US20120160467A1 - Heat sink and assembly method thereof - Google Patents
Heat sink and assembly method thereof Download PDFInfo
- Publication number
- US20120160467A1 US20120160467A1 US13/011,863 US201113011863A US2012160467A1 US 20120160467 A1 US20120160467 A1 US 20120160467A1 US 201113011863 A US201113011863 A US 201113011863A US 2012160467 A1 US2012160467 A1 US 2012160467A1
- Authority
- US
- United States
- Prior art keywords
- base plate
- fins
- fixing
- fixing portions
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title claims description 14
- 238000004080 punching Methods 0.000 claims 2
- 230000008569 process Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Definitions
- the disclosure generally relates to device cooling, and more particularly to a heat sink including a base plate interferingly fitted with a fin unit.
- Heat sinks are used to remove heat from heat-generating electronic components such as central processing units (CPUs) and others, keeping the electronic components within safe operating limits, and enabling stable operation.
- a typical heat sink comprises a base contacting an electronic component and absorbing heat therefrom, and a plurality of parallel planar fins attached to the base by soldering. The fins dissipate the heat to the ambient environment.
- soldering flux needs to be added between the fins such that the base and fins can be assembled together.
- soldering flux needs to be added between the fins such that the base and fins can be assembled together.
- a prior process of nickel-plating may be required before soldering.
- Such process materials and manufacturing procedures make the assembly of the fins and the base somewhat costly and complicated.
- Another common heat sink is a one-piece type, made of forged aluminum.
- a short pitch between adjacent heat dissipating fins is desired, so that the high fin density provides a large overall heat dissipating surface.
- the desired level of fin density is difficult to achieve economically.
- the one-piece type of heat sink rarely provides excellent heat dissipation.
- FIG. 1 is an isometric, assembled view of a heat sink according to an exemplary embodiment of the present disclosure, wherein the heat sink includes a fin unit and a base plate.
- FIG. 2 is an exploded view of the heat sink of FIG. 1 .
- FIG. 3 is an isometric view of a fin of the fin unit of FIG. 1 .
- FIG. 4 is a side view of the heat sink of FIG. 1 , showing the fin unit assembled to the base plate by a punch mold.
- a heat sink 10 according to a first exemplary embodiment of the present disclosure includes a base plate 12 and a fin unit 16 arranged thereon.
- the base plate 12 is rectangular, and includes a planar bottom surface 120 and a top surface 122 .
- the bottom surface 120 is configured to contact a heat-generating component to absorb heat generated thereby.
- Two fixing portions 121 extend upwardly from two opposite sides of the top surface 122 of the base plate 12 , respectively. Each of the fixing portions 121 extends along a long side edge of the base plate 12 .
- the fixing portions 121 are formed by extrusion, and each includes a vertical wall 123 extending upwardly from the top surface 122 of the base plate 12 and a horizontal wall 125 extending inwardly from a top end of the vertical wall 123 towards the other fixing portion 121 .
- the horizontal wall 125 is substantially parallel to and spaced from the top surface 122 of the base plate 12 , to define a groove 126 between the horizontal wall 125 and the top surface 122 of the base plate 12 .
- the groove 126 extends along the long side of the base plate 12 .
- An elongated notch 128 above the groove 126 is defined in an upper surface of the horizontal wall 125 .
- the fin unit 16 includes a plurality of fins 160 arranged on the top surface 122 of the base plate 12 .
- Each of the fins 160 is a substantially rectangular thin metallic plate.
- the fins 160 are parallel.
- each of the fins 160 includes a substantially rectangular main body 161 , an upper flange 162 and a lower flange 163 respectively extending forward from an upper edge and a lower edge of the main body 161 , two fixing strips 166 located at two opposite ends of the lower flange 163 , and two pairs of receiving units 168 formed at the upper flange 162 and the lower flange 163 , respectively.
- the lower flange 163 is longer than the upper flange 162 , with two ends 1631 extending from a left side and right side of the main body 161 .
- Each of the fixing strips 166 includes a first strip portion 165 extending upward from a corresponding end 1631 of the lower flange 163 and a second strip portion 164 extending inward from a top end of the first strip portion 165 towards the other fixing strip 166 .
- the second strip portion 164 is substantially parallel to and spaced from the lower flange 163 .
- Each of the receiving units 168 includes an L-shaped hook 1681 extending from a long edge of the corresponding upper or lower flange 162 , 163 , and a receiving hole 1682 defined in the corresponding upper or lower flange 162 , 163 adjacent to the hook 1681 .
- the receiving hole 1682 is a through slot which is parallel to the long edge of the corresponding upper or lower flange 162 , 163 .
- the fins 160 are stacked together.
- the upper flanges 162 of each two neighboring fins 160 contact each other to cooperatively define a planar top surface of the fin unit 16
- the lower flanges 163 of each two neighboring fins 160 contact each other to cooperatively define a planar bottom surface of the fin unit 16 .
- the hooks 1681 of the receiving units 168 of a rear fin 160 are received in the receiving holes 1682 of a front fin 160 to connect the two neighboring fins 160 .
- the fixing strips 166 of each two neighboring fins 160 abut each other to cooperatively form two protruding members 169 at two opposite sides of the fin unit 16 .
- first strip portions 165 of the fixing strips 166 are coplanar to form two supporting walls 172 extending upward from two opposite sides of the bottom surface of the fin unit 16 ; and the second strip portions 164 are coplanar to form two connecting walls 170 connecting top ends of the supporting walls 172 and a corresponding lateral side of the fin unit 16 .
- the protruding members 169 correspond to the grooves 126 of the fixing portions 121 of the base plate 12 , respectively.
- the fin unit 16 In assembly of the heat sink 10 , the fin unit 16 is placed at one end of the base plate 12 , with the protruding members 169 targeting the grooves 126 of the fixing portions 121 , respectively. The fin unit 16 is then mounted onto the base plate 12 , with the protruding members 169 received in the grooves 126 of the fixing portions 121 , respectively.
- the connecting wall 170 of each of the protruding members 169 abuts a bottom surface of the horizontal wall 125 of a corresponding fixing portion 121
- the supporting wall 172 of each of the protruding members 169 abuts an inner surface of the vertical wall 123 of the corresponding fixing portion 121 .
- the punch mold 20 includes a press plate 21 , and two punch plates 22 depending from the press plate 21 .
- Each of the punch plates 22 is substantially rectangular, and forms an edge 221 at a bottom end thereof.
- a distance between the two punch plates 22 is approximately equal to (slightly greater than) that between the two notches 128 of the fixing portions 121 of the base plate 12 .
- the punch mold 20 is moved over the fin unit 16 to cover the fin unit 16 , with the edges 221 of the punch plates 22 received in the notches 128 of the fixing portions 121 , respectively.
- the punch mold 20 is then driven further down to force the horizontal walls 125 of the fixing portions 121 to tightly contact the connecting walls 170 of the protruding members 169 of the fin unit 16 , thereby firmly connecting the fin unit 16 and the base plate 12 .
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
An exemplary heat sink includes a base plate and a fin unit including fins stacked together and arranged on the base plate. The base plate includes two fixing portions extending upward from a top surface thereof. Each of the fixing portions defines a groove therein. Each of the fins includes a main body and two fixing strips extending from two opposite sides of the main body. The fixing strips of the fins contact each other to cooperatively form two protruding members of the fin unit, the protruding members correspond to the grooves of the fixing portions of the base plate, respectively, and the protruding portions are interference fitted in the grooves, whereby the fin unit and the base plate are connected together.
Description
- 1. Technical Field
- The disclosure generally relates to device cooling, and more particularly to a heat sink including a base plate interferingly fitted with a fin unit.
- 2. Description of Related Art
- Heat sinks are used to remove heat from heat-generating electronic components such as central processing units (CPUs) and others, keeping the electronic components within safe operating limits, and enabling stable operation. A typical heat sink comprises a base contacting an electronic component and absorbing heat therefrom, and a plurality of parallel planar fins attached to the base by soldering. The fins dissipate the heat to the ambient environment.
- When the heat sink is manufactured, soldering flux needs to be added between the fins such that the base and fins can be assembled together. Furthermore, when the fins and the base are of different materials, a prior process of nickel-plating may be required before soldering. Such process materials and manufacturing procedures make the assembly of the fins and the base somewhat costly and complicated.
- Another common heat sink is a one-piece type, made of forged aluminum. A short pitch between adjacent heat dissipating fins is desired, so that the high fin density provides a large overall heat dissipating surface. However, due to technical difficulties inherent in the forging process, the desired level of fin density is difficult to achieve economically. Thus the one-piece type of heat sink rarely provides excellent heat dissipation.
- What is desired, therefore, is a heat sink which can overcome the limitations described.
-
FIG. 1 is an isometric, assembled view of a heat sink according to an exemplary embodiment of the present disclosure, wherein the heat sink includes a fin unit and a base plate. -
FIG. 2 is an exploded view of the heat sink ofFIG. 1 . -
FIG. 3 is an isometric view of a fin of the fin unit ofFIG. 1 . -
FIG. 4 is a side view of the heat sink ofFIG. 1 , showing the fin unit assembled to the base plate by a punch mold. - Reference will now be made to the figures to describe the present heat sink and method in detail.
- Referring to
FIG. 1 , aheat sink 10 according to a first exemplary embodiment of the present disclosure includes abase plate 12 and afin unit 16 arranged thereon. - Referring also to
FIG. 2 , thebase plate 12 is rectangular, and includes aplanar bottom surface 120 and atop surface 122. Thebottom surface 120 is configured to contact a heat-generating component to absorb heat generated thereby. Twofixing portions 121 extend upwardly from two opposite sides of thetop surface 122 of thebase plate 12, respectively. Each of thefixing portions 121 extends along a long side edge of thebase plate 12. Thefixing portions 121 are formed by extrusion, and each includes avertical wall 123 extending upwardly from thetop surface 122 of thebase plate 12 and ahorizontal wall 125 extending inwardly from a top end of thevertical wall 123 towards theother fixing portion 121. Thehorizontal wall 125 is substantially parallel to and spaced from thetop surface 122 of thebase plate 12, to define agroove 126 between thehorizontal wall 125 and thetop surface 122 of thebase plate 12. Thegroove 126 extends along the long side of thebase plate 12. Anelongated notch 128 above thegroove 126 is defined in an upper surface of thehorizontal wall 125. - The
fin unit 16 includes a plurality offins 160 arranged on thetop surface 122 of thebase plate 12. Each of thefins 160 is a substantially rectangular thin metallic plate. Thefins 160 are parallel. Referring to also toFIG. 3 , each of thefins 160 includes a substantially rectangularmain body 161, anupper flange 162 and alower flange 163 respectively extending forward from an upper edge and a lower edge of themain body 161, twofixing strips 166 located at two opposite ends of thelower flange 163, and two pairs ofreceiving units 168 formed at theupper flange 162 and thelower flange 163, respectively. Thelower flange 163 is longer than theupper flange 162, with twoends 1631 extending from a left side and right side of themain body 161. Each of thefixing strips 166 includes afirst strip portion 165 extending upward from acorresponding end 1631 of thelower flange 163 and asecond strip portion 164 extending inward from a top end of thefirst strip portion 165 towards theother fixing strip 166. Thesecond strip portion 164 is substantially parallel to and spaced from thelower flange 163. Each of thereceiving units 168 includes an L-shaped hook 1681 extending from a long edge of the corresponding upper orlower flange receiving hole 1682 defined in the corresponding upper orlower flange hook 1681. In the illustrated embodiment, thereceiving hole 1682 is a through slot which is parallel to the long edge of the corresponding upper orlower flange - Referring back to
FIG. 2 , when theheat sink 10 is assembled, thefins 160 are stacked together. Theupper flanges 162 of each two neighboringfins 160 contact each other to cooperatively define a planar top surface of thefin unit 16, and thelower flanges 163 of each two neighboringfins 160 contact each other to cooperatively define a planar bottom surface of thefin unit 16. For each two neighboringfins 160, thehooks 1681 of thereceiving units 168 of arear fin 160 are received in the receivingholes 1682 of afront fin 160 to connect the two neighboringfins 160. Thefixing strips 166 of each two neighboringfins 160 abut each other to cooperatively form two protrudingmembers 169 at two opposite sides of thefin unit 16. More specifically, thefirst strip portions 165 of thefixing strips 166 are coplanar to form two supportingwalls 172 extending upward from two opposite sides of the bottom surface of thefin unit 16; and thesecond strip portions 164 are coplanar to form two connectingwalls 170 connecting top ends of the supportingwalls 172 and a corresponding lateral side of thefin unit 16. The protrudingmembers 169 correspond to thegrooves 126 of thefixing portions 121 of thebase plate 12, respectively. - In assembly of the
heat sink 10, thefin unit 16 is placed at one end of thebase plate 12, with the protrudingmembers 169 targeting thegrooves 126 of thefixing portions 121, respectively. Thefin unit 16 is then mounted onto thebase plate 12, with the protrudingmembers 169 received in thegrooves 126 of thefixing portions 121, respectively. The connectingwall 170 of each of the protrudingmembers 169 abuts a bottom surface of thehorizontal wall 125 of acorresponding fixing portion 121, and the supportingwall 172 of each of the protrudingmembers 169 abuts an inner surface of thevertical wall 123 of thecorresponding fixing portion 121. - Referring to
FIG. 4 , apunch mold 20 is then provided. Thepunch mold 20 includes apress plate 21, and twopunch plates 22 depending from thepress plate 21. Each of thepunch plates 22 is substantially rectangular, and forms anedge 221 at a bottom end thereof. A distance between the twopunch plates 22 is approximately equal to (slightly greater than) that between the twonotches 128 of thefixing portions 121 of thebase plate 12. Thepunch mold 20 is moved over thefin unit 16 to cover thefin unit 16, with theedges 221 of thepunch plates 22 received in thenotches 128 of thefixing portions 121, respectively. Thepunch mold 20 is then driven further down to force thehorizontal walls 125 of thefixing portions 121 to tightly contact the connectingwalls 170 of the protrudingmembers 169 of thefin unit 16, thereby firmly connecting thefin unit 16 and thebase plate 12. - In the process of assembly of the
heat sink 10, neither soldering flux nor nickel plating is required during assembly of thefin unit 16 to thebase plate 12. The manufacturing cost of theheat sink 10 is minimized, and the assembly of thefins 160 to thebase plate 12 is simple and convenient. - It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (20)
1. A heat sink, comprising:
a base plate comprising two fixing portions extending upward from a top surface thereof, each of the fixing portions defining a groove therein; and
a fin unit comprising a plurality of fins stacked together and arranged on the base plate, each of the fins comprising a main body and two fixing strips extending from two opposite sides of the main body;
wherein the fixing strips of the fins contact each other to cooperatively form two protruding members of the fin unit, the protruding members correspond to the grooves of the fixing portions of the base plate, respectively, and the protruding portions are interference fitted in the grooves whereby the fin unit and the base plate are connected together.
2. The heat sink of claim 1 , wherein each of the fixing portions comprises a vertical wall extending from the top surface of the base plate and a horizontal wall extending from the vertical wall and spaced from the top surface of the base plate, the groove defined between the horizontal wall and the top surface of the base plate.
3. The heat sink of claim 2 , wherein each of the fins further comprises two flanges extending outward from two opposite sides of the main body, one of the flanges is longer than the other flange, and the two fixing strips are formed at two opposite ends of the longer flange, respectively.
4. The heat sink of claim 3 , wherein each of the fixing strips comprises a first strip portion extending upward from the corresponding end of the longer flange, and a second strip portion extending inward from the first strip portion towards the other fixing strip.
5. The heat sink of claim 4 , wherein the first strip portions are coplanar to cooperatively form two supporting walls of the two protruding members of the fin unit, the supporting walls abutting the vertical walls of the fixing portions, respectively, and the second strip portions are coplanar to cooperatively form two connecting walls of the two protruding members of the fin unit, the two connecting walls abutting the horizontal walls of the fixing portions, respectively.
6. The heat sink of claim 3 , wherein each of the fins further comprises a plurality of receiving units on the flanges, each of the receiving units comprising a hook extending outward from a corresponding flange and a receiving hole adjacent to the hook, the hook of the receiving unit of each of the fins engaged in the receiving hole of a corresponding receiving unit of a neighboring fin, whereby the fins are connected together.
7. A method of assembling a fin unit and a base plate, the method comprising:
providing a base plate comprising two fixing portions extending upward from a top surface thereof, each of the fixing portions defining a groove therein;
providing a fin unit comprising a plurality of fins stacked together, each of the fins comprising a main body and two fixing strips extending from two opposite sides of the main body, the fixing strips cooperatively form two protruding members of the fin unit, the protruding members corresponding to the grooves of the fixing portions of the base plate, respectively;
mounting the fin unit to the base plate with the protruding members received in the grooves of the fixing portions, respectively; and
punching outer surfaces of the fixing portions to force the fixing portions to interferingly engage with the protruding members of the fin unit.
8. The method of claim 7 , wherein each of the fixing portions comprises a vertical wall extending from the top surface of the base plate and a horizontal wall extending from the vertical wall and spaced from the top surface of the base plate, a notch defined in the horizontal wall.
9. The method of claim 8 , wherein a punch mold is provided, the punch mold comprising a press plate and two punch plate depending from the press plate, each of the punch plate comprising an edge at a bottom end thereof, the edges received in the notches of the horizontal walls when punching the outer surfaces of the fixing portions.
10. The method of claim 8 , wherein each of the fins further comprises two flanges extending outward from two opposite sides of the main body, one of the flanges is longer than the other flange, and the two fixing strips are formed at two opposite ends of the longer flange, respectively.
11. The method of claim 10 , wherein each of the fixing strips comprises a first strip portion extending upward from the corresponding end of the longer flange and a second strip portion extending inward from the first strip portion towards the other fixing strip.
12. The method of claim 11 , wherein the first strip portions are coplanar to cooperatively form two supporting walls of the two protruding members of the fin unit, the supporting walls abutting the vertical walls of the fixing portions, respectively, and the second strip portions are coplanar to cooperatively form two connecting walls of the two protruding members of the fin unit, the two connecting walls abutting the horizontal walls of the fixing portions, respectively.
13. The method of claim 10 , wherein each of the fins further comprises a plurality of receiving units on the flanges, each of the receiving units comprising a hook extending outward from a corresponding flange and a receiving hole adjacent to the hook, the hook of the receiving unit of each of the fins engaged in the receiving hole of a corresponding receiving unit of a neighboring fin, whereby the fins are connected together.
14. A heat sink, comprising:
a base plate defining a pair of grooves at opposite sides thereof;
a fin unit comprising a plurality of fins arranged on the base plate, the plurality of fins cooperatively forming a pair of opposite protruding members of the fin unit;
wherein the base plate is crimped at the grooves such that the protruding members are interferingly held in the grooves and the fin unit and the base plate are connected together.
15. The heat sink of claim 14 , wherein the base plate comprises two fixing portions extending upward thereof, and the grooves are defined in the fixing portions, respectively.
16. The heat sink of claim 15 , wherein each of the fixing portions comprises a vertical wall extending from a top surface of the base plate and a horizontal wall extending from the vertical wall and spaced from the top surface of the base plate, the grooves defined between the horizontal walls and the top surface of the base plate.
17. The heat sink of claim 14 , wherein each of the fins comprising a main body, two flanges respectively extending outward from two opposite sides of the main body and two fixing strips respectively extending from the other two opposite sides of the main body, the fixing strips contacting each other to cooperatively from the protruding members when the fins are stacked together.
18. The heat sink of claim 17 , wherein one of the flanges is longer than the other flange, and the two fixing strips are formed at two opposite ends of the longer flange, respectively.
19. The heat sink of claim 18 , wherein each of the fixing strips comprises a first strip portion extending upward from the corresponding end of the longer flange and a second strip portion extending inward from the first strip portion towards the other fixing strip, the first strip portions abut the vertical walls of the fixing portions, and the second strip portions abut the horizontal walls of the fixing portions.
20. The heat sink of claim 17 , wherein each of the fins further comprises a plurality of receiving units on the flanges, each of the receiving units comprising a hook extending outward from a corresponding flange and a receiving hole, the hook of the receiving unit of each of the fins engaged in the receiving hole of the receiving unit of a neighboring fin to connect the fins together.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN201010604381.6 | 2010-12-24 | ||
CN201010604381.6A CN102548342B (en) | 2010-12-24 | 2010-12-24 | Radiator and its preparation method |
Publications (1)
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US20120160467A1 true US20120160467A1 (en) | 2012-06-28 |
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ID=46315278
Family Applications (1)
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US13/011,863 Abandoned US20120160467A1 (en) | 2010-12-24 | 2011-01-22 | Heat sink and assembly method thereof |
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US (1) | US20120160467A1 (en) |
CN (1) | CN102548342B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20200232710A1 (en) * | 2019-01-18 | 2020-07-23 | Kuo-Sheng Lin | Heat dissipation unit connection structure |
Families Citing this family (2)
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CN104776733B (en) * | 2015-03-26 | 2017-07-07 | 奇瑞汽车股份有限公司 | A kind of radiator |
CN112911893B (en) * | 2020-12-25 | 2023-05-05 | Oppo广东移动通信有限公司 | Radiator and electronic equipment |
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CN2884807Y (en) * | 2006-02-07 | 2007-03-28 | 龙大昌实业有限公司 | Radiating fin conjunction structure |
CN200997751Y (en) * | 2007-01-26 | 2007-12-26 | 利民科技开发有限公司 | Voltage device of host board and radiater of capacitance |
CN101308318A (en) * | 2007-05-17 | 2008-11-19 | 中强光电股份有限公司 | Light gate device |
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2010
- 2010-12-24 CN CN201010604381.6A patent/CN102548342B/en active Active
-
2011
- 2011-01-22 US US13/011,863 patent/US20120160467A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US5542176A (en) * | 1992-09-21 | 1996-08-06 | Hideaki Serizawa | Radiation plate and method of producing the same |
US5558155A (en) * | 1993-08-06 | 1996-09-24 | Mitsubishi Denki Kabushiki Kaisha | Cooling apparatus and assembling method thereof |
US6995981B2 (en) * | 2003-04-18 | 2006-02-07 | Hon Hai Precision Inc. Co., Ltd. | Heat sink assembly with combined parallel fins |
US20040231827A1 (en) * | 2003-05-09 | 2004-11-25 | Fu Xue Ding | Heat dissipation device with interlocking fin plates |
US20050000682A1 (en) * | 2003-07-04 | 2005-01-06 | Chao-Nan Chien | Heat dissipating fins of heat sink and manufacturing method thereof |
US7174955B2 (en) * | 2004-08-10 | 2007-02-13 | Fu Zhun Precision Industry (Shen Zhen) Co. Ltd. | Heat sink |
US20080289799A1 (en) * | 2007-05-23 | 2008-11-27 | Foxconn Technology Co., Ltd. | Heat dissipation device with a heat pipe |
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Publication number | Priority date | Publication date | Assignee | Title |
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US20200232710A1 (en) * | 2019-01-18 | 2020-07-23 | Kuo-Sheng Lin | Heat dissipation unit connection structure |
Also Published As
Publication number | Publication date |
---|---|
CN102548342B (en) | 2016-01-13 |
CN102548342A (en) | 2012-07-04 |
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