US20120160462A1 - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- US20120160462A1 US20120160462A1 US12/981,438 US98143810A US2012160462A1 US 20120160462 A1 US20120160462 A1 US 20120160462A1 US 98143810 A US98143810 A US 98143810A US 2012160462 A1 US2012160462 A1 US 2012160462A1
- Authority
- US
- United States
- Prior art keywords
- dissipation device
- heat dissipation
- centrifugal fan
- heat sink
- fins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the disclosure relates to heat dissipation, and particularly to a heat dissipation device with low noise.
- Electronic components such as memory banks comprise numerous circuits operating at high speeds and generating substantial amount of heat. Under most circumstances, it is necessary to cool the memory banks to maintain safe operating conditions and assure that the memory banks function properly and reliably. In the past, various approaches have been used to cool electronic components. Typically, a fan is provided to the casing where the memory banks are disposed, which generates airflow towards the memory banks. However, in use, the fan may make a lot of noise.
- FIG. 1 is an isometric, assembled view of a heat dissipation device in accordance with an embodiment of the disclosure.
- FIG. 2 is an exploded view of FIG. 1 .
- the heat dissipation device dissipates heat from an electronic component (not shown) mounted on a printed circuit board (not shown).
- the heat dissipation device comprises a heat sink 10 , a centrifugal fan 20 disposed on the heat sink 10 , and a cover board 30 covering the heat sink 10 and located above the centrifugal fan 20 .
- the heat sink 10 is integrally made of a material with high heat conductivity, such as copper, aluminum or an alloy thereof.
- the heat sink 10 comprises a base 12 and a plurality of fins 14 extending upwardly from a top face of the base 12 .
- the base 12 is a flat, circular plate.
- a bottom face of the base 12 is attached to the electronic component.
- a circular receiving portion 16 is defined by the top face of the base 12 and inner circumferential peripheries of the fins 14 .
- the fins 14 are arranged radially relative to the receiving portion 16 .
- the fins 14 are generally perpendicular to the base 12 .
- the fins 14 are spaced from each other.
- a passage (not labeled) is defined between every two neighboring fins 14 for an airflow flowing through.
- the centrifugal fan 20 comprises a rotation axis 22 , a magnetic member 24 mounted on the rotation axis 22 , a mounting ring 26 , and an impeller 28 rotatably engaging with the rotation axis 22 .
- the centrifugal fan 20 is received in the receiving portion 16 of the heat sink 10 .
- a height of the centrifugal fan 20 is slightly less than that of each fin 14 of the heat sink 10 .
- the rotation axis 22 is perpendicular to the base 12 of the heat sink 10 .
- the cover board 30 is integrally made of a material with high heat conductivity, such as copper, aluminum or an alloy thereof.
- the cover board 30 is circular, flat, and thin.
- a circular hole 32 is defined at a center of the cover board 30 .
- a plurality of through holes 34 are defined in the cover board 30 .
- the through holes 34 are correspondingly located above the impeller 28 of the centrifugal fan 20 .
- the through holes 34 are spaced from each other, and arranged evenly relative to the center of the cover board 30 . In this embodiment, the through holes 34 are arranged radially relative to the center of the cover board 30 .
- the cover board 30 is attached to top faces of the fins 14 of the heat sink 10 .
- the through holes 34 act as air-intakes of the centrifugal fan 20 , and airflow generated by the centrifugal fan 20 directly flow through the passages of the fins 14 of the heat sink 10 .
- the through holes 34 arranged around the circular hole 32 can effectively reduce noise generated by the impeller 28 , whereby the heat dissipation device has a quiet working status.
Abstract
A heat dissipation device for dissipating heat from an electronic component, includes a heat sink, a centrifugal fan disposed on the heat sink, and a cover board covering the heat sink and located above the centrifugal fan. The cover board defines a plurality of through holes acting as air-intakes of the centrifugal fan.
Description
- 1. Technical Field
- The disclosure relates to heat dissipation, and particularly to a heat dissipation device with low noise.
- 2. Description of Related Art
- Electronic components, such as memory banks comprise numerous circuits operating at high speeds and generating substantial amount of heat. Under most circumstances, it is necessary to cool the memory banks to maintain safe operating conditions and assure that the memory banks function properly and reliably. In the past, various approaches have been used to cool electronic components. Typically, a fan is provided to the casing where the memory banks are disposed, which generates airflow towards the memory banks. However, in use, the fan may make a lot of noise.
- What is needed, therefore, is a heat dissipation device with low noise.
-
FIG. 1 is an isometric, assembled view of a heat dissipation device in accordance with an embodiment of the disclosure. -
FIG. 2 is an exploded view ofFIG. 1 . - Referring to
FIGS. 1-2 , a heat dissipation device in accordance with an exemplary embodiment of the disclosure is disclosed. The heat dissipation device dissipates heat from an electronic component (not shown) mounted on a printed circuit board (not shown). The heat dissipation device comprises aheat sink 10, acentrifugal fan 20 disposed on theheat sink 10, and acover board 30 covering theheat sink 10 and located above thecentrifugal fan 20. - The
heat sink 10 is integrally made of a material with high heat conductivity, such as copper, aluminum or an alloy thereof. Theheat sink 10 comprises abase 12 and a plurality offins 14 extending upwardly from a top face of thebase 12. Thebase 12 is a flat, circular plate. A bottom face of thebase 12 is attached to the electronic component. Acircular receiving portion 16 is defined by the top face of thebase 12 and inner circumferential peripheries of thefins 14. Thefins 14 are arranged radially relative to the receivingportion 16. Thefins 14 are generally perpendicular to thebase 12. Thefins 14 are spaced from each other. A passage (not labeled) is defined between every two neighboringfins 14 for an airflow flowing through. - The
centrifugal fan 20 comprises arotation axis 22, amagnetic member 24 mounted on therotation axis 22, amounting ring 26, and animpeller 28 rotatably engaging with therotation axis 22. Thecentrifugal fan 20 is received in thereceiving portion 16 of theheat sink 10. A height of thecentrifugal fan 20 is slightly less than that of eachfin 14 of theheat sink 10. Therotation axis 22 is perpendicular to thebase 12 of theheat sink 10. - The
cover board 30 is integrally made of a material with high heat conductivity, such as copper, aluminum or an alloy thereof. Thecover board 30 is circular, flat, and thin. Acircular hole 32 is defined at a center of thecover board 30. A plurality of throughholes 34 are defined in thecover board 30. The throughholes 34 are correspondingly located above theimpeller 28 of thecentrifugal fan 20. The throughholes 34 are spaced from each other, and arranged evenly relative to the center of thecover board 30. In this embodiment, the throughholes 34 are arranged radially relative to the center of thecover board 30. Thecover board 30 is attached to top faces of thefins 14 of theheat sink 10. In use, the throughholes 34 act as air-intakes of thecentrifugal fan 20, and airflow generated by thecentrifugal fan 20 directly flow through the passages of thefins 14 of theheat sink 10. The throughholes 34 arranged around thecircular hole 32 can effectively reduce noise generated by theimpeller 28, whereby the heat dissipation device has a quiet working status. - It is to be understood, however, that even though numerous characteristics and advantages of certain embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (15)
1. A heat dissipation device comprising:
a heat sink;
a centrifugal fan disposed on the heat sink; and
a cover board covering the heat sink and located above the centrifugal fan; wherein
the cover board defines a plurality of through holes acting as air-intakes of the centrifugal fan.
2. The heat dissipation device of claim 1 , wherein the heat sink comprises a base and a plurality of fins extending upwardly from a top face of the base.
3. The heat dissipation device of claim 2 , wherein a receiving portion is defined by the top face of the base and inner circumferential peripheries of the fins.
4. The heat dissipation device of claim 3 , wherein the fan is received in the receiving portion.
5. The heat dissipation device of claim 4 , wherein a height of the centrifugal fan is less than that of each fin of the heat sink.
6. The heat dissipation device of claim 3 , wherein the fins are arranged radially relative to the receiving portion.
7. The heat dissipation device of claim 2 , wherein the fins are spaced from each other, and a passage is defined between every two neighboring fins.
8. The heat dissipation device of claim 7 , wherein airflow generated by the centrifugal fan directly flow through the passages of the fins.
9. The heat dissipation device of claim 1 , wherein the centrifugal fan comprises a rotation axis, a magnetic member mounted on the rotation axis, a mounting ring, and an impeller rotatably engaging with the rotation axis.
10. The heat dissipation device of claim 9 , wherein the rotation axis is perpendicular to the base of the heat sink.
11. The heat dissipation device of claim 1 , wherein the through holes are located above the centrifugal fan.
12. The heat dissipation device of claim 1 , wherein the through holes are spaced from each other.
13. The heat dissipation device of claim 1 , wherein the through holes are arranged radially relative to a center of the cover board.
14. The heat dissipation device of claim 1 , wherein a circular hole is defined at a center of the cover board.
15. The heat dissipation device of claim 1 , wherein the cover board is attached to a top side of the heat sink.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW099146014A TW201227244A (en) | 2010-12-27 | 2010-12-27 | Heat dissipation device |
TW99146014 | 2010-12-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20120160462A1 true US20120160462A1 (en) | 2012-06-28 |
Family
ID=46315275
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/981,438 Abandoned US20120160462A1 (en) | 2010-12-27 | 2010-12-29 | Heat dissipation device |
Country Status (2)
Country | Link |
---|---|
US (1) | US20120160462A1 (en) |
TW (1) | TW201227244A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105378417A (en) * | 2013-04-26 | 2016-03-02 | 酷奇普科技股份有限公司 | Kinetic heat sink with stationary fins |
US10285303B2 (en) * | 2017-07-14 | 2019-05-07 | Apple Inc. | Electronic device with integrated passive and active cooling |
US10375853B2 (en) | 2016-09-06 | 2019-08-06 | Apple Inc. | Electronic device with cooling fan |
US11384999B2 (en) * | 2019-05-31 | 2022-07-12 | Cooler Master Co., Ltd. | Heat dissipation device |
US20230070319A1 (en) * | 2021-09-08 | 2023-03-09 | Dell Products L.P. | Fan covering with high recycle content and high thermal conductivity |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107816455B (en) * | 2016-09-14 | 2020-01-21 | 宏碁股份有限公司 | Fan module and electronic device using same |
DE102020207966A1 (en) * | 2019-11-25 | 2021-05-27 | Volkswagen Aktiengesellschaft | Cooling arrangement for electronic components of a motor vehicle |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5409352A (en) * | 1994-04-18 | 1995-04-25 | Lin; Mike | CPU heat dissipating device |
US5559674A (en) * | 1993-03-19 | 1996-09-24 | Fujitsu Limited | Heat sink and mounting structure for heat sink |
US5707282A (en) * | 1996-02-28 | 1998-01-13 | Hewlett-Packard Company | Fan diffuser |
US5928076A (en) * | 1997-09-25 | 1999-07-27 | Hewlett Packard Company | EMI-attenuating air ventilation panel |
US20030026074A1 (en) * | 2001-07-31 | 2003-02-06 | Clements Bradley E. | Externally mounted on-line replaceable fan module |
US6659169B1 (en) * | 1999-12-09 | 2003-12-09 | Advanced Rotary Systems, Llc | Cooler for electronic devices |
US6826048B1 (en) * | 2003-09-18 | 2004-11-30 | Hewlett-Packard Development Company, L.P. | Method and apparatus for securing a fan within a device |
US7333340B2 (en) * | 2005-04-14 | 2008-02-19 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Mounting device for heat dissipating apparatus |
US20090008067A1 (en) * | 2007-07-04 | 2009-01-08 | Foxconn Technology Co., Ltd. | Heat dissipation device |
-
2010
- 2010-12-27 TW TW099146014A patent/TW201227244A/en unknown
- 2010-12-29 US US12/981,438 patent/US20120160462A1/en not_active Abandoned
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5559674A (en) * | 1993-03-19 | 1996-09-24 | Fujitsu Limited | Heat sink and mounting structure for heat sink |
US5409352A (en) * | 1994-04-18 | 1995-04-25 | Lin; Mike | CPU heat dissipating device |
US5707282A (en) * | 1996-02-28 | 1998-01-13 | Hewlett-Packard Company | Fan diffuser |
US5928076A (en) * | 1997-09-25 | 1999-07-27 | Hewlett Packard Company | EMI-attenuating air ventilation panel |
US5928076C1 (en) * | 1997-09-25 | 2001-04-24 | Hewlett Packard Co | Emi-attenuating air ventilation panel |
US6659169B1 (en) * | 1999-12-09 | 2003-12-09 | Advanced Rotary Systems, Llc | Cooler for electronic devices |
US20030026074A1 (en) * | 2001-07-31 | 2003-02-06 | Clements Bradley E. | Externally mounted on-line replaceable fan module |
US6690576B2 (en) * | 2001-07-31 | 2004-02-10 | Hewlett Packard Development Company, L.P. | Externally mounted on-line replaceable fan module |
US6826048B1 (en) * | 2003-09-18 | 2004-11-30 | Hewlett-Packard Development Company, L.P. | Method and apparatus for securing a fan within a device |
US7333340B2 (en) * | 2005-04-14 | 2008-02-19 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Mounting device for heat dissipating apparatus |
US20090008067A1 (en) * | 2007-07-04 | 2009-01-08 | Foxconn Technology Co., Ltd. | Heat dissipation device |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105378417A (en) * | 2013-04-26 | 2016-03-02 | 酷奇普科技股份有限公司 | Kinetic heat sink with stationary fins |
EP2989404A4 (en) * | 2013-04-26 | 2016-10-12 | Coolchip Technologies Inc | Kinetic heat sink with stationary fins |
US10375853B2 (en) | 2016-09-06 | 2019-08-06 | Apple Inc. | Electronic device with cooling fan |
US10285303B2 (en) * | 2017-07-14 | 2019-05-07 | Apple Inc. | Electronic device with integrated passive and active cooling |
US11384999B2 (en) * | 2019-05-31 | 2022-07-12 | Cooler Master Co., Ltd. | Heat dissipation device |
US11732981B2 (en) | 2019-05-31 | 2023-08-22 | Cooler Master Co., Ltd. | Heat dissipation device |
US20230070319A1 (en) * | 2021-09-08 | 2023-03-09 | Dell Products L.P. | Fan covering with high recycle content and high thermal conductivity |
Also Published As
Publication number | Publication date |
---|---|
TW201227244A (en) | 2012-07-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:GUAN, ZHI-BIN;REEL/FRAME:025566/0639 Effective date: 20101223 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |