US20030150595A1 - Structure and manufacture of a heat sink with high heat transmission - Google Patents

Structure and manufacture of a heat sink with high heat transmission Download PDF

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Publication number
US20030150595A1
US20030150595A1 US10/073,034 US7303402A US2003150595A1 US 20030150595 A1 US20030150595 A1 US 20030150595A1 US 7303402 A US7303402 A US 7303402A US 2003150595 A1 US2003150595 A1 US 2003150595A1
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US
United States
Prior art keywords
heat sink
aluminum alloy
grains
high heat
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/073,034
Inventor
Yung-Cheng Chen
Chuan-Cheng Huang
Chuan-Ching Tung
Jia-Jen Yeh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Loyalty Founder Enterprise Co Ltd
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Loyalty Founder Enterprise Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Loyalty Founder Enterprise Co Ltd filed Critical Loyalty Founder Enterprise Co Ltd
Priority to US10/073,034 priority Critical patent/US20030150595A1/en
Assigned to LOYALTY FOUNDER ENTERPRISE CO., LTD. reassignment LOYALTY FOUNDER ENTERPRISE CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TUNG, CHUAN-CHING
Priority to CA002379600A priority patent/CA2379600A1/en
Publication of US20030150595A1 publication Critical patent/US20030150595A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The present invention of a structure and manufacture of a heat sink with high heat transmission mainly uses a shear stress caused by stirring to break or crush the solidified arborescent primary crystal at a solid/liquid two-phase area of a aluminum alloy to form a slag fluid with ball-filled solid crushed grit; then ceramic grains are added in and dispersed by the solid grains scattered in the liquid-phase metal; through continuous stirring, the aluminum alloy becomes a fine mixed fluid of ceramic and aluminum alloy without arborescent forms; finally, the external configuration of a heat sink is accomplished through directly compression casting by using the special nature of the aluminum alloy to mold the entire heat sink and to enhance the effect of heat dissipation of the heat sink of the same structure through the high heat transmission efficiency of the ceramic grains.

Description

    BACKGROUND OF THE INVENTION
  • [0001] 1) Field of the Invention
  • The present invention of a structure and manufacture of a heat sink with high heat transmission aims to provide a heat sink with light weight and heat transmission higher than that of a conventional copper/aluminum alloy to accomplish the external configuration of various heat sinks through direct compression casting for dissipating high heat sources in a central process unit of a computer. [0002]
  • [0003] 2) Description of the Prior Art
  • Accordingly, with continuously increased operating speed, the power of a central process unit (CPU) of a computer is also enhanced; at the same time, more heat sources are generated; the common heat sink applied to the CPU mainly uses a heat transmission action to dissipate the heat source thereof; therefore, heat fins are properly spaced on the main body of the heat sink; the disposition of heat fins increases the air contact area so as to achieve the release of heat sources; therefore, basically, the effect of heat dissipation depends on the heat transmission efficiency of the main body of the heat sink; as a result, the heat sink with an aluminum alloy main body used for a CPU of a conventional computer has been gradually replaced by the copper alloy with higher efficiency of heat transmission. [0004]
  • However, although the main body of the conventional heat sinks can be processed into various external configurations through drawing or extruding the copper/aluminum alloy, with limited efficiency of heat transmission of the structure thereof, it fails to meet the heat dissipation demands of a CPU with higher operating speed; more especially, in spite of having heat transmission efficiency better than the aluminum alloy, the specific gravity of the entire heat sink of copper alloy is higher than that of the heat sink of aluminum alloy and that does not meet the requirements of a lightweight computer. [0005]
    • SUMMARY OF THE INVENTION
  • Therefore, the primary objective of the present invention is to use a shear stress caused by stirring to break or crush the solidified arborescent primary crystal at a solid/liquid two-phase area of a aluminum alloy to form a slag fluid with ball-filled solid crushed grit; then ceramic grains are added in and dispersed by the solid grains scattered in the liquid-phase metal; through continuous stirring, the aluminum alloy becomes a fine mixed fluid of ceramic and aluminum alloy without arborescent forms; finally, the external configuration of a heat sink is accomplished through directly compression casting by using the special nature of the aluminum alloy to mold the entire heat sink and to enhance the effect of heat dissipation of the heat sink of the same structure through the high heat transmission efficiency of the ceramic grains. [0006]
  • Another objective of the present invention is to mix a proper ratio of ceramic grains into the aluminum alloy for tremendously reducing the mass of the entire heat sink so as to meet the requirements of the designing demands of the lightweight computer even more. [0007]
  • To enable a further understanding the structure and objectives of the present invention, the brief description of the drawings below is followed by the detailed description of the preferred embodiment.[0008]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 illustrates the tested result obtained by simulating a desk-top computer using the same 80 watt heat source for the conventional copper-made heat sink and the heat sink of the present invention. [0009]
  • FIG. 2 illustrates the tested result obtained by simulating a notebook computer using the same 35 watt heat source for the conventional copper-made heat sink and the heat sink of the present invention. [0010]
  • FIG. 3 is a cross reference table of coefficients of the heat drag obtained through the experiments of the conventional copper-made heat sink and the heat sink of the present invention.[0011]
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • The present invention of a structure and manufacture of a heat sink with high heat transmission has the entire heat sink thereof manufactured into various almost net shapes according to the need of the practical application; furthermore, ceramic grains in a proper ratio are mixed into the aluminum alloy of a main body of the entire structure so as to use the special nature of the aluminum alloy to mold the entire heat sink and to enhance the effect of heat dissipation of the heat sink of the same structure through the high heat transmission efficiency of the ceramic grains; wherein, the aluminum alloy is composed by freely grouping AlSi, AlSiCu, AlSiZn, AlSiMg, AlSiCuMg, AlGe, AlGeSi, AlCu, AlMn, AlLi, AlSn and AlPb; the ceramic grains are grains of silicon carbide with the size of 40-3000 μm. [0012]
  • Furthermore, the manufacturing of the entire heat sink uses a shear stress caused by stirring to break or crush the solidified arborescent primary crystal at a solid/liquid two-phase area of a aluminum alloy to form a slag fluid with ball-filled solid crushed grit; then ceramic grains are added in and dispersed by the solid grains scattered in the liquid-phase metal; through continuous stirring, the aluminum alloy becomes a fine mixed fluid of ceramic and aluminum alloy without arborescent forms; finally, the external configuration of a heat sink is accomplished through directly compression casting. [0013]
  • In the present invention, since a proper ratio of ceramic grains are mixed into the aluminum alloy, the high heat transmission efficiency of the ceramic grains is used to enhance the heat dissipation effect of the structure of the same form; as indicated in FIGS. [0014] 1 to 3, the experimental comparison between the finished sample of the present invention and a conventional copper-made heat sink, the heat transmission efficiency of the heat sink of the present invention is 485 W/mK higher than the magnitude of 4000 W/mK of the copper-made heat sink; furthermore, with different contents of the ceramic grains, the heat transmission coefficients of the heat sink of the present invention are between 150 and 485 W/mK and that can be applied to a central process unit (CPU) with heat source above 85 W or speed of 2.2 GHz; however, the heat transmission coefficient of the conventional copper-made heat sink is only 400 W/mK and that can only be used for a CPU with heat source of 80 W at the most; more especially, with different contents of the ceramic grains, the density of the heat sink of the present invention is between 2.7 and 3.5 g/cm3; to compare with 8.6 g/cm3 of the conventional copper-made heat sink, the weight can be reduced about ½ to ⅔; therefore, it meets the requirements of the designing demands of a notebook computer even more.
  • The present invention of a structure and manufacture of a heat sink with high heat transmission mainly uses a shear stress caused by stirring to break or crush the solidified arborescent primary crystal at a solid/liquid two-phase area of a aluminum alloy to form a slag fluid with ball-filled solid crushed grit; then ceramic grains are added in and dispersed by the solid grains scattered in the liquid-phase metal; through continuous stirring, the aluminum alloy becomes a fine mixed fluid of ceramic and aluminum alloy without arborescent forms; finally, the external configuration of a heat sink is accomplished through directly compression casting by using the special nature of the aluminum alloy to mold the entire heat sink and to enhance the effect of heat dissipation of the heat sink of the same structure through the high heat transmission efficiency of the ceramic grains; therefore, the present invention provides another structure and manufacture of a heat sink with higher heat transmission and is lawfully submitted to the patent application hereby. [0015]
  • It is of course to be understood that the embodiment described herein is merely illustrative of the principles of the invention and that a wide variety of modifications thereto may be effected by persons skilled in the art without departing from the spirit and scope of the invention as set forth in the following claims. [0016]

Claims (6)

1. A heat sink with high heat transmission is characterized that the entire heat sink thereof is manufactured into various almost net shapes according to the need of the practical application; furthermore, ceramic grains are mixed in a proper ratio into the aluminum alloy of a main body of the entire structure so as to use the special nature of the aluminum alloy to mold the entire heat sink and to enhance the effect of heat dissipation of the heat sink of the same structure through the high heat transmission efficiency of the ceramic grains
2. The present invention of a heat sink with high heat transmission according to claim 1, wherein, the aluminum alloy is composed by freely grouping AlSi, AlSiCu, AlSiZn, AlSiMg, AlSiCuMg, AlGe, AlGeSi, AlCu, AlMn, AlLi, AlSn and AlPb.
3. The present invention of a heat sink with high heat transmission according to claim 1, wherein, the ceramic grains are grains of silicon carbide.
4. The present invention of a heat sink with high heat transmission according to claim 1, wherein, the sizes of grains of silicon carbides are preferred to be between 40-3000 μm.
5. The present invention of a heat sink with high heat transmission according to claim 1, wherein, the ceramic grains occupy weight ratio 0.5-80% of the entire heat sink.
6. A structure and manufacture of a heat sink with high heat transmission mainly uses a shear stress caused by stirring to break or crush the solidified arborescent primary crystal at a solid/liquid two-phase area of a aluminum alloy to form a slag fluid with ball-filled solid crushed grit; then ceramic grains are added in and dispersed by the solid grains scattered in the liquid-phase metal; through continuous stirring, the aluminum alloy becomes a fine mixed fluid of ceramic and aluminum alloy without arborescent forms; finally, the external configuration of a heat sink is accomplished through directly compression casting.
US10/073,034 2002-02-12 2002-02-12 Structure and manufacture of a heat sink with high heat transmission Abandoned US20030150595A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/073,034 US20030150595A1 (en) 2002-02-12 2002-02-12 Structure and manufacture of a heat sink with high heat transmission
CA002379600A CA2379600A1 (en) 2002-02-12 2002-03-28 Structure and manufacture of a heat sink with high heat transmission

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/073,034 US20030150595A1 (en) 2002-02-12 2002-02-12 Structure and manufacture of a heat sink with high heat transmission
CA002379600A CA2379600A1 (en) 2002-02-12 2002-03-28 Structure and manufacture of a heat sink with high heat transmission

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US20030150595A1 true US20030150595A1 (en) 2003-08-14

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CA (1) CA2379600A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7224048B1 (en) * 2002-08-05 2007-05-29 Asat Ltd. Flip chip ball grid array package
US20070204976A1 (en) * 2006-03-02 2007-09-06 The Furukawa Electric Co. Ltd. Heat sink with a centrifugal fan
US20110180240A1 (en) * 2010-01-23 2011-07-28 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Centrifugal blower and heat dissipation device incorporating the same
US20140377590A1 (en) * 2012-03-22 2014-12-25 Fuji Electric Co., Ltd. Magnetic recording medium for heat-assisted magnetic recording
CN108595887A (en) * 2018-05-10 2018-09-28 南京航空航天大学 A kind of simulation calculation and prediction technique that glomerocryst CBN abrasive wears develop

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5222542A (en) * 1988-11-10 1993-06-29 Lanxide Technology Company, Lp Method for forming metal matrix composite bodies with a dispersion casting technique
US5513688A (en) * 1992-12-07 1996-05-07 Rheo-Technology, Ltd. Method for the production of dispersion strengthened metal matrix composites
US5706999A (en) * 1995-11-28 1998-01-13 Hughes Electronics Preparation of a coated metal-matrix composite material
US5981085A (en) * 1996-03-21 1999-11-09 The Furukawa Electric Co., Inc. Composite substrate for heat-generating semiconductor device and semiconductor apparatus using the same
US6245442B1 (en) * 1997-05-28 2001-06-12 Kabushiki Kaisha Toyota Chuo Metal matrix composite casting and manufacturing method thereof
US6544636B1 (en) * 1999-02-02 2003-04-08 Hiroshima University Ceramic-reinforced metal-based composite material and a method for producing the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5222542A (en) * 1988-11-10 1993-06-29 Lanxide Technology Company, Lp Method for forming metal matrix composite bodies with a dispersion casting technique
US5513688A (en) * 1992-12-07 1996-05-07 Rheo-Technology, Ltd. Method for the production of dispersion strengthened metal matrix composites
US5706999A (en) * 1995-11-28 1998-01-13 Hughes Electronics Preparation of a coated metal-matrix composite material
US5981085A (en) * 1996-03-21 1999-11-09 The Furukawa Electric Co., Inc. Composite substrate for heat-generating semiconductor device and semiconductor apparatus using the same
US6245442B1 (en) * 1997-05-28 2001-06-12 Kabushiki Kaisha Toyota Chuo Metal matrix composite casting and manufacturing method thereof
US6544636B1 (en) * 1999-02-02 2003-04-08 Hiroshima University Ceramic-reinforced metal-based composite material and a method for producing the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7224048B1 (en) * 2002-08-05 2007-05-29 Asat Ltd. Flip chip ball grid array package
US20070204976A1 (en) * 2006-03-02 2007-09-06 The Furukawa Electric Co. Ltd. Heat sink with a centrifugal fan
US8011423B2 (en) * 2006-03-02 2011-09-06 The Furukawa Electric Co., Ltd. Heat sink with a centrifugal fan having vertically layered fins
US20110180240A1 (en) * 2010-01-23 2011-07-28 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Centrifugal blower and heat dissipation device incorporating the same
US20140377590A1 (en) * 2012-03-22 2014-12-25 Fuji Electric Co., Ltd. Magnetic recording medium for heat-assisted magnetic recording
US9728218B2 (en) * 2012-03-22 2017-08-08 Fuji Electric Co., Ltd. Magnetic recording medium for heat-assisted magnetic recording
CN108595887A (en) * 2018-05-10 2018-09-28 南京航空航天大学 A kind of simulation calculation and prediction technique that glomerocryst CBN abrasive wears develop

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AS Assignment

Owner name: LOYALTY FOUNDER ENTERPRISE CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:TUNG, CHUAN-CHING;REEL/FRAME:012583/0869

Effective date: 20020121

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION