TWM547221U - Contact image sensor and illuminant module - Google Patents

Description

Contact image sensor and light module

The present invention relates to a method or apparatus for reading or recognizing printed or written text or for identifying graphics, and more particularly to a contact image sensor.

A photodiode is a semiconductor component that senses the change in light intensity and produces a corresponding current output depending on the intensity of the received light. In practical applications, one or more photodiodes and a conversion circuit are integrated into a single semiconductor wafer by a semiconductor process to form a photosensitive wafer; wherein the conversion circuit converts the current generated by the photodiode into an analogy Voltage output. The plurality of photosensitive wafers can be arranged in a certain order on a circuit board to achieve the function of capturing an image of an object.

In general, photosensitive wafers are often fabricated in a semiconductor process. In the semiconductor process, the photosensitive wafers 12 can be formed on the wafer 10 shown in FIG. 1, and each of the photosensitive wafers 12 can include one or more photodiodes 14; wherein the wafers 10 are mainly illustrated by FIG. The cylindrical crystal column 1 is formed by cutting along the direction A.

Since the outer shape of the wafer 10 is circular, and the outer shape of the photosensitive wafer 12 is rectangular, as shown in FIG. 2, a plurality of useless widths or lengths which do not conform to the manufacturing requirements of the photosensitive wafer 12 are formed at the periphery of the wafer 10. Region 16, which results in reduced wafer 10 utilization.

The plurality of photosensitive wafers 12 after the cutting is completed may be arranged on a circuit board 18 in a certain order to form a photosensitive array, as shown in FIG. 3, and may cooperate with a light source and a cylindrical lens to form a so-called contact image sensor. .

In general, the length of the photosensitive array in the contact image sensor must exceed the width of the scanned paper to receive the complete image information; however, limited by the size and cost of the wafer, the current common contact type The image sensor mostly splicing the plurality of photosensitive wafers 12 to form a photosensitive array having a length exceeding the width of the scanned paper. For example, A6 paper with a scan width of 105 mm requires 6 photoreceptors to receive the full image.

After the positioning of the photosensitive wafer 12 is completed, a wire bonding process is then used to form a plurality of gold wires 19 between each of the photosensitive wafers 12 and the circuit board 18 to electrically connect the photosensitive wafer 12 to the circuit board 18; . As the number of photosensitive wafers 12 increases, the number of gold wires 19 that are bridged between the photosensitive wafer 12 and the circuit board 18 increases, and the manufacturing cost of the contact image sensor increases.

Moreover, as shown in FIG. 3, there is generally a gap G between adjacent two photosensitive wafers 12 to avoid touching the photodiode 12 adjacent to the edge of the photosensitive wafer 12 while positioning the photosensitive wafer 12 on the circuit board 18. The body 14 causes the photodiode 14 to be damaged. However, the gap G may also cause lines or abnormalities in the image generated by the contact image sensor, thereby affecting the image quality. In the past, a workstation was added to the production line to detect the gap G between the photosensitive wafers 12 to ensure that the image quality of the contact image sensor can fall within the safety specifications; but this increases the manufacturing process and costs. .

Also, a similar problem occurs in the exposure light source of the printer for exposing the photosensitive drum. More specifically, the exposure light source generally used for exposing the photosensitive drum is mainly realized by splicing a plurality of light-emitting wafers, so that the utilization ratio of the wafer is lowered, the manufacturing cost is increased, and the like; the gap between adjacent two light-emitting wafers causes a spot. The production, affecting the quality of exposure.

According to the present invention, a contact image sensor is provided for capturing an image of an object; the contact image sensor comprises a body, a light source module, a light sensing chip and an imaging module. The base body comprises a receiving slot and a through slot, and the object is located on one side of the base body; the light source module is disposed in the receiving slot for generating a line of light to illuminate the object, and the photosensitive wafer is located on the other side of the base body and receives The object reflects linear light to produce one of the image light; the imaging module is disposed in the through slot and images the image light onto the photosensitive wafer. When the length of the photosensitive wafer is X and the width is Y, the following conditions are satisfied: X/Y ≥ 500.

In one embodiment of the present invention, when the length of the photosensitive wafer is X, the following conditions are satisfied: X ≥ 105 mm.

In one embodiment of the present invention, when the length of the photosensitive wafer is X and the width of the photosensitive wafer is Y, the following conditions are satisfied: X/Y ≥ 1000.

In one embodiment of the present invention, the length of the photosensitive wafer can be greater than the width of the article.

In one embodiment of the present invention, the contact image sensor further includes a circuit board, a glue material, and a plurality of gold wires. The photosensitive chip is disposed on the circuit board, and the glue material is disposed between the circuit board and the light sensing chip. The photosensitive wafer is fastened to the circuit board; the gold wire is connected between the circuit board and the photosensitive wafer to electrically connect the photosensitive wafer to the circuit board.

In an embodiment of the present invention, the light emitting module may include an engaging member, a light emitting member, a light guiding rod and a light reflecting member; the light emitting member is disposed on one side of the joint member, and the light guiding rod is disposed on the other side of the joint member And receiving the light emitted by the illuminating member, the light guiding rod has a light emitting surface, the linear light illuminates the object through the light emitting surface; the light reflecting member partially covers the light guiding rod, and the light emitting surface is exposed outside the reflecting member.

In one embodiment of the present invention, the photosensitive wafer may comprise a plurality of photodiodes having a width equal to the width of the photodiode.

In one embodiment of the present invention, the photosensitive wafer may be formed on a rectangular wafer cut along a length direction of one of the rectangular crystal columns, and one of the photosensitive wafers has a longitudinal direction parallel to the longitudinal direction of the rectangular crystal column.

In one embodiment of the present invention, the length of the photosensitive wafer can be greater than the width of the article.

The contact image sensor of the present invention includes only a single photosensitive wafer, thereby reducing the manufacturing process, the manufacturing cost, and improving the image quality.

The present invention further provides a light emitting module for emitting a light toward an object. The illuminating module comprises a body and an illuminating chip. The illuminating chip is disposed on one side of the pedestal and generates light to illuminate the object. When the length of the illuminating chip is X and the width of the illuminating chip is Y, the following conditions are met: X/Y ≥ 500.

In one embodiment of the present invention, when the length of the light-emitting wafer is X and the width of the light-emitting wafer is Y, the following conditions can be satisfied: X/Y ≥ 1000.

In one embodiment of the present invention, the illuminating wafer may comprise a plurality of illuminating diodes having a width equal to the width of the illuminating diode.

In an embodiment of the present invention, the light-emitting module further includes an imaging module mounted in the body and located between the object and the light-emitting chip to project light to a specific position of the object.

In one embodiment of the present invention, the light-emitting module further includes a circuit board, a glue material and a plurality of gold wires. The light-emitting chip is disposed on the circuit board, and the glue material is disposed between the circuit board and the light-emitting chip to emit light. The wafer is fastened to the circuit board, and the gold wire is connected between the circuit board and the light emitting chip to electrically connect the light emitting chip to the circuit board.

The light-emitting module of the present invention only includes a single light-emitting chip, and in addition to reducing the manufacturing process and manufacturing cost, the generation of unnecessary light spots can be avoided.

Please refer to FIG. 4 and FIG. 5 , which are respectively an exploded perspective view and a cross-sectional view of the contact image sensor according to the present invention. The contact image sensor 2 is used to capture an image of a (planar) object and convert the optical image of the object into an analog or digital electronic signal for storage and transmission. The contact image sensor 2 includes a body 20, a light source module 22, an imaging module 24, and a photosensitive module 26.

The base 20 includes a top surface 200, a bottom surface 202 opposite to the top surface 200, a receiving groove 204, and a through groove 206. The bottom surface 202 is substantially parallel to the top surface 200. The accommodating groove 204 is formed on the top surface 200 and is recessed toward the bottom surface 202. The through groove 206 is a slot structure penetrating the top surface 200 and the bottom surface 202. The body 20 can be fabricated using injection molding or molding techniques using plastic or other polymeric materials. The body 20 can be black or other non-reflective dark material process to avoid reflection of the optical image produced by the object reflection by the body 20 to affect the imaging contrast.

The light source module 22 is mounted in the accommodating groove 204 and generates a linear light to illuminate the object. The light source module 22 includes an engaging member 220, at least one illuminating member 222, a light guiding rod 224 and a reflecting member 226. The illuminating member 222 is disposed on one side of the fixing base 220. The light guiding rod 224 is disposed on the other side of the fixing base 220 and receives the light emitted by the illuminating member 222.

The joint 220 is used to fasten the illuminating member 222 and the light guiding rod 224 to achieve the positioning effect of the illuminating member 222 and the light guiding rod 224, so that the light emitted by the illuminating member 222 can enter the light guiding rod 224. The illuminating member 222 can be a light emitting diode or a small bulb and can be used to generate white light. The light guiding rod 224 can transmit light and include a light emitting surface 2240; the light emitted by the light emitting member 222 and entering the light guiding rod 224 is emitted by the light emitting surface 2240 and transmitted to the object. The light guiding rod 224 is used to convert the point light source generated by the light emitting member 222 into a linear light shape.

The light reflecting member 226 partially covers the light guiding rod 224, and the light emitting surface 2240 is exposed outside the reflecting member 226. The reflector 226 is made of a material having a reflective effect such as white or silver to reflect light that is not emitted by the light-emitting surface 2240 of the light guiding rod 224, thereby improving the efficiency of light use.

The imaging module 24 is disposed in the through slot 206 for imaging an image of an object located on one side of the base 20 on the photosensitive module 26 located on the other side of the base 20; the imaging module 24 may include, for example, along A plurality of refractive index progressive lenses 240 arranged in a predetermined direction D.

The photosensitive module 26 is configured to receive the image light generated by the object reflecting the linear light and passing through the imaging module 24; the photosensitive module 26 includes a circuit board 260 and a photosensitive wafer 262. Circuit board 260 can be, for example, but not limited to, a printed circuit board. The photosensitive wafer 262 is disposed on the circuit board 260 and electrically connected to the circuit board 260. The photosensitive wafer 262 may be first fixed on the circuit board 260 with a glue 264, and then formed by a wire bonding process to bridge the photosensitive wafer 262. The solder pads 2620 and the pads 2600 of the circuit board 260 are connected by a plurality of gold wires 266 (shown in FIG. 3) to electrically connect the photosensitive wafer 262 to the circuit board 260. The photosensitive wafer 262 may be disposed corresponding to the imaging module 24, and the photosensitive wafer 262 may be a charge coupled device, a complementary metal oxide semiconductor, or other component having photoelectric conversion characteristics; each photosensitive wafer 262 includes one or more photodiodes body. In the present invention, the contact image sensor 2 includes only one photosensitive wafer 262, so that the wire bonding process and the wire bonding time can be simplified, the manufacturing cost can be reduced, and the image quality can be improved because the photosensitive wafer 262 is not required to be spliced.

Secondly, in order to completely receive the image information of the object, the length of the photosensitive wafer 262 must exceed the width of the object; and as shown in FIG. 6, when the length of the photosensitive wafer 262 is X, when it is used for scanning width of 105 mm (6) A6 paper with the following conditions: X ≥ 105 mm.

In other words, when the photosensitive wafer 262 is used to scan A6 paper having a width of 105 mm, the length of the photosensitive wafer 262 is not less than 105 mm in order to completely receive the image of the paper.

Next, when the length of the photosensitive wafer 262 is X and the width is Y, the following conditions are satisfied: X/Y ≥ 500.

The photosensitive wafer 262 can also be used to intercept image information of a larger-sized object; when the length of the photosensitive wafer 262 is X and the width is Y, the following conditions can be satisfied: X/Y ≥ 1000.

In order to manufacture a photosensitive wafer 262 having a length and a width in accordance with the foregoing conditions, the photosensitive wafer 262 of the present invention must be formed on the rectangular wafer 30 illustrated in FIG. A plurality of photosensitive wafers 262 may be formed on the rectangular wafer 30, and each of the photosensitive wafers 262 may include one or more photodiodes 2622 and a conversion circuit (not shown); wherein the photodiode 2622 can sense light. The strong and weak changes, and the corresponding current output is generated according to the intensity of the received light, and the conversion circuit is used to convert the current generated by the photodiode into an analog voltage output.

The elongated wafer 30 can be cut from the rectangular crystal pillar 32 illustrated in FIG. 8 along the direction B, and the direction B is the longitudinal direction of the rectangular crystal pillar 32. In this way, in addition to saving time and reducing equipment wear, and because the photosensitive wafer 262 of the present invention is not spliced, there is no gap, and no additional workstation can be used for inspection, thereby increasing manufacturing efficiency.

Please refer to FIG. 9 and FIG. 10 , which are respectively a cross-sectional view and a top view of a light emitting module according to the present invention. The light module 4 includes a body 40, a light unit 42 and an imaging module 44. The base 40 includes a top surface 400, a bottom surface 402 opposite to the top surface 400, and a through slot 406. The bottom surface 402 is substantially parallel to the top surface 400. The through slot 406 is a slot structure extending through the top surface 400 and the bottom surface 402.

The light emitting unit 42 includes a circuit board 420 and a light emitting chip 422. Circuit board 420 can be, for example, but not limited to, a printed circuit board. The light-emitting chip 422 is disposed on the circuit board 420 and electrically connected to the circuit board 420. The light-emitting chip 422 can be first fixed on the circuit board 420 with a glue 424, and then formed in a wire bonding process to be connected to the light-emitting chip 422. A plurality of gold wires 426 (shown in FIG. 10) between the pads 4220 and the pads 4200 of the circuit board 420 are used to electrically connect the light-emitting chip 422 to the circuit board 420. Each of the light emitting wafers 422 includes one or more light emitting diodes 4222. In the present invention, the light-emitting module 40 only includes a light-emitting chip 422, which simplifies the wire-bonding process and wire-bonding time, reduces the manufacturing cost, and eliminates the need for the splicing of the light-emitting chip 422, thereby avoiding the occurrence of light spots and achieving high uniformity of light emission. Degree effect.

In the present creation, when the length of the light-emitting wafer 422 is X and the width is Y, the following conditions are satisfied: X/Y ≥ 500.

The light-emitting wafer 422 can also be used to provide a larger illumination area; here, when the length of the light-emitting wafer 422 is X and the width is Y, the following conditions can be satisfied: X/Y ≥ 1000.

In order to fabricate a light-emitting wafer 422 having a length and a width in accordance with the foregoing conditions, the light-emitting wafer 422 of the present invention must be formed on the rectangular wafer 50 illustrated in FIG. The rectangular wafer 50 can be cut along the direction B by the rectangular crystal pillar 52 illustrated in FIG. 12, and the direction B is the length direction of the rectangular crystal pillar 52.

A plurality of light emitting wafers 422 may be formed on the rectangular wafer 50, and each of the light emitting wafers 422 may include one or more light emitting diodes 4222. The light-emitting chip 422 may also be covered with a wavelength conversion layer (not shown) to achieve the effect of changing the color of light. For example, when the light emitting module 4 is configured to generate white light, the light emitting chip 422 can generate blue light, and the wavelength converting layer absorbs blue light generated by the light emitting chip to generate yellow light.

It should be noted that the light-emitting unit 42 can be used to replace the light source module 22 to provide a linear light required for sensing the object of the contact image sensor 2 shown in FIG. 4; The contact image sensor 2 does not need to use a high-priced and difficult-to-manufacture light guide rod to provide a linear light source, thereby achieving cost reduction and manufacturing.

Referring to FIG. 9 and FIG. 10, the imaging module 44 is disposed in the through slot 406 for projecting light on one side of the base 40 onto an object (such as a photosensitive drum) on the other side of the base 40; The module 44 can, for example, comprise a plurality of refractive index progressive lenses (not labeled) arranged along a predetermined direction D, such as to cause light generated by the light-emitting wafer 422 to be projected to a particular location of the object to expose the object.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any person skilled in the art can make various changes and refinements without departing from the spirit and scope of the present creation. The scope is subject to the definition of the scope of the patent application.

1‧‧‧ crystal column

10‧‧‧ wafer

12, 262‧‧‧Photosensitive wafer

14‧‧‧Photoelectric diode

16‧‧‧Useless area

18, 260, 420‧‧‧ circuit boards

19,266, 426‧‧ gold thread

2‧‧‧Contact Image Sensor

20, 40‧‧‧ body

200, 400‧‧‧ top

202, 402‧‧‧ bottom

204‧‧‧ accommodating slots

206, 406‧‧‧through slot

22‧‧‧Light source module

220‧‧‧Joint parts

222‧‧‧Lighting parts

224‧‧‧Light guide rod

2240‧‧‧Glossy surface

226‧‧‧Reflecting parts

24, 44‧‧‧ imaging module

240‧‧‧ Index of Refractive Index Lens

26‧‧‧Photosensitive module

2600, 2620, 4200, 4220‧‧‧ solder pads

2622‧‧‧Photoelectric diode

264, 424‧‧‧ glue

30, 50‧‧‧ Rectangular wafer

32, 52‧‧‧ Rectangular crystal column

4‧‧‧Light source module

42‧‧‧Lighting module

422‧‧‧Lighting chip

4222‧‧‧Lighting diode A, B cutting direction

D‧‧‧Predetermined direction

G‧‧‧ gap

1 is a schematic view of a wafer;

2 is a schematic view of a circular crystal column;

3 is a top plan view of a photosensitive wafer and a circuit board;

4 is an exploded perspective view of the contact image sensor according to the present invention;

Figure 5 is a cross-sectional view of the contact image sensor in accordance with the present invention;

6 is a top plan view of an image sensing module according to the present invention;

Figure 7 is a schematic view of a rectangular wafer;

Figure 8 is a schematic view of a rectangular crystal column;

9 is a cross-sectional view of a light emitting module according to the present invention;

10 is a top plan view of a light unit according to the present invention;

Figure 11 is a schematic view of a rectangular wafer;

Figure 12 is a schematic view of a rectangular crystal column.

2‧‧‧Contact Image Sensor

20‧‧‧ body

200‧‧‧ top surface

204‧‧‧ accommodating slots

206‧‧‧through slot

22‧‧‧Light source module

220‧‧‧Joint parts

222‧‧‧Lighting parts

224‧‧‧Light guide rod

226‧‧‧Reflecting parts

24‧‧‧ imaging module

240‧‧‧ Index of Refractive Index Lens

26‧‧‧Photosensitive module

260‧‧‧ circuit board

262‧‧‧Photosensitive wafer

D‧‧‧Predetermined direction

Claims (14)

A contact image sensor for capturing an image of an object, the contact image sensor comprising: a body comprising a receiving slot and a slot, the object being located on one side of the base; a light source module disposed in the accommodating groove for generating a line of light to illuminate the object; a photosensitive wafer on the other side of the body and receiving the object to reflect the linear light to generate an image light; An imaging module is disposed in the through slot and images the image light on the photosensitive wafer; wherein when the length of the photosensitive wafer is X and the width of the photosensitive wafer is Y, the following conditions are satisfied: X/Y ≥ 500. The contact image sensor of claim 1, wherein when the length of the photosensitive wafer is X, the following condition is satisfied: X ≥ 105 mm. The contact image sensor of claim 1 or 2, wherein when the length of the photosensitive wafer is X and the width of the photosensitive wafer is Y, the following condition is satisfied: X/Y ≥ 1000. The contact image sensor of claim 3, further comprising: a circuit board, the photosensitive chip is disposed on the circuit board; a glue material is disposed between the circuit board and the light sensing chip, The photosensitive wafer is fastened to the circuit board; and a plurality of gold wires are connected between the circuit board and the photosensitive wafer to electrically connect the photosensitive wafer to the circuit board. The contact image sensor of claim 4, wherein the light-emitting module comprises: a joint member; a light-emitting member disposed on one side of the joint member; and a light guide rod disposed on the joint member The other side receives the light emitted by the illuminating member, the light guiding rod has a light emitting surface, and a reflecting member partially covers the light guiding rod, and the light emitting surface is exposed outside the reflecting member. The contact image sensor of claim 4, wherein the light emitting module comprises a light emitting chip. When the length of the light emitting chip is X and the width of the light emitting chip is Y, the following conditions are met: X/ Y ≥ 1000. The contact image sensor of claim 6, wherein the photosensitive wafer comprises a plurality of photodiodes having a width equal to a width of the photodiode. The contact image sensor of claim 6, wherein the photosensitive wafer is formed by cutting along a length direction of a rectangular crystal column to form a rectangular wafer, and the length direction of the photosensitive wafer is parallel to the rectangular crystal The length direction of the column. The contact image sensor of claim 8, wherein the length of the photosensitive wafer is greater than the width of the object. a light emitting module for emitting a light toward an object, the light emitting module comprising: a body; and a light emitting chip mounted on one side of the body and generating the light to illuminate the object; wherein, when the light is emitted When the length of the wafer is X and the width of the light-emitting wafer is Y, the following conditions are satisfied: X/Y ≥ 500. The illuminating module of claim 10, wherein when the length of the illuminating wafer is X and the width of the illuminating wafer is Y, the following condition is satisfied: X/Y ≥ 1000. The illuminating module of claim 11, wherein the illuminating chip comprises a plurality of illuminating diodes having a width equal to a width of the illuminating diode. The illuminating module of claim 10 or claim 11, further comprising an imaging module mounted in the housing and located between the object and the illuminating wafer to cause the ray to be projected At a specific location on the object. The lighting module of claim 12, further comprising: a circuit board, the light emitting chip is disposed on the circuit board; a glue material disposed between the circuit board and the light emitting chip to emit the light The wafer is fastened to the circuit board; and a plurality of gold wires are connected between the circuit board and the light emitting chip to electrically connect the light emitting chip to the circuit board.