US20100147502A1 - Heat dissipation device with heat pipe - Google Patents

Heat dissipation device with heat pipe Download PDF

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Publication number
US20100147502A1
US20100147502A1 US12/432,745 US43274509A US2010147502A1 US 20100147502 A1 US20100147502 A1 US 20100147502A1 US 43274509 A US43274509 A US 43274509A US 2010147502 A1 US2010147502 A1 US 2010147502A1
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US
United States
Prior art keywords
section
heat
dissipation device
heat dissipation
evaporating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/432,745
Inventor
Shou-Biao Xu
Shi-Wen Zhou
Chun-Chi Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Original Assignee
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuzhun Precision Industry Shenzhen Co Ltd, Foxconn Technology Co Ltd filed Critical Fuzhun Precision Industry Shenzhen Co Ltd
Assigned to FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD. reassignment FOXCONN TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, CHUN-CHI, XU, SHOU-BIAO, ZHOU, SHI-WEN
Publication of US20100147502A1 publication Critical patent/US20100147502A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/08—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by varying the cross-section of the flow channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the disclosure relates to a heat dissipation device and, more particularly, to a heat dissipation device incorporating heat pipes for removing heat from an electronic device.
  • CPUs central processing units
  • CPUs central processing units
  • a CPU operates at a high speed in a computer enclosure, its temperature greatly increases. It is desirable to dissipate the heat quickly, for example by using a heat dissipation device attached to the CPU in the enclosure. This allows the CPU and other electronic components in the enclosure to function within their normal operating temperature ranges, thereby assuring the quality of data management, storage and transfer.
  • a typical heat dissipation device comprises a base contacting an electronic component, a fin assembly disposed on the base and a heat pipe connecting the base and the fin assembly.
  • the fin assembly comprises a plurality of fins connected together.
  • the base absorbs heat from the electronic component and directly transfers the heat to the fins through the heat pipe.
  • FIG. 1 is an isometric, assembled view of a heat dissipation device in accordance with one embodiment of the disclosure.
  • FIG. 2 is an isometric, exploded view of the heat dissipation device of FIG. 1 .
  • FIG. 1 shows a heat dissipation device in accordance with an embodiment of the disclosure.
  • the heat dissipation device dissipates heat generated by an electronic device (not shown).
  • the heat dissipation device comprises a heat spreader 10 , a fin assembly 20 above the heat spreader 10 , three heat pipes 30 thermally connecting the heat spreader 10 with the fin assembly 20 , a fan 40 and two fixing brackets 50 fixing the fan 40 to the fin assembly 20 .
  • the heat spreader 10 is made of metal such as aluminum, copper or an alloy thereof.
  • the heat spreader 10 includes a bottom plate 12 and a top plate 14 above the bottom plate 12 .
  • the bottom plate 12 defines three parallel, spaced first grooves 122 in a top thereof.
  • the top plate 14 includes a rectangular body 142 and four ears 144 extending outwardly from four corners of the body 142 .
  • the body 142 defines three parallel, spaced second grooves 146 in a bottom thereof, corresponding to the first grooves 122 .
  • the four ears 144 each define a through hole 148 adjacent to a distal end thereof.
  • Four fasteners 149 extend through the through holes 148 and are fastened on the ears 144 .
  • the fin assembly 20 comprises a plurality of spaced and parallel fins.
  • the fins each are made of metal such as aluminum, copper or an alloy thereof.
  • Two slits 22 are defined in the two opposite lateral sides of the fin assembly 20 and located adjacent a front face thereof.
  • Three through holes 24 are defined vertically through the fin assembly 20 receiving the heat pipes 30 .
  • the heat pipes 30 each have an L-shaped configuration and comprise an evaporating section 32 , a condensing section 34 , an arced connecting section 36 interconnecting the evaporating section 32 and the condensing section 34 .
  • the evaporating sections 32 of the heat pipes 30 are accommodated in channels cooperatively formed by the first and second grooves 122 , 146 of the heat spreader 10 .
  • the condensing sections 34 of the heat pipes 30 are received in the through holes 24 of the fin assembly 20 and thermally connect the fin assembly 20 .
  • the evaporating section 32 of each heat pipe 30 is uniform and has a diameter smaller than that of the condensing section 34 which also has a uniform configuration.
  • the diameter of the connecting section 36 of each heat pipe 30 gradually decreases from a first end connecting with the condensing section 34 to a second end connecting with the evaporating section 32 .
  • the connecting section 36 tapers from the first end connecting with the condensing section 34 to the second end connecting with the evaporating section 32 .
  • the diameter of the condensing section 34 of each heat pipe 30 is 8 mm
  • the diameter of the evaporating section 32 of each heat pipe 30 is 6 mm.
  • the evaporating section 32 of each heat pipe 30 is perpendicular to the condensing section 34 .
  • the evaporating section 32 and the condensing section 34 of the heat pipe 30 located in a middle of the fin assembly 20 are coplanar, and the evaporating section 32 and the condensing section 34 of each heat pipe 30 located near the lateral side of the fin assembly 20 are non-coplanar.
  • the fan 40 includes a rectangular frame 42 and an impeller 44 received in the frame 42 .
  • the frame 42 defines four orifices 420 in four corners thereof.
  • the two fixing brackets 50 each include a mounting portion 52 and a positioning portion 54 bent from a side of the mounting portion 52 .
  • the mounting portion 52 defines an arced cutout 522 in another side thereof remote from the positioning portion 54 .
  • the mounting portion 52 defines two threaded holes 520 in two opposite ends thereof, corresponding to the orifices 420 of the fan 40 .
  • the top plate 14 of the heat spreader 10 engages the bottom plate 12 so that the first grooves 122 of the bottom plate 12 and the second grooves 146 of the top plate 14 cooperatively form the channels receiving the evaporating sections 32 of the heat pipes 30 .
  • the condensing sections 34 of the heat pipes 30 are received in the through holes 24 of the fin assembly 20 .
  • the positioning portion 54 of each fixing bracket 50 engages in a corresponding slit 22 of the fin assembly 20 . Screws (not shown) extend through the orifices 420 in the fan 40 and engage in the threaded holes 520 of the mounting portions 52 , thereby securely mounting the fan 40 on the fixing brackets 50 .
  • the evaporating sections 32 of the heat pipes 30 can rapidly transmit the heat absorbed by the heat spreader 10 to the condensing sections 34 of the heat pipes 30 . Since the evaporating sections 32 are smaller than the condensing sections 34 , material for manufacturing the heat pipes 30 is reduced; thus, the material cost is reduced accordingly. Meanwhile, the smaller evaporating sections 32 match a smaller heat spreader 10 , which also saves material and improves feasibility and applicability of the heat spreader 10 in a limited space such as a computer enclosure.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipation device includes a heat pipe. The heat pipe includes an evaporating section connecting with a heat spreader, a condensing section connecting with a fin assembly, and a connecting section interconnecting the evaporating section and the condensing section. The evaporating section of the heat pipe has a diameter smaller than that of the condensing section.

Description

    BACKGROUND
  • 1. Technical Field
  • The disclosure relates to a heat dissipation device and, more particularly, to a heat dissipation device incorporating heat pipes for removing heat from an electronic device.
  • 2. Description of Related Art
  • As computer technology continues to advance, electronic components such as central processing units (CPUs) of computers are being made to provide faster operational speeds and greater functional capabilities. When a CPU operates at a high speed in a computer enclosure, its temperature greatly increases. It is desirable to dissipate the heat quickly, for example by using a heat dissipation device attached to the CPU in the enclosure. This allows the CPU and other electronic components in the enclosure to function within their normal operating temperature ranges, thereby assuring the quality of data management, storage and transfer.
  • A typical heat dissipation device comprises a base contacting an electronic component, a fin assembly disposed on the base and a heat pipe connecting the base and the fin assembly. The fin assembly comprises a plurality of fins connected together. The base absorbs heat from the electronic component and directly transfers the heat to the fins through the heat pipe. By the provision of the heat pipe, heat dissipation efficiency of the heat dissipation device is improved.
  • However, since most parts of the heat pipe of the conventional heat dissipation device are even in diameters, which results in more material is used for forming the evaporating portion of the heat pipe when the evaporating portion can have a smaller diameter. Furthermore, the evaporating portion of the heat pipe, which has the same diameter as that of the condensing portion, sometimes may hinder the applicability of the heat pipe to dissipate heat from an electronic component which is miniature.
  • What is needed, therefore, is a heat dissipation device which can overcome the limitations described.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an isometric, assembled view of a heat dissipation device in accordance with one embodiment of the disclosure.
  • FIG. 2 is an isometric, exploded view of the heat dissipation device of FIG. 1.
    •  DETAILED DESCRIPTION
  • FIG. 1 shows a heat dissipation device in accordance with an embodiment of the disclosure. The heat dissipation device dissipates heat generated by an electronic device (not shown). The heat dissipation device comprises a heat spreader 10, a fin assembly 20 above the heat spreader 10, three heat pipes 30 thermally connecting the heat spreader 10 with the fin assembly 20, a fan 40 and two fixing brackets 50 fixing the fan 40 to the fin assembly 20.
  • Also referring to FIG. 2, the heat spreader 10 is made of metal such as aluminum, copper or an alloy thereof. The heat spreader 10 includes a bottom plate 12 and a top plate 14 above the bottom plate 12. The bottom plate 12 defines three parallel, spaced first grooves 122 in a top thereof. The top plate 14 includes a rectangular body 142 and four ears 144 extending outwardly from four corners of the body 142. The body 142 defines three parallel, spaced second grooves 146 in a bottom thereof, corresponding to the first grooves 122. The four ears 144 each define a through hole 148 adjacent to a distal end thereof. Four fasteners 149 extend through the through holes 148 and are fastened on the ears 144.
  • The fin assembly 20 comprises a plurality of spaced and parallel fins. The fins each are made of metal such as aluminum, copper or an alloy thereof. Two slits 22 are defined in the two opposite lateral sides of the fin assembly 20 and located adjacent a front face thereof. Three through holes 24 are defined vertically through the fin assembly 20 receiving the heat pipes 30.
  • The heat pipes 30 each have an L-shaped configuration and comprise an evaporating section 32, a condensing section 34, an arced connecting section 36 interconnecting the evaporating section 32 and the condensing section 34. The evaporating sections 32 of the heat pipes 30 are accommodated in channels cooperatively formed by the first and second grooves 122, 146 of the heat spreader 10. The condensing sections 34 of the heat pipes 30 are received in the through holes 24 of the fin assembly 20 and thermally connect the fin assembly 20. The evaporating section 32 of each heat pipe 30 is uniform and has a diameter smaller than that of the condensing section 34 which also has a uniform configuration. The diameter of the connecting section 36 of each heat pipe 30 gradually decreases from a first end connecting with the condensing section 34 to a second end connecting with the evaporating section 32. In other words, the connecting section 36 tapers from the first end connecting with the condensing section 34 to the second end connecting with the evaporating section 32. In this embodiment, the diameter of the condensing section 34 of each heat pipe 30 is 8 mm, and the diameter of the evaporating section 32 of each heat pipe 30 is 6 mm. The evaporating section 32 of each heat pipe 30 is perpendicular to the condensing section 34. The evaporating section 32 and the condensing section 34 of the heat pipe 30 located in a middle of the fin assembly 20 are coplanar, and the evaporating section 32 and the condensing section 34 of each heat pipe 30 located near the lateral side of the fin assembly 20 are non-coplanar.
  • The fan 40 includes a rectangular frame 42 and an impeller 44 received in the frame 42. The frame 42 defines four orifices 420 in four corners thereof.
  • The two fixing brackets 50 each include a mounting portion 52 and a positioning portion 54 bent from a side of the mounting portion 52. The mounting portion 52 defines an arced cutout 522 in another side thereof remote from the positioning portion 54. The mounting portion 52 defines two threaded holes 520 in two opposite ends thereof, corresponding to the orifices 420 of the fan 40.
  • In assembly, the top plate 14 of the heat spreader 10 engages the bottom plate 12 so that the first grooves 122 of the bottom plate 12 and the second grooves 146 of the top plate 14 cooperatively form the channels receiving the evaporating sections 32 of the heat pipes 30. The condensing sections 34 of the heat pipes 30 are received in the through holes 24 of the fin assembly 20. The positioning portion 54 of each fixing bracket 50 engages in a corresponding slit 22 of the fin assembly 20. Screws (not shown) extend through the orifices 420 in the fan 40 and engage in the threaded holes 520 of the mounting portions 52, thereby securely mounting the fan 40 on the fixing brackets 50.
  • In use, the evaporating sections 32 of the heat pipes 30 can rapidly transmit the heat absorbed by the heat spreader 10 to the condensing sections 34 of the heat pipes 30. Since the evaporating sections 32 are smaller than the condensing sections 34, material for manufacturing the heat pipes 30 is reduced; thus, the material cost is reduced accordingly. Meanwhile, the smaller evaporating sections 32 match a smaller heat spreader 10, which also saves material and improves feasibility and applicability of the heat spreader 10 in a limited space such as a computer enclosure.
  • It is believed that the disclosure and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.

Claims (15)

1. A heat dissipation device, comprising:
a fin assembly;
a heat spreader; and
a heat pipe comprising an evaporating section, a condensing section, a connecting section interconnecting the evaporating section and the condensing section, wherein the evaporating section of the heat pipe has a diameter smaller than that of the condensing section, the evaporating section connecting with the heat spreader, the condensing section connecting with the fin assembly.
2. The heat dissipation device as claimed in claim 1, wherein the evaporating section of the heat pipe is perpendicular to the condensing section.
3. The heat dissipation device as claimed in claim 1, wherein the evaporating section has a uniform configuration.
4. The heat dissipation device as claimed in claim 1, wherein the condensing section has a uniform configuration.
5. The heat dissipation device as claimed in claim 1, wherein the evaporating section and the condensing section is coplanar.
6. The heat dissipation device as claimed in claim 1, wherein the evaporating section and the condensing section is non-coplanar.
7. The heat dissipation device as claimed in claim 1, wherein the connecting section of the heat pipe tapers from an end connecting the condensing section to another end connecting the evaporating section.
8. The heat dissipation device as claimed in claim 1, wherein the diameter of the condensing section of the heat pipe is 8 mm, and that of the evaporating section of the heat pipe is 6 mm.
9. The heat dissipation device as claimed in claim 1, further comprising a fan mounted in front of the fin assembly and over the heat spreader for generating an airflow through the fin assembly.
10. A heat dissipation device, comprising:
a heat spreader having a plurality of ears each being mounted with a fastener;
a fin assembly; and
at least one heat pipe comprising an evaporating section contacting the heat spreader, and a condensing section contacting the fin assembly, wherein the evaporating section is smaller than the condensing section.
11. The heat dissipation device as claimed in claim 10, wherein the at least one heat pipe further comprises a connecting section interconnecting the evaporating section and the condensing section, the connecting section of the at least one heat pipe tapering from an end connecting the condensing section to another end connecting the evaporating section.
12. The heat dissipation device as claimed in claim 10, wherein the heat spreader comprises a bottom plate and a top plate above the bottom plate, the bottom plate defining a first groove in a top thereof, the top plate defining a second groove in a bottom thereof, the first and second grooves cooperatively forming a channel receiving the evaporating section of the at least one heat pipe.
13. The heat dissipation device as claimed in claim 12, wherein the top plate comprises a rectangular body, the plurality of ears extending from corners of the rectangular body.
14. The heat dissipation device as claimed in claim 10, further comprising a fan mounted on one side of the fin assembly.
15. The heat dissipation device as claimed in claim 14, further comprising a fixing bracket, the fixing bracket comprising a mounting portion and a positioning portion bent from a side of the mounting portion, the fan being mounted on the mounting portion, the positioning portion engaging in a slit defined in another side of the fin assembly.
US12/432,745 2008-12-16 2009-04-29 Heat dissipation device with heat pipe Abandoned US20100147502A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200810306282.2 2008-12-16
CN2008103062822A CN101749975B (en) 2008-12-16 2008-12-16 Radiating device

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Cited By (4)

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Publication number Priority date Publication date Assignee Title
US9121645B2 (en) 2013-02-11 2015-09-01 Google Inc. Variable thickness heat pipe
US20170153064A1 (en) * 2015-12-01 2017-06-01 Asia Vital Components Co., Ltd. Heat dissipation unit
CN106931815A (en) * 2017-04-27 2017-07-07 长沙理工大学 A kind of reducing series and parallel conduit plate type pulsating heat pipe
CN112153863A (en) * 2020-09-17 2020-12-29 南通大学 Heat radiation assembly

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CN102520775A (en) * 2011-11-23 2012-06-27 东莞市几度电子科技有限公司 CPU (central processing unit) radiator
CN109916207B (en) * 2018-06-12 2020-05-26 山东大学 Loop heat pipe with diameter-variable ascending pipe

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US20050087329A1 (en) * 2003-10-03 2005-04-28 Jie Zhang Heat dissipation module with a pair of fans
US20050231983A1 (en) * 2002-08-23 2005-10-20 Dahm Jonathan S Method and apparatus for using light emitting diodes
US20070044944A1 (en) * 2005-08-30 2007-03-01 Sheng-Huang Lin Radiator module structure
US20070261822A1 (en) * 2006-05-12 2007-11-15 Kuo-Len Lin Heat-Dissipating Device having Air-Guiding Structure
US20080105406A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat pipe with variable grooved-wick structure and method for manufacturing the same
US7518861B2 (en) * 2007-04-20 2009-04-14 Hewlett-Packard Development Company, L.P. Device cooling system
US7610950B2 (en) * 2006-11-08 2009-11-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
US7866375B2 (en) * 2006-12-01 2011-01-11 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes

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CN101026943B (en) * 2006-02-17 2011-09-28 富准精密工业(深圳)有限公司 Guided radiating device
CN100584170C (en) * 2006-05-12 2010-01-20 富准精密工业(深圳)有限公司 Radiating device
CN101193535B (en) * 2006-12-01 2011-07-27 富准精密工业(深圳)有限公司 Heat pipe radiator

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US3572426A (en) * 1967-10-05 1971-03-23 Gen Electric Underwater heat exchange system
US20050231983A1 (en) * 2002-08-23 2005-10-20 Dahm Jonathan S Method and apparatus for using light emitting diodes
US20050087329A1 (en) * 2003-10-03 2005-04-28 Jie Zhang Heat dissipation module with a pair of fans
US20070044944A1 (en) * 2005-08-30 2007-03-01 Sheng-Huang Lin Radiator module structure
US20070261822A1 (en) * 2006-05-12 2007-11-15 Kuo-Len Lin Heat-Dissipating Device having Air-Guiding Structure
US20080105406A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat pipe with variable grooved-wick structure and method for manufacturing the same
US7610950B2 (en) * 2006-11-08 2009-11-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
US7866375B2 (en) * 2006-12-01 2011-01-11 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9121645B2 (en) 2013-02-11 2015-09-01 Google Inc. Variable thickness heat pipe
US10088242B1 (en) 2013-02-11 2018-10-02 Google Llc Variable thickness heat pipe
US20170153064A1 (en) * 2015-12-01 2017-06-01 Asia Vital Components Co., Ltd. Heat dissipation unit
US10048017B2 (en) * 2015-12-01 2018-08-14 Asia Vital Components Co., Ltd. Heat dissipation unit
CN106931815A (en) * 2017-04-27 2017-07-07 长沙理工大学 A kind of reducing series and parallel conduit plate type pulsating heat pipe
CN112153863A (en) * 2020-09-17 2020-12-29 南通大学 Heat radiation assembly

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CN101749975A (en) 2010-06-23
CN101749975B (en) 2013-07-03

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