US20100236764A1 - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- US20100236764A1 US20100236764A1 US12/503,018 US50301809A US2010236764A1 US 20100236764 A1 US20100236764 A1 US 20100236764A1 US 50301809 A US50301809 A US 50301809A US 2010236764 A1 US2010236764 A1 US 2010236764A1
- Authority
- US
- United States
- Prior art keywords
- heat sink
- fan
- dissipation device
- heat dissipation
- fins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present disclosure relates generally to a heat dissipation device, and more particularly to a heat dissipation device having a heat sink and fan clips for facilitating a mounting of a fan on the heat sink.
- a heat dissipation device is used to dissipate heat generated by the electronic device.
- a conventional heat dissipation device includes a heat sink and a fan attached on the heat sink to improve a heat-dissipation capacity of the heat sink.
- FIG. 1 is an isometric, assembled view of a heat dissipation device in accordance with an embodiment of the present disclosure.
- FIG. 2 is an exploded view of the heat dissipation device of FIG. 1 .
- FIG. 3 is an inverted view of the heat dissipation device of FIG. 1 .
- FIG. 1 illustrates a heat dissipation device in accordance with an embodiment of the present disclosure.
- the heat dissipation device dissipates heat from a heat-generating component such as a CPU (not shown).
- the heat dissipation device comprises a heat sink 10 , a fan 20 arranged on a top of the heat sink 10 , and two wire clips 30 fastening the fan 20 on the heat sink 10 .
- the heat sink 10 is integrally formed of a material with a good heat conductivity such as aluminum and copper and comprises a base plate 11 and two first fins 12 extending upwardly from two flanks of the base plate 11 .
- a first horizontal portion 123 extends outwardly and horizontally from a top free end of each first fin 12 .
- a first perpendicular portion 124 extends upwardly from a free end of the first horizontal portion 123 .
- a second horizontal portion 125 extends outwardly and horizontally from a free end of the first perpendicular portion 124 .
- a second perpendicular portion 126 extends upwardly from a free end of the second horizontal portion 125 .
- a groove 121 is defined in a bottom of each first horizontal portion 123 and parallel to the first fins 12 .
- the grooves 121 and the first horizontal portions 123 have a same length.
- the heat sink 10 further comprises a plurality of second fins 13 extending upwardly from the base plate 11 and between the two first fins 12 , and a plurality of third fins 14 extending upwardly from the first horizontal portions 123 .
- the first, second and third fins 12 , 13 , 14 are parallel to each other. Tops of the second and third fins 13 , 14 are beneath the second horizontal portions 125 .
- the third fins 14 extend upwardly from the first horizontal portions 123 . Understandably, in an alternative embodiment, the third fins 14 can further include fins or be fins extending downwardly from the first horizontal portions 123 .
- Each wire clip 30 is integrally formed by bending an elastic metallic wire and comprises a straight engaging arm 31 , two tensile parts 32 , two hooks 33 and a handle 34 .
- the tensile parts 32 extend upwardly from two opposite ends of the engaging arm 31 .
- the tensile parts 32 are substantially C-shaped and can be stretched to generate an elastic force.
- Each of the hooks 33 bends inwardly from a free end of each tensile part 32 .
- a middle of the engaging arm 31 bends and protrudes downwardly to form the handle 34 .
- the handle 34 is substantially U-shaped.
- the tensile parts 32 and the hooks 33 are symmetric relative to the handle 34 .
- the fan 20 comprises a frame 21 and an impeller 22 rotatably received in the frame 21 .
- Four holes 23 are defined in four corners of the fan frame 21 .
- the fan 20 is located on the second horizontal portions 125 and sandwiched between the second perpendicular portions 126 .
- the second perpendicular portions 126 restrict the movement of the fan 20 along a lateral direction of the heat sink 10 .
- the hooks 33 are inserted into the holes 23 of the fan 20 .
- the handle 34 is pulled downwardly to stretch the tensile parts 32 until the engaging arm 31 is aligned with the groove 121 of the heat sink 10 .
- the pulling force on the handle 34 thereafter is released to cause the engaging arm 31 to enter and tightly engage in the groove 121 of the heat sink 10 .
- the tensile parts 32 restrict the movement of the fan 20 along rear-to-front of the heat sink 10
- the engaging arms 31 and hooks 33 restrict the movement of the fan 20 along a vertical direction of the heat sink 10 .
- the fan 20 is secured on the heat sink 10 .
- a detachment of the fan 20 from the heat sink 10 can be easily achieved by directly pulling the handle 34 downwardly and outwardly to disengage the engaging arm 31 of each clip 30 from the groove 121 of the heat sink 10 . Thereafter, the handle 34 is rotated outwardly and upwardly to completely release the locking between the clip 30 and the heat sink 10 .
Abstract
A heat dissipation device includes a heat sink, a fan placed on the heat sink and two wire clips securing the fan on the heat sink. The heat sink has two grooves defined in two flanks thereof. The fan has a frame with a plurality of holes defined therein. Each clip includes an engaging arm received in a corresponding groove of the heat sink, two tensile parts extending upwardly from two opposite ends of the engaging arm, two hooks formed at free ends of the tensile parts and inserted into the holes of the fan, and a handle protruding from a middle of the engaging arm.
Description
- 1. Technical Field
- The present disclosure relates generally to a heat dissipation device, and more particularly to a heat dissipation device having a heat sink and fan clips for facilitating a mounting of a fan on the heat sink.
- 2. Description of Related Art
- Generally, in order to ensure the normal running of an electronic device, a heat dissipation device is used to dissipate heat generated by the electronic device. A conventional heat dissipation device includes a heat sink and a fan attached on the heat sink to improve a heat-dissipation capacity of the heat sink.
- When installing the fan to the heat sink, it is generally to fix the fan to a side of the heat sink via a fan holder with screws. However, using the screws requires a lot of manpower and material resources. Furthermore, it is necessary to remove the fan at first by unscrewing the screws when disassembling and maintaining the heat dissipation device. Such unscrewing operation is tiresome. In addition, it is also possible that the unscrewed screws fall into a computer in which the heat dissipation device is mounted to cause damages to components of the computer.
- What is need therefore is a heat dissipation device having a design which makes assembling and disassembling of a fan to/from a heat sink of the heat dissipation device be convenient and easy.
- Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an isometric, assembled view of a heat dissipation device in accordance with an embodiment of the present disclosure. -
FIG. 2 is an exploded view of the heat dissipation device ofFIG. 1 . -
FIG. 3 is an inverted view of the heat dissipation device ofFIG. 1 . -
FIG. 1 illustrates a heat dissipation device in accordance with an embodiment of the present disclosure. The heat dissipation device dissipates heat from a heat-generating component such as a CPU (not shown). The heat dissipation device comprises aheat sink 10, afan 20 arranged on a top of theheat sink 10, and twowire clips 30 fastening thefan 20 on theheat sink 10. - Referring to
FIG. 2 , theheat sink 10 is integrally formed of a material with a good heat conductivity such as aluminum and copper and comprises abase plate 11 and twofirst fins 12 extending upwardly from two flanks of thebase plate 11. A firsthorizontal portion 123 extends outwardly and horizontally from a top free end of eachfirst fin 12. A firstperpendicular portion 124 extends upwardly from a free end of the firsthorizontal portion 123. A secondhorizontal portion 125 extends outwardly and horizontally from a free end of the firstperpendicular portion 124. A secondperpendicular portion 126 extends upwardly from a free end of the secondhorizontal portion 125. Agroove 121 is defined in a bottom of each firsthorizontal portion 123 and parallel to thefirst fins 12. Thegrooves 121 and the firsthorizontal portions 123 have a same length. Theheat sink 10 further comprises a plurality ofsecond fins 13 extending upwardly from thebase plate 11 and between the twofirst fins 12, and a plurality ofthird fins 14 extending upwardly from the firsthorizontal portions 123. The first, second andthird fins third fins horizontal portions 125. - In the present embodiment, the
third fins 14 extend upwardly from the firsthorizontal portions 123. Understandably, in an alternative embodiment, thethird fins 14 can further include fins or be fins extending downwardly from the firsthorizontal portions 123. - Each
wire clip 30 is integrally formed by bending an elastic metallic wire and comprises a straightengaging arm 31, twotensile parts 32, twohooks 33 and ahandle 34. Thetensile parts 32 extend upwardly from two opposite ends of theengaging arm 31. Thetensile parts 32 are substantially C-shaped and can be stretched to generate an elastic force. Each of thehooks 33 bends inwardly from a free end of eachtensile part 32. A middle of theengaging arm 31 bends and protrudes downwardly to form thehandle 34. Thehandle 34 is substantially U-shaped. Thetensile parts 32 and thehooks 33 are symmetric relative to thehandle 34. - The
fan 20 comprises aframe 21 and animpeller 22 rotatably received in theframe 21. Fourholes 23 are defined in four corners of thefan frame 21. - Also referring to
FIG. 3 , in assembly, thefan 20 is located on the secondhorizontal portions 125 and sandwiched between the secondperpendicular portions 126. The secondperpendicular portions 126 restrict the movement of thefan 20 along a lateral direction of theheat sink 10. Thehooks 33 are inserted into theholes 23 of thefan 20. Then, thehandle 34 is pulled downwardly to stretch thetensile parts 32 until theengaging arm 31 is aligned with thegroove 121 of theheat sink 10. The pulling force on thehandle 34 thereafter is released to cause theengaging arm 31 to enter and tightly engage in thegroove 121 of theheat sink 10. Thetensile parts 32 restrict the movement of thefan 20 along rear-to-front of theheat sink 10, and theengaging arms 31 andhooks 33 restrict the movement of thefan 20 along a vertical direction of theheat sink 10. Thus, thefan 20 is secured on theheat sink 10. - A detachment of the
fan 20 from theheat sink 10 can be easily achieved by directly pulling thehandle 34 downwardly and outwardly to disengage theengaging arm 31 of eachclip 30 from thegroove 121 of theheat sink 10. Thereafter, thehandle 34 is rotated outwardly and upwardly to completely release the locking between theclip 30 and theheat sink 10. - It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the disclosure.
Claims (14)
1. A heat dissipation device comprising:
a heat sink;
a fan placed on a top of the heat sink; and
two wire clips securing the fan on the heat sink, each of the clips having an engaging arm engaged with the heat sink, two tensile parts extending upwardly from two opposite ends of the engaging arm, and two hooks formed at free ends of the tensile parts and engaged with the fan.
2. The heat dissipation device as claimed in claim 1 , wherein the tensile parts and the hooks are symmetric relative to a middle of the engaging arm.
3. The heat dissipation device as claimed in claim 1 , wherein each of the clips further has a handle protruding from a middle of the engaging arm.
4. The heat dissipation device as claimed in claim 1 , wherein the fan comprises a frame with holes defined therein, and the hooks of the clips are inserted into the holes.
5. The heat dissipation device as claimed in claim 1 , wherein the heat sink comprises a base plate and two first fins extending from two flanks of the base plate, and a first horizontal portion extending outwardly from a top end of one of the two first fins, a first perpendicular portion extending upwardly from a free end of the first horizontal portion, a second horizontal portion extending outwardly from a top end of the first perpendicular portion and a second perpendicular portion extending upwardly from a free end of the second horizontal portion, and wherein the fan is located on the second horizontal portions and between the second perpendicular portions, and the engaging arms of the clips engage bottoms of the first horizontal portions.
6. The heat dissipation device as claimed in claim 5 , wherein a groove is defined in the bottom of each first horizontal portion for receiving a corresponding engaging arm therein.
7. The heat dissipation device as claimed in claim 5 , wherein the heat sink further comprises a plurality of second fins extending from the base plate and between the first fins.
8. The heat dissipation device as claimed in claim 7 , wherein the heat sink further comprises a plurality of third fins extending from first horizontal portions.
9. The heat dissipation device as claimed in claim 8 , wherein the first, second and third fins are parallel to each other, and tops of the second and third fins are beneath the second horizontal portions.
10. A heat dissipation device comprising:
a heat sink having two grooves respectively defined in two flanks thereof;
a fan placed on the heat sink, the fan having a frame with a plurality of holes defined therein; and
two clips securing the fan on the heat sink, each clip comprising an engaging arm received in a corresponding groove of the heat sink, two tensile parts extending from two opposite ends of the engaging arm, two hooks formed at free ends of the tensile parts and inserted into corresponding ones of the holes of the fan, and a handle protruding from a middle of the engaging arm configured for facilitating a manipulation of each clip.
11. The heat dissipation device as claimed in claim 10 , wherein the heat sink comprises a base plate, two first fins extending from two flanks of the base plate, a first horizontal portion extending horizontally and outwardly from a top of each first fin, a first perpendicular portion extending upwardly from the first horizontal portion, a second horizontal portion extending horizontally and outwardly from a top of the first perpendicular portion, and a second perpendicular portion extending upwardly from the second horizontal portion, and wherein the grooves are defined in bottoms of the first horizontal portions.
12. The heat dissipation device as claimed in claim 11 , wherein the fan is located on the second horizontal portions and between the second perpendicular portions.
13. The heat dissipation device as claimed in claim 11 , wherein the heat sink further comprises a plurality of second fins extending from the base plate and between the first fins, and a plurality of third fins extending from the first horizontal portions.
14. The heat dissipation device as claimed in claim 10 , wherein the tensile parts are C-shaped and stretched to generate an elastic force to render the engaging arms and hooks respectively engaging with the heat sink and the fan to secure the fan on the heat sink.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910300965.1A CN101841993B (en) | 2009-03-19 | 2009-03-19 | Dissipation device |
CN200910300965.1 | 2009-03-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20100236764A1 true US20100236764A1 (en) | 2010-09-23 |
Family
ID=42736482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/503,018 Abandoned US20100236764A1 (en) | 2009-03-19 | 2009-07-14 | Heat dissipation device |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100236764A1 (en) |
CN (1) | CN101841993B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI417028B (en) * | 2011-03-31 | 2013-11-21 | Wistron Corp | Fixing mechanism of fixing an electronic module and supporting device therewith |
CN104760763B (en) * | 2015-03-20 | 2017-09-26 | 孙建群 | A kind of refrigerating box |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5251101A (en) * | 1992-11-05 | 1993-10-05 | Liu Te Chang | Dissipating structure for central processing unit chip |
US5581442A (en) * | 1995-06-06 | 1996-12-03 | Wakefield Engineering, Inc. | Spring clip for clamping a heat sink module to an electronic module |
US6101091A (en) * | 1998-12-30 | 2000-08-08 | Orient Co., Ltd. | Clip for clamping heat sink and semiconductor |
US20010009187A1 (en) * | 2000-01-25 | 2001-07-26 | Lin Shih-Jen | Heat sink and fan arrangment |
US6435467B1 (en) * | 2000-06-02 | 2002-08-20 | Yaw-Huey Lai | Clamping device of cooling fan |
US20020189789A1 (en) * | 2001-06-18 | 2002-12-19 | Global Win Technology Co., Ltd | CPU cooling arrangement |
US6621704B1 (en) * | 2002-04-18 | 2003-09-16 | Hon Hai Precision Ind. Co., Ltd. | Clip for heat sink |
US6768641B2 (en) * | 2002-06-28 | 2004-07-27 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipation assembly |
US20050072555A1 (en) * | 2001-08-01 | 2005-04-07 | Cheng Sheng-Hsiung | Heat sink fastening device |
US6992889B1 (en) * | 2000-01-25 | 2006-01-31 | Fujitsu Limited | Retention module, heat sink and electronic device |
US20080130229A1 (en) * | 2006-12-01 | 2008-06-05 | Delta Electronics Inc. | Heat dissipating module and heat sink thereof |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2473667Y (en) * | 2001-01-08 | 2002-01-23 | 林世仁 | Non-balance radiation fin |
CN2484639Y (en) * | 2001-07-03 | 2002-04-03 | 林世仁 | Radiating apparatus |
CN2498645Y (en) * | 2001-09-03 | 2002-07-03 | 林世仁 | Unbalanced radiating ribs |
CN2602203Y (en) * | 2003-02-18 | 2004-02-04 | 陈峰益 | Package assembly for thermal fan and radiating fins of central processing unit |
CN101203123B (en) * | 2006-12-11 | 2011-01-12 | 台达电子工业股份有限公司 | Radiating module and heat radiator |
-
2009
- 2009-03-19 CN CN200910300965.1A patent/CN101841993B/en not_active Expired - Fee Related
- 2009-07-14 US US12/503,018 patent/US20100236764A1/en not_active Abandoned
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5251101A (en) * | 1992-11-05 | 1993-10-05 | Liu Te Chang | Dissipating structure for central processing unit chip |
US5581442A (en) * | 1995-06-06 | 1996-12-03 | Wakefield Engineering, Inc. | Spring clip for clamping a heat sink module to an electronic module |
US6101091A (en) * | 1998-12-30 | 2000-08-08 | Orient Co., Ltd. | Clip for clamping heat sink and semiconductor |
US20010009187A1 (en) * | 2000-01-25 | 2001-07-26 | Lin Shih-Jen | Heat sink and fan arrangment |
US6992889B1 (en) * | 2000-01-25 | 2006-01-31 | Fujitsu Limited | Retention module, heat sink and electronic device |
US6435467B1 (en) * | 2000-06-02 | 2002-08-20 | Yaw-Huey Lai | Clamping device of cooling fan |
US20020189789A1 (en) * | 2001-06-18 | 2002-12-19 | Global Win Technology Co., Ltd | CPU cooling arrangement |
US20050072555A1 (en) * | 2001-08-01 | 2005-04-07 | Cheng Sheng-Hsiung | Heat sink fastening device |
US6621704B1 (en) * | 2002-04-18 | 2003-09-16 | Hon Hai Precision Ind. Co., Ltd. | Clip for heat sink |
US6768641B2 (en) * | 2002-06-28 | 2004-07-27 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipation assembly |
US20080130229A1 (en) * | 2006-12-01 | 2008-06-05 | Delta Electronics Inc. | Heat dissipating module and heat sink thereof |
Also Published As
Publication number | Publication date |
---|---|
CN101841993B (en) | 2013-06-05 |
CN101841993A (en) | 2010-09-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KONG, CHENG;YANG, HONG-CHENG;REEL/FRAME:022955/0774 Effective date: 20090710 Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KONG, CHENG;YANG, HONG-CHENG;REEL/FRAME:022955/0774 Effective date: 20090710 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |