M422157M422157
2011/08/23料替換頁2011/08/23 material replacement page
五、新型說明： 【新型所屬之技術領域】 本創作與L Ξ D散熱結構有關，尤指一種構造簡單， 且能迅速導出L ED所產生之熱’避免L E D及其電路板 溫度過高之散熱結構。 【先前技術】 按’發光二極體（LED)因技術發展有成’目前已 廣泛應用於指示燈、背光源及顯示螢幕等等’又因製造L E D之材料亦有所突破，而可應用於照明領域，並以其省 電、體積小之優點取代傳統燈泡°然而L E 〇於使用時會 產生熱能，若不能迅速散熱’則會影響LED的發光效率 及使用壽命。故散熱裝置的設計對於L E D而言是相當重 要的一環。 目前可見之LED散熱裝置設計’乃有如第4圖所示 者以鋁合金板5 0做為基板，上面鋪設有印刷電路及絕緣 馨 材料’在銘合金板5〇上又設有散熱器51，其欲以銘合 金之向導熱性能，將LED 5 2所產生之熱迅速傳導至散 熱器5 ]_而散出。惟鋁合金板5 0雖具有高導熱係數，能 快速將熱導出，但卻會使以鋁合金為製造材料之電路板5 0常時維持高溫，而影響LED52的發光效率；另—方 面’銘合金的成本亦高’若要製作大型L E D燈板，則％ 有成本方面的疑慮。 另有一種L E D散熱設計’如第5圖所示者，乃於以 P C B材料製成之電路板6 0上，對應L E D 6 1之位置 3 M422157 2011/08/23修正替換頁 設有通孔6 2，並於該通孔6 2中設有金屬管6 3，該金 屬管6 3之兩端分別連接至L E D 6 1及散熱器6 4，而 該金屬管6 3内可填入散熱材料6 5，並藉此 1所產生之熱散出。惟此-料構件較多，製造過程複雜， 且該金屬管6 3接觸LED 6 1之面積較小，散熱效率亦 不佳，實有改善之必要。 … 有鑑於此，故如何解決上述問題即為本創作所欲解決 之首要課題，因此，本案創作人乃經過不斷的苦思與試作 後，才終於有本創作之產生。 ~ ' 【新型内容】 本創作之主要目的’在於提供-種L E D散熱結構改 良，其以電熱分離之概念，利用導熱性高之材料迅速將^ ED所產生之熱傳導出去，具有散熱迅速且維持led及 其電路板正常溫度之功效。 為達前述之目的，本創作提供-種LED散熱結構改 良，其包括有： 一設有電路之基座’其具有一頂面及一底面，至少有 一 L E D接設於該基座之電路上，該各L E D之底面分別 固設有一導熱元件’俾使該L ED所產生之熱可藉該導熱 元件傳導出去’而該基座於對應各L E D之位置分別設有 一自該頂面貫穿至該底面之通孔’俾供該各L E 〇接設於 該基座之電路上時，該各L E D之導熱元件即穿伸於該通 孔中，且該導熱元件之底端與該基座之底面平齊； 一散熱器’其設於該基座之底面，該散熱器並以其頂 M422157 - ， 2011/08/23修正替換頁 ί- __ 面貼合於該基座之底面，且與該基座通孔中之導熱元件底 端貼合，而該散熱器又向下設有複數個散熱鰭片。 而本創作之上述目的與優點，不難從下述所選用實施 ' 例之詳細說明與附圖中獲得深入了解。當然，本創作在某 - 些另件或另件之安排上容許有所不同，但所選用之實施例 則於本說明書中予以詳細說明。 【實施方式】 請參閱第1圖至第3圖，為本創作所提供之一種L Ε • D散熱結構改良，其包括有： 一以P C Β材料製成之基座1，其具有一頂面1 1及 一底面1 2，該基座1設有電路13，至少有一LED2 接設於該基座1之電路1 3上，該基座1於對應各L E D 2之位置分別設有一自該頂面1 1貫穿至該底面1 2之通 孔14,而該各LED2之下分別固設有一形狀、尺寸對 應於該通孔1 4之導熱元件3，於本實施例中，該導熱元 件3之導熱係數乃較該基座1為高，藉此使該L E D 2所 • * 產生之熱能可藉該導熱元件3傳導出去，而該各L E D 2 接設於該基座1之電路13上時，該各LED2之導熱元 件3即穿伸於該通孔1 4中，且該導熱元件3延伸至與該 基座1之底面12平齊。 一散熱器4，其以導熱係數較該基座1高之材料製 成，該散熱器4設於該基座1之底面1 2，並以其頂面貼 合於該基座1之底面1 2，且與該基座1通孔1 4中之導 熱元件3底端貼合，而該散熱器4又向下設有複數個散熱 M422157 2011/08/23修正替換頁 鰭片4 1。 就習用之鋁合金基座而言，其面臨之最大難題即為L E D產生之熱能會造成基座溫度過高而影響L E D之發光 效率，故本創作以「電熱分離」之概念，利用設於該L E D2之下的導熱元件3之導熱係數較該P C B基座1為 高，而迅速將L E D 2所產生之熱能傳導出去，接著傳導 至與該導熱元件3相貼合之散熱器4，該散熱器4之導熱 係數亦較該P C B基座1高，並藉由散熱鰭片4 1之作 用，而將熱能迅速逸散於外界，藉此使熱能於被產生之後 的短時間内即被高導熱係數之導熱元件3及散熱器4迅速 排出，就不會使該L E D 2及該基板1之溫度過高並維持 在正常範圍，LED2之發光效率即不致受影響。 此外，本創作之構件簡單，製造成本較習用之結構低， 組裝也非常容易、快速，因此更具有實用上之價值。 惟，以上所述實施例之揭示用以說明本創作，並非用 以限制本創作，故舉凡數值之變更或等效元件之置換仍應 隸屬本創作之範疇。 M422157 _ 2011/08/23修正替換頁 【圖式簡單說明】 第1圖為本創作之立體組合示意圖 第2圖為本創作之立體分解示意圖 第3圖為本創作之剖面側視圖 第4圖為習用之一種L E D散熱結構立體示意圖 第5圖為習用之另一種L ED散熱結構剖 【主要元件符號說明】 ° ®V. New description: [New technology field] This creation is related to the heat dissipation structure of L Ξ D, especially a simple structure, and can quickly derive the heat generated by L ED to avoid the heat dissipation of the LED and its circuit board. structure. [Prior Art] According to the 'light-emitting diode (LED) due to the development of technology, it has been widely used in indicator lights, backlights and display screens, etc.] and it has also made breakthroughs in the manufacture of LED materials. In the field of lighting, and replacing the traditional light bulb with its advantages of power saving and small size, however, LE will generate heat energy when used, and if it cannot be quickly dissipated, it will affect the luminous efficiency and service life of the LED. Therefore, the design of the heat sink is an important part of the L E D. At present, the design of the LED heat sink is as shown in Figure 4, with the aluminum alloy plate 50 as the substrate, and the printed circuit and the insulating material are placed on the top. It wants to use the thermal properties of the alloy to quickly conduct the heat generated by the LED 5 2 to the heat sink 5 ] _ and scatter. However, although the aluminum alloy plate 50 has a high thermal conductivity, it can quickly conduct heat, but it will keep the high temperature of the circuit board made of aluminum alloy as usual, and affect the luminous efficiency of the LED 52; The cost is also high. 'If you want to make a large LED light board, then there are cost concerns. Another type of LED heat dissipation design, as shown in Figure 5, is on the circuit board 60 made of PCB material, corresponding to the position of the LED 6 1 3 M422157 2011/08/23 correction replacement page is provided with a through hole 6 2, and a metal tube 63 is disposed in the through hole 6 2, and the two ends of the metal tube 63 are respectively connected to the LED 6 1 and the heat sink 64, and the metal tube 6 3 can be filled with the heat dissipation material 6 5, and use this to generate heat. However, there are many material members, the manufacturing process is complicated, and the area of the metal tube 63 contacting the LED 61 is small, and the heat dissipation efficiency is also poor, which is necessary for improvement. ... In view of this, how to solve the above problems is the primary subject that the creative office wants to solve. Therefore, the creators of this case have finally made this creation after continuous hard work and trials. ~ ' [New content] The main purpose of this creation is to provide a kind of LED heat dissipation structure improvement. With the concept of electrothermal separation, the material with high thermal conductivity can quickly conduct heat generated by ED, which has rapid heat dissipation and maintains led. And the effectiveness of its board's normal temperature. For the purpose of the foregoing, the present invention provides an LED heat dissipation structure improvement comprising: a base having a circuit having a top surface and a bottom surface, at least one LED being connected to the circuit of the base, A heat conducting component is disposed on the bottom surface of each of the LEDs, so that heat generated by the LED can be conducted out through the heat conducting component, and the base is respectively disposed from the top surface to the bottom surface at positions corresponding to the LEDs. When the through holes 俾 are connected to the circuit of the pedestal, the heat conducting elements of the LEDs extend through the through holes, and the bottom end of the heat conducting element is flat with the bottom surface of the pedestal a heat sink 'which is disposed on the bottom surface of the base, and the heat sink is attached to the bottom surface of the base with its top M422157 - , 2011/08/23 correction replacement page ί- __ The bottom end of the heat conducting element in the through hole is fitted, and the heat sink is further provided with a plurality of heat radiating fins downward. The above objects and advantages of the present invention are not difficult to obtain from the detailed description of the embodiments selected below and the drawings. Of course, this creation is tolerant in the arrangement of certain parts or parts, but the selected embodiments are described in detail in this specification. [Embodiment] Please refer to Fig. 1 to Fig. 3 for an improvement of the L Ε D heat dissipation structure provided by the present invention, which comprises: a susceptor 1 made of PC Β material having a top surface The base 1 is provided with a circuit 13 , and at least one LED 2 is connected to the circuit 13 of the base 1 , and the base 1 is respectively provided with a top position corresponding to each LED 2 . The surface 11 is inserted into the through hole 14 of the bottom surface 12, and a heat conducting element 3 having a shape and a size corresponding to the through hole 14 is respectively fixed under the LEDs 2. In the embodiment, the heat conducting element 3 is The thermal conductivity is higher than that of the susceptor 1 , so that the thermal energy generated by the LED 2 can be conducted by the thermal conductive element 3, and when the LEDs 2 are connected to the circuit 13 of the susceptor 1 The heat conducting element 3 of each of the LEDs 2 extends through the through hole 14 and the heat conducting element 3 extends to be flush with the bottom surface 12 of the base 1. A heat sink 4 is made of a material having a higher thermal conductivity than the base 1. The heat sink 4 is disposed on the bottom surface 12 of the base 1 and is attached to the bottom surface of the base 1 by a top surface thereof. 2, and the bottom end of the heat conducting element 3 in the through hole 14 of the base 1 is attached, and the heat sink 4 is further provided with a plurality of heat dissipation M422157 2011/08/23 to modify the replacement page fin 4 1 . As far as the conventional aluminum alloy pedestal is concerned, the biggest problem is that the thermal energy generated by the LED will cause the susceptor temperature to be too high and affect the luminous efficiency of the LED. Therefore, the concept of "electrical thermal separation" is used in this creation. The thermal conductivity of the heat conducting element 3 under the LE D2 is higher than that of the PCB base 1, and the thermal energy generated by the LED 2 is quickly conducted out, and then transmitted to the heat sink 4 that is in contact with the heat conducting element 3, which dissipates heat. The thermal conductivity of the device 4 is also higher than that of the PCB base 1, and by the action of the heat dissipation fins 41, the thermal energy is quickly dissipated to the outside, thereby enabling the thermal energy to be highly thermally conductive in a short time after being generated. The thermal conduction element 3 and the heat sink 4 of the coefficient are quickly discharged, so that the temperature of the LED 2 and the substrate 1 is not excessively high and maintained in a normal range, and the luminous efficiency of the LED 2 is not affected. In addition, the creation of the components is simple, the manufacturing cost is lower than the conventional structure, and the assembly is also very easy and fast, so it is more practical. However, the disclosure of the above-described embodiments is intended to be illustrative of the present invention and is not intended to limit the present invention. Therefore, changes in numerical values or substitution of equivalent elements are still within the scope of the present invention. M422157 _ 2011/08/23 Correction replacement page [Simple description of the drawing] Figure 1 is a three-dimensional combination diagram of the creation. Figure 2 is a three-dimensional exploded view of the creation. Figure 3 is a cross-sectional side view of the creation. A schematic diagram of a conventional LED heat dissipation structure Fig. 5 is a conventional L ED heat dissipation structure section [Main component symbol description] ° ®
(本創作部份） 基座1 頂面1 1 底面1 2 電路1 3 通孔1 4 L E D 2 導熱元件3 散熱器4 散熱鰭片4 1 (習用部分） 鋁合金板5 0 散熱器5 1 L E D 5 2 電路板6 0 L E D 6 1 通孔6 2 金屬管6 3 散熱器6 4 散熱材料6 5 7(This creation part) Base 1 Top surface 1 1 Bottom surface 1 2 Circuit 1 3 Through hole 1 4 LED 2 Thermal element 3 Heat sink 4 Heat sink fin 4 1 (used part) Aluminum alloy plate 5 0 Heat sink 5 1 LED 5 2 Board 6 0 LED 6 1 Through hole 6 2 Metal tube 6 3 Heat sink 6 4 Heat sink material 6 5 7