TWM541120U - Light emitting device - Google Patents

Abstract

A light emitting device includes a carrier, a light emitting chip, and a covering part. The carrier includes a board and a guiding metal layer. The covering part is disposed on the carrier. The carrier includes a board, a guiding metal layer, and a sealing material. The board has a first surface, a second surface opposite to the first surface, and a through vent. The through vent is divided into a first partial hole and a second partial hole. The first partial hole extends from the first surface to the second partial hole, and the second partial hole extends from the second surface to the first partial hole. The guiding metal layer is formed on the second surface and in the second partial hole, and covers the sidewall of the second partial hole. The guiding metal layer extends from the second partial hole to the second surface, and does not cover the sidewall of the first partial hole and the first surface. The sealing material seals the second partial hole, and the guiding metal layer surrounds the sealing material.

Description

Light-emitting element

The present invention relates to a light-emitting element, and more particularly to a light-emitting element having a through vent.

In the current Light Emitting Diode Package (LED Package) with cavity, in order to avoid long-term contact with the outside water vapor and oxygen in the LED die in the cavity In the case of a sinking, the cavity must be closed to seal the light-emitting diode wafer, and the environment within the cavity is a vacuum environment or a noble gas atmosphere. Therefore, the manufacturing method of the existing light-emitting diode package requires the use of a large vacuum chamber to discharge air around the light-emitting diode wafer in a vacuum environment. However, the cost of a large vacuum chamber is quite high, and it takes a considerable amount of time to convert the cavity environment from an atmospheric environment to a proper vacuum environment, so such a light-emitting diode package generally takes more time and Money to make.

The present invention provides a light-emitting element having a venting aperture for venting air within a cavity in which the luminescent wafer is located.

The light-emitting element provided by the present invention comprises a carrier, a light-emitting chip and a cover. The carrier member includes a board, a guiding metal layer, a sealing material, and a wiring layer. The plate body has a first surface, a second surface opposite to the first surface, and a venting through hole, wherein the venting through hole is divided into a first partial hole and a second hole communicating with the first hole . The first aperture extends from the first surface to the second aperture and the second aperture extends from the second surface to the first aperture. a guiding metal layer is formed on the second surface and the second hole and covers the hole wall of the second hole, wherein the guiding metal layer extends from the second hole to the second surface and does not cover the first hole The wall of the hole and the first surface. A sealing material is filled into the second hole and seals the second hole, wherein the guiding metal layer surrounds the sealing material. A wiring layer is formed on the first surface. The luminescent wafer is mounted on the first surface and electrically connected to the wiring layer. The cover body is disposed on the carrier, wherein a cavity is formed between the cover body and the plate body, and the light emitting chip is located in the cavity.

In an embodiment of the present invention, the second hole has a groove and a communication hole. The groove extends from the second surface to the communication hole, and the communication hole extends from the bottom of the groove to the first hole.

In an embodiment of the present invention, the guiding metal layer covers the hole wall of the communication hole and the side wall of the groove.

In an embodiment of the present creation, the sealing material contacts the guiding metal layer.

In an embodiment of the present creation, the sealing material is a metal material.

In an embodiment of the present invention, the cover body has a receiving groove, and the cavity is defined by the receiving groove and the plate body.

In an embodiment of the present creation, the carrier includes a support frame. The support frame protrudes from the first surface and surrounds the light emitting chip, and the support frame is fixed between the plate body and the cover body.

In an embodiment of the present invention, the cover body includes a cover plate and a support frame. The support frame surrounds the light emitting chip and is fixed between the board and the cover.

In an embodiment of the present creation, the cover is transparent.

In an embodiment of the present creation, the cover is opaque.

In an embodiment of the present invention, the light emitting chip is an infrared light source, a visible light source or an ultraviolet light source.

In an embodiment of the present invention, the light-emitting element further includes an inert filling gas. An inert fill gas fills the cavity and is selected from the group consisting of an inert gas and nitrogen.

In an embodiment of the present creation, the environment within the cavity is a vacuum.

Based on the above, the venting through hole can be used to discharge the air in the cavity of the illuminating element, and the sealing material is used to seal the venting through hole to help prevent the illuminating wafer from contacting the outside water and oxygen, thereby protecting the illuminating wafer from being protected. Water and oxygen damage.

In order to make the features and advantages of the present invention more comprehensible, the following embodiments are described in detail with reference to the accompanying drawings.

Referring to FIG. 1 , the light emitting element 100 includes a carrier 110 and a light emitting chip 130 . The carrier 110 can be a circuit board such as a Printed Circuit Board (PCB). Taking FIG. 1 as an example, the carrier 110 includes a plate body 111 and circuit layers 114a and 114b, wherein the material of the plate body 111 may be resin or ceramic. The plate body 111 has a first surface 111a and a second surface 111b opposite to the first surface 111a, and the circuit layers 114a and 114b are formed on the first surface 111a and the second surface 111b, respectively. Thus, in the embodiment shown in FIG. 1, the carrier 110 is a double sided circuit board. However, in other embodiments, the carrier 110 can also be a single sided circuit board or a multilayer circuit board. That is to say, the number of circuit layers included in the carrier 110 may be only one layer or at least three layers.

The light emitting chip 130 may be a light emitting diode chip and has a light emitting surface 131, and the light emitting chip 130 may emit light L1 from the light emitting surface 131. In addition, the light L1 emitted by the light emitting chip 130 may be infrared light (IR), visible light or ultraviolet light (UV). Therefore, the illuminating wafer 130 may be an infrared light source, a visible light source or an ultraviolet light source. The light emitting chip 130 is mounted on the carrier 110. Taking FIG. 1 as an example, the light-emitting chip 130 can be mounted on the first surface 111a of the carrier 110 via wire bonding, and electrically connected to the circuit layer 114a. Of course, the luminescent wafer 130 can also be mounted on the carrier 110 by other means, such as a flip chip. In addition, the carrier 110 may further include one or more conductive pillars 115, and the conductive pillars 115 are located in the board body 111, and connect the circuit layers 114a and 114b so that the two circuit layer layers 114a and 114b can be electrically connected to each other. .

The carrier 110 further includes a guiding metal layer 112, and the plate body 111 further has a venting through hole 111h, wherein the venting through hole 111h extends from the first surface 111a to the second surface 111b, and the guiding metal layer 112 is formed in the second The surface 111b and the partially vented through hole 111h. The vent hole 111h is divided into a first hole H1 and a second hole H2, wherein the second hole H2 is in communication with the first hole H1. The first hole H1 extends from the first surface 111a to the second portion hole H2, and the second portion hole H2 extends from the second surface 111b to the first portion hole H1. The guiding metal layer 112 is formed in the second portion hole H2 and covers the hole wall of the second portion hole H2, but does not cover the hole wall of the first portion hole H1 and the first surface 111a. In other words, the guiding metal layer 112 extends from the inside of the vent through hole 111h to the second surface 111b. It can be seen that the guiding metal layer 112 is formed only on one side of the plate body 111 (ie, the second surface 111b) and one of the venting through holes 111h (ie, the second hole H2).

In the embodiment shown in FIG. 1, the second hole H2 may have a communication hole H21 and a depression H22. The groove H22 extends from the second surface 111b to the communication hole H21, and the communication hole H21 extends from the bottom of the groove H22 to the first hole H1. Therefore, the second hole H2 may be a hole having a constant aperture. The guiding metal layer 112 covers the hole wall of the communication hole H21 and the side wall of the groove H22. Taking FIG. 1 as an example, the guiding metal layer 112 can cover all surfaces of the communication hole H21 and the groove H22 in a comprehensive manner, but does not cover any surface of the first hole H1. Further, the venting through hole 111h may be formed by at least one of mechanical drilling and laser drilling, and the guiding metal layer 112 may be formed by electroless plating or sputtering. The carrier 110 further includes a sealing material 113, and the sealing material 113 may be a metal material such as a solder paste. The sealing material 113 is filled in the partial venting through hole 111h and is used to seal the venting through hole 111h. In detail, the sealing material 113 is filled in the second hole H2 to seal the second hole H2. The sealing material 113 will contact the guiding metal layer 112, and the guiding metal layer 112 will surround the sealing material 113, as shown in FIG. Further, the melting point of the sealing material 113 is higher than the operating temperature of the light-emitting wafer 130. For example, when the illuminating wafer 130 in operation produces an operating temperature of about 150 ° C, the solder paste which can be used as the sealing material 113 has a melting point of about 220 ° C which is higher than the aforementioned operating temperature of 150 ° C. Since the melting point of the sealing material 113 is higher than the operating temperature of the luminescent wafer 130, it is difficult for the thermal energy generated by the illuminating wafer 130 in operation to melt the sealing material 113.

The light emitting device 100 further includes a cover 120 disposed and fixed to the carrier 110. A cavity C1 is formed between the cover 120 and the plate 111, and the illuminating wafer 130 is located in the cavity C1, wherein the venting hole 111h communicates with the cavity C1. In the embodiment shown in FIG. 1, the cover 120 may include a covering plate 121 and a supporting frame 122. The support frame 122 surrounds the light-emitting chip 130 and is fixed between the plate body 111 and the cover plate 121. The method for fixing the support frame 122 between the plate body 111 and the cover plate 121 may be gluing or eutectic bonding ( Eutectic bonding). The cover plate 121 and the support frame 122 define an accommodating groove (not shown in FIG. 1 ), and the cavity C1 is defined by the accommodating groove of the cover 120 and the plate body 111 . Thus, the cavity C1 is formed between the cover 120 and the plate body 111.

In the embodiment shown in Figure 1, the cover plate 121 can be transparent. For example, the cover plate 121 may be made of a transparent material such as glass or polymethylmethacrylate (PMMA, that is, acrylic). Moreover, the cover plate 121 may also have a function of converging or diverging light. Taking FIG. 1 as an example, the cover plate 121 has a convex lens structure and can concentrate the light L1 emitted from the light-emitting chip 130. However, in other embodiments, the cover plate 121 may not have any function of concentrating or diverging light, so the cover plate 121 may also be a glass plate that is flat on both sides. Moreover, although the cover 121 of the embodiment of FIG. 1 is transparent, in other embodiments, the cover 121 may also be opaque.

In the embodiment shown in FIG. 1, the light emitting element 100 may further include an inert fill gas 140 that fills the cavity C1. The inert fill gas 140 is a gas that does not damage the luminescent wafer 130 and is selected from the group consisting of a noble gas and nitrogen. That is, the inert fill gas 140 can be an inert gas or nitrogen. Alternatively, the inert fill gas 140 can comprise an inert gas and nitrogen. Although the vent hole 111h communicates with the cavity C1, the sealing material 113 can seal the vent hole 111h so that the outside water and oxygen do not enter the cavity C1 to keep the cavity C1 in a noble gas atmosphere. An atmosphere of nitrogen gas or nitrogen mixed with an inert gas prevents the luminescent wafer 130 from coming into contact with external moisture and oxygen. As such, the luminescent wafer 130 is not damaged by contact with external moisture and oxygen. In addition, in other embodiments, the environment within the cavity C1 may also be a vacuum, so the cavity C1 may not be filled with any gas.

2A to 2E are schematic cross-sectional views showing a method of manufacturing the light-emitting element of Fig. 1. Referring to FIG. 2A, in the method of fabricating the light-emitting element 100 of the present embodiment, first, a carrier 110 including a guiding metal layer 112 is provided. Next, the luminescent wafer 130 is mounted on the first surface 111a. For example, the light-emitting wafer 130 is mounted on the first surface 111a by wire bonding or flip chip bonding.

Referring to FIG. 2B, after the illuminating wafer 130 is mounted on the first surface 111a, the cover 120 is disposed on the carrier 110 to form a cavity C1 between the cover 120 and the carrier 110, wherein the illuminating chip 130 Located in the cavity C1. There are various methods of arranging the cover 120 on the carrier 110, such as adhesive or eutectic bonding. In addition, the step of disposing the cover 120 on the carrier 110 is performed in an atmospheric environment, which is different from the manufacturing method of the conventional LED package. According to the manufacturing method of the conventional light-emitting diode package, the step of disposing the cover 120 on the carrier 110 is performed under a vacuum environment, so that the manufacturing method of the existing LED package must use a large vacuum chamber. . Therefore, the step of disposing the cover 120 on the carrier 110 can be performed in an atmospheric environment as compared with the prior art, and does not need to be performed in a vacuum environment in a large vacuum chamber.

Next, a filling metal material 113i is formed on the guiding metal layer 112. The filler metal material 113i may be a solder paste, and in a subsequent process, the filler metal material 113i may be melted to become a sealing material 113 that seals the vent hole 111h (see FIG. 2E). However, the filling metal material 113i at this time does not seal the vent hole 111h as shown in Fig. 2B. In addition, when the cover 120 is disposed on the carrier 110 by eutectic bonding, the filler metal material 113i is formed after the cover 120 is disposed on the carrier 110 to avoid filling the metal material during the eutectic bonding process. The 113i blocks the vent hole 111h due to heat fusion.

Referring to FIG. 2C, next, the gas in the cavity C1 is discharged from the vent hole 111h on the second surface 111b. In detail, after the cover 120 is disposed on the carrier 110, the carrier 110 and the cover 120 are placed in a vacuum environment V1 formed by the vacuum chamber 21, wherein the vacuum chamber 21 can be connected to a gang. Pu 22 with a valve 23 (valve). In addition, when the carrier 110 and the cover 120 are placed in the vacuum environment V1, the carrier 110 may be inverted such that the second surface 111b faces upward and the cover 120 faces downward.

The gas valve 23 can be externally connected with at least one gas cylinder (not shown), and the gas cylinder is filled with a noble gas or nitrogen gas. Alternatively, the gas valve 23 may be externally connected to two cylinders, and the two cylinders are respectively filled with an inert gas and nitrogen. The gas valve 23 can control the gas (for example, inert gas or nitrogen gas) in the above gas cylinder to enter the vacuum chamber 21. Further, in FIGS. 2C to 2E, the blackened air valve 23 represents the closed air valve 23, which blocks the gas in the cylinder from entering the vacuum chamber 21. The blank gas valve 23 represents an open gas valve 23 that allows gas within the cylinder to enter the vacuum chamber 21.

The pump 22 is, for example, a rotary vane pump, and the pressure in the vacuum environment V1 is within about 10 ^-3 torr. However, the vacuum chamber 21 can also be additionally connected to another pump, such as a turbo pump, and the pressure in the vacuum environment V1 can be between 10 ^-3 Torr and 10 ^-6 Torr. Since the vent hole 111h communicates with the cavity C1, and the filling metal material 113i does not seal the vent hole 111h, the gas in the cavity C1 is discharged from the vent hole 111h on the second surface 111b into the vacuum environment V1, after which It is discharged into the outside atmosphere by the pump 22 .

Referring to FIG. 2D, after the gas in the cavity C1 is exhausted, then the gas valve 23 is opened, and an inert filling gas 140 is introduced into the vacuum chamber 21 to vent the inert filling gas 140 from the second surface 111b. The hole 111h enters the cavity C1. Referring to FIG. 2D and FIG. 2E, after that, the filling metal material 113i is melted so that the filling metal material 113i flows into the vent hole 111h along the guiding metal layer 112, wherein the filling metal material 113i can utilize thermal conduction or radiation. Heat to melt. For example, the filling metal material 113i may be heated by an electric resistance heater (not shown) installed in the vacuum chamber 21. Alternatively, the filler metal material 113i may be melted by heating with laser or infrared light. Since the filling metal material 113i and the guiding metal layer 112 are both metal, there is strong adhesion between the filling metal material 113i and the guiding metal layer 112, so that the molten filling metal material 113i can follow the guiding metal. Layer 112 flows.

The molten filler metal material 113i can be moved by gravity. For example, in the present embodiment, since the carrier 110 placed in the vacuum environment V1 is in an inverted state, the molten filler metal material 113i can be driven by gravity to flow from the second surface 111b into the vent hole 111h. However, in other embodiments, when the vent hole 111h has a small aperture, the carrier 110 may not need to be inverted, and the molten filler metal material 113i may flow into the vent hole 111h by capillary action.

Referring to FIG. 2E, thereafter, the filling metal material 113i is solidified so that the filling metal material 113i becomes the sealing material 113 sealing the vent hole 111h. So far, the light-emitting element 100 has been substantially completed. Further, since the melting point of the sealing material 113 (which is also equal to the melting point of the filling metal material 113i) is higher than the operating temperature of the light-emitting wafer 130, it is difficult for the heat energy generated by the operating light-emitting wafer 130 to melt the sealing material 113. Therefore, when the light-emitting element 100 operates normally, the sealing material 113 can always seal the vent hole 111h because it is difficult to melt, so that the outside water and oxygen do not contact the illuminating wafer 130 that is emitting light, so that the illuminating wafer 130 can be continuously protected. Not damaged by moisture and oxygen.

In the above, when the filling metal material 113i is solidified, the filling metal material 113i blocks the vent hole 111h, and the inert filling gas 140 is filled and confined in the cavity C1. However, in other embodiments, the environment within the cavity C1 may also be a vacuum, so the step of introducing the inert fill gas 140 into the vacuum chamber 21 as illustrated in FIG. 2D may be omitted. That is, when the filling metal material 113i is solidified, the cavity C1 may not be filled with any gas (for example, the inert filling gas 140), that is, the environment inside the cavity C1 may also be a vacuum.

It is to be noted that although the manufacturing method of the light-emitting element 100 shown in FIGS. 2A to 2E uses the vacuum chamber 21, since the step of disposing the cover 120 on the carrier 110 is performed in an atmospheric environment, the cover 120 is It is not combined with the carrier 110 in a vacuum environment V1. That is to say, the vacuum chamber 21 does not need to have a large accommodation space to move and bond the cover 120 and the carrier 110. Therefore, the internal space of the vacuum chamber 21 is smaller than the internal space of the large vacuum chamber. It can be seen that, compared to the prior art, the manufacturing method of the light-emitting element 100 can use a small or medium-sized vacuum chamber without using a large vacuum chamber.

Please refer to FIG. 3, which illustrates a light-emitting element 200 of another embodiment of the present invention. The light-emitting element 200 shown in the embodiment of Fig. 3 is similar to the light-emitting element 100 shown in the embodiment of Fig. 1. For example, the light-emitting elements 200 and 100 are manufactured in the same manner, and the light-emitting element 200 also includes the carrier 210, the cover 220, and the light-emitting chip 130, wherein the relative positions and connection relationships between the elements are the same as those of the light-emitting element 100. The difference between the light-emitting elements 100 and 200 will be mainly described below. As for the two manufacturing methods and the same technical features, the description will not be repeated in principle, and will not be shown in the drawings.

Different from the cover 120 in the embodiment of FIG. 1, in the embodiment of FIG. 3, the cover 221 and the support frame 222 included in the cover 220 are integrally formed. That is, both the cover 221 and the support frame 222 can be made of the same material and can be made by the same manufacturing process. For example, the cover plate 221 and the support frame 222 can be formed by the same injection molding. Alternatively, the cover 220 may be formed from a sheet of material by chemical etching or machining, wherein the sheet is, for example, a glass sheet or a plastic sheet (for example, an acrylic sheet). Therefore, there is no obvious boundary between the cover 221 and the support frame 222. When the light emitting chip 130 is an infrared light source, the cover 220 may be opaque and may be made of a plastic plate, but the cover 220 can be completely penetrated by the infrared light emitted by the light emitting chip 130. In addition, the cover 120 of FIG. 1 and the cover 220 of FIG. 3 can be replaced with each other, that is, both the covers 120 and 220 can be used for any of the light-emitting elements 100 and 200.

In addition, the carrier 210 shown in FIG. 3 is also different from the carrier 110 shown in FIG. Specifically, in the embodiment of FIG. 3, the carrier 210 includes a plate body 211, and the plate body 211 also has a venting through hole 211h similar to the venting through hole 111h of FIG. 1, but the venting through hole 211h has uniformity. Aperture. That is, the venting through hole 211h does not have the groove H22 as shown in FIG. In addition, it is worth mentioning that in the light-emitting element 100 of FIG. 1, the vent hole 111h may be replaced with the vent hole 211h shown in FIG. That is, the plate body 111 in FIG. 1 may also have a venting through hole 211h as shown in FIG.

Please refer to FIG. 4, which illustrates a light-emitting element 300 of another embodiment of the present invention. The light-emitting element 300 shown in the embodiment of Fig. 4 is similar to the light-emitting element 100 shown in the embodiment of Fig. 1. For example, the light-emitting elements 300 and 100 are manufactured in the same manner, and the light-emitting element 300 also includes the carrier 310, the cover 320, and the light-emitting chip 130, wherein the relative positions and connection relationships between the elements are the same as those of the light-emitting element 100. The differences between the light-emitting elements 100 and 300 will be mainly described below. As for the two manufacturing methods and the same technical features, the description will not be repeated in principle, and will not be shown in the drawings.

The biggest difference between the light-emitting elements 300 and 100 is the carrier 310. Comparing Figures 1 and 4, the shape of the carrier 310 is significantly different from the flat carrier 110 of Figure 1. In detail, the carrier 310 includes a plate body 311 and a support frame 316. The support frame 316 protrudes from the first surface 311 a of the board body 311 and surrounds the light emitting chip 130 , and the support frame 316 is fixed between the board body 311 and the cover body 320 . The plate body 311 and the support frame 316 may be integrally formed, that is, the plate body 311 and the support frame 316 may be composed of the same material, and may be made by the same manufacturing process. For example, the plate body 311 and the support frame 316 may be formed by ceramic sintering. Therefore, there is no obvious boundary between the plate body 311 and the support frame 316. In addition, the carriers 110 and 210 in FIGS. 1 and 3 can be replaced with the carrier 310 in FIG. 3, so the carrier 310 of FIG. 3 can also be used for the light-emitting elements 100 and 200 of FIGS. 1 and 3.

There is another difference between the light-emitting elements 300 and 100, which lies in the cover 320. In detail, the cover 320 is a flat plate that is flat on both sides, which may be transparent. For example, the cover 320 may be a glass plate or an acrylic plate. Of course, as with the cover 220 described in the embodiment of Figure 3, the cover 320 can also be opaque and can be completely penetrated by infrared light. Therefore, the cover 320 is not limited to being transparent. In addition, the cover 320 can also be a lens, such as a convex lens or a concave lens, and the cover plate 121 in FIG. 1 and the cover 320 in FIG. 4 can be replaced with each other, that is, the cover 320 and the cover plate 121 can be used for the light-emitting element 100 and 300 of any.

In summary, the venting through hole can be used to discharge the air in the cavity of the illuminating element, and the sealing material is used to seal the venting through hole, so that the sealing material can not only block the moisture and oxygen from the external environment and through the ventilation. The through hole enters the cavity, and can also keep the cavity in a vacuum environment, or in an inert atmosphere, a nitrogen atmosphere or an atmosphere in which nitrogen and an inert gas are mixed, thereby protecting the light-emitting wafer from moisture and oxygen. Further, the method of manufacturing the light-emitting element of the present embodiment can be carried out in a small or medium-sized vacuum chamber (see FIGS. 2C to 2D) without using a large vacuum chamber. Compared with the prior art, the light-emitting element manufacturing method of the present embodiment has an advantage of low manufacturing cost.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Those skilled in the art to which the present invention pertains may have some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this creation is subject to the definition of the scope of the patent application attached.

21‧‧‧vacuum chamber
22‧‧‧ pump
23‧‧‧ gas valve
100, 200, 300‧‧‧Lighting elements
110, 210, 310‧‧‧ shipments
111, 211, 311‧‧‧ board
111a, 311a‧‧‧ first surface
111b‧‧‧second surface
111h, 211h‧‧‧ venting through hole
112‧‧‧ Guide metal layer
113‧‧‧ Sealing material
113i‧‧‧Filled metal materials
114a, 114b‧‧‧ circuit layer
115‧‧‧conductive column
120, 220, 320‧‧‧ cover
121, 221‧‧ ‧ cover
122, 222, 316‧‧‧ support frame
130‧‧‧Lighting chip
131‧‧‧Glossy surface
140‧‧‧Inert filling gas
C1‧‧‧ cavity
H1‧‧‧ first hole
H2‧‧‧ second hole
H21‧‧‧Connected holes
H22‧‧‧ Groove
L1‧‧‧Light
V1‧‧‧vacuum environment

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a light-emitting element of an embodiment of the present invention. 2A to 2E are schematic cross-sectional views showing a method of manufacturing the light-emitting element of Fig. 1. Fig. 3 is a schematic cross-sectional view showing a light-emitting element of another embodiment of the present invention. Fig. 4 is a schematic cross-sectional view showing a light-emitting element of another embodiment of the present invention.

100‧‧‧Lighting elements

110‧‧‧Ship

111‧‧‧ board

111a‧‧‧ first surface

111b‧‧‧second surface

111h‧‧‧ Vented through hole

112‧‧‧ Guide metal layer

113‧‧‧ Sealing material

114a, 114b‧‧‧ circuit layer

115‧‧‧conductive column

120‧‧‧ cover

121‧‧‧ Cover

122‧‧‧Support frame

130‧‧‧Lighting chip

131‧‧‧Glossy surface

140‧‧‧Inert filling gas

C1‧‧‧ cavity

H1‧‧‧ first hole

H2‧‧‧ second hole

H21‧‧‧Connected holes

H22‧‧‧ Groove

L1‧‧‧Light

Claims (13)

A light-emitting component comprising: a carrier comprising: a plate having a first surface, a second surface opposite the first surface, and a venting aperture, wherein the venting aperture is divided into a first aperture (first a partial hole and a second hole communicating with the first hole, the first hole extending from the first surface to the second hole, and the second hole extending from the second surface to the first a hole; a guiding metal layer formed on the second surface and the second hole and covering the hole wall of the second hole, wherein the guiding metal layer extends from the second hole to The second surface does not cover the hole wall of the first hole and the first surface; a sealing material is filled in the second hole and seals the second hole, wherein the guiding metal layer Surrounding the sealing material; a circuit layer formed on the first surface; and a light-emitting chip mounted on the first surface and electrically connected to the circuit layer; and a cover disposed on the carrier Wherein a cavity is formed between the cover and the plate body, and the light emitting chip is located in the space Inside the cavity. The illuminating element of claim 1, wherein the second hole has a groove and a communication hole extending from the second surface to the communication hole, and the communication hole extends from the bottom of the groove to the The first hole. The illuminating element of claim 2, wherein the guiding metal layer covers a hole wall of the communication hole and a sidewall of the groove. The light-emitting element of claim 1, wherein the sealing material contacts the guiding metal layer. The light-emitting element of claim 1, wherein the sealing material is a metal material. The illuminating element of claim 1, wherein the cover has a receiving groove defined by the receiving groove and the plate. The light-emitting element of claim 1, wherein the carrier comprises a support frame protruding from the first surface and surrounding the light-emitting chip, and the support frame is fixed to the plate body and the cover body between. The light-emitting element of claim 1, wherein the cover comprises: a cover; and a support frame surrounding the light-emitting chip and fixed between the plate and the cover. The illuminating element of claim 8, wherein the cover is transparent. The illuminating element of claim 8, wherein the cover is opaque. The illuminating element of claim 1, wherein the illuminating wafer is an infrared light source, a visible light source or an ultraviolet light source. The light-emitting element according to claim 1, further comprising an inert filling gas filled in the cavity and selected from the group consisting of an inert gas and nitrogen. The illuminating element of claim 1, wherein the environment within the cavity is a vacuum.