TWM616676U - Transceiver receptacle with emi cage and bezel clips that provide high shielding effectiveness - Google Patents

Abstract

A receptacle includes a cage including a bezel opening and through holes and a bezel clip that is attached to the cage at the bezel opening and that includes first bezel fingers and second bezel fingers. The first bezel fingers are located along an inner surface of the cage. The second bezel fingers extend through the through holes such that outer finger portions extend along an outer surface of the cage and inner finger portions extend along the inner surface of the cage. Adjacent second bezel fingers have different lengths.

Description

Transceiver socket with EMI shielding cover and frame clip that can provide high shielding effect

Cross-reference of related applications: This application claims the rights of U.S. Patent Application No. 62/966,371 filed on January 27, 2020, and the entire content of the application is hereby incorporated by reference. In addition, the entire content of US Patent Application No. 16/629,308 filed on January 7, 2020 is hereby incorporated by reference.

This creation is about a transceiver socket with a shielding cover. The transceiver socket includes a frame clip. More specifically, this creation is about transceiver sockets with shielding covers. The transceiver sockets include frame clips with interleaved fingers and/or fingers of different lengths.

Electrical connectors are used to allow electrical devices such as substrates or printed circuit boards (PCBs) to communicate with each other. Various standards and specifications have been proposed and implemented for electrical connectors that transmit high-frequency signals. One example is the four-channel small form-factor pluggable (QSFP), which is a specification for compact, hot-swappable transceivers typically used in data communication systems. The QSFP transceiver socket can accept both electrical and optical transceivers. Recently, a modification to QSFP called a double-density four-channel small form-factor pluggable device (QSFP-DD) has been proposed to include additional contact rows on the transceiver circuit board to increase the bandwidth. Although shields are usually included in transceiver sockets that include QSFP transceiver sockets, electromagnetic interference (EMI) still includes those such as those described above The focus of the electrical connector device of the connector.

For example, in a device including a QSFP transceiver socket, a physical opening is provided in the device. The physical opening weakens the overall shielding effect of the device, and at the same time allows EMI from an external device to affect the operation of the device and allows The EMI of the device affects the operation of the external device. In addition, the problems of EMI emitted from the device and EMI emitted from the device can occur when the transceiver socket is empty and when a transceiver is inserted in the transceiver socket.

To overcome the problems described above, the embodiments of the present invention provide transceiver sockets each including a frame including interlaced fingers and/or fingers of different lengths to significantly improve EMI performance.

According to the embodiment of the present invention, a socket includes: a shielding cover, which includes a frame opening and a plurality of through holes; and a frame clip, which is attached to the shielding cover at the frame opening and includes a first frame finger and a first frame finger Two-frame finger-shaped pieces. The first frame fingers are positioned along an inner surface of the shielding cover, and the second frame fingers extend through the through holes, so that the outer fingers of the second frame fingers are partially along the The outer surface of the shielding cover extends, and the inner finger part of the second frame fingers extends along the inner surface of the shielding cover. The fingers adjacent to the second frame have different lengths.

The second frame finger may include a first finger, a second finger, and a third finger; each of the first finger and the third finger may have a first length; And the second finger can have a second length different from the first length. The first finger and the second finger can be positioned next to each other, and the second finger and the third finger can be positioned next to each other.

The second finger may include a curved portion connecting the outer finger part and the inner finger part. The socket may further include a connector that can be mated with the transceiver.

According to the embodiment of the present creation, a shielding cover includes: four walls, which define a frame Openings; and at least three holes in at least one of the four walls, which are arranged in a first row and a second row. The holes in the at least three holes that are adjacent in the circumferential direction along the four walls are in different columns. The first row is a first distance from the frame opening. The second row is a second distance from the frame opening, which is different from the first distance.

According to an embodiment of the invention, a socket includes: a substrate; a connector on the substrate; and a shielding case according to various embodiments of the invention, which is connected to the substrate and surrounds the connector.

The socket may further include a frame clip attached to the shield cover at the frame opening. The frame clip may include a first frame finger and a second frame finger; the first frame fingers can be positioned along the inner surface of the shielding cover; and the second frame fingers can extend through At least three holes on at least one of the four walls make the outer finger part of the second frame fingers extend along the outer surface of the shielding cover, and the second frame fingers The inner finger part extends along the inner surface of the shield. The adjacent ones of the second frame fingers can have different lengths. The second frame fingers may include a first finger, a second finger, and a third finger; each of the first finger and the third finger may have a first Length; and the second finger may have a second length different from the first length. The first finger and the second finger can be positioned next to each other; and the second finger and the third finger can be positioned next to each other. The second frame fingers may include curved parts connecting the outer finger part and the inner finger part. The bent portions adjacent to the second frame fingers may be at different positions along the length of the second frame fingers.

According to the embodiment of the present invention, a socket includes: a shielding cover, which includes a frame opening and a plurality of through holes; and a frame clip, which is attached to the shielding cover at the frame opening and includes a first frame finger and a first frame finger Two-frame finger-shaped pieces. The first frame fingers are positioned along the inner surface of the shielding cover. The second frame fingers include curved parts that connect the outer finger part and the inner finger part and allow the second frame fingers to extend through the through holes, so that the outer fingers The shaped part extends along the outer surface of the shielding cover, and the inner finger part extends along the inner surface of the shielding cover. Adjacent to the second border The curved portions of the fingers are at different positions along the length of the second frame fingers.

The second frame finger may include a first finger, a second finger, and a third finger; each of the first finger and the third finger may have a first length; And the second finger can have a second length different from the first length. The first finger and the second finger can be positioned next to each other; and the second finger and the third finger can be positioned next to each other.

The fingers adjacent to the second frame may have different lengths. The socket may further include a connector that can be mated with the transceiver.

According to the embodiment of the present invention, a frame clip includes a first frame finger and a second frame finger, wherein the first frame fingers have the same or substantially the same length and are adjacent to the second frame finger Have different lengths, and each of the second frame fingers is longer than each of the first frame fingers.

According to the embodiment of the present invention, a frame clip includes a first frame finger and a second frame finger, wherein the first frame fingers have the same or substantially the same length and are adjacent to the second frame finger It includes curved portions located at different lengths along the length of the second frame fingers, and each of the second frame fingers is longer than each of the first frame fingers.

With reference to the accompanying drawings, the above and other features, elements, characteristics, steps and advantages of this creation will become more apparent from the following detailed description of the implementation of this creation.

10: Transceiver socket

14: Shield

15: frame opening

16: radiator opening/rear opening

19: Through hole

19a: The first column of through holes

19b: Second column of through holes

20: Hole/Through Hole

21: radiator/spring

22: Keep the latch

23: spring

31: Frame clip

32: The first finger

33: second finger

33a: Outer finger part

33b: Inner finger part

34: Notch

60: Connector

61: Mount the base board

62: Cable

100: device

101: chassis ground

110: main substrate

[Figure 1] A three-dimensional view of the shielding cover with frame clips.

[Fig. 2] is a close-up perspective view of the shielding cover of Fig. 1.

[Fig. 3] and [Fig. 4] are close-up cross-sectional views of the shield cover of Fig. 1.

[Figure 5] A schematic diagram showing the transceiver socket included in the device.

[Figure 6] is a perspective view of the shielding cover of Figure 1 without frame clips.

[Fig. 7] and [Fig. 8] are perspective views of the frame clip of Fig. 1.

[Figure 9] is a perspective view of a shielding cover with frame clips with an alternative structure.

[Figure 10] Shows a connector that can be used with the shielding cover of Figure 1.

FIG. 5 is a schematic diagram showing the transceiver socket 10 included in the device 100. The transceiver socket 10 includes a shielding cover 14 that provides EMI shielding for the device 100 and for external devices (not shown in FIG. 5). Although not shown in FIG. 5, the transceiver socket 10 includes a connector (not shown in FIG. 5), which may be, for example, a double-density (DD) connector, such as a double-density four-channel small form-factor pluggable (QSFP-DD). )Connector. The connector provides an electrical or optical connection with the transceiver (not shown in FIG. 5) when the transceiver is inserted into the transceiver socket 10. FIG. 10 shows an example of a connector 60 that can be used with the shield cover 14 of FIG. 1 to define the transceiver socket 10. The transceiver can be inserted into the connector 60. The connector 60 provides a mechanical connection for fixing the transceiver to the mounting substrate 61 and provides an electrical connection between the transceiver and the mounting substrate 61. Any suitable substrate can be used to mount the substrate 61, including, for example, a PCB. The connector 60 may include electrical contacts, and may be directly connected and fixed to the mounting substrate 61. The connector 60 may include a cable 62 which may be a high-speed and/or low-speed cable. The connector 60 may be connected to the mounting substrate 61. The end of the cable 62 not shown in FIG. 10 can be connected to the mounting substrate 61 or any other suitable device. For example, the cable 62 may allow signal transmission without having to be transmitted via the mounting substrate 61, or may allow the signal to be transmitted only a short distance via the mounting substrate 61. The connector 60 can be mounted to the mounting substrate 61 in a floating configuration, so that the connector 60 floats or moves relative to the mounting substrate 61. Although not shown, a thermal path may be provided for the connector 60.

The transceiver socket 10 can be installed on the main substrate 110. The main substrate 110 can be any suitable substrate, including PCB. As shown in FIG. 5, the shield 14 is grounded to the chassis ground 101 of the device 100, and the transceiver socket 10 includes a bezel opening 15 for receiving electrical components such as a transceiver. Frame opening 15 in the device 100 provides openings that are susceptible to both receiving and transmitting EMI. Figure 5 shows an example in which the transceiver socket 10 is not mated with the transceiver, and the device 100 generates EMI internally ("Harsh Environment" in Figure 5), which is shielded from the outside of the device ("Quiet Environment" in Figure 5) environment"). As a more specific example, if the device 100 has a high internal energy level that generates a large amount of EMI, the shield 14 may have, for example, a high shielding effect to meet electromagnetic compatibility (EMC) standards or regulations. The EMC compliance can be changed, for example, according to the specific application program of the device 100 or the surrounding environment. The shielding effect of the shield 14 is determined by the amount of EMI power transferred between the inside of the device 100 and the external environment.

FIGS. 1-3 show the shield cover 14 with the frame clip 31, and FIG. 6 shows the shield cover 14 without the frame clip 31. The shield 14 includes four walls defining a frame opening 15 through which a transceiver can be inserted, and a frame clip 31 can be attached to the frame opening. Although the shield 14 shown in FIGS. 1-3 and 6 can accommodate a single transceiver, the shield 14 can be modified to accommodate more than one transceiver. The shield cover 14 includes through holes 19 in the wall of the shield cover 14, and the through holes receive the frame clip 31. The through holes 19 can be staggered and can be arranged in a first row 19a and a second row 19b along the circumferential direction, which is a direction perpendicular or substantially perpendicular to the insertion direction of the transceiver along the four walls of the shielding cover 14, as shown in the figure Shown in 1-3 and Figure 6. The adjacent through holes 19 may be included in different first rows 19a or second rows 19b in the circumferential direction.

As shown in FIG. 6, the through holes 19 may have different sizes or areas. For example, adjacent through holes 19 may have different sizes or areas, or every other through hole 19 may have different sizes or areas. The through holes 19 may be configured as a first linear array or a first row 19a of through holes 19. The through holes 19 may be configured as a second linear array or a second row 19b of through holes 19. The first linear array of holes or the continuous through holes 19 in the first row 19a may have different areas, for example, the first through hole 19 has a first area and the second continuous through hole 19 has a second area, wherein the second area Larger than the first area. The second area can be at most twice as large as the first area in value. The second linear array of holes or the continuous through holes 19 in the second row 19b may have different areas. For example, the first through hole 19 has a first area and the second continuous through hole 19 has a second area, wherein the second area is larger than The first area. The first row 19a and the second row 19b can be directly adjacent to each other, and can be parallel or substantially parallel to each other. Bit. The first row 19a may include a first pattern of through holes 19, and the second row 19b may include a second pattern of through holes 19 that are inverted with respect to the first pattern. For example, the first row 19a may include small, large, small, and large hole patterns, and the second row 19b may include large, small, large, and small hole patterns. The first row 19a and the second row 19b may be staggered so that none of the through holes 19 in the first row 19a is aligned with the through holes 19 in the second row 19b in the transceiver insertion direction. Each of the first row 19a and the second row 19b may include at least one, at least two, at least three, or at least four through holes 19 next to each other in sequence. Each of the first row 19a and the second row 19b may include three continuous through holes 19 along the first row 19a and the second row 19b, wherein two of the through holes 19 have the same size or area, The third through holes 19 have different sizes or areas. The third linear array of holes 20 may be spaced apart from the first linear array of through holes 19 in the first row 19a and extend parallel or substantially parallel thereto. The third linear array of through holes 20 may be spaced apart from the second linear array of through holes 19 or the second row 19b and extend parallel or substantially parallel thereto.

Any number of through holes 19 and any number of rows of through holes 19 can be included in the shield 14. The shielding cover 14 may also include radiator openings 16, when the transceiver is inserted into the shielding cover 14, the radiator 21 can be connected to the transceiver through the radiator openings. Although FIG. 1 shows two heat sink openings 16, the shield cover 14 may include any number of heat sink openings 16, including no heat sink openings.

As shown in FIG. 6, the shielding cover 14 may include a third linear array of through holes 20 that engage with the notches 34 of the frame clip 31. The through holes 20 may be arranged in a single row 20a along the circumferential direction.

The shielding cover 14 can be made of any suitable conductive material, and can be manufactured by any suitable method. For example, the shield 14 may be made of stamped metal. Although not shown in FIGS. 1-3, the shielding cover 14 can be mounted on any suitable substrate, including, for example, a PCB. The shielding cover 14 can be mounted to the substrate by press-fit connectors (as shown in FIG. 9), through holes (as shown in FIGS. 1, 2 and 6) or surface mount technology.

FIGS. 1 and 2 show that two frame clips 31 are arranged side by side on each of the top wall and the bottom wall of the shield cover 14, and one frame clip 31 is arranged on each of the side walls of the shield cover 14. Depending on the shape of the shield 14, each side of the shield 14 may include a different number of frame clips 31. For example, If the shielding case 14 includes two transceivers, four frame clips can be arranged along each of the top wall and the bottom wall of the shielding case 14. Each frame clip 31 includes a first finger 32 and a second finger 33. Each first finger 32 may include a corresponding first free end that is not physically connected to a second free end adjacent to the second finger 33. Each of the first finger 32 and the second finger 33 can be suspended from a corresponding second end of the respective first finger 32 or the respective second finger 33. The second finger 33 includes an outer finger part 33a and an inner finger part 33b. The first finger 32 extends along the inner surface of the shield cover 14. The second finger 33 extends into the through hole 19 in the shielding case 14, wherein the outer finger part 33a extends along the outer surface of the shielding case 14, and the inner finger part 33b extends along the inner surface of the shielding case 14. extend. The number of first fingers 32 and the number of second fingers 33 may be at least three. For example, FIGS. 1-3 show that the number of the first finger 32 and the second finger 33 of each frame clip 31 is four, but it can include any suitable number of the first finger 32 and the second finger.形件33.

In FIGS. 1-3, the frame clip 31 provided on each of the top wall and the bottom wall of the shield cover 14 is substantially the same as the frame clip 31 provided on each of the side walls of the shield cover 14. However, the frame clip 31 may be different. For example, the frame clips 31 used on the top and bottom walls of the shielding cover 14 may have more fingers, so that only one frame clip 31 is provided on the top and bottom walls of the shielding cover 14.

FIG. 9 shows the shielding cover 14 with an alternative structure. The shield cover 14 in FIG. 9 includes a spring 21 and a holding latch 22 that can fix a heat sink such as the heat sink 21 shown in FIG. 5 or the like to the shield cover 14. The spring 21 may be an S-shaped leaf spring as shown in FIG. 9, but may also include other suitable springs and shapes. The retention latch 22 can prevent the radiator from being disengaged from the shield 14. Although the retaining latch 22 is located in the rear opening 16 opposite to the frame opening 15 in FIG. 9, the retaining latch 22 may also be located in the opening 16 closer to the frame opening 15. Although the retention latch 22 is centered relative to the rear opening 16 in FIG. 9, the retention latch 22 may be laterally offset so as not to be centered in the rear opening 16.

The spring 21 may be stamped and formed when the shield cover 14 is manufactured. Therefore, the shield 14 and the spring 21 can define a single body, that is, a single integral structure. Other possible structures of the shielding cover 14 and the spring 21 can also be provided. For example, the shield 14 can be stamped, and then the spring 21 can be subsequently added to the shield 14, wherein each of the springs 21 extends into the opening 16 of the shield cover 14.

Each of the springs 21 may extend from the shield 14 in substantially the same overall direction. As shown in FIG. 9, the shield 14 may include two openings 16, and two springs 21 may extend into each of the openings 16. Figure 9 shows four springs 21, but any number of springs can be used, including, for example, two springs, and any configuration of springs can be used, including, for example, one of the openings 16 has two springs and the other opening 16 does not have two springs. The spring, or each of the openings 16 has a spring. It is also possible to use openings 16 of any suitable number, location, and structure. The heat sink can be slid onto the shield cover 14 in the first direction, and the spring 21 can be engaged with the cavity in the heat sink. Subsequently, except in the direction opposite to the first direction, the spring 21 significantly reduces or prevents the heat sink from moving in the plane defined by the opening 16.

As shown in FIG. 9, the spring 21 extends into the opening 16 of the shield cover 14, and the top end of the spring 21 at the distal end of the spring 21 opposite to the part of the spring 21 attached to the shield cover 14 includes an engagement portion, the The equal joint part is located in the plane defined by the openings 16, wherein the remaining part of the springs 21 is located above the plane defined by the openings 16. As shown in FIG. 9, the springs 21 may generally have an S-shape, wherein the springs 21 are folded back onto themselves, and the joint portion extends from the top of the S-shape downward toward the shield 14. Other suitable shapes and structures can also be provided, including, for example, depending on the size and position of the cavity in the heat sink, the top end and the joint portion of the spring 21 are located above or below the plane defined by the opening 16.

Each spring 21 can be inserted into a corresponding cavity in the heat sink to engage with the heat sink. The spring 21 provides a downward force on the heat sink to bias the heat sink to contact the transceiver when it is inserted into the shield 14. The spring 21 can automatically bias the heat sink relative to the transceiver. The spring 21 allows the radiator to float and travel up and down. The floating radiator moving up and down can accommodate transceivers of different heights. The radiator does not require springs or straps to exert force on the top surface, side surface or back surface of the radiator. The spring 21 on the shield 14 exerts a downward force on the cavity in the heat sink. As shown in FIG. 9, the shielding case 14 may include springs 23 on the bottom that push the floating heat sink upward toward the top of the shielding case 14. The spring 23 on the bottom of the shield 14 may have a spring in the deflection range similar to the spring 21 on the top of the shield 14 This allows the transceiver to align with the opening of the electrical connector in the shield 14 and reduces the asymmetric load force of the transceiver on the connector contacts of the shield.

3 and 4 are close-up cross-sectional views of the shielding cover 14 near the frame opening 15. FIG. 3 is a cross-section of the shield cover 14 in the thickness direction, so that one of the side walls of the shield cover 14 is shown. FIG. 4 is a cross-section of the shield cover 14 in the width direction, so that either the top wall or the bottom wall of the shield cover 14 is shown. 7 and 8 show the frame clip 31 without the shield cover 14.

As shown in FIGS. 3, 4, 7 and 8, the first fingers 32 may each have the same length or substantially the same length within manufacturing tolerances, and the second fingers 32 may have different lengths. For example, the adjacent second fingers 32 may have different lengths. Alternatively, the first finger 32 may have different lengths, and/or the second finger 33 may each have the same length or approximately the same length within manufacturing tolerances, wherein the outer finger portion 33a and the inner finger portion 33a Both 33b have different lengths to accommodate the staggered through holes 19. As shown in FIGS. 1 and 2, the outer finger portion 33a may have different lengths depending on the position of the corresponding through hole 19 through which the second finger 33 extends. As shown in Figure 3, the inner finger portion 33b may have the same length or approximately the same length within manufacturing tolerances. Therefore, the total length of the second finger 33 can be different.

Each of the first finger 32 and the second finger 33 may have a different length and/or width. For example, the adjacent first finger 32 may have different lengths and/or widths, and the adjacent second finger 33 may have different lengths and/or widths. However, all the first fingers 32 and/or all the second fingers 33 may have the same length and/or width. The width of the second finger 33 is provided in a pattern corresponding to the combination of the first pattern and the second pattern of the through hole 19. For example, the width of the second finger 33 may have patterns of small, large, large, and small.

Each of the second fingers 33 includes a bent portion that connects the outer finger portion 33 a and the inner finger portion 33 b and allows the second fingers 33 to extend through the through hole 19. The adjacent fingers of the second finger 33 may have curved portions located at different lengths along the second finger. The patterns of the curved portions of the second finger 33 can be alternated. For example, the curved portion of the second finger 33 can be closer to the frame opening 15 and Alternate between openings 15 farther away from the frame. If there are more than two rows 19a, 19b including through holes 19, more than two positions of the bent portion can be provided. The positions of the curved parts can be staggered so that adjacent curved parts have different positions. The second finger may include three fingers next to each other, in which two curved parts are at the same position, and the other curved part is at a different position.

The second finger 33 is significantly longer than the first finger 32. In addition, the second finger 33 passes through the through hole 19 in the shield cover 14, and therefore includes an outer finger part 33a positioned along the outer surface of the shield cover 14 and located between the first finger 32 and the shield cover 14. The inner finger portion 33b on the same inner surface. Although the through hole 19 in the shield 14 can potentially provide a location for EMI emission, it passes through the through hole 19 to define the second finger portion 33b of the second finger 33 and the second finger portion 33a of the outer finger. The finger 33 provides EMI shielding for the through hole 19.

On the left side of FIG. 3, the through holes 19 are included in the second row 19b of the through holes 19, which is farther from the frame opening 15, and on the right side of FIG. 3, the through holes 19 are included in the second row of the through holes 19 In a row 19a, the first row is closest to the frame opening 15. On both the left and right sides of FIG. 4, the through holes 19 are included in the first row 19 a of the through holes 19, and the first row is closest to the frame opening 15. The first finger 32 can extend along the inner surface of the shield 14 to the first row 19 a of the through holes 19, but not to the second row 19 b of the through holes 19. The first fingers 32 extending to the first row 19a can be configured such that when the transceiver is inserted into the shielding cover 14, their first fingers 32 interact with the through holes 19 extending through the first row 19a The second finger 33 touches. The first finger 32 may also be configured such that when the transceiver is inserted into the shielding cover 14, the first finger 32 does not contact the second finger 33.

The fingers of the first finger 32 and the second finger 33 can be physically separated from each other by an air gap on a part of their respective lengths, can only be suspended at one end, and can be physically or physically or at one end. Electrically connected together. The fingers of the first finger 32 and the second finger 33 may only include a respective free end. The frame clip 31 can be fixed to the shield cover 14 by any suitable connection including welding, interference fit connection and the like. The inner finger part 33b may be spaced apart from the frame opening 15 of the shielding cover 14 and be spaced from the first finger 32 Spaced apart, the inner finger parts 33b only physically touch the conductive outer surface of the electrical connector or transceiver, and not physically touch the panel wall of the device 100.

The frame clip 31 can be made of any suitable conductive material, and can be made by any suitable method. For example, the frame clip 31 may be made of stamped metal. The frame clip 31 can be mounted to the shield cover 14 using any suitable method including, for example, a notch 34.

Each of the first finger 32, the outer finger portion 33a of the second finger 33, and the inner finger portion 33b of the second finger 33 may include press-fitting mechanical connections and electrical connections. Raised surfaces (for example, "bumps"). More specifically, the convex surface of the outer finger portion 33a provides a mechanical and electrical connection from the EMI frame to the chassis ground 101 of the device 100 including the transceiver socket 10. When the transceiver is inserted into the shielding cover 14 of the transceiver socket 10, both the first finger 32 and the inner finger portion 33b contact the transceiver. Therefore, due to the additional contact points provided by the inner finger portion 33b, when compared with other known sockets, the total number of frame finger contact points in contact with the transceiver can be increased, for example, about twice. When compared with other known sockets, this increase in the total number of frame finger contact points in contact with the transceiver will also reduce the series impedance of the ground connection of the shield 14 by about 50% or more. A method of reducing undesirable EMI emissions can include by adding physical and electrical contact between the frame clip 31 and the mating connector or transceiver (e.g., physical and electrical contact with the conductive outer surface of the mating connector or transceiver) To reduce the series impedance of the ground connection between the shielding cover 14, the frame clip 31 and the matching connector or transceiver. Another method may include adding physical and electrical contact points between the frame clip 31 of the shield cover 14 and the mating connector or transceiver (e.g., physical and electrical contact with the conductive outer surface of the mating connector or transceiver). Point) to reduce the EMI emission from the shielding cover 14.

In addition, the inner finger portion 33b is located in the interior of the device 100 including the transceiver socket 10, that is, behind the frame opening 15 of the transceiver socket 10 in the direction toward the rear wall of the shield cover 14. Therefore, the EMI generated in the transceiver can be projected from the second finger 33 through the through hole 19 of the shield cover 14 to the convex surface of the outer finger part 33a and the casing of the device 100 through a short electrical path. Between ground 101 Ground connection. In addition, since the ground path starts at the finger portion 33b inside the device 100, instead of starting in the frame opening 15 outside the device 100, the transceiver socket 10 with the frame clip 31 is empty in the transceiver socket 10 When the transceiver socket 10 and the transceiver cooperate with each other, the EMI emission can be significantly reduced. In other words, one method involves shortening the undesirable EMI field generated by the transceiver or other matching electrical connector before the EMI field reaches the opening in the finger portion 33a outside the receiving frame clip 31 or in the panel of the first finger 32 Connect to ground. In addition, when the transceiver socket 10 is mated with the transceiver, the increased number of contact points between the first finger 32 and the second finger 33 and the transceiver significantly improves the heat dissipation of the connector 60, which also helps Reduce EMI emission. One method may include increasing the number of contact points between the first finger 32 and the second finger 33 of the frame clip 31 and a heat source such as a transceiver or other mating connector to dissipate the connector.

When compared with the prior art, the transceiver socket 10 shown in FIG. 5 provides significantly improved shielding performance in the frequency range of about 8GHz to about 14GHz, and when compared with the noise floor, the transceiver socket Provides a better shielding effect in the frequency range of about 4GHz to about 14GHz.

As described above, when the transceiver is inserted into the shield cover 14 of the transceiver socket 10, both the first finger 32 and the inner finger portion 33b contact the transceiver, thereby providing multiple ground paths to reduce The series impedance of the ground connection between the shielding case 14, the frame clip 31 and the matching connector or transceiver. Therefore, the transceiver socket 10 shown in FIG. 5 provides a shielding effect that is very close to the noise floor in the frequency band of about 500 MHz to about 4 GHz and in the frequency band of about 14 GHz to about 20 GHz. Shielding effectiveness or shielding effect refers to the mitigation of power transmission of common mode energy. In addition, the shielding effectiveness in the aforementioned frequency bands can be further improved, for example, by including a pre-amplifier. In general, the transceiver socket 10 shown in FIG. 5 can increase the dynamic range by approximately 10 dB, which can then be further increased to approximately 35 dB to approximately 45 dB when the pre-amplifier is implemented and automatic acquisition.

The transceiver socket 10 of the embodiment of the invention, and more specifically the shield cover 14 and the frame clip 31, can provide a constant shielding effect even after the heat sink is removed and replaced four times. Therefore, in addition to providing a higher shielding effect, the transceiver socket according to the embodiment of the invention is also durable and Rely on.

It should be understood that the foregoing description only illustrates this creation. Without departing from this creation, various alternatives and modifications can be designed by those with ordinary knowledge in the field. Therefore, this creation intends to cover all such alternatives, modifications and changes that fall within the scope of the attached patent application.

14: Shield

15: frame opening

16: radiator opening/rear opening

31: Frame clip

32: The first finger

33a: Outer finger part

Claims (21)

A socket, comprising: a shielding cover, which includes a frame opening and a plurality of through holes; and a frame clip, which is attached to the shielding cover at the frame opening and includes a first frame finger and a second frame Fingers; wherein the first frame fingers are positioned along an inner surface of the shielding cover; the second frame fingers extend through the through holes, so that the second frame fingers outside The finger part extends along an outer surface of the shielding cover, and the inner finger part of the second frame fingers extends along the inner surface of the shielding cover; and the adjacent second frame fingers have different length. Such as the socket of claim 1, wherein the second frame fingers include a first finger, a second finger, and a third finger; the first finger and the third finger Each of the elements has a first length; and the second finger has a second length that is different from the first length. Such as the socket of claim 2, wherein the first finger and the second finger are located next to each other; and the second finger and the third finger are located next to each other. Such as the socket of claim 1, wherein the second frame fingers include curved parts connecting the outer finger parts and the inner finger parts. For example, the socket of any one of claims 1 to 4, which further includes a connector that can be matched with a transceiver. A shielding cover comprising: four walls defining a frame opening; and at least three holes in at least one of the four walls, which are arranged in a first row and a second row; wherein the at least three The holes that are adjacent to each other along the four walls in a circumferential direction among the holes are in different rows; The first row is a first distance from the frame opening; and the second row is a second distance from the frame opening, which is different from the first distance. A socket includes: a substrate: a connector on the substrate; and the shielding cover as in claim 6, which is connected to the substrate and surrounds the connector. Such as the socket of claim 7, which further includes a frame clip attached to the shielding cover at the frame opening. Such as the socket of claim 8, wherein the frame clip includes a first frame finger and a second frame finger; the first frame fingers are positioned along an inner surface of the shielding cover; and the second frames The fingers extend through the at least three holes on the at least one of the four walls, so that the finger portions outside the second frame fingers extend along an outer surface of the shielding cover, And the inner finger parts of the second frame fingers extend along the inner surface of the shielding cover. Such as the socket of claim 9, wherein adjacent ones of the second frame fingers have different lengths. Such as the socket of claim 9 or 10, wherein the second frame fingers include a first finger, a second finger, and a third finger; the first finger and the third finger Each of the fingers has a first length; and the second finger has a second length that is different from the first length. Such as the socket of claim 11, wherein the first finger and the second finger are located next to each other; and the second finger and the third finger are located next to each other. Such as the socket of claim 9, wherein the second frame fingers include connecting the external The bending part of the finger part and the inner finger parts. Such as the socket of claim 13, wherein the bent portions of the adjacent second frame fingers are at different positions along the length of the second frame fingers. A socket, comprising: a shielding cover, which includes a frame opening and a plurality of through holes; and a frame clip, which is attached to the shielding cover at the frame opening and includes a first frame finger and a second frame Fingers; wherein the first frame fingers are positioned along an inner surface of the shielding cover; the second frame fingers include bent parts, the bent parts connect the outer finger part and the inner finger part Partially and allow the second frame fingers to extend through the through holes, so that the outer fingers partially extend along an outer surface of the shielding cover and the inner fingers partially extend along the inner surface of the shielding cover The surface extends; and the bent portions of the adjacent second frame fingers are at different positions along the length of the second frame fingers. Such as the socket of claim 15, wherein the second frame fingers include a first finger, a second finger, and a third finger; the first finger and the third finger Each of the elements has a first length; and the second finger has a second length that is different from the first length. Such as the socket of claim 16, wherein the first finger and the second finger are located next to each other; and the second finger and the third finger are located next to each other. Such as the socket of claim 15, wherein the adjacent second frame fingers have different lengths. For example, the socket of any one of claims 15 to 18, which further includes a connector that can be mated with a transceiver. A frame clip includes a first frame finger and a second frame finger, wherein the first frame fingers have the same or substantially the same length, and the adjacent second frame fingers have different lengths , And each of the second frame fingers is longer than each of the first frame fingers. A frame clip includes a first frame finger and a second frame finger, wherein the first frame fingers have the same or substantially the same length, and the adjacent second frame fingers include The curved portions at different lengths of the lengths of the second frame fingers, and each of the second frame fingers is longer than each of the first frame fingers.

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