US20030071688A1 - Temperature compensated current mirror - Google Patents
Temperature compensated current mirror Download PDFInfo
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- US20030071688A1 US20030071688A1 US09/976,445 US97644501A US2003071688A1 US 20030071688 A1 US20030071688 A1 US 20030071688A1 US 97644501 A US97644501 A US 97644501A US 2003071688 A1 US2003071688 A1 US 2003071688A1
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/30—Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters
- H03F1/302—Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters in bipolar transistor amplifiers
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Abstract
Description
- This invention relates generally to electrical circuits, and more particularly, the invention relates to a current mirror circuit with temperature compensation.
- The current mirror is often used in bipolar circuits such as low voltage bipolar amplifier circuits. A problem in low voltage applications stems from variations in base-emitter voltage, Vbe, with temperature, which can adversely affect a reference current and a mirrored current. In many applications, including power amplifiers, current mirror circuitry is used to set up an operating current through the amplifier. With a low operating voltage using a three cell nickel battery or lithium ion battery, it becomes difficult to maintain a constant current over a temperature range. Unfortunately, changing the operating current over temperature will adversely affect circuit performance.
- For example, FIG. 1 shows a prior art current mirror circuit used to set the operating current for a rf power amplifier transistor, Qrf. A reference current, Iref, flowing from a reference voltage, Vref, to circuit ground through resistor Ra and transistor Q2 is mirrored (proportionately to transistor sizes) as current Icrf through rf power transistor Qrf between voltage Vcc and ground. Transistors Q3, Q4 connect a bias voltage, Vbias, to the respective base regions of transistors Q2, Qrf due to the same bias voltage, VA, being applied to transistors Q3, Q4. As temperature rises, the current through Qrf increases as Vbe is reduced at about −2 mV/° C. for a silicon bipolar transistor or −1 mV/° C. for a gallium arsenide heterojunction bipolar transistor, GaAs HBT. When this circuit is used in a CDMA handset power amplifier, the increased bias current of Qrf at high temperature is unfavorable for “talk time”.
- The present invention is directed to compensating for temperature induced variations in a current mirror circuit, such as shown in FIG. 1, for example.
- In accordance with the invention, in a current mirror circuit having a reference node and a reference current transistor connected to the reference node, a temperature compensating circuit for maintaining the reference current value during temperature variations includes a compensating transistor connected between the reference node and circuit ground and parallel with the reference current transistor. Bias circuitry is provided for biasing the compensating transistor whereby current flows from the reference node to ground through the compensating transistor in order to remove excess current when temperature increases.
- In a low voltage bipolar transistor amplifier circuit embodiment, a power bipolar transistor is connected between a supply voltage and circuit ground, and a current mirror circuit including a reference current transistor is serially connected with a first resistor between a reference voltage and circuit ground. A pair of bipolar bias voltage transistors are connected respectively between a bias voltage and a base of the reference current transistor and between the bias voltage and a base of the power bipolar transistor, the bases of the pair of bipolar bias voltage transistors being connected to the common terminal of the reference current transistor and the first resistor. The temperature compensating circuit including the compensating transistor is then connected between the reference node and circuit ground in parallel with the reference current transistor with bias circuitry biasing the compensating transistor whereby current flows from the reference node to ground through the compensating transistor to remove excess current from the node when temperature increases.
- In another embodiment of the invention, the bias circuitry for the compensating transistor includes a diode for limiting bias circuitry current flow when the reference voltage drops below the base-emitter voltage of the compensating transistor.
- In another embodiment, a switch transistor can be connected in parallel with the reference current transistor to reduce the reference current transistor when the switch transistor is conducting.
- The invention and objects and features thereof will be more readily apparent from the following detailed description and dependent claims when taken with the drawings.
- FIG. 1 is a schematic of a low voltage bipolar power amplifier with current mirror in accordance with the prior art.
- FIG. 2 is a schematic of a low voltage bipolar power transistor with current mirror in accordance with an embodiment of the invention.
- FIG. 3 is a schematic of another embodiment of a temperature compensated current mirror and low voltage bipolar power amplifier in accordance with the invention.
- FIG. 4 is a graph illustrating compensated and uncompensated power transistor current in the circuits of FIGS. 1 and 2.
- FIG. 5 is a schematic of another embodiment of the temperature compensated current mirror and low voltage power amplifier with a reference current adjustment transistor.
- FIGS. 6A and 6B are graphs illustrating power transistor current versus temperature with low temperature compensation and with temperature compensation, respectively.
- Like elements in the figures have the same reference numerals.
- FIG. 1 is a schematic of a low voltage bipolar power amplifier with a standard current mirror circuit for setting up operation current in accordance with the prior art. Power transistor Qrf is connected between a supply voltage Vcc and a circuit ground with operating current Icrf flowing through the power transistor. Current Icrf is a mirror (proportional to transistor parameters) of a reference current Iref flowing through transistor Q2 serially connected with resistor Ra between a reference voltage, Vref, and circuit ground. Bias transistors Q3, Q4 receive a base voltage from the common terminal VA of resistor Ra and transistor Q2 and provide a bias voltage Vbe to the base of transistor Q3 and the base of transistor Q4, respectively.
- As noted above, as temperature rises, the current through transistor Qrf increases as Vbe is reduced at about −2 mV/° C. for a silicon bipolar transistor or −1 mV/° C. for a GaAs heterojunction bipolar transistor. When the circuit of FIG. 1 is used in a CDMA handset power amplifier, the increased bias current of Qrf at high temperature is unfavorable for the “talk time”.
- In accordance with the invention, a temperature compensation circuit is provided to minimize the change of bias current versus temperature as illustrated in one embodiment of FIG. 2. Like elements in the circuitry of FIG. 1 and FIG. 2 have the same reference numerals. In FIG. 2 the compensation circuit includes a transistor Q1 serially connected with resistor Re and in parallel with transistor Q2 to remove excess current at node VA as temperature rises. The reference current Iref through transistor Q2 must be kept nearly constant over temperature in order to hold the bias current through transistor Qrf steady. Voltage Vref is an external reference voltage independent of temperature, and as temperature rises, the voltage at point A (VA) will change since VA is equal to the base-emitter voltage drop (Vbe) through transistors Q2, Q3 (same as Q4, Qrf).
- As temperature rises, Vbe is reduced and VA decreases, thus and more current flows through resistor Ra. However, as Vbe is reduced, transistor Q1 bias current Ic1 increases. Since Ic1 plus Iref equal current flow through resistor Ra, Iref will be temperature independent when Ic1 drains the excess current over temperature. Ic1 is determined by bias circuitry R1, R2.
- This current operation can be expressed mathematically as follows:
- (V ref −V A)/Ra−Ic1=Iref
- Ic1*(Re+(R1∥R2)/β)+Vbe=Vref*R2/(R1+R2)
- where β is the current gain of the bipolar transistor.
- Since ∂Iref/∂T=0 is the design target, then:
- Ra/2=Re+(R1∥R2)/β
- At this moment:
- Iref=Vref(1−2R2/(R1+R2))/Ra=Vref*(R1−R2)/(R1+R2)/Ra (1)
- Therefore, a minimum temperature variation of Iref and Icrf is achieved.
- One possible drawback in the circuit of FIG. 2 lies in current flow through resistors R1, R2 when Vref is reduced below Vbe and all transistors are turned off. The circuit is turned off completely only when Vref is exactly 0 volt. To enhance the circuit performance, a diode D1 is provided in the serial circuit of resistors R1, R2 as illustrated in FIG. 3. Thus, as Vref is reduced below Vdiode and Vbe the diode and transistors are turned off and there is no connection path from Vref to ground.
- One can further derive the condition when ∂Iref/∂T=0.
- Since ∂Vbe/∂T≈∂Vdiode/∂T, and Idiode>>Ib1
- Iref=Vref/Ra−Vref*R2/(R1+R2)Re+Vbe(1/(R3−2/Ra)+Vd*R2/Re/(R1+R2)
- ∂Iref=/∂T=0 when Ra=2(R1+R2)Re/(2R2+R1)
- and Iref=Vref*R1/(2*(R1+R2)*Re)=Vref*R1/((2R2+R1)*Ra) (2)
- Another advantage of the temperature compensated current mirror by-circuit as shown in FIG. 3 is reduced sensitivity to the Vref as shown in both equations 1 and 2. Without the temperature compensated circuit, the Iref is simply (Vref−VA)/Ra. As Vref is increased, ΔIref=ΔVref/Ra.
- But for the circuit in FIG. 2, ΔIref=ΔVref*(R1−R2)/(R1+R2)/Ra; and for the circuit in FIG. 3, ΔIref=ΔVref*R1/((2R2+R1)*Ra).
- In both circuits, the sensitivity is reduced, by (R1−R2)/(R1+R2) and R1/((2R2+R1) respectively. Therefore the Iref vs. Vref curve is improved in FIG. 4. Once Vref reaches the normal operation range, the Iref is relatively insensitive to the Vref, as illustrated in the graph of FIG. 4.
- In a CDMA handset power amplifier made of GaAs HBT for 3 to 3.5V operation, the circuit can maintain a near constant bias current over temperature. A power transistor for IS95 may draw a quiescent current of 50 mA at room temperature. The current from the Vref is about 1 to 2 mA without the temperature compensation circuit. As temperature changes from −30 to +85° C., the quiescent current will change from about 30 mA to 75 mA or more.
- When the temperature compensation circuit is added, the quiescent current at room temperature is still 50 mA; but the current from Vref is increased to 2 to 3 mA. Over the same temperature range, the quiescent current is maintained at 50 mA or so. This offers several advantages over the non-compensated circuit. For example, at high temperature, the current drawn by the power transistor stage is still <55 mA, versus the non-compensated current of 80 mA or so. Further, at low temperature and without the temperature compensation, the quiescent current is lower than that at room temperature, and may cause ACPR to degrade at high power level (25 dBm or more).
- Besides these advantages, the temperature-compensated circuit also facilitates other power amplifier amplifications in CDMA. At low power level, the power transistor can operate at even lower current, e.g. 25 mA. A simple on/off switch, Qsw, may be used to change the power transistor bias current as shown in FIG. 5. When Qsw is turned on, it will be in the saturation range, and the current flowing through it is (VA−Vsat,sw)RQ which is nearly constant over temperature. With the temperature compensation, the bias current at low current state is flat versus temperature. If no temperature compensation is used, the low bias current at low temperature may be so small as shown in FIGS. 6A, 6B. In FIG. 6A, Icrf varies appreciably with temperature, whereas in FIG. 6B Icrf remains nearly constant with temperature. Again it will have a much lower power level with acceptable ACPR.
- While the invention has been described with reference to specific embodiments, the description is illustrative of the invention and is not to be construed as limiting the invention. Various modifications and applications may occur to those skilled in the art without departing from the true spirit and script of the invention as defined by the appended claims.
Claims (13)
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Cited By (5)
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EP1652295A2 (en) * | 2003-08-08 | 2006-05-03 | Skyworks Solutions, Inc. | Temperature-insensitive bias circuit for high-power amplifiers |
EP1664965A2 (en) * | 2003-09-08 | 2006-06-07 | Skyworks Solutions, Inc. | Quiescent current control circuit for high-power amplifiers |
CN102566632A (en) * | 2010-12-13 | 2012-07-11 | 鸿富锦精密工业(深圳)有限公司 | Voltage stabilizing circuit |
JP2015195566A (en) * | 2014-03-20 | 2015-11-05 | 株式会社村田製作所 | power amplifier module |
JP2020106453A (en) * | 2018-12-28 | 2020-07-09 | 株式会社村田製作所 | Temperature detection circuit, power amplification circuit, and electronic apparatus |
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FR2823921B1 (en) * | 2001-04-20 | 2003-10-31 | St Microelectronics Sa | TRANSCONDUCTANCE STAGE AND WIRELESS COMMUNICATION DEVICE PROVIDED WITH SUCH A STAGE |
US6774724B2 (en) * | 2002-11-21 | 2004-08-10 | Motorola, Inc. | Radio frequency power amplifier active self-bias compensation circuit |
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KR100704686B1 (en) * | 2004-09-14 | 2007-04-06 | 아바고테크놀로지스코리아 주식회사 | A temperature compensated circuit for a power amplifier using diode voltage control |
KR100654646B1 (en) * | 2004-10-11 | 2006-12-08 | 아바고테크놀로지스코리아 주식회사 | A temperature compensated bias circuit for a power amplifier |
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US6300837B1 (en) * | 2000-03-28 | 2001-10-09 | Philips Electronics North America Corporation | Dynamic bias boosting circuit for a power amplifier |
US6424225B1 (en) * | 2000-11-27 | 2002-07-23 | Conexant Systems, Inc. | Power amplifier circuit for providing constant bias current over a wide temperature range |
-
2001
- 2001-10-12 US US09/976,445 patent/US6556082B1/en not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
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EP1652295A2 (en) * | 2003-08-08 | 2006-05-03 | Skyworks Solutions, Inc. | Temperature-insensitive bias circuit for high-power amplifiers |
EP1652295A4 (en) * | 2003-08-08 | 2009-04-01 | Skyworks Solutions Inc | Temperature-insensitive bias circuit for high-power amplifiers |
EP1664965A2 (en) * | 2003-09-08 | 2006-06-07 | Skyworks Solutions, Inc. | Quiescent current control circuit for high-power amplifiers |
EP1664965A4 (en) * | 2003-09-08 | 2007-10-10 | Skyworks Solutions Inc | Quiescent current control circuit for high-power amplifiers |
CN102566632A (en) * | 2010-12-13 | 2012-07-11 | 鸿富锦精密工业(深圳)有限公司 | Voltage stabilizing circuit |
JP2015195566A (en) * | 2014-03-20 | 2015-11-05 | 株式会社村田製作所 | power amplifier module |
JP2020106453A (en) * | 2018-12-28 | 2020-07-09 | 株式会社村田製作所 | Temperature detection circuit, power amplification circuit, and electronic apparatus |
US11177777B2 (en) | 2018-12-28 | 2021-11-16 | Murata Manufacturing Co., Ltd. | Temperature detection circuit, power amplification circuit, and electronic device |
JP7024703B2 (en) | 2018-12-28 | 2022-02-24 | 株式会社村田製作所 | Power amplifier circuit and electronic equipment |
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