US20120055940A1

US20120055940A1 - Enclosure of electronic device

Info

Publication number: US20120055940A1
Application number: US12/888,432
Authority: US
Inventors: Yao-Ting Chang
Original assignee: Hon Hai Precision Industry Co Ltd
Current assignee: Hon Hai Precision Industry Co Ltd
Priority date: 2010-09-08
Filing date: 2010-09-23
Publication date: 2012-03-08
Also published as: TW201212803A

Abstract

An enclosure of an electronic device includes a bottom wall and a sidewall. The sidewall includes at least two non-coplanar portions. Each of the non-coplanar portions defines a plurality of through holes for heat dissipation.

Description

BACKGROUND

1. Technical Field
The present disclosure relates to an enclosure of an electronic device.
2. Description of Related Art
As shown in FIG. 3, an enclosure 10 of an electronic device often includes a sidewall 12 defining a number of through holes 122 for heat dissipation. However, the area and quantity of the through holes both are often less then desired because of the size of the sidewall, which is insufficient for heat dissipation.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is a schematic, isometric view of a first embodiment of an enclosure of an electronic device.

FIG. 2 is a schematic, isometric view of a second embodiment of an enclosure of an electronic device.

FIG. 3 is a schematic, isometric view of an enclosure of an electronic device of a related art.

DETAILED DESCRIPTION

The disclosure, including the accompanying drawings, is illustrated by way of examples and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to FIG. 1, a first exemplary embodiment of an enclosure 20 of an electronic device, such as a computer, includes a bottom wall 21 and a sidewall 22. The sidewall 22 includes three non-coplanar portions, a first portion 224, a second portion 222, and a third portion 226 connected between the first portion 224 and the second portion 222. The first portion 224 substantially perpendicularly extends from the bottom wall 21. The first portion 224 and the second portion 222 are parallel to each other and perpendicular to the bottom wall 21. The third portion 226 is parallel to the bottom wall 21 and substantially perpendicular to the first and second portions 224 and 222 by opposite sides of the third portion 226. A number of through holes 288 is defined in the first to third portions 224, 222, and 226.
Referring to FIG. 2, a second exemplary embodiment of an enclosure 30 of an electronic device, such as a computer, includes a bottom wall 31 and a sidewall 32. The sidewall 32 includes two non-coplanar portions, a first portion 324 and a second portion 322 connected to the first portion 322. The first portion 324 slantingly extends from the bottom wall 31. The second portion 322 extends from the first portion 324. The second portion 322 is opposite and substantially perpendicular to the bottom wall 31. A number of through holes 328 is defined in both the first portion 324 and the second bend 322.
In this application, the sidewalls 22 and 32 include several non-coplanar portions, such that more through holes can be defined in the sidewall 22 and 32, increasing heat dissipation efficiency.
It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the present disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

What is claimed is:

1. An enclosure comprising:

a bottom wall; and

a sidewall extending from the bottom wall and comprising at least two non-coplanar portions, wherein each of the at least two non-coplanar portions defines a plurality of through holes for heat dissipation.

2. The enclosure of claim 1, wherein the at least two non-coplanar portions comprise a first portion substantially perpendicularly extending from the bottom wall, a second portion substantially parallel to the first portion, and a third portion connected between the first portion and the second portion.

3. The enclosure of claim 2, wherein the third bend portion is substantially parallel to the bottom wall.

4. The enclosure of claim 1, wherein the at least two non-coplanar portions comprise a first portion slantingly extending from the bottom wall, and a second portion extending from the first portion opposite and substantially perpendicular to the bottom wall.