US20040118552A1 - Heat-dissipating device - Google Patents

Heat-dissipating device Download PDF

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Publication number
US20040118552A1
US20040118552A1 US10/391,084 US39108403A US2004118552A1 US 20040118552 A1 US20040118552 A1 US 20040118552A1 US 39108403 A US39108403 A US 39108403A US 2004118552 A1 US2004118552 A1 US 2004118552A1
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United States
Prior art keywords
heat
fins
dissipating device
base
dissipating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/391,084
Inventor
Wen-Shi Huang
Kuo-Cheng Lin
Li-Kuang Tan
Yu-Hung Huang
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Delta Electronics Inc
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Assigned to DELTA ELECTRONICS, INC. reassignment DELTA ELECTRONICS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUANG, WEN-SHI, LIN, KUO-CHENG, TAN, LI-KUANG, HUANG, YU-HUNG
Assigned to DELTA ELECTRONICS, INC. reassignment DELTA ELECTRONICS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUANG, WEN-SHI, HUANG, YU-HUNG, LIN, KUO-CHENG, TAN, LI-KUANG
Publication of US20040118552A1 publication Critical patent/US20040118552A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates generally to a heat-dissipating device and, more particularly, to a heat sink, used in electronic components such as CPUs of computers, capable of effectively dissipating heat generated from the electronic components to the outside.
  • heat-dissipating devices or systems have become indispensable components. If the heat generated by individual components within the electronic device cannot be appropriately dissipated, in a less serious situation, the performance thereof is reduced, and in a more serious situation, the electronic device may be burnt and damaged. As a result, the surfaces or side-walls of the electronic component (for instance, the CPU of a computer) which produced a great amount of heat is generally mounted on a heat sink so as to dissipate the generated heat.
  • FIG. 1 there is shown a conventional heat sink 1 with a base 11 at the center and a plurality of heat-dissipation fins 12 extended outward from the base 11 .
  • the base 11 and the heat dissipation fins 12 are formed integrally as a unit.
  • the restrictions of the height and thickness of the fins 12 there exists the restrictions of the height and thickness of the fins 12 , and the distance between each of the fins 12 cannot be too small. Therefore, when the heat dissipation area of the heat sink 1 is increased, the entire volume of the heat sink is also increased.
  • a larger heat-dissipating area can be obtained, which effectively dissipates heat generated by the electronic components to the outside.
  • Another object of the invention is to provide an annular heat-dissipating device formed with a plurality of fins combined together, and the device provides a larger heat-dissipating area which effectively dissipates heat generated by the electronic element to the outside.
  • the heat-dissipating device includes a base, and a plurality of fins mounted around the periphery of the base, wherein a first end of each of the plurality of fins is coupled to the base after the base is formed.
  • each fin has a rectangular, triangular, trapezoidal, polygonal or irregular shape.
  • the fins are made from aluminum, copper, magnesium, an aluminum alloy, a copper alloy or a mixture thereof, or other thermally conductive material with high thermal conductivity.
  • the base is a pillar base with a circular, rectangular, triangular, trapezoidal or polygonal shape, or the base can be in a conical shape or an irregular shape.
  • the base is made from aluminum, copper, magnesium, an aluminum alloy, a copper alloy, or a mixture thereof, or other thermally conductive material with high thermal conductivity.
  • the fins are coupled to the base at their first ends by way of welding, adhesion, riveting, engaging or fastening.
  • the first ends of the fins are connected with each other by coupling, riveting, engaging or fastening so as to strengthen the heat-dissipating device.
  • the fins are connected with each other by means of at least a rim portion being disposed on second ends of the fins to strengthen the heat-dissipating device.
  • each of the fins is provided with a flange.
  • the flange is provided with at least a concave portion and at least an engagement portion which can respectively fasten with at least an engagement portion and at least a concave portion of another fin.
  • the second end of each of the fins is provided with at least a concave portion and at least an engagement portion, which can respectively fasten to at least an engagement portion and at least a concave portion of another fin.
  • the heat dissipation device further includes a plurality of bridge portions each connecting corresponding ends of each two fins.
  • the plurality of bridge portions and the plurality of fins are formed integrally as a unit.
  • FIG. 1 is a schematic view of a conventional heat sink.
  • FIG. 2A is a heat sink in accordance with a first preferred embodiment of the invention.
  • FIG. 2B is a perspective view of a fin in accordance with the preferred embodiment of FIG. 2A of the invention.
  • FIG. 3A is a perspective view of the heat-dissipating device in accordance with a second preferred embodiment of the invention.
  • FIG. 3B is a schematic view showing coupling of the base and fins in accordance with the preferred embodiment as shown in FIG. 3A.
  • FIG. 3C is a perspective view showing the fins in accordance with the preferred embodiment as shown in FIG. 3A of the invention.
  • FIG. 3D is a side view showing a combination of a fan with the heat-dissipating device of FIG. 3A.
  • FIGS. 2A and 2B there is shown a first preferred embodiment of a heat-dissipating device 2 , which includes a cylindrical base 22 and a plurality of fins 21 annularly mounted around the base 22 , and a first end of each fin 21 is coupled to the base 22 .
  • the plurality of fins 21 are coupled to the base 22 by means of welding, adhesion, riveting, engaging and fastening after the base was formed.
  • Each of the fins 21 can be formed in a rectangular, triangular, trapezoidal, polygonal, or irregular shape, which can be made from aluminum, copper, magnesium, an aluminum alloy, a copper alloy or a mixture thereof, or other thermally conductive material having high thermal conductivity.
  • a rectangular fin as an example, as shown in FIG. 2B, a first end of the fin 21 is provided with engagement portions 215 on its both sides, respectively. Each of the engagement portions 215 can be fastened with an engaging slot on the base 22 .
  • a second end of the fin 21 is provided with a flange 211 with its two sides having a concave portion 212 and an engagement portion 213 .
  • the concave portion 212 and engagement portion 213 can be fastened to an engagement portion and a concave portion formed on another fin, respectively.
  • the plurality of fins 21 of the heat-dissipating device 2 can be connected by a plurality of bridge portions (not shown), respectively connected between corresponding ends of each two fins 21 .
  • the plurality of bridge portions and the fins 21 can be formed integrally as a unit.
  • each of the fins 21 can be connected with each other by means of at least one rim portion (not shown), which is disposed on the second ends of the fins 21 so as to strengthen the heat-dissipating device 2 .
  • the heat-dissipating device 3 includes a cylindrical base 32 and a plurality of fins 31 annularly mounted around the base 32 .
  • An engaging portion 311 at a first end of each fin 31 is coupled to the base 32 .
  • the fins 31 can be coupled to the base 32 by welding, adhesion, riveting, or fastening.
  • a second end of each fin 31 is provided with a pair of concave portions 312 and a pair of engagement portions 313 . In assembling, the engagement portion 313 of each fin 31 can be fastened with the concave portion 312 of a neighboring fin 31 .
  • the bottom surface of the heat-dissipating device 3 is mounted on an electronic component (not shown) and an axial fan 4 is positioned at the top surface of the heat-dissipating device 3 .
  • the electronic component produces heat during operation and the heat is transferred to the heat-dissipating device 3 and the air stream produced by the axial fan 4 flows to the heat-dissipating device 3 , thereby the heat accumulated on the heat-dissipating device 3 is dissipated.
  • the fins 31 of the heat-dissipating device 3 are coupled to the base 32 one by one, the heat-dissipating area is effectively increased so as to obtain an excellent heat-dissipating effect.
  • the second ends of the fins 31 can be connected by coupling, riveting, engaging or fastening so as to strengthen the heat-dissipating device 3 and secure the second ends of the fins 31 .

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention discloses an annular heat-dissipating device formed by a plurality of fins combined together, all of which are arranged around a base, wherein one side of each of the plurality of fins is coupled to the base, respectively. The heat-dissipating device of the invention can greatly increase the heat-dissipating area so as to effectively dissipate heat generated from the electronic elements to the outside.

Description

    BACKGROUND OF THE INVENTION
  • (a) Field of the Invention [0001]
  • The invention relates generally to a heat-dissipating device and, more particularly, to a heat sink, used in electronic components such as CPUs of computers, capable of effectively dissipating heat generated from the electronic components to the outside. [0002]
  • (b) Description of the Related Art [0003]
  • Following continuous improvements in performance of electronic devices, heat-dissipating devices or systems have become indispensable components. If the heat generated by individual components within the electronic device cannot be appropriately dissipated, in a less serious situation, the performance thereof is reduced, and in a more serious situation, the electronic device may be burnt and damaged. As a result, the surfaces or side-walls of the electronic component (for instance, the CPU of a computer) which produced a great amount of heat is generally mounted on a heat sink so as to dissipate the generated heat. [0004]
  • Referring to FIG. 1, there is shown a [0005] conventional heat sink 1 with a base 11 at the center and a plurality of heat-dissipation fins 12 extended outward from the base 11. The base 11 and the heat dissipation fins 12 are formed integrally as a unit. In the manufacturing process of the conventional heat sink 1, there exists the restrictions of the height and thickness of the fins 12, and the distance between each of the fins 12 cannot be too small. Therefore, when the heat dissipation area of the heat sink 1 is increased, the entire volume of the heat sink is also increased.
  • Therefore, it is an important subject of the invention to provide a heat sink that has a larger heat dissipation area with respect to a specific volume. [0006]
    • SUMMARY OF THE INVENTION
  • Accordingly, it is an object of the invention to provide a heat-dissipating device formed with a plurality of fins, all of the fins are coupled to a base after the base is formed. As compared with a conventional heat sink, a larger heat-dissipating area can be obtained, which effectively dissipates heat generated by the electronic components to the outside. [0007]
  • Another object of the invention is to provide an annular heat-dissipating device formed with a plurality of fins combined together, and the device provides a larger heat-dissipating area which effectively dissipates heat generated by the electronic element to the outside. [0008]
  • In accordance with the invention, the heat-dissipating device includes a base, and a plurality of fins mounted around the periphery of the base, wherein a first end of each of the plurality of fins is coupled to the base after the base is formed. [0009]
  • In accordance with the invention, each fin has a rectangular, triangular, trapezoidal, polygonal or irregular shape. In addition, the fins are made from aluminum, copper, magnesium, an aluminum alloy, a copper alloy or a mixture thereof, or other thermally conductive material with high thermal conductivity. [0010]
  • The base is a pillar base with a circular, rectangular, triangular, trapezoidal or polygonal shape, or the base can be in a conical shape or an irregular shape. The base is made from aluminum, copper, magnesium, an aluminum alloy, a copper alloy, or a mixture thereof, or other thermally conductive material with high thermal conductivity. [0011]
  • The fins are coupled to the base at their first ends by way of welding, adhesion, riveting, engaging or fastening. The first ends of the fins are connected with each other by coupling, riveting, engaging or fastening so as to strengthen the heat-dissipating device. Alternatively, the fins are connected with each other by means of at least a rim portion being disposed on second ends of the fins to strengthen the heat-dissipating device. [0012]
  • The second end of each of the fins is provided with a flange. The flange is provided with at least a concave portion and at least an engagement portion which can respectively fasten with at least an engagement portion and at least a concave portion of another fin. Alternatively, the second end of each of the fins is provided with at least a concave portion and at least an engagement portion, which can respectively fasten to at least an engagement portion and at least a concave portion of another fin. [0013]
  • Preferably, the heat dissipation device further includes a plurality of bridge portions each connecting corresponding ends of each two fins. The plurality of bridge portions and the plurality of fins are formed integrally as a unit.[0014]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a schematic view of a conventional heat sink. [0015]
  • FIG. 2A is a heat sink in accordance with a first preferred embodiment of the invention. [0016]
  • FIG. 2B is a perspective view of a fin in accordance with the preferred embodiment of FIG. 2A of the invention. [0017]
  • FIG. 3A is a perspective view of the heat-dissipating device in accordance with a second preferred embodiment of the invention. [0018]
  • FIG. 3B is a schematic view showing coupling of the base and fins in accordance with the preferred embodiment as shown in FIG. 3A. [0019]
  • FIG. 3C is a perspective view showing the fins in accordance with the preferred embodiment as shown in FIG. 3A of the invention. [0020]
  • FIG. 3D is a side view showing a combination of a fan with the heat-dissipating device of FIG. 3A.[0021]
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Referring to FIGS. 2A and 2B, there is shown a first preferred embodiment of a heat-[0022] dissipating device 2, which includes a cylindrical base 22 and a plurality of fins 21 annularly mounted around the base 22, and a first end of each fin 21 is coupled to the base 22. The plurality of fins 21 are coupled to the base 22 by means of welding, adhesion, riveting, engaging and fastening after the base was formed.
  • Each of the [0023] fins 21 can be formed in a rectangular, triangular, trapezoidal, polygonal, or irregular shape, which can be made from aluminum, copper, magnesium, an aluminum alloy, a copper alloy or a mixture thereof, or other thermally conductive material having high thermal conductivity., Taking a rectangular fin as an example, as shown in FIG. 2B, a first end of the fin 21 is provided with engagement portions 215 on its both sides, respectively. Each of the engagement portions 215 can be fastened with an engaging slot on the base 22. In addition, a second end of the fin 21 is provided with a flange 211 with its two sides having a concave portion 212 and an engagement portion 213. The concave portion 212 and engagement portion 213 can be fastened to an engagement portion and a concave portion formed on another fin, respectively.
  • The plurality of [0024] fins 21 of the heat-dissipating device 2 can be connected by a plurality of bridge portions (not shown), respectively connected between corresponding ends of each two fins 21. The plurality of bridge portions and the fins 21 can be formed integrally as a unit. Alternatively, each of the fins 21 can be connected with each other by means of at least one rim portion (not shown), which is disposed on the second ends of the fins 21 so as to strengthen the heat-dissipating device 2.
  • Next, referring to FIGS. 3A to [0025] 3C, there is shown a heat-dissipating device 3 in accordance with a second preferred embodiment of the invention. The heat-dissipating device 3 includes a cylindrical base 32 and a plurality of fins 31 annularly mounted around the base 32. An engaging portion 311 at a first end of each fin 31 is coupled to the base 32. Alternatively, the fins 31 can be coupled to the base 32 by welding, adhesion, riveting, or fastening. In addition, a second end of each fin 31 is provided with a pair of concave portions 312 and a pair of engagement portions 313. In assembling, the engagement portion 313 of each fin 31 can be fastened with the concave portion 312 of a neighboring fin 31.
  • In practical application, as shown in FIG. 3D, the bottom surface of the heat-dissipating [0026] device 3 is mounted on an electronic component (not shown) and an axial fan 4 is positioned at the top surface of the heat-dissipating device 3. The electronic component produces heat during operation and the heat is transferred to the heat-dissipating device 3 and the air stream produced by the axial fan 4 flows to the heat-dissipating device 3, thereby the heat accumulated on the heat-dissipating device 3 is dissipated.
  • Since the [0027] fins 31 of the heat-dissipating device 3 are coupled to the base 32 one by one, the heat-dissipating area is effectively increased so as to obtain an excellent heat-dissipating effect. In addition, the second ends of the fins 31 can be connected by coupling, riveting, engaging or fastening so as to strengthen the heat-dissipating device 3 and secure the second ends of the fins 31.
  • While the invention has been particularly described, in conjunction with specific preferred embodiments, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art in light of the foregoing description. It is therefore contemplated that the appended claims will embrace any such alternatives, modifications and variations as falling within the true scope and spirit of the invention. [0028]

Claims (12)

What is claimed is:
1. A heat-dissipating device comprising:
a base; and
a plurality of fins mounted around a periphery of the base,
wherein a first end of each of the plurality of fins is coupled to the base after the base is formed.
2. The heat-dissipating device of claim 1, wherein the fins are formed as rectangular, triangular, trapezoid, polygonal or irregular shapes.
3. The heat-dissipating device of claim 1, wherein the plurality of fins are made from aluminum, copper, magnesium, an aluminum alloy, a copper alloy or a mixture thereof or other material with high thermal conductivity.
4. The heat-dissipating device of claim 1, wherein the plurality of fins are coupled to the base by welding, adhesion, riveting, engaging or fastening.
5. The heat-dissipating device of claim 1, wherein a second end of each of the plurality of fins is connected to each other so as to strengthen the heat-dissipating device.
6. The heat-dissipating device of claim 5, wherein the second end of each of the plurality of fins is provided with a flange that is formed with at least a concave portion and at least an engagement portion, which are respectively fastened to an engagement portion and a concave portion of another fin.
7. The heat-dissipating device of claim 5, wherein the second end of each of the fin is provided with at least a concave portion and at least an engagement portion, which are respectively fastened to an engagement portion and a concave portion of another fin.
8. The heat-dissipating device of claim 1, further comprising a plurality of bridge portions respectively connected between corresponding ends of each two fins.
9. The heat-dissipating device of claim 8, wherein the bridge portions and the fins are formed integrally as a unit.
10. The heat-dissipating device of claim 1, further comprising at least a rim portion mounted on second ends of the plurality of fins to strengthen the heat-dissipating device.
11. The heat-dissipating device of claim 1, wherein the base is a pillar base with a circular, rectangular, triangular, trapezoid, polygonal or irregular shape.
12. The heat-dissipating device of claim 1, wherein the base is made from aluminum, copper, magnesium, an aluminum alloy, a copper alloy or a mixture thereof or a thermal conductivity material with high thermal conductivity.
US10/391,084 2002-12-24 2003-03-17 Heat-dissipating device Abandoned US20040118552A1 (en)

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Cited By (17)

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US20050257914A1 (en) * 2004-05-07 2005-11-24 Liang-Fu Huang Skived-fin annular heat sink
US20060213641A1 (en) * 2005-03-25 2006-09-28 Yuh-Cheng Chemical Ltd. Heat sink
US20070012422A1 (en) * 2005-07-14 2007-01-18 Huang Tsung H Heat radiating fin
US20070084595A1 (en) * 2005-10-14 2007-04-19 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US20080094798A1 (en) * 2005-04-11 2008-04-24 Lee Sang C Apparatus for cooling computer parts and method of manufacturing the same
US20090178794A1 (en) * 2008-01-16 2009-07-16 Wen Chen Wei Method for manufacturing heat sink having heat-dissipating fins and structure of the same
US20090178795A1 (en) * 2008-01-16 2009-07-16 Wen-Chen Wei Manufacturing method for a radiator and a structure thereof
US20100044009A1 (en) * 2008-08-20 2010-02-25 Shyh-Ming Chen Annular heat dissipating device
US20100132931A1 (en) * 2008-11-28 2010-06-03 Shien-Kuei Liaw Thermal module for light source
US20100180632A1 (en) * 2009-01-16 2010-07-22 Korea Institute Of Radiological & Medical Sciences Pileus-gills type helium condenser and apparatus including the same
US20110036545A1 (en) * 2009-08-12 2011-02-17 Tsung-Hsien Huang High-performance heat sink
JP2011038702A (en) * 2009-08-11 2011-02-24 崇賢 ▲黄▼ Heat exhauster increasing heat exhaust efficiency
US20110048675A1 (en) * 2009-08-28 2011-03-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink
US20120061067A1 (en) * 2010-09-15 2012-03-15 Denso Corporation Heat sink
CN103471060A (en) * 2013-09-06 2013-12-25 南京北方科技有限公司 Combined light-emitting diode (LED) radiator
US20140318757A1 (en) * 2013-04-24 2014-10-30 Foxconn Technology Co., Ltd. Heat sink incorporating interlocked fin
US11024558B2 (en) * 2010-03-26 2021-06-01 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels

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US20050257914A1 (en) * 2004-05-07 2005-11-24 Liang-Fu Huang Skived-fin annular heat sink
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