US20100032134A1 - Heat sink assembly - Google Patents

Heat sink assembly Download PDF

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Publication number
US20100032134A1
US20100032134A1 US12/237,233 US23723308A US2010032134A1 US 20100032134 A1 US20100032134 A1 US 20100032134A1 US 23723308 A US23723308 A US 23723308A US 2010032134 A1 US2010032134 A1 US 2010032134A1
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US
United States
Prior art keywords
mistake
cap
assembly
diameter
proof
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/237,233
Inventor
Yun-Zhi Yang
Zhi-Jiang Yao
Ning-Yu Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Assigned to HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD. reassignment HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WANG, NING-YU, YANG, Yun-zhi, YAO, ZHI-JIANG
Publication of US20100032134A1 publication Critical patent/US20100032134A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat sink assembly which is mistake proof in assembly.
  • a typical heat sink assembly includes a motherboard having a plurality of threaded holes, and a heat sink fastened to the motherboard. Screws are threadedly engaged in the screw holes to secure the heat sink apparatus to the motherboard to dissipate heat generated by a heat generating component, such as a CPU on the motherboard. Since the screws of the heat sink apparatus are arranged symmetrically, the heat sink apparatus can be secured to the motherboard in various orientations, such that the heat sink apparatus may be attached incorrectly, thereby impairing heat dissipation efficiency.
  • FIG. 1 is an exploded view of an embodiment of a heat sink assembly, the assembly including a motherboard, a heat sink apparatus, and a mistake-proof member;
  • FIG. 2 is another view of the mistake-proof member of FIG. 1 ;
  • FIG. 3 is an assembly view of FIG. 1 ;
  • an embodiment of a heat sink assembly includes a motherboard 10 , a heat sink apparatus 20 configured for dissipating heat generated by a heat generating component on the motherboard 10 , and a mistake-proof member 30 .
  • the heat sink apparatus 20 includes four supporting pieces 22 at four corners thereof and four screws 24 attached to distal ends of the supporting pieces 22 .
  • a mounting hole 26 is defined in one of the four supporting pieces 22 for receiving the mistake-proof member 30 .
  • Four screw holes 12 are defined in the motherboard 10 corresponding to the screws 24 of the heat sink apparatus 20 .
  • a mistake-proof hole 14 is defined in the motherboard 30 corresponding to the mounting hole 26 for receiving the mistake-proof member 30 .
  • the mistake-proof member 30 includes a post 32 , a cap 34 formed at a top of the post 32 , and a ring 36 formed under the cap 34 .
  • a distance between the cap 34 and the ring 36 is approximately equal to a thickness of the supporting piece 22 .
  • a groove 341 is defined in the cap 34 and an upper portion of the post 32 for increasing the elasticity of the cap 34 .
  • the cap 34 is frustoconical shaped such that a diameter of a top side is less than a diameter of a bottom side.
  • a diameter of the mounting hole 26 greater than the diameter of the top side of the cap 34 , but less than that of the bottom side of the cap 34 and the outer diameter of the ring 36 .
  • the cap 34 is symmetrically divided by the groove 341 .
  • the mistake-proof member 30 is attached to the mounting hole 26 of the supporting piece 22 .
  • the top side of the cap 34 of the mistake-proof member 30 is inserted into the mounting hole 26 upwardly from a back side of the supporting piece 22 toward a top side of the supporting piece 22 .
  • the cap 34 is elastically compressed in the mounting hole 26 and returns to its original shape and size when the bottom side of the cap extends through the mounting hole 26 and resists against the top side of the supporting piece 22 .
  • the ring 36 of the mistake-proof member 30 is resisted against the back side of the supporting piece 22 .
  • the mistake-proof member 30 is aligned with the mistake-proof hole 14 and the screws 24 of the heat sink apparatus 20 are secured in the screw holes 12 of the motherboard 10 in only one configuration with the mistake-proof member 30 engaged in the mistake-proof hole 14 .

Abstract

An assembly includes a circuit board and a heat sink apparatus attached to the motherboard. The heat sink apparatus has at least two screws, and a first mistake-proof structure. A plurality of screw holes are defined in the circuit board corresponding to the screws. The circuit board has a second mistake-proof structure corresponding to the first mistake-proof structure. The first mistake-proof structure engages with the second mistake-proof structure to align the heat sink apparatus to the circuit board in only one configuration.

Description

    BACKGROUND
  • 1. Technical Field
  • The present invention relates to a heat sink assembly which is mistake proof in assembly.
  • 2. Description of Related Art
  • A typical heat sink assembly includes a motherboard having a plurality of threaded holes, and a heat sink fastened to the motherboard. Screws are threadedly engaged in the screw holes to secure the heat sink apparatus to the motherboard to dissipate heat generated by a heat generating component, such as a CPU on the motherboard. Since the screws of the heat sink apparatus are arranged symmetrically, the heat sink apparatus can be secured to the motherboard in various orientations, such that the heat sink apparatus may be attached incorrectly, thereby impairing heat dissipation efficiency.
  • Therefore, a mistake proof heat sink assembly is desired to overcome the above-described shortcomings.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an exploded view of an embodiment of a heat sink assembly, the assembly including a motherboard, a heat sink apparatus, and a mistake-proof member;
  • FIG. 2 is another view of the mistake-proof member of FIG. 1;
  • FIG. 3 is an assembly view of FIG. 1;
    •  DETAILED DESCRIPTION OF THE EMBODIMENTS
  • Referring to FIG. 1, an embodiment of a heat sink assembly includes a motherboard 10, a heat sink apparatus 20 configured for dissipating heat generated by a heat generating component on the motherboard 10, and a mistake-proof member 30.
  • The heat sink apparatus 20 includes four supporting pieces 22 at four corners thereof and four screws 24 attached to distal ends of the supporting pieces 22. A mounting hole 26 is defined in one of the four supporting pieces 22 for receiving the mistake-proof member 30. Four screw holes 12 are defined in the motherboard 10 corresponding to the screws 24 of the heat sink apparatus 20. A mistake-proof hole 14 is defined in the motherboard 30 corresponding to the mounting hole 26 for receiving the mistake-proof member 30.
  • Referring to FIG. 2, the mistake-proof member 30 includes a post 32, a cap 34 formed at a top of the post 32, and a ring 36 formed under the cap 34. A distance between the cap 34 and the ring 36 is approximately equal to a thickness of the supporting piece 22. A groove 341 is defined in the cap 34 and an upper portion of the post 32 for increasing the elasticity of the cap 34. The cap 34 is frustoconical shaped such that a diameter of a top side is less than a diameter of a bottom side. A diameter of the mounting hole 26 greater than the diameter of the top side of the cap 34, but less than that of the bottom side of the cap 34 and the outer diameter of the ring 36. The cap 34 is symmetrically divided by the groove 341.
  • Referring to FIG. 3, in assembly, the mistake-proof member 30 is attached to the mounting hole 26 of the supporting piece 22. The top side of the cap 34 of the mistake-proof member 30 is inserted into the mounting hole 26 upwardly from a back side of the supporting piece 22 toward a top side of the supporting piece 22. The cap 34 is elastically compressed in the mounting hole 26 and returns to its original shape and size when the bottom side of the cap extends through the mounting hole 26 and resists against the top side of the supporting piece 22. The ring 36 of the mistake-proof member 30 is resisted against the back side of the supporting piece 22. The mistake-proof member 30 is aligned with the mistake-proof hole 14 and the screws 24 of the heat sink apparatus 20 are secured in the screw holes 12 of the motherboard 10 in only one configuration with the mistake-proof member 30 engaged in the mistake-proof hole 14.
  • It is to be understood, however, that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the embodiments to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (16)

1. An assembly comprising:
a heat sink apparatus comprising at least two screws and a first mistake-proof structure; and
a circuit board comprising a second mistake-proof structure corresponding to the first mistake-proof structure, wherein at least two screw holes corresponding to the at least two screws are defined in the circuit board;
wherein the first mistake-proof structure engages with the second mistake-proof structure to align the heat sink apparatus to the circuit board.
2. The assembly of claim 1, wherein the at least two screws comprises four screws arranged symmetrically; the first mistake-proof structure is adjacent to one of the four screws.
3. The assembly of claim 2, wherein the heat sink apparatus has four corners; a supporting piece extends from each corner of the heat sink apparatus; each of the four screws are attached to each of the supporting pieces; the first mistake-proof structure is attached to a first of the supporting pieces.
4. The assembly of claim 3, wherein the first mistake-proof structure is a mistake-proof member; a mounting hole is defined in the first of the supporting pieces for receiving the mistake-proof member.
5. The assembly of claim 4, wherein the second mistake-proof structure is a mistake-proof hole defined in the circuit board for receiving the mistake-proof member.
6. The assembly of claim 4, wherein the mistake-proof member comprises a cap resisting against a top surface of the first of the supporting pieces, and a ring resisting against a bottom surface of the first of the supporting pieces.
7. The assembly of claim 6, wherein the cap is frustoconical shaped; a diameter of a top side of the cap is less than a diameter of a bottom side of the cap; a diameter of the mounting hole is greater than the diameter of the top side of the cap, but less than the diameter of the bottom side of the cap.
8. The assembly of claim 7, wherein the diameter of the mounting hole is less than an outer diameter of the ring.
9. The assembly of claim 7, wherein a groove is defined in the cap and divides the cap symmetrically.
10. An assembly comprising:
a heat sink apparatus comprising a plurality of screws arranged at corners of the heat sink apparatus and a mistake-proof member attached at one of the corners; and
a circuit board defining a plurality of screw holes corresponding to the plurality of screws and a mistake-proof hole corresponding to the mistake-proof member;
wherein the plurality of screws are capable of threadedly engaging with the plurality of screws holes only if the mistake-proof member is aligned with the mistake-proof hole, thereby preventing the heat sink apparatus to be attached to the circuit board in an incorrect configuration.
11. The assembly of claim 10, wherein a plurality of supporting pieces extend from the corners of the heat sink apparatus; the plurality of screws are attached to the supporting pieces; the mistake-proof member is attached to a first of the supporting pieces.
12. The assembly of claim 11, wherein a mounting hole is defined in the first of the supporting pieces for receiving the mistake-proof member.
13. The assembly of claim 12, wherein the mistake-proof member comprises a cap resisting against a top surface of the first of the supporting pieces, and a ring resisting against a bottom surface of the first of the supporting pieces.
14. The assembly of claim 13, wherein the cap is frustoconical shaped; a diameter of a top side of the cap is less than a diameter of a bottom side of the cap, a diameter of the mounting hole is greater than the diameter of the top side of the cap, but less than the diameter of the bottom side of the cap.
15. The assembly of claim 14, wherein the diameter of the mounting hole is less than an outer diameter of the ring.
16. The assembly of claim 14, wherein a groove is defined in the cap and divides the cap symmetrically.
US12/237,233 2008-08-08 2008-09-24 Heat sink assembly Abandoned US20100032134A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNU2008203017926U CN201263286Y (en) 2008-08-08 2008-08-08 Radiator fixed combination
CN200820301792.6 2008-08-08

Publications (1)

Publication Number Publication Date
US20100032134A1 true US20100032134A1 (en) 2010-02-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
US12/237,233 Abandoned US20100032134A1 (en) 2008-08-08 2008-09-24 Heat sink assembly

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US (1) US20100032134A1 (en)
CN (1) CN201263286Y (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012058494A2 (en) 2010-10-27 2012-05-03 Danisco Us Inc. Isoprene synthase variants for improved production of isoprene
CN104898800A (en) * 2015-05-21 2015-09-09 浪潮电子信息产业股份有限公司 Design method and apparatus for ensuring proper installation of CPU heat sink
EP4138123A1 (en) * 2021-08-16 2023-02-22 Pegatron Corporation Positioning fixture

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102056454A (en) * 2009-10-29 2011-05-11 鸿富锦精密工业（深圳）有限公司 Heat radiating device with foolproof structure and electronic device with same
CN103414036A (en) * 2013-07-31 2013-11-27 昆山维金五金制品有限公司 Radiator connecting assembly
CN108710409B (en) * 2017-07-05 2022-02-11 超聚变数字技术有限公司 Processor fixed structure spare, subassembly and computer equipment
CN109567443A (en) * 2019-01-21 2019-04-05 宁波象吹塑家具有限公司 Table stool one outdoor table

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3888064A (en) * 1973-11-16 1975-06-10 Amerace Corp Multiple grip length mounting bolt
US4938645A (en) * 1989-05-30 1990-07-03 Phillips Plastics Corporation Tee tree fastener
US20030159819A1 (en) * 2002-02-27 2003-08-28 Sang-Cheol Lee Heatsink device for cooling chipset
US20030178179A1 (en) * 2002-02-23 2003-09-25 Viktor Brost Heat exchanger for electronic/electrical components
US20030178177A1 (en) * 2002-03-21 2003-09-25 Eytcheson Charles T. Heatsink buffer configuration
US6768641B2 (en) * 2002-06-28 2004-07-27 Hon Hai Precision Ind. Co., Ltd. Heat dissipation assembly
US6809929B2 (en) * 2002-10-04 2004-10-26 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly with retaining device
US20050168927A1 (en) * 2004-02-04 2005-08-04 Hon Hai Precision Industry Co., Ltd. Mounting apparatus for motherboards
US20060232944A1 (en) * 2005-04-14 2006-10-19 Jie Zhang Mounting device for heat dissipating apparatus
US7190586B2 (en) * 2004-03-03 2007-03-13 Hewlett-Packard Development Company, L.P. Heat sink retention assembly and related methods
US7239518B2 (en) * 2005-11-01 2007-07-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Universal locking device for heat sink
US20080316707A1 (en) * 2007-06-22 2008-12-25 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes
US7570490B2 (en) * 2005-08-31 2009-08-04 Ati Technologies Ulc Variable spring rate thermal management apparatus attachment mechanism
US7969742B2 (en) * 2009-07-01 2011-06-28 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Bracket for mounting heat sink

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3888064A (en) * 1973-11-16 1975-06-10 Amerace Corp Multiple grip length mounting bolt
US4938645A (en) * 1989-05-30 1990-07-03 Phillips Plastics Corporation Tee tree fastener
US20030178179A1 (en) * 2002-02-23 2003-09-25 Viktor Brost Heat exchanger for electronic/electrical components
US20030159819A1 (en) * 2002-02-27 2003-08-28 Sang-Cheol Lee Heatsink device for cooling chipset
US20030178177A1 (en) * 2002-03-21 2003-09-25 Eytcheson Charles T. Heatsink buffer configuration
US6768641B2 (en) * 2002-06-28 2004-07-27 Hon Hai Precision Ind. Co., Ltd. Heat dissipation assembly
US6809929B2 (en) * 2002-10-04 2004-10-26 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly with retaining device
US20050168927A1 (en) * 2004-02-04 2005-08-04 Hon Hai Precision Industry Co., Ltd. Mounting apparatus for motherboards
US7190586B2 (en) * 2004-03-03 2007-03-13 Hewlett-Packard Development Company, L.P. Heat sink retention assembly and related methods
US20060232944A1 (en) * 2005-04-14 2006-10-19 Jie Zhang Mounting device for heat dissipating apparatus
US7570490B2 (en) * 2005-08-31 2009-08-04 Ati Technologies Ulc Variable spring rate thermal management apparatus attachment mechanism
US7239518B2 (en) * 2005-11-01 2007-07-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Universal locking device for heat sink
US20080316707A1 (en) * 2007-06-22 2008-12-25 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes
US7969742B2 (en) * 2009-07-01 2011-06-28 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Bracket for mounting heat sink

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012058494A2 (en) 2010-10-27 2012-05-03 Danisco Us Inc. Isoprene synthase variants for improved production of isoprene
CN104898800A (en) * 2015-05-21 2015-09-09 浪潮电子信息产业股份有限公司 Design method and apparatus for ensuring proper installation of CPU heat sink
EP4138123A1 (en) * 2021-08-16 2023-02-22 Pegatron Corporation Positioning fixture

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Date Code Title Description
AS Assignment

Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YANG, YUN-ZHI;YAO, ZHI-JIANG;WANG, NING-YU;REEL/FRAME:021581/0731

Effective date: 20080915

Owner name: HON HAI PRECISION INDUSTRY CO., LTD.,TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YANG, YUN-ZHI;YAO, ZHI-JIANG;WANG, NING-YU;REEL/FRAME:021581/0731

Effective date: 20080915

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION