US20070089869A1 - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- US20070089869A1 US20070089869A1 US11/309,067 US30906706A US2007089869A1 US 20070089869 A1 US20070089869 A1 US 20070089869A1 US 30906706 A US30906706 A US 30906706A US 2007089869 A1 US2007089869 A1 US 2007089869A1
- Authority
- US
- United States
- Prior art keywords
- bulge
- heat sink
- main body
- heat
- fins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A heat sink (10) includes a plurality of fins (12). Each of the fins includes a main body (122) and at least one bulge (126) disposed on the main body. The main bodies of two adjacent fins cooperatively define an air passage (121) therebetween, for allowing an airflow to pass therethough. The bulge has a varying projection height so as to form a streamline guide surface (127) thereon.
Description
- The present invention relates generally to a heat sink, and more particularly to a heat sink for dissipating heat generated by electronic components, wherein fins of the heat sink project bulges therefrom for increasing heat dissipation efficiency of the heat sink.
- A conventional heat dissipating apparatus includes a heat sink thermally connected with a heat source for absorbing heat therefrom, and a heat dissipating fan for providing an airflow, which flows through the heat sink to take away heat therefrom. The heat sink includes a plurality of fins with two opposite planar surfaces. A plurality of air passages is formed between the fins allowing the airflow to flow therebetween.
- When the airflow flowing through the air passages of the heat sink, the airflow is laminar or turbulent. Turbulent airflow increases heat convection efficiency between the fins and the airflow, which further increases heat dissipation efficiency of the heat dissipating apparatus. However, even if the airflow is turbulent, a laminar sublayer is still formed adjacent to the surfaces of the fins where the airflow contacts with the fins. The thickness of the laminar sublayer is gradually increased when the airflow flowing through the air passages of the heat sink. The increase in thickness of the laminar sublayer causes a decrease in heat convection efficiency. Therefore, reducing the laminar sublayer and so improving heat convection efficiency is key in increasing the heat dissipation efficiency of the heat dissipating apparatus.
- The present invention relates to a heat sink for dissipating heat from a heat-generating electronic component. According to a preferred embodiment of the present invention, the heat sink includes a plurality of fins. Each of the fins includes a main body and at least one bulge disposed on the main body. The main bodies of two adjacent fins cooperatively define an air passage therebetween, allowing airflow to pass therethough. The bulge has a varying projection height so as to form a streamline guide surface thereon. Furthermore, the bulge facilitates creating turbulence on surfaces of the fin, thereby increasing heat dissipation effectiveness of the fin when an airflow flows through the fin.
- Other advantages and novel features of the present invention will become more apparent from the following detailed description of preferred embodiment when taken in conjunction with the accompanying drawings, in which:
-
FIG. 1 is an isometric view of a heat sink according to a preferred embodiment of the present invention; -
FIG. 2 is an isometric view of a fin of the heat sink ofFIG. 1 ; -
FIG. 3 is an isometric view of a fin of a heat sink according to a second embodiment of the present invention; and -
FIG. 4 is an isometric view of a heat sink according to a third embodiment of the present invention. - Referring to
FIGS. 1 and 2 , aheat sink 10 according to a preferred embodiment of the present invention is shown. A heat dissipating fan (not shown) is disposed at one side of theheat sink 10, for providing an airflow passing through theheat sink 10 to take away heat therefrom as indicated by arrows ofFIG. 1 . Theheat sink 10 includes a plurality ofparallel fins 12 and aheat pipe 14 extending through thefins 12. Theheat pipe 14 has two opposite ends respectively connecting with a heat-generating electronic component (not shown) and thefins 12, for transferring heat therebetween. - Each of the
fins 12 includes a rectangular shapedmain body 122, and twoflanges 123 extending from two opposite ends of themain body 122. Thefins 12 are stacked together with theflanges 123 of arear fin 12 abutting against themain body 122 of afront fin 12. A plurality ofair passages 121 are formed between twoadjacent fins 12 to allow the airflow pass through. Themain body 122 of eachfin 12 defines areceiving hole 124 at a top portion thereof, for allowing theheat pipe 14 to extend therethrough. Acollar 125 extends forwards from a periphery of thereceiving hole 124, thus increasing the contacting areas between thefins 12 and theheat pipe 14. The heat convection between thefin 12 and theheat pipe 14 is thus increased due to thecollar 125. - Each fin 12 projects a bulge 126 forwards from the
main body 122 thereof. Thebulge 126 extends from the bottom and right corner of themain body 122 toward the bottom and left side of theheat pipe 14. The extension direction of thebulge 126 is at an obtuse angle to the flow direction of the airflow. The joint of thebulge 126 and themain body 122 is rhombus-shaped in profile. The projection height of thebulge 126 gradually decreases from a center of thebulge 126 toward that of the joint. Twostreamline guide surfaces 127 with arrow-shaped profiles are formed on thebulge 126. Theguide surfaces 127 extend from two acute corners of thebulge 126 toward a middle portion thereof and join with each other thereat. The profile of theguide surface 127 reduces the air resistance of thebulge 126. - When the airflow reaches the
bulges 126 of thefins 12, one part of the airflow strides over thebulges 126, going straight ahead, whilst the other part of the airflow moves towards theheat pipe 14 along theguide surfaces 127 of thebulges 126. There is more airflow flowing toward theheat pipe 14, which removes more heat from theheat pipe 14. The heat dissipation efficiency of theheat sink 10 is thus increased. Moreover, the airflow flowing through theair passages 121 of thefins 12 is deflected by thebulges 126 projecting from themain bodies 122 of thefins 12. The turbulence of the airflow reduces the thickness of the laminar sublayer, which increases the heat convection between thefins 12 and the airflow, and further improves the heat dissipation efficiency of theheat sink 10. In addition, thebulges 126 increase the heat dissipation areas of thefins 12, and further increase the heat dissipation efficiency of theheat sink 10. - Referring to
FIG. 3 , thefin 12 a of theheat sink 10 of the second embodiment of the present invention is shown. In this embodiment, themain body 122 of thefin 12 a projects three parallel bulges 126 a. The extension lengths of thebulges 126 a decrease from the left side of themain body 122 toward the right side thereof. Thebulge 126 a at the left side of themain body 122 extends from the bottom and right corner of themain body 122 toward the bottom and left side of thecollar 125, in a manner such that it can guide more airflow to flow toward the heat pipe. Referring toFIG. 4 , the third embodiment of theheat sink 10 b of the present invention is shown. The difference between this embodiment from the second embodiment is that the extension directions of thebulges 126 b are different from each other. Thebulges 126 b guide the airflow flowing toward theheat pipe 14 along different directions. Air turbulence is thus generated, which increases the heat convection of thefins 12 and the airflow near theheat pipe 14, and further improves the heat dissipation efficiency of theheat sink 10 b. Alternatively, the heat sink may include a plurality of heat pipes, whist the main body of each fin projects a plurality of bulges towards the heat pipes. When the main body of each of the fins projects more than two bulges, the bulges can be arranged on two opposite surfaces of the main body. - In the above mentioned embodiments of the present invention, the joint of the
bulge 126 and themain body 122 of thefin 12 has been rhombus-shaped in profile. Alternatively, that joint may be ellipse-shaped or other shaped in profile. When the main body of the fin projects more than two bulges, the joints of the bulges and the main body may have the same or different profiles. - It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (20)
1. A heat sink comprising:
a plurality of fins each comprising a main body and at least one bulge disposed on the main body, the main bodies of two adjacent fins cooperatively defining an air passage therebetween for allowing an airflow to pass therethough, the at least one bulge having a varying projection height so as to form a streamline guide surface thereon.
2. The heat sink as described in claim 1 , wherein the at least one bulge extends from the main body of the fin towards at least an adjacent fin.
3. The heat sink as described in claim 1 , wherein the projection height of the at least one bulge is gradually decreased from a center of the at least one bulge toward the joint of the at least one bulge and the main body.
4. The heat sink as described in claim 1 , wherein the profile of the joint between the at least one bulge and the main body is chosen from the group consisting of rhombus-shape, and ellipse-shape.
5. The heat sink as described in claim 1 , further comprising a heat pipe thermally connected with the fins.
6. The heat sink as described in claim 6 , wherein the at least one bulge extends from a corner of the main body of the fin towards an opposite corner adjacent to the heat pipe.
7. The heat sink as described in claim 1 , wherein the extension direction of the at least one bulge forms an obtuse angle to the flow direction of the airflow.
8. The heat sink as described in claim 1 , wherein the at least one bulge comprises more than one parallel bulge.
9. The heat sink as described in claim 1 , wherein the at least one bulge comprises more than one bulge having a different extension direction.
10. A heat sink adapted for dissipating heat from a heat-generating electronic component comprising:
a plurality of fins each comprising a main body and at least one bulge extending from the main body, the at least one bulge having a projection height gradually decreased from a middle portion of the at least one bulge toward a periphery thereof.
11. The heat sink as described in claim 10 , further comprising a heat pipe thermally connected to the fins.
12. The heat sink as described in claim 11 , wherein the at least one bulge extends from a corner of the main body of the fin toward an opposite corner adjacent to the heat pipe.
13. The heat sink as described in claim 10 , wherein the profile of the periphery of the at least one bulge is selected from the group consisting of rhombus-shape and ellipse-shape.
14. The heat sink as described in claim 10 , wherein the at least one bulge has two arrow-shaped guide surfaces formed thereon.
15. The heat sink as described in claim 14 , wherein the two guide surfaces have acute corners pointed toward opposite directions and met with each other at a middle of the at least one bulge.
16. A heat sink comprising:
a heat pipe having a first end section adapted for thermally connecting with a heat generating electronic component and a second end section; and
a plurality of fins stacked together, the second end section of the heat pipe extending through the fins and thermally connecting therewith, each of the fins having a main body with an elongated bulge thereon, wherein the elongated bulge extends from a corner of the main body toward the heat pipe.
17. The heat sink of claim 16 , wherein the bulge has a height gradually increased from a periphery thereof toward a center thereof.
18. The heat sink of claim 17 , wherein the main body comprises an additional bulge having a length smaller than that of the bulge and extending in a direction parallel to that of the bulge.
19. The heat sink of claim 18 , wherein the bulge has one of rhombus shape and ellipse shape.
20. The heat sink of claim 17 , wherein the main body comprises an additional bulge having a length smaller than that of the bulge and extending in a direction non-parallel to that of the bulge.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005101005662A CN100493317C (en) | 2005-10-21 | 2005-10-21 | Radiator |
CN200510100566.2 | 2005-10-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20070089869A1 true US20070089869A1 (en) | 2007-04-26 |
Family
ID=37984272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/309,067 Abandoned US20070089869A1 (en) | 2005-10-21 | 2006-06-15 | Heat sink |
Country Status (2)
Country | Link |
---|---|
US (1) | US20070089869A1 (en) |
CN (1) | CN100493317C (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070188992A1 (en) * | 2006-02-10 | 2007-08-16 | Foxconn Technology Co., Ltd. | Heat sink |
US20080165503A1 (en) * | 2007-01-08 | 2008-07-10 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20080304230A1 (en) * | 2007-06-11 | 2008-12-11 | Franz John P | Heat-Sink Structure With Small Fin Gap Area |
US20110024088A1 (en) * | 2009-07-29 | 2011-02-03 | Kuo-Len Lin | Heat-dissipating fin capable of increasing heat-dissipating area, heat sink having such heat-dissipating fins, and method for manufacturing the same |
EP2284885A1 (en) * | 2009-07-31 | 2011-02-16 | Cpumate Inc. | Heat-dissipating fin capable of increasing heat-dissipating area, heat sink having such heat-dissipating fins, and method for manufacturing the same |
EP2299488A1 (en) * | 2009-08-06 | 2011-03-23 | Cpumate Inc. | Heat-dissiping fin assembly with heat-conducting structure |
US20110127012A1 (en) * | 2009-11-27 | 2011-06-02 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd . | Heat dissipation device |
US20130265761A1 (en) * | 2012-04-06 | 2013-10-10 | Ruud Lighting, Inc. | LED Light Fixture with Inter-Fin Air-Flow Interrupters |
US20140102670A1 (en) * | 2012-10-17 | 2014-04-17 | Hon Hai Precision Industry Co., Ltd. | Heat dissipating apparatus |
US20140116659A1 (en) * | 2012-11-01 | 2014-05-01 | Msi Computer (Shenzhen) Co., Ltd. | Heat dissipation device and heat dissipation fins thereof |
US20220136784A1 (en) * | 2020-10-30 | 2022-05-05 | Asrock Inc. | Heat dissipation fin and heat dissipation module |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101641005B (en) * | 2008-07-31 | 2011-08-31 | 富准精密工业(深圳)有限公司 | Radiating device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5957194A (en) * | 1996-06-27 | 1999-09-28 | Advanced Thermal Solutions, Inc. | Plate fin heat exchanger having fluid control means |
US20040112570A1 (en) * | 2002-02-21 | 2004-06-17 | Wenger Todd Michael | Fin with elongated hole and heat pipe with elongated cross section |
US20050190538A1 (en) * | 2004-02-27 | 2005-09-01 | Quanta Computer Inc. | Heat-dissipating module and structure thereof |
-
2005
- 2005-10-21 CN CNB2005101005662A patent/CN100493317C/en not_active Expired - Fee Related
-
2006
- 2006-06-15 US US11/309,067 patent/US20070089869A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5957194A (en) * | 1996-06-27 | 1999-09-28 | Advanced Thermal Solutions, Inc. | Plate fin heat exchanger having fluid control means |
US20040112570A1 (en) * | 2002-02-21 | 2004-06-17 | Wenger Todd Michael | Fin with elongated hole and heat pipe with elongated cross section |
US20050190538A1 (en) * | 2004-02-27 | 2005-09-01 | Quanta Computer Inc. | Heat-dissipating module and structure thereof |
US7245492B2 (en) * | 2004-02-27 | 2007-07-17 | Quanta Computer Inc. | Heat-dissipating module and structure thereof |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7304847B2 (en) * | 2006-02-10 | 2007-12-04 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink |
US20070188992A1 (en) * | 2006-02-10 | 2007-08-16 | Foxconn Technology Co., Ltd. | Heat sink |
US20080165503A1 (en) * | 2007-01-08 | 2008-07-10 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US7417860B2 (en) * | 2007-01-08 | 2008-08-26 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20080304230A1 (en) * | 2007-06-11 | 2008-12-11 | Franz John P | Heat-Sink Structure With Small Fin Gap Area |
US8359745B2 (en) | 2009-07-29 | 2013-01-29 | Cpumate Inc. | Method for manufacturing a heat sink |
US20110024088A1 (en) * | 2009-07-29 | 2011-02-03 | Kuo-Len Lin | Heat-dissipating fin capable of increasing heat-dissipating area, heat sink having such heat-dissipating fins, and method for manufacturing the same |
EP2284885A1 (en) * | 2009-07-31 | 2011-02-16 | Cpumate Inc. | Heat-dissipating fin capable of increasing heat-dissipating area, heat sink having such heat-dissipating fins, and method for manufacturing the same |
EP2299488A1 (en) * | 2009-08-06 | 2011-03-23 | Cpumate Inc. | Heat-dissiping fin assembly with heat-conducting structure |
US20110127012A1 (en) * | 2009-11-27 | 2011-06-02 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd . | Heat dissipation device |
US8381800B2 (en) * | 2009-11-27 | 2013-02-26 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation device with triangular guiding member |
US20130265761A1 (en) * | 2012-04-06 | 2013-10-10 | Ruud Lighting, Inc. | LED Light Fixture with Inter-Fin Air-Flow Interrupters |
US9121582B2 (en) * | 2012-04-06 | 2015-09-01 | Cree, Inc. | LED light fixture with inter-fin air-flow interrupters |
US9879849B2 (en) | 2012-04-06 | 2018-01-30 | Cree, Inc. | LED light fixture having heat sink with fins at flow-through opening |
US20140102670A1 (en) * | 2012-10-17 | 2014-04-17 | Hon Hai Precision Industry Co., Ltd. | Heat dissipating apparatus |
US20140116659A1 (en) * | 2012-11-01 | 2014-05-01 | Msi Computer (Shenzhen) Co., Ltd. | Heat dissipation device and heat dissipation fins thereof |
US20220136784A1 (en) * | 2020-10-30 | 2022-05-05 | Asrock Inc. | Heat dissipation fin and heat dissipation module |
US11781818B2 (en) * | 2020-10-30 | 2023-10-10 | Asrock Inc. | Heat dissipation fin and heat dissipation module |
Also Published As
Publication number | Publication date |
---|---|
CN1953648A (en) | 2007-04-25 |
CN100493317C (en) | 2009-05-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HWANG, CHING-BAI;ZHU, XI-JIAN;REEL/FRAME:017792/0145 Effective date: 20060508 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |