US20020058116A1 - Method for molding substance on substrate and device formed thereby - Google Patents
Method for molding substance on substrate and device formed thereby Download PDFInfo
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- US20020058116A1 US20020058116A1 US10/045,791 US4579102A US2002058116A1 US 20020058116 A1 US20020058116 A1 US 20020058116A1 US 4579102 A US4579102 A US 4579102A US 2002058116 A1 US2002058116 A1 US 2002058116A1
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- United States
- Prior art keywords
- substance
- molded
- substrate
- fixing
- mold
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/681—Component parts, details or accessories; Auxiliary operations
- B29C70/682—Preformed parts characterised by their structure, e.g. form
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49799—Providing transitory integral holding or handling portion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4998—Combined manufacture including applying or shaping of fluent material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4998—Combined manufacture including applying or shaping of fluent material
- Y10T29/49993—Filling of opening
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12188—All metal or with adjacent metals having marginal feature for indexing or weakened portion for severing
- Y10T428/12194—For severing perpendicular to longitudinal dimension
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12486—Laterally noncoextensive components [e.g., embedded, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/15—Sheet, web, or layer weakened to permit separation through thickness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/20—Patched hole or depression
Definitions
- the present invention relates to a molding method and device formed thereby, and more particularly relates to a method for molding one substance to another substance and the molded product.
- An object of the present invention is to provide a method for molding one substance on a substrate.
- Another object of the present invention is to provide a molded device having a core substrate enveloped by a molded shell.
- a method for molding a molded substance to a substrate is provided. First of all, a substrate connected to a fixing portion by a connecting portion is prepared. The substrate is placed in a mold, wherein a portion of the fixing portion is protruding from the mold. The fixing portion is fixed by a fixing device outside the mold. Then, the molded substance covering the substrate is formed in the mold.
- the method further includes a step of removing the fixing portion from the substrate and the molded substance.
- the connecting portion is capable of being separated by an external force exerted on the portion of the fixing portion protruding from the mold.
- the fixing portion and the substrate integrally.
- the connecting portion is a groove.
- a hole is formed on the surface of the molded substance. It is preferable to fill up the hole by a filling substance.
- the filling substance is pre-molded. More preferably, the filling substance and the molded substance are made of the same material.
- the fixing portion preferably includes a structure for preventing the substrate moving away from the fixing device.
- the structure of the fixing portion preferably includes a body portion connecting to the substrate; and a top portion connecting to and larger than the body portion.
- the fixing device preferably further includes an opening having a width smaller than that of the top portion for preventing the top portion from leaving said fixing device.
- a method for molding a first substance to a second substance includes steps of: preparing the second substance, wherein the second substance is connected to a plurality of fixing portions; placing the second substance in a mold, wherein the plurality of fixing portions are protruding from the mold; fixing the second substance by fixing the plurality of fixing portions; and injecting a material of the first substance into the mold to form the first substance on the second substance.
- one or more of the plurality of fixing portions is/are connected to the second substance by a connecting portion capable of being broken for separating this fixing portion from the second substance.
- the first fixing portion is preferably integrally formed with the second substance.
- the connecting portion is a groove.
- One or more than one of the plurality of fixing portions may be made of material the same as that of the first substance.
- a molded device includes a substrate; a molded substance covering the substrate except at least one hole, wherein the molded substance is formed by only one molding process; and a filling substance filling up the at least one hole.
- the filling substance and the molded substance are preferably made of the same material.
- the substrate is preferably made of metal.
- the molded substance is preferably made of plastic.
- the molded device preferably further includes an opening formed on the substrate and an element capable of performing a specific function, wherein the element is plugged on the opening.
- a portion of the element is covered by the molded substance.
- FIGS. 1 ( a )- 1 ( e ) illustrate a preferred embodiment of a molding method according to the present invention
- FIGS. 2 ( a )- 2 ( b ) illustrate another preferred embodiment of a molding method according to the present invention.
- FIGS. 3 ( a )- 3 ( b ) shows still another preferred embodiment of a molding method according to the present invention.
- a substrate 1 is prepared before the molding process.
- the substrate 1 is cylindrical or any other shape as desired.
- the substrate 1 is connected to a fixing portion 2 with a connecting portion 3 .
- the connecting portion 3 may be a groove, a slot, a notch, or any other structure that may be separated by a force exerted on the fixing portion 2 .
- the fixing portion 2 is separated from the substrate 1 .
- the substrate 1 , the fixing portion 2 , and the connecting portion 3 are integrally formed.
- the fixing portion 2 is so constructed that it is capable of being properly held or clamped by a fixing device. Accordingly, the substrate 1 can be fixed within the mold during the molding process.
- the two cylinders 21 and 22 with different radius, as shown in FIG. 1( a ), are constructed for the above-mentioned purpose. Of course, any other structure or shape capable of performing similar function is also available.
- the fixing device 5 includes an opening 51 .
- the width of the opening 51 is similar to that of the body portion 21 and is smaller than that of the top portion 22 . Accordingly, the opening 51 can prevent a movement of the substrate 1 due to the injection of the molding material.
- the injected material is injected into the mold 4 through the nozzle 41 . Since the injected material is injected into the mold 4 with high velocity and viscosity, a drag force intending to pull the substrate 1 away from the fixing device 5 will be occurred.
- a molded substance 6 is formed on the surface of the substrate 1 .
- the molded substance 6 covers the connecting portion 3 and a portion of the fixing portion 2 .
- the molded substrate 6 is molded to the substrate 1 while the substrate 1 is properly fixed. If needed, the fixing portion 2 can be separated from the substrate 1 and the molded substance 6 .
- FIG. 1( c ) illustrates an example of how to remove the fixing portion 2 from the substrate 1 and the molded substance 6 .
- the fixing portion 2 is twisted and/or tore and pulled off the substance 6 .
- the connecting portion 3 can be any structure capable of helping such a separation.
- the substrate 1 and the fixing portion 2 can be formed integrally. They can also be two individual elements connected by the connecting portion 3 .
- a hole 61 is formed on the molded substance 61 .
- a filling substance 7 can be made of material the same as that of the molded substance 6 . It can also be made of other material.
- the filling substance 7 can be pre-molded by other mold.
- succeeding mechanical processes can be performed to remove a portion of the filling substance 7 protruding from the surface of the molded substance 6 .
- After a surface-trimming process it looks like that the remaining portion 71 is integrally formed with the molded substance 6 . Therefore, a molded device/element having a substrate enveloped by a molded substance is obtained. Furthermore, the molded substance can be formed by only one injecting process.
- the substrate may be made of metal or other material as desired.
- the molded substrate may be made of plastic or other material as desired.
- the substrate 9 is connected to fixing portions 11 with connecting portions 10 respectively.
- the fixing portions 11 are respectively fixed by fixing devices 12 .
- the fixing portions 11 can be formed integrally with the substrate 9 . It is also possible that one or more fixing portions 11 is/are replaced by other material.
- the injected material especially the portion near the injecting nozzle of the mold, has a considerable high temperature, the heat-resistance of the fixing portion and the location of the injecting nozzle must be considered carefully. If the distance between a fixing portion with a low heat-resistance and the injecting nozzle is short, the fixing portion may be melt down by the injected material. Of course, when such a fixing portion is far from the injecting nozzle, the injected material has already been cooled before contacting the fixing portion. In such a situation, a relatively low heat-resistance material such as plastic can be chosen to manufacture the fixing portion.
- the molded substance 13 is formed on the substrate 9 .
- the holes caused by the fixing portions are filled with filling substances 14 .
- the filling substances 14 are often made of material the same as the molded substance 13 .
- one or more of the fixing portion can be replaced by elements capable of performing a specific function.
- the substrate 15 is connected to fixing portions 19 and 21 .
- the substrate 15 is connected to the fixing portion 21 by the connecting portion 20 .
- the structures and functions of the fixing portion 21 are similar to those shown in FIGS. 1 ( b ) and 2 ( a ).
- the fixing portion 19 is a pen tip plugged on an opening 22 formed at one end of the substrate 15 .
- the ends of the fixing portions 19 and 21 are exposed from the mold 16 and are fixed by the fixing devices 18 .
- the fixing portion 19 is made of plastic or other material having relatively low heat-resistance, the molded material has to be injected from the nozzle 21 which are far from the fixing portion 19 .
- the product after the molding process is shown in FIG. 3( b ).
- the substrate 15 and a portion of the fixing portion 19 are covered by the molded substance 22 formed during the molding process. Accordingly, the fixing portion 19 will be properly connected to the substrate 15 by the molded substance 22 .
- the hole formed due to the removal of the fixing portion 17 is filled up by the filling substance 23 .
- the rigidity and/or the weight of a molded device/element are improved.
- the molded substance can be molded to the substrate by only one molding process.
- the method and device of the present invention can be applied to any filed that needs to mold a substance to another substance.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
A method for molding a molded substance to a substrate is provided. A substrate connected to a fixing portion by a connecting portion is prepared. The substrate is placed in a mold, wherein a portion of the fixing portion is protruding from the mold. The fixing portion is fixed by a fixing device outside the mold. Then, the molded substance covering the substrate is formed within the mold.
Description
- The present invention relates to a molding method and device formed thereby, and more particularly relates to a method for molding one substance to another substance and the molded product.
- Diversified appearances can be obtained by molding processes. However, some molding materials are not heavy or strong enough in some application. For solving the above-mentioned or other problems, sometimes it is desirable to mold one substance to another substrate made of different material.
- When proceeding such a molding process, it is very important to maintain the mold and the substrate in a fixed position. However, it is difficult to fix the substrate within the mold since the molding material is often injected into the mold cavity with high pressure. For solving such a problem, a substrate holder installed within the mold is used. A portion of the molded shell is performed while the substrate is fixed by the substrate holder. Then the holder is removed and the remaining molding process is performed. However, such a process is very troublesome. It is then attempted by the Applicant to solve the above-mentioned problems.
- An object of the present invention is to provide a method for molding one substance on a substrate.
- Another object of the present invention is to provide a molded device having a core substrate enveloped by a molded shell.
- According to the present invention, a method for molding a molded substance to a substrate is provided. First of all, a substrate connected to a fixing portion by a connecting portion is prepared. The substrate is placed in a mold, wherein a portion of the fixing portion is protruding from the mold. The fixing portion is fixed by a fixing device outside the mold. Then, the molded substance covering the substrate is formed in the mold.
- Preferably, the method further includes a step of removing the fixing portion from the substrate and the molded substance. To execute this step, the connecting portion is capable of being separated by an external force exerted on the portion of the fixing portion protruding from the mold.
- It is preferable to form the fixing portion and the substrate integrally. Preferably, the connecting portion is a groove.
- When the fixing portion is removed from the molded substance, a hole is formed on the surface of the molded substance. It is preferable to fill up the hole by a filling substance. Preferably, the filling substance is pre-molded. More preferably, the filling substance and the molded substance are made of the same material.
- The fixing portion preferably includes a structure for preventing the substrate moving away from the fixing device. The structure of the fixing portion preferably includes a body portion connecting to the substrate; and a top portion connecting to and larger than the body portion.
- The fixing device preferably further includes an opening having a width smaller than that of the top portion for preventing the top portion from leaving said fixing device.
- According to another aspect of the present invention, a method for molding a first substance to a second substance is provided. The method includes steps of: preparing the second substance, wherein the second substance is connected to a plurality of fixing portions; placing the second substance in a mold, wherein the plurality of fixing portions are protruding from the mold; fixing the second substance by fixing the plurality of fixing portions; and injecting a material of the first substance into the mold to form the first substance on the second substance.
- Preferably, one or more of the plurality of fixing portions is/are connected to the second substance by a connecting portion capable of being broken for separating this fixing portion from the second substance. The first fixing portion is preferably integrally formed with the second substance. Preferably, the connecting portion is a groove.
- When the first fixing portion is separated from the second substance, a hole will be formed on the first substance. It is preferable to fill up the hole with a filling substance.
- One or more than one of the plurality of fixing portions may be made of material the same as that of the first substance.
- It is preferable to form an opening on the second substance so that a specific one of the plurality of fixing portions can be plugged onto the substrate through the opening.
- According to another aspect of the present invention, a molded device is provided. The molded device includes a substrate; a molded substance covering the substrate except at least one hole, wherein the molded substance is formed by only one molding process; and a filling substance filling up the at least one hole.
- The filling substance and the molded substance are preferably made of the same material.
- The substrate is preferably made of metal.
- The molded substance is preferably made of plastic.
- The molded device preferably further includes an opening formed on the substrate and an element capable of performing a specific function, wherein the element is plugged on the opening.
- Preferably, a portion of the element is covered by the molded substance.
- The present invention may best be understood through the following description with reference to the accompanying drawings, in which:
- FIGS.1(a)-1(e) illustrate a preferred embodiment of a molding method according to the present invention;
- FIGS.2(a)-2(b) illustrate another preferred embodiment of a molding method according to the present invention; and
- FIGS.3(a)-3(b) shows still another preferred embodiment of a molding method according to the present invention.
- An illustration of how to manufacture the molded device of the present invention is shown in FIGS.1(a) to 1(e). Referring to FIG. 1(a), a
substrate 1 is prepared before the molding process. Thesubstrate 1 is cylindrical or any other shape as desired. Thesubstrate 1 is connected to afixing portion 2 with a connectingportion 3. The connectingportion 3 may be a groove, a slot, a notch, or any other structure that may be separated by a force exerted on thefixing portion 2. Once the connectingportion 3 is broken, thefixing portion 2 is separated from thesubstrate 1. Preferably, thesubstrate 1, thefixing portion 2, and the connectingportion 3 are integrally formed. They may be directly manufactured from a block of row material such as metal by lathing, stamping, and/or any other machining processes. Thefixing portion 2 is so constructed that it is capable of being properly held or clamped by a fixing device. Accordingly, thesubstrate 1 can be fixed within the mold during the molding process. The twocylinders - The
substrate 1 is then placed into a mold 4. The fixingportion 2 is exposed from the mold 4 so that it can be held or clamped by a fixingdevice 5. Referring to FIG. 1(b), the fixingdevice 5 includes anopening 51. When the fixingportion 2 is fixed by the fixingdevice 5, the width of theopening 51 is similar to that of thebody portion 21 and is smaller than that of thetop portion 22. Accordingly, theopening 51 can prevent a movement of thesubstrate 1 due to the injection of the molding material. The injected material is injected into the mold 4 through the nozzle 41. Since the injected material is injected into the mold 4 with high velocity and viscosity, a drag force intending to pull thesubstrate 1 away from the fixingdevice 5 will be occurred. However, since thetop portion 22 is stopped by theopening 51, thesubstrate 1 will not be moved by such a drag force during the molding process. After the injection process, a moldedsubstance 6 is formed on the surface of thesubstrate 1. The moldedsubstance 6 covers the connectingportion 3 and a portion of the fixingportion 2. - The molded
substrate 6 is molded to thesubstrate 1 while thesubstrate 1 is properly fixed. If needed, the fixingportion 2 can be separated from thesubstrate 1 and the moldedsubstance 6. FIG. 1(c) illustrates an example of how to remove the fixingportion 2 from thesubstrate 1 and the moldedsubstance 6. The fixingportion 2 is twisted and/or tore and pulled off thesubstance 6. The connectingportion 3 can be any structure capable of helping such a separation. Thesubstrate 1 and the fixingportion 2 can be formed integrally. They can also be two individual elements connected by the connectingportion 3. - Once the fixing
portion 2 is removed, ahole 61 is formed on the moldedsubstance 61. As shown in FIG. 1(d), it is preferable to fill thehole 61 by a fillingsubstance 7. The fillingsubstance 7 can be made of material the same as that of the moldedsubstance 6. It can also be made of other material. The fillingsubstance 7 can be pre-molded by other mold. - Referring to FIG. 1(e), succeeding mechanical processes can be performed to remove a portion of the filling
substance 7 protruding from the surface of the moldedsubstance 6. After a surface-trimming process, it looks like that the remainingportion 71 is integrally formed with the moldedsubstance 6. Therefore, a molded device/element having a substrate enveloped by a molded substance is obtained. Furthermore, the molded substance can be formed by only one injecting process. - The substrate may be made of metal or other material as desired. The molded substrate may be made of plastic or other material as desired.
- If needed, more than one fixing portion can be applied. Referring to FIG. 2(a), the
substrate 9 is connected to fixingportions 11 with connectingportions 10 respectively. The fixingportions 11 are respectively fixed by fixingdevices 12. The fixingportions 11 can be formed integrally with thesubstrate 9. It is also possible that one ormore fixing portions 11 is/are replaced by other material. However, since the injected material, especially the portion near the injecting nozzle of the mold, has a considerable high temperature, the heat-resistance of the fixing portion and the location of the injecting nozzle must be considered carefully. If the distance between a fixing portion with a low heat-resistance and the injecting nozzle is short, the fixing portion may be melt down by the injected material. Of course, when such a fixing portion is far from the injecting nozzle, the injected material has already been cooled before contacting the fixing portion. In such a situation, a relatively low heat-resistance material such as plastic can be chosen to manufacture the fixing portion. - Referring to FIG. 2(b), with processes similar to those shown in FIGS. 1(c) to 1(e), the molded
substance 13 is formed on thesubstrate 9. The holes caused by the fixing portions are filled with fillingsubstances 14. The fillingsubstances 14 are often made of material the same as the moldedsubstance 13. Of course, if one ormore fixing portions 11 are made by material the same as the fillingsubstances 14, it is not necessary to remove such a fixing portion, and a trimming process is directly executed to obtain the product shown in FIG. 2(b). - In some applications, one or more of the fixing portion can be replaced by elements capable of performing a specific function. Referring to FIG. 3(a), the
substrate 15 is connected to fixingportions substrate 15 is connected to the fixingportion 21 by the connectingportion 20. The structures and functions of the fixingportion 21 are similar to those shown in FIGS. 1(b) and 2(a). However, the fixingportion 19 is a pen tip plugged on anopening 22 formed at one end of thesubstrate 15. When thesubstrate 15 is placed into amold 16, the ends of the fixingportions mold 16 and are fixed by the fixingdevices 18. If the fixingportion 19 is made of plastic or other material having relatively low heat-resistance, the molded material has to be injected from thenozzle 21 which are far from the fixingportion 19. The product after the molding process is shown in FIG. 3(b). Thesubstrate 15 and a portion of the fixingportion 19 are covered by the moldedsubstance 22 formed during the molding process. Accordingly, the fixingportion 19 will be properly connected to thesubstrate 15 by the moldedsubstance 22. The hole formed due to the removal of the fixingportion 17 is filled up by the fillingsubstance 23. - By the molding method of the present invention, the rigidity and/or the weight of a molded device/element are improved. The molded substance can be molded to the substrate by only one molding process. The method and device of the present invention can be applied to any filed that needs to mold a substance to another substance.
- While the invention has been described in terms of what are presently considered to be the most practical and preferred embodiments, it is to be understood that the invention needs not be limited to the disclosed embodiment. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all such modifications and similar structures.
Claims (25)
1. A method for molding a molded substance to a substrate; comprising:
preparing said substrate connected to a fixing portion by a connecting portion;
placing said substrate in a mold, wherein a portion of said fixing portion is protruding from said mold;
fixing said fixing portion by a fixing device outside said mold; and
executing a molding process in said mold to form said molded substance covering said substrate.
2. A method according to claim 1 , further comprising a step of removing said fixing portion from said substrate and said molded substance.
3. A method according to claim 2 wherein said connecting portion is capable of being separated by an external force exerted on said portion of said fixing portion protruding from said mold.
4. A method according to claim 2 wherein said fixing portion and said substrate are formed integrally.
5. A method according to claim 4 wherein said connecting portion is a groove.
6. A method according to claim 2 wherein a hole is formed on said molded substance when said fixing portion is removed from said molded substance.
7. A method according to claim 6 , further comprising a step of filling up said hole by a filling substance.
8. A method according to claim 7 wherein said filling substance is pre-molded.
9. A method according to claim 7 wherein said filling substance and said molded substance are made of the same material.
10. A method according to claim 1 wherein said fixing portion includes a structure for preventing said substrate moving away from said fixing device.
11. A method according to claim 10 wherein said structure of said fixing portion includes:
a body portion connecting to said substrate; and
a top portion connecting to and larger than said body portion.
12. A method according to claim 11 wherein said fixing device further includes an opening having a width smaller than that of said top portion for preventing said top portion from leaving said fixing device.
13. A method for molding a first substance to a second substance; comprising steps of:
preparing said second substance, wherein said second substance is connected to a plurality of fixing portions;
placing said second substance in a mold, wherein said plurality of fixing portions are protruding from said mold;
fixing said second substance by fixing said plurality of fixing portions; and
injecting a material of said first substance into said mold to form said first substance on said second substance.
14. A method according to claim 13 wherein a first one of said plurality of fixing portions is connected to said second substance by a connecting portion capable of being broken for separating said first fixing portion from said second substance.
15. A method according to claim 14 wherein said first fixing portion is integrally formed with said second substance.
16. A method according to claim 15 wherein said connecting portion is a groove.
17. A method according to claim 14 , wherein a hole is formed on said first substance when said first fixing portion is separated from said second substance, and said method further comprises a step of:
filling up said hole with a filling substance.
18. A method according to claim 13 wherein a second one of said plurality of fixing portions and said first substance are made of the same material.
19. A method according to claim 13 , further comprising a step of:
forming an opening on said second substance; and
plugging one of said plurality of fixing portions onto said second substance through said opening.
20. A molded device comprising:
a substrate;
a molded substance covering said substrate except at least one hole,
wherein said molded substance is formed by only one molding process; and
a filling substance filling up said at least one hole.
21. A molded device according to claim 20 wherein said filling substance and said molded substance are made of the same material.
22. A molded device according to claim 20 wherein said substrate is made of metal.
23. A molded device according to claim 20 wherein said molded substance is made of plastic.
24. A molded device according to claim 20 , further comprising an opening formed on said substrate and an element capable of performing a specific function, wherein said element is plugged on said opening.
25. A molded device according to claim 24 wherein a portion of said element is covered by said molded substance.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/045,791 US20020058116A1 (en) | 2000-06-09 | 2002-01-11 | Method for molding substance on substrate and device formed thereby |
US11/088,171 US20050227183A1 (en) | 2002-01-11 | 2005-03-23 | Compositions and methods for image development of conventional chemically amplified photoresists |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/591,325 US6601281B1 (en) | 2000-06-09 | 2000-06-09 | Method for molding substance on substrate and device formed thereby |
US10/045,791 US20020058116A1 (en) | 2000-06-09 | 2002-01-11 | Method for molding substance on substrate and device formed thereby |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US09/591,325 Division US6601281B1 (en) | 2000-06-09 | 2000-06-09 | Method for molding substance on substrate and device formed thereby |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/088,171 Continuation-In-Part US20050227183A1 (en) | 2002-01-11 | 2005-03-23 | Compositions and methods for image development of conventional chemically amplified photoresists |
Publications (1)
Publication Number | Publication Date |
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US20020058116A1 true US20020058116A1 (en) | 2002-05-16 |
Family
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Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/591,325 Expired - Lifetime US6601281B1 (en) | 2000-06-09 | 2000-06-09 | Method for molding substance on substrate and device formed thereby |
US10/045,791 Abandoned US20020058116A1 (en) | 2000-06-09 | 2002-01-11 | Method for molding substance on substrate and device formed thereby |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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US09/591,325 Expired - Lifetime US6601281B1 (en) | 2000-06-09 | 2000-06-09 | Method for molding substance on substrate and device formed thereby |
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US (2) | US6601281B1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US7497012B2 (en) * | 2004-12-21 | 2009-03-03 | Pratt & Whitney Canada Corp. | Gas turbine fuel nozzle manufacturing |
GB0504365D0 (en) * | 2005-03-03 | 2005-04-06 | Probond International Ltd | Superstructures for elongate members and methods of forming such superstructures |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5422442A (en) * | 1992-10-30 | 1995-06-06 | Sharp Kabushiki Kaisha | Mechanism for containing input pen |
US5440080A (en) * | 1992-03-31 | 1995-08-08 | Pentel Kabushiki Kaisha | Information input device |
US5635682A (en) * | 1994-03-16 | 1997-06-03 | A.T. Cross Company | Wireless stylus and disposable stylus cartridge therefor for use with a pen computing device |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4235832A (en) * | 1978-07-31 | 1980-11-25 | Alden Research Foundation | Molding method |
JP3484861B2 (en) * | 1995-03-31 | 2004-01-06 | セイコーエプソン株式会社 | Roller for image forming apparatus and mold for molding the same |
-
2000
- 2000-06-09 US US09/591,325 patent/US6601281B1/en not_active Expired - Lifetime
-
2002
- 2002-01-11 US US10/045,791 patent/US20020058116A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5440080A (en) * | 1992-03-31 | 1995-08-08 | Pentel Kabushiki Kaisha | Information input device |
US5422442A (en) * | 1992-10-30 | 1995-06-06 | Sharp Kabushiki Kaisha | Mechanism for containing input pen |
US5635682A (en) * | 1994-03-16 | 1997-06-03 | A.T. Cross Company | Wireless stylus and disposable stylus cartridge therefor for use with a pen computing device |
Also Published As
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US6601281B1 (en) | 2003-08-05 |
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