US20060102325A1 - Guiding fin heat sink - Google Patents

Guiding fin heat sink Download PDF

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Publication number
US20060102325A1
US20060102325A1 US10/989,324 US98932404A US2006102325A1 US 20060102325 A1 US20060102325 A1 US 20060102325A1 US 98932404 A US98932404 A US 98932404A US 2006102325 A1 US2006102325 A1 US 2006102325A1
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US
United States
Prior art keywords
heat
dissipating
base
dissipation unit
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/989,324
Inventor
Nien-Lun Li
Yun-Yeu Yeh
To Hsu
Hung-Chung Chu
Cheng-Hsing Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Datech Technology Co Ltd
Detech Technology Co Ltd
Original Assignee
Detech Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Detech Technology Co Ltd filed Critical Detech Technology Co Ltd
Priority to US10/989,324 priority Critical patent/US20060102325A1/en
Assigned to DATECH TECHLOLOGY CO., LTD. reassignment DATECH TECHLOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LI, NIEN-LUN, CHU, HUNG-CHUNG, HSU, TO, LEE, CHENG-HSING, YEH, YUN-YEU
Publication of US20060102325A1 publication Critical patent/US20060102325A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat sink and its method thereof; more particularly, relates to a guiding fin heat sink and its method where heat generated by a CPU can be directly dissipated out from the computer case to prevent from heat recycling and to obtain better heat-dissipation efficiency.
  • a heat sink according to a prior art comprises a heat-dissipation unit and a fan thereon.
  • the heat-dissipation unit comprises a base and a plurality of fins extended up from the base.
  • the base is stuck on a CPU of a main board so that heat generated by the CPU on operating is transmitted to the fins through the base; an air flow is directed to the fins to carry out the heat; and then, the air flow with the heat is absorbed by another fan on the computer case to be flown out for heat dissipation.
  • the above heat sink according to the prior art utilizes a fan to guide an air flow to the fins for heat dissipation. But, because the air flow is directly directed to the base and the fins by the fan, when the air flow with heat is flown from between the fins, the air flow with heat will be remained in the computer case. And, because the another fan on the computer case is far from the heat-dissipation device on the main board, when the air flow with heat is not yet absorbed and blown out of the computer case by the another fan on the computer case, the air flow with heat will be directly directed to the base and the fins so that a heat recycling and bad heat-dissipation efficiency occurs.
  • the main purpose of the present invention is that: absorbing heat generated by a CPU through a base and guiding it to a heat-dissipation unit and more than one heat pipe; and dissipating the heat in the heat-dissipation unit and the heat pipe out to the outside of a computer case, to prevent from heat re-cycling in the computer case and to achieve better heat dissipation efficiency.
  • the present invention is a guiding fin heat sink and a method thereof, where the sink comprises a base, a heat-dissipation unit deposed on a surface of the base, more than one heat pipe deposed between the base and the heat-dissipation unit, and a fan on an end-surface at a side of the heat-dissipation unit; and the method comprises the following steps:
  • the heat generated by the CPU can be absorbed by the base to be directed to the heat-dissipation unit and the heat pipe and then to be directly directed out of the computer case by the fan.
  • FIG. 1 is a perspective view according to a first embodiment of the present invention
  • FIG. 2 is a top view according to the first embodiment of the present invention.
  • FIG. 3A is a view showing a status of use according to the first embodiment of the present invention.
  • FIG. 3B is a view showing a status of use according to a second embodiment of the present invention.
  • FIG. 4 is a view showing a status of use according to a third embodiment of the present invention.
  • FIG. 5 is a perspective view according to a prior art.
  • FIG. 1 through FIG. 4 are a perspective view, a top view, and a view showing a status of use, according to the first embodiment of the present invention; and views showing a status of use according to a second embodiment and a third embodiment of the present invention.
  • the present invention is a guiding fin heat sink, comprising a base 1 , a heat-dissipation unit 2 , more than one heat pipe 3 and a fan 4 , where heat absorbed by the base 1 can be transmitted to the heat-dissipation unit 2 and the heat pipe 3 and then can be directly directed out of a computer case by the fan 4 .
  • the base 1 can be made of alumni, copper, alumni alloy or copper alloy which has better heat dissipation efficiency.
  • the heat-dissipation unit 2 made of alumni, copper, alumni alloy or copper alloy with better heat dissipation efficiency, is deposed on a surface of the base 1 , comprising a curved surface opposite to the surface contacting the base 1 ; more than one guiding channel 23 passing through at least two end surfaces of said heat-dissipation unit 2 ; a first 21 and a second 22 heat-dissipating parts with a plurality of fins 211 , 221 ; and more than one slanting part 24 , 25 extending from two ends of the first 21 and the second 22 heat-dissipating parts while the slanting parts 24 , 25 are slanted opposite to each neighboring other.
  • the heat pipe 3 is located between the base 1 and the heat-dissipation unit 2 while the other end is made penetrating through the guiding channels 23 .
  • the heat pipe 3 can be curved in a ‘U’ shape; can be a pipe filled with liquid inside while producing capillary attraction; or can be a circuit-type pipe.
  • the fan 4 is deposed on an end surface of the heat-dissipation unit 2 or an opening of a computer case.
  • a heat-dissipating method using the above guiding fin heat sink comprises the following steps:
  • (b) Depose a heat-dissipation unit 2 on the opposite surface of the base 1 to the CPU 51 , which is made of a material with better heat-dissipation efficiency like alumni, copper, alumni alloy or copper alloy.
  • the heat-dissipation unit 2 comprises more than one guiding channel 23 passing through at least two end surfaces of the heat-dissipation unit 2 .
  • the heat-dissipation unit 2 consists of a first 21 and a second 22 heat-dissipating parts of a plurality of fins 211 , 221 .
  • More than one slanting part 24 , 25 extends from two ends of the first 21 and the second 22 heat-dissipating parts, where the slanting parts 24 , 25 are slanted opposite to each neighboring other.
  • more than one heat pipe 3 is deposed between the base 1 and the heat-dissipation unit 2 with one end; and the other end is made penetrating through the more than one guiding channel of the heat-dissipation unit 2 .
  • the heat pipe can be curved in a ‘U’ shape.
  • the heat pipe 3 can be a pipe filled with liquid inside while producing capillary attraction; or can be a circuit-type pipe.
  • an end of the more than one guiding channel is corresponding to an opening (not shown in the figures) of a side wall of the computer case.
  • a fan is deposed between the opening of the computer case and an end surface of the more than one guiding channel (as shown in FIG. 3A ) so that, after heat generated by the CPU is absorbed by the base 1 , the heat directed to the heat-dissipation unit 2 and the heat pipe 3 is then directed out to the outside of the computer case 6 through the opening.
  • the fan can not only be deposed between the opening of the computer case and the heat-dissipation unit but also can be deposed outside of the opening of the computer case (as shown in FIG. 3B ), so that, after heat generated by the CPU is absorbed by the base 1 and then is directed to the heat-dissipation unit 2 and the heat pipe 3 , an air flow is directed into the guiding channel by the fan to make the heat be directly carried out of the computer case 6 through the opening.
  • the present invention is a guiding fin heat sink, where heat generated by a CPU is directly dissipated out to the outside of the computer case to prevent from heat recycling and to obtain better heat-dissipation efficiency.

Abstract

The present invention is a guiding fin heat sink, where a heat-dissipation unit is stuck on a CPU by a base and the unit has guiding channels passing through two ends; heat pipes are located between the base and the unit at one end, the other end is made penetrating through the guiding channels, and one end surface of the guiding channels is corresponding to an opening on a side wall of a computer case; and, after the heat of the CPU is absorbed by the base, it is directed to the heat-dissipation unit and the heat pipes and is carried to the outside of the computer case by an air flow made a fan between the case and the unit, so that no heat re-cycling is in the case and better heat dissipation efficiency is obtained.

Description

    FIELD OF THE INVENTION
  • The present invention relates to a heat sink and its method thereof; more particularly, relates to a guiding fin heat sink and its method where heat generated by a CPU can be directly dissipated out from the computer case to prevent from heat recycling and to obtain better heat-dissipation efficiency.
    • DESCRIPTION OF THE RELATED ART
  • A heat sink according to a prior art, as shown in FIG. 5, comprises a heat-dissipation unit and a fan thereon. The heat-dissipation unit comprises a base and a plurality of fins extended up from the base. When utilizing, the base is stuck on a CPU of a main board so that heat generated by the CPU on operating is transmitted to the fins through the base; an air flow is directed to the fins to carry out the heat; and then, the air flow with the heat is absorbed by another fan on the computer case to be flown out for heat dissipation.
  • The above heat sink according to the prior art utilizes a fan to guide an air flow to the fins for heat dissipation. But, because the air flow is directly directed to the base and the fins by the fan, when the air flow with heat is flown from between the fins, the air flow with heat will be remained in the computer case. And, because the another fan on the computer case is far from the heat-dissipation device on the main board, when the air flow with heat is not yet absorbed and blown out of the computer case by the another fan on the computer case, the air flow with heat will be directly directed to the base and the fins so that a heat recycling and bad heat-dissipation efficiency occurs.
    • SUMMARY OF THE INVENTION
  • Therefore, the main purpose of the present invention is that: absorbing heat generated by a CPU through a base and guiding it to a heat-dissipation unit and more than one heat pipe; and dissipating the heat in the heat-dissipation unit and the heat pipe out to the outside of a computer case, to prevent from heat re-cycling in the computer case and to achieve better heat dissipation efficiency.
  • In order to achieve the above purpose, the present invention is a guiding fin heat sink and a method thereof, where the sink comprises a base, a heat-dissipation unit deposed on a surface of the base, more than one heat pipe deposed between the base and the heat-dissipation unit, and a fan on an end-surface at a side of the heat-dissipation unit; and the method comprises the following steps:
  • (a) obtaining a heat-dissipation unit which is deposed on a CPU of a main board by a base
  • (b) Corresponding more than one guiding channel of the heat-dissipation unit to an opening on a side wall of a computer case; and
  • (c) Deposing a fan on the opening of the computer case, where, after absorbing heat generated by the CPU through the base, the heat is directly directed out of the computer case by the fan.
  • Accordingly, the heat generated by the CPU can be absorbed by the base to be directed to the heat-dissipation unit and the heat pipe and then to be directly directed out of the computer case by the fan.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The present invention will be better understood from the following detailed descriptions of the preferred embodiments according to the present invention, taken in conjunction with the accompanying drawings, in which
  • FIG. 1 is a perspective view according to a first embodiment of the present invention;
  • FIG. 2 is a top view according to the first embodiment of the present invention;
  • FIG. 3A is a view showing a status of use according to the first embodiment of the present invention;
  • FIG. 3B is a view showing a status of use according to a second embodiment of the present invention;
  • FIG. 4 is a view showing a status of use according to a third embodiment of the present invention; and
  • FIG. 5 is a perspective view according to a prior art.
    • DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • The following descriptions of the preferred embodiments are provided to understand the features and the structures of the present invention.
  • Please refer to FIG. 1 through FIG. 4, which are a perspective view, a top view, and a view showing a status of use, according to the first embodiment of the present invention; and views showing a status of use according to a second embodiment and a third embodiment of the present invention. As shown in the figures, the present invention is a guiding fin heat sink, comprising a base 1, a heat-dissipation unit 2, more than one heat pipe 3 and a fan 4, where heat absorbed by the base 1 can be transmitted to the heat-dissipation unit 2 and the heat pipe 3 and then can be directly directed out of a computer case by the fan 4.
  • The base 1 can be made of alumni, copper, alumni alloy or copper alloy which has better heat dissipation efficiency.
  • The heat-dissipation unit 2, made of alumni, copper, alumni alloy or copper alloy with better heat dissipation efficiency, is deposed on a surface of the base 1, comprising a curved surface opposite to the surface contacting the base 1; more than one guiding channel 23 passing through at least two end surfaces of said heat-dissipation unit 2; a first 21 and a second 22 heat-dissipating parts with a plurality of fins 211,221; and more than one slanting part 24,25 extending from two ends of the first 21 and the second 22 heat-dissipating parts while the slanting parts 24,25 are slanted opposite to each neighboring other.
  • An end of the heat pipe 3 is located between the base 1 and the heat-dissipation unit 2 while the other end is made penetrating through the guiding channels 23. The heat pipe 3 can be curved in a ‘U’ shape; can be a pipe filled with liquid inside while producing capillary attraction; or can be a circuit-type pipe.
  • The fan 4 is deposed on an end surface of the heat-dissipation unit 2 or an opening of a computer case.
  • By the above structure, a guiding fin heat sink is obtained.
  • A heat-dissipating method using the above guiding fin heat sink comprises the following steps:
  • (a) Obtain a base made of alumni, copper, alumni alloy or copper alloy which has better heat dissipation efficiency. The base 1 is stuck on a CPU 51 of a main board 5 (as shown in FIG. 3A).
  • (b) Depose a heat-dissipation unit 2 on the opposite surface of the base 1 to the CPU 51, which is made of a material with better heat-dissipation efficiency like alumni, copper, alumni alloy or copper alloy. The heat-dissipation unit 2 comprises more than one guiding channel 23 passing through at least two end surfaces of the heat-dissipation unit 2. The heat-dissipation unit 2 consists of a first 21 and a second 22 heat-dissipating parts of a plurality of fins 211,221. More than one slanting part 24,25 extends from two ends of the first 21 and the second 22 heat-dissipating parts, where the slanting parts 24,25 are slanted opposite to each neighboring other. And, more than one heat pipe 3 is deposed between the base 1 and the heat-dissipation unit 2 with one end; and the other end is made penetrating through the more than one guiding channel of the heat-dissipation unit 2. So, the heat pipe can be curved in a ‘U’ shape. The heat pipe 3 can be a pipe filled with liquid inside while producing capillary attraction; or can be a circuit-type pipe. And, an end of the more than one guiding channel is corresponding to an opening (not shown in the figures) of a side wall of the computer case.
  • (c) A fan is deposed between the opening of the computer case and an end surface of the more than one guiding channel (as shown in FIG. 3A) so that, after heat generated by the CPU is absorbed by the base 1, the heat directed to the heat-dissipation unit 2 and the heat pipe 3 is then directed out to the outside of the computer case 6 through the opening.
  • The fan can not only be deposed between the opening of the computer case and the heat-dissipation unit but also can be deposed outside of the opening of the computer case (as shown in FIG. 3B), so that, after heat generated by the CPU is absorbed by the base 1 and then is directed to the heat-dissipation unit 2 and the heat pipe 3, an air flow is directed into the guiding channel by the fan to make the heat be directly carried out of the computer case 6 through the opening.
  • Or, one can also make an end of the more than one guiding channel corresponding to the opening of the computer case and depose the fan on the opposite end surface of the guiding channel, so that, after heat generated by the CPU is absorbed by the base 1 and then is directed to the heat-dissipation unit 2 and the heat pipe 3, an air flow is directed into the guiding channel by the fan to make the heat be directly carried out of the computer case 6 through the opening.
  • To sum up, the present invention is a guiding fin heat sink, where heat generated by a CPU is directly dissipated out to the outside of the computer case to prevent from heat recycling and to obtain better heat-dissipation efficiency.
  • The preferred embodiments herein disclosed are not intended to unnecessarily limit the scope of the invention. Therefore, simple modifications or variations belonging to the equivalent of the scope of the claims and the instructions disclosed herein for a patent are all within the scope of the present invention.

Claims (20)

1. A guiding fin heat sink, comprising:
a base;
a heat-dissipation unit deposed on a surface of said base, having a curved end surface which is opposite to an end surface stuck on said surface of said base, and more than one guiding channel which is made passing through at least two other end surfaces of said heat-dissipation unit;
more than one heat pipe, having one end which is deposed between said base and said heat-dissipation unit, and the other end which is made penetrating through said more than one guiding channel; and
a fan deposed on an end surface of said heat-dissipation unit.
2. The heat sink according to claim 1, wherein said base is made of which is selected from a group consisting of alumni, copper, alumni alloy and copper alloy.
3. The heat sink according to claim 1,
wherein said heat-dissipation unit comprises a first heat-dissipating part and a second heat-dissipating part; and
wherein more than one slanting part is located at each of two ends of said first heat-dissipating part and said second heat-dissipating part and is extended out each of two ends of said guiding channel.
4. The heat sink according to claim 3, wherein each of said slanting part of said first heat-dissipating part and said second heat-dissipating part is slanted opposite to each neighboring other.
5. The heat sink according to claim 3, wherein said first heat-dissipating part and said second heat-dissipating part comprises a plurality of heat-dissipating fins.
6. The heat sink according to claim 1, wherein said heat-dissipation unit is made of which is selected from a group consisting of alumni, copper, alumni alloy and copper alloy.
7. The heat sink according to claim 1, wherein said heat pipe is curved in a ‘U’ shape.
8. The heat sink according to claim 1, wherein said heat pipe is a pipe filled with liquid inside while producing capillary attraction.
9. The heat sink according to claim 1, wherein said heat pipe is a circuit-type pipe.
10. A heat-dissipating method using a guiding fin heat sink, comprising the following steps:
(a) Obtaining a heat-dissipation unit to be deposed on a CPU of a main board by a base;
(b) Corresponding an end of more than one guiding channel of said heat-dissipation unit to an opening on a side wall of a computer case; and
(c) Deposing a fan on said opening of said computer case, wherein, after absorbing heat generated by said CPU through said base, said heat is directly directed out of said computer case by said fan.
11. A heat-dissipating method according to claim 10, wherein said base is made of which is selected from a group consisting of alumni, copper, alumni alloy and copper alloy.
12. A heat-dissipating method according to claim 10,
wherein said heat-dissipation unit comprises a first heat-dissipating part and a second heat-dissipating part; and
wherein more than one slanting part is located at each of two ends of said first heat-dissipating part and said second heat-dissipating part and is extended out each of two ends of said guiding channel.
13. A heat-dissipating method according to claim 10, wherein each of said slanting part of said first heat-dissipating part and said second heat-dissipating part is slanted opposite to each neighboring other.
14. A heat-dissipating method according to claim 10, wherein said first heat-dissipating part and said second heat-dissipating part comprises a plurality of heat-dissipating fins.
15. A heat-dissipating method according to claim 10, wherein said heat-dissipation unit is made of which is selected from a group consisting of alumni, copper, alumni alloy and copper alloy.
16. A heat-dissipating method according to claim 10, wherein more than one heat pipe is deposed between said base and said heat-dissipation unit at one end and the other end is made penetrating through said more than one guiding channel.
17. A heat-dissipating method according to claim 10, wherein said heat pipe is curved in a ‘U’ shape.
18. A heat-dissipating method according to claim 10, wherein said heat pipe is a pipe filled with liquid inside while producing capillary attraction.
19. A heat-dissipating method according to claim 10, wherein said heat pipe is a circuit-type pipe.
20. A heat-dissipating method according to claim 10, wherein said step (c) is corresponding an end of said guiding channel to an opening of said computer case; deposing a fan at an opposite end of said guiding channel; and, after heat generated by CPU is absorbed by said base, guiding an air flow into said guiding channel to make said heat be directly carried out of said computer case.
US10/989,324 2004-11-17 2004-11-17 Guiding fin heat sink Abandoned US20060102325A1 (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080105409A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes
EP1981080A2 (en) * 2007-04-10 2008-10-15 Fujikura, Ltd. Heat sink
US20110304978A1 (en) * 2010-06-10 2011-12-15 Hon Hai Precision Industry Co., Ltd. Enclosure of electronic device
US10998253B1 (en) 2019-12-23 2021-05-04 Google Llc Fluid diverting heat sink
US11039550B1 (en) 2020-04-08 2021-06-15 Google Llc Heat sink with turbulent structures

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080105409A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes
EP1981080A2 (en) * 2007-04-10 2008-10-15 Fujikura, Ltd. Heat sink
US20080251239A1 (en) * 2007-04-10 2008-10-16 Fujikura Ltd. Heat sink
EP1981080A3 (en) * 2007-04-10 2011-03-02 Fujikura, Ltd. Heat sink
US7942194B2 (en) 2007-04-10 2011-05-17 Fujikura Ltd. Heat sink
US20110304978A1 (en) * 2010-06-10 2011-12-15 Hon Hai Precision Industry Co., Ltd. Enclosure of electronic device
US10998253B1 (en) 2019-12-23 2021-05-04 Google Llc Fluid diverting heat sink
US11039550B1 (en) 2020-04-08 2021-06-15 Google Llc Heat sink with turbulent structures
US11574850B2 (en) 2020-04-08 2023-02-07 Google Llc Heat sink with turbulent structures

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Owner name: DATECH TECHLOLOGY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LI, NIEN-LUN;YEH, YUN-YEU;HSU, TO;AND OTHERS;REEL/FRAME:015997/0703;SIGNING DATES FROM 20040630 TO 20040929

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION