US20070089869A1 - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
US20070089869A1
US20070089869A1 US11/309,067 US30906706A US2007089869A1 US 20070089869 A1 US20070089869 A1 US 20070089869A1 US 30906706 A US30906706 A US 30906706A US 2007089869 A1 US2007089869 A1 US 2007089869A1
Authority
US
United States
Prior art keywords
bulge
heat sink
main body
heat
fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/309,067
Inventor
Ching-Bai Hwang
Xi-Jian Zhu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxconn Technology Co Ltd
Original Assignee
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Technology Co Ltd filed Critical Foxconn Technology Co Ltd
Assigned to FOXCONN TECHNOLOGY CO., LTD. reassignment FOXCONN TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HWANG, CHING-BAI, ZHU, XI-JIAN
Publication of US20070089869A1 publication Critical patent/US20070089869A1/en
Abandoned legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00Fins
    • F28F2215/10Secondary fins, e.g. projections or recesses on main fins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat sink (10) includes a plurality of fins (12). Each of the fins includes a main body (122) and at least one bulge (126) disposed on the main body. The main bodies of two adjacent fins cooperatively define an air passage (121) therebetween, for allowing an airflow to pass therethough. The bulge has a varying projection height so as to form a streamline guide surface (127) thereon.

Description

    FIELD OF THE INVENTION
  • The present invention relates generally to a heat sink, and more particularly to a heat sink for dissipating heat generated by electronic components, wherein fins of the heat sink project bulges therefrom for increasing heat dissipation efficiency of the heat sink.
  • DESCRIPTION OF RELATED ART
  • A conventional heat dissipating apparatus includes a heat sink thermally connected with a heat source for absorbing heat therefrom, and a heat dissipating fan for providing an airflow, which flows through the heat sink to take away heat therefrom. The heat sink includes a plurality of fins with two opposite planar surfaces. A plurality of air passages is formed between the fins allowing the airflow to flow therebetween.
  • When the airflow flowing through the air passages of the heat sink, the airflow is laminar or turbulent. Turbulent airflow increases heat convection efficiency between the fins and the airflow, which further increases heat dissipation efficiency of the heat dissipating apparatus. However, even if the airflow is turbulent, a laminar sublayer is still formed adjacent to the surfaces of the fins where the airflow contacts with the fins. The thickness of the laminar sublayer is gradually increased when the airflow flowing through the air passages of the heat sink. The increase in thickness of the laminar sublayer causes a decrease in heat convection efficiency. Therefore, reducing the laminar sublayer and so improving heat convection efficiency is key in increasing the heat dissipation efficiency of the heat dissipating apparatus.
  • SUMMARY OF THE INVENTION
  • The present invention relates to a heat sink for dissipating heat from a heat-generating electronic component. According to a preferred embodiment of the present invention, the heat sink includes a plurality of fins. Each of the fins includes a main body and at least one bulge disposed on the main body. The main bodies of two adjacent fins cooperatively define an air passage therebetween, allowing airflow to pass therethough. The bulge has a varying projection height so as to form a streamline guide surface thereon. Furthermore, the bulge facilitates creating turbulence on surfaces of the fin, thereby increasing heat dissipation effectiveness of the fin when an airflow flows through the fin.
  • Other advantages and novel features of the present invention will become more apparent from the following detailed description of preferred embodiment when taken in conjunction with the accompanying drawings, in which:
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an isometric view of a heat sink according to a preferred embodiment of the present invention;
  • FIG. 2 is an isometric view of a fin of the heat sink of FIG. 1;
  • FIG. 3 is an isometric view of a fin of a heat sink according to a second embodiment of the present invention; and
  • FIG. 4 is an isometric view of a heat sink according to a third embodiment of the present invention.
  • DETAILED DESCRIPTION OF THE INVENTION
  • Referring to FIGS. 1 and 2, a heat sink 10 according to a preferred embodiment of the present invention is shown. A heat dissipating fan (not shown) is disposed at one side of the heat sink 10, for providing an airflow passing through the heat sink 10 to take away heat therefrom as indicated by arrows of FIG. 1. The heat sink 10 includes a plurality of parallel fins 12 and a heat pipe 14 extending through the fins 12. The heat pipe 14 has two opposite ends respectively connecting with a heat-generating electronic component (not shown) and the fins 12, for transferring heat therebetween.
  • Each of the fins 12 includes a rectangular shaped main body 122, and two flanges 123 extending from two opposite ends of the main body 122. The fins 12 are stacked together with the flanges 123 of a rear fin 12 abutting against the main body 122 of a front fin 12. A plurality of air passages 121 are formed between two adjacent fins 12 to allow the airflow pass through. The main body 122 of each fin 12 defines a receiving hole 124 at a top portion thereof, for allowing the heat pipe 14 to extend therethrough. A collar 125 extends forwards from a periphery of the receiving hole 124, thus increasing the contacting areas between the fins 12 and the heat pipe 14. The heat convection between the fin 12 and the heat pipe 14 is thus increased due to the collar 125.
  • Each fin 12 projects a bulge 126 forwards from the main body 122 thereof. The bulge 126 extends from the bottom and right corner of the main body 122 toward the bottom and left side of the heat pipe 14. The extension direction of the bulge 126 is at an obtuse angle to the flow direction of the airflow. The joint of the bulge 126 and the main body 122 is rhombus-shaped in profile. The projection height of the bulge 126 gradually decreases from a center of the bulge 126 toward that of the joint. Two streamline guide surfaces 127 with arrow-shaped profiles are formed on the bulge 126. The guide surfaces 127 extend from two acute corners of the bulge 126 toward a middle portion thereof and join with each other thereat. The profile of the guide surface 127 reduces the air resistance of the bulge 126.
  • When the airflow reaches the bulges 126 of the fins 12, one part of the airflow strides over the bulges 126, going straight ahead, whilst the other part of the airflow moves towards the heat pipe 14 along the guide surfaces 127 of the bulges 126. There is more airflow flowing toward the heat pipe 14, which removes more heat from the heat pipe 14. The heat dissipation efficiency of the heat sink 10 is thus increased. Moreover, the airflow flowing through the air passages 121 of the fins 12 is deflected by the bulges 126 projecting from the main bodies 122 of the fins 12. The turbulence of the airflow reduces the thickness of the laminar sublayer, which increases the heat convection between the fins 12 and the airflow, and further improves the heat dissipation efficiency of the heat sink 10. In addition, the bulges 126 increase the heat dissipation areas of the fins 12, and further increase the heat dissipation efficiency of the heat sink 10.
  • Referring to FIG. 3, the fin 12 a of the heat sink 10 of the second embodiment of the present invention is shown. In this embodiment, the main body 122 of the fin 12 a projects three parallel bulges 126 a. The extension lengths of the bulges 126 a decrease from the left side of the main body 122 toward the right side thereof. The bulge 126 a at the left side of the main body 122 extends from the bottom and right corner of the main body 122 toward the bottom and left side of the collar 125, in a manner such that it can guide more airflow to flow toward the heat pipe. Referring to FIG. 4, the third embodiment of the heat sink 10 b of the present invention is shown. The difference between this embodiment from the second embodiment is that the extension directions of the bulges 126 b are different from each other. The bulges 126 b guide the airflow flowing toward the heat pipe 14 along different directions. Air turbulence is thus generated, which increases the heat convection of the fins 12 and the airflow near the heat pipe 14, and further improves the heat dissipation efficiency of the heat sink 10 b. Alternatively, the heat sink may include a plurality of heat pipes, whist the main body of each fin projects a plurality of bulges towards the heat pipes. When the main body of each of the fins projects more than two bulges, the bulges can be arranged on two opposite surfaces of the main body.
  • In the above mentioned embodiments of the present invention, the joint of the bulge 126 and the main body 122 of the fin 12 has been rhombus-shaped in profile. Alternatively, that joint may be ellipse-shaped or other shaped in profile. When the main body of the fin projects more than two bulges, the joints of the bulges and the main body may have the same or different profiles.
  • It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (20)

1. A heat sink comprising:
a plurality of fins each comprising a main body and at least one bulge disposed on the main body, the main bodies of two adjacent fins cooperatively defining an air passage therebetween for allowing an airflow to pass therethough, the at least one bulge having a varying projection height so as to form a streamline guide surface thereon.
2. The heat sink as described in claim 1, wherein the at least one bulge extends from the main body of the fin towards at least an adjacent fin.
3. The heat sink as described in claim 1, wherein the projection height of the at least one bulge is gradually decreased from a center of the at least one bulge toward the joint of the at least one bulge and the main body.
4. The heat sink as described in claim 1, wherein the profile of the joint between the at least one bulge and the main body is chosen from the group consisting of rhombus-shape, and ellipse-shape.
5. The heat sink as described in claim 1, further comprising a heat pipe thermally connected with the fins.
6. The heat sink as described in claim 6, wherein the at least one bulge extends from a corner of the main body of the fin towards an opposite corner adjacent to the heat pipe.
7. The heat sink as described in claim 1, wherein the extension direction of the at least one bulge forms an obtuse angle to the flow direction of the airflow.
8. The heat sink as described in claim 1, wherein the at least one bulge comprises more than one parallel bulge.
9. The heat sink as described in claim 1, wherein the at least one bulge comprises more than one bulge having a different extension direction.
10. A heat sink adapted for dissipating heat from a heat-generating electronic component comprising:
a plurality of fins each comprising a main body and at least one bulge extending from the main body, the at least one bulge having a projection height gradually decreased from a middle portion of the at least one bulge toward a periphery thereof.
11. The heat sink as described in claim 10, further comprising a heat pipe thermally connected to the fins.
12. The heat sink as described in claim 11, wherein the at least one bulge extends from a corner of the main body of the fin toward an opposite corner adjacent to the heat pipe.
13. The heat sink as described in claim 10, wherein the profile of the periphery of the at least one bulge is selected from the group consisting of rhombus-shape and ellipse-shape.
14. The heat sink as described in claim 10, wherein the at least one bulge has two arrow-shaped guide surfaces formed thereon.
15. The heat sink as described in claim 14, wherein the two guide surfaces have acute corners pointed toward opposite directions and met with each other at a middle of the at least one bulge.
16. A heat sink comprising:
a heat pipe having a first end section adapted for thermally connecting with a heat generating electronic component and a second end section; and
a plurality of fins stacked together, the second end section of the heat pipe extending through the fins and thermally connecting therewith, each of the fins having a main body with an elongated bulge thereon, wherein the elongated bulge extends from a corner of the main body toward the heat pipe.
17. The heat sink of claim 16, wherein the bulge has a height gradually increased from a periphery thereof toward a center thereof.
18. The heat sink of claim 17, wherein the main body comprises an additional bulge having a length smaller than that of the bulge and extending in a direction parallel to that of the bulge.
19. The heat sink of claim 18, wherein the bulge has one of rhombus shape and ellipse shape.
20. The heat sink of claim 17, wherein the main body comprises an additional bulge having a length smaller than that of the bulge and extending in a direction non-parallel to that of the bulge.
US11/309,067 2005-10-21 2006-06-15 Heat sink Abandoned US20070089869A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNB2005101005662A CN100493317C (en) 2005-10-21 2005-10-21 Radiator
CN200510100566.2 2005-10-21

Publications (1)

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US20070089869A1 true US20070089869A1 (en) 2007-04-26

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070188992A1 (en) * 2006-02-10 2007-08-16 Foxconn Technology Co., Ltd. Heat sink
US20080165503A1 (en) * 2007-01-08 2008-07-10 Foxconn Technology Co., Ltd. Heat dissipation device
US20080304230A1 (en) * 2007-06-11 2008-12-11 Franz John P Heat-Sink Structure With Small Fin Gap Area
US20110024088A1 (en) * 2009-07-29 2011-02-03 Kuo-Len Lin Heat-dissipating fin capable of increasing heat-dissipating area, heat sink having such heat-dissipating fins, and method for manufacturing the same
EP2284885A1 (en) * 2009-07-31 2011-02-16 Cpumate Inc. Heat-dissipating fin capable of increasing heat-dissipating area, heat sink having such heat-dissipating fins, and method for manufacturing the same
EP2299488A1 (en) * 2009-08-06 2011-03-23 Cpumate Inc. Heat-dissiping fin assembly with heat-conducting structure
US20110127012A1 (en) * 2009-11-27 2011-06-02 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd . Heat dissipation device
US20130265761A1 (en) * 2012-04-06 2013-10-10 Ruud Lighting, Inc. LED Light Fixture with Inter-Fin Air-Flow Interrupters
US20140102670A1 (en) * 2012-10-17 2014-04-17 Hon Hai Precision Industry Co., Ltd. Heat dissipating apparatus
US20140116659A1 (en) * 2012-11-01 2014-05-01 Msi Computer (Shenzhen) Co., Ltd. Heat dissipation device and heat dissipation fins thereof
US20220136784A1 (en) * 2020-10-30 2022-05-05 Asrock Inc. Heat dissipation fin and heat dissipation module

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101641005B (en) * 2008-07-31 2011-08-31 富准精密工业(深圳)有限公司 Radiating device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5957194A (en) * 1996-06-27 1999-09-28 Advanced Thermal Solutions, Inc. Plate fin heat exchanger having fluid control means
US20040112570A1 (en) * 2002-02-21 2004-06-17 Wenger Todd Michael Fin with elongated hole and heat pipe with elongated cross section
US20050190538A1 (en) * 2004-02-27 2005-09-01 Quanta Computer Inc. Heat-dissipating module and structure thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5957194A (en) * 1996-06-27 1999-09-28 Advanced Thermal Solutions, Inc. Plate fin heat exchanger having fluid control means
US20040112570A1 (en) * 2002-02-21 2004-06-17 Wenger Todd Michael Fin with elongated hole and heat pipe with elongated cross section
US20050190538A1 (en) * 2004-02-27 2005-09-01 Quanta Computer Inc. Heat-dissipating module and structure thereof
US7245492B2 (en) * 2004-02-27 2007-07-17 Quanta Computer Inc. Heat-dissipating module and structure thereof

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7304847B2 (en) * 2006-02-10 2007-12-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink
US20070188992A1 (en) * 2006-02-10 2007-08-16 Foxconn Technology Co., Ltd. Heat sink
US20080165503A1 (en) * 2007-01-08 2008-07-10 Foxconn Technology Co., Ltd. Heat dissipation device
US7417860B2 (en) * 2007-01-08 2008-08-26 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20080304230A1 (en) * 2007-06-11 2008-12-11 Franz John P Heat-Sink Structure With Small Fin Gap Area
US8359745B2 (en) 2009-07-29 2013-01-29 Cpumate Inc. Method for manufacturing a heat sink
US20110024088A1 (en) * 2009-07-29 2011-02-03 Kuo-Len Lin Heat-dissipating fin capable of increasing heat-dissipating area, heat sink having such heat-dissipating fins, and method for manufacturing the same
EP2284885A1 (en) * 2009-07-31 2011-02-16 Cpumate Inc. Heat-dissipating fin capable of increasing heat-dissipating area, heat sink having such heat-dissipating fins, and method for manufacturing the same
EP2299488A1 (en) * 2009-08-06 2011-03-23 Cpumate Inc. Heat-dissiping fin assembly with heat-conducting structure
US20110127012A1 (en) * 2009-11-27 2011-06-02 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd . Heat dissipation device
US8381800B2 (en) * 2009-11-27 2013-02-26 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device with triangular guiding member
US20130265761A1 (en) * 2012-04-06 2013-10-10 Ruud Lighting, Inc. LED Light Fixture with Inter-Fin Air-Flow Interrupters
US9121582B2 (en) * 2012-04-06 2015-09-01 Cree, Inc. LED light fixture with inter-fin air-flow interrupters
US9879849B2 (en) 2012-04-06 2018-01-30 Cree, Inc. LED light fixture having heat sink with fins at flow-through opening
US20140102670A1 (en) * 2012-10-17 2014-04-17 Hon Hai Precision Industry Co., Ltd. Heat dissipating apparatus
US20140116659A1 (en) * 2012-11-01 2014-05-01 Msi Computer (Shenzhen) Co., Ltd. Heat dissipation device and heat dissipation fins thereof
US20220136784A1 (en) * 2020-10-30 2022-05-05 Asrock Inc. Heat dissipation fin and heat dissipation module
US11781818B2 (en) * 2020-10-30 2023-10-10 Asrock Inc. Heat dissipation fin and heat dissipation module

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Publication number Publication date
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AS Assignment

Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HWANG, CHING-BAI;ZHU, XI-JIAN;REEL/FRAME:017792/0145

Effective date: 20060508

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION