US20130052937A1

US20130052937A1 - Heat dissipation apparatus

Info

Publication number: US20130052937A1
Application number: US13/525,483
Authority: US
Inventors: Jin-Biao Ji; Zhi-Jiang Yao
Original assignee: Hongfujin Precision Industry Wuhan Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Wuhan Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2011-08-29
Filing date: 2012-06-18
Publication date: 2013-02-28
Also published as: TW201309918A; CN102958326A

Abstract

A heat dissipation apparatus includes a heat dissipating device, a fan and an air guiding duct. The heat dissipating device includes a heat conduction core, a plurality of fins, and a pair of securing fin assemblies. The pair of securing fin assemblies includes a first securing fin, and a first securing hole defined in the first securing fin. The fan includes a bottom panel and a plurality of fan blades. The bottom panel defines a fixing hole. The air guiding duct is hollow and defines an air guiding opening communicating with the plurality of fan blades. The first securing hole is aligned with the fixing hole, a fixing member is engaged in the first securing hole and the fixing hole, and the fan is secured to the heat dissipating device.

Description

BACKGROUND

1. Technical Field
The present disclosure relates to heat dissipation apparatuses, particularly to a heat dissipation apparatus for an electronic device.
2. Description of Related Art
Heat dissipating apparatus performs critical functions of removing heat from a computer system. A Balanced Technology Extended (BTX) dissipating apparatus may be used in a Small Form Factor (SFF) computer chassis, wherein the SFF has a small volume. The BTX dissipating apparatus includes a heat dissipating device and a fan. However, an additional securing member is needed to secure the fan to the device. Therefore, there is room for improvement within the art.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is an exploded, isometric view of a heat dissipation apparatus in accordance with an embodiment.

FIG. 2 is similar to FIG. 1, but viewed from another aspect.

FIG. 3 is an assembled view of the items of FIG. 1.

FIG. 4 is an exploded, isometric view of the heat dissipation apparatus and a circuit board in accordance with an embodiment.

DETAILED DESCRIPTION

The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to FIGS. 1 and 2, a heat dissipation apparatus in accordance with an embodiment includes a heat dissipating device 10, a fan 20 and an air guiding duct 30.
The heating dissipating device 10 includes a heat conduction core 11 and a plurality of fins 12 around the heat conduction core 11. Each of the plurality of fins 12 is arcuate. Four pairs of securing fin assemblies 125 are evenly arranged among the plurality of fins 12. Each of the four pairs of securing fin assemblies 125 includes a first securing fin 121 and a second securing fin 123 adjacent to the first securing fin 121. The first securing fin 121 and the second securing fin 123 all extend out of the plurality of fins 12, and a length of the first securing fin 121 is less than that of the second securing fin 123. A first securing hole 124 is defined in the first securing fin 121, and a second securing hole 126 is defined in the second securing fin 123. In one embodiment, the first securing hole 124 includes a cutout (not labeled).
The fan 20 includes an outer frame 21, and a receiving hole 201 is defined in the outer frame 21. A plurality of fan blades 202 are received in the receiving hole 201. The outer frame 21 includes a top panel 23 and bottom panel 24. The top panel 23 defines four mounting holes 231 arranged at the four corners of the top panel 23. Four fixing holes 241, arranged at the four corners of the bottom panel 24, are defined in the bottom panel 24. The four fixing holes 241 correspond to the first securing holes 124.
The air guiding duct 30 is hollow and defines an air guiding opening 31. Four securing posts 32 and four clipping portions 34 extend from a side of the air guiding duct 30. Each of the four clipping portions 34 is adjacent to each of the four securing posts 32. In one embodiment, a cross-section of the air guiding duct 30 is rectangular, and the air guiding opening 31 is rectangular. A size of the air guiding opening 31 is substantially equal to that of the receiving hole 201.
Referring to FIGS. 1-3, in assembly, the bottom panel 24 is placed on the heat dissipating device 10. The four fixing holes 241 are aligned with the four first securing holes 124. Four fixing members 90 are engaged in the four fixing holes 241 and the four first securing holes 124, to secure the fan 20 to the heat dissipating device 10. When the fixing member 90 is received in the first securing hole 241, a size of the cutout may be increased.
The four securing posts 32 are engaged in the four mounting holes 231, and the four clipping portions 34 are engaged with the top panel 23, to secure the air guiding duct 30 to the fan 20. At this point, the air guiding opening 31 corresponds to the fan 20.
Referring to FIG. 4, the heat dissipating apparatus can be attached to a circuit board 50. The circuit board 50 includes a heat generating component 51, and four positioning holes 53 are defined in the circuit board 50 and around the heat generating component 51.
When the heat dissipating apparatus is secured to the circuit board 50, the heat conduction core 11 abuts the heat generating component 51. The four second securing holes 126 are aligned with the four positioning holes 53. Four mounting members 70 are engaged in the four second securing holes 126 and the four positioning holes 53, to secure the heat dissipating apparatus to the circuit board 50. The heat generated by the heat generating component 51 is transmitted to the heat conduction core 11. The heat conduction core 11 transmits the heat to the plurality of fins 12. The fan 20 can dissipate the heat from of the plurality of fins 12 via the air guiding opening 31.
It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of embodiments, together with details of the structures and functions of the embodiments, the disclosure is illustrative only and changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. A heat dissipation apparatus comprising:

a heat dissipating device comprising a plurality of fins and a pair of securing fin assemblies; the pair of securing fin assemblies comprising a first securing fin, and a first securing hole defined in the first securing fin;

a fan secured to the heat dissipating device, the fan comprising a bottom panel and a plurality of fan blades; the bottom panel defining a fixing hole; the first securing hole being aligned with the fixing hole;

an air guiding duct attached to the fan; the air guiding duct being hollow and defining an air guiding opening communicating with the plurality of fan blades; and

a fixing member engaged in the first securing hole and the fixing hole.

2. The heat dissipation apparatus of claim 1, wherein the first securing fin extends out of the plurality of fins.

3. The heat dissipation apparatus of claim 1, wherein the pair of securing fin assemblies further comprises a second securing fin adjacent to the first securing fin, a length of the second securing fin is greater than a length of the first securing fin, and a second securing hole is defined in the second securing fin for receiving a mounting member.

4. The heat dissipation apparatus of claim 1, wherein the air guiding opening is a rectangle.

5. The heat dissipation apparatus of claim 4, wherein the fan defines a receiving hole configured to receive the plurality of fan blades, and a size of the receiving hole is substantially equal to a size of the air guiding opening.

6. The heat dissipation apparatus of claim 1, wherein the fan comprises a top panel opposite to the bottom panel, the top panel defines a mounting hole, a securing post extends from the air guiding duct, and the securing post is engaged in the mounting hole.

7. The heat dissipation apparatus of claim 6, wherein a clipping portion extends from the air guiding duct, and the clipping portion is adjacent to the securing post and clamped to the top panel.

8. The heat dissipation apparatus of claim 1, wherein the first securing fin is arcuate.

9. The heat dissipation apparatus of claim 1, wherein the first securing hole comprises a cutout, and when the fixing member is received in the first securing hole, the fixing member expands the cutout by pressing the first securing fin.

10. A heat dissipation apparatus comprising:

a heat dissipating device comprising a heat conduction core, a plurality of fins surrounding the heat conduction core, and four pairs of securing fin assemblies evenly arranged among the plurality of fins; each of the four pairs of securing fin assemblies comprising a first securing fin and a second securing fin adjacent to the first securing fin; a first securing hole being defined in the first securing fin, and a second securing hole being defined in the second securing fin; the second securing hole being adapted to receive a mounting member;

a fan attached to the heat dissipating device, comprising a bottom panel and a plurality of fan blades; the bottom panel defining a fixing hole aligned with the first securing hole;

an air guiding duct attached to the fan; the air guiding duct being hollow and defining an air guiding opening communicating with the plurality of fan blades;

a fixing member engaged in the first securing hole and the fixing hole.

11. The heat dissipation apparatus of claim 10, wherein each of the four pairs of securing fin assemblies extends out of the plurality of fins, and a length of the second securing fin is greater than a length of the first securing fin.

12. The heat dissipation apparatus of claim 10, wherein the air guiding opening is a rectangle.

13. The heat dissipation apparatus of claim 12, wherein the fan defines a receiving hole configured to receive the plurality of fan blades, and a size of the receiving hole is substantially equal to a size of the air guiding opening.

14. The heat dissipation apparatus of claim 10, wherein the fan comprises a top panel opposite to the bottom panel, the top panel defines a mounting hole, a securing post extends from the air guiding duct, and the securing post is engaged in the mounting hole.

15. The heat dissipation apparatus of claim 14, wherein a clipping portion extends from the air guiding duct, and the clipping portion is adjacent to the securing post and clamped to the top panel.

16. The heat dissipation apparatus of claim 10, wherein the first securing fin is arcuate.

17. The heat dissipation apparatus of claim 10, wherein the first securing hole comprises a cutout, and when the fixing member is received in the first securing hole, the fixing member expands the cutout by pressing the first securing fin.