US20020024797A1 - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- US20020024797A1 US20020024797A1 US09/746,266 US74626600A US2002024797A1 US 20020024797 A1 US20020024797 A1 US 20020024797A1 US 74626600 A US74626600 A US 74626600A US 2002024797 A1 US2002024797 A1 US 2002024797A1
- Authority
- US
- United States
- Prior art keywords
- chassis
- heat dissipation
- dissipation device
- fin member
- recited
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A heat dissipation device (1) includes a chassis (10) and a fin member (20). The chassis is formed as a single unit by extrusion, and includes a top surface (11). Four parallel ribs (13) are formed on the top surface. A pair of slots (14) is defined in the top surface, adjacent the two outermost ribs. The slots are adapted for connection to a conventional fan frame (50). The fin member defines four grooves (21) and a channel (22) therethrough. The channel is between the innermost grooves, and is adapted to interferentially receive a conventional heat sink clip (60). The four grooves interferentially receive the ribs of the chassis, thereby securely attaching the fin member to the chassis.
Description
- 1. Field of the Invention
- The present invention relates to a heat dissipation device, and more particularly to a heat dissipation device which has enhanced heat removal capability.
- 2. Related Art
- Many electronic devices, such as Central Processing Units (CPUs), generate a lot of heat during normal operation. This can deteriorate their operational stability. Thus the heat must be removed quickly to ensure normal operation of the electronic device. A heat dissipation device is often attached to a top surface of the electronic device, to remove heat therefrom.
- A conventional heat dissipation device is shown in FIG. 5. The device2 is conventionally formed by extrusion, which significantly limits the amount of heat dissipation surface which can be produced. Furthermore, the device 2 is relatively heavy compared to a typical electronic device which it is designed to service.
- Another conventional heat dissipation device is shown in FIG. 6. The
device 4 includes achassis 6 defining a plurality of grooves (not labeled) therein, and a plurality offins 8 inserted into the grooves. The heat dissipation surface of thedevice 4 is greater than that of the device 2. However, installation of thefins 8 into thechassis 6 is time-consuming and costly. Furthermore, during normal use entailing vibration and shock, thefins 8 of thedevice 4 are prone to dislodge within the grooves of thechassis 6. This results in gaps forming between thefins 8 and thechassis 6, thereby reducing the efficiency of heat transfer. Thus theheat dissipation device 4 does not reliably remove heat. - It is strongly desired to provide a heat dissipation device which resolves the above-mentioned problems.
- Accordingly, an object of the present invention is to provide a heat dissipation device with a large surface area for increasing the efficiency of heat removal.
- Another object of the present invention is to provide a heat dissipation device comprising two easily manufactured parts readily assembled together.
- To achieve the above objects, a heat dissipation device in accordance with the present invention comprises a chassis and a fin member. The chassis is formed as a single unit by extrusion, and includes a top surface. Four parallel ribs are formed on the top surface. A pair of parallel slots is defined in the top surface adjacent respective outermost ribs, and is adapted for connection to a conventional fan frame. The chassis forms a pair of shoulders at respective opposite sides thereof, adapted to support the fan frame thereon. The fin member is formed from a single plate, and defines four parallel grooves and a channel therethrough. The channel is defined between the two innermost grooves, and is adapted to interferentially receive a conventional clip. The clip secures the heat dissipation device to a heat-generating electronic device. The four grooves interferentially receive the ribs of the chassis, thereby securely attaching the fin member to the chassis.
- Other objects, advantages and novel features of the present invention will be drawn from the following detailed embodiment of the present invention with attached drawings, in which:
- FIG. 1 is an exploded view of a heat dissipation device in accordance with the present invention;
- FIG. 2 is an assembled view of FIG. 1;
- FIG. 3 is a side elevation view of FIG. 2;
- FIG. 4 shows the assembled heat dissipation device attached to a conventional heat sink clip and a conventional fan assembly.
- FIG. 5 is a perspective view of a conventional heat dissipation device; and
- FIG. 6 is a perspective view of another conventional heat dissipation device.
- Referring to FIG. 1, a
heat dissipation device 1 in accordance with the present invention includes achassis 10 and afin member 20 interferentially mountable on thechassis 10. - The
chassis 10 is formed as a single unit by extrusion, and comprises atop surface 11 and abottom surface 12. Fourparallel ribs 13 are formed on thetop surface 11, at uniform intervals. A pair ofU-shaped slots 14 is defined in thetop surface 11, parallel to and adjacent innermost extremities of the respectiveoutermost ribs 13. Thus eachoutermost rib 13 defines an outer limit of itsadjacent slot 14. A pair oflongitudinal shoulders 15 is formed at respective opposite sides of thechassis 10, theshoulders 15 being perpendicular to theribs 13. An upper surface of eachshoulder 15 is lower than theslots 14 of thechassis 10. - The
fin member 20 is concertinaed from a single plate to provide maximum surface area for heat dissipation. Thefin member 20 extends continuously withupper surfaces 24 andlower surfaces 25 alternately bridged by thevertical planes 26.Lower surfaces 25 of thefin member 20 are coplanar. Fourparallel grooves 21 are defined throughout a bottom of thefin member 20, and are dimensioned to interferentially engage with thecorresponding ribs 13 of thechassis 10. Achannel 22 is defined throughout a bottom of thefin member 20, and extends in a direction perpendicular to thevertical planes 26. Thechannel 22 is parallel to thegrooves 21, and is located between the twoinnermost grooves 21. Thechannel 22 is dimensioned to interferentially receive a conventional heat sink clip 60 (see FIG. 4). - Referring also to FIGS. 2 and 3, in assembly, the
fin member 20 is placed on thechassis 10. Theribs 13 of thechassis 10 interferentially engage with thegrooves 21 of thefin member 20. Thelower surfaces 25 of thefin member 20 abut thetop surface 11 of thechassis 10. Thus theheat dissipation device 1 is readily assembled for use as a single unit. - Referring also to FIG. 4, the
heat dissipation device 1 is adapted to readily receive the conventionalheat sink clip 60 and a conventional fan assembly. Theclip 60 is adapted to engage with a retention module (not shown), and thus secure thebottom surface 12 of theheat dissipation device 1 to an electronic device (not shown). The fan assembly comprises afan 30 attached to a top of afan frame 50 by conventional means, and screws 40 for attaching thefan frame 50 to theheat dissipation device 1. - The
fan frame 50 is generally U-shaped, with anopening 52 defined at a bottom of eachopposite sidewall 54. Theopenings 52 are located and dimensioned to correspond to thechannel 22 of thefin member 20. Ascrew hole 51 is defined near each bottom corner of eachsidewall 54 of thefan frame 50. The screw holes 51 are located and dimensioned to correspond to theslots 14 of thechassis 10. - Final assembly entails putting together the
heat dissipation device 1, theclip 60 and the fan assembly. Theclip 60 is received in thechannel 22 of thefin member 20. Thefan frame 50 is placed over thefin member 20, such that bottom edges (not labeled) of thesidewalls 54 of thefan frame 50 abutrespective shoulders 15 of thechassis 10. Thescrews 40 are inserted into the screw holes 51 of thefan frame 50, and then screwed into theslots 14 of thechassis 10. Thechannel 22 of thefin member 20 and theopenings 52 of thefan frame 50 cooperate to prevent theheat dissipation device 1 from moving relative to theclip 60 in a normal direction. - Other advantages of the
heat dissipation device 1 include: - 1. The
chassis 10 is easily extruded from a single plate. Thefin member 20 is also easily formed from a single plate. The plate for thefin member 20 is first stamped to specification, and then concertinaed. Thus manufacture of theheat dissipation device 1 is simple. - 2. Since the
chassis 10 and thefin member 20 are made separately before being coupled together, thefin member 20 is produced without the limitations inherent in extrusion processes. Thus thefin member 20 can be readily manufactured to have a large surface area for enhanced heat dissipation capability. - 3. Since the
chassis 10 and thefin member 20 are made separately before being coupled together, they can be readily formed from different materials. The material of thechassis 10 can be selected to provide maximum heat transfer from an electronic device, and the material of thefin member 20 can be selected to provide maximum heat dissipation from thefin member 20. - It is understood that the invention may be embodied in other forms without departing from the spirit thereof. Thus, the present example and embodiment is to be considered in all respects as illustrative and not restrictive, and the invention is not to be limited to the details given herein.
Claims (11)
1. A heat dissipation device adapted for removing heat from a heat-generating electronic device comprising:
a chassis comprising at least one rib on a top surface thereof; and
a fin member defining at least one groove therethrough, each groove interferentially receiving the corresponding rib of the chassis therein to thereby secure the fin member to the chassis, the fin member further defining a channel therethrough adapted for receiving a clip.
2. The heat dissipation device as recited in claim 1 , wherein the fin member comprises a plurality of integrally concertinaed fins.
3. The heat dissipation device as recited in claim 1 , wherein the fin member comprises coplanar lower surfaces for abutting the top surface of the chassis.
4. The heat dissipation device as recited in claim 1 , wherein the chassis comprises four ribs and the fin member defines four grooves, for providing the heat dissipation device with high stability and simple configuration.
5. The heat dissipation device as recited in claim 1 , wherein the chassis defines at least one slot adapted for attaching a fan frame thereto.
6. The heat dissipation device as recited in claim 1 , wherein the chassis forms at least a shoulder adapted for abutting a fan frame.
7. A heat dissipation device including:
a chassis;
a fin member including a plurality of parallel spaced vertical planes standing on the chassis;
a channel extending through bottom portions of said vertical planes in a direction perpendicular to said vertical planes while not through said vertical plane in a vertical direction; and
a clip positioned on the chassis and received in the channel; wherein
said clip is protected under said vertical planes.
8. The device as recited in claim 7 , wherein said vertical planes are successively interconnected with one another by alternate upper and lower surfaces.
9. A heat dissipation device comprising:
a chassis with a plurality of parallel spaced ribs extending along a first direction thereon;
a fin member concertinaed from a single plate with alternate upper and lower surfaces interconnected with one another via vertical planes, said vertical planes extending along a second direction perpendicular to said first direction; and
a plurality of grooves defined throughout bottom portions of the vertical planes along said first direction and interferentially engaging said corresponding ribs, respectively.
10. The device as recited in claim 9 , wherein a channel extends throughout the bottom portions of the vertical plane to receive a clip therein.
11. The device as recited in claim 10 , wherein said channel extends along the first direction.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW089214934 | 2000-08-29 | ||
TW89214934U | 2000-08-29 | ||
TW089214934U TW510526U (en) | 2000-08-29 | 2000-08-29 | Heat dissipating device |
Publications (2)
Publication Number | Publication Date |
---|---|
US20020024797A1 true US20020024797A1 (en) | 2002-02-28 |
US6373699B1 US6373699B1 (en) | 2002-04-16 |
Family
ID=21672107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/746,266 Expired - Fee Related US6373699B1 (en) | 2000-08-29 | 2000-12-21 | Heat dissipation device |
Country Status (2)
Country | Link |
---|---|
US (1) | US6373699B1 (en) |
TW (1) | TW510526U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040108104A1 (en) * | 2002-11-08 | 2004-06-10 | Chin-Kuang Luo | Axial heat-dissipating device |
US20130014917A1 (en) * | 2011-07-14 | 2013-01-17 | Tsung-Hsien Huang | Heat pipe-attached heat sink with bottom radiation fins |
US11262140B2 (en) * | 2018-09-30 | 2022-03-01 | Tyco Electronics (Shanghai) Co. Ltd. | Heat sink and housing assembly |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2447913A1 (en) * | 2001-05-30 | 2002-12-05 | Ats Automation Tooling Systems Inc. | Folded-fin heat sink assembly and method of manufacturing same |
US6595275B1 (en) * | 2002-07-02 | 2003-07-22 | Waffer Technology Corp. | Heat sink assembly |
US6657865B1 (en) * | 2002-12-12 | 2003-12-02 | Wuh Chuong Indutrial Co., Ltd. | Heat dissipating structure |
JP4173014B2 (en) * | 2003-01-17 | 2008-10-29 | 富士通株式会社 | Heat sink and electronic device cooling apparatus and electronic device |
US7537151B2 (en) | 2004-01-21 | 2009-05-26 | Delphi Technologies, Inc. | Method of making high performance heat sinks |
CN100464278C (en) * | 2005-11-02 | 2009-02-25 | 富准精密工业(深圳)有限公司 | Heat sink |
US20070204972A1 (en) * | 2006-03-01 | 2007-09-06 | Sensis Corporation | Method and apparatus for dissipating heat |
US20130299154A1 (en) * | 2012-05-11 | 2013-11-14 | Sheng-Huang Lin | Thermal module and manufacturing method thereof |
CN111787780A (en) * | 2018-08-02 | 2020-10-16 | 莫列斯有限公司 | Shield can assembly |
US10942322B2 (en) | 2018-08-02 | 2021-03-09 | Molex, Llc | Shield cage assembly |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5621244A (en) * | 1994-05-16 | 1997-04-15 | Lin; Shih-Jen | Fin assembly for an integrated circuit |
US5771966A (en) * | 1995-12-15 | 1998-06-30 | Jacoby; John | Folded conducting member heatsinks and method of making same |
US6009937A (en) * | 1995-12-20 | 2000-01-04 | Hoogovens Aluminium Profiltechnik Gmbh | Cooling device for electrical or electronic components having a base plate and cooling elements and method for manufacturing the same |
US5706169A (en) * | 1996-05-15 | 1998-01-06 | Yeh; Robin | Cooling apparatus for a computer central processing unit |
US6109340A (en) * | 1997-04-30 | 2000-08-29 | Nidec Corporation | Heat sink fan |
US5969949A (en) * | 1998-03-31 | 1999-10-19 | Sun Microsystems, Inc. | Interfitting heat sink and heat spreader slug |
TW376171U (en) * | 1998-11-24 | 1999-12-01 | Foxconn Prec Components Co Ltd | Radiating device |
TW407753U (en) * | 1999-03-02 | 2000-10-01 | West Victory Ind Co Ltd | Improvement of heat dissipating structure for CPU |
-
2000
- 2000-08-29 TW TW089214934U patent/TW510526U/en not_active IP Right Cessation
- 2000-12-21 US US09/746,266 patent/US6373699B1/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040108104A1 (en) * | 2002-11-08 | 2004-06-10 | Chin-Kuang Luo | Axial heat-dissipating device |
US20130014917A1 (en) * | 2011-07-14 | 2013-01-17 | Tsung-Hsien Huang | Heat pipe-attached heat sink with bottom radiation fins |
US11262140B2 (en) * | 2018-09-30 | 2022-03-01 | Tyco Electronics (Shanghai) Co. Ltd. | Heat sink and housing assembly |
Also Published As
Publication number | Publication date |
---|---|
TW510526U (en) | 2002-11-11 |
US6373699B1 (en) | 2002-04-16 |
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Legal Events
Date | Code | Title | Description |
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AS | Assignment |
Owner name: FOXCONN PRECISION COMPONENTS CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHEN, YUN LONG;REEL/FRAME:011402/0742 Effective date: 20001202 |
|
FPAY | Fee payment |
Year of fee payment: 4 |
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REMI | Maintenance fee reminder mailed | ||
LAPS | Lapse for failure to pay maintenance fees | ||
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
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FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20100416 |