US20030032378A1 - Polishing surface constituting member and polishing apparatus using the polishing surface constituting member - Google Patents
Polishing surface constituting member and polishing apparatus using the polishing surface constituting member Download PDFInfo
- Publication number
- US20030032378A1 US20030032378A1 US10/214,355 US21435502A US2003032378A1 US 20030032378 A1 US20030032378 A1 US 20030032378A1 US 21435502 A US21435502 A US 21435502A US 2003032378 A1 US2003032378 A1 US 2003032378A1
- Authority
- US
- United States
- Prior art keywords
- polishing
- constituting member
- surface constituting
- polishing surface
- polished
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 243
- 239000012530 fluid Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 description 57
- 239000007788 liquid Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 4
- 239000006061 abrasive grain Substances 0.000 description 3
- 230000000593 degrading effect Effects 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
Definitions
- the present invention relates to a polishing surface constituting member used in a polishing apparatus for polishing an object to be polished, e.g. a semiconductor substrate. More particularly, the present invention relates to a polishing surface constituting member suitable for polishing a surface of a polishing object flat and uniformly without overpolishing at the edge of the object. The present invention also relates to a polishing apparatus using the polishing surface constituting member.
- a polishing apparatus for polishing an object to be polished e.g. a semiconductor substrate
- the polishing apparatus further has a top ring for holding a substrate as an object to be polished, and an abrasive liquid supply nozzle. While an abrasive liquid is being supplied onto the polishing surface constituting member from the abrasive liquid supply nozzle, the substrate to be polished that is held by the top ring is pressed against the polishing surface constituting member under a predetermined pressure, and the polishing table and the top ring are rotated to cause relative movement between the polishing surface constituting member and the substrate, thereby polishing the substrate.
- the term “polishing surface constituting member” as used herein means a polishing pad, an abrasive wheel having a polishing surface, a sheet-shaped member containing abrasive grains, etc.
- substrates to be polished e.g. semiconductor substrates
- the general practice is to press the whole surface of the substrate against the surface of a polishing surface constituting member under a uniform pressure.
- the polishing surface constituting member has elasticity, as shown in FIG. 12, the polishing surface constituting member 20 is deformed during polishing in the vicinity of a portion thereof that comes in contact with the edge 10 a of the substrate 10 . Accordingly, the surface of the substrate 10 to be polished cannot uniformly be pressed against the polishing surface constituting member 20 .
- the polishing surface constituting member 20 is deformed downwardly by being pressed with the substrate 10 being polished. At this time, a particularly high pressure is applied to the edge 10 a of the substrate 10 , causing the edge 10 a to be overpolished. This is known as “edge rounding”.
- FIG. 13 is an enlarged view of part A in FIG. 12.
- a polishing pad 20 - 1 generally used as the polishing surface constituting member 20 has a double-layer structure including a relatively hard first layer 21 formed by using IC-1000 or the like, and a relatively soft second layer 22 made of SUBA400 or the like.
- the relatively hard first layer 21 forms a surface that comes in contact with the substrate 10 to polish it.
- the relatively soft second layer 22 which is an underlying layer, allows the first layer 21 to follow surface waviness or the like of the substrate 10 .
- follow-up capability undesirably reduces in the vicinity of the edge 10 a of the substrate 10 . Consequently, the width D of the rebound region becomes about 6 mm. Thus, overpolishing at the edge 10 a of the substrate 10 cannot be reduced.
- the polishing surface constituting member 20 needs to retain an abrasive liquid. Therefore, the surface of the polishing surface constituting member 20 is provided with a large number of grooves 23 in a lattice configuration as shown in FIG. 15, or provided with a large number of holes 24 as shown in FIG. 16. However, the grooves 23 and the holes 24 are not provided to prevent overpolishing at the edge 10 a of the substrate 10 and hence have no function of preventing overpolishing at the edge 10 a of the substrate 10 .
- one purpose of the present invention is to provide a polishing surface constituting member capable of polishing a surface of a polishing object flat and uniformly with minimal overpolishing at the edge of the object.
- Another purpose of the present invention is to provide a polishing apparatus using the above-described polishing surface constituting member.
- a polishing surface constituting member for polishing an object to be polished by pressing the object against the polishing surface constituting member under a predetermined pressure and causing relative movement between the object and the polishing surface constituting member.
- a surface of the polishing surface constituting member that comes in contact with the object is provided with grooves at a predetermined pitch or provided with projections in a predetermined configuration.
- the surface of the polishing surface constituting member that comes in contact with the object to be polished is provided with grooves at a predetermined pitch or provided with projections in a predetermined configuration. Therefore, the follow-up capability of the polishing surface constituting member with respect to the object being polished is improved, and overpolishing at the edge of the object to be polished is minimized. Accordingly, the surface of the object can be polished flat and uniformly.
- the present invention provides a polishing surface constituting member for polishing an object to be polished by pressing the object against the polishing surface constituting member under a predetermined pressure and causing relative movement between the object and the polishing surface constituting member.
- a surface of the polishing surface constituting member that comes in contact with the object is provided with a large number of disk-shaped projections at a predetermined pitch suitable for improving follow-up capability with respect to the object being polished and for preventing overpolishing at the edge of the object, whereby grooves are provided between the disk-shaped projections.
- the surface of the polishing surface constituting member that comes in contact with the object to be polished is provided with a large number of disk-shaped projections at a predetermined pitch suitable for improving follow-up capability with respect to the object being polished and for preventing overpolishing at the edge of the object, whereby grooves are provided between the disk-shaped projections. Therefore, the follow-up capability of the polishing surface constituting member with respect to the object being polished is improved, and overpolishing at the edge of the object to be polished is minimized. Accordingly, the surface of the object can be polished flat and uniformly.
- the polishing surface constituting member according to the first aspect of the present invention has a laminated structure including at least two layers, and the grooves or grooves provided between the projections extend to the surface of a layer of the polishing surface constituting member immediately subsequent to a layer thereof that comes in contact with the object to be polished.
- the polishing surface constituting member has a laminated structure including at least two layers, and the grooves or grooves provided between the projections extend to the surface of a layer of the polishing surface constituting member immediately subsequent to a layer thereof that comes in contact with the object to be polished. Therefore, the follow-up capability of the polishing surface constituting member with respect to the object being polished is further improved, and overpolishing at the edge of the object to be polished is further minimized. Accordingly, the surface of the object can be polished even more flat and uniformly.
- the polishing surface constituting member according to the first aspect of the present invention has a laminated structure including at least two layers, and the grooves or grooves provided between the projections extend into a layer of the polishing surface constituting member immediately subsequent to a layer thereof that comes in contact with the object to be polished.
- the polishing surface constituting member has a laminated structure including at least two layers, and the grooves or grooves provided between the projections extend into a layer of the polishing surface constituting member immediately subsequent to a layer thereof that comes in contact with the object to be polished. Therefore, the width of the grooves can be narrowed without degrading the follow-up capability of the polishing surface constituting member with respect to the object being polished, and the surface of the object can be polished still more flat and uniformly.
- the polishing surface constituting member according to the second or third aspect of the present invention is arranged such that at least one of underlying layers of the polishing surface constituting member subsequent to the layer thereof that comes in contact with the object to be polished is a layer pressurized by a fluid.
- At least one of underlying layers of the polishing surface constituting member subsequent to the layer thereof that comes in contact with the object to be polished is a layer pressurized by a fluid. Therefore, the follow-up capability of the polishing surface constituting member with respect to the object being polished is further improved by properly varying the pressure of the fluid. Accordingly, overpolishing at the edge of the object to be polished is minimized, and the surface of the object can be polished flat and uniformly. Even if the layer of the polishing surface constituting member that comes in contact with the object to be polished is reduced in thickness, stable polishing can be performed because the pressure applied to the object to be polished can be held constant.
- a polishing apparatus for polishing an object to be polished by pressing the object against a polishing surface constituting member on a polishing table under a predetermined pressure and causing relative movement between the object and the polishing surface constituting member.
- the polishing surface constituting member of the polishing apparatus is the polishing surface constituting member according to any one of the first to fourth aspects of the present invention.
- the polishing surface constituting member according to any one of the first to fourth aspects of the present invention is used as the polishing surface constituting member of the polishing apparatus. Therefore, the polishing apparatus can polish the surface of the object flat and uniformly.
- FIG. 1 is a cross-section of an essential part of a polishing pad used as a polishing surface constituting member according to the present invention, showing a structural example thereof.
- FIG. 2 is a graph showing the results of polishing a substrate as an object to be polished.
- FIG. 3 is an enlarged view of part B in FIG. 2.
- FIG. 4 is a partly-sectioned perspective of an essential part of a polishing pad used as a polishing surface constituting member according to the present invention, showing another structural example thereof.
- FIG. 5 is a cross-section showing an essential part of another embodiment of the polishing surface constituting member according to the present invention.
- FIG. 6 is a cross-section showing an essential part of still another embodiment of the polishing surface constituting member according to the present invention.
- FIG. 7 is a cross-section showing an essential part of a further embodiment of the polishing surface constituting member according to the present invention.
- FIG. 8 is a schematic sectional view showing a further embodiment of the polishing surface constituting member according to the present invention.
- FIG. 9 is a diagram showing a structural example of a polishing apparatus using the polishing surface constituting member according to the present invention.
- FIG. 10 is a perspective showing another structural example of a polishing apparatus using the polishing surface constituting member according to the present invention.
- FIG. 11 is a diagram showing still another structural example of a polishing apparatus using the polishing surface constituting member according to the present invention.
- FIG. 12 is a diagram showing problems associated with a conventional polishing surface constituting member.
- FIG. 13 is an enlarged view of part A in FIG. 12.
- FIG. 14 is a cross-section of a conventional polishing pad.
- FIG. 15 is a diagram showing a structural example of a conventional polishing surface constituting member.
- FIG. 16 is a diagram showing another structural example of a conventional polishing surface constituting member.
- FIG. 1 is a cross-section showing an essential part of a polishing pad 1 - 1 used as a polishing surface constituting member 1 according to the present invention.
- the polishing pad 1 - 1 is composed of two layers, i.e. a first layer 2 , and a second layer 3 .
- the first layer 2 is made of a relatively hard material, e.g. IC-1000.
- the second layer 3 is made of a relatively soft material, e.g. SUBA400.
- FIG. 2 is a graph showing the results of polishing the substrate 10 .
- FIG. 3 is an enlarged view of part B in FIG. 2.
- the grooves 4 provided in the polishing pad 1 - 1 each have a width of 1 mm and a depth of 1 mm, and the substrate 10 to be polished has a circular shape with an outer diameter of 8 inches.
- the abscissa axis represents the distance (mm) from the center of the substrate 10
- the ordinate axis represents the stock removal (Polishing Amount) ( ⁇ ) in polishing of the substrate 10 .
- a rebound of the polishing pad 1 - 1 at the edge 10 a that extends over a range of about 3 mm from the outer periphery of the substrate 10 is further reduced when the pitch L is 3 mm (see FIG. 3).
- overpolishing and the rebound of the polishing pad 1 - 1 at the edge 10 a can be reduced by setting the pitch L of the grooves 4 in the polishing pad 1 - 1 at 5 mm or less.
- grooves 4 there is no particular restriction on the configuration of the grooves 4 provided in the surface of the polishing pad 1 - 1 . As shown in FIG. 15, a large number of grooves 4 may be provided in a lattice configuration. Alternatively, grooves 4 may be formed by providing a large number of disk-shaped projections 5 as shown in FIG. 4.
- the depth of the grooves 4 provided in the surface of the polishing surface constituting member 1 is not necessarily limited to the one that is short of the surface of the second layer 3 . As shown in FIG. 5, the grooves 4 may extend to the surface of the second layer 3 . Alternatively, the grooves 4 may extend into the second layer 3 as shown in FIG. 6. In a case where the grooves 4 are provided to extend to the surface of the second layer 3 of the polishing surface constituting member 1 , the follow-up capability of the polishing surface constituting member 1 is further improved, and the occurrence of a rebound region in the vicinity of the edge 10 a of the substrate 10 is further suppressed.
- the grooves 4 are provided to extend into the second layer 3 of the polishing surface constituting member 1 , the follow-up capability of the polishing surface constituting member 1 will not be degraded even if the width of the grooves 4 is narrowed. Further, because the area with which the first layer 2 comes in contact with the substrate 10 increases, the surface of the substrate 10 can be polished even more flat and even more uniformly.
- FIG. 7 is a cross-section showing an essential part of a further embodiment of the polishing surface constituting member according to the present invention.
- the polishing surface constituting member 1 according to this embodiment has a triple-layer structure in which an elastic intermediate layer 6 made, for example, of rubber or urethane foam is provided between a relatively hard first layer 2 and a relatively soft second layer 3 . Provision of the intermediate layer 6 makes it possible to minimize rapid changes in elasticity even when the first layer 2 is reduced in thickness. Regarding the depth of the grooves 4 in this embodiment, the grooves 4 may be provided to extend through the first layer 2 . Alternatively, the grooves 4 may be provided to extend into the intermediate layer 6 or as far as the inside of the second layer 3 . Although in this embodiment the polishing surface constituting member 1 has a triple-layer structure, the present invention is not necessarily limited thereto.
- the polishing surface constituting member 1 may have a laminated structure including more than three layers.
- FIG. 8 is a schematic sectional view showing a further embodiment of the polishing surface constituting member according to the present invention.
- the polishing surface constituting member 1 according to this embodiment has a layer member 7 as a layer underlying a relatively hard first layer 2 .
- the layer member 7 is capable of accommodating a fluid F therein.
- the layer member 7 can be expanded or contracted by varying the pressure of the fluid accommodated therein. More specifically, the layer member 7 expands as the pressure therein is increased by introducing the fluid into the layer member 7 from a fluid inlet 7 a .
- the pressure in the layer member 7 is varied appropriately, whereby it is possible to further improve the follow-up capability of the polishing surface constituting member 1 with respect to the substrate 10 being polished. Even when the first layer 2 is reduced in thickness, stable polishing can be performed because the pressure applied to the substrate 10 can be held constant. It should be noted that a polishing surface constituting member 1 having a laminated structure including three or more layers can also perform stable polishing by having the layer member 7 as the lowermost layer.
- FIG. 9 is a diagram showing a structural example of a polishing apparatus using the polishing surface constituting member according to the present invention.
- the polishing apparatus includes a turntable 11 having the polishing surface constituting member 1 according to the present invention bonded to the upper surface thereof.
- the polishing apparatus further includes a top ring 12 for holding a substrate 10 to be polished in such a manner that the substrate 10 is rotatable and capable of being pressed against the polishing surface constituting member 1 .
- the polishing apparatus includes an abrasive liquid supply nozzle 13 for supplying an abrasive liquid Q to the polishing surface constituting member 1 .
- the top ring 12 is connected to a top ring shaft 14 .
- the top ring shaft 14 is rotatable by a rotating device (not shown), e.g. a motor, provided in an oscillating arm 15 .
- the top ring shaft 14 is also vertically movable by a vertically moving mechanism (not shown), e.g. a cylinder, provided in the oscillating arm 15 .
- the top ring shaft 14 is supported by the oscillating arm 15 through bearings (not shown).
- the oscillating arm 15 is supported in such a manner as to be oscillatable, together with the top ring 12 as one unit, over a predetermined angle range in a horizontal plane parallel to the polishing surface constituting member 1 by a motor 16 .
- the top ring 12 has the substrate 10 attached on the lower surface thereof by a holding device (not shown).
- the top ring 12 has a cylindrical guide ring 17 provided on the outer periphery thereof to prevent the substrate 10 from becoming dislodged from the lower surface of the top ring 12 during polishing.
- the guide ring 17 is secured to the top ring 12 .
- the lower end surface of the guide ring 17 projects from the substrate holding surface of the top ring 12 so that the substrate 10 is held in a recess defined inside the projecting lower end of the guide ring 17 .
- the substrate 10 to be polished is attached on the lower surface of the top ring 12 .
- the substrate 10 is pressed against the polishing surface constituting member 1 on the turntable 11 by the top ring 12 , and the turntable 11 and the top ring 12 are rotated to cause relative movement between the polishing surface constituting member 1 and the substrate 10 , thereby polishing the substrate 10 .
- the abrasive liquid Q is supplied onto the polishing surface constituting member 1 from the abrasive liquid supply nozzle 13 .
- a liquid containing abrasive grains, for example, fine silica particles, is used as the abrasive liquid Q.
- the polishing apparatus can polish the surface of the substrate 10 flat and uniformly because it uses the polishing surface constituting member 1 according to the present invention.
- polishing apparatus using the polishing surface constituting member 1 according to the present invention is not necessarily limited to that shown in FIG. 9.
- the polishing surface constituting member 1 according to the present invention is applicable to any polishing apparatus wherein a substrate to be polished is pressed against a polishing pad and polished by relative movement therebetween.
- the present invention may be applied to a polishing apparatus as shown in FIG. 10.
- the polishing apparatus has a polishing table 33 arranged such that a polishing sheet 1 - 2 as a polishing surface constituting member 1 unwound from a polishing sheet feed drum 31 is wound onto a polishing sheet take-up drum 32 via a back plate 30 .
- the polishing apparatus further has a top ring 12 .
- a substrate 10 to be polished that is held by the rotating top ring 12 is pressed against the polishing sheet 1 - 2 passing over the upper surface of the back plate 30 of the polishing table 33 , thereby polishing the substrate 10 .
- the present invention may also be applied to a polishing apparatus as shown in FIG. 11.
- the polishing apparatus has a rotary drum 34 having a polishing sheet 1 - 2 bonded to the outer peripheral surface thereof as a polishing surface constituting member 1 .
- the polishing apparatus further has a top ring 12 .
- a substrate 10 to be polished that is held by the rotating top ring 12 is pressed against the polishing sheet 1 - 2 on the rotary drum 34 , thereby polishing the substrate 10 .
- the polishing surface constituting member 1 confusing-consider eliminating which contacts and polishes the surface of the substrate 10 to be polished can be constituted by a grinder or a pad or a sheet which contains abrasive grains.
- the surface of the polishing surface constituting member that comes in contact with an object to be polished is provided with grooves at a predetermined pitch or provided with projections in a predetermined configuration. Therefore, the follow-up capability of the polishing surface constituting member with respect to the object being polished is improved, and overpolishing at the edge of the object to be polished is minimized. Accordingly, the surface of the object can be polished flat and uniformly.
- the polishing surface constituting member has a laminated structure including at least two layers, and the grooves or grooves provided between the projections extend to the surface of a layer of the polishing surface constituting member immediately subsequent to a layer thereof that comes in contact with the object to be polished. Therefore, the follow-up capability of the polishing surface constituting member with respect to the object being polished is further improved, and overpolishing at the edge of the object to be polished is further minimized. Accordingly, the surface of the object can be polished even more flat and uniformly.
- the polishing surface constituting member has a laminated structure including at least two layers, and the grooves or grooves provided between the projections extend into a layer of the polishing surface constituting member immediately subsequent to a layer thereof that comes in contact with the object to be polished. Therefore, the width of the grooves can be narrowed without degrading the follow-up capability of the polishing surface constituting member with respect to the object being polished, and the surface of the object can be polished still more flat and uniformly.
- At least one of underlying layers of the polishing surface constituting member subsequent to the layer thereof that comes in contact with the object to be polished is a layer pressurized by a fluid. Therefore, the follow-up capability of the polishing surface constituting member with respect to the object being polished is further improved by properly varying the pressure of the fluid. Accordingly, overpolishing at the edge of the object to be polished is minimized, and the surface of the object can be polished flat and uniformly. Even if the layer of the polishing surface constituting member that comes in contact with the object to be polished is reduced in thickness, stable polishing can be performed because the pressure applied to the object to be polished can be held constant.
- the polishing apparatus uses the polishing surface constituting member according to any one of the first to fourth aspects of the present invention. Therefore, the polishing apparatus can polish the surface of the object flat and uniformly.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
A polishing surface constituting member capable of polishing an object surface flat and uniformly with minimal overpolishing at the edge of the object is provided, together with a polishing apparatus using the polishing surface constituting member. The polishing surface constituting member polishes the object pressed against it under a predetermined pressure by relative movement therebetween. A surface of the polishing surface constituting member that comes in contact with the object is provided with grooves at a predetermined pitch or provided with projections in a predetermined configuration.
Description
- The present invention relates to a polishing surface constituting member used in a polishing apparatus for polishing an object to be polished, e.g. a semiconductor substrate. More particularly, the present invention relates to a polishing surface constituting member suitable for polishing a surface of a polishing object flat and uniformly without overpolishing at the edge of the object. The present invention also relates to a polishing apparatus using the polishing surface constituting member.
- A polishing apparatus for polishing an object to be polished, e.g. a semiconductor substrate, has a polishing table with a polishing surface constituting member bonded to the upper surface thereof. The polishing apparatus further has a top ring for holding a substrate as an object to be polished, and an abrasive liquid supply nozzle. While an abrasive liquid is being supplied onto the polishing surface constituting member from the abrasive liquid supply nozzle, the substrate to be polished that is held by the top ring is pressed against the polishing surface constituting member under a predetermined pressure, and the polishing table and the top ring are rotated to cause relative movement between the polishing surface constituting member and the substrate, thereby polishing the substrate. It should be noted that the term “polishing surface constituting member” as used herein means a polishing pad, an abrasive wheel having a polishing surface, a sheet-shaped member containing abrasive grains, etc.
- As the degree of integration of semiconductor devices increases, it is increasingly demanded that substrates to be polished, e.g. semiconductor substrates, should be polished flat and uniformly. To polish a substrate flat and uniformly, the general practice is to press the whole surface of the substrate against the surface of a polishing surface constituting member under a uniform pressure. However, because the polishing surface constituting member has elasticity, as shown in FIG. 12, the polishing
surface constituting member 20 is deformed during polishing in the vicinity of a portion thereof that comes in contact with theedge 10 a of thesubstrate 10. Accordingly, the surface of thesubstrate 10 to be polished cannot uniformly be pressed against the polishingsurface constituting member 20. More specifically, the polishingsurface constituting member 20 is deformed downwardly by being pressed with thesubstrate 10 being polished. At this time, a particularly high pressure is applied to theedge 10 a of thesubstrate 10, causing theedge 10 a to be overpolished. This is known as “edge rounding”. - Further, in the vicinity of the
edge 10 a of thesubstrate 10, the polishingsurface constituting member 20 cannot follow the geometry of thesubstrate 10 because it is deformed downwardly by theedge 10 a of thesubstrate 10. That is, a rebound region occurs as shown in FIG. 13. Accordingly, at the rebound region with a width D, the pressure applied to the polishingsurface constituting member 20 reduces, and hence the polishing rate reduces. Consequently, flat and uniform polishing cannot be attained. It should be noted that FIG. 13 is an enlarged view of part A in FIG. 12. - As shown in FIG. 14, a polishing pad20-1 generally used as the polishing
surface constituting member 20 has a double-layer structure including a relatively hardfirst layer 21 formed by using IC-1000 or the like, and a relatively softsecond layer 22 made of SUBA400 or the like. In the polishing pad 20-1, the relatively hardfirst layer 21 forms a surface that comes in contact with thesubstrate 10 to polish it. The relatively softsecond layer 22, which is an underlying layer, allows thefirst layer 21 to follow surface waviness or the like of thesubstrate 10. However, because thefirst layer 21 is a relatively hard layer, follow-up capability undesirably reduces in the vicinity of theedge 10 a of thesubstrate 10. Consequently, the width D of the rebound region becomes about 6 mm. Thus, overpolishing at theedge 10 a of thesubstrate 10 cannot be reduced. - In general, the polishing
surface constituting member 20 needs to retain an abrasive liquid. Therefore, the surface of the polishingsurface constituting member 20 is provided with a large number ofgrooves 23 in a lattice configuration as shown in FIG. 15, or provided with a large number ofholes 24 as shown in FIG. 16. However, thegrooves 23 and theholes 24 are not provided to prevent overpolishing at theedge 10 a of thesubstrate 10 and hence have no function of preventing overpolishing at theedge 10 a of thesubstrate 10. - The present invention has been made in view of the above-described circumstances.
- Accordingly, one purpose of the present invention is to provide a polishing surface constituting member capable of polishing a surface of a polishing object flat and uniformly with minimal overpolishing at the edge of the object.
- Another purpose of the present invention is to provide a polishing apparatus using the above-described polishing surface constituting member.
- According to a first aspect of the present invention, a polishing surface constituting member is provided for polishing an object to be polished by pressing the object against the polishing surface constituting member under a predetermined pressure and causing relative movement between the object and the polishing surface constituting member. A surface of the polishing surface constituting member that comes in contact with the object is provided with grooves at a predetermined pitch or provided with projections in a predetermined configuration.
- According to the above-described structure of the present invention, the surface of the polishing surface constituting member that comes in contact with the object to be polished is provided with grooves at a predetermined pitch or provided with projections in a predetermined configuration. Therefore, the follow-up capability of the polishing surface constituting member with respect to the object being polished is improved, and overpolishing at the edge of the object to be polished is minimized. Accordingly, the surface of the object can be polished flat and uniformly.
- In addition, the present invention provides a polishing surface constituting member for polishing an object to be polished by pressing the object against the polishing surface constituting member under a predetermined pressure and causing relative movement between the object and the polishing surface constituting member. A surface of the polishing surface constituting member that comes in contact with the object is provided with a large number of disk-shaped projections at a predetermined pitch suitable for improving follow-up capability with respect to the object being polished and for preventing overpolishing at the edge of the object, whereby grooves are provided between the disk-shaped projections.
- According to the above-described structure of the present invention, the surface of the polishing surface constituting member that comes in contact with the object to be polished is provided with a large number of disk-shaped projections at a predetermined pitch suitable for improving follow-up capability with respect to the object being polished and for preventing overpolishing at the edge of the object, whereby grooves are provided between the disk-shaped projections. Therefore, the follow-up capability of the polishing surface constituting member with respect to the object being polished is improved, and overpolishing at the edge of the object to be polished is minimized. Accordingly, the surface of the object can be polished flat and uniformly.
- According to a second aspect of the present invention, the polishing surface constituting member according to the first aspect of the present invention has a laminated structure including at least two layers, and the grooves or grooves provided between the projections extend to the surface of a layer of the polishing surface constituting member immediately subsequent to a layer thereof that comes in contact with the object to be polished.
- According to the above-described structure of the present invention, the polishing surface constituting member has a laminated structure including at least two layers, and the grooves or grooves provided between the projections extend to the surface of a layer of the polishing surface constituting member immediately subsequent to a layer thereof that comes in contact with the object to be polished. Therefore, the follow-up capability of the polishing surface constituting member with respect to the object being polished is further improved, and overpolishing at the edge of the object to be polished is further minimized. Accordingly, the surface of the object can be polished even more flat and uniformly.
- According to a third aspect of the present invention, the polishing surface constituting member according to the first aspect of the present invention has a laminated structure including at least two layers, and the grooves or grooves provided between the projections extend into a layer of the polishing surface constituting member immediately subsequent to a layer thereof that comes in contact with the object to be polished.
- According to the above-described structure of the present invention, the polishing surface constituting member has a laminated structure including at least two layers, and the grooves or grooves provided between the projections extend into a layer of the polishing surface constituting member immediately subsequent to a layer thereof that comes in contact with the object to be polished. Therefore, the width of the grooves can be narrowed without degrading the follow-up capability of the polishing surface constituting member with respect to the object being polished, and the surface of the object can be polished still more flat and uniformly.
- According to a fourth aspect of the present invention, the polishing surface constituting member according to the second or third aspect of the present invention is arranged such that at least one of underlying layers of the polishing surface constituting member subsequent to the layer thereof that comes in contact with the object to be polished is a layer pressurized by a fluid.
- According to the above-described structure of the present invention, at least one of underlying layers of the polishing surface constituting member subsequent to the layer thereof that comes in contact with the object to be polished is a layer pressurized by a fluid. Therefore, the follow-up capability of the polishing surface constituting member with respect to the object being polished is further improved by properly varying the pressure of the fluid. Accordingly, overpolishing at the edge of the object to be polished is minimized, and the surface of the object can be polished flat and uniformly. Even if the layer of the polishing surface constituting member that comes in contact with the object to be polished is reduced in thickness, stable polishing can be performed because the pressure applied to the object to be polished can be held constant.
- According to a fifth aspect of the present invention, there is provided a polishing apparatus for polishing an object to be polished by pressing the object against a polishing surface constituting member on a polishing table under a predetermined pressure and causing relative movement between the object and the polishing surface constituting member. The polishing surface constituting member of the polishing apparatus is the polishing surface constituting member according to any one of the first to fourth aspects of the present invention.
- According to the above-described structure of the present invention, the polishing surface constituting member according to any one of the first to fourth aspects of the present invention is used as the polishing surface constituting member of the polishing apparatus. Therefore, the polishing apparatus can polish the surface of the object flat and uniformly.
- The above and other functions, features and advantages of the present invention will become more apparent from the following description of the preferred embodiments thereof, taken in conjunction with the accompanying drawings.
- FIG. 1 is a cross-section of an essential part of a polishing pad used as a polishing surface constituting member according to the present invention, showing a structural example thereof.
- FIG. 2 is a graph showing the results of polishing a substrate as an object to be polished.
- FIG. 3 is an enlarged view of part B in FIG. 2.
- FIG. 4 is a partly-sectioned perspective of an essential part of a polishing pad used as a polishing surface constituting member according to the present invention, showing another structural example thereof.
- FIG. 5 is a cross-section showing an essential part of another embodiment of the polishing surface constituting member according to the present invention.
- FIG. 6 is a cross-section showing an essential part of still another embodiment of the polishing surface constituting member according to the present invention.
- FIG. 7 is a cross-section showing an essential part of a further embodiment of the polishing surface constituting member according to the present invention.
- FIG. 8 is a schematic sectional view showing a further embodiment of the polishing surface constituting member according to the present invention.
- FIG. 9 is a diagram showing a structural example of a polishing apparatus using the polishing surface constituting member according to the present invention.
- FIG. 10 is a perspective showing another structural example of a polishing apparatus using the polishing surface constituting member according to the present invention.
- FIG. 11 is a diagram showing still another structural example of a polishing apparatus using the polishing surface constituting member according to the present invention.
- FIG. 12 is a diagram showing problems associated with a conventional polishing surface constituting member.
- FIG. 13 is an enlarged view of part A in FIG. 12.
- FIG. 14 is a cross-section of a conventional polishing pad.
- FIG. 15 is a diagram showing a structural example of a conventional polishing surface constituting member.
- FIG. 16 is a diagram showing another structural example of a conventional polishing surface constituting member.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a cross-section showing an essential part of a polishing pad1-1 used as a polishing
surface constituting member 1 according to the present invention. The polishing pad 1-1 is composed of two layers, i.e. afirst layer 2, and asecond layer 3. - The
first layer 2 is made of a relatively hard material, e.g. IC-1000. The surface of thefirst layer 2 is provided withgrooves 4 extending short of the surface of thesecond layer 3 in such a manner that the pitch (interval) L of thegrooves 4 is L=5 mm. Thesecond layer 3 is made of a relatively soft material, e.g. SUBA400. - A
substrate 10 to be polished is pressed against the polishing pad 1-1 under a predetermined pressure and polished by relative movement between them. During the polishing process, it becomes easy for the polishing pad 1-1 to follow thesubstrate 10 because thefirst layer 2 is thin in thickness at portions where thegrooves 4 are provided. FIG. 2 is a graph showing the results of polishing thesubstrate 10. FIG. 3 is an enlarged view of part B in FIG. 2. In this embodiment, thegrooves 4 provided in the polishing pad 1-1 each have a width of 1 mm and a depth of 1 mm, and thesubstrate 10 to be polished has a circular shape with an outer diameter of 8 inches. In FIGS. 2 and 3, the abscissa axis represents the distance (mm) from the center of thesubstrate 10, and the ordinate axis represents the stock removal (Polishing Amount) (Å) in polishing of thesubstrate 10. - It will be understood from FIGS. 2 and 3 that when the pitch L is 5 mm, overpolishing at an
edge 10 a of thesubstrate 10 that extends over a range of about 5 mm (and a range of about 1 mm not to be measured) from the outer periphery thereof is reduced in comparison to a case where the pitch L is 10 mm. The reason for this is that the occurrence of a rebound region in the vicinity of theedge 10 a of thesubstrate 10 is suppressed owing to an improvement in follow-up capability of the polishing pad 1-1. Also, it should be noted that a rebound of the polishing pad 1-1 at theedge 10 a that extends over a range of about 3 mm from the outer periphery of thesubstrate 10 is further reduced when the pitch L is 3 mm (see FIG. 3). Thus, overpolishing and the rebound of the polishing pad 1-1 at theedge 10 a can be reduced by setting the pitch L of thegrooves 4 in the polishing pad 1-1 at 5 mm or less. - It should be noted that there is no particular restriction on the configuration of the
grooves 4 provided in the surface of the polishing pad 1-1. As shown in FIG. 15, a large number ofgrooves 4 may be provided in a lattice configuration. Alternatively,grooves 4 may be formed by providing a large number of disk-shapedprojections 5 as shown in FIG. 4. - The depth of the
grooves 4 provided in the surface of the polishingsurface constituting member 1 is not necessarily limited to the one that is short of the surface of thesecond layer 3. As shown in FIG. 5, thegrooves 4 may extend to the surface of thesecond layer 3. Alternatively, thegrooves 4 may extend into thesecond layer 3 as shown in FIG. 6. In a case where thegrooves 4 are provided to extend to the surface of thesecond layer 3 of the polishingsurface constituting member 1, the follow-up capability of the polishingsurface constituting member 1 is further improved, and the occurrence of a rebound region in the vicinity of theedge 10 a of thesubstrate 10 is further suppressed. When thegrooves 4 are provided to extend into thesecond layer 3 of the polishingsurface constituting member 1, the follow-up capability of the polishingsurface constituting member 1 will not be degraded even if the width of thegrooves 4 is narrowed. Further, because the area with which thefirst layer 2 comes in contact with thesubstrate 10 increases, the surface of thesubstrate 10 can be polished even more flat and even more uniformly. - FIG. 7 is a cross-section showing an essential part of a further embodiment of the polishing surface constituting member according to the present invention. The polishing
surface constituting member 1 according to this embodiment has a triple-layer structure in which an elasticintermediate layer 6 made, for example, of rubber or urethane foam is provided between a relatively hardfirst layer 2 and a relatively softsecond layer 3. Provision of theintermediate layer 6 makes it possible to minimize rapid changes in elasticity even when thefirst layer 2 is reduced in thickness. Regarding the depth of thegrooves 4 in this embodiment, thegrooves 4 may be provided to extend through thefirst layer 2. Alternatively, thegrooves 4 may be provided to extend into theintermediate layer 6 or as far as the inside of thesecond layer 3. Although in this embodiment the polishingsurface constituting member 1 has a triple-layer structure, the present invention is not necessarily limited thereto. The polishingsurface constituting member 1 may have a laminated structure including more than three layers. - FIG. 8 is a schematic sectional view showing a further embodiment of the polishing surface constituting member according to the present invention. The polishing
surface constituting member 1 according to this embodiment has alayer member 7 as a layer underlying a relatively hardfirst layer 2. Thelayer member 7 is capable of accommodating a fluid F therein. Thelayer member 7 can be expanded or contracted by varying the pressure of the fluid accommodated therein. More specifically, thelayer member 7 expands as the pressure therein is increased by introducing the fluid into thelayer member 7 from afluid inlet 7 a. During polishing of thesubstrate 10, the pressure in thelayer member 7 is varied appropriately, whereby it is possible to further improve the follow-up capability of the polishingsurface constituting member 1 with respect to thesubstrate 10 being polished. Even when thefirst layer 2 is reduced in thickness, stable polishing can be performed because the pressure applied to thesubstrate 10 can be held constant. It should be noted that a polishingsurface constituting member 1 having a laminated structure including three or more layers can also perform stable polishing by having thelayer member 7 as the lowermost layer. - Next, a polishing apparatus using the polishing surface constituting member according to the present invention will be described. FIG. 9 is a diagram showing a structural example of a polishing apparatus using the polishing surface constituting member according to the present invention. The polishing apparatus includes a
turntable 11 having the polishingsurface constituting member 1 according to the present invention bonded to the upper surface thereof. The polishing apparatus further includes atop ring 12 for holding asubstrate 10 to be polished in such a manner that thesubstrate 10 is rotatable and capable of being pressed against the polishingsurface constituting member 1. Further, the polishing apparatus includes an abrasiveliquid supply nozzle 13 for supplying an abrasive liquid Q to the polishingsurface constituting member 1. Thetop ring 12 is connected to atop ring shaft 14. Thetop ring shaft 14 is rotatable by a rotating device (not shown), e.g. a motor, provided in anoscillating arm 15. Thetop ring shaft 14 is also vertically movable by a vertically moving mechanism (not shown), e.g. a cylinder, provided in theoscillating arm 15. Thetop ring shaft 14 is supported by theoscillating arm 15 through bearings (not shown). Theoscillating arm 15 is supported in such a manner as to be oscillatable, together with thetop ring 12 as one unit, over a predetermined angle range in a horizontal plane parallel to the polishingsurface constituting member 1 by amotor 16. - The
top ring 12 has thesubstrate 10 attached on the lower surface thereof by a holding device (not shown). Thetop ring 12 has acylindrical guide ring 17 provided on the outer periphery thereof to prevent thesubstrate 10 from becoming dislodged from the lower surface of thetop ring 12 during polishing. Theguide ring 17 is secured to thetop ring 12. The lower end surface of theguide ring 17 projects from the substrate holding surface of thetop ring 12 so that thesubstrate 10 is held in a recess defined inside the projecting lower end of theguide ring 17. - With the above-described arrangement, the
substrate 10 to be polished is attached on the lower surface of thetop ring 12. Thesubstrate 10 is pressed against the polishingsurface constituting member 1 on theturntable 11 by thetop ring 12, and theturntable 11 and thetop ring 12 are rotated to cause relative movement between the polishingsurface constituting member 1 and thesubstrate 10, thereby polishing thesubstrate 10. At this time, the abrasive liquid Q is supplied onto the polishingsurface constituting member 1 from the abrasiveliquid supply nozzle 13. A liquid containing abrasive grains, for example, fine silica particles, is used as the abrasive liquid Q. The polishing apparatus can polish the surface of thesubstrate 10 flat and uniformly because it uses the polishingsurface constituting member 1 according to the present invention. - It should be noted that the polishing apparatus using the polishing
surface constituting member 1 according to the present invention is not necessarily limited to that shown in FIG. 9. The polishingsurface constituting member 1 according to the present invention is applicable to any polishing apparatus wherein a substrate to be polished is pressed against a polishing pad and polished by relative movement therebetween. - For example, the present invention may be applied to a polishing apparatus as shown in FIG. 10. The polishing apparatus has a polishing table33 arranged such that a polishing sheet 1-2 as a polishing
surface constituting member 1 unwound from a polishingsheet feed drum 31 is wound onto a polishing sheet take-up drum 32 via aback plate 30. The polishing apparatus further has atop ring 12. Asubstrate 10 to be polished that is held by the rotatingtop ring 12 is pressed against the polishing sheet 1-2 passing over the upper surface of theback plate 30 of the polishing table 33, thereby polishing thesubstrate 10. - The present invention may also be applied to a polishing apparatus as shown in FIG. 11. The polishing apparatus has a
rotary drum 34 having a polishing sheet 1-2 bonded to the outer peripheral surface thereof as a polishingsurface constituting member 1. The polishing apparatus further has atop ring 12. Asubstrate 10 to be polished that is held by the rotatingtop ring 12 is pressed against the polishing sheet 1-2 on therotary drum 34, thereby polishing thesubstrate 10. - In the polishing apparatus of the present invention, the polishing
surface constituting member 1 confusing-consider eliminating which contacts and polishes the surface of thesubstrate 10 to be polished can be constituted by a grinder or a pad or a sheet which contains abrasive grains. - As has been described above, the present invention provides the following advantages.
- According to the first aspect of the present invention, the surface of the polishing surface constituting member that comes in contact with an object to be polished is provided with grooves at a predetermined pitch or provided with projections in a predetermined configuration. Therefore, the follow-up capability of the polishing surface constituting member with respect to the object being polished is improved, and overpolishing at the edge of the object to be polished is minimized. Accordingly, the surface of the object can be polished flat and uniformly.
- According to the second aspect of the present invention, the polishing surface constituting member has a laminated structure including at least two layers, and the grooves or grooves provided between the projections extend to the surface of a layer of the polishing surface constituting member immediately subsequent to a layer thereof that comes in contact with the object to be polished. Therefore, the follow-up capability of the polishing surface constituting member with respect to the object being polished is further improved, and overpolishing at the edge of the object to be polished is further minimized. Accordingly, the surface of the object can be polished even more flat and uniformly.
- According to the third aspect of the present invention, the polishing surface constituting member has a laminated structure including at least two layers, and the grooves or grooves provided between the projections extend into a layer of the polishing surface constituting member immediately subsequent to a layer thereof that comes in contact with the object to be polished. Therefore, the width of the grooves can be narrowed without degrading the follow-up capability of the polishing surface constituting member with respect to the object being polished, and the surface of the object can be polished still more flat and uniformly.
- According to the fourth aspect of the present invention, at least one of underlying layers of the polishing surface constituting member subsequent to the layer thereof that comes in contact with the object to be polished is a layer pressurized by a fluid. Therefore, the follow-up capability of the polishing surface constituting member with respect to the object being polished is further improved by properly varying the pressure of the fluid. Accordingly, overpolishing at the edge of the object to be polished is minimized, and the surface of the object can be polished flat and uniformly. Even if the layer of the polishing surface constituting member that comes in contact with the object to be polished is reduced in thickness, stable polishing can be performed because the pressure applied to the object to be polished can be held constant.
- According to the fifth aspect of the present invention, the polishing apparatus uses the polishing surface constituting member according to any one of the first to fourth aspects of the present invention. Therefore, the polishing apparatus can polish the surface of the object flat and uniformly.
- It should be noted that the present invention is not necessarily limited to the foregoing embodiments but can be modified in a variety of ways.
Claims (9)
1. A polishing surface constituting member for polishing an object to be polished by pressing said object against said polishing surface constituting member under a predetermined pressure and causing relative movement between said object and said polishing surface constituting member,
wherein a surface of said polishing surface constituting member that comes in contact with said object is provided with grooves at a predetermined pitch or provided with projections in a predetermined configuration.
2. A polishing surface constituting member according to claim 1 , which has a laminated structure including at least two layers, wherein said grooves or grooves provided between said projections extend to a surface of a layer of said polishing surface constituting member immediately subsequent to a layer thereof that comes in contact with said object to be polished.
3. A polishing surface constituting member according to claim 2 , wherein at least one of underlying layers of said polishing surface constituting member subsequent to the layer thereof that comes in contact with said object to be polished is a layer pressurized by a fluid.
4. A polishing surface constituting member according to claim 1 , which has a laminated structure including at least two layers, wherein said grooves or grooves provided between said projections extend into a layer of said polishing surface constituting member immediately subsequent to a layer thereof that comes in contact with said object to be polished.
5. A polishing surface constituting member according to claim 4 , wherein at least one of underlying layers of said polishing surface constituting member subsequent to the layer thereof that comes in contact with said object to be polished is a layer pressurized by a fluid.
6. A polishing apparatus for polishing an object to be polished by pressing said object against a polishing surface constituting member on a polishing table under a predetermined pressure and causing relative movement between said object and said polishing surface constituting member,
wherein said polishing surface constituting member is the polishing surface constituting member according to claim 1 .
7. A polishing apparatus for polishing an object to be polished by pressing said object against a polishing surface constituting member on a polishing table under a predetermined pressure and causing relative movement between said object and said polishing surface constituting member,
wherein said polishing surface constituting member is the polishing surface constituting member according to claim 2 .
8. A polishing apparatus for polishing an object to be polished by pressing said object against a polishing surface constituting member on a polishing table under a predetermined pressure and causing relative movement between said object and said polishing surface constituting member,
wherein said polishing surface constituting member is the polishing surface constituting member according to claim 4 .
9. A polishing surface constituting member according to claim 1 , which has a laminated structure including at least two layers, wherein said grooves or grooves provided between said projections extend short of a surface of a layer of said polishing surface constituting member immediately subsequent to a layer thereof that comes in contact with said object to be polished.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP243278/2001 | 2001-08-10 | ||
JP2001243278A JP2003053657A (en) | 2001-08-10 | 2001-08-10 | Polishing surface structural member and polishing device using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
US20030032378A1 true US20030032378A1 (en) | 2003-02-13 |
Family
ID=19073402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/214,355 Abandoned US20030032378A1 (en) | 2001-08-10 | 2002-08-08 | Polishing surface constituting member and polishing apparatus using the polishing surface constituting member |
Country Status (2)
Country | Link |
---|---|
US (1) | US20030032378A1 (en) |
JP (1) | JP2003053657A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006072452A1 (en) * | 2004-12-30 | 2006-07-13 | Supfina Grieshaber Gmbh & Co .Kg | Device ahd method for polishing wafers with abrasive bound in a foamed plastic |
US20080305720A1 (en) * | 2005-08-30 | 2008-12-11 | Toyo Tire & Rubber Co., Ltd. | Method for Production of a Laminate Polishing Pad |
US20090093202A1 (en) * | 2006-04-19 | 2009-04-09 | Toyo Tire & Rubber Co., Ltd. | Method for manufacturing polishing pad |
US20100009611A1 (en) * | 2006-09-08 | 2010-01-14 | Toyo Tire & Rubber Co., Ltd. | Method for manufacturing a polishing pad |
US20100317263A1 (en) * | 2008-03-12 | 2010-12-16 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
US8602846B2 (en) | 2007-01-15 | 2013-12-10 | Toyo Tire & Rubber Co., Ltd. | Polishing pad and a method for manufacturing the same |
WO2019052743A1 (en) * | 2017-09-12 | 2019-03-21 | Carl Zeiss Smt Gmbh | Method for machining a workpiece in the production of an optical element |
US20210323114A1 (en) * | 2020-04-21 | 2021-10-21 | Smart Pad LLC | Chemical-mechanical polishing pad with protruded structures |
CN115401601A (en) * | 2021-05-26 | 2022-11-29 | Skc索密思株式会社 | Polishing system, polishing pad, and method for manufacturing semiconductor device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120302148A1 (en) * | 2011-05-23 | 2012-11-29 | Rajeev Bajaj | Polishing pad with homogeneous body having discrete protrusions thereon |
-
2001
- 2001-08-10 JP JP2001243278A patent/JP2003053657A/en active Pending
-
2002
- 2002-08-08 US US10/214,355 patent/US20030032378A1/en not_active Abandoned
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006072452A1 (en) * | 2004-12-30 | 2006-07-13 | Supfina Grieshaber Gmbh & Co .Kg | Device ahd method for polishing wafers with abrasive bound in a foamed plastic |
US20080305720A1 (en) * | 2005-08-30 | 2008-12-11 | Toyo Tire & Rubber Co., Ltd. | Method for Production of a Laminate Polishing Pad |
US9126303B2 (en) | 2005-08-30 | 2015-09-08 | Toyo Tire & Rubber Co., Ltd. | Method for production of a laminate polishing pad |
US8500932B2 (en) | 2006-04-19 | 2013-08-06 | Toyo Tire & Rubber Co., Ltd. | Method for manufacturing polishing pad |
US20090093202A1 (en) * | 2006-04-19 | 2009-04-09 | Toyo Tire & Rubber Co., Ltd. | Method for manufacturing polishing pad |
US8398794B2 (en) | 2006-04-19 | 2013-03-19 | Toyo Tire & Rubber Co., Ltd. | Method for manufacturing polishing pad |
US9050707B2 (en) | 2006-04-19 | 2015-06-09 | Toyo Tire & Rubber Co., Ltd. | Method for manufacturing polishing pad |
US20100009611A1 (en) * | 2006-09-08 | 2010-01-14 | Toyo Tire & Rubber Co., Ltd. | Method for manufacturing a polishing pad |
US8602846B2 (en) | 2007-01-15 | 2013-12-10 | Toyo Tire & Rubber Co., Ltd. | Polishing pad and a method for manufacturing the same |
US8476328B2 (en) * | 2008-03-12 | 2013-07-02 | Toyo Tire & Rubber Co., Ltd | Polishing pad |
US20100317263A1 (en) * | 2008-03-12 | 2010-12-16 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
WO2019052743A1 (en) * | 2017-09-12 | 2019-03-21 | Carl Zeiss Smt Gmbh | Method for machining a workpiece in the production of an optical element |
US11980990B2 (en) | 2017-09-12 | 2024-05-14 | Carl Zeiss Smt Gmbh | Method for machining a workpiece in the production of an optical element |
US20210323114A1 (en) * | 2020-04-21 | 2021-10-21 | Smart Pad LLC | Chemical-mechanical polishing pad with protruded structures |
CN115401601A (en) * | 2021-05-26 | 2022-11-29 | Skc索密思株式会社 | Polishing system, polishing pad, and method for manufacturing semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JP2003053657A (en) | 2003-02-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8133096B2 (en) | Multi-phase polishing pad | |
JP2738392B1 (en) | Polishing apparatus and polishing method for semiconductor device | |
US5899745A (en) | Method of chemical mechanical polishing (CMP) using an underpad with different compression regions and polishing pad therefor | |
EP1133380B1 (en) | A carrier head with edge control for chemical mechanical polishing | |
US6575825B2 (en) | CMP polishing pad | |
US6402591B1 (en) | Planarization system for chemical-mechanical polishing | |
EP1800800A1 (en) | Abrasive pad | |
US6498101B1 (en) | Planarizing pads, planarizing machines and methods for making and using planarizing pads in mechanical and chemical-mechanical planarization of microelectronic device substrate assemblies | |
US5876273A (en) | Apparatus for polishing a wafer | |
US6093085A (en) | Apparatuses and methods for polishing semiconductor wafers | |
US6143127A (en) | Carrier head with a retaining ring for a chemical mechanical polishing system | |
JP4750250B2 (en) | Carrier head with modified flexible membrane | |
JP4264289B2 (en) | Wafer polishing apparatus, polishing head thereof, and wafer polishing method | |
US20030032378A1 (en) | Polishing surface constituting member and polishing apparatus using the polishing surface constituting member | |
US20050014455A1 (en) | Method and pad for polishing wafer | |
US6224712B1 (en) | Polishing apparatus | |
JPH1086057A (en) | Polishing device and its conditioner | |
US7121933B2 (en) | Chemical mechanical polishing apparatus | |
JPH11254305A (en) | Both side polishing method for wafer and wafer carrier used for polishing method | |
JP3326841B2 (en) | Polishing equipment | |
US20010034192A1 (en) | Apparatus, backing plate, backing film and method for chemical mechanical polishing | |
JP3856634B2 (en) | Substrate holding device and polishing apparatus provided with the substrate holding device | |
CN115551676A (en) | Polishing device for wafer outer periphery | |
JPH11233466A (en) | Method and equipment for manufacturing semiconductor elements | |
JP2005271172A (en) | Abrasive pad |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: EBARA CORPORATION, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ICHIMURA, TERUHIKO;AKAGI, MAKOTO;TOGAWA, TETSUJI;REEL/FRAME:013411/0878 Effective date: 20021001 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |