US20080087573A1 - Carrier tape and method of wrapping semiconductor devices using the same - Google Patents
Carrier tape and method of wrapping semiconductor devices using the same Download PDFInfo
- Publication number
- US20080087573A1 US20080087573A1 US11/907,720 US90772007A US2008087573A1 US 20080087573 A1 US20080087573 A1 US 20080087573A1 US 90772007 A US90772007 A US 90772007A US 2008087573 A1 US2008087573 A1 US 2008087573A1
- Authority
- US
- United States
- Prior art keywords
- tape
- carrier tape
- frame
- perforation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D83/00—Containers or packages with special means for dispensing contents
- B65D83/04—Containers or packages with special means for dispensing contents for dispensing annular, disc-shaped, or spherical or like small articles, e.g. tablets or pills
- B65D83/0445—Containers or packages with special means for dispensing contents for dispensing annular, disc-shaped, or spherical or like small articles, e.g. tablets or pills all the articles being stored in individual compartments
- B65D83/0463—Containers or packages with special means for dispensing contents for dispensing annular, disc-shaped, or spherical or like small articles, e.g. tablets or pills all the articles being stored in individual compartments formed in a band or a blisterweb, inserted in a dispensing device or container
- B65D83/0472—Containers or packages with special means for dispensing contents for dispensing annular, disc-shaped, or spherical or like small articles, e.g. tablets or pills all the articles being stored in individual compartments formed in a band or a blisterweb, inserted in a dispensing device or container the band being wound in flat spiral, folded in accordion or the like
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
Definitions
- carrier tapes or trays may be used as the wrapping materials.
- the carrier tape protects the semiconductor packages included therein from external shocks, and allows the semiconductor packages to be handled more easily.
- FIG. 1 is a perspective view showing a carrier tape according to the conventional art.
- semiconductor devices may be loaded in pockets 14 that are recessed on a carrier tape 10 . Upper portions of the pockets 14 may then be sealed by a cover tape 20 .
- the carrier tape 10 may be wound on a reel 30 and transferred to the user.
- the user may withdraw the semiconductor devices from the carrier tape 10 to use the semiconductor packages.
- the cover tape 20 may be removed first, and the semiconductor devices included in the pockets 14 withdrawn.
- sprocket holes 12 may be used when the carrier tape 10 is wound/unwound, or when the cover tape 20 is attached/detached.
- the conventional carrier tape 10 once the cover tape 20 is removed to withdraw the semiconductor devices, it may be impossible to use the cover tape 20 and carrier tape 10 again. As such, the conventional carrier tape may be discarded to become a cause of environmental contamination. Further, even if a defect occurs on only one portion of the plurality of pockets 14 and/or the cover tape 20 , the entire carrier tape 10 and/or the cover tape 20 must be discarded.
- Example embodiments may provide a carrier tape that may be recyclable so as not to become a cause of environmental contamination. Even when a defect occurs on recesses of a carrier tape, a corresponding part may be easily replaced. Thus, the carrier tape may be more economically and environmentally advantageous over the conventional art.
- Example embodiments also may provide a method of wrapping semiconductor devices using the tape carrier.
- a carrier tape for receiving semiconductor devices may include a frame tape having perforation portions, and a pocket.
- the pocket may have a recessed bottom, on which the semiconductor device may be received, and a stopper that may prevent the semiconductor device received in the recessed bottom from escaping from the pocket.
- the pocket may be capable of being attached/detached into/from the perforation portion.
- a pair of stoppers facing each other may be disposed on an opening portion of the pocket.
- the semiconductor device may be separated by moving the stoppers so that the pocket and the carrier tape may be recycled.
- the pocket may be inserted into the perforation portion to be attached into the frame tape.
- the carrier tape may further include a reel, on which the frame tape may be wound.
- a lip portion in parallel with the recessed bottom may be formed on at least a portion of the opening portion of the pocket with constant width. The lip portion may prevent the pocket from penetrating the perforation portion even if the pocket is forcefully inserted into the perforation portion of the frame tape.
- the pocket may be removably inserted into the perforation portion of the frame tape, and the lip portion may be mounted on a peripheral surface of the perforation portion of the frame tape.
- the stoppers may be disposed in parallel to the recessed bottom to prevent the semiconductor device from escaping from the pocket.
- the stoppers may be capable of rotating toward the recessed bottom and may be incapable of moving toward the opposite direction of the recessed bottom.
- the pocket may be inserted into the perforation portion of the frame tape, and the pocket may include a protrusion at least on a side surface of the pocket for preventing the pocket from escaping from the frame tape.
- a method of wrapping semiconductor devices using a carrier tape which may include a frame tape having perforation portions, and a pocket.
- the pocket may have a recessed bottom, on which the semiconductor device may be received, and a stopper that may prevent the semiconductor device received in the recessed bottom from escaping from the pocket.
- the pocket may be capable of being attached/detached into/from the perforation portion.
- the method may include attaching the pocket onto the frame tape, and inserting the semiconductor device into the pocket.
- FIG. 1 is a perspective view of a carrier tape according to the conventional art
- FIGS. 2A and 2B are perspective views of a frame tape and a pocket according to an example embodiment
- FIG. 3 is a perspective view of a carrier tape, in which the pocket of FIG. 2B is attached on the frame tape of FIG. 2A , according to an example embodiment
- FIG. 4 is a cross-sectional view of the carrier tape taken along line IV-IV of FIG. 3 ;
- FIG. 5 is a cross-sectional view of a pocket according to an example embodiment
- FIG. 6 is a cross-sectional view of a pocket according to an example embodiment
- FIG. 7 is a cross-sectional view of a pocket illustrating how a protrusion formed thereon prevent the pocket from escaping from the frame tape according to an example embodiment
- FIGS. 8A and 8B are cross-sectional views of protrusions according to an example embodiment.
- FIG. 9 is a perspective view illustrating a method of wrapping semiconductor devices according to an example embodiment.
- Example embodiments will now be described more fully with reference to the accompanying drawings.
- Example embodiments may, however, be embodied in many different forms and should not be construed as being limited to example embodiments set forth herein. Rather, example embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art.
- the thicknesses of layers and regions are exaggerated for clarity.
- Like reference numerals in the drawings denote like elements, and thus their description will be omitted.
- a carrier tape for receiving semiconductor devices.
- the carrier tape may include a frame tape having perforation portions, and pockets.
- Each pocket may include a recessed bottom on which the semiconductor device may be received, and a stopper for preventing the received semiconductor device from escaping from the pocket.
- the pocket may be capable of being attached/detached into/from the perforation portions.
- FIG. 2A is a perspective view of a frame tape according example embodiments
- FIG. 2B is a perspective view of a pocket according to example embodiments
- FIG. 3 is a perspective view of a carrier tape according to example embodiments.
- the frame tape 100 may include perforation portions 110 .
- the frame tape 100 may optionally include sprocket holes 120 that may be used when the frame tape 100 is wound/unwound.
- the frame tape 100 may be formed of the same material as that of a conventional carrier tape. However, the frame tape 100 is not limited thereto because there may be no need for the frame tape 100 to be attached to a cover tape. Therefore, a wide variety of materials may be used to form the frame tape 100 .
- a conventional carrier tape may have various widths according to the sizes of the semiconductor devices that are to be received, and a certain semiconductor device may only be received in a carrier tape having a corresponding width.
- the carrier tape 100 semiconductor devices of different sizes may be received by changing pockets 200 ( FIG. 2B ).
- the pocket and the frame tape are recyclable and therefore are more environmentally friendly.
- the size of perforation portion 110 may be adjusted to correspond to a size of the pocket (not shown) that is attached to the frame tape 100 .
- the perforation portions 110 may be arranged with a predetermined interval therebetween to facilitate automation.
- the sprocket holes 120 may be fabricated to have various shapes/intervals.
- the pocket 200 may include a recessed bottom 210 where the semiconductor device (not shown) may be received, and a stopper 220 that may prevent the semiconductor device from escaping from the pocket 200 .
- a pair of stoppers 220 facing each other may be disposed on an opening portion of the pocket.
- the stopper 220 may use a structure familiar to those of skill in the art. However, the structure of the stopper 220 is not limited thereto.
- the inner space in the pocket 200 may be adjusted according to the size of the semiconductor device that is to be received in the pocket 200 . If the semiconductor device is small, a pocket having smaller inner space may be used to receive the semiconductor device, but still have the same outer appearance of the pocket 200 . Therefore, the frame tape 100 may be used to receive semiconductor devices having various sizes to provide a more economical and easily automated alternative to the conventional carrier tape.
- the pocket 200 may be inserted into the perforation portion 110 of the frame tape 100 .
- the pocket 200 may include a lip portion 230 that may be formed with constant width on at least a part of the opening in parallel with the recessed bottom 210 .
- lip portions 230 may be disposed on facing two sides of the opening of the pocket 200 .
- the lip portions 230 may also be formed on all sides of the opening. The lip portions 230 may prevent the pocket 200 from passing through the perforation portion 110 when the pocket 200 is inserted into the perforation portion 110 of the frame tape 100 .
- FIG. 3 is a perspective view showing the pocket 200 mounted on the frame tape 100 .
- FIG. 4 is a cross-sectional view showing the pocket taken along line IV-IV of FIG. 3 .
- the lip portions 230 of the pocket 200 may be mounted on the peripheral surfaces of the perforation portion 110 of the frame tape 100 .
- FIG. 5 is a cross-sectional view of a pocket 300 according to example embodiments.
- a stopper 320 of the pocket 300 may be parallel with recessed bottom 310 to prevent the semiconductor device from escaping from the pocket 300 .
- the stopper 320 may rotate toward the recessed bottom (direction A in FIG. 5 ). However, the stopper 320 may not rotate toward the opposite portion (opposite direction to the direction A in FIG. 5 ) to prevent the semiconductor device (not shown) received in the pocket 300 from escaping out of the pocket 300 .
- the stopper 320 may be sufficiently rotated in the direction A of FIG. 5 to ensure a sufficient space so the semiconductor device may be withdrawn.
- FIG. 6 is a cross-sectional view of a pocket 400 according to example embodiments.
- the pocket 400 may be inserted into the perforation portion 110 of the frame tape 100 .
- a protrusion 440 may be disposed on at least one side surface 450 of the pocket 400 to prevent the pocket 400 from escaping from the frame tape 100 .
- FIG. 7 is a cross-sectional view of a pocket showing how the protrusion 440 may prevent the pocket 400 from escaping from the frame tape 100 .
- the pocket 400 may be inserted into the frame tape 100 .
- lip portions 430 may be mounted on the frame tape 100 , and edges of the perforation portion of the frame tape 100 may be inserted between the protrusions 440 and the lip portions 430 . Therefore, the escape of the pocket 400 from the frame tape 100 may be prevented by the protrusion 440 .
- the edges of the frame tape 100 may be removed from the gap between the protrusion 440 and the lip portion 430 .
- side portions of the frame tape 100 may be extended to both side directions to separate the pocket 400 , or both side surfaces 450 of the pocket 400 may be pressed to separate the pocket 400 from the frame tape 100 .
- FIGS. 8A and 8B are cross-sectional views of a part of a pocket 400 showing examples of the protrusion 440 .
- an upper edge of a protrusion 440 a may be rounded.
- it may be easier to separate the pocket 400 from the frame tape 100 .
- an end portion of a protrusion 440 b may be attached to the side surface 450 of the pocket 400 , and the other end of the protrusion 440 b may be separated from the side surface 450 .
- the end portion of the protrusion 440 b may be attached onto the side surface 450 of the pocket 400 so as to be inclined. If an external force is not applied, the other end of the protrusion 440 b may be separated from the side surface 450 of the pocket 400 as denoted by the solid line in FIG. 8B . If an external force is applied toward the center portion of the pocket 400 , the protrusion portion 440 b may be bent and may be adhered onto the side surface 450 of the pocket 400 .
- the pocket 400 may be easily inserted into the frame tape 100 .
- the other end portion of the protrusion 440 b may be separated from the side surface 450 of the pocket 400 to prevent the pocket 400 from escaping from the frame tape 100 .
- the pocket 400 is to be separated, the other end may be pressed to contact the side surface 450 of the pocket 400 and the pocket 400 may be easily separated from the frame tape 100 .
- the carrier tape may further include a reel.
- the reel may be the reel 30 of FIG. 1 , but is not limited thereto.
- the carrier tape may be easily handled.
- a method of wrapping semiconductor devices using a carrier tape receiving semiconductor devices which may include a frame tape having perforation portions, and a pocket including a recessed bottom, on which the semiconductor device may be received, and a stopper preventing the semiconductor device from escaping from the pocket, and capable of being attached/detached into/from the perforation portion, the method may include attaching the pocket into the frame tape, and inserting the semiconductor device into the pocket.
- FIG. 9 is an exploded perspective view illustrating an example method of wrapping the semiconductor device.
- the pocket 200 may be removably attached into the perforation portion 110 of the frame tape 110 and a semiconductor device 500 may be inserted into the pocket 200 . Attaching of the pocket 200 may be performed by inserting the pocket 200 into the perforation portion 110 . As described above, the pocket 200 may be inserted until the lip portions of the pocket 200 are mounted on the surface of the frame tape 100 .
- the stoppers 230 may be folded toward the inside of the pocket 200 , and then, unfolded. After inserting the semiconductor device 500 into the pocket 200 , the stoppers 230 may be arranged in parallel with the recessed bottom of the pocket 200 to prevent the semiconductor device 500 from escaping from the pocket 200 .
- the carrier tape may be recyclable to be more environmentally friendly. Even if a defective portion is generated on the pocket, the corresponding portion may be easily replaced with a new one. Thus, it may be economically advantageous to use the carrier tape of example embodiments.
Abstract
Provided are a carrier tape and a method of wrapping semiconductor devices using the carrier tape. The carrier tape may include a frame tape having perforation portions, and a pocket having a recessed bottom on which the semiconductor device may be received. The stopper may prevent the semiconductor device received in the recessed bottom from escaping from the pocket. The stopper may be capable of being attached/detached into/from the perforation portion. The carrier tape may be recyclable to be more environmentally friendly. In addition, even if a defective portion is generated on the pocket, the corresponding portion may be more easily replaced with a new one. Thus, it may be economically advantageous to use the carrier tape.
Description
- This non-provisional U.S. patent application claims the benefit of priority under 35 U.S.C. §119 of Korean Patent Application No. 10-2006-0101026, filed on Oct. 17, 2006, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference.
- When semiconductor chips are assembled as semiconductor packages, various types of wrapping materials may be used to transfer the semiconductor packages to a user safely. Conventionally, carrier tapes or trays may be used as the wrapping materials. The carrier tape protects the semiconductor packages included therein from external shocks, and allows the semiconductor packages to be handled more easily.
-
FIG. 1 is a perspective view showing a carrier tape according to the conventional art. As shown inFIG. 1 , semiconductor devices may be loaded inpockets 14 that are recessed on acarrier tape 10. Upper portions of thepockets 14 may then be sealed by acover tape 20. Thecarrier tape 10 may be wound on areel 30 and transferred to the user. - The user may withdraw the semiconductor devices from the
carrier tape 10 to use the semiconductor packages. To do this, thecover tape 20 may be removed first, and the semiconductor devices included in thepockets 14 withdrawn. InFIG. 1 ,sprocket holes 12 may be used when thecarrier tape 10 is wound/unwound, or when thecover tape 20 is attached/detached. - According to the
conventional carrier tape 10, once thecover tape 20 is removed to withdraw the semiconductor devices, it may be impossible to use thecover tape 20 andcarrier tape 10 again. As such, the conventional carrier tape may be discarded to become a cause of environmental contamination. Further, even if a defect occurs on only one portion of the plurality ofpockets 14 and/or thecover tape 20, theentire carrier tape 10 and/or thecover tape 20 must be discarded. - Example embodiments may provide a carrier tape that may be recyclable so as not to become a cause of environmental contamination. Even when a defect occurs on recesses of a carrier tape, a corresponding part may be easily replaced. Thus, the carrier tape may be more economically and environmentally advantageous over the conventional art.
- Example embodiments also may provide a method of wrapping semiconductor devices using the tape carrier.
- According to example embodiments, there may be provided a carrier tape for receiving semiconductor devices, the carrier tape may include a frame tape having perforation portions, and a pocket. The pocket may have a recessed bottom, on which the semiconductor device may be received, and a stopper that may prevent the semiconductor device received in the recessed bottom from escaping from the pocket. The pocket may be capable of being attached/detached into/from the perforation portion.
- A pair of stoppers facing each other may be disposed on an opening portion of the pocket. The semiconductor device may be separated by moving the stoppers so that the pocket and the carrier tape may be recycled.
- The pocket may be inserted into the perforation portion to be attached into the frame tape.
- The carrier tape may further include a reel, on which the frame tape may be wound.
- A lip portion in parallel with the recessed bottom may be formed on at least a portion of the opening portion of the pocket with constant width. The lip portion may prevent the pocket from penetrating the perforation portion even if the pocket is forcefully inserted into the perforation portion of the frame tape.
- The pocket may be removably inserted into the perforation portion of the frame tape, and the lip portion may be mounted on a peripheral surface of the perforation portion of the frame tape.
- The stoppers may be disposed in parallel to the recessed bottom to prevent the semiconductor device from escaping from the pocket. The stoppers may be capable of rotating toward the recessed bottom and may be incapable of moving toward the opposite direction of the recessed bottom.
- The pocket may be inserted into the perforation portion of the frame tape, and the pocket may include a protrusion at least on a side surface of the pocket for preventing the pocket from escaping from the frame tape.
- According to example embodiments, there may be provided a method of wrapping semiconductor devices using a carrier tape, which may include a frame tape having perforation portions, and a pocket. The pocket may have a recessed bottom, on which the semiconductor device may be received, and a stopper that may prevent the semiconductor device received in the recessed bottom from escaping from the pocket. The pocket may be capable of being attached/detached into/from the perforation portion. The method may include attaching the pocket onto the frame tape, and inserting the semiconductor device into the pocket.
- The above and other features and advantages of example embodiments will become more apparent by being described in detail with reference to the attached drawings in which:
-
FIG. 1 is a perspective view of a carrier tape according to the conventional art; -
FIGS. 2A and 2B are perspective views of a frame tape and a pocket according to an example embodiment; -
FIG. 3 is a perspective view of a carrier tape, in which the pocket ofFIG. 2B is attached on the frame tape ofFIG. 2A , according to an example embodiment; -
FIG. 4 is a cross-sectional view of the carrier tape taken along line IV-IV ofFIG. 3 ; -
FIG. 5 is a cross-sectional view of a pocket according to an example embodiment; -
FIG. 6 is a cross-sectional view of a pocket according to an example embodiment; -
FIG. 7 is a cross-sectional view of a pocket illustrating how a protrusion formed thereon prevent the pocket from escaping from the frame tape according to an example embodiment; -
FIGS. 8A and 8B are cross-sectional views of protrusions according to an example embodiment; and -
FIG. 9 is a perspective view illustrating a method of wrapping semiconductor devices according to an example embodiment. - Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as being limited to example embodiments set forth herein. Rather, example embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. Like reference numerals in the drawings denote like elements, and thus their description will be omitted.
- Detailed illustrative embodiments of example embodiments are disclosed herein. However, specific structural and functional details disclosed herein are merely representative for purposes of describing example embodiments. The example embodiments may, however, be embodied in many alternate forms and should not be construed as limited to only example embodiments set forth herein.
- Accordingly, while example embodiments are capable of various modifications and alternative forms, embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It should be understood, however, that there is no intent to limit example embodiments to the particular forms disclosed, but on the contrary, example embodiments are to cover all modifications, equivalents, and alternatives falling within the scope of example embodiments. Like numbers refer to like elements throughout the description of the figures.
- It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of example embodiments. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
- It will be understood that when an element is referred to as being “connected” or “coupled” to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, there are no intervening elements present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., “between” versus “directly between”, “adjacent” versus “directly adjacent”, etc.).
- The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises”, “comprising,”, “includes” and/or “including”, when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
- It should also be noted that in some alternative implementations, the functions/acts noted may occur out of the order noted in the figures. For example, two figures shown in succession may in fact be executed substantially concurrently or may sometimes be executed in the reverse order, depending upon the functionality/acts involved.
- According to example embodiments, there may be provided a carrier tape for receiving semiconductor devices. The carrier tape may include a frame tape having perforation portions, and pockets. Each pocket may include a recessed bottom on which the semiconductor device may be received, and a stopper for preventing the received semiconductor device from escaping from the pocket. The pocket may be capable of being attached/detached into/from the perforation portions.
-
FIG. 2A is a perspective view of a frame tape according example embodiments,FIG. 2B is a perspective view of a pocket according to example embodiments, andFIG. 3 is a perspective view of a carrier tape according to example embodiments. - Referring to
FIG. 2A , theframe tape 100 may includeperforation portions 110. Theframe tape 100 may optionally include sprocket holes 120 that may be used when theframe tape 100 is wound/unwound. Theframe tape 100 may be formed of the same material as that of a conventional carrier tape. However, theframe tape 100 is not limited thereto because there may be no need for theframe tape 100 to be attached to a cover tape. Therefore, a wide variety of materials may be used to form theframe tape 100. - A conventional carrier tape may have various widths according to the sizes of the semiconductor devices that are to be received, and a certain semiconductor device may only be received in a carrier tape having a corresponding width. However, according to example embodiments, the
carrier tape 100 semiconductor devices of different sizes may be received by changing pockets 200 (FIG. 2B ). The pocket and the frame tape are recyclable and therefore are more environmentally friendly. - Referring to
FIG. 2A , the size ofperforation portion 110 may be adjusted to correspond to a size of the pocket (not shown) that is attached to theframe tape 100. Theperforation portions 110 may be arranged with a predetermined interval therebetween to facilitate automation. The sprocket holes 120 may be fabricated to have various shapes/intervals. - Referring to
FIG. 2B , thepocket 200 may include a recessedbottom 210 where the semiconductor device (not shown) may be received, and astopper 220 that may prevent the semiconductor device from escaping from thepocket 200. In example embodiments, a pair ofstoppers 220 facing each other may be disposed on an opening portion of the pocket. Thestopper 220 may use a structure familiar to those of skill in the art. However, the structure of thestopper 220 is not limited thereto. - Alternatively, the inner space in the
pocket 200 may be adjusted according to the size of the semiconductor device that is to be received in thepocket 200. If the semiconductor device is small, a pocket having smaller inner space may be used to receive the semiconductor device, but still have the same outer appearance of thepocket 200. Therefore, theframe tape 100 may be used to receive semiconductor devices having various sizes to provide a more economical and easily automated alternative to the conventional carrier tape. - To attach the
pocket 200 to theframe tape 100, thepocket 200 may be inserted into theperforation portion 110 of theframe tape 100. - In example embodiments, referring to
FIG. 2B , thepocket 200 may include alip portion 230 that may be formed with constant width on at least a part of the opening in parallel with the recessedbottom 210. InFIG. 2B ,lip portions 230 may be disposed on facing two sides of the opening of thepocket 200. Thelip portions 230 may also be formed on all sides of the opening. Thelip portions 230 may prevent thepocket 200 from passing through theperforation portion 110 when thepocket 200 is inserted into theperforation portion 110 of theframe tape 100. - When the
pocket 200 is inserted into theperforation portion 110 of theframe tape 100, thelip portions 230 of thepocket 200 may be mounted on peripheral surfaces of theperforation portion 110. Thus, thepocket 200 may be coupled to theframe tape 100.FIG. 3 is a perspective view showing thepocket 200 mounted on theframe tape 100.FIG. 4 is a cross-sectional view showing the pocket taken along line IV-IV ofFIG. 3 . Thelip portions 230 of thepocket 200 may be mounted on the peripheral surfaces of theperforation portion 110 of theframe tape 100. -
FIG. 5 is a cross-sectional view of apocket 300 according to example embodiments. Astopper 320 of thepocket 300 may be parallel with recessedbottom 310 to prevent the semiconductor device from escaping from thepocket 300. Thestopper 320 may rotate toward the recessed bottom (direction A inFIG. 5 ). However, thestopper 320 may not rotate toward the opposite portion (opposite direction to the direction A inFIG. 5 ) to prevent the semiconductor device (not shown) received in thepocket 300 from escaping out of thepocket 300. In addition, when the semiconductor device is to be withdrawn, thestopper 320 may be sufficiently rotated in the direction A ofFIG. 5 to ensure a sufficient space so the semiconductor device may be withdrawn. -
FIG. 6 is a cross-sectional view of apocket 400 according to example embodiments. Thepocket 400 may be inserted into theperforation portion 110 of theframe tape 100. For example, aprotrusion 440 may be disposed on at least oneside surface 450 of thepocket 400 to prevent thepocket 400 from escaping from theframe tape 100. -
FIG. 7 is a cross-sectional view of a pocket showing how theprotrusion 440 may prevent thepocket 400 from escaping from theframe tape 100. InFIG. 7 , thepocket 400 may be inserted into theframe tape 100. Referring toFIG. 7 ,lip portions 430 may be mounted on theframe tape 100, and edges of the perforation portion of theframe tape 100 may be inserted between theprotrusions 440 and thelip portions 430. Therefore, the escape of thepocket 400 from theframe tape 100 may be prevented by theprotrusion 440. - To separate the
pocket 400 from theframe tape 100, the edges of theframe tape 100 may be removed from the gap between theprotrusion 440 and thelip portion 430. For example, side portions of theframe tape 100 may be extended to both side directions to separate thepocket 400, or both side surfaces 450 of thepocket 400 may be pressed to separate thepocket 400 from theframe tape 100. -
FIGS. 8A and 8B are cross-sectional views of a part of apocket 400 showing examples of theprotrusion 440. - Referring to
FIG. 8A , an upper edge of aprotrusion 440 a may be rounded. When the upper edge of theprotrusion 440 a is rounded, it may be easier to separate thepocket 400 from theframe tape 100. - In
FIG. 8B , an end portion of a protrusion 440 b may be attached to theside surface 450 of thepocket 400, and the other end of the protrusion 440 b may be separated from theside surface 450. For example, as shown inFIG. 8B , the end portion of the protrusion 440 b may be attached onto theside surface 450 of thepocket 400 so as to be inclined. If an external force is not applied, the other end of the protrusion 440 b may be separated from theside surface 450 of thepocket 400 as denoted by the solid line inFIG. 8B . If an external force is applied toward the center portion of thepocket 400, the protrusion portion 440 b may be bent and may be adhered onto theside surface 450 of thepocket 400. - When the protrusion 440 b is attached as above, the
pocket 400 may be easily inserted into theframe tape 100. After inserting thepocket 400 into theframe tape 100, the other end portion of the protrusion 440 b may be separated from theside surface 450 of thepocket 400 to prevent thepocket 400 from escaping from theframe tape 100. When thepocket 400 is to be separated, the other end may be pressed to contact theside surface 450 of thepocket 400 and thepocket 400 may be easily separated from theframe tape 100. - The carrier tape may further include a reel. The reel may be the
reel 30 ofFIG. 1 , but is not limited thereto. When theframe tape 100, in which thepocket - According to example embodiments, there is provided a method of wrapping semiconductor devices using a carrier tape receiving semiconductor devices, which may include a frame tape having perforation portions, and a pocket including a recessed bottom, on which the semiconductor device may be received, and a stopper preventing the semiconductor device from escaping from the pocket, and capable of being attached/detached into/from the perforation portion, the method may include attaching the pocket into the frame tape, and inserting the semiconductor device into the pocket.
FIG. 9 is an exploded perspective view illustrating an example method of wrapping the semiconductor device. - Referring to
FIG. 9 , thepocket 200 may be removably attached into theperforation portion 110 of theframe tape 110 and asemiconductor device 500 may be inserted into thepocket 200. Attaching of thepocket 200 may be performed by inserting thepocket 200 into theperforation portion 110. As described above, thepocket 200 may be inserted until the lip portions of thepocket 200 are mounted on the surface of theframe tape 100. - During insertion of the
semiconductor device 500 into thepocket 200, thestoppers 230 may be folded toward the inside of thepocket 200, and then, unfolded. After inserting thesemiconductor device 500 into thepocket 200, thestoppers 230 may be arranged in parallel with the recessed bottom of thepocket 200 to prevent thesemiconductor device 500 from escaping from thepocket 200. - According to example embodiments, the carrier tape may be recyclable to be more environmentally friendly. Even if a defective portion is generated on the pocket, the corresponding portion may be easily replaced with a new one. Thus, it may be economically advantageous to use the carrier tape of example embodiments.
- While example embodiments have been particularly shown and described with reference to the drawings thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of example embodiments as defined by the following claims.
Claims (19)
1. A carrier tape for receiving a semiconductor device, the carrier tape comprising:
a frame tape including perforation portions; and
a pocket having a recessed bottom, and a stopper that retains the semiconductor device received in the pocket, wherein the pocket is capable of being attached/detached into/from the frame tape.
2. The carrier tape of claim 1 , wherein the pocket includes a pair of stoppers facing each other from opposite sides of an opening portion of the pocket.
3. The carrier tape of claim 1 , wherein the pocket is removably insertable into the perforation portions.
4. The carrier tape of claim 1 wherein the carrier tape is windable on a reel.
5. The carrier tape of claim 1 , wherein the pocket includes a lip portion parallel to the recessed bottom, the lip portion having a constant width on at least a portion of the opening portion of the pocket.
6. The carrier tape of claim 5 , wherein the pocket is removably insertable into the perforation portion of the frame tape, and the lip portion is mounted on a peripheral surface of the perforation portion of the frame tape.
7. The carrier tape of claim 1 , wherein the stopper is parallel to the recessed bottom, and the stopper is capable of rotating toward the recessed bottom and is incapable of moving toward in an opposite direction of the recessed bottom.
8. The carrier tape of claim 1 , wherein the pocket is removably insertable into the perforation portion of the frame tape, and the pocket includes a protrusion at least on a side surface of the pocket that prevents the pocket from escaping from the frame tape.
9. The carrier tape of claim 1 , wherein the perforation portions are uniform in size and the pockets have a non-uniform inner space to receive semiconductor devices of various sizes.
10. The carrier tape of claim 1 , wherein the pocket includes a lip portion around a periphery of an opening of the pocket.
11. The carrier tape of claim 1 , wherein the frame tape includes sprocket holes.
12. The carrier tape of claim 8 , wherein the protrusion is parallel to a lip portion that extends from the side surface of the pocket.
13. The carrier tape of claim 8 , wherein the protrusion is rounded.
14. The carrier tape of claim 1 , further comprising a cover tape covering an opening in the pocket.
15. A method of wrapping semiconductor device using a carrier tape, including a frame tape having perforation portions; and a pocket having a recessed bottom and a stopper that retains the semiconductor in the pocket, the pocket capable of being attached/detached into/from the perforation portion, the method comprising:
removably attaching the pocket into the frame tape; and
inserting the semiconductor device into the pocket.
16. The method of claim 15 , wherein the attaching of the pocket onto the frame tape includes:
inserting the pocket into the perforation portion of the frame tape.
17. The method of claim 15 , further comprising removing the pocket from the frame tape.
18. The method of claim 17 , wherein the removing includes pressing opposing side surfaces of the pocket to separate the pocket from the frame tape.
19. The method of claim 17 , wherein the removing includes depressing protrusions that extend from side walls of the pocket.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2006-0101026 | 2006-10-17 | ||
KR1020060101026A KR100771888B1 (en) | 2006-10-17 | 2006-10-17 | Carrier tape and method of wrapping semiconductor devices using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
US20080087573A1 true US20080087573A1 (en) | 2008-04-17 |
Family
ID=39060403
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/907,720 Abandoned US20080087573A1 (en) | 2006-10-17 | 2007-10-17 | Carrier tape and method of wrapping semiconductor devices using the same |
Country Status (2)
Country | Link |
---|---|
US (1) | US20080087573A1 (en) |
KR (1) | KR100771888B1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103625774A (en) * | 2013-12-11 | 2014-03-12 | 苏州康铂塑料科技有限公司 | Electronic package carrying belt capable of being recovered and utilized |
CN103662402A (en) * | 2013-12-16 | 2014-03-26 | 苏州康铂塑料科技有限公司 | Chip carrier band locating structure |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3444993A (en) * | 1968-04-23 | 1969-05-20 | Thomas J Lunsford | Component package with dust cover |
US5101975A (en) * | 1990-10-31 | 1992-04-07 | Novapak, Inc. | Electronic component carrier |
US5119934A (en) * | 1989-07-14 | 1992-06-09 | Seiko Epson Corporation | Transport carrier tape with integral component engaging means |
US5360110A (en) * | 1992-09-14 | 1994-11-01 | Matsushita Electric Industrial Co., Ltd. | Component container |
US5472085A (en) * | 1994-05-16 | 1995-12-05 | Gpax International, Inc. | Gated-pocket tape-form packaging system |
US5690233A (en) * | 1995-03-30 | 1997-11-25 | Kaneko Denki Kabushiki Kaisha | Carrier tape with recesses for electronic parts |
US5960961A (en) * | 1998-08-03 | 1999-10-05 | Tempo G | Tab means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes |
US5967328A (en) * | 1998-01-22 | 1999-10-19 | Dial Tool Industries, Inc. | Part carrier strip |
US6016918A (en) * | 1998-08-18 | 2000-01-25 | Dial Tool Industries, Inc. | Part carrier strip |
US6270614B1 (en) * | 1997-04-02 | 2001-08-07 | Fujitsu Limited | Method for fabricating carrier tape |
US6681937B2 (en) * | 2001-06-08 | 2004-01-27 | Smk Corporation | Packing tape composition and packing method using the packing tape composition |
US20040035747A1 (en) * | 2002-08-21 | 2004-02-26 | Butler Michael S. | Temporary electronic component-carrying tape with weakened areas and related methods |
US20040206665A1 (en) * | 2003-04-16 | 2004-10-21 | Patent-Treuhand-Gesellschaft Fur Elektrische Gluhlampen Mbh | Transport tape |
-
2006
- 2006-10-17 KR KR1020060101026A patent/KR100771888B1/en not_active IP Right Cessation
-
2007
- 2007-10-17 US US11/907,720 patent/US20080087573A1/en not_active Abandoned
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3444993A (en) * | 1968-04-23 | 1969-05-20 | Thomas J Lunsford | Component package with dust cover |
US5119934A (en) * | 1989-07-14 | 1992-06-09 | Seiko Epson Corporation | Transport carrier tape with integral component engaging means |
US5101975A (en) * | 1990-10-31 | 1992-04-07 | Novapak, Inc. | Electronic component carrier |
US5360110A (en) * | 1992-09-14 | 1994-11-01 | Matsushita Electric Industrial Co., Ltd. | Component container |
US5472085A (en) * | 1994-05-16 | 1995-12-05 | Gpax International, Inc. | Gated-pocket tape-form packaging system |
US5690233A (en) * | 1995-03-30 | 1997-11-25 | Kaneko Denki Kabushiki Kaisha | Carrier tape with recesses for electronic parts |
US6270614B1 (en) * | 1997-04-02 | 2001-08-07 | Fujitsu Limited | Method for fabricating carrier tape |
US5967328A (en) * | 1998-01-22 | 1999-10-19 | Dial Tool Industries, Inc. | Part carrier strip |
US5960961A (en) * | 1998-08-03 | 1999-10-05 | Tempo G | Tab means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes |
US6016918A (en) * | 1998-08-18 | 2000-01-25 | Dial Tool Industries, Inc. | Part carrier strip |
US6681937B2 (en) * | 2001-06-08 | 2004-01-27 | Smk Corporation | Packing tape composition and packing method using the packing tape composition |
US20040035747A1 (en) * | 2002-08-21 | 2004-02-26 | Butler Michael S. | Temporary electronic component-carrying tape with weakened areas and related methods |
US20040206665A1 (en) * | 2003-04-16 | 2004-10-21 | Patent-Treuhand-Gesellschaft Fur Elektrische Gluhlampen Mbh | Transport tape |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103625774A (en) * | 2013-12-11 | 2014-03-12 | 苏州康铂塑料科技有限公司 | Electronic package carrying belt capable of being recovered and utilized |
CN103662402A (en) * | 2013-12-16 | 2014-03-26 | 苏州康铂塑料科技有限公司 | Chip carrier band locating structure |
Also Published As
Publication number | Publication date |
---|---|
KR100771888B1 (en) | 2007-11-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7503109B2 (en) | Method of mounting an electronic component | |
TW201637115A (en) | Carrier tape and carrier tape assembly | |
US20080087573A1 (en) | Carrier tape and method of wrapping semiconductor devices using the same | |
JP5562892B2 (en) | Packaging structure | |
JP4679053B2 (en) | Roll fixed packing equipment | |
KR101648212B1 (en) | Box | |
JP2007201311A (en) | Method for conveying substrate | |
JPH09323752A (en) | Carrier band for electronic part | |
JP4496913B2 (en) | Package electronic components and electronic component mounters | |
JP5028815B2 (en) | Adhesive sheet with release sheet | |
JP2008009163A (en) | Gas removal tool | |
JP2006182522A (en) | Roll stopper | |
JP2007168806A (en) | Reel for taking up electronic component storing carrier tape | |
KR102294041B1 (en) | tape packing container | |
JP2008230670A (en) | Packing box | |
JP6405852B2 (en) | Electronic component packaging, electronic component package, method for manufacturing electronic component package, and method for taking out electronic component | |
KR200381811Y1 (en) | Case for Receiving Roll Type Band | |
JP2007015741A (en) | Carrier tape for housing electronic component, and electronic component feeding device | |
JP2006213388A (en) | Embossed tape | |
CN111846611A (en) | Packing winding tape with retaining wall structure | |
KR102023426B1 (en) | Packing box | |
KR19990025567U (en) | Packing box with handle for easy assembly | |
JPH0726221A (en) | Self-adhesive tape and its use | |
JPH03200554A (en) | Embossed plastic tape | |
WO2012075061A1 (en) | Protective envelope |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SAMSUNG ELECTRONICS CO., LTD., KOREA, REPUBLIC OF Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HAN, MOON-SOO;REEL/FRAME:020019/0033 Effective date: 20071016 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |