US11357136B2 - Device for cooling server rack - Google Patents
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- US11357136B2 US11357136B2 US16/905,378 US202016905378A US11357136B2 US 11357136 B2 US11357136 B2 US 11357136B2 US 202016905378 A US202016905378 A US 202016905378A US 11357136 B2 US11357136 B2 US 11357136B2
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- 238000001816 cooling Methods 0.000 title claims abstract description 41
- 239000002826 coolant Substances 0.000 claims abstract description 26
- 239000007788 liquid Substances 0.000 claims abstract description 24
- 238000004891 communication Methods 0.000 claims abstract description 18
- 239000012530 fluid Substances 0.000 claims abstract description 16
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 12
- 230000004044 response Effects 0.000 claims description 10
- 239000003507 refrigerant Substances 0.000 claims description 9
- 238000011144 upstream manufacturing Methods 0.000 claims description 7
- OHMHBGPWCHTMQE-UHFFFAOYSA-N 2,2-dichloro-1,1,1-trifluoroethane Chemical compound FC(F)(F)C(Cl)Cl OHMHBGPWCHTMQE-UHFFFAOYSA-N 0.000 claims description 6
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 6
- 239000001569 carbon dioxide Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000003570 air Substances 0.000 description 75
- 238000005516 engineering process Methods 0.000 description 64
- 238000005259 measurement Methods 0.000 description 8
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 230000003247 decreasing effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000013459 approach Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000037361 pathway Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
Definitions
- the present technology generally relates to a cooling device, more particularly, to a cooling device for cooling a server rack.
- computers have fans installed for drawing in air and exhausting the heated air for cooling down the chips. Needless to say, although such fans may be enough for certain computers (such as personal computers), it is not enough to cool down the chips found in servers in a data center. Indeed, most corporate data centers have elaborate, expensive air conditioning and venting systems to prevent overheating of the chips.
- a common approach is to control the amount of air to be blown into the chamber containing the servers based on the sensed temperature of the servers.
- Another common approach is to cool the air (using a cooling device) entering the server room.
- European Patent No. 2298051 B1 published Mar. 23, 2011 to Semper Holdings Ltd., and titled “Rack Mounted Cooling Unit”, discloses a cooling unit comprising at least one cooling coil, at least one fan for circulating air through said at least one cooling coil, and a housing containing said at least one cooling coil and fan, wherein said housing is sized to fit within an IT server rack and is arranged for attachment to said rack.
- the present technology aims at controlling the air flow for cooling a server rack in a more efficient manner, thus improving energy consumption and decreasing computational burden on the controlling systems.
- embodiments of the present technology have been developed based on the assumption that it would be beneficial to provide a cooling device that can be controlled to selectively (i.e. on demand) cool the air intake of particular server racks requiring additional cooling within a free cooling data center.
- some embodiments of the present technology may provide a more economic and resource efficient manner of preventing over heating of the servers in a data center.
- a device for cooling a server rack configured for operating in a free cooling server room, the server room having a first chamber and a second chamber air-flow partitioned therebetween by the server rack and being in fluid communication therebetween via the server rack, the device comprising: a main chilling unit; a heat exchanging unit operatively coupled to the main chilling unit via a pipe running a liquid coolant; the main chilling unit including a housing for housing: an evaporator configured to cause the liquid coolant to absorb heat from air surrounding the evaporator, thereby cooling the air surrounding the evaporator; a first airlock device configured to removably secure the main chilling unit to the server rack from a side of the first chamber; a first fan configured to force air from the first chamber to the second chamber via the server rack through a first path of travel including the evaporator and the first airlock device; the heat exchanging unit including a housing for housing: a condenser in fluid communication with the e
- the first chamber is a cold chamber and the second chamber is hot chamber.
- the server rack includes an inlet to intake cooled air from the main chilling unit; the main chilling unit further including a first inlet and a first outlet, wherein the evaporator is fluidly coupled between the first inlet and the first outlet; and wherein the first airlock device is configured to secure the first outlet to the inlet of the server rack.
- the first fan is fluidly coupled between the first inlet and the first outlet and fluidly upstream of the evaporator, the first fan being configured to flow the cooled air toward the server rack via the first outlet and the inlet.
- the main chilling unit further comprising a controller operatively coupled to at least one of the evaporator and the first fan, the controller including a processor configured to selectively: generate a first control signal to adjust a rate at which the liquid coolant absorbs heat from air surrounding the evaporator; and generate a second control signal to adjust a speed of the first fan.
- the controller is operatively coupled to a thermometer configured to measure a temperature of the cold chamber, and wherein the processor is configured to generate one of the first control signal and the second control signal in response to the measured temperature being above a predetermined temperature threshold.
- the controller is operatively coupled to a thermometer configured to measure a temperature within the server rack, and wherein the processor is configured to generate one of the first control signal and the second control signal in response to the measured temperature being above a predetermined temperature threshold.
- the controller is operatively coupled to a differential pressure gauge configured to measure a differential air pressure value of the cold chamber relative to the hot chamber, and wherein the processor is configured to generate the second control signal in response to the measured differential air pressure value being above a predetermined air pressure value threshold.
- the hot chamber includes an inlet to intake heated air from the heat exchanging unit; the heat exchanging unit further including a second inlet and a second outlet, wherein the condenser is fluidly coupled between the second inlet and the second outlet; and wherein the second airlock device is configured to secure the second outlet to the inlet of the second chamber.
- the second fan is fluidly coupled between the second inlet and the second outlet and fluidly upstream of the condenser, the second fan being configured to flow air heated by the condenser toward the hot chamber via the second outlet and the inlet of the second chamber.
- At least one of the first airlock device and the second airlock device is a rubber seal.
- the heat exchanging unit further comprising a compressor and an expansion valve in fluid communication with the evaporator and the condenser via the pipe.
- the pipe is configured to run the liquid coolant between the evaporator, the compressor, the expansion valve and the condenser in a closed loop.
- the liquid coolant is implemented as one of: Cholorofluorocarbon (CFC) refrigerant, Hydrochlorofluorocarbon (HCFC) refrigerant, Hydrofluorocarbon (HFC) refrigerant, and Carbon dioxide (CO2).
- CFC Cholorofluorocarbon
- HCFC Hydrochlorofluorocarbon
- HFC Hydrofluorocarbon
- CO2 Carbon dioxide
- a device for cooling a server rack comprising: a main chilling unit; a heat exchanging unit operatively coupled to the main chilling unit via a pipe running a liquid coolant; the main chilling unit including a housing for housing: an evaporator configured to cause the liquid coolant to absorb heat from air surrounding the evaporator at different rates; an airlock device configured to removably secure the main chilling unit to the server rack; a fan configured to force air through the server rack via a path of travel including the evaporator and the airlock device; a controller operatively coupled to at least one of the evaporator and the fan, the controller including a processor configured to selectively: generate a first control signal to adjust the rate at which the liquid coolant absorbs heat from air surrounding the evaporator; and generate a second control signal to adjust the speed of the fan; the heat exchanging unit including a housing for housing: a condenser in fluid communication with the evaporator
- the controller is operatively coupled to a thermometer configured to measure a temperature within the server rack, and wherein the processor is configured to generate one of the first control signal and the second control signal in response to the measured temperature being above a predetermined temperature threshold.
- the controller is operatively coupled to a differential pressure gauge configured to measure a differential air pressure value of the cold chamber relative to the hot chamber, and wherein the processor is configured to generate the second control signal in response to the measured differential air pressure value being above a predetermined air pressure value threshold.
- the server rack includes an inlet to intake cooled air from the main chilling unit; the main chilling unit further including a first inlet and a first outlet, wherein the evaporator is fluidly coupled between the first inlet and the first outlet; and wherein the airlock device is configured to secure the first outlet to the inlet of the server rack.
- the server rack is configured for operating in a free cooling server room having a cold chamber and a hot chamber partitioned by the server rack.
- the heat exchanging unit is provided within one of the hot chamber and an outside of the server room
- FIG. 1 is a schematic diagram depicting a system according to some non-limiting embodiments of the present technology.
- FIG. 2 depicts an example of a process of generating a first, second and third control signals by a controller unit of the system of FIG. 1 .
- FIG. 3 is a perspective view of a main chilling unit of the system of FIG. 1 .
- FIG. 4 is a perspective view of a heat exchanging unit of the system of FIG. 1 .
- FIG. 1 there is shown a schematic diagram of a system 100 , the system 100 being suitable for implementing non-limiting embodiments of the present technology.
- the system 100 is depicted merely as an illustrative implementation of the present technology.
- the description thereof that follows is intended to be only a description of illustrative examples of the present technology. This description is not intended to define the scope or set forth the bounds of the present technology.
- what are believed to be helpful examples of modifications to the system 100 may also be set forth below. This is done merely as an aid to understanding, and, again, not to define the scope or set forth the bounds of the present technology.
- processor may be provided through the use of dedicated hardware as well as hardware capable of executing software in association with appropriate software.
- the functions may be provided by a single dedicated processor, by a single shared processor, or by a plurality of individual processors, some of which may be shared.
- the processor may be a general purpose processor, such as a central processing unit (CPU) or a processor dedicated to a specific purpose, such as a graphics processing unit (GPU).
- CPU central processing unit
- GPU graphics processing unit
- processor or “controller” should not be construed to refer exclusively to hardware capable of executing software, and may implicitly include, without limitation, digital signal processor (DSP) hardware, network processor, application specific integrated circuit (ASIC), field programmable gate array (FPGA), read-only memory (ROM) for storing software, random access memory (RAM), and non-volatile storage.
- DSP digital signal processor
- ASIC application specific integrated circuit
- FPGA field programmable gate array
- ROM read-only memory
- RAM random access memory
- non-volatile storage Other hardware, conventional and/or custom, may also be included.
- the system 100 is configured to control the air flow for cooling a server room 102 , of a data center (not depicted) or the like.
- the server room 102 is partitioned by a server rack 108 into a cold chamber 104 (which can also be thought of as a “first chamber”), and a hot chamber 106 (which can also be thought as a “second chamber”).
- the server rack 108 is configured to house one or more servers 110 .
- the manner in which the one or more servers 110 are housed within the server rack 108 is not limited, and may for example be in a “chassis” configuration. Although in the illustrated embodiment only one server rack 108 is shown, it is not limitative. As such, it is contemplated that the server room 102 can be partitioned, by a plurality of server racks organized in rows or back-to-back, into the cold chamber 104 and the hot chamber 106 .
- each of the servers 110 housed within the server rack 108 generally comprises a fan (not depicted), which is configured to draw cool air from the cold chamber 104 through an inlet of the server, allow it to circulate within the servers 110 and exhaust the heated air into the hot chamber 106 .
- a fan not depicted
- heat generated within the one or more servers 110 is cooled by the cold air sucked thereinto, and the one or more servers 110 can operate normally.
- the server rack 108 may include one or more large “rack fans” located behind the servers (not shown) within the server rack 108 . These “rack fans” are also configured to draw cool air from the cold chamber 104 into the plurality of servers (not shown) and exhaust the heated air into the hot chamber 106 .
- the system 100 includes a first channel 109 coupling an air inlet 112 of the cold chamber 104 to an ambient outside 114 , thereby allowing the air from the ambient outside 114 to flow into the cold chamber 104 .
- the server room 102 is housed within a building (such as a hangar and the like) (not depicted), and the ambient outside 114 is an area outside the server room 102 .
- the ambient outside 114 may refer to, for example, the area surrounding the building, or the area surrounding the server room 102 within the building.
- the amount of air from the ambient outside 114 flowing into the cold chamber 104 is controlled by a damper 116 that can be installed near one end of the first channel 109 , which is configured to adjust, by a degree of opening thereof, an amount of air that flows into the first channel 109 .
- a damper 116 that can be installed near one end of the first channel 109 , which is configured to adjust, by a degree of opening thereof, an amount of air that flows into the first channel 109 .
- other means of controlling the amount of air from the ambient outside 114 is contemplated, such as for example, an inlet fan (not shown) near the end of the first channel 109 .
- a filter 120 within the first channel 109 , which filter 120 prevents dust (or other impurities) carried by the air in the ambient outside 114 from entering the cold chamber 104 .
- the filter 120 is shown to be placed fluidly downstream from the damper 116 , it is not limited as such, and may be placed fluidly upstream from the damper 116 .
- the hot chamber 106 comprises, and is in fluid communication with, a second channel 126 .
- an outlet fan (not shown) is installed nearby the air outlet to force-flow the heated air from the hot chamber 106 to the ambient outside 114 .
- a cooling device 115 is made up of two units, namely a main chilling unit 122 and a heat exchanging unit 124 .
- the main chilling unit 122 may be removably connected to an inlet (not depicted) of the server rack 108 .
- the main chilling unit comprises one or more fans 118 configured to control the amount of air flowing into the server rack 108 .
- the manner in which the fans 118 are implemented is not limited.
- the fans 118 may be implemented as an axial-flow fan, a centrifugal fan, or a cross-flow fan, and the like or a combination thereof.
- the fans 118 are configured to increase and/or decrease the flow of air into the server rack 108 by, for example, increasing or decreasing the speed of rotation (discussed in detail below).
- the temperature of the cold chamber 104 is captured by a first thermometer 136 .
- the first thermometer 136 is placed in proximity to an inlet of the main chilling unit 122 , to obtain a relatively-more precise temperature value of the air entering the server rack 108 .
- thermometer 139 may be placed within the server rack 108 to obtain a relatively-more precise temperature value within the server rack 108 , and/or the servers 110 .
- the main chilling unit 122 further includes an evaporator 138 .
- the evaporator 138 is implemented is generally known in the art, and will not be described in detail herein. Suffice it to say that the evaporator 138 is configured to cool the air with the use of a coolant (described below, not shown).
- the evaporator 138 is in fluid communication with a condenser 140 installed within the heat exchanging unit 124 via flexible tubes 107 (shown in broken lines).
- the main chilling unit 122 and the heat exchanging unit 124 are in fluid communication with each other via the flexible tubes 107 .
- the condenser 140 is configured to change the phase of the gaseous coolant into its liquid form before sending it back to the evaporator 138 .
- the heat exchanging unit 124 further comprises a compressor 142 configured to control the flow of the coolant within the flexible tubes 107 .
- an inlet (not shown) of the heat exchanging unit 124 faces the cold chamber 104
- the outlet (not shown) of the heat exchanging unit 124 faces the hot chamber 106 .
- air from the cold chamber 104 is configured to flow into the hot chamber 106 via the heat exchanging unit 124 .
- the heat exchanging unit 124 may include one or more fans 144 . How the fans 144 are implemented is not limited and may for example be implemented similar to the fans 118 . Although the fans 144 are depicted as being installed upstream the condenser 140 , it is not limited as such. It is contemplated that the fans 144 be installed downstream the condenser, or nearby the outlet of the heat exchanging unit 124 .
- the system 100 may further comprise a differential pressure gauge 152 configured to measure a differential pressure value corresponding to a difference of air pressure of the cold chamber 104 relative to the air pressure of the hot chamber 106 .
- the differential pressure gauge 152 has a first and second inlet ports (not numbered) that are each connected to a respective pressure point being monitored.
- the first inlet port may be connected to a first pressure point within the cold chamber 104 and the second inlet port may be connected, for example, to a second pressure point within the hot chamber 106 , or vice-versa.
- the differential pressure gauge 152 can be implemented as one of the differential pressure gauges manufactured by Dwyer Instruments Inc. of Michigan, USA, under model designation DH Digihelic®.
- the system 100 further comprises a controller unit 137 for controlling the air flow for cooling the server rack 108 .
- the controller unit 137 is a computer configured to receive and transmit signals from various devices of the system 100 (described in more detail below).
- the controller unit 137 comprises a memory 146 which includes one or more storage media and generally provides a place to store computer-executable program instructions executable by a processor 148 .
- the memory 146 may be implemented as tangible computer-readable storage medium including Read-Only Memory (ROM) and/or Random-Access Memory (RAM).
- the memory 146 may also include one or more fixed storage devices in the form of, by way of example, hard disk drives (HDDs), solid-state drives (SSDs) and flash memory cards.
- Controlling the air flow for cooling the server room 102 is executed by an application 150 stored within the memory 146 .
- the application 150 comprises a set of computer executable program instructions executable by the processor 148 .
- FIG. 2 there is depicted a schematic illustration of an operation of the application 150 for controlling the air flow between the cold chamber 104 and the hot chamber 106 .
- the application 150 executes (or otherwise has access to): a measurement value acquisition routine 202 , a fan control routine 204 , and an evaporator control routine 206 .
- routine refers to a subset of the computer executable program instructions of the application 150 that is executable by the processor 148 to perform the functions explained below.
- the measurement value acquisition routine 202 the fan control routine 204 , and the evaporator control routine 206 are illustrated schematically herein in a separate and distributed manner for ease of explanation of the processes executed by the application 150 . It is contemplated that some or all of the measurement value acquisition routine 202 , the fan control routine 204 , and the evaporator control routine 206 may be implemented as one or more combined routines.
- Each of the first thermometer 136 , the second thermometer 139 and the differential pressure gauge 152 transmit sensed data to the controller unit 137 by virtue of data packets 208 transmitted to the controller unit 137 .
- the system 100 includes only one of, or a combination of two of, the first thermometer 136 , the second thermometer 139 and the differential pressure gauge 152 , and as such, the sensed data received via the data packets 208 comprise the sensed data associated with said one, or combination of two.
- the data packets 208 include a respective data packet for each of the monitored measurements, and thus include a respective data packet comprising a temperature value sensed by the first thermometer 136 and the second thermometer 139 , and at least one data packet comprising the differential pressure value sensed by the first differential pressure gauge 152 .
- differential pressure gauge 152 has been depicted as hardware within FIG. 1 , it is to be understood that it is not limited as such. Indeed, it is contemplated that the differential pressure gauge 152 may be implemented as a software routine that is part of the measurement value acquisition routine 202 and configured to receive, via the data packets 208 , the measured air pressures from their respective first and second pressure points (implemented as pressure gauges), and calculate the differential pressure value.
- the pressure gauges are implemented as a pressure gauge manufactured by Dwyer Instruments Inc. of Michigan, USA, under model designation DPG-200.
- the fan control routine 204 Based on data contained in the data packets 208 received by the measurement value acquisition routine 202 , the fan control routine 204 generates a first control signal 210 for controlling the rotation speed of the fans 144 and/or fans 118 .
- the fan control routine 204 executes a first proportional-integral-derivative (PID) algorithm 214 .
- the first PID algorithm 214 is configured to compare the differential pressure value (determined by the differential pressure gauge 152 ) to a first target value (described below).
- the fan control routine 204 generates and transmits the first control signal 210 which contains instructions for adjusting the rotation speed of the fans 144 and/or fans 118 in order to achieve the first target value.
- the first target value is indicative of the target differential pressure value to be maintained within the cold chamber 104 in relation to the hot chamber 106 .
- the controller unit 137 comprises, or is electrically coupled to, an input device (not shown) for receiving the first target value from a user (such as, for example, an operator of the system 100 ).
- the first target value is 0 Pa (meaning there should be, as a target, equilibrium between the pressure in the cold chamber 104 and the hot chamber 106 ). Needless to say, it is further contemplated that the first target value may be a different value.
- the first control signal 210 contains instructions to decrease the rotation speed of the fans 144 and/or fans 118 in order to decrease the amount of heated air entering the hot chamber 106 , thereby increasing the air pressure within the cold chamber 104 to achieve the first target value.
- the first control signal 210 contains instructions to increase the rotation speed of the fans 144 and/or fans 118 to increase the amount of heated air entering the hot chamber 106 , thereby increasing the air pressure within the hot chamber 106 to achieve the first target value.
- the fan control routine 204 if it is determined that the differential pressure value matches the first target value, the fan control routine 204 does not generate the first control signal 210 .
- the fan control routine 204 may also be configured to generate the first control signal 210 which contains instructions to maintain the rotation speed of the fans 144 and/or fans 118 , upon determining that the differential pressure value matches the first target value.
- the fan control routine 204 is configured to generate a second control signal 211 for controlling the rotation speed of the fans 118 .
- the fan control routine 204 comprises a second PID algorithm 215 configured to compare a first temperature value received by the first thermometer 136 and/or a second temperature value received by the second thermometer 139 against second target value.
- the fan control routine 204 generates and transmits the second control signal 211 which contains instructions for adjusting the rotation speed of the fans 118 in order to achieve the second target value.
- the second target value is indicative of a target temperature to be maintained within the cold chamber 104 or in the server rack 108 .
- the second control signal 211 contains instructions to increase the rotation speed of the fans 118 in order to increase the amount of air entering the hot chamber 106 , thereby decreasing the temperature within the cold chamber 104 and/or the server rack 108 to achieve the second target value.
- the second control signal 211 contains instructions to decrease the rotation speed of the fans 118 in order to decrease the amount of air entering the hot chamber 106 , thereby increasing the temperature within the cold chamber 104 and/or the server rack 108 to achieve the second target value.
- the fan control routine 204 if it is determined that the first temperature value and/or the second temperature value matches the second target value, the fan control routine 204 does not generate the second control signal 211 .
- the fan control routine 204 may also be configured to generate the second control signal 211 which contains instructions to maintain the rotation speed of the fans 118 , upon determining that the first temperature value and/or the second temperature value matches the second target value.
- the fan control routine 204 generates the first control signal 210 independently from the second control signal 211 .
- the fan control routine 204 independently controls operation of the fans 118 and fans 144 .
- the fan control routine 204 is configured to determine (i) the difference between the differential pressure value to the first target value to selectively adjust the speed of the fans 144 , and (ii) the difference between the first temperature value and/or the second temperature value to the second target value to selectively adjust the speed of the fans 118 .
- the evaporator control routine 206 Based on data contained in the data packets 208 received by the measurement value acquisition routine 202 , the evaporator control routine 206 generates a third control signal 212 for adjusting a rate at which the air within the cold chamber 104 is cooled by the evaporator 138 .
- the evaporator control routine 206 comprises a third PID algorithm 216 .
- the third PID algorithm 216 is configured to compare the second temperature value sensed by the second thermometer 139 to a temperature target value.
- the evaporator control routine 206 generates and transmits the third control signal 212 which contains instructions for adjusting the rate at which the air within the main chilling unit 122 is cooled by the evaporator 138 .
- the temperature target value is indicative of a target temperature to be maintained within the server rack 108 .
- the temperature target value is or about 20 degree Celsius. Needless to say, it is further contemplated that the temperature target value may be a different value. It is also contemplated that the temperature target value is inputted from the user via the input device (not shown).
- the third control signal 212 contains instruction of increasing the rate at which the evaporator 138 cools the air within the main chilling unit 122 , thereby cooling the air that enters server rack 108 so as to achieve the temperature target value.
- the third control signal 212 contains instruction of decreasing the rate at which the evaporator 138 cools the air within the cold chamber 104 so as to achieve the temperature target value.
- the evaporator control routine 206 generates the third control signal 212 independently from the first control signal 210 and the second control signal 211 .
- FIG. 3 there is depicted a perspective view of the main chilling unit 122 implemented in accordance with a non-limiting embodiment of the present technology.
- the main chilling unit 122 comprises three (3) axial fans 118 .
- the three axial fans 118 are implemented as fans manufactured by the Ziehl-Abegg SE of Kunzelsau, Germany, under model designation FN035-4IL.ZC.A5P5. Needless to say, although three axial fans 118 are illustrated, it is contemplated that more or less fans may be used.
- the evaporator 138 is in fluid communication with an expansion valve 302 via, for example, a copper tube (not numbered).
- the evaporator 138 is implemented as an evaporator manufactured by the Ventolux.
- the expansion valve 302 is implemented as an electric expansion valve manufactured by Carel Industries S.p.A. of Padova, Italy, under model designation E2V24 USF10.
- the evaporator 138 further comprises a control panel 304 , which is in electrical communication with the axial fans 118 , the evaporator 138 and the expansion valve 302 .
- the controller unit 137 may establish communication with the axial fans 118 , the evaporator 138 and the expansion valve 302 via the control panel 304 .
- the main chilling unit 122 comprises a first airlock device 306 provided on a rear frame of the main chilling unit 122 .
- the first airlock device 306 is configured to removably secure the main chilling unit 122 to an opening of the server rack 108 .
- the first airlock device 306 secures the main chilling unit 122 to allow cooled air to flow into the server rack 108 without leaks.
- the first airlock device 306 is a rubber seal provided on a perimeter of the rear frame.
- main chilling unit 122 is not permanently secured to the server rack 108 . Accordingly, the main chilling unit 122 may be selectively moved to be stored or to be secured to another server rack (not shown) when the server rack 108 does not require additional cooling.
- FIG. 3 illustrates the main chilling unit 122 and its components in a configuration most susceptible for illustrating structure thereof for the purposes of this description, it should be understood that it is contemplated that walls for covering the interior of the main chilling unit 122 may be installed.
- FIG. 4 there is depicted a perspective view of the heat exchanging unit 124 implemented in accordance with non-limiting embodiments of the present technology.
- the heat exchanging unit 124 comprises the compressor 142 in fluid communication, via a copper pipe or the like (not numbered), with the condenser 140 .
- the heat exchanging unit 124 also comprises three (3) axial fans 144 , which may be implemented as the same model as the axial fans 118 .
- the heat exchanging unit 124 further comprises a movable panel 402 which is configured to adjust, by a degree of opening thereof, an amount of air that flows into the hot chamber 106 , via, for example, the controller unit 137 .
- a movable panel 402 is shown to be placed fluidly downstream from the condenser 140 , it is not limited as such, and may be placed fluidly upstream from the movable panel 402 .
- the heat exchanging unit 124 comprises a second airlock device 404 provided on a rear frame of the heat exchanging unit 124 .
- the second airlock device 404 is configured to secure the heat exchanging unit 124 to an opening of the hot chamber 106 .
- the second airlock device 404 secures the heat exchanging unit 124 to an inlet of the hot chamber 106 to allow heated air to flow into the hot chamber 106 without leaks.
- the second airlock device 404 is a rubber seal provided on a perimeter of the rear frame.
- the heat exchanging unit 124 is not permanently secured to the inlet of the hot chamber 106 . Accordingly, the heat exchanging unit 124 may be selectively moved to be stored (together with the main chilling unit 122 ) or to be secured to another inlet of the hot chamber 106 (not shown) when the main chilling unit 122 is coupled to another server rack (not shown).
- FIG. 3 illustrates the heat exchanging unit 124 and its components in an uncovered configuration, it should be understood that it is contemplated that walls for covering the interior of the heat exchanging unit 124 be installed.
- the main chilling unit 122 and the heat exchanging unit 124 are in fluid communication via the flexible tubes 107 (see FIG. 1 ) connected to the copper piping of the main chilling unit 122 and the heat exchanging unit 124 .
- the liquid coolant is configured to run between the evaporator 138 , the expansion valve 302 , the compressor 142 and the condenser 140 in a closed loop.
- the liquid coolant is implemented as one of: Chlorofluorocarbon (CFC) refrigerant, Hydrochlorofluorocarbon (HCFC) refrigerant, Hydrofluorocarbon (HCF) refrigerant, and Carbon dioxide (CO2).
- CFC Chlorofluorocarbon
- HCFC Hydrochlorofluorocarbon
- HCF Hydrofluorocarbon
- CO2 Carbon dioxide
- the inlet (not shown) of the heat exchanging unit 124 is illustrated as facing the cold chamber 104
- the outlet (not shown) of the heat exchanging unit 124 is illustrated as facing the hot chamber 106
- the heat exchanging unit 124 be placed entirely within the hot chamber 106 , or even in the ambient outside 114 , while being in fluid communication with the main chilling unit 122 via the flexible tubes 107 .
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Moving Of Heads (AREA)
Abstract
Description
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RU2019137518A RU2757178C2 (en) | 2019-11-21 | 2019-11-21 | Device for cooling server rack |
RURU2019137518 | 2019-11-21 | ||
RU2019137518 | 2019-11-21 |
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US20210161032A1 US20210161032A1 (en) | 2021-05-27 |
US11357136B2 true US11357136B2 (en) | 2022-06-07 |
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ID=75906530
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US16/905,378 Active 2040-12-01 US11357136B2 (en) | 2019-11-21 | 2020-06-18 | Device for cooling server rack |
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US (1) | US11357136B2 (en) |
CN (2) | CN214381895U (en) |
RU (1) | RU2757178C2 (en) |
TW (1) | TWI774128B (en) |
Families Citing this family (2)
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RU2757178C2 (en) * | 2019-11-21 | 2021-10-11 | Общество С Ограниченной Ответственностью «Яндекс» | Device for cooling server rack |
US20230341911A1 (en) * | 2022-04-21 | 2023-10-26 | Quanta Computer Inc. | Housing with one or more airflow elements |
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Also Published As
Publication number | Publication date |
---|---|
CN214381895U (en) | 2021-10-08 |
RU2757178C2 (en) | 2021-10-11 |
CN112825615A (en) | 2021-05-21 |
RU2019137518A (en) | 2021-05-21 |
TWI774128B (en) | 2022-08-11 |
US20210161032A1 (en) | 2021-05-27 |
TW202131782A (en) | 2021-08-16 |
RU2019137518A3 (en) | 2021-09-06 |
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