US20070018335A1 - Polygonal, rounded, and circular flip chip ball grid array board - Google Patents

Polygonal, rounded, and circular flip chip ball grid array board Download PDF

Info

Publication number
US20070018335A1
US20070018335A1 US11/483,844 US48384406A US2007018335A1 US 20070018335 A1 US20070018335 A1 US 20070018335A1 US 48384406 A US48384406 A US 48384406A US 2007018335 A1 US2007018335 A1 US 2007018335A1
Authority
US
United States
Prior art keywords
board
flip chip
chip bga
warpage
rounded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/483,844
Inventor
Seung-Hyun Cho
Soon-Jin Cho
Jae-Joon Lee
Se-Jong Oh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD. reassignment SAMSUNG ELECTRO-MECHANICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHO, SEUNG-HYUN, CHO, SOON-JIN, LEE, JAE-JOON, OH, SE-JONG
Publication of US20070018335A1 publication Critical patent/US20070018335A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001—Internal layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001—Internal layers
    • H01L2224/0502—Disposition
    • H01L2224/05022—Disposition the internal layer being at least partially embedded in the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001—Internal layers
    • H01L2224/05099—Material
    • H01L2224/051—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/05124—Aluminium [Al] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
    • H01L2224/05572—Disposition the external layer being disposed in a recess of the surface the external layer extending out of an opening
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/1147—Manufacturing methods using a lift-off mask
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15158—Shape the die mounting substrate being other than a cuboid
    • H01L2924/15162—Top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Definitions

  • the present invention relates to a flip chip ball grid array (hereinafter referred to as “flip chip BGA”) board, and in particular, to a flip chip BGA board in which heat deformation is minimized by evenly removing the corners of a quadrilateral board.
  • flip chip BGA flip chip ball grid array
  • the conventional package made by attaching a chip to a lead frame, connecting the pads of the chip with the leads, and sealing with resin —was large and heavy, and required a substantial length of wiring for its mounting.
  • the flip chip BGA package was developed, in which a chip is attached to an epoxy or ceramic board, and round solder balls are used as the leads.
  • Aluminum pads 2 are formed on a semiconductor chip 1 , and the semiconductor chip 1 is covered with a protective layer 3 .
  • a metal layer 4 is formed by sputtering and is connected with the pads 2 .
  • Photoresist 5 is applied so that only the regions of the pads 2 are exposed.
  • Lead coating 6 is applied on the regions of the pads 2 that are not masked by the photoresist 5 .
  • the overlaying photoresist 5 is removed.
  • the metal layer 4 is removed by etching in the regions excluding the portions where the lead coating 6 is applied.
  • Heat is-applied to render the lead coating 6 a round form.
  • the bumped chip manufactured as above is joined to the flip chip BGA board 8 .
  • the joining method consists of depositing in a reflow device, heating the board 8 to a high temperature to melt the lead coating 6 , and contacting the contact pads 10 of the flip chip BGA board 8 with the pads 2 of the chip 1 . Then, resin is filled between the flip chip BGA board 8 and the chip 1 via an underfilling process.
  • the manufacture of a flip chip BGA entails the application of a large amount of heat, during the process of rounding the lead coating 6 as in (g) and during the reflow process as in (h).
  • a high temperature generally of about 225 ° C. is applied, which causes warpage in the flip chip BGA board 8 .
  • FIG. 2 is a perspective view of a conventional flip chip BGA package.
  • the conventional flip chip BGA board 8 is generally formed as a quadrilateral.
  • FIG. 3 illustrates the degree of warpage developed on the flip chip BGA board 8 after manufacture.
  • the degree of warpage is the greatest at the edges of the flip chip BGA board 8 , so that it is warped into a concave shape by heat.
  • This warpage due to heat as illustrated in FIG. 3 is especially significant in a thin board such as a UTFCB (Ultra Thin Flexible Circuit Board) having a core thickness of 0.4 mm or less.
  • UTFCB Ultra Thin Flexible Circuit Board
  • one aspect of the present invention provides a flip chip BGA board manufactured to be polygonal, rounded, or circular, to minimize deformation due to heat.
  • a flip chip BGA board used in a flip chip BGA package may have comers of the board evenly removed to form a polygonal shape.
  • the board may be formed in a variety of shapes, such as a hexagonal or an octagonal shape.
  • a flip chip BGA board used in a flip chip BGA package may have comers of the board rounded in equal radii of curvature.
  • a flip chip BGA board used in a flip chip BGA package may be circular.
  • Figs. l( a ) through 1 ( h ) are cross-sectional views illustrating the manufacturing process of a typical flip chip BGA package.
  • FIG. 2 illustrates the distribution of warpage due to heat generated on a conventional board.
  • FIG. 3 illustrates the distribution of warpage due to heat generated on a conventional thin flip chip ball grid array board.
  • FIG. 4 is a schematic diagram illustrating a rounded flip chip ball grid array board based on an embodiment of the invention.
  • FIG. 5 is a schematic diagram illustrating a polygonal flip chip ball grid array board based on an embodiment of the invention.
  • FIG. 6 is a schematic diagram illustrating a circular flip chip ball grid array board based on an embodiment of the invention.
  • FIG. 7 a illustrates the distribution of warpage due to heat generated on a rounded flip chip ball grid array board based on an embodiment of the invention.
  • FIG. 7 b illustrates the distribution of warpage due to heat generated on a polygonal flip chip ball grid array board based on an embodiment of the invention.
  • FIG. 7 c illustrates the distribution of warpage due to heat generated on a circular flip chip ball grid array board based on an embodiment of the invention.
  • FIG. 4 illustrates a rounded flip chip BGA board 10 , based on an embodiment of the invention.
  • the flip chip BGA board 10 has each of the four comers rounded identically. It is preferable that the radius of curvature of each comer be made equal or very similar to prevent warpage due to heat as much as possible. Here, making the radii of curvature great, so that the board is as close as possible to a circle, most effectively prevents warpage, as will be explained with reference to experimental results described below.
  • the flip chip BGA board 10 may be a board used in BOC (Board On Chip), CSP (Chip Scale Package), and UTFCB (Ultra Thin Flexible Circuit Board) technologies. Also, the board 10 may be formed in multiple layers of 6 layers or more.
  • FIG. 5 illustrates a flip chip BGA board 20 having a polygonal shape, based on another embodiment of the invention.
  • the flip chip BGA board 20 illustrated in FIG. 5 has a hexagonal shape.
  • the invention is not limited to a hexagonal shape, and any shape may be used, such as an octagonal or a dodecagonal shape, such that the comers of the board are removed as much as possible to minimize deformation due to heat.
  • FIG. 6 illustrates a circular flip chip BGA board 30 , based on another embodiment of the invention. As seen in FIG. 6 , forming the board to have a circular shape removes the comers, so that warpage due to heat is minimized.
  • Typical methods of removing the comers of the flip chip BGA board 10 , 20 , 30 include using a saw or a router.
  • a router may be preferable.
  • punching using a cast it may be preferable to employ punching using a cast.
  • Polymer type flip chip BGA's having a core thickness of 0.1 mm and dimensions of 37.5 mm ⁇ 37.5 mm were stacked in 6 layers, and the temperature was decreased from 175° C. to 25° C.
  • the warpage of the board due to heat was measured using a square flip chip BGA board such as that shown in FIG. 2 .
  • FIGS. 7 a to 7 c The warpage of the board in each Experiment Case is as illustrated in FIGS. 7 a to 7 c .
  • the warpage due to heat of a conventional board according to the Comparison Example is as illustrated in FIG. 3 .
  • the (+) sign represents warpage of the board in the upward direction
  • the ( ⁇ ) sign represents warpage of the board in the downward direction.
  • a flip chip BGA board is provided in which the corners are evenly removed to minimize deformation due to heat.
  • a flip chip BGA board based on the present invention, it is possible to produce thin boards since the deformation due to heat is minimized. Also according to the present invention, a flip chip BGA board may be provided which is high in reliability, since the risk of the chip being separated from the board is reduced.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

A flip chip BGA board is disclosed, in which each of the corners of the board is removed to minimize warpage of the board due to heat applied during the manufacturing process. Embodiments of the invention allow the production of thin boards by preventing warpage of the board, and may provide a board high in reliability since the risk of the chip being separated from the board is reduced.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • This application claims the benefit of Korean Patent Application No. 2005-62274 filed with the Korea Industrial Property Office on Jul. 11, 2005, the disclosure of which is incorporated herein by reference.
    • BACKGROUND
  • 1. Technical Field
  • The present invention relates to a flip chip ball grid array (hereinafter referred to as “flip chip BGA”) board, and in particular, to a flip chip BGA board in which heat deformation is minimized by evenly removing the corners of a quadrilateral board.
  • 2. Description of the Related Art
  • The conventional package —made by attaching a chip to a lead frame, connecting the pads of the chip with the leads, and sealing with resin —was large and heavy, and required a substantial length of wiring for its mounting. As a solution to these problems, the flip chip BGA package was developed, in which a chip is attached to an epoxy or ceramic board, and round solder balls are used as the leads.
  • The manufacturing method of a typical flip chip BGA package is described below with reference to FIGS. 1 (a) to (h).
  • (a) Aluminum pads 2 are formed on a semiconductor chip 1, and the semiconductor chip 1 is covered with a protective layer 3. (b) A metal layer 4 is formed by sputtering and is connected with the pads 2. (c) Photoresist 5 is applied so that only the regions of the pads 2 are exposed. (d) Lead coating 6 is applied on the regions of the pads 2 that are not masked by the photoresist 5. (e) The overlaying photoresist 5 is removed. (f) The metal layer 4 is removed by etching in the regions excluding the portions where the lead coating 6 is applied. (g) Heat is-applied to render the lead coating 6 a round form. (h) The bumped chip manufactured as above is joined to the flip chip BGA board 8. The joining method consists of depositing in a reflow device, heating the board 8 to a high temperature to melt the lead coating 6, and contacting the contact pads 10 of the flip chip BGA board 8 with the pads 2 of the chip 1. Then, resin is filled between the flip chip BGA board 8 and the chip 1 via an underfilling process.
  • As discussed above, the manufacture of a flip chip BGA entails the application of a large amount of heat, during the process of rounding the lead coating 6 as in (g) and during the reflow process as in (h). During the reflow process in particular, since it is needed to melt the lead coating 6, a high temperature generally of about 225 ° C. is applied, which causes warpage in the flip chip BGA board 8.
  • FIG. 2 is a perspective view of a conventional flip chip BGA package. The conventional flip chip BGA board 8 is generally formed as a quadrilateral.
  • FIG. 3 illustrates the degree of warpage developed on the flip chip BGA board 8 after manufacture. As seen in FIG. 3, the degree of warpage is the greatest at the edges of the flip chip BGA board 8, so that it is warped into a concave shape by heat. This warpage due to heat as illustrated in FIG. 3 is especially significant in a thin board such as a UTFCB (Ultra Thin Flexible Circuit Board) having a core thickness of 0.4 mm or less.
  • The thinner the flip chip BGA board 8, the greater is the degree of warpage. Thus, in spite of the recent trends toward boards with smaller sizes and more sophisticated functionalities, this warpage due to heat not only makes it difficult to mount the chip, but also causes the chip to be peeled off from the board. Also, this warpage becomes an obstacle to making thin boards.
    • SUMMARY
  • As a solution to the foregoing problems of prior art, one aspect of the present invention provides a flip chip BGA board manufactured to be polygonal, rounded, or circular, to minimize deformation due to heat.
  • Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
  • According to a first embodiment of the invention, a flip chip BGA board used in a flip chip BGA package may have comers of the board evenly removed to form a polygonal shape. Thus, by removing each comer of a conventional flip chip BGA board, the warpage of the board due to heat may be minimized. The board may be formed in a variety of shapes, such as a hexagonal or an octagonal shape.
  • In a second embodiment of the invention, a flip chip BGA board used in a flip chip BGA package may have comers of the board rounded in equal radii of curvature.
  • In a third embodiment of the invention, a flip chip BGA board used in a flip chip BGA package may be circular.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • These and/or other aspects and advantages of the invention will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
  • Figs. l(a) through 1(h) are cross-sectional views illustrating the manufacturing process of a typical flip chip BGA package.
  • FIG. 2 illustrates the distribution of warpage due to heat generated on a conventional board.
  • FIG. 3 illustrates the distribution of warpage due to heat generated on a conventional thin flip chip ball grid array board.
  • FIG. 4 is a schematic diagram illustrating a rounded flip chip ball grid array board based on an embodiment of the invention.
  • FIG. 5 is a schematic diagram illustrating a polygonal flip chip ball grid array board based on an embodiment of the invention.
  • FIG. 6 is a schematic diagram illustrating a circular flip chip ball grid array board based on an embodiment of the invention.
  • FIG. 7 a illustrates the distribution of warpage due to heat generated on a rounded flip chip ball grid array board based on an embodiment of the invention.
  • FIG. 7 b illustrates the distribution of warpage due to heat generated on a polygonal flip chip ball grid array board based on an embodiment of the invention.
  • FIG. 7 c illustrates the distribution of warpage due to heat generated on a circular flip chip ball grid array board based on an embodiment of the invention.
    • DETAILED DESCRIPTION
  • Hereinafter, the board with comers removed, according to embodiments of the present invention will be described in more detail with reference to the accompanying drawings.
  • FIG. 4 illustrates a rounded flip chip BGA board 10, based on an embodiment of the invention. The flip chip BGA board 10 has each of the four comers rounded identically. It is preferable that the radius of curvature of each comer be made equal or very similar to prevent warpage due to heat as much as possible. Here, making the radii of curvature great, so that the board is as close as possible to a circle, most effectively prevents warpage, as will be explained with reference to experimental results described below. The flip chip BGA board 10 may be a board used in BOC (Board On Chip), CSP (Chip Scale Package), and UTFCB (Ultra Thin Flexible Circuit Board) technologies. Also, the board 10 may be formed in multiple layers of 6 layers or more.
  • FIG. 5 illustrates a flip chip BGA board 20 having a polygonal shape, based on another embodiment of the invention. The flip chip BGA board 20 illustrated in FIG. 5 has a hexagonal shape. Of course, the invention is not limited to a hexagonal shape, and any shape may be used, such as an octagonal or a dodecagonal shape, such that the comers of the board are removed as much as possible to minimize deformation due to heat. Also, it is preferable to use a shape having as many sides as possible, so that the shape of the board is as close as possible to a circle.
  • FIG. 6 illustrates a circular flip chip BGA board 30, based on another embodiment of the invention. As seen in FIG. 6, forming the board to have a circular shape removes the comers, so that warpage due to heat is minimized.
  • Typical methods of removing the comers of the flip chip BGA board 10, 20, 30 include using a saw or a router. In particular, in forming the flip chip BGA board 10, 20, 30 to have a polygonal, rounded, or circular shape as in the embodiments set forth above, a router may be preferable. Also, when the board is thin, it may be preferable to employ punching using a cast.
  • Hereinafter, warpage due to heat in the foregoing embodiments of the invention will be explained with reference to experimental results.
  • Experiment: Deformation due to heat according to the shape of the board
  • Experiment Conditions
  • Polymer type flip chip BGA's having a core thickness of 0.1 mm and dimensions of 37.5 mm ×37.5 mm were stacked in 6 layers, and the temperature was decreased from 175° C. to 25° C.
  • Experiment Cases 1 to 3
  • The warpage of the board according to changes in heat was measured, with a rounded flip chip BGA board 10 for Experiment Case 1, a polygonal flip chip BGA board 20 for Experiment Case 2, and a circular flip chip BGA board 30 for Experiment Case 3.
  • Comparison Example
  • The warpage of the board due to heat was measured using a square flip chip BGA board such as that shown in FIG. 2.
  • Experiment Results
  • The warpage of the board in each Experiment Case is as illustrated in FIGS. 7 a to 7 c. The warpage due to heat of a conventional board according to the Comparison Example is as illustrated in FIG. 3. In FIG. 3 and FIGS. 7 a to 7 c, the (+) sign represents warpage of the board in the upward direction, and the (−) sign represents warpage of the board in the downward direction.
  • As in the Comparison Example illustrated in FIG. 1, for a conventional quadrilateral board, warpage is developed principally in each of the comers.
  • Referring to FIGS. 7 a to 7 c, there is less deformation due to heat in a polygonal board (Experiment Case 2) than in a rounded board (Experiment Case 1). Also, there is less deformation due to heat in a circular board (Experiment Case 3) than in a polygonal board (Experiment Case 2).
  • The relative percentages of warpage of Experiment Cases 1 to 3 with respect to that of the Comparison Example is listed below in Table 1.
    TABLE 1
    Degree of Warpage in Relation to
    Shape of Board Quadrilateral Board
    Rounded (Experiment Case 1) 17.81%
    Polygonal (Experiment Case 2) 13.05%
    Circular (Experiment Case 3) 12.61%
  • As seen in Table 1, it is found that the degrees of warpage are decreased according to the degrees to which the corners of the boards are removed, from the rounded to the polygonal and to the circular boards.
  • According to the present invention comprised as above mentioned, a flip chip BGA board is provided in which the corners are evenly removed to minimize deformation due to heat.
  • With a flip chip BGA board based on the present invention, it is possible to produce thin boards since the deformation due to heat is minimized. Also according to the present invention, a flip chip BGA board may be provided which is high in reliability, since the risk of the chip being separated from the board is reduced.
  • Although a few embodiments of the invention have been shown and described, it will be appreciated by those skilled in the art that changes may be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (4)

1. A flip chip BGA board used in a flip chip BGA package, wherein corners of the board are evenly removed to form a polygonal shape.
2. The flip chip BGA board of claim 1, wherein the flip chip BGA board has a hexagonal shape.
3. A flip chip BGA board used in a flip chip BGA package, wherein the corners of the board are rounded in equal radii of curvature.
4. A flip chip BGA board used in a flip chip BGA package, wherein the board is circular.
US11/483,844 2005-07-11 2006-07-11 Polygonal, rounded, and circular flip chip ball grid array board Abandoned US20070018335A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020050062274A KR100652549B1 (en) 2005-07-11 2005-07-11 Polygonal, rounded and circular flip chip ball grid array board
KR10-2005-0062274 2005-07-11

Publications (1)

Publication Number Publication Date
US20070018335A1 true US20070018335A1 (en) 2007-01-25

Family

ID=37609718

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/483,844 Abandoned US20070018335A1 (en) 2005-07-11 2006-07-11 Polygonal, rounded, and circular flip chip ball grid array board

Country Status (5)

Country Link
US (1) US20070018335A1 (en)
JP (1) JP2007027699A (en)
KR (1) KR100652549B1 (en)
CN (1) CN1897263A (en)
TW (1) TWI307550B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080014911A1 (en) * 2006-07-13 2008-01-17 Jonathan William Medved Group sharing of media content
WO2017112350A1 (en) * 2015-12-26 2017-06-29 Intel Corporation Non-rectangular electronic device components
US20180012847A1 (en) * 2015-05-18 2018-01-11 Denso Corporation Semiconductor device
US11093011B2 (en) * 2019-09-04 2021-08-17 Samsung Display Co., Ltd. Display device
US11676913B2 (en) 2020-05-12 2023-06-13 Samsung Electronics Co., Ltd. Semiconductor package

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10211175B2 (en) 2012-11-30 2019-02-19 International Business Machines Corporation Stress-resilient chip structure and dicing process

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5669780A (en) * 1995-03-30 1997-09-23 Enplas Corporation IC socket
US5731231A (en) * 1996-03-15 1998-03-24 Kabushiki Kaisha Toshiba Semiconductor apparatus, fabrication method therefor and board frame
US5834843A (en) * 1994-06-20 1998-11-10 Fujitsu Limited Multi-chip semiconductor chip module
US6166435A (en) * 1998-12-10 2000-12-26 Industrial Technology Research Institute Flip-chip ball grid array package with a heat slug
US6664620B2 (en) * 1999-06-29 2003-12-16 Intel Corporation Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer
US6861858B2 (en) * 2002-01-24 2005-03-01 Scs Hightech, Inc. Vertical probe card and method for using the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5834843A (en) * 1994-06-20 1998-11-10 Fujitsu Limited Multi-chip semiconductor chip module
US6287949B1 (en) * 1994-06-20 2001-09-11 Fujitsu Limited Multi-chip semiconductor chip module
US5669780A (en) * 1995-03-30 1997-09-23 Enplas Corporation IC socket
US5731231A (en) * 1996-03-15 1998-03-24 Kabushiki Kaisha Toshiba Semiconductor apparatus, fabrication method therefor and board frame
US6166435A (en) * 1998-12-10 2000-12-26 Industrial Technology Research Institute Flip-chip ball grid array package with a heat slug
US6664620B2 (en) * 1999-06-29 2003-12-16 Intel Corporation Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer
US6861858B2 (en) * 2002-01-24 2005-03-01 Scs Hightech, Inc. Vertical probe card and method for using the same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080014911A1 (en) * 2006-07-13 2008-01-17 Jonathan William Medved Group sharing of media content
US20180012847A1 (en) * 2015-05-18 2018-01-11 Denso Corporation Semiconductor device
US10002837B2 (en) * 2015-05-18 2018-06-19 Denso Corporation Semiconductor device
US10366957B2 (en) 2015-05-18 2019-07-30 Denso Corporation Semiconductor device
WO2017112350A1 (en) * 2015-12-26 2017-06-29 Intel Corporation Non-rectangular electronic device components
US11093011B2 (en) * 2019-09-04 2021-08-17 Samsung Display Co., Ltd. Display device
US11599162B2 (en) * 2019-09-04 2023-03-07 Samsung Display Co., Ltd. Display device
US11676913B2 (en) 2020-05-12 2023-06-13 Samsung Electronics Co., Ltd. Semiconductor package

Also Published As

Publication number Publication date
KR100652549B1 (en) 2006-12-01
TW200703608A (en) 2007-01-16
JP2007027699A (en) 2007-02-01
TWI307550B (en) 2009-03-11
CN1897263A (en) 2007-01-17

Similar Documents

Publication Publication Date Title
JPH0927568A (en) Method of flattening solder ball of ball grid array semiconductor package using solder ball as input-output terminal and its substrate structure
US7772685B2 (en) Stacked semiconductor structure and fabrication method thereof
US7538421B2 (en) Flip-chip package structure with stiffener
US9741668B2 (en) Semiconductor packages having residual stress layers and methods of fabricating the same
US8803300B2 (en) Integrated circuit packaging system with protective coating and method of manufacture thereof
US10163662B2 (en) Fabrication method of semiconductor package
US20070018335A1 (en) Polygonal, rounded, and circular flip chip ball grid array board
JP2008078367A (en) Semiconductor device
US10832999B2 (en) Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substrates
JP2008537336A (en) Structure of rigid corrugated pattern on chip carrier substrate and printed circuit board for semiconductor and electronic subsystem packaging
US11646248B2 (en) Semiconductor device having a lead flank and method of manufacturing a semiconductor device having a lead flank
US6909166B2 (en) Leads of a no-lead type package of a semiconductor device
US7795718B2 (en) Warpage resistant semiconductor package and method for manufacturing the same
US20200105640A1 (en) Semiconductor device
US20070045821A1 (en) Printed circuit board with dual type inner structure
TWI720846B (en) Package stiffener for protecting semiconductor die
US20230411332A1 (en) Wafer level chip scale package having varying thicknesses
US8952523B2 (en) Integrated circuit package lid configured for package coplanarity
JP4103888B2 (en) Semiconductor device
US20050146050A1 (en) Flip chip package structure and chip structure thereof
TWI740625B (en) Integrated circuit package structure and method of manufacture
KR0122847B1 (en) Preventing method for bending of an integrated circuit package
TWI642133B (en) Mounting method for electronic component and carrying jig applying the mounting method
US20070049000A1 (en) Method for re-forming BGA of a semiconductor package
JP2000200851A (en) Multi-chip semiconductor device

Legal Events

Date Code Title Description
AS Assignment

Owner name: SAMSUNG ELECTRO-MECHANICS CO., LTD., KOREA, REPUBL

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHO, SEUNG-HYUN;CHO, SOON-JIN;LEE, JAE-JOON;AND OTHERS;REEL/FRAME:018051/0842

Effective date: 20060503

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION