US20130000881A1 - Passive heat exchanger for gimbal thermal management - Google Patents
Passive heat exchanger for gimbal thermal management Download PDFInfo
- Publication number
- US20130000881A1 US20130000881A1 US13/534,027 US201213534027A US2013000881A1 US 20130000881 A1 US20130000881 A1 US 20130000881A1 US 201213534027 A US201213534027 A US 201213534027A US 2013000881 A1 US2013000881 A1 US 2013000881A1
- Authority
- US
- United States
- Prior art keywords
- thermally conductive
- conductive shell
- extended
- external surface
- gimbal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000012080 ambient air Substances 0.000 claims abstract description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 229910052790 beryllium Inorganic materials 0.000 claims description 6
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 description 7
- 239000003570 air Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008685 targeting Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
Definitions
- the present invention relates to cooling systems, more specifically to enclosed volumes containing payloads, such as electronics and sensor equipment.
- gimbals provide stability and many degrees of freedom, but they require that the optical sensor be encapsulated by a shell.
- the shell tends to thermally isolate the optical sensor, leaving no direct path from the heat generated by the optical sensor to the exterior of the gimbal. Rather, the heat generated by the optical sensor must overcome three sources of thermal resistance by first transferring from the air to the shell, then transferring through the shell, and finally transferring from the shell to the outside air. This heat transfer scenario represents a relatively poor method for managing the dissipation of a sensor payload.
- the optical sensors can warp and become unreliable in extreme thermal conditions and, as a result, poor thermal management may often limit the environmental conditions in which these optical sensors may reliably operate.
- a thermal management system includes one or more electronics and/or sensor equipment. Further, the thermal management system includes a thermally conductive shell configured to house the electronics and/or sensor equipment. Furthermore, the thermally conductive shell includes an external surface and an internal surface. In addition, at least some portion of the external surface and the internal surface of the thermally conductive shell include an extended surface configured to reduce thermal resistance between an interior region of the thermally conductive shell and ambient air.
- a gimbal includes a thermally conductive sphere configured to house rotatably the electronics and/or sensor equipment. Further, the thermally conductive sphere includes the external surface and the internal surface. Furthermore, the at least some portion of the external surface and the internal surface of the thermally conductive sphere include the extended surface configured to reduce the thermal resistance between an interior region of the thermally conductive sphere and the ambient air.
- FIG. 1 illustrates an exemplary sectional view of a thermally conductive shell of a gimbal, according to an embodiment of the present subject matter
- FIG. 2 illustrates an exemplary sectional view of a portion of the thermally conductive shell of FIG. 1 , according to an embodiment of the present subject matter
- FIG. 3 illustrates an exemplary isometric view of the gimbal and one or more electronics and/or sensor equipment housed in the thermally conductive shell of FIG. 1 , for a thermal management system, according to an embodiment of the present subject matter.
- FIG. 1 illustrates an exemplary sectional view 100 of a thermally conductive shell 105 of a gimbal, according to an embodiment of the present subject matter.
- the thermally conductive shell 105 is configured to house rotatably one or more electronics and/or sensor equipment.
- the thermally conductive shell 105 includes an external surface 120 and an internal surface 125 .
- at least some portion of the external surface 120 and the internal surface 125 of the thermally conductive shell 105 include an external extended surface 110 and an internal extended surface 115 , respectively.
- the thermally conductive shell 105 is configured so that when the external extended surface 110 and the internal extended surface 115 are attached to the configured thermally conductive shell forming a complete thermally conductive shell.
- the thermally conductive shell 105 is configured such that the external extended surface 110 and the internal extended surface 115 are integral with a remaining portion of the thermally conductive shell 105 without including the extended surfaces.
- a material of the thermally conductive shell 105 including the external extended surface 110 and internal extended surface 115 includes aluminum, beryllium, a composite of aluminum and beryllium and the like.
- the external extended surface 110 and the internal extended surface 115 include a plurality of fins.
- the fins extend orthogonally or at a slant from the external surface 120 and the internal surface 125 of the thermally conductive shell 105 .
- the external extended surface 110 and the internal extended surface 115 are configured to reduce thermal resistance between an interior region of the thermally conductive shell 105 and ambient air.
- the fins are configured to reduce the thermal resistance between the interior region of the thermally conductive shell 105 and the ambient air. This is explained in more detailed with reference to FIG. 3 .
- FIG. 2 illustrates an exemplary sectional view 200 of a portion of the thermally conductive shell 105 of FIG. 1 , according to an embodiment of the present subject matter.
- the sectional view 200 illustrates the portion of the thermally conductive shell 105 including the external extended surface 110 and the internal extended surface 115 of the external surface 120 and internal surface 125 , respectively.
- the external extended surface 110 and the internal extended surface 115 include a plurality of fins configured to reduce thermal resistance between the interior region of the thermally conductive shell 105 and the ambient air. Further as shown in FIG. 2 , the fins extend orthogonally or at a slant from the external surface 120 and the internal surface 125 of the thermally conductive shell 105 .
- FIG. 3 illustrates an exemplary isometric view 300 of the gimbal and one or more electronics and/or sensor equipment 305 housed in the thermally conductive shell 105 of FIG. 1 for a thermal management system, according to an embodiment of the present subject matter.
- the thermal management system includes the electronics and/or sensor equipment 305 and the thermally conductive shell 105 configured to house the electronics and/or sensor equipment 305 .
- thermally conductive shell 105 includes the external surface 120 and the internal surface 125 , such as the one shown in FIG. 1 .
- at least some portion of the external surface 120 and the internal surface 125 of the thermally conductive shell 105 include the external extended surface 110 and internal extended surface 115 , respectively.
- the thermally conductive shell 105 is configured so that when the external extended surface 110 and the internal extended surface 115 are attached to the configured thermally conductive shell forming a complete thermally conductive shell. In another embodiment, the thermally conductive shell 105 is configured such that the external extended surface 110 and the internal extended surface 115 are integral with a remaining portion of the thermally conductive shell 105 without including the extended surfaces.
- the external extended surface 110 and the internal extended surface 115 include a plurality of fins.
- the fins extend orthogonally or at a slant from the external surface 120 and the internal surface 125 of the thermally conductive shell 105 .
- the external extended surface 110 and the internal extended surface 115 are configured to reduce thermal resistance between an interior region of the thermally conductive shell 105 and ambient air.
- the fins are configured to reduce thermal resistance between the interior region of the thermally conductive shell 105 and the ambient air.
- the internal extended surface 115 of the thermally conductive shell 105 transfers heat generated by the electronics and/or sensor equipment 305 to a thermally conductive shell wall by providing an increased internal surface area. Further, the generated heat is transferred from the thermally conductive shell wall to the external extended surface 110 .
- the material of the thermally conductive shell 105 is a highly conductive material which improves the heat transfer through the thermally conductive shell wall.
- the external extended surface 110 transfers the heat to the ambient air by providing an increased external surface area.
Abstract
Description
- This application claims rights under 35 USC §119(e) from U.S. application Ser. No. 61/502,441 filed Jun. 29, 2011, the contents of which are incorporated herein by reference.
- 1. Field of the Invention
- The present invention relates to cooling systems, more specifically to enclosed volumes containing payloads, such as electronics and sensor equipment.
- 2. Brief Description of Related Art
- One of the most common and important devices found on military host platforms today is a high precision, targetable optical sensor. These sensors are useful for threat detection, weapons targeting, countermeasure functions, surveillance, and many other applications. However, in order to achieve the necessary stability and maneuverability for effective targeting, most such sensors must be attached to a gimbal.
- Further, gimbals provide stability and many degrees of freedom, but they require that the optical sensor be encapsulated by a shell. The shell tends to thermally isolate the optical sensor, leaving no direct path from the heat generated by the optical sensor to the exterior of the gimbal. Rather, the heat generated by the optical sensor must overcome three sources of thermal resistance by first transferring from the air to the shell, then transferring through the shell, and finally transferring from the shell to the outside air. This heat transfer scenario represents a relatively poor method for managing the dissipation of a sensor payload.
- In such scenarios, the optical sensors can warp and become unreliable in extreme thermal conditions and, as a result, poor thermal management may often limit the environmental conditions in which these optical sensors may reliably operate.
- A passive heat exchanger for gimbal thermal management is disclosed. According to one aspect of the present subject matter, a thermal management system includes one or more electronics and/or sensor equipment. Further, the thermal management system includes a thermally conductive shell configured to house the electronics and/or sensor equipment. Furthermore, the thermally conductive shell includes an external surface and an internal surface. In addition, at least some portion of the external surface and the internal surface of the thermally conductive shell include an extended surface configured to reduce thermal resistance between an interior region of the thermally conductive shell and ambient air.
- According to another aspect of the present subject matter, a gimbal includes a thermally conductive sphere configured to house rotatably the electronics and/or sensor equipment. Further, the thermally conductive sphere includes the external surface and the internal surface. Furthermore, the at least some portion of the external surface and the internal surface of the thermally conductive sphere include the extended surface configured to reduce the thermal resistance between an interior region of the thermally conductive sphere and the ambient air.
- The advantages and features of the present disclosure will become better understood with reference to the following detailed description and claims taken in conjunction with the accompanying drawings, wherein like elements are identified with like symbols, and in which:
-
FIG. 1 illustrates an exemplary sectional view of a thermally conductive shell of a gimbal, according to an embodiment of the present subject matter; -
FIG. 2 illustrates an exemplary sectional view of a portion of the thermally conductive shell ofFIG. 1 , according to an embodiment of the present subject matter; and -
FIG. 3 illustrates an exemplary isometric view of the gimbal and one or more electronics and/or sensor equipment housed in the thermally conductive shell ofFIG. 1 , for a thermal management system, according to an embodiment of the present subject matter. - The exemplary embodiments described herein in detail for illustrative purposes are subject to many variations in structure and design.
- The terms “sphere” and “shell” are used interchangeably throughout the document.
-
FIG. 1 illustrates an exemplarysectional view 100 of a thermallyconductive shell 105 of a gimbal, according to an embodiment of the present subject matter. In one embodiment, the thermallyconductive shell 105 is configured to house rotatably one or more electronics and/or sensor equipment. As shown inFIG. 1 , the thermallyconductive shell 105 includes anexternal surface 120 and aninternal surface 125. Further, at least some portion of theexternal surface 120 and theinternal surface 125 of the thermallyconductive shell 105 include an external extendedsurface 110 and an internal extendedsurface 115, respectively. In one embodiment, the thermallyconductive shell 105 is configured so that when the external extendedsurface 110 and the internal extendedsurface 115 are attached to the configured thermally conductive shell forming a complete thermally conductive shell. In another embodiment, the thermallyconductive shell 105 is configured such that the external extendedsurface 110 and the internal extendedsurface 115 are integral with a remaining portion of the thermallyconductive shell 105 without including the extended surfaces. In these embodiments, a material of the thermallyconductive shell 105 including the external extendedsurface 110 and internal extendedsurface 115 includes aluminum, beryllium, a composite of aluminum and beryllium and the like. - Furthermore as shown in
FIG. 1 , the externalextended surface 110 and the internal extendedsurface 115 include a plurality of fins. In one exemplary implementation, the fins extend orthogonally or at a slant from theexternal surface 120 and theinternal surface 125 of the thermallyconductive shell 105. In one embodiment, the external extendedsurface 110 and the internal extendedsurface 115 are configured to reduce thermal resistance between an interior region of the thermallyconductive shell 105 and ambient air. Particularly, the fins are configured to reduce the thermal resistance between the interior region of the thermallyconductive shell 105 and the ambient air. This is explained in more detailed with reference toFIG. 3 . -
FIG. 2 illustrates an exemplarysectional view 200 of a portion of the thermallyconductive shell 105 ofFIG. 1 , according to an embodiment of the present subject matter. Particularly, thesectional view 200 illustrates the portion of the thermallyconductive shell 105 including the external extendedsurface 110 and the internal extendedsurface 115 of theexternal surface 120 andinternal surface 125, respectively. As shown inFIG. 2 , the external extendedsurface 110 and the internal extendedsurface 115 include a plurality of fins configured to reduce thermal resistance between the interior region of the thermallyconductive shell 105 and the ambient air. Further as shown inFIG. 2 , the fins extend orthogonally or at a slant from theexternal surface 120 and theinternal surface 125 of the thermallyconductive shell 105. -
FIG. 3 illustrates an exemplaryisometric view 300 of the gimbal and one or more electronics and/orsensor equipment 305 housed in the thermallyconductive shell 105 ofFIG. 1 for a thermal management system, according to an embodiment of the present subject matter. As shown inFIG. 3 , the thermal management system includes the electronics and/orsensor equipment 305 and the thermallyconductive shell 105 configured to house the electronics and/orsensor equipment 305. Further, thermallyconductive shell 105 includes theexternal surface 120 and theinternal surface 125, such as the one shown inFIG. 1 . Furthermore, at least some portion of theexternal surface 120 and theinternal surface 125 of the thermallyconductive shell 105 include the external extendedsurface 110 and internal extendedsurface 115, respectively. In one embodiment, the thermallyconductive shell 105 is configured so that when the external extendedsurface 110 and the internal extendedsurface 115 are attached to the configured thermally conductive shell forming a complete thermally conductive shell. In another embodiment, the thermallyconductive shell 105 is configured such that the external extendedsurface 110 and the internal extendedsurface 115 are integral with a remaining portion of the thermallyconductive shell 105 without including the extended surfaces. - In addition as shown in
FIG. 3 , the externalextended surface 110 and the internal extendedsurface 115 include a plurality of fins. In one exemplary implementation, the fins extend orthogonally or at a slant from theexternal surface 120 and theinternal surface 125 of the thermallyconductive shell 105. In one embodiment, the external extendedsurface 110 and the internal extendedsurface 115 are configured to reduce thermal resistance between an interior region of the thermallyconductive shell 105 and ambient air. Particularly, the fins are configured to reduce thermal resistance between the interior region of the thermallyconductive shell 105 and the ambient air. - In operation, the internal extended
surface 115 of the thermallyconductive shell 105 transfers heat generated by the electronics and/orsensor equipment 305 to a thermally conductive shell wall by providing an increased internal surface area. Further, the generated heat is transferred from the thermally conductive shell wall to the external extendedsurface 110. In one embodiment, the material of the thermallyconductive shell 105 is a highly conductive material which improves the heat transfer through the thermally conductive shell wall. Furthermore, the external extendedsurface 110 transfers the heat to the ambient air by providing an increased external surface area. - The foregoing descriptions of specific embodiments of the present disclosure have been presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the present disclosure to the precise forms disclosed, and obviously many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the present disclosure and its practical application, to thereby enable others skilled in the art to best utilize the present disclosure and various embodiments with various modifications as are suited to the particular use contemplated. It is understood that various omission and substitutions of equivalents are contemplated as circumstance may suggest or render expedient, but such are intended to cover the application or implementation without departing from the spirit or scope of the claims of the present disclosure.
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/534,027 US20130000881A1 (en) | 2011-06-29 | 2012-06-27 | Passive heat exchanger for gimbal thermal management |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161502441P | 2011-06-29 | 2011-06-29 | |
US13/534,027 US20130000881A1 (en) | 2011-06-29 | 2012-06-27 | Passive heat exchanger for gimbal thermal management |
Publications (1)
Publication Number | Publication Date |
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US20130000881A1 true US20130000881A1 (en) | 2013-01-03 |
Family
ID=47389408
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US13/534,027 Abandoned US20130000881A1 (en) | 2011-06-29 | 2012-06-27 | Passive heat exchanger for gimbal thermal management |
Country Status (1)
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US (1) | US20130000881A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014137423A1 (en) * | 2013-03-04 | 2014-09-12 | Raytheon Company | Thermal management system and method for space and air-borne sensors |
WO2019216963A1 (en) * | 2018-05-10 | 2019-11-14 | Raytheon Company | Heat exchangers for multi-axis gimbal pointing or targeting systems |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3621337A (en) * | 1969-08-14 | 1971-11-16 | Westinghouse Electric Corp | Solid-state photocontrol housing assembly with external heat dissipating ribs |
US5758955A (en) * | 1995-07-11 | 1998-06-02 | High End Systems, Inc. | Lighting system with variable shaped beam |
US20060071121A1 (en) * | 2004-10-01 | 2006-04-06 | Wescott Timothy A | Gimbal system |
US20070246189A1 (en) * | 2006-04-19 | 2007-10-25 | Hon Hai Precision Industry Co., Ltd. | Heat sink |
US7663229B2 (en) * | 2006-07-12 | 2010-02-16 | Hong Kong Applied Science And Technology Research Institute Co., Ltd. | Lighting device |
US7699691B1 (en) * | 2005-05-11 | 2010-04-20 | L-3 Communications Sonoma Eo, Inc. | Cooling system and method for enclosed volume |
US8018136B2 (en) * | 2008-02-28 | 2011-09-13 | Tyco Electronics Corporation | Integrated LED driver for LED socket |
-
2012
- 2012-06-27 US US13/534,027 patent/US20130000881A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3621337A (en) * | 1969-08-14 | 1971-11-16 | Westinghouse Electric Corp | Solid-state photocontrol housing assembly with external heat dissipating ribs |
US5758955A (en) * | 1995-07-11 | 1998-06-02 | High End Systems, Inc. | Lighting system with variable shaped beam |
US20060071121A1 (en) * | 2004-10-01 | 2006-04-06 | Wescott Timothy A | Gimbal system |
US7699691B1 (en) * | 2005-05-11 | 2010-04-20 | L-3 Communications Sonoma Eo, Inc. | Cooling system and method for enclosed volume |
US20070246189A1 (en) * | 2006-04-19 | 2007-10-25 | Hon Hai Precision Industry Co., Ltd. | Heat sink |
US7663229B2 (en) * | 2006-07-12 | 2010-02-16 | Hong Kong Applied Science And Technology Research Institute Co., Ltd. | Lighting device |
US8018136B2 (en) * | 2008-02-28 | 2011-09-13 | Tyco Electronics Corporation | Integrated LED driver for LED socket |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014137423A1 (en) * | 2013-03-04 | 2014-09-12 | Raytheon Company | Thermal management system and method for space and air-borne sensors |
US9296496B2 (en) | 2013-03-04 | 2016-03-29 | Raytheon Company | Thermal management system and method for space and air-borne sensors |
JP2016515061A (en) * | 2013-03-04 | 2016-05-26 | レイセオン カンパニー | Thermal management system and method for space and aerospace sensors |
WO2019216963A1 (en) * | 2018-05-10 | 2019-11-14 | Raytheon Company | Heat exchangers for multi-axis gimbal pointing or targeting systems |
US20190346209A1 (en) * | 2018-05-10 | 2019-11-14 | Raytheon Company | Heat exchangers for multi-axis gimbal pointing or targeting systems |
JP2021523054A (en) * | 2018-05-10 | 2021-09-02 | レイセオン カンパニー | Heat exchanger for pointing or targeting systems of multi-axis gimbals |
US11150025B2 (en) * | 2018-05-10 | 2021-10-19 | Raytheon Company | Heat exchangers for multi-axis gimbal pointing or targeting systems |
JP7050182B2 (en) | 2018-05-10 | 2022-04-07 | レイセオン カンパニー | Heat exchanger for pointing or targeting systems of multi-axis gimbals |
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Legal Events
Date | Code | Title | Description |
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AS | Assignment |
Owner name: BAE SYSTEMS INFORMATION AND ELECTRONICS SYSTEMS IN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LAVOLE, BARRY;ESPOSITO, GERARD A.;BOWIER, DENNIS P.;REEL/FRAME:028450/0358 Effective date: 20120626 |
|
AS | Assignment |
Owner name: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INT Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LAVOIE, BARRY;ESPOSITO, GERARD A.;BOWLER, DENNIS P.;REEL/FRAME:028612/0574 Effective date: 20120626 Owner name: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INT Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LAVOIE, BARRY;ESPOSITO, GERARD A.;BOWLER, DENNIS P.;REEL/FRAME:028460/0151 Effective date: 20120626 |
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STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |