US20110073287A1

US20110073287A1 - Heat dissipating device

Info

Publication number: US20110073287A1
Application number: US12/650,434
Authority: US
Inventors: Jin-Biao Ji; Zhi-Guo Zhang; Li-Fu Xu
Original assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2009-09-30
Filing date: 2009-12-30
Publication date: 2011-03-31
Also published as: CN201563340U

Abstract

A heat dissipating device includes a heat sink and a heat sink cover. The heat sink includes a base and a plurality of fins extending from the base. Each of the plurality of fins includes a corner projection. The heat sink cover covers the corner projections of the heat sink.

Description

BACKGROUND

1. Technical Field
The disclosure generally relates to heat dissipating devices, especially to a heat sink cover and a heat dissipating device using the heat sink cover.
2. Description of Related Art
Electronic devices in computers, such as central processing units (CPUs), generate a lot of heat during normal operation, which can deteriorate their operational stability, and damage associated electronic devices. Thus, the heat must be removed quickly to ensure normal operation of the CPU. Some heat dissipating devices include a heat sink mounted on a CPU to remove heat. Some heat sinks include a plurality of fins each having a corner projection. The corner projections may be hazardous during installation.
Therefore there is a need for improvement in the art.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is an exploded, isometric view of a heat dissipating device of an embodiment, the heat dissipating device including a heat sink and a heat sink cover.

FIG. 2 is a partial enlarged, isometric view of the heat sink of FIG. 1, showing section II.

FIG. 3 is a cross section view of the heat sink cover of FIG. 1, taken along line III-III.

FIG. 4 is an exploded, isometric view of the heat dissipating device of FIG. 1 and an enclosure.

FIG. 5 is an assembled view of FIG. 4.

DETAILED DESCRIPTION

The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to FIG. 1, a heat dissipating device 10 includes a heat sink 30, a heat sink cover 40, and a fan 50.
The heat sink 30 includes a base 31, a plurality of fins 32 extending radially from the base 31, and four securing portions 33 extending from the base 31. Each securing portion 33 includes a first mounting portion 331 and a second mounting portion 332. The first mounting portion 331 includes a fastener 3311 capable of securing the heat sink 30 to the motherboard. The second mounting portion 332 defines a securing hole 3321. Each fin 32 is generally rectangle-shaped. As shown in FIG. 2, each fin 32 includes a first edge 321 and a second edge 322 perpendicular to the first edge 321. A corner projection 323 is corporately defined by the first edge 321 and the second edge 322.
The fan 50 includes four securing portion 51. Each securing portion 51 defines a securing hole 511 therein.
Referring to FIGS. 1 and 3, the heat sink cover 40 is used to cover the corner projections 323 of the heat sink 30. The heat sink cover 40 includes a first wall 41 and a second wall 42 perpendicularly extending from the first wall 41. A receiving space 43 is corporately defined by the first wall and the second portion 42. The cross section of the heat sink cover 40 is L-shaped. The first wall 41 includes four mounting portions 411. Each mounting portion 411 defines a through hole 412 corresponding to the securing hole 3321 of the heat sink 30 and an opening 413 corresponding to the fastener 3311. The second wall 42 has four receiving portions 422 for receiving the second mounting portions 332 respectively. The heat sink cover 40 is circular and surrounds the corner projections 323 of the heat sink 30.
Referring to FIGS. 1 to 4, in assembly of the heat dissipating device 10, the heat sink cover 40 is disposed on the heat sink 30 to cover the corner projection 323 of the heat sink 30. The receiving portions 422 of the heat sink cover 40 receive the second mounting portions 332 of the heat sink 30 respectively. The openings 413 of the heat sink cover 40 align with the first mounting portions 331 of the heat sink 30 respectively. The first wall 41 of the heat sink cover 40 contacts the first edge 321 of the heat sink 30 and the second wall 42 of the heat sink cover 40 contacts the second edges 322 of the heat sink 30. The receiving space 43 receives the corner projections 323 of the fins 32. The securing holes 511 of the fan 50 are aligned with the through holes 412 of the heat sink cover 40 respectively. Four fasteners 60 are respectively extended through the securing holes 511 of the fan 50, the through holes 412 of the heat sink cover 40, and then screwed into the securing holes 3321 of the heat sink 30 to secure the fan 50, the heat sink cover 40, and the heat sink 30 together.
Referring to FIGS. 4 and 5, a printed circuit board 80 is placed in an enclosure 70. The printed circuit board 80 includes a heat generating element 90 mounted thereon. The printed circuit board 80 defines four mounting holes 810 corresponding to the fasteners 3311 respectively. In assembly of the heat dissipating device 10 to the enclosure 70, the fasteners 3311 of the heat dissipating device 10 are aligned with and screwed into the mounting holes 810 respectively to secure the heat dissipating device 10 in the enclosure 70.
It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of preferred embodiments, together with details of the structures and functions of the preferred embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. A heat dissipating device, comprising:

a heat sink comprising a base and a plurality of fins extending from the base, each of the plurality of fins comprising a corner projection; and

a heat sink cover covering the corner projections of the heat sink for avoiding the corner projections to be exposed.

2. The heat dissipating device of claim 1, wherein the heat sink cover comprises a first wall and a second wall extending from the first wall, a receiving space is corporately defined by the first wall and the second wall, the receiving space receives the corner projections of the heat sink.

3. The heat dissipating device of claim 2, wherein each of the plurality of fins comprises a first edge and a second edge connecting the first edge, the corner projection is corporately defined by the first edge and the second edge.

4. The heat dissipating device of claim 3, wherein the first wall contacts the first edge and the second wall contacts the second edge.

5. The heat dissipating device of claim 3, wherein the first wall is perpendicular to the second wall, and each of the plurality of fins is generally rectangle-shaped, the first edge is perpendicular to the second edge.

6. The heat dissipating device of claim 1, wherein the heat sink cover is ring-shaped and surrounds the corner projections of the heat sink.

7. The heat dissipating device of claim 1, wherein the heat sink defines a securing hole therein, and the heat sink cover comprises a mounting portion, the mounting portion defines a through hole corresponding to the securing hole of the heat sink.

8. The heat dissipating device of claim 7, further comprising a fan placed on the heat sink, the heat sink cover disposed between the heat sink and the fan.

9. The heat dissipating device of claim 8, wherein the fan comprises a securing portion, the securing portion defines a securing hole therein corresponding to the through hole of the heat sink cover.

10. The heat sink dissipating device of claim 7, wherein the heat sink comprises a second mounting portion, the second mounting portion defining the securing hole therein, the heat sink cover comprising a receiving portion receiving the second mounting portion.

11. The heat sink dissipating device of claim 1, wherein the cross section of the heat sink cover is L-shaped.

12. The heat sink dissipating device of claim 1, wherein the heat sink comprises a fastener for securing the heat sink to a printed circuit board, and the heat sink cover defines an opening corresponding to the fastener of the heat sink.

13. The heat sink dissipating device of claim 1, wherein the plurality of fins radially extends from the base.

14. A heat sink cover, comprising:

a first wall; and

a second wall extending from the first wall;

wherein a receiving space is corporately defined by the first wall and the second wall, the receiving space is capable of receiving corner projections of fins of a heat sink for avoiding the corner projections to be exposed.

15. The heat sink cover of claim 14, wherein the cross section of the heat sink cover is L-shaped.

16. The heat sink cover of claim 14, wherein the heat sink cover is ring-shaped for surrounding the corner projections of the heat sink.

17. The heat sink cover of claim 14, wherein the first wall is perpendicular to the second wall.