US20030008148A1 - Optimized capping layers for EUV multilayers - Google Patents

Optimized capping layers for EUV multilayers Download PDF

Info

Publication number
US20030008148A1
US20030008148A1 US09/898,833 US89883301A US2003008148A1 US 20030008148 A1 US20030008148 A1 US 20030008148A1 US 89883301 A US89883301 A US 89883301A US 2003008148 A1 US2003008148 A1 US 2003008148A1
Authority
US
United States
Prior art keywords
overcoat
layer
bilayer
layer comprises
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US09/898,833
Inventor
Sasa Bajt
James Folta
Eberhard Spiller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of California
Original Assignee
University of California
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of California filed Critical University of California
Priority to US09/898,833 priority Critical patent/US20030008148A1/en
Assigned to REGENTS OF THE UNIVERSITY OF CALIFORNIA, THE reassignment REGENTS OF THE UNIVERSITY OF CALIFORNIA, THE ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BAJT, SASA, FOLTA, JAMES A., SPILLER, EBERHARD
Priority to US10/066,108 priority patent/US6780496B2/en
Assigned to U.S. DEPARTMENT OF ENERGY reassignment U.S. DEPARTMENT OF ENERGY CONFIRMATORY LICENSE (SEE DOCUMENT FOR DETAILS). Assignors: CALIFORNIA, UNIVERSITY OF
Priority to KR1020047000028A priority patent/KR100749897B1/en
Priority to PCT/US2002/021128 priority patent/WO2003005377A2/en
Priority to JP2003511257A priority patent/JP4460284B2/en
Priority to EP02748067A priority patent/EP1402542B1/en
Priority to AU2002318192A priority patent/AU2002318192A1/en
Priority to AT02748067T priority patent/ATE374425T1/en
Priority to DE60222663T priority patent/DE60222663T2/en
Publication of US20030008148A1 publication Critical patent/US20030008148A1/en
Priority to JP2008163789A priority patent/JP4929238B2/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/08Mirrors
    • G02B5/0891Ultraviolet [UV] mirrors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/08Mirrors
    • G02B5/0816Multilayer mirrors, i.e. having two or more reflecting layers
    • G02B5/0825Multilayer mirrors, i.e. having two or more reflecting layers the reflecting layers comprising dielectric materials only
    • GPHYSICS
    • G21NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21KTECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K1/00Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
    • G21K1/06Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diffraction, refraction or reflection, e.g. monochromators
    • G21K1/062Devices having a multilayer structure
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12674Ge- or Si-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12729Group IIA metal-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771Transition metal-base component
    • Y10T428/12806Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12826Group VIB metal-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495Thickness [relative or absolute]
    • Y10T428/24967Absolute thicknesses specified
    • Y10T428/24975No layer or component greater than 5 mils thick
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/26Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264Up to 3 mils
    • Y10T428/2651 mil or less
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/30Self-sustaining carbon mass or layer with impregnant or other layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal

Definitions

  • the present invention relates to capping layers for multilayer reflective coatings used in extreme ultraviolet or soft x-ray lithography applications.
  • EUV Extreme ultraviolet
  • soft x-ray projection lithography make use of optical elements with highly reflective multilayer coatings.
  • These multilayer coatings typically consist of alternating layers of molybdenum (Mo) and silicon (Si) or molybdenum and beryllium (Be).
  • Mo molybdenum
  • Si silicon
  • Be molybdenum and beryllium
  • High EUV reflectivity is essential for lithography applications.
  • a critical limitation to achieving the maximum theoretical peak reflectivity is the oxidation and corrosion of the top layers, which both increases the absorption and degrades the phase coherence of the reflection from these layers.
  • Mo/Si multilayers with Mo as the top layer have the highest theoretically possible reflectivity; however, Mo is not stable in air and therefore Mo/Si multilayers for EUV optics are usually capped with a Si top layer with a loss in reflectivity of 1.3%. After exposure to air, this layer partly oxidizes and forms SiO 2 that absorbs EUV light and reduces the reflectance of the multilayer by about another 1-2 %. This reflectance of Si capped multilayers will remain unchanged for years if the multilayers are kept at room temperatures. See C. Montcalm, S. Bajt, P. B. Mirkarimi, E. Spiller, F. J. Weber, and J. A.
  • the overcoat bilayer comprises a layer of silicon or beryllium underneath at least one top layer of an elemental or a compound material that resists oxidation and corrosion. Materials for the top layer include carbon, palladium, carbides, borides, nitrides, and oxides.
  • the thicknesses of the two layers that make up the overcoat bilayer are optimized to produce the highest reflectance at the wavelength range of operation.
  • Protective overcoat systems comprising three or more layers are also possible.
  • the present invention is a passivating overcoat bilayer for multilayer reflective coatings for soft x-ray or extreme ultraviolet applications and the method for making such layers. These passivating layers are useful for reflective optical coatings for soft x-ray and extreme ultraviolet wavelengths in applications such as microscopy, astronomy, spectroscopy, laser research, laser cavities and optics, synchrotron optics, and projection lithography.
  • a passivating overcoat bilayer (also called a “capping” bilayer) is deposited on top of a multilayer coating to prevent oxidation and corrosion of the multilayer coating, thereby improving the EUV optical performance.
  • the multilayer coating can comprise alternating layers of a variety of materials, such as molybdenum-silicon, molybdenum carbide-silicon, molybdenum-beryllium, and molybdenum carbide-beryllium.
  • the passivating bilayer comprises a diffusion resistant layer underneath at least one top layer of an elemental material or compound that resists oxidation and corrosion.
  • Oxidation resistant materials for the top layer (or layers) may include pure elements, such as Ru, Zr, Rh or Pd, and similar materials or compound materials.
  • Diffusion resistant materials for the bottom layer include B 4 C, Mo and carbon and similar materials or compound materials.
  • the top layer and the bottom layer may each comprise a plurality of layers.
  • each layer that makes up the overcoat bilayer is in the range of about 0.5 to 7 nanometers, and the thicknesses are selected to produce the highest reflectance at the EUV wavelength range of operation.
  • the thickness of the overcoat bilayer will typically be different from the thickness of the pairs of alternating layers in the underlying multilayer coating.
  • the thickness of the two layers in the overcoat are individually optimized so as to provide sufficient chemical protection and to maximize EUV optical performance.
  • FIG. 1 shows passivating overcoat bilayer of the present invention on a multilayer reflective coating.
  • FIG. 2 shows an embodiment that uses a diffusion barrier of Mo under a Ru layer.
  • FIG. 3 shows optimization of the thicknesses of Ru and Mo to obtain the highest reflectances.
  • FIG. 4A shows an embodiment that provides a diffusion barrier of B 4 C under the Ru layer.
  • FIG. 4B illustrates the replacement with B 4 C of the top part of the last Si layer of the multilayer reflective coating.
  • FIG. 5 shows the optimum B 4 C barrier thickness is a tradeoff between reflectance and interdiffusion.
  • FIG. 6 shows the reflectance as a function of wavelength of a Ru/B 4 C/Si capping layer system and a Ru/Mo capping layer system where the Ru layers are 2.2 nm thick.
  • the present invention is a passivating overcoat bilayer for a multilayer reflective coating and is shown schematically in FIG. 1.
  • the overcoat bilayer 10 is made up of a top layer 14 , and a bottom layer 12 .
  • Top layer 14 comprises a material that resists corrosion and oxidation and protects the underlying layers from oxidation.
  • the bottom layer 12 is deposited on a multilayer coating 16 , which typically comprises alternating layers of an absorber material 18 and a spacer material 20 .
  • the multilayer coating 16 is deposited on a substrate 22 .
  • Bottom layer 12 comprises a material that prevents diffusion of the top layer 14 into the top layer 18 of the multilayer coating 16 .
  • the present invention contemplates including a plurality of components and layers within top layer 14 and/or bottom layer 12 .
  • Ru is very stable against oxidation in the environment of a EUV camera. However, a loss in reflectance of 1%-5% is observed over the standard reference coating. This loss is due to the diffusion of Ru and Si and the formation of ruthenium silicide. For a successful capping layer system, an additional layer that acts as diffusion barrier between the Ru and the underlying structure is therefore needed.
  • Other elements that can be substituted for Ru in the present invention include Zr, Rh and Pd and similar materials and compounds.
  • FIG. 2 shows an embodiment that uses a diffusion barrier 30 of Mo under the Ru layer 32 and on top of the last Si layer 34 in the first system.
  • the molybdenum layer acts as the diffusion barrier between the Ru layer and the Si layer.
  • Multilayers capped with 1.3 nm of Mo and between 0.6 nm and 3 nm of Ru have been produced. This embodiment has measured over 67% reflectance.
  • FIG. 3 shows optimization of the thicknesses of Ru and Mo to obtain the highest reflectances.
  • Diffusion barrier 30 may be formed from other materials such as, e.g., carbon.
  • FIG. 4A shows an embodiment that provides a diffusion barrier 40 of B 4 C under the Ru layer 42 and on top of the last Si layer 44 , which is on Mo layer 46 .
  • Ru/B 4 C multilayers form very smooth and compositionally abrupt interfaces.
  • Thermal annealing at 100° and 250° C. produced no measurable change in the reflectance.
  • a theoretical calculation shows a 2-3% reflectance loss if the last Si layer is replaced with B 4 C due to the less favorable optical properties of B 4 C in the EUV energy range. Experimental data support this prediction. However, this loss can be greatly reduced by replacing only the top part of the last Si layer with B 4 C, as shown in FIG. 4A.
  • FIG. 5 shows that the optimum B 4 C barrier thickness is a tradeoff between reflectance and interdiffusion.
  • FIG. 6 shows the reflectance as a function of wavelength of a Ru/B 4 C/Si capping layer system and a Ru/Mo capping layer system where the Ru layers are 2.2 nm thick.
  • FIG. 4B shows an embodiment where the top Si layer of a Si/Mo multilayer structure has been entirely replaced with a B 4 C layer 50 .
  • the multilayer structure is formed of alternating layers of Mo ( 52 ) and Si ( 54 ). It can be seen that the thickness 56 of one pair of alternating layers of the multilayer structure is the same as the combined thickness 58 of the Mo layer 54 and the B 4 C layer 50 .
  • Ru layer 60 is shown on top of the B 4 C layer 50 .
  • Diffusion barrier 50 may be formed from other materials such as, e.g., carbon.
  • a multilayer coating 16 that is designed for applications in extreme ultraviolet (EUV) lithography is typically made of a periodic stack of 40-100 alternating layers of molybdenum (Mo) and silicon (Si), or molybdenum and beryllium (Be).
  • Mo molybdenum
  • Si silicon
  • Be molybdenum and beryllium
  • other structures e.g., non-periodic stacks, multilayer stacks with other materials or with more than two materials
  • the combinations of Mo and Si in one case and Mo and Be in another case exhibit unusually high normal incidence reflectivity (at least 65%) in the EUV wavelength region (i.e., less than about 15 nanometers).
  • the topmost layer of the multilayer coating 16 would typically be molybdenum (the absorber material). However, since molybdenum is not stable in air, the additional overcoat bilayer is needed. It should be recognized that the Mo in the Mo/Si multilayer structures could be replaced with an absorber layer comprising another material. For example, the Mo can be replaced with molybdenum carbide or Mo 2 C. It should also be appreciated that the Mo in a Mo/Be multilayer structure can be replaced by MoRu.
  • the bottom layer 12 of the overcoat bilayer 10 is made up of either B 4 C or Mo.
  • the top layer 14 is deposited or grown on the bottom layer 12 and comprises Ru, which is a material that resists oxidation and corrosion, and has a low chemical reactivity with common atmospheric gas species such as oxygen, nitrogen, and water vapor.
  • “deposition” of the top layer is intended to encompass the concepts of both “depositing” and “growing”. This top layer 14 serves to chemically passivate and protect the underlying multilayer coating 16 and to preserve the high reflectance of the coating.
  • the passivating overcoat can be grown using a vapor phase deposition technique (e.g., sputtering). This method can be incorporated into the multilayer deposition system (e.g., magnetron sputtering with argon plasma) so that the multilayer stack can be encapsulated in situ without exposure to the atmosphere. Alternatively, the overcoat can be grown by chemical reaction.
  • a vapor phase deposition technique e.g., sputtering
  • This method can be incorporated into the multilayer deposition system (e.g., magnetron sputtering with argon plasma) so that the multilayer stack can be encapsulated in situ without exposure to the atmosphere.
  • the overcoat can be grown by chemical reaction.
  • the thicknesses of the bottom layer 12 and the top layer 14 of the overcoat bilayer 10 are chosen to produce the highest reflectance and offer high oxidation resistance at the EUV wavelength of operation, in a similar manner to how the thicknesses of both layers in the underlying periodic multilayer stack 16 were determined.
  • the best reflecting multilayer geometry is usually a quarter-wave stack, where the optical thickness of each layer is equal to a quarter of the wavelength of interest at normal incidence.
  • the optical thickness of a layer is the product of the geometrical or metric thickness and the refractive index of the material.
  • the beams reflected from each interface are in phase and add constructively. This design is ideal when both materials in the stack are non-absorbing, and still remains the best when the extinction coefficients of the two materials are similar.
  • the design of the stack must be modified to reduce the overall absorption.
  • the thickness of the absorber is reduced, while the period thickness 24 is kept constant. Therefore, thicknesses are determined by the trade-off between maximizing the constructive interference of the beams reflected at each interface and minimizing the overall absorption to enable more interfaces to contribute to the reflectance.
  • the thickness of the overcoat bilayer 10 is adjusted to provide the best phase matching with the underlying multilayer coating 16 in order to achieve the highest EUV reflectance while maintaining the highest oxidation resistance.
  • the thickness of each layer in the overcoat bilayer is in the range of 0.5 to 7 nanometers.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Optical Filters (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

A new capping multilayer structure for EUV-reflective Mo/Si multilayers consists of two layers: A top layer that protects the multilayer structure from the environment and a bottom layer that acts as a diffusion barrier between the top layer and the structure beneath. One embodiment combines a first layer of Ru with a second layer of B4C. Another embodiment combines a first layer of Ru with a second layer of Mo. These embodiments have the additional advantage that the reflectivity is also enhanced. Ru has the best oxidation resistance of all materials investigated so far. B4C is an excellent barrier against silicide formation while the silicide layer formed at the Si boundary is well controlled.

Description

  • [0001] The United States Government has rights in this invention pursuant to Contract No. W-7405-ENG-48 between the United States Department of Energy and the University of California for the operation of Lawrence Livermore National Laboratory.
  • BACKGROUND OF THE INVENTION
  • 1. Field of the Invention [0002]
  • The present invention relates to capping layers for multilayer reflective coatings used in extreme ultraviolet or soft x-ray lithography applications. [0003]
  • 2. Description of Related Art [0004]
  • Extreme ultraviolet (EUV) and soft x-ray projection lithography make use of optical elements with highly reflective multilayer coatings. These multilayer coatings typically consist of alternating layers of molybdenum (Mo) and silicon (Si) or molybdenum and beryllium (Be). High EUV reflectivity is essential for lithography applications. A critical limitation to achieving the maximum theoretical peak reflectivity is the oxidation and corrosion of the top layers, which both increases the absorption and degrades the phase coherence of the reflection from these layers. [0005]
  • Although there have been numerous investigations of carbon-based, boron carbide-based, and silicon-based multilayer coatings for EUV mirrors, there has been little work on environmental effects (e.g., oxidation and corrosion) of these structures. Underwood et al. (Applied Optics 32:6985 (1993)) investigated the aging effects of Mo—Si multilayers by monitoring the decrease in reflectivity with time. Their experimental results showed a degradation of the Mo—Si multilayer reflectance caused by the oxidation of the topmost layer of molybdenum. Underwood et al. identified the oxidation of the molybdenum layer as a potential problem in soft x-ray projection lithography. The proposed solutions were to make silicon the topmost layer, to store the optical elements in an inert atmosphere or vacuum, or to remove the oxidized surface by sputtering or chemical etching. Underwood et al. did not investigate the use of passivating layers. [0006]
  • Mo/Si multilayers with Mo as the top layer have the highest theoretically possible reflectivity; however, Mo is not stable in air and therefore Mo/Si multilayers for EUV optics are usually capped with a Si top layer with a loss in reflectivity of 1.3%. After exposure to air, this layer partly oxidizes and forms SiO[0007] 2 that absorbs EUV light and reduces the reflectance of the multilayer by about another 1-2 %. This reflectance of Si capped multilayers will remain unchanged for years if the multilayers are kept at room temperatures. See C. Montcalm, S. Bajt, P. B. Mirkarimi, E. Spiller, F. J. Weber, and J. A. Folta, in “Emerging Lithographic Technologies II”, ed. Y. Vladimirsky, SPIE Vol 3331, 42-51 (1998). However, in a working EUV lithography tool the coatings are exposed to EUV illumination in the presence of low background pressure gases including water, oxygen, and hydrocarbons. L. Klebanoff et al., M. Wedowski et al. references have shown that the reflectance of Si capped Mo/Si multilayers decreased as a function of EUV illumination dose and the amount of water vapor and other background gases in the system.
  • U.S. Pat. No. 5,958,605, titled “Passivating Overcoat Bilayer For Multilayer Reflective Coatings For Extreme Ultraviolet Lithography”, discloses a passivating overcoat bilayer that is used for multilayer reflective coatings for extreme ultraviolet (EUV) or soft x-ray applications to prevent oxidation and corrosion of the multilayer coating, thereby improving the EUV optical performance. The overcoat bilayer comprises a layer of silicon or beryllium underneath at least one top layer of an elemental or a compound material that resists oxidation and corrosion. Materials for the top layer include carbon, palladium, carbides, borides, nitrides, and oxides. The thicknesses of the two layers that make up the overcoat bilayer are optimized to produce the highest reflectance at the wavelength range of operation. Protective overcoat systems comprising three or more layers are also possible. [0008]
  • SUMMARY OF THE INVENTION
  • It is an object of the present invention to provide a passivating overcoat bilayer for a multilayer reflective coating designed for use in extreme ultraviolet or soft x-ray applications. [0009]
  • It is another object of the invention to provide a bottom overcoat layer that prevents diffusion of a top overcoat layer into the top layer of a multilayer reflective coating. [0010]
  • It is another object of the invention to provide a top overcoat layer made of material that resists oxidation and corrosion and protects a multilayer reflective coating from oxidation. [0011]
  • These and other objects will be apparent based on the disclosure herein. [0012]
  • The present invention is a passivating overcoat bilayer for multilayer reflective coatings for soft x-ray or extreme ultraviolet applications and the method for making such layers. These passivating layers are useful for reflective optical coatings for soft x-ray and extreme ultraviolet wavelengths in applications such as microscopy, astronomy, spectroscopy, laser research, laser cavities and optics, synchrotron optics, and projection lithography. [0013]
  • A passivating overcoat bilayer (also called a “capping” bilayer) is deposited on top of a multilayer coating to prevent oxidation and corrosion of the multilayer coating, thereby improving the EUV optical performance. The multilayer coating can comprise alternating layers of a variety of materials, such as molybdenum-silicon, molybdenum carbide-silicon, molybdenum-beryllium, and molybdenum carbide-beryllium. The passivating bilayer comprises a diffusion resistant layer underneath at least one top layer of an elemental material or compound that resists oxidation and corrosion. Oxidation resistant materials for the top layer (or layers) may include pure elements, such as Ru, Zr, Rh or Pd, and similar materials or compound materials. Diffusion resistant materials for the bottom layer include B[0014] 4C, Mo and carbon and similar materials or compound materials. The top layer and the bottom layer may each comprise a plurality of layers.
  • The thickness of each layer that makes up the overcoat bilayer is in the range of about 0.5 to 7 nanometers, and the thicknesses are selected to produce the highest reflectance at the EUV wavelength range of operation. The thickness of the overcoat bilayer will typically be different from the thickness of the pairs of alternating layers in the underlying multilayer coating. The thickness of the two layers in the overcoat are individually optimized so as to provide sufficient chemical protection and to maximize EUV optical performance.[0015]
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 shows passivating overcoat bilayer of the present invention on a multilayer reflective coating. [0016]
  • FIG. 2 shows an embodiment that uses a diffusion barrier of Mo under a Ru layer. [0017]
  • FIG. 3 shows optimization of the thicknesses of Ru and Mo to obtain the highest reflectances. [0018]
  • FIG. 4A shows an embodiment that provides a diffusion barrier of B[0019] 4C under the Ru layer.
  • FIG. 4B illustrates the replacement with B[0020] 4C of the top part of the last Si layer of the multilayer reflective coating.
  • FIG. 5 shows the optimum B[0021] 4C barrier thickness is a tradeoff between reflectance and interdiffusion.
  • FIG. 6 shows the reflectance as a function of wavelength of a Ru/B[0022] 4C/Si capping layer system and a Ru/Mo capping layer system where the Ru layers are 2.2 nm thick.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • The present invention is a passivating overcoat bilayer for a multilayer reflective coating and is shown schematically in FIG. 1. The [0023] overcoat bilayer 10 is made up of a top layer 14, and a bottom layer 12. Top layer 14 comprises a material that resists corrosion and oxidation and protects the underlying layers from oxidation. The bottom layer 12 is deposited on a multilayer coating 16, which typically comprises alternating layers of an absorber material 18 and a spacer material 20. The multilayer coating 16 is deposited on a substrate 22. Bottom layer 12 comprises a material that prevents diffusion of the top layer 14 into the top layer 18 of the multilayer coating 16. The present invention contemplates including a plurality of components and layers within top layer 14 and/or bottom layer 12.
  • Ru is very stable against oxidation in the environment of a EUV camera. However, a loss in reflectance of 1%-5% is observed over the standard reference coating. This loss is due to the diffusion of Ru and Si and the formation of ruthenium silicide. For a successful capping layer system, an additional layer that acts as diffusion barrier between the Ru and the underlying structure is therefore needed. Other elements that can be substituted for Ru in the present invention include Zr, Rh and Pd and similar materials and compounds. [0024]
  • The embodiments discussed herein contain both the oxidation protection and the diffusion barrier. Both systems use a top layer of Ru as the protection against oxidation. FIG. 2 shows an embodiment that uses a [0025] diffusion barrier 30 of Mo under the Ru layer 32 and on top of the last Si layer 34 in the first system. The molybdenum layer acts as the diffusion barrier between the Ru layer and the Si layer. Multilayers capped with 1.3 nm of Mo and between 0.6 nm and 3 nm of Ru have been produced. This embodiment has measured over 67% reflectance. FIG. 3 shows optimization of the thicknesses of Ru and Mo to obtain the highest reflectances. Diffusion barrier 30 may be formed from other materials such as, e.g., carbon.
  • FIG. 4A shows an embodiment that provides a [0026] diffusion barrier 40 of B4C under the Ru layer 42 and on top of the last Si layer 44, which is on Mo layer 46. Ru/B4C multilayers form very smooth and compositionally abrupt interfaces. Thermal annealing at 100° and 250° C. produced no measurable change in the reflectance. A theoretical calculation shows a 2-3% reflectance loss if the last Si layer is replaced with B4C due to the less favorable optical properties of B4C in the EUV energy range. Experimental data support this prediction. However, this loss can be greatly reduced by replacing only the top part of the last Si layer with B4C, as shown in FIG. 4A. Experiments exploring how far the thickness of B4C can be reduced have shown that the boron carbide layer must be at least 0.6 nm or thicker. The expected reflectance loss is only 0.6% if B4C replaces ⅓ of the last Si layer. In this case boron carbide is about 1.3 nm thick. The experimental data in FIG. 5 shows that the optimum B4C barrier thickness is a tradeoff between reflectance and interdiffusion. FIG. 6 shows the reflectance as a function of wavelength of a Ru/B4C/Si capping layer system and a Ru/Mo capping layer system where the Ru layers are 2.2 nm thick. FIG. 4B shows an embodiment where the top Si layer of a Si/Mo multilayer structure has been entirely replaced with a B4C layer 50. In the figure, the multilayer structure is formed of alternating layers of Mo (52) and Si (54). It can be seen that the thickness 56 of one pair of alternating layers of the multilayer structure is the same as the combined thickness 58 of the Mo layer 54 and the B4C layer 50. Ru layer 60 is shown on top of the B4C layer 50. Diffusion barrier 50 may be formed from other materials such as, e.g., carbon.
  • Referring again to FIG. 1, a [0027] multilayer coating 16 that is designed for applications in extreme ultraviolet (EUV) lithography is typically made of a periodic stack of 40-100 alternating layers of molybdenum (Mo) and silicon (Si), or molybdenum and beryllium (Be). Although other structures are possible (e.g., non-periodic stacks, multilayer stacks with other materials or with more than two materials), the combinations of Mo and Si in one case and Mo and Be in another case, exhibit unusually high normal incidence reflectivity (at least 65%) in the EUV wavelength region (i.e., less than about 15 nanometers). When Mo and Si or Mo and Be are used for the multilayer stack, the topmost layer of the multilayer coating 16 would typically be molybdenum (the absorber material). However, since molybdenum is not stable in air, the additional overcoat bilayer is needed. It should be recognized that the Mo in the Mo/Si multilayer structures could be replaced with an absorber layer comprising another material. For example, the Mo can be replaced with molybdenum carbide or Mo2C. It should also be appreciated that the Mo in a Mo/Be multilayer structure can be replaced by MoRu.
  • In two of the embodiments discussed, the [0028] bottom layer 12 of the overcoat bilayer 10 is made up of either B4C or Mo. The top layer 14 is deposited or grown on the bottom layer 12 and comprises Ru, which is a material that resists oxidation and corrosion, and has a low chemical reactivity with common atmospheric gas species such as oxygen, nitrogen, and water vapor. For purposes of this disclosure, “deposition” of the top layer is intended to encompass the concepts of both “depositing” and “growing”. This top layer 14 serves to chemically passivate and protect the underlying multilayer coating 16 and to preserve the high reflectance of the coating.
  • The passivating overcoat can be grown using a vapor phase deposition technique (e.g., sputtering). This method can be incorporated into the multilayer deposition system (e.g., magnetron sputtering with argon plasma) so that the multilayer stack can be encapsulated in situ without exposure to the atmosphere. Alternatively, the overcoat can be grown by chemical reaction. [0029]
  • The thicknesses of the [0030] bottom layer 12 and the top layer 14 of the overcoat bilayer 10 are chosen to produce the highest reflectance and offer high oxidation resistance at the EUV wavelength of operation, in a similar manner to how the thicknesses of both layers in the underlying periodic multilayer stack 16 were determined.
  • As discussed in U.S. Pat. No. 3,887,261, titled “Low-loss reflection coatings using absorbing materials”, the best reflecting multilayer geometry is usually a quarter-wave stack, where the optical thickness of each layer is equal to a quarter of the wavelength of interest at normal incidence. (The optical thickness of a layer is the product of the geometrical or metric thickness and the refractive index of the material.) In the quarter-wave stack, the beams reflected from each interface are in phase and add constructively. This design is ideal when both materials in the stack are non-absorbing, and still remains the best when the extinction coefficients of the two materials are similar. However, when the absorption of one of the two materials is larger, as in the case of EUV multilayer mirrors, the design of the stack must be modified to reduce the overall absorption. The thickness of the absorber is reduced, while the [0031] period thickness 24 is kept constant. Therefore, thicknesses are determined by the trade-off between maximizing the constructive interference of the beams reflected at each interface and minimizing the overall absorption to enable more interfaces to contribute to the reflectance.
  • In the present invention, the thickness of the [0032] overcoat bilayer 10 is adjusted to provide the best phase matching with the underlying multilayer coating 16 in order to achieve the highest EUV reflectance while maintaining the highest oxidation resistance. For the Mo/Si and Mo/Be systems, the thickness of each layer in the overcoat bilayer is in the range of 0.5 to 7 nanometers.
  • The foregoing description of the invention has been presented for purposes of illustration and description and is not intended to be exhaustive or to limit the invention to the precise form disclosed. Many modifications and variations are possible in light of the above teaching. The embodiments disclosed were meant only to explain the principles of the invention and its practical application to thereby enable others skilled in the art to best use the invention in various embodiments and with various modifications suited to the particular use contemplated. The scope of the invention is to be defined by the following claims. [0033]

Claims (35)

We claim:
1. A passivating overcoat bilayer for a multilayer reflective coating designed for use in extreme ultraviolet or soft x-ray applications, comprising:
a bottom overcoat layer affixed to a top layer of a multilayer reflective coating; and
a top overcoat layer deposited on said bottom overcoat layer, wherein said bottom overcoat layer comprises material that prevents diffusion of said top overcoat layer into said top layer of said multilayer reflective coating, wherein said top overcoat layer comprises material that resists oxidation and corrosion and protects said multilayer reflective coating from oxidation.
2. The overcoat bilayer of claim 1, wherein said bottom overcoat layer comprises boron carbide.
3. The overcoat bilayer of claim 1, wherein said bottom overcoat layer comprises molybdenum.
4. The overcoat bilayer of claim 1, wherein said bottom overcoat layer comprises carbon.
5. The overcoat bilayer of claim 1, wherein said bottom overcoat layer comprises a plurality of components.
6. The overcoat bilayer of claim 1, wherein said bottom overcoat layer comprises a plurality of layers.
7. The overcoat bilayer of claim 1, wherein said top overcoat layer comprises ruthenium.
8. The overcoat bilayer of claim 1, wherein said top overcoat layer comprises material selected from the group consisting of Zr, Rh and Pd.
9. The overcoat bilayer of claim 1, wherein said top overcoat layer comprises a plurality of components.
10. The overcoat bilayer of claim 1, wherein said top overcoat layer comprises a plurality of layers.
11. The overcoat bilayer of claim 1, wherein said bottom overcoat layer comprises about 1.3 nm of Mo and wherein said top layer comprises between 0.6 nm and 3 nm of Ru.
12. The overcoat bilayer of claim 1, wherein said bottom overcoat layer comprises B4C, wherein said top layer of said multilayer coating comprises silicon.
13. The overcoat bilayer of 6, wherein the thickness of said bottom layer is combined with said top layer of said multilayer coating.
14. The overcoat bilayer of claim 1, wherein said top overcoat layer and said bottom overcoat layer of said overcoat bilayer have optimum thicknesses selected such that the bilayer overcoat is phase-matched with the underlying multilayer coating.
15. The overcoat bilayer of claim 1, wherein said top overcoat layer and said bottom overcoat layer have thicknesses, wherein the thickness of said top overcoat layer is selected to protect the underlying layers from oxidation, and wherein the thickness of the bottom layer is selected such that the bilayer overcoat is phase-matched with the underlying multilayer coating.
16. The overcoat bilayer of claim 1, wherein said top overcoat layer and said bottom overcoat layer have thicknesses that are optimized to maximize the normal incidence reflectance at an operating wavelength of less than about 15 nanometers.
17. The overcoat bilayer of claim 1, wherein said top overcoat layer has a thickness ranging from about 0.5 nanometers to about 7 nanometers.
18. The overcoat bilayer of claim 1, wherein said bottom overcoat layer has a thickness ranging from about 0.5 nanometers to about 7 nanometers.
19. The overcoat bilayer of claim 1, wherein said multilayer reflective coating comprises a plurality of pairs of underlying layers, and the underlying layers have a reflectance greater than about 65% at an operating wavelength of less than about 15 nanometers.
20. The overcoat bilayer of claim 19, wherein each underlying pair of layers of said underlying layers comprises a first layer comprising silicon and a second layer comprising molybdenum.
21. The overcoat bilayer of claim 19, wherein each underlying pair of layers of said underlying layers comprises a first layer comprising beryllium and a second layer comprising molybdenum.
22. The overcoat bilayer of claim 1, wherein said overcoat bilayer and said multilayer reflective coating have a normal incidence reflectivity of at least about 65% at an operating wavelength of less than about 15 nanometers, and wherein said multilayer reflective coating comprises silicon and molybdenum.
23. The overcoat bilayer of claim 1, wherein said overcoat bilayer and said multilayer reflective coating have a normal incidence reflectivity of at least about 65% at an operating wavelength of less than about 15 nanometers, and wherein said multilayer reflective coating comprises beryllium and molybdenum.
24. A method for forming a passivating overcoat bilayer for a multilayer reflective coating designed for use in extreme ultraviolet or soft x-ray applications, comprising:
providing a multilayer reflective coating;
depositing on said multilayer coating a bottom layer comprising material that will reduce or prevent interdiffusion; and
depositing on said bottom layer a top layer comprising material that resists oxidation and corrosion and protects said multilayer reflective coating from oxidation.
25. The method of claim 24, wherein said bottom layer comprises B4C.
26. The method of claim 24, wherein said bottom layer comprises Mo.
27. The method of claim 24, wherein said top layer comprises Ru.
28. The method of claim 24, wherein the deposition of the bottom layer or the top layer is carried out by vapor phase deposition.
29. The method of claim 24, wherein the thickness of the top layer is controlled by intentional oxidation of said bottom layer.
30. The method of claim 24, wherein said bottom layer comprises carbon.
31. The method of claim 24, wherein said bottom layer comprises a plurality of components.
32. The method of claim 24, wherein said bottom layer comprises a plurality of layers.
33. The method of claim 24, wherein said top overcoat layer comprises a plurality of components.
34. The method of claim 24, wherein said top overcoat layer comprises a plurality of layers.
35. The method of claim 24, wherein said top overcoat layer comprises material selected from the group consisting of Zr, Rh and Pd.
US09/898,833 2001-07-03 2001-07-03 Optimized capping layers for EUV multilayers Abandoned US20030008148A1 (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
US09/898,833 US20030008148A1 (en) 2001-07-03 2001-07-03 Optimized capping layers for EUV multilayers
US10/066,108 US6780496B2 (en) 2001-07-03 2002-02-01 Optimized capping layers for EUV multilayers
DE60222663T DE60222663T2 (en) 2001-07-03 2002-07-02 2-DAY PROTECTIVE LAYER
AT02748067T ATE374425T1 (en) 2001-07-03 2002-07-02 DUAL LAYER PROTECTIVE LAYER
PCT/US2002/021128 WO2003005377A2 (en) 2001-07-03 2002-07-02 Passivating overcoat bilayer
KR1020047000028A KR100749897B1 (en) 2001-07-03 2002-07-02 Passivity overcoat bilayer
JP2003511257A JP4460284B2 (en) 2001-07-03 2002-07-02 Optical element and method for forming the same
EP02748067A EP1402542B1 (en) 2001-07-03 2002-07-02 Passivating overcoat bilayer
AU2002318192A AU2002318192A1 (en) 2001-07-03 2002-07-02 Passivating overcoat bilayer
JP2008163789A JP4929238B2 (en) 2001-07-03 2008-06-23 Passivation protective double layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/898,833 US20030008148A1 (en) 2001-07-03 2001-07-03 Optimized capping layers for EUV multilayers

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/066,108 Continuation-In-Part US6780496B2 (en) 2001-07-03 2002-02-01 Optimized capping layers for EUV multilayers

Publications (1)

Publication Number Publication Date
US20030008148A1 true US20030008148A1 (en) 2003-01-09

Family

ID=25410097

Family Applications (2)

Application Number Title Priority Date Filing Date
US09/898,833 Abandoned US20030008148A1 (en) 2001-07-03 2001-07-03 Optimized capping layers for EUV multilayers
US10/066,108 Expired - Lifetime US6780496B2 (en) 2001-07-03 2002-02-01 Optimized capping layers for EUV multilayers

Family Applications After (1)

Application Number Title Priority Date Filing Date
US10/066,108 Expired - Lifetime US6780496B2 (en) 2001-07-03 2002-02-01 Optimized capping layers for EUV multilayers

Country Status (2)

Country Link
US (2) US20030008148A1 (en)
JP (1) JP4929238B2 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070081229A1 (en) * 2005-10-11 2007-04-12 Nikon Corporation Multilayer-film mirrors, lithography systems comprising same, and methods for manufacturing same
US20080043321A1 (en) * 2006-08-16 2008-02-21 Cymer, Inc. EUV optics
US20080204861A1 (en) * 2005-10-11 2008-08-28 Nikon Corporation Surface-corrected multilayer-film mirrors with protected reflective surfaces, exposure systems comprising same, and associated methods
US7671260B2 (en) 2005-08-23 2010-03-02 Yamaha Corporation Component of musical instrument, musical instrument and production method of the same
US20110228234A1 (en) * 2008-09-19 2011-09-22 Carl Zeiss Smt Gmbh Reflective optical element and method for production of such an optical element
US8986910B2 (en) 2009-12-09 2015-03-24 Asahi Glass Company, Limited Optical member for EUV lithography
US9581890B2 (en) 2014-07-11 2017-02-28 Applied Materials, Inc. Extreme ultraviolet reflective element with multilayer stack and method of manufacturing thereof
US9690016B2 (en) 2014-07-11 2017-06-27 Applied Materials, Inc. Extreme ultraviolet reflective element with amorphous layers and method of manufacturing thereof
US9733580B2 (en) 2011-06-22 2017-08-15 Carl Zeiss Smt Gmbh Method for producing a reflective optical element for EUV-lithography
US9739913B2 (en) 2014-07-11 2017-08-22 Applied Materials, Inc. Extreme ultraviolet capping layer and method of manufacturing and lithography thereof
US10353120B2 (en) 2013-05-09 2019-07-16 Nikon Corporation Optical element, projection optical system, exposure apparatus, and device manufacturing method
US11143604B1 (en) 2020-04-06 2021-10-12 Kla Corporation Soft x-ray optics with improved filtering

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070281109A1 (en) * 2000-03-31 2007-12-06 Carl Zeiss Smt Ag Multilayer system with protecting layer system and production method
US7261957B2 (en) * 2000-03-31 2007-08-28 Carl Zeiss Smt Ag Multilayer system with protecting layer system and production method
US7439530B2 (en) 2005-06-29 2008-10-21 Cymer, Inc. LPP EUV light source drive laser system
US7405416B2 (en) * 2005-02-25 2008-07-29 Cymer, Inc. Method and apparatus for EUV plasma source target delivery
CN100495210C (en) * 2002-08-28 2009-06-03 Asml荷兰有限公司 Photoetching equipment and device manufacturing method
DE10258709A1 (en) * 2002-12-12 2004-07-01 Carl Zeiss Smt Ag Protection system for reflective optical elements, reflective optical element and method for their production
US6998202B2 (en) * 2003-07-31 2006-02-14 Intel Corporation Multilayer reflective extreme ultraviolet lithography mask blanks
US7193228B2 (en) * 2004-03-10 2007-03-20 Cymer, Inc. EUV light source optical elements
CN100454485C (en) * 2004-12-10 2009-01-21 凸版印刷株式会社 Reflective photomask blank, reflective photomask, and method for manufacturing semiconductor device using same
US7547505B2 (en) * 2005-01-20 2009-06-16 Infineon Technologies Ag Methods of forming capping layers on reflective materials
US8139218B2 (en) * 2005-07-06 2012-03-20 Asml Netherlands B.V. Substrate distortion measurement
EP1947682B1 (en) * 2005-10-11 2012-01-18 Nikon Corporation Multilayer reflecting mirror, multilayer reflecting mirror manufacturing method, optical system, exposure apparatus and device manufacturing method
TWI427334B (en) * 2007-02-05 2014-02-21 Zeiss Carl Smt Gmbh Reflective optical element for euv lithography devices
WO2009043374A1 (en) 2007-10-02 2009-04-09 Consiglio Nazionale Delle Ricerche - Infm Istituto Nazionale Per La Fisica Della Materia Aperiodic multilayer structures
KR100972863B1 (en) * 2008-04-22 2010-07-28 주식회사 하이닉스반도체 Extreme ultra violet lithogrphy mask and method for fabricating the same
JP2011527436A (en) * 2008-07-07 2011-10-27 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Extreme ultraviolet radiation reflective elements containing sputter resistant materials
DE102008040964B4 (en) * 2008-08-04 2010-07-15 Carl Zeiss Smt Ag Remove reflective layers from EUV mirrors
DE102009017096A1 (en) * 2009-04-15 2010-10-21 Carl Zeiss Smt Ag Mirror for the EUV wavelength range, projection objective for microlithography with such a mirror and projection exposure apparatus for microlithography with such a projection objective
US20100271693A1 (en) * 2009-04-24 2010-10-28 Manuela Vidal Dasilva Narrowband filters for the extreme ultraviolet
DE102009049640B4 (en) * 2009-10-15 2012-05-31 Carl Zeiss Smt Gmbh Projection objective for a microlithographic EUV projection exposure machine
JP5669295B2 (en) * 2010-01-05 2015-02-12 独立行政法人日本原子力研究開発機構 Multilayer optical element
JP5458983B2 (en) * 2010-03-15 2014-04-02 セイコーエプソン株式会社 Manufacturing method of optical filter
JP2011191555A (en) * 2010-03-15 2011-09-29 Seiko Epson Corp Method of manufacturing optical filter, analytical instrument and optical apparatus
WO2012014904A1 (en) 2010-07-27 2012-02-02 旭硝子株式会社 Substrate provided with reflecting layer for euv lithography, and reflective mask blank for euv lithography
EP2622609A1 (en) * 2010-09-27 2013-08-07 Carl Zeiss SMT GmbH Mirror, projection objective comprising such a mirror, and projection exposure apparatus for microlithography comprising such a projection objective
CN102621815B (en) 2011-01-26 2016-12-21 Asml荷兰有限公司 Reflection optics and device making method for lithographic equipment
WO2012136420A1 (en) * 2011-04-04 2012-10-11 Asml Netherlands B.V. Mirror, radiation source - collector and lithographic apparatus
DE102011076011A1 (en) 2011-05-18 2012-11-22 Carl Zeiss Smt Gmbh Reflective optical element and optical system for EUV lithography
US20140272684A1 (en) 2013-03-12 2014-09-18 Applied Materials, Inc. Extreme ultraviolet lithography mask blank manufacturing system and method of operation therefor
US9417515B2 (en) 2013-03-14 2016-08-16 Applied Materials, Inc. Ultra-smooth layer ultraviolet lithography mirrors and blanks, and manufacturing and lithography systems therefor
US9632411B2 (en) 2013-03-14 2017-04-25 Applied Materials, Inc. Vapor deposition deposited photoresist, and manufacturing and lithography systems therefor
US9612521B2 (en) 2013-03-12 2017-04-04 Applied Materials, Inc. Amorphous layer extreme ultraviolet lithography blank, and manufacturing and lithography systems therefor
US9354508B2 (en) 2013-03-12 2016-05-31 Applied Materials, Inc. Planarized extreme ultraviolet lithography blank, and manufacturing and lithography systems therefor
DE102013102670A1 (en) * 2013-03-15 2014-10-02 Asml Netherlands B.V. Optical element and optical system for EUV lithography and method for treating such an optical element
US9612522B2 (en) * 2014-07-11 2017-04-04 Applied Materials, Inc. Extreme ultraviolet mask blank production system with thin absorber and manufacturing system therefor
KR102369935B1 (en) 2015-08-31 2022-03-03 삼성전자주식회사 EUV Light Generator Including a Collecting Mirror Having a Drip Hole
DE102016208987A1 (en) 2016-05-24 2017-11-30 Carl Zeiss Smt Gmbh Optical element and EUV lithography system
TWI811037B (en) 2016-07-27 2023-08-01 美商應用材料股份有限公司 Extreme ultraviolet mask blank with multilayer absorber and method of manufacture
DE102016213831A1 (en) * 2016-07-27 2018-02-01 Carl Zeiss Smt Gmbh Reflective optical element for EUV lithography
KR102402767B1 (en) 2017-12-21 2022-05-26 삼성전자주식회사 EUV mask blank, photomask manufactured by using the EUV mask blank, lithography apparatus using the photomask and method of fabricating semiconductor device using the photomask
DE102018211980A1 (en) * 2018-07-18 2019-09-05 Carl Zeiss Smt Gmbh Reflective optical element
US11630385B2 (en) 2020-01-24 2023-04-18 Applied Materials, Inc. Extreme ultraviolet mask absorber materials
TW202131087A (en) 2020-01-27 2021-08-16 美商應用材料股份有限公司 Extreme ultraviolet mask absorber materials
TW202141165A (en) 2020-03-27 2021-11-01 美商應用材料股份有限公司 Extreme ultraviolet mask absorber materials
US11644741B2 (en) 2020-04-17 2023-05-09 Applied Materials, Inc. Extreme ultraviolet mask absorber materials
TW202202641A (en) 2020-07-13 2022-01-16 美商應用材料股份有限公司 Extreme ultraviolet mask absorber materials
US11609490B2 (en) 2020-10-06 2023-03-21 Applied Materials, Inc. Extreme ultraviolet mask absorber materials
US11513437B2 (en) 2021-01-11 2022-11-29 Applied Materials, Inc. Extreme ultraviolet mask absorber materials
US11592738B2 (en) 2021-01-28 2023-02-28 Applied Materials, Inc. Extreme ultraviolet mask absorber materials

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5433988A (en) * 1986-10-01 1995-07-18 Canon Kabushiki Kaisha Multi-layer reflection mirror for soft X-ray to vacuum ultraviolet ray
JP2723955B2 (en) * 1989-03-16 1998-03-09 キヤノン株式会社 Multilayer reflector for soft X-ray and vacuum ultraviolet
US5307395A (en) * 1992-09-30 1994-04-26 The United States Of America As Represented By The Secretary Of The Navy Low-damage multilayer mirror for the soft X-ray region
US5265143A (en) * 1993-01-05 1993-11-23 At&T Bell Laboratories X-ray optical element including a multilayer coating
JPH1138192A (en) * 1997-07-17 1999-02-12 Nikon Corp Multiple layer film reflection mirror
US5958605A (en) * 1997-11-10 1999-09-28 Regents Of The University Of California Passivating overcoat bilayer for multilayer reflective coatings for extreme ultraviolet lithography
US6011646A (en) * 1998-02-20 2000-01-04 The Regents Of The Unviersity Of California Method to adjust multilayer film stress induced deformation of optics
US6110607A (en) * 1998-02-20 2000-08-29 The Regents Of The University Of California High reflectance-low stress Mo-Si multilayer reflective coatings
US6295164B1 (en) * 1998-09-08 2001-09-25 Nikon Corporation Multi-layered mirror
US6228512B1 (en) * 1999-05-26 2001-05-08 The Regents Of The University Of California MoRu/Be multilayers for extreme ultraviolet applications
TWI267704B (en) * 1999-07-02 2006-12-01 Asml Netherlands Bv Capping layer for EUV optical elements
DE10016008A1 (en) 2000-03-31 2001-10-11 Zeiss Carl Village system and its manufacture
US6664554B2 (en) * 2001-01-03 2003-12-16 Euv Llc Self-cleaning optic for extreme ultraviolet lithography

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7671260B2 (en) 2005-08-23 2010-03-02 Yamaha Corporation Component of musical instrument, musical instrument and production method of the same
US20070081229A1 (en) * 2005-10-11 2007-04-12 Nikon Corporation Multilayer-film mirrors, lithography systems comprising same, and methods for manufacturing same
US20080204861A1 (en) * 2005-10-11 2008-08-28 Nikon Corporation Surface-corrected multilayer-film mirrors with protected reflective surfaces, exposure systems comprising same, and associated methods
US7599112B2 (en) 2005-10-11 2009-10-06 Nikon Corporation Multilayer-film mirrors, lithography systems comprising same, and methods for manufacturing same
US7948675B2 (en) 2005-10-11 2011-05-24 Nikon Corporation Surface-corrected multilayer-film mirrors with protected reflective surfaces, exposure systems comprising same, and associated methods
US20080043321A1 (en) * 2006-08-16 2008-02-21 Cymer, Inc. EUV optics
US7843632B2 (en) 2006-08-16 2010-11-30 Cymer, Inc. EUV optics
US20110075253A1 (en) * 2006-08-16 2011-03-31 Cymer,Inc. EUV Optics
US8598549B2 (en) 2006-08-16 2013-12-03 Cymer, Llc EUV optics
US8430514B2 (en) 2008-09-19 2013-04-30 Carl Zeiss Smt Gmbh Reflective optical element and method for production of such an optical element
US8246182B2 (en) * 2008-09-19 2012-08-21 Carl Zeiss Smt Gmbh Reflective optical element and method for production of such an optical element
US20110228234A1 (en) * 2008-09-19 2011-09-22 Carl Zeiss Smt Gmbh Reflective optical element and method for production of such an optical element
US8986910B2 (en) 2009-12-09 2015-03-24 Asahi Glass Company, Limited Optical member for EUV lithography
US9733580B2 (en) 2011-06-22 2017-08-15 Carl Zeiss Smt Gmbh Method for producing a reflective optical element for EUV-lithography
US10353120B2 (en) 2013-05-09 2019-07-16 Nikon Corporation Optical element, projection optical system, exposure apparatus, and device manufacturing method
US9581890B2 (en) 2014-07-11 2017-02-28 Applied Materials, Inc. Extreme ultraviolet reflective element with multilayer stack and method of manufacturing thereof
US9690016B2 (en) 2014-07-11 2017-06-27 Applied Materials, Inc. Extreme ultraviolet reflective element with amorphous layers and method of manufacturing thereof
US9739913B2 (en) 2014-07-11 2017-08-22 Applied Materials, Inc. Extreme ultraviolet capping layer and method of manufacturing and lithography thereof
US10012908B2 (en) 2014-07-11 2018-07-03 Applied Materials, Inc. Extreme ultraviolet reflective element with multilayer stack and method of manufacturing thereof
US11143604B1 (en) 2020-04-06 2021-10-12 Kla Corporation Soft x-ray optics with improved filtering

Also Published As

Publication number Publication date
US20030008180A1 (en) 2003-01-09
US6780496B2 (en) 2004-08-24
JP4929238B2 (en) 2012-05-09
JP2008293032A (en) 2008-12-04

Similar Documents

Publication Publication Date Title
US6780496B2 (en) Optimized capping layers for EUV multilayers
US5958605A (en) Passivating overcoat bilayer for multilayer reflective coatings for extreme ultraviolet lithography
EP1402542B1 (en) Passivating overcoat bilayer
KR101490533B1 (en) Multilayer reflective optical element for EUV lithography devices comprising first and second additional intermediate layers
JP6389896B2 (en) Multilayer mirror
EP1340106B1 (en) Protective overcoat for replicated diffraction gratings
US7172788B2 (en) Optical element and method for its manufacture as well as lithography apparatus and method for manufacturing a semiconductor device
US6529321B2 (en) Protective overcoat for replicated diffraction gratings
WO2013124224A1 (en) Method for optimizing a protective layer system for an optical element, optical element and optical system for euv lithography
US10916356B2 (en) Reflective optical element
JP4689182B2 (en) Optical device with enhanced mechanical stability operating in extreme ultraviolet and lithographic mask comprising such a device
US6759141B2 (en) Oxidation preventative capping layer for deep-ultra-violet and soft x-ray multilayers
KR20240004892A (en) Extreme ultraviolet ray mask absorber materials
CN116981966A (en) Process for manufacturing a reflective optical element in the extreme ultraviolet wavelength range and reflective optical element
Yang et al. Highly reflective optical coatings from vacuum ultraviolet to near infrared for micro mirrors

Legal Events

Date Code Title Description
AS Assignment

Owner name: REGENTS OF THE UNIVERSITY OF CALIFORNIA, THE, CALI

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:BAJT, SASA;FOLTA, JAMES A.;SPILLER, EBERHARD;REEL/FRAME:011993/0603

Effective date: 20010618

AS Assignment

Owner name: U.S. DEPARTMENT OF ENERGY, CALIFORNIA

Free format text: CONFIRMATORY LICENSE;ASSIGNOR:CALIFORNIA, UNIVERSITY OF;REEL/FRAME:012829/0810

Effective date: 20020114

STCB Information on status: application discontinuation

Free format text: EXPRESSLY ABANDONED -- DURING EXAMINATION