 (en) * 2008-01-11 2009-07-16 Tsung-Hsien Huang Cooler module without base panel
US7864526B2 (en) * 2009-03-13 2011-01-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20110024087A1 (en) * 2009-07-29 2011-02-03 Kuo-Len Lin Heat-dissipating fins, large-area heat sink having such heat-dissipating fins and method for manufacturing the same
US20120312508A1 (en) * 2011-06-08 2012-12-13 Shen Chih-Yeh Gapless heat pipe combination structure and combination method thereof

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3241610A (en) * 1961-10-16 1966-03-22 Peerless Of America Fin and tube stock assemblies for heat exchange units
US4669535A (en) * 1985-08-07 1987-06-02 North American Specialties Corp. Heat sink formed of stacked fin elements
US6076594A (en) * 1998-10-13 2000-06-20 Kuo; Ching-Sung Heat dissipating device
US6370774B1 (en) * 2000-07-21 2002-04-16 Ling-Po Sheu Radiator with thin fins and method for producing the same
US6749011B2 (en) * 2002-08-09 2004-06-15 Sunonwealth Electric Machine Industry Co., Ltd. Heat sink
US6776224B1 (en) * 2003-05-30 2004-08-17 Shin Ming Chen Heating dissipating device for electronic elements
US7441592B2 (en) * 2006-11-26 2008-10-28 Tsung-Hsien Huang Cooler module
US20090178787A1 (en) * 2008-01-11 2009-07-16 Tsung-Hsien Huang Cooler module without base panel
US7864526B2 (en) * 2009-03-13 2011-01-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20110024087A1 (en) * 2009-07-29 2011-02-03 Kuo-Len Lin Heat-dissipating fins, large-area heat sink having such heat-dissipating fins and method for manufacturing the same
US20120312508A1 (en) * 2011-06-08 2012-12-13 Shen Chih-Yeh Gapless heat pipe combination structure and combination method thereof

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170303435A1 (en) * 2016-04-14 2017-10-19 Microsoft Technology Licensing, Llc Heat spreader
CN109075142A (en) * 2016-04-14 2018-12-21 微软技术许可有限责任公司 Radiator
US10653038B2 (en) * 2016-04-14 2020-05-12 Microsoft Technology Licensing, Llc Heat spreader
EP3443590B1 (en) * 2016-04-14 2023-05-03 Microsoft Technology Licensing, LLC Heat spreader
EP3403937A1 (en) * 2017-05-19 2018-11-21 Goodrich Lighting Systems GmbH Exterior aircraft light unit
US10604275B2 (en) 2017-05-19 2020-03-31 Goodrich Lighting Systems Gmbh Exterior aircraft light unit
US11262140B2 (en) * 2018-09-30 2022-03-01 Tyco Electronics (Shanghai) Co. Ltd. Heat sink and housing assembly
US20210270538A1 (en) * 2019-09-05 2021-09-02 Ldc Precision Engineering Co., Ltd. Fast heat-sinking device for evaporators
US11747091B2 (en) * 2019-09-05 2023-09-05 Ldc Precision Engineering Co., Ltd. Fast heat-sinking device for evaporators
US20210114082A1 (en) * 2019-10-21 2021-04-22 Huizhou Hanxu Hardware & Plastic Technology Co., Ltd. Double-sided expanded plate riveting structure and method
US11786959B2 (en) * 2019-10-21 2023-10-17 Huizhou Hanxu Hardware & Plastic Technology Co., Ltd. Double-sided expanded plate riveting structure and method

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