US10268863B2 - Capacitive sensing device, fingerprint sensing device and method for manufacturing capacitive sensing device - Google Patents
Capacitive sensing device, fingerprint sensing device and method for manufacturing capacitive sensing device Download PDFInfo
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- US10268863B2 US10268863B2 US15/351,692 US201615351692A US10268863B2 US 10268863 B2 US10268863 B2 US 10268863B2 US 201615351692 A US201615351692 A US 201615351692A US 10268863 B2 US10268863 B2 US 10268863B2
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04166—Details of scanning methods, e.g. sampling time, grouping of sub areas or time sharing with display driving
-
- G06K9/0002—
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04106—Multi-sensing digitiser, i.e. digitiser using at least two different sensing technologies simultaneously or alternatively, e.g. for detecting pen and finger, for saving power or for improving position detection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
Definitions
- the invention relates in general to a capacitive sensing device, and more particularly, to a capacitive sensing device applied to a portable electronic device or a flat display device.
- a capacitive sensing device includes: a substrate; a touch sensing electrode group, disposed above the substrate; a fingerprint sensing electrode group, disposed above the substrate; and a capacitive sensing integrated circuit, electrically connected to the touch sensing electrode group and the fingerprint sensing electrode group, sensing a capacitance change in the touch sensing electrode group to generate a touch control instruction, and sensing a capacitance change in the fingerprint sensing electrode group to generate a fingerprint pattern.
- the substrate is a transparent substrate including a touch sensing electrode distribution region, in which the touch sensing electrode group is distributed.
- the touch sensing electrode group includes an insulation layer and two layers of conductive structures.
- the substrate includes a fingerprint sensing electrode distribution region, in which the fingerprint sensing electrode group is distributed.
- the touch sensing electrode group and/or the fingerprint sensing electrode group at least include(s) three layers of structures, with the middle-layer structure being an insulation layer and upper and lower layers being conductive structures.
- both of the conductive structures are implemented by metal mesh layers or by transparent electrode layers.
- the two layers of conductive structures are implemented by a metal mesh layer and a transparent electrode layer.
- an electrode distribution density of the fingerprint sensing electrode group is greater than an electrode distribution density of the touch sensing electrode group, and a position of the fingerprint sensing electrode group overlaps a position of the touch sensing electrode group.
- the substrate includes a recess above the fingerprint sensing electrode group.
- a metal ring is formed on a sidewall of the recess.
- the recess is electrically connected to the capacitive sensing integrated circuit and is thus provided with a fixed voltage.
- the touch sensing electrode group, the fingerprint sensing electrode group and the capacitive sensing integrated circuits are all disposed on a same surface or above a same surface of the substrate.
- the fingerprint sensing electrode includes: a first conductive structure, disposed above the substrate, including a plurality of parallel conducting lines; a second conductive structure, disposed above the substrate; an insulation layer, disposed between the first conductive structure and the second conductive structure; and at least one floating conductive structure, made of the same material as the second conductive structure but not being in electrical contact with the second conductive structure, disposed on the same side of the insulation layer as the second conductive layer and above a gap of the parallel conducting lines.
- the capacitive sensing device further includes a metal mesh segment disposed on the first conductive structure and being in electrical contact with the first conductive structure.
- the fingerprint sensing electrode group includes: a first conductive structure, disposed above the substrate, including a plurality of parallel conducting lines; a second conductive structure, disposed above the substrate; an insulation layer, disposed between the first conductive structure and the second conductive structure; at least one auxiliary conductive structure, made of the same material as the second conductive structure and being in electrical contact with the second conductive structure, disposed on the same side of the insulation layer as the second conductive structure and located above a gap of the parallel conducting lines.
- the capacitive sensing device further includes a metal mesh segment disposed on the first conductive structure and being in electrical contact with the first conductive structure.
- the present invention further provides a capacitive sensing device.
- the capacitive sensing device includes: a substrate; a first conductive structure, disposed above a surface of the substrate, including a plurality of parallel conducting lines; a second conductive structure, disposed above the substrate; an insulation layer, disposed between the first conductive structure and the second conductive structure; and an auxiliary conductive structure, being in electrical contact with the second conductive structure, disposed on the same side of the insulation layer as the second conductive structure and located above a gap of the parallel conducting lines.
- the present invention further provides a method for manufacturing a capacitive sensing device.
- the method includes: providing a substrate; completing a touch sensing electrode group and a finger sensing electrode group above a surface of the substrate using a same manufacturing process; and providing a capacitive sensing integrated circuit and electrically connecting the capacitive sensing integrated circuit with the touch sensing electrode group and the fingerprint sensing electrode group, the capacitive sensing integrated circuit sensing a capacitance change in the touch sensing electrode group to generate a touch control instruction and sensing a capacitance change in the fingerprint sensing electrode group to generate a fingerprint pattern.
- FIG. 1 a is a function block diagram of a capacitive touch sensing device with a fingerprint recognition function according to an embodiment of the present invention
- FIG. 1 b is a section view of a capacitive touch sensing device with a fingerprint recognition function according to an embodiment of the present invention
- FIG. 2 a is a partial section view of a touch sensing electrode distribution region and a fingerprint sensing electrode distribution according to an embodiment of the present invention
- FIG. 2 b is a partial section view of a touch sensing electrode distribution region and a fingerprint sensing electrode distribution according to an embodiment of the present invention
- FIG. 2 c is a partial section view of a touch sensing electrode distribution region and a fingerprint sensing electrode distribution according to an embodiment of the present invention
- FIG. 3 a is a function block diagram of a capacitive touch sensing device with a fingerprint recognition function according to another embodiment of the present invention.
- FIG. 3 b is a function block diagram of a capacitive touch sensing device with a fingerprint recognition function according to another embodiment of the present invention.
- FIG. 4 a is a schematic diagram of electrode patterns of a fingerprint sensing electrode group according to an embodiment of the present invention.
- FIG. 4 b is a schematic diagram of electrode patterns of a fingerprint sensing electrode group according to an embodiment of the present invention.
- FIG. 4 c is a schematic diagram of electrode patterns of a fingerprint sensing electrode group according to an embodiment of the present invention.
- FIG. 4 d is a schematic diagram of electrode patterns of a fingerprint sensing electrode group according to an embodiment of the present invention.
- FIG. 4 e is a schematic diagram of electrode patterns of a fingerprint sensing electrode group according to an embodiment of the present invention.
- FIG. 1 a shows a function block diagram of a capacitive touch sensing device with a fingerprint recognition function according to an embodiment of the present invention.
- a substrate 10 includes a touch sensing electrode distribution region 11 and a fingerprint sensing electrode distribution region 12 .
- the sensing for a touch position on the touch sensing electrode distribution region 11 and the sensing for a fingerprint pattern on the fingerprint sensing electrode distribution 12 are both implemented by capacitive touch sensing technologies.
- a capacitive sensing integrate circuit 13 is used to calculate the touch position on the touch sensing electrode distribution region 11 and to construct the fingerprint pattern on the fingerprint sensing electrode distribution 12 ; that is, the sensing for the touch position and that for the fingerprint pattern are achieved using the same integrated circuit chip.
- the capacitive sensing integrated circuit 13 senses a capacitance change of a touch sensing electrode group included in the touch sensing electrode distribution region 11 to generate a touch sensing instruction, and a capacitance change of a fingerprint sensing electrode group included in the fingerprint sensing electrode distribution region 12 to generate a fingerprint pattern. Further, due to different resolutions required for the sensing of the touch position and the sensing for the fingerprint pattern, a distribution density of a touch sensing electrode group 310 included in the touch sensing electrode distribution region 11 differs from a distribution density of a fingerprint sensing electrode group 320 included in the fingerprint sensing electrode distribution region 12 , with the electrode distribution density of the fingerprint sensing electrode group 320 obviously being greater than the electrode distribution density of the touch sensing electrode group 310 .
- the substrate 10 when the present invention is applied to a flat display or any electronic device with a flat display, the substrate 10 is a transparent substrate, e.g., common glass or acrylic.
- the touch sensing electrode distribution region 11 is located in a display region of the flat display, whereas the fingerprint sensing electrode distribution region 12 is located outside the display region to prevent over-dense circuit routing wires from affecting the visibility of the display region.
- FIG. 1 b shows a section view of the above capacitive touch sensing device with a fingerprint recognition function.
- a predetermined region 100 On the substrate 10 is a predetermined region 100 , which is located above the fingerprint sensing electrode distribution region 12 and is for prompting a user finger to be placed therein to easily complete positioning.
- the predetermine region 100 may include a pre-defined region or a recess. Further, the pre-defined region may be a rough surface or a surface printed with different colors.
- a recess is used as an example for illustration.
- the thickness of the substrate 10 is approximately 0.3 mm, and the thickness of the bottom of the recess is reduced to approximately 0.2 mm.
- a distance between a finger and the fingerprint sensing electrode distribution region 12 is closer than the thickness of the substrate 10 , such that a fingerprint image sensed can be clearer to increase the recognition rate.
- a metal ring 101 may be formed on a sidewall of the recess, and is electrically connected to the capacitive sensing integrated circuit 13 at the other side through a via 102 or a routing wire.
- the capacitive sensing integrated circuit 13 provides a fixed voltage to the metal ring 101 to reduce possible noise generated during fingerprint sensing.
- the touch sensing electrode distribution region 11 , the capacitive integrated circuit 13 and the fingerprint sensing electrode distribution region 12 are located at the same side of the substrate 10 .
- the capacitive sensing integrated circuit 13 may also be disposed at one side of the substrate 10 , whereas the touch sensing electrode distribution region 11 and the fingerprint sensing electrode distribution region 12 may be disposed at the other side of the substrate 10 .
- FIG. 2 a to FIG. 2 c are partial section views of the touch sensing electrode distribution region 11 and the fingerprint sensing electrode distribution region 12 according to different embodiment of the present invention.
- FIG. 2 a three layers of structures are sequentially stacked on the substrate 10 —a first metal mesh layer 21 , an insulation layer 22 , and a second metal mesh layer 23 , with the metal mesh layers mostly completed by a silver paste material.
- the substrate 10 three layers of structures are sequentially stacked on the substrate 10 —the first metal mesh layer 21 , the insulation layer 22 , and a second transparent electrode layer 24 .
- FIG. 2 c three layers of structures are sequentially stacked on the substrate 10 —a first transparent electrode layer 25 , the insulation layer 22 , and the second transparent electrode layer 24 .
- the touch sensing electrode distribution region 11 and the fingerprint sensing electrode distribution region 12 are located at the same side of the substrate 10 , by appropriately designing a mask and causing the upper and lower conductive layers and the middle insulation layer of the touch sensing electrode group 310 and the fingerprint sensing electrode group 320 to have substantially the same thickness, the touch sensing electrode distribution region 11 and the fingerprint sensing electrode distribution region 12 may simultaneously form three-layer stacks as shown in FIG. 2 a to FIG. 2 c .
- the touch sensing electrode group 310 in the touch sensing electrode distribution region 11 and the fingerprint sensing electrode group 320 in the fingerprint sensing electrode distribution region 12 can be completed together in the same manufacturing process.
- the present invention achieves effects of reducing both production steps and costs. For example, by applying metal on the entire substrate 10 and removing excessive components using yellow light lithography process, the touch sensing electrode group 310 in the touch sensing electrode distribution region 11 and the fingerprint sensing electrode group 320 in the fingerprint sensing electrode distribution region 12 can be formed at the same time. Corresponding relationships of the three-layer structures in FIG. 2 a to FIG. 2 c and electrode patterns in the fingerprint sensing electrode group in the fingerprint sensing electrode distribution region 12 will be described in detail with reference to FIG. 4 a to FIG. 4 e shortly.
- FIG. 3 a shows a function block diagram of a touch sensing device with a fingerprint recognition function according to another embodiment of the present invention.
- a difference of the embodiment in FIG. 3 a from the embodiment in FIG. 1 a is that, a fingerprint sensing electrode distribution region 32 of this embodiment overlaps in a touch sensing electrode distribution region 31 , and does not occupy an addition wire routing region given that a routing density of a fingerprint sensing electrode group 320 and a touch sensing electrode group 310 that overlap each other does not affect the visibility of the display region.
- the same capacitive sensing integrated circuit 13 is used to complete the sensing for a touch position on the touch sensing electrode distribution region 31 and the sensing for a fingerprint pattern on the fingerprint sensing electrode distribution region 32 , thereby even better achieving objects of reducing manufacturing steps and costs.
- a plurality of fingerprint sensing electrodes may also be used as one touch sensing electrode.
- the fingerprint sensing electrode distribution region 32 may also perform touch sensing.
- FIG. 3 b shows a function block diagram of a touch sensing device with a fingerprint recognition function according to another embodiment of the present invention.
- a metal ring 301 is disposed to surround edges of the fingerprint sensing electrode distribution region 32 and is electrically connected to the capacitive sensing integrated circuit 13 through a routing wire.
- the capacitive sensing integrated circuit 13 provides a fixed voltage to the metal ring 301 to alleviate possible noise generated during fingerprint sensing.
- FIG. 4 a to FIG. 4 e show schematic diagrams of electrode patterns of a fingerprint sensing electrode group according to different embodiments of the present invention. For simplicity, only the upper and lower layers of conductive structures that are used to complete sensing electrodes in the three-layer structures in FIG. 2 a to FIG. 2 c , but not the substrate 10 and the insulation layer 22 , are depicted.
- a first conductive structure 41 farther away from the surface of the substrate 10 is a transparent electrode (equivalent to the second transparent electrode layer 24 in FIG. 2 b and FIG. 2 c ), and includes multiple parallel large-linewidth conducting lines.
- a second conductive structure 42 closer to the surface or even on the surface of the substrate 10 is a metal mesh (equivalent to the first metal mesh layer 21 in FIG. 2 a and FIG. 2 b ).
- the linewidth of the second conductive structure 42 may be reduced to a certain level under the premise that the visibility of the display region in the display device is not affected.
- an auxiliary conductive structure 43 made of the metal mesh is also formed above a gap between adjacent first conductive structures 41 . That is to say, the second conductive structure 42 and the auxiliary conductive structure 43 are substantially located on the same plane and may be formed by the same manufacturing process.
- the auxiliary conductive structure 43 , the second conductive structure 42 and the first conductive structure 41 are not connected to one another and are kept floating. However, the auxiliary conductive structure 43 may use an addition finger to form a capacitive coupling path to the first conductive structure 41 and the second conductive structure 42 , hence reinforcing the effect of capacitive sensing.
- a first conductive structure 51 farther away from the surface of the substrate 10 is a transparent electrode (equivalent to the second transparent layer 24 in FIG. 2 b and FIG. 2 c ), and includes multiple large-linewidth parallel conducting lines.
- a second conductive structure 52 closer to the surface or even on the surface of the substrate 10 is a metal mesh (equivalent to the first metal mesh layer 21 in FIG. 2 a and FIG. 2 b ).
- an auxiliary conductive structure 53 made of the metal mesh is formed above a gap between adjacent first conductive structures 51 .
- the second conductive structure 52 ad the auxiliary 53 are substantially located on the same plane, and may be formed by the same manufacturing process.
- the auxiliary conductive structure 53 is electrically connected to the second conductive structure 52 but not to the first conductive structure 51 .
- One main purpose of the above connection is increasing an adjacent length between the first conductive structure 52 and the first conductive structure 51 to reinforce the capacitive coupling effect between the first conductive structure 51 and the second conductive structure 52 , thereby reinforcing the effect of capacitive sensing.
- the electrode pattern is based on that in FIG. 4 a , with one difference being that, after the first conductive structure 41 made of a transparent electrode material is formed, a printed metal mesh segment 44 is first formed on the surface of the first conductive structure 41 to reduce the overall resistance of the first conductive structure 41 .
- the remaining parts are identical to the corresponding parts in FIG. 4 a , and shall be omitted herein.
- the electrode pattern is based on that in FIG. 4 b , with one difference being that, after the first conductive structure 51 made of a transparent electrode material is formed, a printed metal mesh segment 54 is first formed on the surface of the first conductive structure 51 to reduce the overall resistance of the first conductive structure 51 .
- the remaining parts are identical to the corresponding parts in FIG. 4 a , and shall be omitted herein.
- an electrode pattern of an auxiliary conductive structure is additionally provided on the fundamental stacked structure in FIG. 2 b .
- the present invention is not limited to these examples.
- the auxiliary conductive structure may also be applied to the stacked structures in FIG. 2 a and FIG. 2 c .
- FIG. 4 e is an electrode pattern developed based on the stacked structure in FIG. 2 c .
- a first conductive structure 61 and a second conductive structure 62 are made of a transparent material, and metal mesh segments 63 and 64 are respectively printed on the first conductive structure 61 and the second conductive structure 62 to reduce the overall resistance of the first conductive structure 61 and the second conductive structure 62 , thereby improving an issue of unsatisfactory conductivity of a conventional double-layer ITO.
- the technical means provided by the embodiments of the present invention are capable of satisfying both requirements of touch sensing and fingerprint sensing using the same capacitive sensing integrated circuit, hence achieving the primary object of the present invention.
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TW104144446A TWI582678B (en) | 2015-12-30 | 2015-12-30 | Capacitive sensing device, fingerprint sensing device and manufacturing method of capacitive sensing device |
TW104144446 | 2015-12-30 | ||
TW104144446A | 2015-12-30 |
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US20170193265A1 US20170193265A1 (en) | 2017-07-06 |
US10268863B2 true US10268863B2 (en) | 2019-04-23 |
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US15/351,692 Active 2037-04-29 US10268863B2 (en) | 2015-12-30 | 2016-11-15 | Capacitive sensing device, fingerprint sensing device and method for manufacturing capacitive sensing device |
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CN109766132A (en) * | 2018-12-27 | 2019-05-17 | 上海乐今通信技术有限公司 | A kind of unlocked by fingerprint speed-optimization device and recognition methods and smart machine |
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CN112107088B (en) * | 2020-09-09 | 2021-12-03 | 武汉华星光电半导体显示技术有限公司 | Induction module and wearable equipment |
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TWI582678B (en) | 2017-05-11 |
US20170193265A1 (en) | 2017-07-06 |
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